JP2018037540A - Dustproof cover - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dustproof cover which covers electronic components exposed in an opening of a case of an electronic device when a seal material adhering to a periphery of the opening is removed.SOLUTION: A dustproof cover 2 covers electronic components exposed in an opening 12a when a seal material adhering to a periphery (a flange surface 13a) of the opening 12a of a case 12 of an electronic device 10 is removed. The dustproof cover 2 has a size such that the dustproof cover 2 contacts with an inner wall 12b of the case 12 over an entire periphery of the opening 12a. The dustproof cover 2 includes fitting parts (housing parts 4a, 4b) in which connectors 15 and a protrusion 18 exposed in the opening 12a are press-fitted. The fitting parts fit with the components in the case to fix the dustproof cover 2.SELECTED DRAWING: Figure 1

Description

  The present specification discloses a dustproof cover that covers an electronic component exposed to the opening when the sealing material attached around the opening of the case of the electronic device is removed.

  In electronic equipment, the lid that closes the opening of the case is opened during maintenance. Before closing the case lid again, it is necessary to remove the previous sealing material adhering around the opening of the case (flange surface of the opening). When removing the sealing material, there is a demand for preventing the residue of the sealing material from entering the opening and adhering to the electronic component. For example, Patent Document 1 discloses a technique that meets such a requirement. Patent document 1 is disclosing the dustproof cover which covers the electronic component exposed to opening of a case. A pedestal surface is provided inside the opening, and the dust cover is placed on the pedestal surface when removing the sealing material on the flange surface around the opening. The dust cover covers the residue of the sealing material that falls into the opening, preventing adhesion to electronic components in the case.

JP 2014-103150 A

  In the technique of Patent Document 1, the dust cover is only placed on the pedestal surface inside the opening. Therefore, there is a problem that the dust cover is easily detached. On the other hand, if the dustproof cover is fixed with a bolt or the like, there is a problem that the cost increases and the operation becomes complicated. The present specification provides a technique for fixing a dustproof cover with a simple structure.

  The dustproof cover disclosed in the present specification has a size that is in contact with the inner wall of the case over the entire periphery of the opening of the case, and includes a fitting portion into which a protruding object exposed in the opening is press-fitted. . This dustproof cover is fixed by press-fitting a protrusion provided on the case side. The dust cover is fixed to the case by press fitting and can be easily attached and detached. An electronic component exposed in the opening can be used as the protrusion to be press-fitted. The technique disclosed in this specification can be realized at a low cost because the dustproof cover is fixed with the parts already present in the case. Details and further improvements of the technology disclosed in this specification will be described in the following “DETAILED DESCRIPTION”.

It is a perspective view of the dustproof cover of an Example (before mounting | wearing to a case). It is a perspective view of the dustproof cover of an Example (state mounted to the case). It is a top view of the case which attached the dustproof cover. FIG. 4 is a sectional view taken along line IV-IV in FIG. 3. It is sectional drawing along the VV line of FIG. It is a top view of the injection molded product with which the dustproof cover and the scraper were united.

  The dustproof cover 2 of an Example is demonstrated with reference to drawings. 1 and 2 are perspective views of the dust cover 2 of the embodiment and the electronic device 10 that is the target of use of the dust cover 2. FIG. FIG. 1 is a view before the dust cover 2 is attached to the case 12 of the electronic device 10. FIG. 2 is a diagram showing a state where the dust cover 2 is attached to the case 12. In FIGS. 1 and 2, the lid of the case 12 has already been removed and is not shown.

  The electronic device 10 is an inverter for a travel motor of an electric vehicle, for example. When performing maintenance (for example, component replacement) of the electronic device 10, the lid (not shown) of the case 12 is opened. The case 12 and the lid are sealed with a sealing material. In recent years, a sealing material called a liquid gasket (FIPG: Formed In Place Gasket) is often used. The liquid gasket is initially in a liquid state, and when applied to the joint surface (the flange surface 13a of the case 12) with the lid and attached with the lid, it solidifies after a predetermined time, and the case and the lid adhere to each other. When a liquid gasket is employed, the gasket remains in close contact with the flange surface 13a around the opening 12a after the lid is removed. Before closing the lid again, the previous sealant remaining on the flange surface 13a around the opening 12a must be removed by the scraper 20. FIG. 2 also shows the scraper 20 applied to the flange surface 13a. The dust cover 2 is a cover that covers parts so that the residue of the sealing material scraped off by the scraper 20 does not adhere to the parts inside the case 12. The dust cover 2 is made of aluminum or resin. The dust cover 2 is made by injection molding of aluminum or resin.

