JP2018035392A - Processing roller and method of manufacturing the same, and processing apparatus, and backing plate and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing roller capable of performing smooth conveyance while keeping a surface of a film flat when various processing such as film deposition is performed on the film on a roll-to-roll basis by various processing apparatuses such as a sputtering apparatus, speedily and accurately controlling the temperature of the film, and also performing the processing excellently.SOLUTION: A processing roller wound with a film to be processed by film deposition on a roll-to-roll basis has, at least at an effective part, a cylinder part which has a flow passage formed inside and is made of copper, copper alloy, aluminum, or aluminum alloy. On a surface of the cylinder part, a coating layer is formed as needed which is formed of a material higher in hardness than the material forming the cylinder part. The flow passage inside the cylinder part is typically in a shape which is bent zigzag having a part extending linearly in a circumferential direction of the cylinder part and a folded part, and has a rectangular cross-sectional shape parallel with the center axis of the cylinder part.SELECTED DRAWING: Figure 1

Description

  The present invention is used in various processing apparatuses such as a sputtering apparatus, a vacuum evaporation apparatus, and a dry etching apparatus that perform various processes such as film formation and etching on a film by a roll-to-roll method. In particular, the present invention relates to a processing roller and a manufacturing method thereof, a processing apparatus having such a processing roller, a backing plate and a manufacturing method thereof, for example, forming a thin film on a film or the like. The present invention relates to a processing roller and a processing apparatus suitable for manufacturing various devices for etching a thin film and a backing plate suitable for cooling a sputtering cathode, for example.

  Conventionally, in the process of forming electrodes in various devices such as semiconductor devices, solar cells, liquid crystal displays, and organic EL, a sputtering apparatus or a vacuum evaporation apparatus has been used to form an electrode material.

  Conventionally, film forming apparatuses such as a sputtering apparatus and a vacuum evaporation apparatus for forming a film on a film by a roll-to-roll method have been put into practical use. In this film forming apparatus, a film forming roller (also called a main roller) is installed in the film forming chamber, and a pair of rollers for unwinding / winding is installed in a film transfer chamber provided separately from the film forming chamber. Then, the film is unwound from one roller, and film formation is performed on the film wound around the film formation roller while winding the film with the other roller through the film formation roller. The film forming roller that has been generally used conventionally is composed of a cylindrical stainless steel plate, and a cylindrical stainless steel plate having a slightly smaller diameter is provided inside the cylindrical stainless steel plate. Cooling water can be supplied to the space between the stainless steel plates provided in the plate to perform cooling (for example, see Non-Patent Document 1).

Japanese Patent No. 5102470

[Search August 8, 2016], Internet <URL: http://www.komatsubara-iw.jp/roll 04.html> [Search August 8, 2016], Internet <URL: http://www.ramtech.jp/page5>

  However, the conventional film forming roller described above has a structure in which the pressure of the cooling water is applied to the entire inner surface of the outer cylindrical stainless steel plate, so that it deforms into a via barrel shape in a vacuum, and the film surface is curved. In addition to this, there was a drawback that the film could not be transported smoothly.

  Therefore, the problem to be solved by the present invention is that when a film is formed by a roll-to-roll method in a film forming apparatus such as a sputtering apparatus or a vacuum vapor deposition apparatus, more generally, a film is formed on an object to be processed. In addition, in the roll-to-roll method, when the thin film formed on the object to be processed is subjected to various processes such as dry etching such as plasma etching, surface treatment by plasma, and cooling, the object to be processed such as a film. The surface of the substrate can be smoothly conveyed while being kept flat, the temperature of the object to be processed can be controlled quickly and accurately, and various processes such as film formation and etching can be performed satisfactorily It is to provide a roller and its manufacturing method and a processing apparatus having such a processing roller.

  Another problem to be solved by the present invention is that a backing plate capable of quickly and accurately controlling the temperature of a cylindrical body by using it in contact with a cylindrical body such as a cylindrical sputtering target, and its manufacture Is to provide a method.

In order to solve the above problems, the present invention provides:
A processing roller around which a workpiece to be processed in a roll-to-roll system is wound,
It has a cylindrical part made of copper, copper alloy, aluminum or aluminum alloy with a built-in flow path at least as an effective part.

  The effective portion of the processing roller refers to a portion around which the object to be processed is wound and comes into contact. Here, the treatment includes film formation, dry etching (plasma etching, etc.), surface treatment with plasma (for the purpose of improving adhesion, surface modification, hydrophilicity improvement, reduction treatment, water repellent treatment, etc.) Various types of cooling processing are included. The object to be processed may be basically any material as long as it can be wound around the effective portion of the processing roller, and is not particularly limited. Specifically, the object is, for example, a film, a thin plate, or a fiber. The material may be a cloth-like body, a linear body, or the like, and the material may be various materials such as a resin, a metal material (ferrous material and non-ferrous material) such as a single metal or an alloy. When the cylindrical portion is made of copper or a copper alloy, when the thermal conductivity and workability are regarded as the most important, preferably, copper (pure copper) (for example, oxygen-free) having high thermal conductivity and excellent spreadability is used. Copper, tough pitch copper, phosphorous deoxidized copper, etc.), most preferably oxygen free copper. On the other hand, the cylindrical part is made of a copper alloy when characteristics that cannot be obtained with copper (for example, higher mechanical strength than copper) are required. Examples of the copper alloy include a copper-tin alloy, a copper-zinc alloy, a copper-nickel alloy, a copper-aluminum alloy, and a copper-beryllium alloy. Alloys and compositions that meet the desired properties are selected. Further, when the cylindrical portion is made of aluminum or an aluminum alloy, when the thermal conductivity and workability are regarded as the most important, the cylindrical portion is preferably made of aluminum (pure aluminum) having high thermal conductivity and excellent spreadability. Is done. On the other hand, the cylindrical portion is made of an aluminum alloy when characteristics that cannot be obtained with aluminum (for example, higher mechanical strength than aluminum) are required. Examples of the aluminum alloy include an aluminum-copper-magnesium alloy, an aluminum-manganese alloy, an aluminum-silicon alloy, an aluminum-magnesium alloy, an aluminum-magnesium-silicon alloy, and an aluminum-zinc-magnesium alloy. Among these, an alloy and a composition satisfying the characteristics required for the cylindrical portion are selected. Thus, when a cylindrical part is comprised with copper, a copper alloy, aluminum, or an aluminum alloy, high heat conductivity can be obtained at least compared with stainless steel. For example, the thermal conductivity of stainless steel is 16.7 W / (m · K) for SUS304 and SUS316, and 26.0 W / (m · K) for SUS444, whereas the thermal conductivity of copper is oxygen-free copper ( C1020) and tough pitch copper (C1100) are 391 W / (m · K), phosphorous deoxidized copper (C1220) is 339 W / (m · K), and the thermal conductivity of the copper alloy is brass 1 which is a copper-zinc alloy. 121W / (m · K) for seeds, 33W / (m · K) for two types of copper-nickel alloys, 84W / (m · K) for one type of phosphor bronze that is a copper-tin alloy, Copper-nickel-silicon alloy (Corson alloy), which is a copper-nickel alloy, such as 210 W / (m · K) for EFTEC23Z, the thermal conductivity of aluminum is 220 W / (m · K) for A1100, aluminum alloy The thermal conductivity is 190 W / (m · K) for A2017 which is an aluminum-copper-magnesium alloy, 190 W / (m · K) for A3003 which is an aluminum-manganese alloy, and A4032 which is an aluminum-silicon alloy. 150 W / (m · K), 200 W / (m · K) for the aluminum-magnesium alloy A5005, 220 W / (m · K) for the A6063 aluminum-magnesium-silicon alloy, aluminum-zinc-magnesium system A7075, which is an alloy, has 130 W / (m · K), which is higher than stainless steel.

