JP2018039040A - Laser processing method, laser processing machine and processing calculator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing method which secures a wide range of a processing area, controls a processing line width and performs processing at a high speed.SOLUTION: In a processing method which performs processing along a predetermined processing course and with a predetermined processing line width on a plane extended in a scanning direction of galvano mirrors by using a processing device which has a processing head provided with a set of galvano mirrors, a light condensing element and a driving part and causes the driving part to change defocus and/or optical magnification of an optical system in the processing head, processing is performed based on a galvano mirror driving amount and a driving part driving amount provided through a process consisting of a process S1 of 1. deciding a galvano mirror driving amount D7 of the galvano mirrors from the processing course D1, a process S2 of 2. deciding processing plane light density profile information D5 from light density profile information D3 determined beforehand and a processing position on the processing course and a process S3 of 3. deciding a driving part driving amount D6 from the processing course, the processing line width D2 and the processing plane light density profile information.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a laser processing method for processing a workpiece by scanning a laser beam using a galvanometer mirror.

  Laser processing such as battery welding and solar cell scribing is widely performed. Among them, scan processing using a galvanometer mirror is widespread. This processing has an advantage that a wide area can be processed at high speed.

  On the other hand, in the scanning process, the laser beam is obliquely incident on the outer periphery of the processable area. For this reason, the beam profile on the workpiece surface is distorted, and the energy density varies greatly depending on the machining path. Thereby, the problem that the processing line width, such as the welding width of a battery and the scribing width of a solar cell panel, is not constant occurs. Conventionally, as means for solving this problem, a method using a telecentric fθ lens (Patent Document 1) and a method incorporating a gonio stage as a work stage (Patent Document 2) are known.

JP 2013-3317 A Japanese Patent No. 4549620

  However, in the method using a telecentric fθ lens, when a wide processing area is to be secured, the optical axis cross-sectional area of the telecentric fθ is necessarily larger than the processing area. For this reason, the volume and weight of the machining head increase, and the usage conditions are restricted. In addition, in the method using the gonio stage, the gonio stage must be moved twice as much as the swing angle of the galvano mirror, and the weight of the gonio stage is larger than the weight of the galvano mirror. It will be slower than the moving speed of the mirror.

  Therefore, when the gonio stage is used, the processing speed is reduced. As described above, it has conventionally been difficult to secure a wide processing area, control the processing line width, and perform high-speed processing with a compact configuration.

A light source and a pair of galvanometer mirrors that scan the light emitted from the light source in directions that are not parallel to each other, and at least one condensing element on the optical path, and of the condensing elements At least one processing head having a drive unit for driving the light collecting element, the drive unit defocusing an optical system including the light source, the light collecting element, and the galvanometer mirror, and / or Or, it is characterized by changing the optical magnification,
The optical system has one or more imaging planes that are conjugate to the light source, and one of them is in the vicinity of the workpiece, using a processing apparatus,
In the processing method of processing the surface stretched in the scanning direction of the one set of galvanometer mirrors with a predetermined processing line width along a predetermined processing path,
1. Determining a galvanometer mirror driving amount of the galvanometer mirror from the processing path;
2. Determining light density profile information obtained in advance, and processing surface light density profile information from a processing position in the processing path;
3. Determining a driving unit driving amount of the driving unit from the processing path, the processing line width, and the processing surface light density profile information;
It processes based on the said galvanometer mirror drive amount obtained from the process which consists of, and the said drive part drive amount.

  When the present invention is applied, a machining method for securing a wide machining area, controlling the machining line width, and machining at high speed is provided.

It is the figure which showed the laser beam machine of 1st Embodiment of this invention. It is the figure which showed the process parameter derivation | leading-out flow of 1st Embodiment of this invention. It is the figure which showed another example in 1st Embodiment of this invention. It is the figure which showed the optical density profile measured in advance in 1st Embodiment of this invention. It is the figure which showed the light density profile on the processing surface in 1st Embodiment of this invention. It is the figure which showed the laser beam machine of 4th Embodiment of this invention. It is the figure which showed the processing parameter derivation | leading-out flow of 4th Embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First embodiment]
FIG. 1 is a diagram of a laser beam machine according to the first embodiment of the present invention, and FIG.

