JP2018025430A - Measurement result notification device, measurement system, and measurement result notification method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the failure degree of each conductor path in each substrate to be inspected to be reliably and easily grasped.SOLUTION: When visually notifying of the measurement result specifiably for each conductor pattern of the failure degree of each conductor pattern in N substrates to be inspected, on the basis of measured values that are measured by measurement processing carried out on a plurality of substrates to be inspected of the same kind in which a plurality of conductor patterns (conductor paths) are provided, a "previously stipulated value" by which the failure degree is specifiable is computed for each conductor pattern on the basis of each measured value, and "one of previously stipulated hue, brightness and saturation" of each pattern image Gl arranged in accordance with the position of each conductor pattern in the substrate to be inspected is changed in correspondence to the "previously stipulated value," whereby the data of image G4 for notification is generated, and the magnitude of the "previously stipulated value" for each conductor pattern is notified on the basis of an image G1a of the substrate to be inspected of the generated data.SELECTED DRAWING: Figure 6

Description

  The present invention is configured to include a measurement result notification device, a measurement result notification method, and such a measurement result notification device that visually notify measurement results of a plurality of conductor paths provided on a substrate to be inspected. It relates to a measurement system.

  For example, the following patent document discloses an invention of an in-circuit tester (a method for outputting and displaying defective data using an in-circuit tester) configured to execute inspection on a substrate to be inspected and display or print the inspection result. ing.

  In this in-circuit tester, first, probe pins are probed to a plurality of measurement points defined on a substrate to be inspected, and each measurement point (measurement points defined for the purpose of inspection: Measurement data is obtained by executing the measurement process for “. Next, by comparing the value of the reference data absorbed from the corresponding part of the non-defective substrate (hereinafter also referred to as “reference value”) and the value of the above measurement data (hereinafter also referred to as “measurement value”), Inspect the quality of the inspection location. In this case, in this in-circuit tester, an allowable range for the satisfaction rate of the measured value with respect to the reference value is set for each inspection point (each measurement step), and the satisfaction rate is within the allowable range in parallel with the measurement process. When it is determined whether or not there is a satisfaction rate that is outside the allowable range, a configuration is adopted in which the inspection data is additionally recorded as a defect in the inspection location.

  In this in-circuit tester, the “measurement step number display field” indicating the number of steps of the measurement process, the “pin number display field” indicating the probe pin number used in the measurement process, and the “measurement value display field” indicating the measurement value ”,“ Satisfaction rate display field ”indicating the satisfaction rate,“ Tolerance range display field ”indicating the specified tolerance, and“ Disparity display field ”indicating the difference between the measured value and the reference value (difference between both values) A configuration is adopted in which a list provided for each inspection location (each measurement step) is displayed or printed based on the above-described inspection data so as to notify the inspection result of the substrate to be inspected. Thereby, in this in-circuit tester, it becomes possible to identify which inspection location (which measurement step) is defective by referring to the numerical values in the displayed or printed list. Yes.

JP-A-3-197880 (page 2-4, Fig. 1-3)

  However, the in-circuit tester disclosed in the above patent document has the following problems to be solved. In other words, in the above-mentioned in-circuit tester, inspection points (measurement steps) where the satisfaction rate of measured values with respect to the reference value is outside the allowable range are determined as defective, and inspection data is generated, and a list based on the inspection data is displayed. Or the structure which alert | reports the test result about a to-be-inspected board | substrate by printing is employ | adopted.

  In this case, each of the inspection points that are inspected as defective by the inspection by the in-circuit tester has a filling rate that is not a constant value but various values that fall below the allowable range. In addition, due to changes in the manufacturing conditions (manufacturing environment) of the substrate to be inspected, the inspection point where the defect occurs (the inspection point where the sufficiency rate is measured below the allowable range) changes or the degree of the defect (The value of the sufficiency rate) changes. For this reason, in the inspection using this type of apparatus, not only the individual inspection results for each substrate to be inspected, but also the degree of defect for each inspection location (which inspection is to be performed) on a plurality of substrates to be inspected. It is necessary to identify and analyze how many defects are occurring at the location.