  Preferably, at least the outer peripheral surface of the cylindrical portion made of copper, copper alloy, aluminum or aluminum alloy is configured to prevent scratching or abrasion during use of the processing roller. A coating layer made of a material having higher hardness than copper, copper alloy, aluminum or aluminum alloy is formed. For example, the surface of the cylindrical portion is plated with copper, a copper alloy, aluminum, or a material having higher hardness than aluminum alloy, preferably hard chrome plating. The thickness of the coating layer or the plating layer is selected so as not to impair the thermal conductivity of the surface of the cylindrical portion.

  A fluid such as liquid or gas is flowed through the flow path built in the cylindrical portion, and what kind of fluid is flowed is appropriately determined according to the processing performed by the processing roller, the type of material constituting the cylindrical portion, and the like. . Examples of the fluid include water, oil, alternative CFCs (hydrofluorocarbon (HFC)), and air. The flow path contained in the cylindrical portion is typically bent in a zigzag shape having a portion that extends linearly in the circumferential direction of the cylindrical portion (a straight portion when the cylindrical portion is expanded on a plane) and a folded portion. Have a different shape. The cross-sectional shape of the flow path is not particularly limited and is selected as necessary, but preferably has a rectangular cross-sectional shape parallel to the central axis of the cylindrical portion. More specifically, the cylindrical portion preferably has, for example, a lower groove having the same planar shape as the flow path when the cylindrical portion is expanded in a plane, and a planar shape substantially similar to the lower groove. A first flat plate having a rectangular or square planar shape that is the same as the planar shape when the cylindrical portion is developed on a plane, wherein a groove comprising an upper groove that is larger than the lower groove is provided on one main surface; A flat plate having a rectangular or square planar shape, in which a boundary portion between the first flat plate and the second flat plate is joined by friction stir welding, is composed of a second flat plate fitted in the upper groove of the flat plate groove. Rounded in a cylindrical shape in a flat direction (a direction parallel to or perpendicular to the straight line portion of the flow path when the cylindrical portion is expanded in a plane), and one end and the other end of this rounded plate are joined Consists of. When this flat plate is rolled into a cylindrical shape in a direction parallel to one side thereof, the surface on the side where the boundary between the first flat plate and the second flat plate is joined by friction stir welding may be external. You may make it inside. In the process of rounding the flat plate into a cylindrical shape, in order to prevent the lower groove which finally becomes the flow path from being deformed and the flow path having the cross-sectional shape as designed cannot be obtained, the groove of the first flat plate is prevented. You may make it provide the support | pillar for supporting the 2nd flat plate fitted by the upper part groove | channel inside this lower part groove | channel. By doing so, when the flat plate is rolled into a cylindrical shape, the support supports the second flat plate with respect to the lower groove, thereby preventing the lower groove from being deformed. This support is provided in at least one place in the extending direction of the lower groove, typically a plurality of places, and in some cases, for example, in the form of a line or a dot, and preferably has a cross-sectional area of the lower groove. In order not to decrease too much, it is provided with a width sufficiently smaller than the width of the lower groove. This support may be provided integrally with the first flat plate or the second flat plate, or may be produced separately from the first flat plate and the second flat plate. Friction stir welding is performed by inserting the material into the material while rotating the welding tool, and moving the welding tool along the welding line to soften the material by frictional heat generated between the welding tool and the material. Is solid phase bonding using frictional heat and plastic flow that are agitated and bonded together (see, for example, Patent Document 1 and Non-Patent Document 2). Since the crystal structure joined by this friction stir welding becomes finer than before joining, the stretchability in the direction along the joining line is improved. Therefore, a flat plate having a rectangular or square planar shape in which the boundary portion between the first flat plate and the second flat plate is joined by friction stir welding has good stretchability in the direction of the boundary portion. The process of rounding in a cylindrical shape in the direction of the boundary portion so that the surface on the side where the boundary portion between the first flat plate and the second flat plate is joined by friction stir welding is outside, the boundary between the first flat plate and the second flat plate This can be easily performed without causing destruction or damage of the part. The flow path contained in the cylindrical portion is not limited to the above-described one having a zigzag shape having a portion extending linearly in the circumferential direction of the cylindrical portion and a folded portion. You may have the shape bent in the zigzag shape which has the part extended in the direction parallel to a central axis, and a folding | turning part. Further, a plurality of flow paths built in the cylindrical portion may be provided between the both end faces of the cylindrical portion in parallel with the central axis of the cylindrical portion and at, for example, equal intervals in the circumferential direction of the cylindrical portion. Such a flow path is obtained by, for example, rounding a flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is developed into a plane into a cylindrical shape in a direction parallel to one side thereof. After joining one end and the other end, it can be formed by forming a through hole reaching from the one end face of the cylindrical portion to the other end face. The cross-sectional shape of the flow path in this case is not particularly limited, but is circular when the through hole is formed by, for example, gun drilling.

  Typically, discs are provided at both ends of the cylindrical portion so as to close the cylindrical portion, and these discs have through-holes that communicate the inside and the outside of the cylindrical portion. Thus, when this processing roller is installed as a film forming roller in a film forming chamber of a film forming apparatus such as a sputtering apparatus or a vacuum vapor deposition apparatus, and the inside of the film forming chamber is evacuated, the pressure inside and outside the cylindrical portion is made equal. Therefore, it is possible to prevent the cylindrical portion from being deformed due to an external force. Although the material which comprises these discs is chosen as needed, it is stainless steel, for example. In order to ensure the symmetry of the weight distribution around the central axis of the processing roller and to allow the processing roller to rotate smoothly, the through-holes in these discs are preferably They are arranged symmetrically around the central axis. Typically, on the outside of each disc, a rotating shaft is mounted on the processing roller and thus on the central axis of the cylinder. The fluid can be supplied to the flow path built in the cylindrical portion as follows, for example. That is, a first through hole that penetrates the rotating shaft and the one disc is provided on the central axis of one rotating shaft, and a first penetrating through the rotating shaft and the other disc is provided on the central axis of the other rotating shaft. Two through-holes are provided, communicated with the first through-hole inside the cylindrical portion, and one end of the first pipe is fixed with airtightness, and the other end of the first pipe is connected to one of the flow paths built in the cylindrical portion. Is connected to the hole provided so as to communicate with the flow path at one end of the disk side, and communicates with the second through-hole inside the cylindrical portion so that one end of the second pipe is airtight. The other end of the second pipe is connected to a hole provided so as to communicate with the other end on the other disk side of the flow path built in the cylindrical portion with airtightness. Then, the fluid is supplied from the outside through the first through hole of one of the rotating shafts, and the fluid is supplied to one end of the flow path built in the cylindrical portion via the first pipe, and the other end of the flow path The fluid is circulated through the flow path by discharging it from the through hole of the other rotating shaft via the second pipe connected to the other end portion from the portion. Alternatively, a third through hole penetrating this rotary shaft is provided on the central axis of one rotary shaft, a fourth through hole penetrating this rotary shaft is provided on the central axis of the other rotary shaft, and one disk Is provided with a flow path communicating with the third through hole, and this flow path is communicated with one end of one of the flow paths contained in the cylindrical portion, and the fourth through hole is formed inside the other disk. And a flow path communicating with the other disk side of the flow path built in the cylindrical portion. Then, a fluid is supplied from the outside through the through hole of one of the rotating shafts, and this fluid is supplied to one end of the flow path built in the cylindrical portion via the flow path built in one disk. The fluid is circulated through the flow path by discharging it from the through hole of the other rotating shaft via the flow path built in the other disk connected to the other end from the other end of the path. .

  The outer diameter and inner diameter of the cylindrical portion, the length, the cross-sectional shape of the flow path built in the cylindrical portion, the cross-sectional dimension, the interval, and the like are appropriately selected according to the intended use of the processing roller.