<Configuration of laser processing machine>
First, the laser beam machine according to the present embodiment will be described. As shown in FIG. 1, it comprises a laser light source 1 as a light source and a laser processing head 3 as a processing head. A light source controller 51 that performs power output control, shutter control, and the like is connected to the laser light source 1 by a transmission cable 61. Laser light 2 as processing light oscillated from the laser light source 1 is emitted from the fiber end 12 into the laser processing head 3 via an optical fiber cable 11 as a waveguide. Next, the laser beam 2 is collimated by a condenser lens 21 as a condenser element, diffused by a condenser lens 23, collimated again by a condenser lens 24, and then condensed by a condenser lens 22. Become.

  Next, the laser beam 2 is deflected by the galvanometer mirror 31. The galvanometer mirrors 31 are configured in pairs, and their rotation axes are arranged so as to have a twisted relationship that is not parallel to each other. The galvanometer mirror 31 is connected to and controlled by a controller 53 that is a control device thereof.

  The workpiece 4 is attached on an XYZ stage 5 as a workpiece driving mechanism. The defocus direction is adjusted by the XYZ stage 5 so that an energy density sufficient to process the workpiece 4 can be secured. The XYZ stage 5 is adjusted so that the surface stretched by the set of galvanometer mirrors 31 coincides with the processed surface of the workpiece 4.

  In the present embodiment, a condensing lens is not disposed between the galvanometer mirror 31 and the workpiece 4, but a condensing lens may be disposed. However, it is not preferable to use a conventional telecentric fθ lens.

  A linear stage 41 as a drive unit for driving the lens is attached to the condenser lens 23. Instead of the linear stage 41, a piezo stage may be used as another form. The linear stage is excellent in that the movable amount is large, and the piezo stage is excellent in response. A controller 53 is connected to and controlled by the linear stage 41 via a transmission cable 62 as signal transmission means.

  In this zoom mechanism, the optical magnification can be changed independently according to the drive amount of the linear stage 41. As another form, there is a method in which a driving unit 24 is added to the condenser lens 24 as shown in FIG. In this case, defocusing can be driven in addition to the optical magnification. In the first embodiment, a case where the optical magnification is changed independently will be described as an example.

  If the NA of the linear stage origin is NA0, the drive amount from the linear stage origin is ξ, and the NA at the drive amount ξ is NA (ξ),

It becomes the relationship. Here, κ is the NA sensitivity to the drive amount ξ.

  A synchronization device 54 is connected to the controller 52 and the controller 53 by a transmission cable 64. The synchronization device 54 can synchronize and transmit the signals of the controller 52 and the controller 53 by the internal clock of the synchronization device 54 or an external trigger signal. Although not shown, the synchronization device 54 is provided with an external information transfer device such as a jog box as a teaching device, a LAN port for connecting a PC as a teaching device, and a CD drive for reading a teaching program. .

<Process parameter derivation flow>
Secondly, the flow for deriving the machining parameters according to the first embodiment of the present invention will be described. The flowchart of FIG. 2 is a diagram showing a flow until the driving amount of the linear stage 41 in the present invention is determined. Based on the driving amount determined in this flow, the processing is performed by the processing apparatus described with reference to FIG.

(Process S1)
D1 is machining path information. The machining path information is given in advance by teaching or a program. Here, the processing path is not a processing position. The processing position is the point of the processing position such as {(X_1, Y_1), (X_2, Y_2), (X_3, Y_3), ..., (X_i, Y_i), ..., (X_N, Y_N)} It is group data, and the processing path is {(Xs_1, Ys_1, Xe_1, Ye_1), (Xs_2, Ys_2, Xe_2, Ye_2), ..., (Xs_i, Ys_i, Xe_i, Ye_i), ..., (Xs_N, Ys_N, Xe_N, Ye_N)} is vector group data including at least a start point position and an end point position. As an exception, in processing such as one-stroke drawing, (Xe_i, Ye_i) and (Xs_i + 1, Ys_i + 1) of the processing path vector group coincide with each other, so that it is possible to use the same notation as the processing position.