  However, in the above-described in-circuit tester, measured values for a plurality of substrates to be inspected in which there are inspection locations inspected as defective are displayed numerically in a list. For this reason, for inspection locations where the number of inspected substrates that are inspected for defects is small, the number of times that the satisfaction rate is recorded in the list is small, so there is a possibility that the degree of failure at that inspection location can be easily grasped. Although there are many inspection locations where there are many substrates to be inspected that are defective, the filling rate is recorded many times in the list, so it is very long to grasp the degree of defects at the inspection locations. It will take time.

  In this case, if you are unfamiliar with the inspection using this type of equipment, even if it takes a long time when there are many inspection locations that are inspected as defective, Refer to the list that contains a number of "rows" consisting of "number display column", "measurement value display column", "satisfaction rate display column", "acceptable range display column" and "difference display column" in succession. It is very difficult to grasp the degree of defect at each inspection location.

  Furthermore, in the above-mentioned in-circuit tester, by referring to the above list, the degree of failure at each inspection point (conductor pattern, via, etc .: hereinafter also referred to as “conductor path”) on a plurality of substrates to be inspected. Even if it was possible to identify the conductor path, it was inspected to determine which position on the board to be inspected was the conductor path whose degree of failure was determined (measurement process) It is necessary to refer to another drawing or the like showing the correspondence relationship between the conductor path and the number of measurement steps for each inspection point. For this reason, especially for those unaccustomed to inspection using this type of apparatus, the degree of failure of any conductor path provided at any position on the substrate to be inspected is large, and the degree of failure of any conductor path It is very difficult to determine whether the is small.

  The present invention has been made in view of the problems to be solved, and it is possible to reliably and easily determine which of the conductor paths in each inspected substrate has a large degree of defect and which of the conductor paths has a small degree of defect. It is a main object to provide a measurement result notification device, a measurement system, and a measurement result notification method that can be grasped.

  In order to achieve the above object, the measurement result notification device according to claim 1 is provided for each of the substrates to be inspected measured by a measurement process for a plurality of the same type of substrates to be inspected provided with a plurality of conductor paths. Based on the measured values for each of the conductor paths, the measurement results can be specified for each of the conductor paths for each of the N conductors (N is a natural number greater than or equal to 2). A measurement result notification device provided with a processing unit for visually informing the measurement result, wherein the processing unit is preliminarily defined to be able to specify the degree of the defect based on the measured values for the N substrates to be inspected. The calculated value is calculated for each conductor path, and a plurality of conductor path images indicating the conductor paths are arranged in accordance with the positions of the conductor paths on the inspected boards. The substrate image data is used to The notification image data is generated by changing one of the hue, brightness, and saturation of each conductor path image in the inspection board image corresponding to the predetermined value. Based on the image data for notification, the size of the predetermined value for each conductor path is notified.

  The measurement result notifying device according to claim 2 is the measurement result notifying device according to claim 1, wherein the processing unit includes a variance value of the measurement values for each of the conductor paths in the N test substrates, and the N pieces. The standard deviation value of the measured value for each of the conductor paths in the substrate to be inspected, the coefficient of variation of the measured value for each of the conductor paths in the N substrates to be inspected, and the conductor path in the N substrates to be inspected Error rate of the measured value, standard score of the measured value for each of the conductor paths in the N test substrates, average value of the measured values for the conductor paths in the N test substrates, N One of the process capability index for each of the conductor paths in the one board to be inspected and the ratio of the board to be inspected in which the measurement value satisfying a predetermined condition among the N boards to be inspected is measured. As the pre-defined value Wherein generating the broadcast image data.

  The measurement result notifying device according to claim 3 is the measurement result notifying device according to claim 1 or 2, wherein the processing unit displays a color bar that can specify the size of the predetermined value. To draw the image data for notification.

  According to a fourth aspect of the present invention, there is provided a measurement system according to any one of the first to third aspects, and the measurement results obtained by executing the measurement process for the respective conductor paths in each of the substrates to be inspected. And a measuring device to be configured.