  The dust cover 2 and the electronic device 10 will be specifically described. The electronic device 10 accommodates a substrate 14 and an electronic component 15-17 in the case 12 thereof. The component 15 is a connector, and the components 16 and 17 are a plurality of semiconductor chips. The connector 15 and the semiconductor chips 16 and 17 are both mounted on the substrate 14. The substrate 14, the connector 15, and the semiconductor chips 16 and 17 are exposed from the opening 12a of the case 12 when a lid (not shown) is opened. A protrusion 18 extending from the inner wall of the case 12 penetrates the substrate 14 and is exposed from the opening 12a.

  Normally, the opening 12a of the case 12 is covered with a lid (not shown). The lid is in close contact with the flange surface 13a of the flange 13 provided around the opening 12a of the case 12, and is fixed with a bolt. Reference numeral 13b denotes a bolt hole for fixing the lid. As described above, a liquid gasket is applied to the flange surface 13a before attaching the lid.

  The dust cover 2 has a size such that the edge 3a of the base portion 3 is in contact with the inner wall 12b of the case 12 over the entire circumference of the opening 12a. That is, when the dust cover 2 is attached to the case 12, the dust cover 2 completely covers the opening 12a. The base portion 3 is provided with housing portions 4a-4d corresponding to various protrusions (connectors 15, semiconductor chips 16, 17, and protrusions 18) extending upward from the opening 12a. The accommodating portion 4 a has a shape that covers the two connectors 15. The accommodating portion 4 b has a shape that covers the plurality of semiconductor chips 16. The accommodating portion 4 c has a shape that covers a plurality of other semiconductor chips 17. The accommodating portion 4d has a shape that covers the protrusion 18. The dust cover 2 not only covers the part 15-18 exposed from the opening 12a, but also completely covers the opening 12a. Therefore, the residue of the previous sealing material scraped off from the flange surface 13a by the scraper 20 is received by the dustproof cover 2 and does not adhere to the parts 15-18 in the case 12.

  The accommodating portions 4a and 4d of the dustproof cover 2 are sized so that corresponding parts (connectors 15 and protrusions 18) can be press-fitted. In other words, the connector 15 is press-fitted into the housing portion 4a, and the protrusion 18 is press-fit into the housing portion 4d. The dust cover 2 is fixed to the case 12 by press-fitting parts. Therefore, even if the case 12 to which the dust cover 2 is attached is inverted, the dust cover 2 cannot be removed.

  In other words, the accommodating portion 4a into which the connector 15 is press-fitted is a fitting portion that fits into the connector 15 exposed to the opening 12a. In other words, the accommodating portion 4d into which the protrusion 18 is press-fitted is a fitting portion that fits into the protrusion 18 exposed to the opening 12a. A plurality of semiconductor chips 16 are loosely fitted in the accommodating portion 4b, and a plurality of semiconductor chips 17 are loosely fitted in the accommodating portion 4c.

  FIG. 3 shows a plan view of the case 12 with the dust cover 2 attached thereto. A connector 15 is press-fitted inside the accommodating portion 4a, and a protrusion 18 is press-fitted inside the accommodating portion 4d. 4 shows a cross section taken along line IV-IV in FIG. 3, and FIG. 5 shows a cross section taken along line V-V in FIG. 4 and FIG. 5 show the combined state of the parts and the dust cover 2. FIG.

  The protrusion 18 extends from the inner wall 12b of the case 12 and penetrates the substrate 14 and is exposed to the opening 12a (see FIG. 4). The housing portion 4d of the dust cover 2 has an inner width in the Y direction of the coordinate system in the drawing that is slightly narrower than the projection 18, and when pressed against the projection 18, the projection 18 is press-fitted into the housing portion 4d. The accommodating portion 4 a accommodates the connector 15 attached to the substrate 14. The connector 15 is made of resin. The accommodating part 4a has the protrusion 4a1 on the inner surface facing in the X direction in the coordinate system in the drawing (see FIG. 5). The distance between the pair of opposing protrusions 4a1 is slightly narrower than the width of the connector 15, and when pressed against the connector 15, the connector 15 is press-fitted into the housing portion 4a (between the pair of protrusions 4a1). In this way, the parts exposed to the opening 12a of the case 12 are press-fitted into the housing portions 4a and 4d, and the dust cover 2 is fixed to the case 12. When the dust cover 2 is attached to the case 12, the edge 3 a of the base portion 3 contacts the inner wall 12 b of the case 12. The edge 3a of the base 3 is in contact with the inner wall 12b over the entire circumference of the opening 12a, and the dust-proof cover 2 completely closes the opening 12a. Since the dust-proof cover 2 completely closes the opening 12a, the residue of the sealing material peeled off from the flange surface 13a does not adhere to the components inside the case 12.

