JP2018036136A - Manufacturing method of probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a probe card, which positions guide holes between two guide plates constituting the probe card with high accuracy.SOLUTION: A manufacturing method of a probe card 100 which includes a guide unit 21 for positioning contact probes 20 includes the steps of: mutually joining two guide plates 31 outside a probe arrangement region 31R in a manner to interpose a spacer 32 between them; performing exposure/development processing on respective outer surfaces of the joined two guide plates 31, which do not face each other, so as to form guide holes 33 corresponding to each other in each of the two guide plates 31; and inserting each of the contact probes 20 into two of the guide holes 33, which correspond to each other.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a method for manufacturing a probe card, and more particularly to an improvement in a method for manufacturing a probe card having two or more guide plates.

  Generally, a probe card is configured by standing a large number of contact probes on a wiring board, and is used in a semiconductor integrated circuit inspection process. The inspection of the semiconductor integrated circuit is performed by bringing a contact probe into contact with an electrode pad of the semiconductor integrated circuit formed on the semiconductor wafer and conducting the semiconductor integrated circuit and an external device. At this time, a process of pressing the contact probe against the electrode pad is performed in order to absorb the variation in the height of the contact probe and the electrode pad and to reliably connect the contact probe to the electrode pad. This process is called overdrive, and the pressing distance is called the overdrive amount.

  Some conventional probe cards have a guide plate (for example, Patent Document 1). The guide plate is provided with a guide hole and attached to the wiring board. The contact probe is inserted into the guide holes of the two guide plates and held so as not to drop, and is positioned in a horizontal plane. The probe card described in Patent Document 1 includes a front end side guide plate that holds the vicinity of the front end of the contact probe and a rear end side guide plate that holds the vicinity of the rear end, and each guide plate has a front end and a rear end of the probe. The end is positioned.

  Some conventional contact probes use a silicon plate as a guide plate (for example, Patent Document 2). By using a silicon plate for the guide plate, the guide hole can be formed using a photolithography (exposure development) technique, and the processing of the fine guide hole is facilitated.

  Further, some conventional probe cards include a guide unit. The guide unit is composed of two guide plates arranged opposite to each other. A probe card having two guide plates can be obtained by attaching such a guide unit to the wiring board.

  The guide unit is obtained by forming guide holes in two guide plates and then joining these guide plates so as to face each other. Since the two guide plates are formed so that the guide holes correspond to each other, the guide plates need to be joined by performing alignment so that the guide holes have a predetermined positional relationship. However, there is a problem that it is not easy to perform accurate positioning and bonding.

  In particular, as the pitch of the electrodes on the inspection object is reduced, the guide holes are also formed at a narrow pitch. For this reason, higher accuracy is required for alignment of the guide plates at the time of joining, but there is a problem that it is not easy to align the two guide plates with high accuracy. there were.

JP2013-03002 JP2012-93127

  The present invention has been made in view of the above circumstances, and an object thereof is to perform alignment of guide holes between two guide plates constituting a probe card with high accuracy.

  The probe card manufacturing method according to the first aspect of the present invention is a probe card manufacturing method including a guide unit for positioning a probe, wherein two guide plates are mutually connected with a spacer outside a probe arrangement region. A step of bonding, a step of exposing and developing each of the non-opposing outer surfaces of the two guide plates bonded to each other, and forming a corresponding guide hole in each of the two guide plates; And inserting the probe into two guide holes corresponding to each other.

  By adopting such a configuration, a guide hole is formed by performing an exposure development process after joining the guide plates. For this reason, it is possible to align the guide holes between the guide plates without being affected by the positional deviation of the guide plates at the time of joining. Therefore, the alignment of the guide hole can be performed with high accuracy without significantly increasing the manufacturing cost.

  In the probe card manufacturing method according to the second aspect of the present invention, in addition to the above configuration, the guide hole is formed by a deep reactive ion etching method for the guide plate made of silicon.

  By adopting such a configuration, it is possible to easily form fine guide holes in the guide plates that are bonded and fixed to each other.

  In the probe card manufacturing method according to the third aspect of the present invention, in addition to the above configuration, the step of forming the guide hole includes the step of forming a silicon oxide film on both surfaces of the guide plate, Removing a part of the silicon oxide film formed on the outer surface to form an opening corresponding to the formation region of the guide hole; and the silicon oxide film formed in the probe arrangement region on the inner surface of the guide plate. Removing.