If the machining speed or machining type (straight line machining, arc machining, etc.) is not constant, the machining initial position, path type (straight line G01, curve G02, etc.), machining end position (Xe_i, Ye_i) and vector group data defined by processing speed (F_i) are suitable. In this case, when the machining initial position is represented as (Xs_i, Ys_i), the path type is represented as Li, the machining end position is represented as (Xe_i, Ye_i), and the machining speed is represented as F_i.
{(Xs_1, Ys_1, L_1, Xe_1, Ye_1, F_1), (Xs_2, Ys_2, L_2, Xe_2, Ye_2, F_2), ... (Xs_i, Ys_i, L_i, Xe_i, Ye_i, F_i), ..., (Xs_N, Ys_N, L_N, Xe_N, Ye_N, F_N)}.
In the first embodiment, all route types Li are straight lines, and {(Xs_1, Ys_1, Xe_1, Ye_1, F_1), (Xs_2, Ys_2, Xe_2, Ye_2, F_2), ... (Xs_i, Ys_i, Xe_i, Ye_i , F_i),..., (Xs_N, Ys_N, Xe_N, Ye_N, F_N)}.

  In step S1, the machining path D1 is converted into a galvanometer mirror driving amount D7. When the galvanometer mirror driving amount D7 is proportional to the machining path D1,

It becomes.

  Here, ωxs_i, ωys_i, ωxe_i, and ωye_i are the galvano X mirror drive amount at the machining path i-th initial position, the galvano Y mirror drive amount at the machining path i-th initial position, and the galvano at the machining path i-th end position, respectively. The X mirror drive amount and the galvano Y mirror drive amount at the processing path i-th end position. Xs, Ys, Xe, and Ye are the X-direction machining position at the machining path i-th initial position, the Y-direction machining position at the machining path i-th initial position, and the X-direction machining position at the machining path i-th initial position, respectively. The Y-direction machining position at the machining path i-th end position. ωx_ost is a galvano X mirror offset amount, and ωy_ost is a galvano Y mirror offset amount.

  Here, the offset amount represents a deviation from normal incidence when the processing position is the origin. By defining in this way, the incident angle to the workpiece is set to be twice the swing angle of the galvanometer mirror. kx and ky are the driving sensitivity of the galvano X mirror with respect to the X direction machining position and the driving sensitivity of the galvano X mirror with respect to the Y direction machining position, respectively.

  The galvano mirror drive amount information D7 for the processing path information D1 has been described as a proportional relationship. However, when strict correction is performed or when the galvano swing angle is large, the galvano mirror drive amount information D7 is expressed by an m-order polynomial as shown in Equation 2. Is preferred. Where kx1 is the primary correction coefficient in the x direction, ky1 is the primary correction coefficient in the y direction, k2x is the secondary correction coefficient in the x direction, k2y is the secondary correction coefficient in the y direction, and kxm is x The m-th order correction coefficient in the direction, and kym is the m-th order correction coefficient in the y direction. This embodiment will be described based on Formula 1.

(Process S2)
Step S2 is a step of calculating the light density profile information D5 on the processing surface from the processing path information D1, the light density profile information D3 and the light intensity information D4 obtained in advance. The light density profile information D3 is obtained by actually measuring or obtaining the shape by assuming the shape with a laser. In the first embodiment, a case where a profile shape is actually measured will be described.

  The actual measurement data will be described with reference to FIG. FIG. 4 is a two-dimensional contour map of a light density profile at normal incidence at a linear stage origin at normal incidence with the total power normalized at 1 kW. This light density profile is acquired in advance before processing. If the light density profile with respect to the drive amount ξ is expressed as Is (x, y; ξ), the light density profile in FIG. 4 is Is (x, y; 0). In Is (x, y; ξ), Is (0,0; 0) is the center of gravity of the light density profile. Light Density Profile The horizontal axis of FIG. 4 represents the profile x direction, and the vertical axis of FIG. 4 represents the profile y direction orthogonal to the x direction.