  The measurement result notifying method according to claim 5 is a method for measuring each of the conductor paths for each of the inspected boards measured by a measurement process for a plurality of inspected boards of the same type provided with a plurality of conductor paths. Based on the measurement value, the measurement result visually notifies the measurement result in such a manner that the degree of failure of each conductor path in the N substrates (N is a natural number of 2 or more) can be specified for each conductor path. In the result notification method, based on the measured values for the N substrates to be inspected, a predetermined value that can specify the degree of the defect is calculated for each conductor path, and Each of the conductor paths in the inspected board image using board image data of the inspected board image in which a plurality of conductor path images indicating the respective conductor paths are arranged according to the position of each of the conductor paths in the inspected board Image hue, brightness and The notification image data is generated by changing a predetermined one of the degrees corresponding to the predetermined value, and based on the generated notification image data, for each conductor path Announces the size of the value defined in advance.

  In the measurement result notification device according to claim 1 and the measurement result notification method according to claim 5, each of the predetermined values that can specify the degree of failure is determined on the basis of each measurement value for N substrates to be inspected. Inspected using the substrate image data of the inspected board image in which a plurality of conductor path images indicating each conductor path are arranged according to the position of each conductor path in each inspected board, while calculating for each conductor path Notification image data is generated by changing a predetermined one of the hue, brightness, and saturation of each conductor path image in the board image to correspond to a predetermined value, and the generated notification image Based on the data, the size of a predetermined value for each conductor path is visually notified. According to a fourth aspect of the present invention, there is provided a measurement system comprising: the above-described measurement result notification device; and a measurement device that executes a measurement process for each conductor path in each board to be inspected to obtain each measurement value. Yes.

  Therefore, according to the measurement result notifying device according to claim 1, the measurement system according to claim 4, and the measurement result notifying method according to claim 5, the measured value or the like for each conductor path in a plurality of substrates to be inspected is obtained. Unlike the measurement results (inspection results) displayed and printed in a list format, each inspected substrate is referred to by referring to the inspected substrate image of the displayed or printed notification image (image of notification image data). It is possible to intuitively grasp the position of the conductor path formed at which position is large and the position of the conductor path formed at which position is small, and each conductor path image The magnitude of “predetermined value” indicating the degree of failure of each conductor path can be intuitively grasped by the difference of “predetermined one of hue, brightness, and saturation”. Thereby, even a person unfamiliar with the inspection using this type of apparatus can easily identify the cause of a defect occurring in each “conductor path” in a plurality of substrates to be inspected.

  According to the measurement result notifying device and the measurement result notifying method according to claim 2, and the measurement system including such a measurement result notifying device, the dispersion value of the measured value for each conductor path in the N test substrates, Standard deviation value of measured value for each conductor path on N test boards, coefficient of variation of measured value for each conductor path on N test boards, error of measured value for each conductor path on N test boards Rate, standard score of measured values for each conductor path on N test boards, average value of measured values for each conductor path on N test boards, process capability index for each conductor path on N test boards , And N of the N substrates to be inspected are calculated as a predetermined value by calculating any one of the ratios of the substrates to be inspected in which the measurement values satisfying the predetermined conditions are generated. Due to the degree of failure of each conductor track It is possible to accurately grasp.

  According to the measurement result notifying apparatus and the measurement result notifying method according to claim 3, and the measurement system including such a measurement result notifying apparatus, a color bar that can specify the size of a predetermined value is inspected. By generating the image data for notification by drawing along with the board image, it is possible to further determine the degree of the defect of each conductor path (the degree of the “predetermined value”). It can be easily grasped.

It is a block diagram which shows the structure of the board | substrate inspection system 100 (the measuring apparatus 1 and the data processing apparatus 2). It is explanatory drawing for demonstrating an example of to-be-inspected board | substrate X (conductor pattern L1, L2, ... and via | veer V1, V2, ...). FIG. 3 is an explanatory diagram for explaining an example of an inspected substrate image G1 (pattern images Gl1, Gl2,...) For the inspected substrate X shown in FIG. It is explanatory drawing for demonstrating an example of the to-be-inspected board | substrate image G1. It is explanatory drawing for demonstrating an example of the to-be-inspected board | substrate image G2. It is explanatory drawing for demonstrating an example of the image G4 (Inspected substrate image G1a and color bar G3) which alert | reports a test result. It is explanatory drawing for demonstrating an example of the image G4 (Inspected board | substrate image G2a and color bar G3) which alert | reports a test result.