  An opening corresponding to the formation region of the guide hole is formed in the silicon oxide film formed on the outer surface of the silicon substrate, while the silicon oxide film formed in the probe placement region on the inner surface of the guide plate is removed, thereby A guide hole that penetrates the guide plate can be easily formed from the outside.

  In the probe card manufacturing method according to the fourth aspect of the present invention, in addition to the above configuration, the step of removing the silicon oxide film formed in the probe arrangement region is defined by the guide plate and the spacer. This is performed by supplying an etching solution from the outside to the probe arrangement space via a communication path that connects the probe arrangement space and the outside.

  With such a configuration, the silicon oxide film formed in the probe placement region on the inner surface of the guide plate can be easily removed.

  According to the probe card manufacturing method of the present invention, the guide holes are formed after the guide plates are joined, so that the guide holes can be accurately aligned between the guide plates constituting the probe card.

It is sectional drawing which showed one structural example of the probe card 100 by Embodiment 1 of this invention. It is the figure which showed the mode at the time of the assembly and disassembly of the probe card 100 of FIG. It is the figure which showed the detailed structure of the guide unit 21 shown in FIG. It is the expanded view which decomposed | disassembled and showed the guide unit 21 to the component. It is the perspective view which showed the guide plate 31 and the spacer 32 before joining. It is the figure which showed in order the example of the manufacturing process of the guide unit 21 of FIG. It is the figure which showed in order the example of the manufacturing process of the guide unit 21 of FIG. It is the figure which showed in order the example of the manufacturing process of the guide unit 21 of FIG. It is sectional drawing which showed one structural example of the probe card 101 by Embodiment 2 of this invention. It is the figure which showed the detailed structure of 21 A of front end side guide units shown in FIG. It is the expanded view which decomposed | disassembled and showed the front end side guide unit 21A to the component.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a configuration example of a probe card 100 according to Embodiment 1 of the present invention. The probe card 100 arranged in a horizontal direction so that the contact probe 20 is on the lower side is shown in a vertical plane. A cross-section when cut is shown. FIG. 2 is a view showing the probe card 100 of FIG. 1 during assembly and disassembly. The probe card 100 includes a wiring board 12, a reinforcing plate 13, and a probe attachment 15.

<Wiring board 12>
The wiring board 12 is a board that is detachably attached to a probe device (not shown). For example, a disk-shaped printed circuit board is used. A large number of external electrodes 121 are provided on the upper surface of the wiring board 12. The external electrode 121 is an input / output terminal for inputting / outputting a signal to / from a tester device (not shown), and is arranged at the peripheral edge of the upper surface of the wiring board 12.

  A large number of probe electrodes 122 are provided on the lower surface of the wiring board 12. The probe electrode 122 is a terminal to which the contact probe 20 is connected. The probe electrode 122 is disposed at the center of the lower surface of the wiring board 12 and is electrically connected to the external electrode 121 through the wiring of the wiring board 12.

  One or more electronic components 123 are provided on the lower surface of the wiring board 12. The electronic component 123 is a component connected to the wiring between the external electrode 121 and the probe electrode 122, for example, a noise removing capacitor, and is disposed in the vicinity of the probe electrode 122.

  Further, an attachment frame 124 is provided on the lower surface of the wiring board 12. The attachment frame 124 is a frame to which the probe attachment 15 is attached. The attachment frame 124 is arranged outside the probe electrode 122 and the electronic component 123 and surrounds them.

<Reinforcing plate 13>
The reinforcing plate 13 is a reinforcing member for preventing deformation of the wiring board 12, is made of a material having higher rigidity than the wiring board 12, and is attached to the upper surface of the wiring board 12. For example, a flat plate-shaped or frame-shaped metal block made of stainless steel can be used as the reinforcing plate 13.

<Probe attachment 15>
The probe attachment 15 is a component attached to the lower surface side of the wiring board 12. The probe attachment 15 includes a large number of contact probes 20, two guide units 21, and a support frame 22, and is detachably attached to the attachment frame 124 using attachment screws 23.