  This processing roller typically includes various film forming apparatuses such as a sputtering apparatus, a vacuum vapor deposition apparatus, and a plasma CVD (Chemical Vapor Deposition) apparatus for forming a film on a target object in a roll-to-roll manner. In a roll-to-roll system, various types of processing equipment (such as dry etching equipment and plasma processing equipment) that perform dry etching (plasma etching, etc.) of thin films formed on the object to be processed and surface treatment with plasma. Used for membrane devices). Among these processing rollers, a roller used for a part where film formation is performed in a film formation apparatus is called a film formation roller.

In addition, this invention
A method of manufacturing a processing roller having a cylindrical portion made of copper, copper alloy, aluminum, or aluminum alloy containing a flow path around which a workpiece to be processed by a roll-to-roll method is wound, at least in an effective portion,
A groove composed of a lower groove having the same planar shape as the flow path when the cylindrical portion is developed in a plane and a planar shape substantially similar to the lower groove, and an upper groove larger than the lower groove is one of the grooves. A step of fitting a second flat plate into the upper groove of the groove of the first flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is flattened provided on the main surface;
Joining the boundary between the first flat plate and the second flat plate by friction stir welding;
A rectangular or square flat plate composed of the first flat plate and the second flat plate in which the boundary between the first flat plate and the second flat plate is joined by the friction stir welding in a direction parallel to one side thereof. Rounding into a cylindrical shape and joining one end and the other end of the rounded plate;
It is characterized by having.

In addition, this invention
A method of manufacturing a processing roller having a cylindrical portion made of copper, copper alloy, aluminum, or aluminum alloy containing a flow path around which a workpiece to be processed by a roll-to-roll method is wound, at least in an effective portion,
A rectangular or square flat plate having the same planar shape as the planar shape when the cylindrical portion is developed in a plane is rounded into a cylindrical shape in a direction parallel to one side, and one end and the other end of the rounded plate are joined. Process,
The flow path is formed by forming through holes reaching from one end face of the rounded plate to the other end face in parallel to the central axis of the rounded plate and at equal intervals in the circumferential direction of the rounded plate. Forming a step;
It is characterized by having.

  The first flat plate and the second flat plate are made of the same material as copper, copper alloy, aluminum, or aluminum alloy constituting the cylindrical portion. In the invention of the manufacturing method of these processing rollers, what has been described in relation to the invention of the processing roller is valid as long as it is not contrary to its properties.

In addition, this invention
A processing apparatus having a processing roller around which a workpiece to be processed in a roll-to-roll system is wound,
The processing roller has at least an effective portion having a cylindrical portion made of copper, copper alloy, aluminum, or aluminum alloy with a built-in flow path.

  This processing apparatus includes film forming apparatuses such as a sputtering apparatus, a vacuum evaporation apparatus, and a plasma CVD apparatus for forming a film on a target object by a roll-to-roll method, and a target object by a roll-to-roll method. Various processing apparatuses (except for a film forming apparatus) such as a dry etching apparatus or a plasma processing apparatus for performing dry etching (plasma etching or the like) of a thin film formed thereon or surface treatment with plasma are included. In the invention of the processing apparatus, what has been described in relation to the invention of the processing roller is valid as long as it is not contrary to the nature of the processing apparatus.

In particular, when the film forming apparatus is a sputtering apparatus, this sputtering apparatus preferably has a tubular shape having a pair of long sides whose cross-sectional shapes face each other, and the erosion surface faces inward. A sputtering cathode having a sputtering target is provided in the deposition chamber. As described above, the sputtering target of the sputtering cathode has a tubular shape having a pair of long sides whose cross-sectional shapes face each other, that is, a shape surrounded by four sides, and the erosion surface faces inward, so that sputtering is performed. When this sputtering cathode is attached to the apparatus and discharge is performed, plasma circulating around the inner surface of the sputtering target can be generated on the erosion surface side of the sputtering target. For this reason, since the plasma density can be increased, the deposition rate can be sufficiently increased. In addition, since a place where a large amount of plasma is generated is limited to the vicinity of the surface of the sputtering target, it is possible to minimize the possibility of damage caused by irradiating the film with light emitted from the plasma. Typically, the distance between a pair of opposing long sides of the sputtering target is sufficient to allow the number of sputtered particles toward the space above the sputtering target to be sufficient when the sputtering cathode is attached to a sputtering apparatus. From the viewpoint of ensuring that the light generated from the plasma generated in the vicinity of the surface of the sputtering target is prevented from being irradiated to the object to be processed that is transported in the space above the sputtering target, it is preferably 50 mm or more and 150 mm or less. More preferably, it is 60 mm or more and 100 mm or less, and most preferably 70 mm or more and 90 mm or less. The ratio of the length of the long side portion to the distance between the pair of long side portions of the sputtering target is typically 2 or more, preferably 5 or more. Although there is no particular upper limit for this ratio, it is generally 40 or less. The pair of long side portions of the sputtering target are typically parallel to each other, but are not limited to this, and may be inclined with respect to each other. The cross-sectional shape of the sputtering target typically has a pair of long sides that are parallel to each other and a pair of short sides that are perpendicular to these long sides. In this case, the sputtering target has a rectangular tubular shape with a rectangular cross section. The cross-sectional shape of the sputtering target may be composed of, for example, a pair of curved parts (for example, semicircular parts) facing each other whose both ends in the direction parallel to the long side part are convex outward. A sputtering target having a rectangular tubular shape with a rectangular cross-section typically has a pair of short plates that are perpendicular to the long side portion and the first and second flat plates constituting the pair of long side portions. It consists of a 3rd flat plate and a 4th flat plate which comprise a side part. In this case, it is possible to assemble the sputtering target by separately preparing the first flat plate to the fourth flat plate and arranging them in a square tube shape. The first flat plate and the second flat plate constituting the pair of long sides are generally made of a material having the same composition as the material for film formation, but may be made of different materials. Good. For example, the first flat plate is made of the material A, the second flat plate is made of the material B, and the sputtered particle bundle from the first flat plate and the sputtered particle bundle from the second flat plate are incident on the film. A thin film made of B can be formed, and a thin film made of a multi-component material can be formed by using two or more materials as materials A and B as required. More specifically, for example, the first flat plate is made of a metal M ₁ made of a single element, and the second flat plate is made of a metal M ₂ made of a single element, thereby forming M ₁ and M _2. It is possible to form a binary alloy thin film. This means that a film formation method similar to the binary evaporation method in the vacuum evaporation method can be realized by the sputtering apparatus.

  In general, sputtered particle bundles from portions other than the pair of long sides of the sputtering target are not actively used for film formation, but in order to prevent unintentional mixing of elements, The portions other than the pair of long side portions are made of the same material as the long side portions. However, when the sputtered particle bundle from portions other than the pair of long side portions of the sputtering target is actively used for film formation, the portions other than the pair of long side portions of the sputtering target are different from the pair of long side portions. It may be composed of materials.

In addition, this invention
It is a backing plate having a cylindrical portion made of copper, copper alloy, aluminum or aluminum alloy containing a flow path.

  In the invention of the backing plate, what has been described in relation to the invention of the processing roller is valid as long as it is not contrary to the nature of the backing plate.

In addition, this invention
A method of manufacturing a backing plate having a cylindrical portion made of copper, copper alloy, aluminum or aluminum alloy containing a flow path,
A groove composed of a lower groove having the same planar shape as the flow path when the cylindrical portion is developed in a plane and a planar shape substantially similar to the lower groove, and an upper groove larger than the lower groove is one of the grooves. A step of fitting a second flat plate into the upper groove of the groove of the first flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is flattened provided on the main surface;
Joining the boundary between the first flat plate and the second flat plate by friction stir welding;
A rectangular or square flat plate composed of the first flat plate and the second flat plate in which the boundary between the first flat plate and the second flat plate is joined by the friction stir welding in a direction parallel to one side thereof. Rounding into a cylindrical shape and joining one end and the other end of the rounded plate;
It is characterized by having.