  Hereinafter, embodiments of a measurement result notification device, a measurement system, and a measurement result notification method according to the present invention will be described with reference to the accompanying drawings.

  A substrate inspection system 100 shown in FIG. 1 is an example of a “measurement system”, and includes a measurement device 1 and a data processing device 2, and based on the measurement results of a plurality of substrates X to be inspected by the measurement device 1, data In the processing apparatus 2, a configuration is used in which the degree of failure for each “conductor path” in each inspected substrate X is informed in a identifiable manner. In this case, the inspected substrate X is an example of the “inspected substrate”, and as shown in FIG. 2, the conductor patterns L1, L2,... And vias V1, V2,. A plurality of “conductor paths” including “L” and “via V”) are provided.

  The measuring device 1 is an example of a “measuring device” and includes a measuring jig 11, a scanner 12, a measuring unit 13, a storage unit 14, and a processing unit 15 as shown in FIG. The measurement process for the substrate X (an example of “measurement process for a plurality of substrates of the same type”) can be sequentially executed. The measurement jig 11 is provided with a plurality of probing points Pa, Pb... (See FIG. 2; hereinafter referred to as “probing when not distinguished from each other” defined for measurement processing for each conductor pattern L and via V on the substrate X to be inspected. A plurality of measurement probes 11a are provided so as to be probing with respect to the point P).

  The scanner 12 connects an arbitrary measurement probe 11 a in the measurement jig 11 to the measurement unit 13 under the control of the processing unit 15. Under the control of the processing unit 15, the measurement unit 13 uses an electrical parameter (“measurement value”: as an example) between arbitrary probing points P and P of the inspected substrate X via the measurement probe 11 a connected by the scanner 12. , Resistance value). The storage unit 14 temporarily stores measurement procedure data Da in which a measurement procedure (inspection procedure) for the substrate X to be inspected is recorded, a calculation result of the processing unit 15, and the like.

  The processing unit 15 controls the measuring apparatus 1 overall. Specifically, the processing unit 15 controls the scanner 12 according to the measurement procedure data Da to connect an arbitrary measurement probe 11a to the measurement unit 13, and also controls the measurement unit 13 to execute a resistance value measurement process. Let Further, the processing unit 15 records the measurement value output from the measurement unit 13 to generate the measurement value data D1 (an example of “measurement value data”), and the generated measurement value data D1 to the data processing device 2. Output.

  In this example, as an example, 20 pieces of measured value data D1, D1,... ("For each substrate to be inspected" generated by the measurement processing for N = 20 substrates X, X,. It is assumed that the measurement result is notified in the data processing device 2 so that the degree of failure for each “conductor path” can be specified using an example of data in which “measured values for each conductor path” are recorded).

  On the other hand, the data processing device 2 corresponds to a “measurement result notification device”, and as an example, includes a general-purpose personal computer in which a data processing program is installed. Specifically, the data processing apparatus 2 includes an operation unit 21, a display unit 22, a printing unit 23, a storage unit 24, and a processing unit 25. The operation unit 21 includes a pointing device such as a mouse and a touch pad, a keyboard, and the like, and outputs an operation signal corresponding to an operation by the user to the processing unit 25. The display unit 22 displays a measurement result display screen and the like as described later under the control of the processing unit 25. The printing unit 23 prints a measurement result, which will be described later, under the control of the processing unit 25.

  The storage unit 24 stores the above-described data processing program, measurement value data D1, D1,... Sequentially output from the measurement apparatus 1, reference value data D0, substrate image data D2, color bar image data D3, and notification. For example, image data D4 is stored. In this case, as the reference value data D0, a reference value defined in advance for each conductor pattern L or via V (each conductor path) in the inspected substrate X is recorded. For example, the reference value data D0 is generated in an external device based on the design data of the substrate X to be inspected, and is stored in the storage unit 24 of the data processing device 2.