  Returning to FIG. 3, the description will be supplemented for the accommodating portions 4 a and 4 d into which the parts are press-fitted. The two press-fitting locations (accommodating portions 4a and 4d) are located at locations away from the base portion 3 when the dustproof cover 2 is viewed in plan. The dust-proof cover 2 is stably fixed by setting the press-fitting locations (accommodating portions 4a, 4d) fixed to the parts of the case 12 to locations away from each other. In addition, in the housing portion 4a, the connector 15 is press-fitted between a pair of inner surfaces facing each other in the X direction of the coordinate system in the drawing, leaving room for the connector 15 and the housing portion 4a to move relative to each other in the Y direction. Yes. On the other hand, in the housing portion 4d, the protrusion 18 is press-fitted between a pair of inner surfaces facing each other in the Y direction of the coordinate system in the drawing, and in the X direction, there remains room for the protrusion 18 and the housing portion 4d to move relative to each other. Yes. That is, the fitting of the housing portion 4a and the connector 15 restricts the position of the dustproof cover 2 in the X direction, and the housing portion 4d and the protrusion 18 restrict the position of the dustproof cover 2 in the Y direction. Since the two press-fitting locations regulate the directions orthogonal to each other, the dust-proof cover 2 can be easily attached to the case 12. As described above, a plurality of semiconductor chips 16 are loosely fitted in the accommodating portion 4b, and another plurality of semiconductor chips 17 are loosely fitted in the accommodating portion 4c. That is, the accommodating portions 4b and 4c have room for movement in both the X direction and the Y direction. Therefore, the housing parts 4b and 4c do not hinder the attachment of the dust cover 2.

  As described above, the dust-proof cover 2 includes the fitting portions (accommodating portions 4a and 4d) into which the protrusions (connectors 15 and protrusions 18) exposed to the opening 12a of the case 12 are press-fitted. 12 is fixed. Since the dustproof cover 2 is fixed by press-fitting, it can be easily detached. Furthermore, since the press-fitting parts (connector 15 and protrusion 18) are parts already present in the case, it is not necessary to separately prepare a special part for fixing the dustproof cover, and can be realized at low cost.

  On the other hand, since the dust-proof cover 2 is fixed to the case 12, for example, an operation mode in which the case 12 with the dust-proof cover 2 attached is laid down and the sealing material on the flange surface 13a is removed is possible.

  As described above, the dust cover 2 is made by injection molding of aluminum or resin. It is also preferable to perform injection molding of the scraper 20 simultaneously with the dust cover 2. FIG. 6 shows a plan view of an injection molded product 9 in which the dust cover 2 and the scraper 20 are continuous. After the injection molded product 9 is manufactured, the dustproof cover 2 and the scraper 20 are completed when the injection molded product 9 is separated by the connecting portion 21.

  Points to be noted regarding the technology described in the embodiments will be described. The dust-proof cover 2 covers the electronic parts exposed in the opening 12a when the sealing material adhering to the periphery (flange surface 13a) of the opening 12a of the case 12 of the electronic device 10 is removed. Prevents sticking to parts. The shape of the base portion 3 of the dustproof cover 2 and the position and shape of the housing portions 4a to 4d are determined according to the form of the electronic device to which the dustproof cover 2 is attached. The dust cover 2 can be manufactured by a 3D printer in addition to injection molding.

  The accommodating portions 4a and 4d of the embodiment correspond to an example of a “fitting portion” in the claims. The connectors 15 and the protrusions 18 that are press-fitted into the housing portions 4a and 4d correspond to an example of the “projection exposed in the opening” in the claims.

  Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

2: Dust-proof cover 3: Foundation part 3a: Edge 4a-4d: Housing part 4a1: Projection 9: Injection molded product 10: Electronic device 12: Case 12a: Opening 12b: Inner wall 13: Flange 13a: Flange surface 14: Substrate 15: Connectors 16, 17: Semiconductor chip 18: Protrusion 20: Scraper

Claims (1)

  A dust-proof cover that covers the electronic components exposed to the opening when the sealing material attached around the opening of the case of the electronic device is removed, and has a size that contacts the inner wall of the case over the entire periphery of the opening. And a dustproof cover provided with a fitting portion into which the protrusion exposed in the opening is press-fitted.

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