In addition, this invention
A method of manufacturing a backing plate having a cylindrical portion made of copper, copper alloy, aluminum or aluminum alloy containing a flow path,
A flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is developed in a plane is rounded into a cylindrical shape in a direction parallel to one side, and one end and the other end of the rounded plate are joined. Process,
The flow path is formed by forming through holes reaching from one end face of the rounded plate to the other end face in parallel to the central axis of the rounded plate and at equal intervals in the circumferential direction of the rounded plate. Forming a step;
It is characterized by having.

  In the invention of the manufacturing method of these backing plates, what has been described in relation to the invention of the manufacturing method of the processing roller is valid as long as it is not contrary to the nature.

  According to the present invention, since the cylindrical portion of the processing roller is made of copper, copper alloy, aluminum, or aluminum alloy having excellent thermal conductivity, for example, by flowing cooling water or hot water into the flow path built in the cylindrical portion, the cylinder The part can be cooled or heated quickly and efficiently, and there is no problem of being deformed into a via barrel shape in a vacuum unlike the conventional film forming roller described in Non-Patent Document 1. For this reason, a film is formed on a target object such as a film by a roll-to-roll method in a film forming apparatus such as a sputtering apparatus, or is formed on a target object such as a film in a dry etching apparatus or a plasma processing apparatus. When etching a thin film formed, surface treatment with plasma, or cooling a target object such as a film, the surface of the target object can be smoothly transported while being maintained flat. In addition, since the cylindrical portion made of copper, copper alloy, aluminum or aluminum alloy having excellent thermal conductivity has good thermal responsiveness, the temperature can be quickly and quickly adjusted by the temperature or flow rate of cooling water or hot water flowing through the flow path. It is possible to accurately control the temperature of the object to be processed that is wound around the cylindrical portion quickly and accurately. Further, according to the backing plate of the present invention, the temperature of the cylindrical body can be controlled quickly and accurately by using it in contact with a cylindrical body such as a cylindrical sputtering target.

It is the front view which shows the processing roller by 1st Embodiment of this invention, the left view, the right view, and a longitudinal cross-sectional view. It is the top view and sectional drawing which show the state which expand | deployed the cylindrical part of the processing roller by 1st Embodiment of this invention on the plane. It is the top view and sectional drawing for demonstrating the manufacturing method of the processing roller by 1st Embodiment of this invention. It is the top view and sectional drawing for demonstrating the manufacturing method of the processing roller by 1st Embodiment of this invention. It is the top view and sectional drawing for demonstrating the manufacturing method of the processing roller by 1st Embodiment of this invention. It is an approximate line figure showing the sputtering device by a 2nd embodiment of this invention. It is an approximate line figure showing the sputtering device by a 2nd embodiment of this invention. It is a longitudinal cross-sectional view which shows the sputtering cathode of the sputtering device by 2nd Embodiment of this invention. It is a top view which shows the sputtering cathode of the sputtering device by the 2nd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the state which the plasma generate | occur | produced in the surface vicinity of the sputtering target in the sputtering device by the 2nd Embodiment of this invention. It is a top view which shows the state which the plasma generate | occur | produced in the surface vicinity of the sputtering target in the sputtering device by the 2nd Embodiment of this invention. It is a longitudinal cross-sectional view which shows the method of forming a thin film on a film with the sputtering device by 2nd Embodiment of this invention. It is a top view which shows the specific structural example of the sputtering cathode and anode of the sputtering device by the 2nd Embodiment of this invention. It is a top view which shows the sputtering cathode of the sputtering device by 3rd Embodiment of this invention.

  Hereinafter, modes for carrying out the invention (hereinafter referred to as “embodiments”) will be described with reference to the drawings.

<First Embodiment>
[Processing roller]
1A, B, C and D show a processing roller according to the first embodiment, FIG. 1A is a front view, FIG. 1B is a left side view, FIG. 1C is a right side view, and FIG.

  As shown in FIGS. 1A, B, C, and D, the processing roller includes a cylindrical portion 10 and discs 20 and 30 provided at both ends of the cylindrical portion 10 so as to close the cylindrical portion 10, and these The processing rollers, and therefore the rotating shaft 40 provided on the central axis of the cylindrical portion 10 are provided outside the discs 20 and 30.

The cylindrical portion 10 incorporates a rectangular cross-sectional flow path 11 parallel to the central axis of the cylindrical portion 10. That is, the flow path 11 is embedded in the cylindrical portion 10. 2A and 2B are plan views showing a state in which the cylindrical portion 10 is developed on a plane. As shown in FIGS. 2A and 2B, in this example, when the cylindrical portion 10 is expanded in a plane, the shape is a rectangle, and the flow path 11 includes a straight portion 11a extending in parallel with the long side of the rectangle and the linear portion 11a. Folded portions 11b that are bent perpendicular to the straight portions 11a are alternately provided, and have a shape that is bent in a zigzag shape. A hole 12 serving as an inlet for fluid such as cooling water is provided at one end of the flow path 11, and a hole 13 serving as an outlet for fluid is provided at the other end. The cylindrical portion 10 is made of copper, a copper alloy, aluminum, or an aluminum alloy, and is preferably made of oxygen-free copper having the highest thermal conductivity among these materials. Oxygen-free copper has a thermal conductivity about 23 times higher than that of, for example, stainless steel (SUS304). Although illustration is omitted, hard chrome plating is applied to at least the outer peripheral surface, typically the outer peripheral surface and the inner peripheral surface of the cylindrical portion 10. If the hard chrome plating layer is too thick, the thermal conductivity of the cylindrical portion 10 is reduced. If the hard chrome plating layer is too thin, the effect of surface hardening of the cylindrical portion 10 is small. Therefore, the thickness of the hard chrome plating layer is generally 20 μm or more. It is selected to be 40 μm or less, for example, 30 μm. The hardness of the hard chrome plating layer can be, for example, 500 or more in terms of Vickers hardness. If necessary, the surface of the hard chrome plating layer is planarized by polishing, thereby extremely small, for example between 10nm about surface roughness R _a.

  The discs 20 and 30 are fixed to both end surfaces of the cylindrical portion 10 by bolting, welding, or the like. The circular plate 20 is provided with a total of four circular through holes 21 to 24 at 90 ° intervals around the central axis. Similarly, the disc 30 is provided with a total of four circular through holes 31 to 34 at intervals of 90 ° around the central axis at positions corresponding to the through holes 21 to 24 of the disc 20. These through holes 21 to 24 and 31 to 34 are arranged inside and outside the cylindrical portion 10 when the processing roller is installed as a film forming roller in a film forming chamber such as a sputtering apparatus or a vacuum evaporation apparatus and the film forming chamber is evacuated. This is to prevent external force due to the pressure difference from being applied to the cylindrical portion 10 and the discs 20 and 30. The diameters of these through holes 21 to 24 and 31 to 34 are selected as necessary as long as the mechanical strength of the disks 20 and 30 can be secured. The discs 20 and 30 are made of, for example, stainless steel.