  The substrate image data D2 is an example of “substrate image data”, and the pattern images Gl1, Gl2,... (Hereinafter referred to as “pattern image Gl when not distinguished from each other) according to the position of each conductor pattern L on the inspected substrate X. ”) (See FIG. 3 and 4: an example of“ inspected substrate image in which a plurality of conductor path images showing each conductor path ”are arranged), or in the inspected board X. Inspected substrate image G2 in which via images Gv, Gv,... Are arranged according to the position of each via V (see FIG. 5: “Inspected substrate image in which a plurality of conductor path images showing each conductor path are arranged”) It is composed of image data such as another example.

  Specifically, the board image G1 to be inspected is, for example, the conductor patterns L1 to L4 shown in FIG. 2 among the conductor patterns L on the board X to be inspected, as shown in FIG. The pattern images G11 to G14 are drawn accordingly. In addition, in the inspected substrate image G2, via images Gv and Gv are drawn according to the diameter and position of each via V in the inspected substrate X. The substrate image data D2 of the inspected substrate images G1 and G2 is generated in an external device based on the design data of the inspected substrate X, for example, and stored in the storage unit 24 of the data processing device 2.

  As will be described later, the color bar image data D3 is a color bar G3 that can specify the brightness range defined for each pattern image Gl in the inspected substrate image G1 and each via image Gv in the inspected substrate image G2. (See FIGS. 6 and 7). The relationship between the color bar G3 of the color bar image data D3 and the brightness of each pattern image Gl or each via image Gv will be described in detail later. The notification image data D4 is an example of “notification image data”, and is generated by data processing executed by the processing unit 25 as described later.

  The processing unit 25 generally controls the data processing device 2. The processing unit 25 is an example of a “processing unit”, and is based on the reference value data D0, D0,..., The measured value data D1, D1,. The notification image data D4 is generated, and using the generated notification image data D4, the degree of failure for each “conductor path” such as each conductor pattern L and each via V in the inspected substrate X (measurement result: inspection result) ) On the display unit 22 or printable on the printing unit 23 (an example of a process of “notifying visually”). The notification process of the measurement result by the processing unit 25 will be described in detail later with a specific example.

  In the measurement processing for a plurality of substrates X to be inspected by the substrate inspection system 100 and the notification of the measurement results for those substrates X, the first substrate X to be inspected is first set in the measuring apparatus 1. Then, the resistance value measurement process for the “conductor path” such as each conductor pattern L and each via V is executed. As a result, the measurement value data D1 in which the resistance value for each “conductor path (each conductor pattern L or each via V)” in the first substrate to be inspected X is recorded is generated and stored in the storage unit 14. . In the actual measuring apparatus 1, the substrate X to be inspected is held by a substrate holding unit (not shown), the measurement jig 11 is moved by a moving mechanism (not shown) (probing each measurement probe 11a with respect to each probing point P), and the like. However, since these operations are publicly known, detailed description thereof is omitted.

  Next, in place of the first board to be inspected X, the second board to be inspected X is set in the measuring apparatus 1 and the resistance value measurement processing for each conductor pattern L, each via V, and the like is measured. Is executed. As a result, measurement value data D1 in which measurement values for each “conductor path” in the second inspected substrate X are recorded is generated and stored in the storage unit 14. Thereafter, in the same manner as the measurement process for the second inspected substrate X, the measurement processes for the third and subsequent inspected substrates X are sequentially executed. Thus, when the measurement processing for N = 20 inspected substrates X, X,... Is completed, the resistance value for each “conductor path” of 20 inspected substrates X, X,. 20 measured value data D1, D1,... Are stored in the storage unit 14.

  Next, the measured value data D1, D1,... Generated in the measuring device 1 are transferred to the data processing device 2. The transfer processing of the measurement value data D1 is not limited to this time point when the measurement processing for the 20 inspected substrates X, X,... Is completed, and the measurement processing for one inspection substrate X is performed. Each time it is completed, the measurement value data D1 for the substrate X to be inspected can be transferred.

  On the other hand, in the data processing device 2, the processing unit 25 stores the measured value data D1 transferred (transmitted) from the measuring device 1 in the storage unit 24, and the 20 test substrates X, X,. Are stored in the storage unit 24, the inspection result (measurement result) notification process is started. Specifically, the processing unit 25 first reads the reference value data D0 and the 20 measurement value data D1, D1,... From the storage unit 24, and each of the “conductors” of the 20 substrates to be inspected X, X A “predetermined value (hereinafter also referred to as“ specific value ”)” that can specify the degree of failure of the “road” is calculated.