  The optical profile in the machining path i of the machining path information D1 can be represented by the center position (Xave_i, Yave_i) of the machining path i. Where Xave_i and Yave_i are

Is the midpoint between the initial position and the end position in the machining path i. From Equation 2, the incident vector (θxave_i, θyave_i) to the workpiece is

Therefore, the incident angle θave_i is

It becomes. The light density profile Is (x, y; 0) in FIG. 4A is extended by 1 / cos θave_i in the direction of φave_i in FIG. Here, φave_i = arctan (Xave_i / Yave_i). When coordinates are converted to the x 'axis that matches the φave_i direction and the y' axis that is orthogonal to the x 'axis,

The light density profile Is (x ′, y ′; 0) converted by

  Furthermore, the scanning direction ρs_i in the machining path i is determined using Xs_i, Ys_i, Xe_i, and Xs_i.

It can be expressed. As shown in FIG. 5B, the light density profile Iρs_i (u, v) in the scanning direction ρ has a relationship rotated by ρ with respect to (x ′, y ′).

It becomes. The u axis is the scanning direction in the machining path i, and the v axis is the direction perpendicular to the scanning direction. Similarly, FIG. 5C shows the redefinition of (U, V) with respect to the coordinates (X, Y) on the workpiece. Where l is

And the path length in the machining path i.

  If the light density profile data is given discretely, interpolating Is (x, y; 0) before performing the conversion of Equation 9, or Is (x, y; 0) as a polynomial For example, it is preferable to interpolate the data. There is a need. Alternatively, the data interpolation of Iρs_i (u, v; ξ) may be performed after the conversion of Expression 9. At that time, it is necessary to make the total power equal before and after the conversion.

  Here, ξ = 0 has been described as an example. Similarly, a light density profile Iρs_i (u, v; ξ) at the zoom drive amount ξ is also acquired. However, the profile center of Iρs_i (u, v; ξ) is defined to coincide with Iρs_i (u, v; 0).

  Since the light density profile is normalized by the total power, the light intensity profile information on the processed surface is acquired by multiplying the laser power P given by the light intensity information D4. D4 may be acquired in advance or may be acquired at the time of processing. If it is obtained at the time of processing, more precise processing is possible. At this time, the light density profile I_i (u, v; ξ) on the processed surface is expressed by Equation 11.

(Process S3)
Step S3 is a step of obtaining drive unit driving amount information D5 from processing path information D1, light density profile information D5 on the processing surface, and processing line width information D2. The range of energy density required for desired processing is, for example, the Laser Processing Society website “http://www.jlps.gr.jp/laser/atoz/2/” and non-patent literature “2010 Patent Application Technology Trends” "Survey Report (Overview)" According to these documents, the desired processing is determined by the relationship between energy density and action time. Here, the upper limit of the processing threshold is Wu, the lower limit is Wd, the upper limit of the action time is Tu, and the lower limit is Td.
The maximum value for (u, v) of the light density profile I_i (u, v; ξ) is defined as Imax_i (ξ). Since Imax_i (ξ) must be less than Wu,

Must hold.

  Also, from the viewpoint of action time, the upper limit Tu should not be exceeded. If a range where I_i (u, v; ξ) exceeds Wb in a certain v is Δ (v; ξ), the action time t_i (v; ξ) is

Defined by The maximum value tmax_i of the action time t_i (u) in the machining line width is

And it must not exceed the upper limit Tu of action time,

Must hold.

  The machining line width δ_i (ξ) is a range of v exceeding the action time lower limit value Tb at t_i (v; ξ). The range of v where t_ (v; ξ) ≧ Tb is expressed as δ_i (ξ). Assuming that the machining line width in the machining path i given by the machining line width information D2 is d_i, it is possible to perform machining with a desired line width in the machining path i as long as ξ satisfying Expression 16 exists.