  The contact probe 20 is a probe that is elastically brought into contact with the microelectrode on the inspection object, is made of a metal material having good elasticity and conductivity, and has a tip that contacts the inspection object disposed below, And a rear end in contact with the probe electrode 122. For example, a vertical probe is used as the contact probe 20. The vertical probe is a probe that has a gently curved line shape and is disposed substantially perpendicular to the wiring board 12 and the inspection object, and is elastically limited by the axial compression force received from the inspection object during overdrive. It buckles and deforms inside.

  The two guide units 21 are horizontally arranged so as to face each other with a space in between. The lower guide unit 21 is a distal-side guide unit 21A that supports the vicinity of the distal end of the contact probe 20, and positions the distal end of the contact probe 20. The upper guide unit 21 is a rear end side guide unit 21B that supports the vicinity of the rear end of the contact probe 20, and positions the rear end of the contact probe 20.

  The support frame 22 is a support member that supports the guide unit 21. For example, flange-shaped stainless steel is used. The distal end side guide unit 21 </ b> A is detachably attached to the support frame 22 from below using attachment screws 24. The rear end side guide unit 21B is adhesively fixed to the support frame 22 from above using resin.

  The only difference in configuration between the front end side guide unit 21 </ b> A and the rear end side guide unit 21 </ b> B is the presence or absence of the screw hole 34. Therefore, hereinafter, as an example of the guide unit 21, the front end side guide unit 21 </ b> A will be described, and a redundant description of the rear end side guide unit 21 </ b> B will be omitted.

  FIG. 3 is a diagram illustrating an example of a detailed configuration of the guide unit 21 illustrated in FIG. 1. FIG. 3A is a plan view of the guide unit 21 as viewed from above, and FIG. Sectional drawing at the time of cut | disconnecting by A cut surface, (c) is the bottom view seen from the bottom. FIG. 4 is an exploded view showing the guide unit 21 disassembled into components.

<Guide unit 21>
The guide unit 21 includes two guide plates 31 facing each other and a spacer 32 sandwiched between the guide plates 31.

  The guide plate 31 is a substantially rectangular flat plate in which a large number of guide holes 33 are formed, and positions the contact probe 20 in the horizontal plane. By using, for example, a silicon plate as the guide plate 31, the fine guide hole 33 can be easily formed using a photolithography technique. The silicon plate is made of single crystal silicon, polycrystalline silicon, or amorphous silicon. The probe placement region 31R is a region on the guide plate 31 excluding the peripheral edge, and a large number of guide holes 33 are formed.

  The spacer 32 is disposed between the two guide plates 31 and defines the distance between the guide plates 31. The spacer 32 is made of a frame-shaped silicon plate having a through hole 32H. The through hole 32H corresponds to the probe arrangement region 31R, and each guide plate 31 is joined to the spacer 32 at a region outside the probe arrangement region 31R. For joining the guide plate 31 and the spacer 32, for example, diffusion bonding or anodic bonding can be used. The probe placement space 32 </ b> S is a space in the through hole 32 </ b> H, and is sandwiched between the probe placement regions 31 </ b> R of the two guide plates 31 and surrounded by the spacers 32.

  The guide hole 33 is a through hole formed in the thickness direction of the guide plate 31, that is, in the vertical direction, and the contact probe 20 is inserted therethrough. The guide hole 33 has a cross section having a size and a shape corresponding to the cross section of the contact probe 20 and restricts movement in the horizontal direction, while moving in the vertical direction (axial direction). Support. Further, the contact probe 20 has a locking portion (not shown) that cannot penetrate the guide hole 33 in a part in the axial direction, and is held by the guide plate 31 so as not to drop off.

  The screw hole 34 is a through hole into which the mounting screw 24 is screwed. The second guide plate 31B and the spacer 32 are formed with screw holes 34 in the vicinity of the four apexes.

  The alignment mark 35 is a through hole used for alignment between the guide plate 31 and the spacer 32 and alignment of a photomask for forming a guide hole described later. In the second guide plate 31B and the spacer 32, alignment marks 35 are formed in the vicinity of the midpoints of the four sides, and are used for alignment when the two are joined. Moreover, since the diameter of the alignment mark 35 of the 2nd guide plate 31B is larger than the alignment mark 35 of the spacer 32, the alignment mark 35 of the spacer 32 can be visually recognized from both upper and lower sides. For this reason, the position of the corresponding guide hole 33 between the two guide plates 31 can be accurately matched without being affected by the alignment accuracy of the two guide plates 31 and the spacers 32. In addition, the alignment mark of the spacer 32 should just be formed in both surfaces, and may not be a through-hole.