A through hole 41 having a circular cross section is provided on the central axis of the rotating shaft 40 fixed to the disk 20. The through-hole 41 includes a portion 41 a having a diameter d ₁ from the tip of the rotating shaft 40 to a midway depth and a portion 41 b having a diameter d ₂ smaller than d ₁ from the portion to the disk 20. The disc 20 is provided with a through hole 25 communicating with the portion 41 b on the central axis of the rotating shaft 40. One end of the pipe 51 communicates with the through hole 25 and is fixed with airtightness. The other end of the pipe 51 is connected to a hole 12 provided at one end of the flow path 11 on the disk 20 side with airtightness. Similarly, a through hole 42 having a circular cross-sectional shape is provided on the central axis of the rotating shaft 40 fixed to the disc 30. The through hole 42 includes a portion 42 a having a diameter d ₁ from the tip of the rotating shaft 40 to a midway depth and a portion 42 b having a diameter d ₂ smaller than d ₁ from the portion to the disk 30. The disc 20 is provided with a through hole 26 communicating with the portion 42b. One end of the pipe 52 communicates with the through hole 26 and is fixed with airtightness. The other end of the pipe 52 is connected to a hole 13 provided at one end of the flow path 11 on the disc 30 side with airtightness. As these piping 50 and 51, a flexible metal piping, for example, a bellows tube, is preferably used. The fluid is supplied from, for example, a through hole 41 of the rotating shaft 40 fixed to the disk 20 by a fluid circulation mechanism (not shown), enters the flow path 11 from the hole 12 of the cylindrical portion 10 via the pipe 51, It goes out of the hole 13 through this flow path 11, goes out of the through hole 42 of the rotating shaft 40 fixed to the disk 30 via the pipe 52, and circulates in this path.

  The dimensions of each part of this processing roller are selected as necessary. For example, the overall length is 500 mm, the diameter is 400 mm, the thickness of the cylindrical part 10 is 10 mm, the cross section of the flow path 11 is 35 mm × 5 mm, the flow path The interval of 11 is 15 mm.

[Processing roller manufacturing method]
As shown in FIGS. 3A and 3B, a rectangular flat plate 60 having a planar shape similar to that shown in the developed view of the cylindrical portion 10 shown in FIG. 2 is prepared. Here, FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along line BB of FIG. 3A. The thickness of the flat plate 60 is the same as the thickness of the cylindrical portion 10. A groove 61 having a cross-sectional shape with a step is provided on one main surface of the flat plate 60. The lower groove 61a of the groove 61 has the same planar shape and the same depth as the flow path 11 when the cylindrical portion 10 is developed in a plane. The upper groove 61b of the groove 61 is similar to the lower groove 61a and has a planar shape that is slightly larger.

  Next, as shown in FIGS. 4A and 4B, a flat plate 70 having the same planar shape as the upper groove 61b of the groove 61 of the flat plate 60 and the same thickness as the depth of the upper groove 61b is prepared. Here, FIG. 4A is a plan view, and FIG. 4B is a cross-sectional view taken along line BB in FIG. 4A. In the flat plate 70, a hole 12 is provided at the bottom of one end of the lower groove 61a of the groove 61, and a hole 13 is provided at the bottom of the other end.

  Next, as shown in FIGS. 5A and 5B, the flat plate 70 is fitted into the upper groove 61 b of the groove 61 of the flat plate 60. Here, FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along line BB of FIG. 5A.

  Next, the boundary portion (the straight portion and the folded portion) between the flat plate 60 and the flat plate 70 shown in FIGS. 5A and 5B is joined by friction stir welding. In this way, a rectangular flat plate 80 provided with the lower groove 61 a of the groove 61 that becomes the flow path 11 between the flat plate 60 and the flat plate 70 is obtained.

  Next, the flat plate 80 is rounded into a cylindrical shape in the longitudinal direction so that the surface on which the friction stir welding is performed is on the outside, and one short side and the other short side of the rounded plate are Butt and join by friction stir welding. In this way, the cylindrical portion 10 containing the flow path 11 composed of the lower groove 61a of the groove 61 of the flat plate 60 is manufactured.

  Thereafter, the disks 20 and 30 and the rotating shaft 40 are fixed to both ends of the cylindrical portion 10.

  Thus, the target processing roller shown in FIG. 1 is manufactured.

  As described above, according to the first embodiment, the cylindrical portion 10 of the processing roller is made of copper, copper alloy, aluminum, or aluminum alloy having excellent thermal conductivity. 11, by flowing a fluid such as cooling water or hot water, the cylindrical portion 10 around which a target object such as a film for film formation or etching is wound can be quickly or efficiently cooled or heated. The problem of being deformed into a via barrel shape in a vacuum like the film forming roller shown in Non-Patent Document 1 does not occur. For this reason, for example, when a film is formed on a film by a roll-to-roll method in a film forming apparatus such as a sputtering apparatus, or on a film by a roll-to-roll method in a dry etching apparatus or a plasma processing apparatus. In the case of performing etching of the formed thin film or surface treatment with plasma, the film can be smoothly conveyed while maintaining the surface of the film flat. In addition, the cylindrical portion 10 made of copper, copper alloy, aluminum, or aluminum alloy having excellent thermal conductivity has good thermal responsiveness. Therefore, depending on the temperature or flow rate of a fluid such as cooling water or hot water flowing through the flow path 11, etc. The temperature can be controlled quickly and accurately. As a result, the temperature of the object wound around the cylindrical portion 10 can be quickly and accurately controlled, and various processes such as film formation, etching, and surface treatment by plasma can be performed. It can be done well.

<Second Embodiment>
[Sputtering equipment]
6 and 7 show a sputtering apparatus according to the second embodiment. Here, FIG. 6 is a schematic diagram of the inside of the vacuum container of this sputtering apparatus viewed from a direction parallel to the film forming roller, and FIG. 7 is a view of the inside of the vacuum container of this sputtering apparatus viewed from the direction perpendicular to the film forming roller. FIG.

As shown in FIGS. 6 and 7, in this sputtering apparatus, the inside of the vacuum vessel 90 is partitioned vertically by a partition plate 91. The space below the partition plate 91 inside the vacuum vessel 90 is the film forming chamber C ₁ , and the space above is the film transport chamber C ₂ . Inside the film forming chamber C _1, a film forming roller R _{1 including the} processing roller according to the first embodiment is horizontally installed. Both end portions of the rotary shaft 40 at both ends of the cylindrical portion 10 of the deposition roller R ₁ is deposition chamber C ₁ of the circular hole and the deposition chamber C ₁ provided on the support plate 92 and 93 fixed to both side walls Circular holes provided in both side walls are passed through and supported rotatably by these holes. For example, three sputtering cathodes K ₁ , K ₂ , K ₃ are installed on the inner wall of the film forming chamber C ₁ . Among these, the sputtering cathode K ₁ is installed at the bottom of the film forming chamber C ₁ via an insulating member 94 and is electrically insulated from the vacuum vessel 90. The sputtering cathodes K ₂ and K ₃ are respectively installed on the side walls facing each other in the film forming chamber C ₁ via insulating members 94. Around the cylindrical portion 10 of the film forming roller R ₁ , a film is formed on the film to limit the amount of sputtered particles generated from the sputtering cathodes K ₁ , K ₂ , and K ₃ and incident on the film. A shielding plate 95 is provided. On the other hand, unwinding / winding rollers R ₂ and R ₃ and transport rollers (or guide rollers) R ₄ , R ₅ , R ₆ and R ₇ are installed in the film transport chamber C ₂ . The axes of the rollers R ₂ and R ₃ for unwinding / winding (only the axis S ₃ of the roller R ₃ is shown in FIG. 7) are support plates 92 fixed to both side walls of the film forming chamber C _1. , 93 and circular holes provided on both side walls of the film forming chamber C ₁ are passed through and supported rotatably by these holes. Shaft of the conveying roller _{R 4, R 5, R 6} , R 7 ( illustrated only axial S _6, S ₇ of the transport roller R _6, R ₇ in Figure 7) is provided on the support plate 92 and 93 It is rotatably supported by a circular hole. Then, the film F is conveyed by the unwinding / winding roller R ₂ , the conveying rollers R ₄ , R ₅ , the film forming roller R ₁ , the conveying rollers R ₆ , R ₇ and the unwinding / winding roller R _3. It has come to be. The film F, by rotating the rollers R _2, the rotating shaft S _2, these rollers by the rotation mechanism not shown which is fixed to the S ₃ R ₂ of R _3, R _3, making it possible to transport ing. In this case, by rotating the rollers R ₂ and R ₃ counterclockwise in FIG. 6, the film F is unwound from the roller R ₂ , and the transport rollers R ₄ and R ₅ , the film forming roller R ₁ and the transport roller R _6, and conveyed via the R _7, it may take up the film F by a roller R _3. Conversely, by rotating the rollers R ₂ and R ₃ in the clockwise direction in FIG. 6, the film F is unwound from the roller R ₃ , and the transport rollers R ₇ and R ₆ , the film forming roller R ₁ and the transport roller R _5. , R _4, and the film F can be taken up by the roller R ₂ . That is, the film F can be conveyed in the opposite directions. Thereby, for example, first in FIG. 6 a roller R _2, R _3, while conveying the film F is rotated in the counterclockwise direction, after deposition on deposition rollers R _1, roller R _2, R ₃ in FIG. 6, while conveying by rotating clockwise the film F in the reverse direction, performs deposition on deposition rollers R _1, by repeating several times this, a thin film on the film F in the multi-layer Can be formed. If necessary, at least one of the transport rollers R _{4 to} R ₇ may be configured similarly to the processing roller according to the first embodiment and used as a cooling roller. In this way, it is possible to cool the cooling roller during transport before being wound the heated film F when performing film formation on the film formation roller R ₁ to the roller R ₂ or roller R _3, When the film F is wound around the roller R ₂ or the roller R ₃ while the temperature of the film F is high, the film F can be prevented from being scratched when the film F is rubbed against each other when shrinking. The partition plate 91 is provided with slit-shaped holes 91a and 91b for allowing the film F to pass therethrough.