  In this way, the light density profile I_i (u, v; ξ) was formulated with respect to the condition of the power density upper limit Wu, the condition of the upper limit of working time Tu, and the machining line width Δ_i. For each machining path i, if ξ is obtained by Expression 16 and ξ for which Expression 12 and Expression 15 simultaneously exist, machining can be performed with a desired machining line width in all paths.

  If there is no solution due to conditions such as Wu and Tu, the drive amount ξ may be obtained by further taking F_i as a parameter. However, if the machining speed is changed for each machining path i, the load on the galvano control mechanism is increased and machining defects are likely to occur. Therefore, the machining speed is preferably constant.

  Similarly, when there is no solution due to conditions such as Wu and Tu, the laser power P may be used as a parameter. However, when P is large, thermal drift tends to occur, and when P is small, Fi has to be lowered, resulting in a problem that processing time increases.

  Similarly, ξ, Fi, and P may be simultaneously used as parameters, and may be obtained by an optimization problem in consideration of the problems listed above. At this time, the effect of the present invention does not change even if the equation 16 is weighted or the equation 16 is transformed into a range inequality and optimized.

  When the centroid of I (u, v; 0) and the centroid of I (u, v; ξ) are negatively matched, feedback may be applied to the drive amount of the galvanometer mirror 31 as necessary. In this case, an effect of improving the machining accuracy can be obtained.

  Here, I (u, v; ξ) is acquired in advance for each zoom drive amount ξ before processing, but may be formulated as a function for ξ. For example, in the case of the present embodiment, only the optical magnification changes depending on ξ, so that it can be formulated as shown in Equation 17.

  In this case, there is an effect that the light density profile information D3 that must be acquired in advance is reduced.

<Processing>
Finally, the driving amount {ωxs, ωys, ωxe, ωye} of the galvano mirror and the driving amount ξ of the zoom driving system derived by the steps S1, S2 and S3 are input to the synchronization device 54, The processing line width is controlled and processed.

  Thus, according to the present invention, since the processing line width can be controlled without using an fθ lens, it can be configured more compactly than a conventional processing machine, and a wider area can be processed. Furthermore, according to the present invention, since the condensing element is driven and the optical magnification and defocus are changed, it is possible to drive faster than driving the stage attached to the workpiece.

  In the first embodiment, the optical system that converts only the optical magnification has been described as an example. However, as another example, the effect is the same in an optical system that performs defocusing. Two or more zoom mechanisms may be combined. In this case, the optical magnification and defocus are converted with a small amount of driving.

  In this embodiment, the three-axis stage is described as the workpiece driving mechanism. However, the number of axes is increased or decreased as necessary, a rotation stage such as a gonio stage or a θ stage is added, or the XYZ stage 5 is used instead. Even if a robot arm is used, the effect of the present invention does not change.

  In this embodiment, the light density profile is rotated at the center of gravity of the spot. However, the effect of the present invention does not change even if the peak position, the center position, the second moment average value, and the like are changed according to processing. .

  In the present embodiment, the drive controller 52, the drive controller 53, and the synchronization device 54 have been described as separate devices, but the effect of the present invention does not change even if the controller is replaced with a controller that performs multi-channel control.

  In the present embodiment, the processing type is described as a straight line, but the effect of the present invention is not changed even when the processing type is a curved line. In this embodiment, the steps S1, S2, and S3 have been described in this order. However, the present invention is not limited to this order. Furthermore, in step S2, it has been described that the optical density profile information D5 on the processing surface is obtained from the processing path information D1, the light density profile information D3, and the light intensity information D4. However, even if the processing path information D1 is replaced with the drive amount information D7, The effect of the present invention is not changed.

[Second Embodiment]
Although the first embodiment has been described based on an actually measured optical profile, a case will be described in which the optical density profile of a single mode fiber laser is approximated by a Gaussian beam. If the light density profile I_i (u, v; ξ) is a Gaussian beam, it can be described as in Expression 18.

The upper limit of processing density is

Therefore, it is formulated into a simple expression as compared with Expression 12.
Also, tmax_i (ξ) defined by Equation 15 can be transformed,

Should be satisfied. Furthermore, the machining line width δ_i (ξ) is

Therefore, ξ satisfying Expressions 19, 20, and 21 may be obtained.