  The etching hole 36 is a through-hole that communicates the probe placement space 32S with the outside after the guide plate 31 and the spacer 32 are joined and before the formation of the guide hole 33, and is used in the processing process of the guide hole 33. The

  The step space 37 is a space generated by the step shape due to the difference in the outer size of the guide plate 31 and the spacer 32. The two guide plates 31 include a first guide plate 31A having a different outer size, a smaller outer size, and a second guide plate 31B having a larger outer size. The outer shape of the spacer 32 is the same as that of the second guide plate 31 </ b> B, and the first guide 31 </ b> A is disposed without facing the peripheral portion of the spacer 32 including the screw hole 34 and the alignment mark 35. Accordingly, a step space 37 adjacent to the main surface of the spacer 32 is formed outside the first guide plate 31A as compared with the case where the outer shapes of the two guide plates 31 and the spacer 32 are the same.

  By using the step space 37, a larger overdrive amount can be secured. As shown in FIG. 1, the front end side guide unit 21A is arranged so that the first guide plate 31A is lower than the second guide plate 31B, and the mounting screw 24 screwed from below is provided in a step space 37. To the screw hole 34 of the spacer 32. For this reason, the head of the mounting screw 24 is disposed in the step space 37 and can be prevented or suppressed from projecting downward from the distal end side guide unit 21A. As a result, the distance from the probe card 100 to the object to be inspected is increased by the amount by which the head of the mounting screw 24 is prevented or suppressed from protruding compared to a conventional probe card having no step space 37. A larger overdrive amount can be ensured.

  In addition, the electronic component 123 can be disposed closer to the contact probe 20 by using the step space 37. As shown in FIG. 1, the rear end side guide unit 21 </ b> B is disposed such that the first guide plate 31 </ b> A is above the second guide plate 31 </ b> B, and the electronic component 123 is disposed in the step space 37. The distance from the wiring board 12 to the nearest guide plate 31 (the first guide plate 31A of the rear end side guide unit 21B) is narrow, and there are many restrictions on mounting the electronic component 123. For this reason, by arranging the electronic component 123 using the step space 37, more electronic components 123 can be mounted on the lower surface of the wiring board 12, and the electronic component 123 is placed closer to the contact probe 20. Can be arranged.

  FIG. 5 is a perspective view showing the guide plate 31 and the spacer 32 before joining. The guide unit 21 improves the relative positional accuracy of the corresponding guide holes 33 between different guide plates 31 by forming the guide holes 33 after joining the guide plates 31 and the spacers 32. That is, the alignment accuracy between the guide holes 33 is improved without being affected by the alignment accuracy between the guide plates 31 at the time of joining. For this reason, the guide hole 33 is not formed in the guide plate 31 at the time of joining. In addition, the screw hole 34, the alignment mark 35, and the etching hole 36 are previously formed in the 2nd guide plate 31B at the time of joining.

<Function of guide unit 21>
The contact probe 20 is buckled and deformed between the guide units 21 during overdrive. At this time, the distal end side guide unit 21 </ b> A ensures the electrical connection between the contact probe 20 and the microelectrode of the inspection object by limiting the fluctuation of the horizontal position of the distal end of the contact probe 20. Similarly, the rear end side guide unit 21 </ b> B ensures continuity between the contact probe 20 and the probe electrode 122 by restricting fluctuations in the horizontal position of the rear end of the contact probe 20.

  The distal-side guide unit 21A supports the vicinity of the distal end of the contact probe 20, and defines the horizontal position and inclination of the support portion, thereby defining the horizontal position of the distal end of the contact probe 20. For this purpose, the distal end side guide unit 21A includes two guide plates 31 facing each other with the probe arrangement space 32S interposed therebetween. For example, if the guide holes 33 through which the same contact probe 20 is inserted are arranged in the vertical direction, the extending direction near the tip of the contact probe 20 is also in the vertical direction.