Details of the sputtering cathodes K ₁ , K ₂ , and K ₃ will be described. These sputtering cathodes K ₁ , K ₂ , K ₃ may have the same configuration or different configurations. Here, as an example, it will be described sputtering cathodes K _1. As shown in FIG. 8, the sputtering cathode K ₁ has a rectangular tubular shape with a rectangular cross section, and is provided on the outside of the sputtering target 110 with the erosion surface facing inward. The permanent magnet 120 has a yoke 130 provided outside the permanent magnet 120. Further, a magnetic circuit is formed by the permanent magnet 120 and the yoke 130. The polarities of the permanent magnets 120 are as shown in FIG. 8, but there is no problem even if the polarities are completely opposite. A cooling backing plate is preferably provided between the sputtering target 110 and the permanent magnet 120, and cooling water, for example, is caused to flow through a flow path provided inside the backing plate. An anode 140 having an L-shaped cross section is provided in the vicinity of the lower end of the rectangular parallelepiped space surrounded by the sputtering target 110 so that the erosion surface of the sputtering target 110 is exposed. The anode 140 is generally connected to a vacuum vessel 90 that is grounded. In addition, a light shielding shield 150 having an L-shaped cross section is provided in the vicinity of the upper end of a rectangular parallelepiped space surrounded by the sputtering target 110 so that the erosion surface of the sputtering target 110 is exposed. The light shielding shield 150 is made of a conductor, typically a metal. The light shielding shield 150 also serves as an anode, and is generally connected to a grounded vacuum vessel 90 in the same manner as the anode 140.

  As shown in FIG. 9, when the distance between a pair of opposing long sides of the sputtering target 110 is a and the distance between a pair of opposing short sides of the sputtering target 110 is b, b / a Is selected to be 2 or more, and generally 40 or less. a is generally selected from 50 mm to 150 mm.

In this sputtering apparatus, film formation is performed while conveying the film F wound around the cylindrical portion 10 of the film formation roller R ₁ above the space surrounded by the sputtering target 110. At this time, the film F is conveyed with respect to the sputtering target 110 in the direction crossing the long side part of the sputtering target 110. The width of the film formation region of the film F in the direction parallel to the long side portion of the sputtering target 110 is selected to be smaller than b, so that the film F fits between a pair of short side portions facing each other inside the sputtering target 110. It has become. The width of the film formation region of the film F coincides with the width of the film F when film formation is performed on the entire surface of the film F.

[Film Forming Method Using Sputtering Apparatus]
Although it is possible to form a film using two or more of the sputtering cathodes K ₁ , K ₂ , and K ₃ , a case where film formation is performed using only the sputtering cathode K ₁ will be described here.

Water is circulated through the flow path 11 of the cylindrical portion 10 of the film forming roller R ₁ , and the temperature of the cylindrical portion 10 is set to a temperature at which film formation is performed on the film F. The water to be circulated through the flow path 11 contains ethylene glycol or the like as an antifreeze as necessary. An example of the control range of the temperature of the water circulated through the flow path 11 is −10 ° C. to 80 ° C.

After the vacuum vessel 90 is evacuated to a high vacuum by a vacuum pump, the Ar gas was introduced as the sputtering gas in a space surrounded by the sputtering target 110, between the anode 140 and sputtering cathode K _1, the plasma generated by the predetermined power source In general, a high DC voltage is applied. In general, the anode 140 is grounded, and a negative high voltage (for example, −400 V) is applied to the sputtering cathode K ₁ . As a result, as shown in FIGS. 10 and 11, plasma 160 that circulates along the inner surface of the sputtering target 110 is generated near the surface of the sputtering target 110.

  As a result of the sputtering target 110 being sputtered by Ar ions in the plasma 160 that circulates along the inner surface of the sputtering target 110, atoms constituting the sputtering target 110 jump out upward from the space surrounded by the sputtering target 110. At this time, atoms jump out of the erosion surface of the sputtering target 110 all over the portion near the plasma 160, but the atoms jumping out from the erosion surface of the short side inside the sputtering target 110 are basically used for film formation. do not use. For this purpose, by providing a horizontal shielding plate above the sputtering target 110 so as to shield both ends of the long side direction of the sputtering target 110, atoms that jump out from the erosion surface of the short side of the sputtering target 110 are formed. Sometimes it is sufficient not to reach the substrate S. Alternatively, the width b in the longitudinal direction of the sputtering target 110 is made sufficiently larger than the width of the film F so that atoms jumping out from the erosion surface of the short side of the sputtering target 110 do not reach the film F during film formation. Good. As a result of part of the atoms jumping out of the sputtering target 110 being blocked by the light shielding shield 150, sputtered particle bundles 170 and 180 as shown in FIG. 12 are obtained from the erosion surface of the long side portion of the sputtering target 10. The sputtered particle bundles 170 and 180 have a substantially uniform intensity distribution in the longitudinal direction of the sputtering target 110.

When stable sputtered particle bundles 170 and 180 are obtained, the rollers F ₂ and R ₃ for unwinding / rewinding the film F are rotated in the counterclockwise direction in FIG. Sputtered particle bundles from below on the film F wound around the film forming roller R ₁ while being transported at a constant speed via the transport rollers R ₄ and R ₅ , the film forming roller R ₁ and the transport rollers R ₆ and R _7. Film formation is performed by 170 and 180. At this time, the tension applied to the film F is controlled to be a constant value with 10 to 100 N as a guideline, for example.

[Examples of sputtering cathode and anode of sputtering apparatus]
As shown in FIG. 13, the sputtering target 110 is formed by four plate-like sputtering targets 110a, 110b, 110c, and 110d, and the permanent magnet 120 is formed by four plate-like or rod-like permanent magnets 120a, 120b, 120c, and 120d. The yoke 130 is formed by four plate-like yokes 130a, 130b, 130c, and 130d. Further, backing plates 190a, 190b, 190c, and 190d are inserted between the sputtering targets 110a, 110b, 110c, and 110d and the permanent magnets 120a, 120b, 120c, and 120d, respectively. The distance between the sputtering target 110a and the sputtering target 110c is 80 mm, the distance between the sputtering target 110b and the sputtering target 110d is 200 mm, and the height of the sputtering targets 110a, 110b, 110c, and 110d is 80 mm.