  Although the second embodiment has been described using an analytical expression, the effect of the present invention does not change even if ξ is derived by an approximate expression such as Macrolin expansion or a numerical solution using a numerical table.

[Third embodiment]
Although the first embodiment has been described based on the actually measured optical profile, a case will be described in which a top flat beam is approximated like a multimode fiber laser.

  In the case of the top flat beam, the light density profile I (u, v; ξ) is described as in Expression 22.

The upper limit condition of the machining density is Equation 23, the upper limit condition of the working time is Equation 24, the machining line width δ_i (ξ) is Equation 25, and in the machining path i, all of Equation 23, Equation 24, and Equation 25 are satisfied. You can ask for.

  Similar to the second embodiment, even in the third embodiment, the effect of the present invention does not change even if ξ is derived by an approximate expression such as Macrolin expansion or a numerical solution using a numerical table.

[Fourth embodiment]
In the first embodiment, the second embodiment, and the third embodiment, the processing of the surface stretched by one set of galvanometer mirrors has been described. However, even when a three-dimensional surface is processed by combining a zoom mechanism that varies the focal position. Applicable.

<Configuration of laser processing machine>
First, the laser beam machine according to the fourth embodiment will be described with reference to FIG. Compared to the first embodiment, the laser processing machine has two components added. One is a linear stage 42 as a drive unit. As described with reference to FIG. 3, only defocusing can be adjusted. The other is a controller 55. The drive unit of the zoom optical system 2 is controlled by the controller 55.

<Process parameter derivation flow>
Secondly, a flow for deriving machining parameters according to the fourth embodiment of the present invention will be described. The flowchart of FIG. 7 is a diagram showing a flow until the drive amounts of the linear stage 41 and the linear stage 42 in the present invention are determined. Based on the driving amount determined in this flow, processing is performed by the processing apparatus described in FIG.

(Process S4)
In the fourth embodiment, unlike S1 in the first embodiment, the machining path is given as three-dimensional data. In the machining path information D8, {(Xs_1, Ys_1, Zs_1, L_1, Xe_1, Ye_1, Ze_1, F_1), (Xs_2, Ys_2, Zs_2, L_2, Xe_2, Ye_2, Ze_2, F_2), ... (Xs_i, Ys_i , Zs_i, L_i, Xe_i, Ye_i, Ze_i, F_i),... (Xs_N, Ys_N, L_N, Xe_N, Ye_N, Ze_1, F_N)}. The driving amount of the galvanometer mirror 31 with respect to the processing position follows the first embodiment, but in addition to that, the driving amount of the driving unit of the linear stage 42 is added.

  Here, Zs is a driving unit driving amount at the i-th initial position of the processing path, and Ze is a driving unit driving amount at the i-th end position of the processing path. Further, it is the offset amount of the drive unit with respect to the machining position origin. When Zs or Ze is 0, ζ_ofs coincides with the distance from the galvano mirror 31 to the machining origin on the workpiece. Also in the fourth embodiment, the galvano mirror drive amount and the drive amount of the linear stage 42 are linearly related to the machining position, but may be polynomial approximation as shown in Equation 3 of the first embodiment.

  As described above, the galvanometer mirror driving amount information D9 and the driving unit 2 driving amount information D10 of the linear stage 42 are obtained from the processing path information D8 by the step S4.

(Process S5)
Step S5 of the fourth embodiment is the same step as S2 of the first embodiment. S5 is a step of deriving the light density profile information D5 on the processed surface from the processing path information D8, the light density profile information D3, and the light intensity information D4. The difference from S2 is that, in the first embodiment, the surface stretched by the galvanometer mirror 31 is treated as a processed surface, but in the fourth example, the processing surface becomes a three-dimensional surface due to the addition of the optical axis direction. That is. Even in that case, the processing line width is determined by the irradiation direction of the processing light 2 on the workpiece 4. However, it must be considered that the light density profile extends in the y ′ direction.