  The rear end side guide unit 21 </ b> B supports the vicinity of the rear end of the contact probe 20, and defines the horizontal position and inclination of the support portion, thereby defining the horizontal position of the rear end of the contact probe 20. Therefore, the rear end side guide unit 21B includes two guide plates 31 that face each other with the probe arrangement space 32S interposed therebetween. For example, if the guide holes 33 through which the same contact probe 20 is inserted are arranged in the vertical direction, the extending direction in the vicinity of the rear end of the contact probe 20 is also in the vertical direction.

  Therefore, the guide unit 21 needs to align the corresponding guide hole 33 with high accuracy. For this reason, the contact probe manufacturing method according to the present embodiment forms the guide holes 33 after the guide plates 31 are joined, so that the guide holes 31 between the guide plates 31 are not affected by the displacement of the guide plates 31. 33 can be aligned with high accuracy.

  6 to 8 are cross-sectional views sequentially showing an example of a manufacturing process of the guide unit 21 shown in FIG.

FIG. 6A shows the guide plate 31 and the spacer 32 before joining. An oxide film (SiO ₂ ) 40 is formed on the spacer 32. Since the interval between the guide plates 31 is defined by the thickness of the spacer 32, the interval between the guide plates 31 can be finely adjusted by adjusting the thickness of the oxide film 40. An oxide film 40 may be formed on the surface of the guide plate 31.

  FIG. 6B shows an assembly obtained by joining the guide plate 31 and the spacer 32. The two guide plates 31 are joined to different surfaces of the spacer 32, respectively. The region on the guide plate 31 facing each other through the inside of the through hole 32H of the spacer 32, that is, through the probe placement space 32S becomes the probe placement region 31R. The etching hole 36 is a communication path that communicates the probe arrangement space 32S with the outside.

  FIG. 6C shows an assembly in which the oxide film 40 is formed. An oxide film 40 is formed on the entire surface of the assembly obtained by the bonding. The oxide film 40 is formed by, for example, thermal oxidation, and is formed not only on the outer surface of the assembly but also on the inner wall surface of the probe arrangement space 32S. That is, oxide films are formed on both surfaces of the guide plate 31 in the probe arrangement region 31R.

  FIG. 6D shows a state after the metal layer 41 is formed. A metal layer 41 is formed on the surface of the assembly on which the oxide film 40 is formed. The metal layer 41 is formed by vapor deposition or sputtering, and is formed on the entire outer surface of the assembly, but is not formed on the inner wall surface of the probe arrangement space 32S.

  FIG. 7A shows the state after application of the photosensitive resist. A resist film 42 is formed on the entire surface of the assembly on which the metal layer 41 is formed.

  FIG. 7B shows the state after exposure and development together with the photomask 4. The exposure process is performed by arranging the photomask 4 on which the pattern of the guide hole 33 is drawn so as to face the guide plate 31. At this time, alignment of the photomask 4 is performed using the alignment mark 35. This exposure process is performed for each of the two guide plates 31. The exposure processing of both guide plates 31 may be performed simultaneously or sequentially. In the development processing performed after the exposure, only the resist film 42 in the formation region of the guide hole 33 is selectively removed by the developer, and an opening exposing the metal layer 41 is formed.

  The photomask 4A is a photomask for the first guide plate 31A, and the photomask 4B is a photomask for the second guide plate 31B. The two photomasks 4A and 4B are aligned using the alignment mark 35 of the spacer 32. For this reason, the positioning of the guide hole 33 can be performed with high accuracy without being affected by the alignment accuracy when the guide plate 31 and the spacer 32 are joined.

  In the present embodiment, the case where alignment is performed using the alignment mark 35 of the spacer 32 has been described. However, the alignment mark 35 of the guide plate 31 is visible from both directions, and alignment is performed using the alignment mark 35. May be performed.

  FIG. 7C shows a state after the metal layer 41 is etched. After exposure and development of the resist film 42, chemical etching of the metal layer 41 is performed, and only the metal layer 41 in the formation region of the guide hole 33 is selectively removed, and an opening exposing the oxide film 40 is formed.