  Four plate-like anodes 200a, 200b, 200c, and 200d are provided outside the yokes 130a, 130b, 130c, and 130d. These anodes 200a, 200b, 200c, and 200d are connected to a grounded vacuum vessel 90 together with the anode 140.

According to the second embodiment, in addition to the same advantages as those of the first embodiment, the following advantages can be obtained. That is, the sputtering cathodes K ₁ , K ₂ , K ₃ have a rectangular tubular shape with a rectangular cross section, and have a sputtering target 110 whose erosion surface faces inward, so that the following various types are possible. Benefits can be gained. That is, plasma 160 that circulates around the inner surface of the sputtering target 110 can be generated on the erosion surface side of the sputtering target 110. For this reason, since the density of the plasma 160 can be increased, the deposition rate can be sufficiently increased. In addition, since the place where a lot of plasma 160 is generated is limited to the vicinity of the surface of the sputtering target 110, the film F is irradiated with light emitted from the plasma 160 in combination with the provision of the light shielding shield 150. Can minimize the risk of damage. In addition, since the lines of magnetic force generated by the magnetic circuit formed by the permanent magnet 120 and the yoke 130 are constrained by the sputtering cathode and do not go to the film F, there is no possibility that the film F is damaged by the plasma 160 or the electron beam. Further, since the film formation is performed using the sputtered particle bundles 170 and 180 obtained from the pair of long sides facing each other of the sputtering target 110, the film F is impacted by the high-energy particles of the reflective sputtering neutral gas and damaged. Can be minimized. Further, since the sputtered particle bundles 170 and 180 obtained from a pair of long sides facing each other of the sputtering target 110 have a uniform intensity distribution in a direction parallel to the long sides, the film F crosses the long sides. The film thickness variation of the thin film formed on the film F can be reduced in combination with the film formation while transporting at a constant speed in the direction to be performed, for example, the direction perpendicular to the long side portion. The thickness distribution can be made ± 5% or less. This sputtering apparatus is suitable for application to film formation of an electrode material in various devices such as a semiconductor device, a solar cell, a liquid crystal display, and an organic EL.

<Third Embodiment>
[Sputtering equipment]
The sputtering apparatus according to the third embodiment is different from the sputtering apparatus according to the second embodiment in that a sputtering target 110 as shown in FIG. 14 is used. That is, as shown in FIG. 14, the sputtering target 110 includes a pair of long side portions facing in parallel to each other and a semicircular portion connected to these long side portions. The permanent magnet 120 provided outside the sputtering target 110 and the yoke 130 provided outside the permanent magnet 120 have the same shape as the sputtering target 110. Other configurations of the sputtering apparatus are the same as those of the sputtering apparatus according to the second embodiment.

[Film Forming Method Using Sputtering Apparatus]
The film forming method using this sputtering apparatus is the same as in the second embodiment.

  Although the embodiments and examples of the present invention have been specifically described above, the present invention is not limited to the above-described embodiments and examples, and various modifications based on the technical idea of the present invention can be made. Is possible.

  For example, the numerical values, materials, structures, shapes, and the like given in the above-described embodiments and examples are merely examples, and different numerical values, materials, structures, shapes, and the like may be used as necessary.

In the sputtering apparatus according to the second and third embodiments, sputtering cathodes K ₁ , K ₂ , and K ₃ having different configurations from those described above may be used.

  DESCRIPTION OF SYMBOLS 10 ... Cylindrical part, 11 ... Channel, 11a ... Linear part, 11b ... Folded part, 20, 30 ... Disc, 40 ... Rotating shaft, 110, 110a, 110b, 110c, 110d ... Sputtering target, 120, 120a, 120b , 120c, 120d ... permanent magnet, 130, 130a, 130b, 130c, 130d ... yoke, 140 ... anode, 150 ... light shielding shield, 160 ... plasma, 170, 180 ... sputtered particle bundle

Claims (37)