(Step S6 and Step S7)
The process S6 of the fourth embodiment is the same as S3 of the first embodiment. Through this process, the drive amount information D6 of the linear stage 42 is obtained from the processing path information D8, the light density profile information D5 on the processing surface, and the processing line width information D2. In this embodiment, since the linear stage 41 is an optical system that changes only the optical magnification with respect to its driving amount, D10 and D6 could be handled independently. However, when the optical magnification and the defocus change simultaneously with respect to the drive amount of the drive unit, step S7 is necessary. Step S7 is a step of integrating D10 and D6. There, the two stage drive amounts are subjected to a linear sum operation, and drive amount information D12 of the linear stage 41 and drive unit drive amount information D11 of the linear stage 42 are newly obtained. By doing so, even when a plurality of drive units are provided, the effect of machining by controlling the machining line width can be obtained.

<Processing>
By inputting the galvano driving amount information D9, the driving unit driving amount D6 of the linear stage 41, and the driving unit driving amount D10 of the linear stage 42 to the synchronization device 54, the processing line width is controlled and processed as in the first embodiment. Effect is obtained. Alternatively, the processing line width is controlled in the same manner as in the first embodiment by inputting the galvano mirror drive amount information D9, the drive unit drive amount D12 of the linear stage 41, and the drive unit drive amount D11 of the linear stage 42 to the synchronization device 54. Thus, the effect of processing is obtained.

  As another example of this embodiment, when the defocus changes according to the drive amount of the linear stage 41, the linear stage 41 and the linear stage 42 may be the same. In this case, there is an advantage that the configuration of the laser processing head 3 can be simplified.

  In this embodiment, the driving amount of the galvano mirror is handled independently of the driving amount of the linear stage 42, but may be handled as a subordinate. In this case, in the processing step S7, the galvanometer mirror drive amount information D9, the drive unit drive amount information D10 of the linear stage 42, and the drive unit drive amount information D11 of the linear stage 41 are newly added to the galvanometer mirror drive amount information D13, the linear stage 42. This is a step in which the drive unit drive amount information D11 and the drive unit drive amount information D12 of the linear stage 41 are determined.

  In the present embodiment, the light density profile information D3 may use a light density profile obtained by actual measurement as in the first embodiment, or may be approximated by a function as in the second embodiment or the third embodiment. It may be done. In any case, the effect of the present invention is not changed.

  In addition, various modifications are possible as described in the first embodiment, the second embodiment, and the third embodiment.

[Fifth Embodiment]
In the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment, the method for deriving the driving amount ξi has been described. However, it is preferable that the driving amount ξi is automated. In this case, the operation of deriving the machining program at high speed can be achieved. Further, the computing unit may be always connected to the laser processing machine. In this case, machining program creation to machining can be performed continuously, and the effect of shortening the time can be obtained.

As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary. Further, a machining program created by the computing unit of the present invention, a workpiece produced by the machining method of the present invention, a workpiece machined based on the machining program obtained by the computing unit of the present invention, A workpiece manufactured by the processing machine of the invention is also a target.

D1 ... Processing path information D2 ... Processing line width information D3 ... Light density profile information D4 ... Light intensity information D5 ... Light density profile information D6 on the processed surface ... Driving unit drive amount D7 ... Galvano mirror drive information S1 ... Process S1
S2 ... Process S2
S3 ... Process S3

Claims (7)