  FIG. 8A shows a state after the selective removal of the oxide film 40. After the resist film 42 is removed, the oxide film 40 is selectively removed by chemical etching. By exposing the outer surface of the assembly to the etching solution, the oxide film 40 in the formation region of the guide hole 33 is removed, and an opening exposing the outer surface of the guide plate 31 is formed. The etching solution also flows into the probe placement space 32S through the etching hole 36, and the oxide film on the inner wall surface of the probe placement space 32S is also removed. Accordingly, the oxide film 40 is removed from both sides of the guide plate 31 in the formation region of the guide hole 33.

  In order to efficiently remove the oxide film 40 formed on the inner wall surface of the probe placement space 32S, it is desirable that two or more etching holes 36 are provided in the probe placement region 31R. In particular, it is desirable that the two etching holes 36 be disposed at positions apart from each other, for example, with the guide hole 33 interposed therebetween.

  Although an example has been described here in which the etching hole 36 is formed in the second guide plate 31B to allow the etchant to flow into the probe placement space 32S, the present invention is not limited to such a configuration. For example, the etching hole 36 may be formed in the first guide plate 31 </ b> A, or a communication path through which the etching solution can flow may be provided between the guide plate 31 and the spacer 32.

  FIG. 8B shows a state after the guide hole 33 is formed. After the oxide film 40 is selectively removed, the guide hole 33 is formed. The guide hole 31 is formed by, for example, the DRIE method (deep RIE method). The DRIE method is a method in which the RIE method (reactive ion etching method) and the protective film formation are alternately performed, and the through-hole in which the inclination of the inner wall surface with respect to the thickness direction of the guide plate 31 is smaller than the general RIE method. Can be formed.

  FIG. 8C shows a state after the oxide film 40 is formed. After the guide hole 33 is formed, an oxide film by thermal oxidation is formed on the entire surface of the assembly. This oxide film functions as a protective film and an insulating film. The guide unit 21 is obtained by the above manufacturing process.

  In the method of manufacturing the probe card 100 according to the present embodiment, after the spacers 32 are sandwiched and the two guide plates 31 are joined, each guide plate 31 is exposed and developed on the outer surface of each guide plate 31. A guide hole 33 is formed in each. By forming the guide hole 33 by such a method, it is possible to prevent a relative positional shift from occurring between the corresponding guide holes 33 due to the influence of the positional shift when the guide plate 31 is joined. . In addition, the alignment in the exposure and development process can ensure higher accuracy than the alignment at the time of joining the guide plate 31. For this reason, alignment of the corresponding guide hole 33 can be performed with high accuracy.

  In the method of manufacturing the probe card 100 according to the present embodiment, the guide plate 31 is made of a silicon plate, and the guide holes 33 are formed by the DRIE method (deep digging reactive ion etching method) for the guide plate 31. By forming the guide hole 33 by such a method, the guide hole 33 can be easily formed in the guide plate 31 after joining.

  In the method of manufacturing the probe card 100 according to the present embodiment, when the guide hole 33 is formed, an oxide film is formed on both surfaces of the guide plate 31 and a part of the oxide film formed on the outer surface of the guide plate 31 is formed. Then, an opening corresponding to the formation region of the guide hole 33 is formed, and the oxide film formed in the probe placement region 31R on the inner surface of the guide plate 31 is removed. By such a method, an opening exposing the formation region of the guide hole 33 can be formed on the outer surface of the guide plate 31, and the oxide film formed on the inner surface of the guide plate 31 can also be removed.

  Further, in the method of manufacturing the probe card 100 according to the present embodiment, when removing the oxide film formed in the probe placement region 31R, the probe placement space 32S defined by the guide plate 31 and the spacer 32 is communicated with the outside. Using the etching hole 36, an etching solution is supplied from the outside to the probe placement space 32S. With such a configuration, the oxide film formed on the inner surface of the guide plate 31 can be easily removed.

Embodiment 2. FIG.
In the first embodiment, the example of the guide unit 21 in which the outer size of the guide plate 31 is different has been described. On the other hand, in the present embodiment, an example of the guide unit 21 having the same outer size of the guide plate 31 will be described.