  In this case, in the data processing apparatus 2 (substrate inspection system 100) of this example, the processing unit 25, for example, “measured value” for each “conductor path” in N = 20 substrates X, X,. , “Standard deviation value” of “measured value” for each “conductor path” in N = 20 substrates X, X,..., N = 20 substrates X, X,. "Coefficient of variation" of "measured value" for each "conductor path" in N, "error rate (difference rate)" of "measured value" for each "conductor path" in N = 20 substrates X, X ... N = “standard score” of “measured value” for each “conductor path” in 20 inspected boards X, X,..., N = for each “conductor path” in 20 inspected boards X, X,. The “average value” of “measured values”, “process capability index” for each “conductor path” of N = 20 test substrates X, X..., And N = 20 Each “conductor path” is defined as “specific value (predetermined value)” as “a ratio of the inspected substrate X in which a measurement value satisfying a preliminarily defined condition” is measured among the inspection substrates X, X. Calculate each time.

  Further, the processing unit 25 calculates “Z score”, “z score”, and “T score” as the “standard score” for each “conductor path”. Further, the processing unit 25 is recorded in the reference value data D0 as the above-mentioned “ratio of the inspected substrates X on which the measurement values satisfying the predefined conditions are measured (hereinafter also simply referred to as“ ratio ”)”. The resistance value within the “resistance value range determined to be good (hereinafter also referred to as“ allowable range ”)” defined based on the “reference value” for each “conductor path” (“predetermined condition is An example of the “measurable measurement value”) is the ratio of the inspected substrate X (hereinafter also referred to as “good determination ratio”), and the resistance value that deviates from the above “allowable range” (measurement that satisfies a “predetermined condition”). (Another example of “value”) is the ratio of the inspected substrate X (hereinafter also referred to as “defect determination ratio”) measured, and the resistance value that deviates from the “allowable range”, and the measurement probe 11a with respect to the probing point P Caused by poor contact or broken conductor tracks The ratio of the inspected substrate X in which the resistance value of such a high resistance is measured (the ratio of the inspected substrate X in which the defect code specified by the processing unit 25 at the time of the defect determination is a code satisfying the above-described condition occurs. : Hereinafter referred to as “specific defect code occurrence ratio”) for each “conductor path”.

  In addition, “variance value”, “standard deviation value”, “variation coefficient”, “error rate (difference rate)”, “standard score (“ Z score ”,“ z score ”and“ T score ”)”, “average” "Value", "Process capability index" and "Ratio (" Good judgment ratio "," Defect judgment ratio "and" Specific defect code occurrence ratio ")" are all calculated as "Specific values (predetermined values)" In place of the configuration / method, one or more of these values and various values including any value other than these values are calculated as “specific values (predefined values)”. The method can also be adopted. In addition, since the concrete calculation method of each value of said illustration is well-known, detailed description is abbreviate | omitted.

  Next, the processing unit 25 obtains the brightness of each pattern image Gl and each via image Gv in the board image G1 and G2 of the board image data D2 (“one of the hue, brightness, and saturation defined in advance”). An example of the process of “brightness”) is changed in correspondence with the calculated “specific value”. In the following description, an example in which the “good determination ratio” as the “specific value” is notified will be described.

  Specifically, the processing unit 25 determines that the conductor pattern L (20 test substrates X, X,... Is good) with respect to the above-described “good determination ratio” with respect to the test substrate image G1 shown in FIG. The pattern image Gl of the conductor pattern L) having a larger number of substrates X to be inspected is defined to have lower brightness, and the conductor pattern L having a lower “good judgment ratio” (20 substrates to be inspected X, X,. By defining the lightness of the pattern image Gl of the conductor pattern L) having a smaller number of determined substrates X to be inspected, as shown in FIG. 6, the grayscale image is redrawn as the inspected substrate image G1a. Thereby, the board image data D2 in which the brightness of each pattern image Gl differs depending on the degree of defect of the corresponding conductor pattern L (in this example, “good determination ratio”) is generated.