A processing roller around which a workpiece to be processed in a roll-to-roll system is wound,
A processing roller having a cylindrical portion made of copper, copper alloy, aluminum, or aluminum alloy containing a flow path at least in an effective portion.   The processing roller according to claim 1, wherein the cylindrical portion is made of oxygen-free copper.   The coating layer made of a material having higher hardness than the copper, copper alloy, aluminum, or aluminum alloy constituting the cylindrical portion is formed on at least an outer peripheral surface of the cylindrical portion. Processing roller.   The flow path is a zigzag bent shape having a portion extending linearly in the circumferential direction of the cylindrical portion and a folded portion, or a portion extending in a direction parallel to the central axis of the cylindrical portion The processing roller according to any one of claims 1 to 3, wherein the processing roller has a zigzag shape that has a bent portion and a folded portion.   The cylindrical portion has a lower groove having the same planar shape as the flow path when the cylindrical portion is developed in a plane, a planar shape substantially similar to the lower groove, and an upper groove larger than the lower groove. A first flat plate having a rectangular or square planar shape that is the same as the planar shape when the cylindrical portion is developed on a plane, and the upper portion of the groove of the first flat plate. A flat plate having a rectangular or square planar shape in which a boundary portion between the first flat plate and the second flat plate is joined by friction stir welding, in a direction parallel to one side thereof. The processing roller according to claim 4, wherein the processing roller is formed by rounding into a cylindrical shape and joining one end and the other end of the rounded plate.   A support for supporting the second flat plate fitted in the upper groove of the groove of the first flat plate is provided inside the lower groove, and the flat plate is rounded into a cylindrical shape in this state. The processing roller according to claim 5.   The cylindrical portion is formed by rounding a flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is developed into a plane into a cylindrical shape in a direction parallel to one side of the cylindrical portion. After joining the ends, through holes reaching from one end face of the rounded plate to the other end face are parallel to the central axis of the rounded plate and at a plurality of equidistant intervals in the circumferential direction of the rounded plate The processing roller according to claim 1, wherein the processing roller is formed by forming the flow path.   Disks are respectively provided at both ends of the cylindrical part so as to close the cylindrical part, and these circular disks have through holes that communicate the inside and the outside of the cylindrical part. The processing roller according to claim 7.   A rotary shaft is attached to the outer side of each circular plate on the central axis of the cylindrical portion, and a first through-hole penetrating the rotary shaft and one of the circular plates is provided on the central axis of one rotary shaft. A second through-hole penetrating the rotary shaft and the other disk is provided on the central axis of the rotary shaft, and communicates with the first through-hole inside the cylindrical portion so that one end of the first pipe is airtight. And the other end of the first pipe has airtightness in a hole provided so as to communicate with the flow path at one end of the flow path contained in the cylindrical portion on the one disk side. And one end of the second pipe is fixed in an airtight manner in communication with the second through-hole inside the cylindrical portion, and the other end of the second pipe is connected to the flow in the cylindrical portion. Airtightness is provided in a hole provided to communicate with the flow path at the other end of the path on the other disc side. Processing roller according to claim 8, wherein the connected I.   A rotating shaft is attached to the outer side of each circular plate on the central axis of the cylindrical portion, a third through hole penetrating the rotating shaft is provided on the central axis of one rotating shaft, and the center of the other rotating shaft is provided. A fourth through hole penetrating the rotating shaft is provided on the shaft, a flow path communicating with the third through hole is provided inside the one disc, and the flow path is provided in the cylindrical portion. A flow path that communicates with one end of the flow path on the side of the one disk and communicates with the fourth through hole is provided inside the other disk, and this flow path includes the flow that the cylindrical portion incorporates. The processing roller according to claim 8, wherein the processing roller communicates with the other end portion on the other disk side of the path. A method of manufacturing a processing roller having a cylindrical portion made of copper, copper alloy, aluminum, or aluminum alloy containing a flow path around which a workpiece to be processed by a roll-to-roll method is wound, at least in an effective portion,
A groove composed of a lower groove having the same planar shape as the flow path when the cylindrical portion is developed in a plane and a planar shape substantially similar to the lower groove, and an upper groove larger than the lower groove is one of the grooves. A step of fitting a second flat plate into the upper groove of the groove of the first flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is flattened provided on the main surface;
Joining the boundary between the first flat plate and the second flat plate by friction stir welding;
A rectangular or square flat plate composed of the first flat plate and the second flat plate in which the boundary between the first flat plate and the second flat plate is joined by the friction stir welding in a direction parallel to one side thereof. Rounding into a cylindrical shape and joining one end and the other end of the rounded plate;
The manufacturing method of the processing roller characterized by having.   The method for manufacturing a processing roller according to claim 11, wherein the first flat plate and the second flat plate are made of oxygen-free copper.   The flow path is a zigzag bent shape having a portion extending linearly in the circumferential direction of the cylindrical portion and a folded portion, or a portion extending in a direction parallel to the central axis of the cylindrical portion The method for manufacturing a processing roller according to claim 11, wherein the processing roller has a shape that is bent in a zigzag shape and has a folded portion.   A support for supporting the second flat plate fitted in the upper groove of the groove of the first flat plate is provided inside the lower groove, and the flat plate is rounded into a cylindrical shape in this state. The manufacturing method of the processing roller as described in any one of Claims 11-13. A method of manufacturing a processing roller having a cylindrical portion made of copper, copper alloy, aluminum, or aluminum alloy containing a flow path around which a workpiece to be processed by a roll-to-roll method is wound, at least in an effective portion,
A flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is developed in a plane is rounded into a cylindrical shape in a direction parallel to one side, and one end and the other end of the rounded plate are joined. Process,
The flow path is formed by forming through holes reaching from one end face of the rounded plate to the other end face in parallel to the central axis of the rounded plate and at equal intervals in the circumferential direction of the rounded plate. Forming a step;
The manufacturing method of the processing roller characterized by having.   The method for manufacturing a processing roller according to claim 15, wherein the flat plate is made of oxygen-free copper. A processing apparatus having a processing roller around which a workpiece to be processed in a roll-to-roll system is wound,
The processing apparatus, wherein the processing roller has a cylindrical portion made of copper, a copper alloy, aluminum, or an aluminum alloy with a built-in flow path at least as an effective portion.   The processing apparatus according to claim 17, wherein the cylindrical portion is made of oxygen-free copper.   The cylindrical portion has a lower groove having the same planar shape as the flow path when the cylindrical portion is developed in a plane, a planar shape substantially similar to the lower groove, and an upper groove larger than the lower groove. A first flat plate having a rectangular or square planar shape that is the same as the planar shape when the cylindrical portion is developed on a plane, and the upper portion of the groove of the first flat plate. A flat plate having a rectangular or square planar shape in which a boundary portion between the first flat plate and the second flat plate is joined by friction stir welding, in a direction parallel to one side thereof. The processing apparatus according to claim 17 or 18, wherein the processing apparatus is formed by rounding into a cylindrical shape and joining one end and the other end of the rounded plate.   A support for supporting the second flat plate fitted in the upper groove of the groove of the first flat plate is provided inside the lower groove, and the flat plate is rounded into a cylindrical shape in this state. The processing apparatus according to claim 19.   The cylindrical portion is formed by rounding a flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is developed into a plane into a cylindrical shape in a direction parallel to one side of the cylindrical portion. After joining the ends, through holes reaching from one end face of the rounded plate to the other end face are parallel to the central axis of the rounded plate and at a plurality of equidistant intervals in the circumferential direction of the rounded plate The processing apparatus according to claim 17 or 18, wherein the flow path is formed by forming the flow path.   The processing apparatus further includes a plurality of transport rollers, and at least one of the plurality of transport rollers has at least an effective portion having a cylindrical portion made of copper, copper alloy, aluminum, or aluminum alloy containing a flow path. The processing apparatus according to any one of claims 17 to 21, wherein the processing apparatus is characterized.   The processing apparatus according to claim 22, wherein the cylindrical portion of the transport roller is made of oxygen-free copper.   The processing apparatus is a film forming apparatus, the processing roller is a film forming roller installed in a film forming chamber of the film forming apparatus, and the object to be processed is a film forming object. The processing apparatus as described in any one of 17-23.   In the case where the film forming apparatus is a sputtering apparatus, a sputtering cathode having a sputtering target having a tubular shape having a pair of long sides facing each other and having an erosion surface facing inward is formed. The processing apparatus according to claim 24, wherein the processing apparatus is provided in a membrane chamber.   The cross-sectional shape of the sputtering target has a pair of short sides perpendicular to the pair of long sides that are parallel to each other, or a pair of curved portions that are convex toward each other. Item 26. The processing apparatus according to Item 25.   27. The processing apparatus according to claim 25 or 26, wherein a distance between the pair of long side portions of the sputtering target is 50 mm or more and 150 mm or less.   The processing apparatus according to any one of claims 25 to 27, wherein a ratio of a length of the long side portion to a distance between the pair of long side portions of the sputtering target is 2 or more.   The sputtering target includes a first flat plate and a second flat plate constituting the pair of long side portions, and a third flat plate and a fourth flat plate constituting a pair of short side portions facing each other perpendicular to the long side portion. 29. The processing apparatus according to any one of claims 25 to 28, wherein:   30. The processing apparatus according to claim 25, further comprising an anode provided so that an erosion surface of the sputtering target is exposed.   The film formation target having a film formation region having a width smaller than the long side part of the sputtering target is wound around the cylindrical part of the film formation roller above the space surrounded by the sputtering target, On the other hand, while transporting in the direction crossing the long side part of the sputtering target, the discharge is performed so as to generate plasma that circulates along the inner surface of the sputtering target, and the ions in the plasma generated by the sputtering gas generate the plasma. 31. The processing apparatus according to claim 25, wherein a film is formed in the film formation region of the film formation target by sputtering an inner surface of the long side portion of the sputtering target.   A backing plate having a cylindrical portion made of copper, copper alloy, aluminum or aluminum alloy containing a flow path.   The backing plate according to claim 32, wherein the cylindrical portion is made of oxygen-free copper. A method of manufacturing a backing plate having a cylindrical portion made of copper, copper alloy, aluminum or aluminum alloy containing a flow path,
A groove composed of a lower groove having the same planar shape as the flow path when the cylindrical portion is developed in a plane and a planar shape substantially similar to the lower groove, and an upper groove larger than the lower groove is one of the grooves. A step of fitting a second flat plate into the upper groove of the groove of the first flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is flattened provided on the main surface;
Joining the boundary between the first flat plate and the second flat plate by friction stir welding;
A rectangular or square flat plate composed of the first flat plate and the second flat plate in which the boundary between the first flat plate and the second flat plate is joined by the friction stir welding in a direction parallel to one side thereof. Rounding into a cylindrical shape and joining one end and the other end of the rounded plate;
The manufacturing method of the backing plate characterized by having.   The method for manufacturing a backing plate according to claim 34, wherein the first flat plate and the second flat plate are made of oxygen-free copper. A method of manufacturing a backing plate having a cylindrical portion made of copper, copper alloy, aluminum or aluminum alloy containing a flow path,
A flat plate having the same rectangular or square planar shape as the planar shape when the cylindrical portion is developed in a plane is rounded into a cylindrical shape in a direction parallel to one side, and one end and the other end of the rounded plate are joined. Process,
The flow path is formed by forming through holes reaching from one end face of the rounded plate to the other end face in parallel to the central axis of the rounded plate and at equal intervals in the circumferential direction of the rounded plate. Forming a step;
The manufacturing method of the backing plate characterized by having.   The method for manufacturing a backing plate according to claim 36, wherein the flat plate is made of oxygen-free copper.

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