  FIG. 9 is a cross-sectional view showing a configuration example of the probe card 101 according to the second embodiment of the present invention, and shows a cross section when the probe card 101 arranged in the horizontal direction is cut along a vertical plane. . FIG. 10 is a diagram showing a detailed configuration of the distal end side guide unit 21A shown in FIG. 9. FIG. 10A is a plan view of the distal end side guide unit 21A as viewed from the first guide plate 31A side. FIG. 4B is a cross-sectional view taken along the line BB, and FIG. 4C is a bottom view seen from the second guide plate 31B side. FIG. 11 is an exploded view showing the distal side guide unit 21A in an exploded manner. In addition, the overlapping description is abbreviate | omitted about the structure same as the probe card 100 (Embodiment 1) of FIG.

  The distal-side guide unit 21A has the same outer size of the two guide plates 31 and the spacer 32 as in the conventional guide unit. For this reason, the screw hole 34 and the alignment mark 35 are also formed in the first guide plate 31A in the same manner as the second guide plate 31B.

  Further, the inner diameter of the screw hole 34 of the first guide plate 31 </ b> A is larger than the screw hole 34 of the second guide plate 31 </ b> B and the spacer 32, and larger than the outer diameter of the head of the mounting screw 24. For this reason, the head of the mounting screw 24 is disposed in the screw hole 34 of the first guide plate 31A, and can be prevented or suppressed from projecting downward from the distal end side guide unit 21A. As a result, the distance from the probe card 101 to the object to be inspected is increased by the amount by which the head of the mounting screw 24 is prevented or suppressed, and a larger overdrive amount can be secured.

  Further, since the diameter of the alignment mark 35 of the two guide plates 31 is larger than the alignment mark 35 of the spacer 32, the alignment mark 35 of the spacer 32 has the alignment mark 35 of the guide plate 31 from both above and below. Can be visually recognized. For this reason, the position of the corresponding guide hole 33 between the two guide plates 31 can be accurately matched without being affected by the alignment accuracy of the two guide plates 31 and the spacers 32. The alignment mark 35 of the spacer 32 may not be a through hole as long as it is formed on both surfaces.

  In the present embodiment, the example in which the alignment mark 35 that is visible from both above and below is provided on the spacer 32 has been described. However, the present invention is not limited to such a case. For example, one of the two guide plates 31 may be provided with an alignment mark 35 that is visible from above and below after joining.

  In the present embodiment, the example of the probe cards 100 and 101 including the probe attachment 15 constituted by the two guide units 21 has been described. However, the present invention is not limited to such a case. That is, the present invention can be provided as long as the probe card includes one or more guide units 21.

100, 101 Probe card 12 Wiring board 120 Probe placement area 121 External electrode 122 Probe electrode 123 Electronic component 124 Mounting frame 13 Reinforcement plate 15 Probe attachment 20 Contact probe 21 Guide unit 21A Front end side guide unit 21B Rear end side guide unit 22 Support frame 23, 24 Mounting screw 31 Guide plate 31A First guide plate 31B Second guide plate 31R Probe placement area 32 Spacer 32H Through hole 32S Probe placement space 33 Guide hole 34 Screw hole 35 Alignment mark 36 Etching hole 37 Step space 4, 4A, 4B Photomask 40 Oxide film 41 Metal layer 42 Resist film

Claims (4)

A method of manufacturing a probe card having a guide unit for positioning a probe,
A step in which two guide plates are joined together with a spacer outside the probe placement region;
Performing exposure development processing on the outer surfaces of the two guide plates joined to each other that do not face each other to form corresponding guide holes in the two guide plates, respectively;
And a step of inserting the probe into the two guide holes corresponding to each other.   The probe card manufacturing method according to claim 1, wherein the guide hole is formed by a deep reactive ion etching method for the guide plate made of silicon. The step of forming the guide hole includes forming a silicon oxide film on both surfaces of the guide plate;
Removing a part of the silicon oxide film formed on the outer surface of the guide plate, and forming an opening corresponding to the formation region of the guide hole;
The method for manufacturing a probe card according to claim 2, further comprising a step of removing the silicon oxide film formed in the probe placement region on the inner surface of the guide plate.   The step of removing the silicon oxide film formed in the probe arrangement region is performed from the outside to the probe arrangement space via a communication path that connects the probe arrangement space defined by the guide plate and the spacer and the outside. The method for manufacturing a probe card according to claim 3, wherein the method is performed by supplying an etching solution.

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