A light source and a pair of galvanometer mirrors that scan the light emitted from the light source in directions that are not parallel to each other, and at least one condensing element on the optical path, and of the condensing elements A processing head having at least one drive unit for driving the light collecting element;
The drive unit is characterized by changing the defocus and / or optical magnification of an optical system composed of the light source, the condensing element, and the galvanometer mirror,
The optical system has one or more imaging planes that are conjugate to the light source, and one of them is in the vicinity of the workpiece, using a processing apparatus,
In the processing method of processing the surface stretched in the scanning direction of the one set of galvanometer mirrors with a predetermined processing line width along a predetermined processing path,
1. Determining a galvanometer mirror driving amount of the galvanometer mirror from the processing path;
2. Determining light density profile information obtained in advance, and processing surface light density profile information from a processing position in the processing path;
3. Determining a driving unit driving amount of the driving unit from the processing path, the processing line width, and the processing surface light density profile information;
A processing method characterized in that processing is performed based on the galvanometer mirror driving amount and the driving unit driving amount obtained from the process consisting of: A light source and a pair of galvanometer mirrors that scan the light emitted from the light source in directions that are not parallel to each other, and at least one condensing element on the optical path, and of the condensing elements A processing head having at least one drive unit for driving the light collecting element;
The drive unit is characterized by changing the defocus and / or optical magnification of an optical system composed of the light source, the condensing element, and the galvanometer mirror,
The optical system has one or more imaging planes that are conjugate to the light source, and one of them is in the vicinity of the workpiece, using a processing apparatus,
In a processing method for processing a solid surface extending in a scanning direction of the set of galvanometer mirrors and a defocusing direction of the drive unit along a predetermined processing path with a predetermined processing line width,
1. Determining a galvano mirror driving amount of the galvano mirror and a driving unit driving amount 1 of the driving unit from the processing path;
2. Determining light density profile information obtained in advance, and processing surface light density profile information from a processing position in the processing path;
3. Determining a drive unit drive amount 2 of the drive unit from the processing path, the processing line width, and the processing surface light density profile information;
4). Integrating the drive unit drive amount 1 and the drive unit drive amount 2 to determine the drive unit drive amount 3;
A processing method characterized in that processing is performed based on the galvanometer mirror driving amount and the driving unit driving amount 3 obtained from the process comprising the steps of: The processing method according to claim 1, wherein the processing surface light density profile information is a width where an energy density exceeds a processing threshold in a cross-sectional profile in a scanning direction. A light source and a pair of galvanometer mirrors that scan the light emitted from the light source in directions that are not parallel to each other, and at least one condensing element on the optical path, and of the condensing elements A processing head having at least one drive unit for driving the light collecting element;
The drive unit is characterized by changing the defocus and / or optical magnification of an optical system composed of the light source, the condensing element, and the galvanometer mirror,
In the processing arithmetic unit for calculating the control parameter of the processing apparatus, wherein the optical system has one or more imaging planes conjugate to the light source, and one of them is in the vicinity of the workpiece.
1. Determining a galvanometer mirror driving amount of the galvanometer mirror from the processing path;
2. Determining light density profile information obtained in advance, and processing surface light density profile information from a processing position in the processing path;
3. Determining a driving unit driving amount of the driving unit from the processing path, the processing line width, and the processing surface light density profile information;
A machining arithmetic unit that outputs the galvanometer mirror driving amount and the driving unit driving amount determined from the process comprising: A light source and a pair of galvanometer mirrors that scan the light emitted from the light source in directions that are not parallel to each other, and at least one condensing element on the optical path, and of the condensing elements A processing head having at least one drive unit for driving the light collecting element;
The drive unit is characterized by changing the defocus and / or optical magnification of an optical system composed of the light source, the condensing element, and the galvanometer mirror,
The optical system has one or more imaging planes that are conjugate to a light source, and one of them is in the vicinity of a workpiece.
1. Determining a galvano mirror driving amount of the galvano mirror and a driving unit driving amount 1 of the driving unit from the processing path;
2. Determining light density profile information obtained in advance, and processing surface light density profile information from a processing position in the processing path;
3. Determining a drive unit drive amount 2 of the drive unit from the processing path, the processing line width, and the processing surface light density profile information;
4). Integrating the drive unit drive amount 1 and the drive unit drive amount 2 to determine the drive unit drive amount 3;
A machining arithmetic unit that outputs the galvanometer mirror driving amount and the driving unit driving amount 3 determined from the process comprising: 6. The processing unit according to claim 4, wherein the light density profile information is a width in which an energy density exceeds a processing threshold in a cross-sectional profile in a scanning direction. A laser processing machine on which the arithmetic unit according to any one of claims 4 to 6 is mounted.