  Further, the processing section 25 relates to the inspected substrate image G2 shown in FIG. 5 and the via V (the inspected substrate determined to be good in the 20 inspected substrates X, X,. The via image Gv of the via V having a larger number of X is defined to have a lower brightness, and the via V having a lower “good determination ratio” (the inspected substrate determined to be good in the 20 inspected substrates X, X... The via image Gv of the conductor pattern L) having a smaller number of X is defined to have higher brightness and each via image Gv is redrawn.

  In this case, in the data processing apparatus 2 (substrate inspection system 100) of this example, in order to facilitate the visual recognition of the via image Gv indicating the small-diameter via V, each via image Gv is concurrently with the change in the brightness described above. A configuration for enlarging and drawing is employed. Specifically, as an example, each via image Gv in the inspected substrate image G2 shown in FIG. 5 is enlarged at a predetermined magnification within a range of, for example, 2 to 10 times without changing the center of each. Expanding. Accordingly, as an example, a grayscale inspected substrate image G2a as shown in FIG. 7 is drawn, and the brightness of each via image Gv indicates the degree of quality of the corresponding via V (in this example, “good judgment ratio”). ”), Different board image data D2 is generated.

  Subsequently, as illustrated in FIG. 6, the processing unit 25 obtains the above-described inspected substrate image G1a in which the brightness of each pattern image Gl is changed, and the color bar G3 of the color bar image data D3 read from the storage unit 24. Draw side by side. Thereby, the notification image data D4 of the notification image G4 indicating the measurement result (degree of defect) for each conductor pattern L in the 20 test substrates X, X,... Is generated. Further, as illustrated in FIG. 7, the processing unit 25 draws the above-described inspected substrate image G2a and the color bar G3, in which the brightness of each via image Gv is changed, side by side. Thereby, the notification image data D4 of the notification image G4 indicating the measurement result (degree of defect) for each via V in the 20 test substrates X, X... Is generated.

  In this case, the color bar G3 of the color bar image data D3 is an example of a “color bar”, and a range of “good determination ratio” (0% to 100%) for each “conductor path” of the board X to be inspected. ) And the range of lightness defined in each pattern image Gl and each via image Gv (in this example, a range from white to black) can be specified. Specifically, in the color bar G3 of this example, the higher the “good determination ratio”, the lower the lightness (lightness closer to black) is associated, and the lower the “good determination ratio”, the higher lightness (closer to white). It is configured to be able to specify that the (lightness) is associated. That is, the lightness gradually decreases as the “good determination ratio” is high, and the lightness gradually increases as the “good determination ratio” is low.

  Next, the processing unit 25 causes the display unit 22 to display the notification image G4 (inspected substrate image G1a and color bar G3) based on the generated notification image data D4 as shown in FIG. As a result, the measurement results for each conductor pattern L on the 20 test substrates X, X... (Degree of defect: in this example, the magnitude of the value of the “good judgment ratio” of the conductor pattern L) are shown. The inspection board image G1a is displayed side by side with the color bar G3 (an example of a process of “notifying the measurement result visually”).

  The notification image G4 (inspected substrate image G1a) corresponds to the “good determination ratio” for each conductor pattern L calculated based on the reference value data D0 and the measured value data D1, D1,. The brightness of the pattern image Gl is made different. In the notification image G4 (inspected substrate image G1a), the pattern image Gl of each conductor pattern L is drawn corresponding to the position of the actual conductor pattern L on the inspected substrate X. Therefore, by referring to the inspected substrate image G1a displayed on the display unit 22 together with the color bar G3, it is possible to intuitively grasp the degree of defect of the conductor pattern L formed on each part of the inspected substrate X. .

  Instead of displaying on the display unit 22, the notification image data D4 is output to the printing unit 23 so that the notification image G4 (the inspected substrate image G1a and the color bar G3) is printed on the paper surface. Yes (another example of the process of “notifying the measurement result visually”). Thereby, the conductive pattern formed in each part of the substrate X to be inspected by referring to the notification image G4 printed on the paper surface in the same manner as when the notification image G4 displayed on the display unit 22 is referred to. It is possible to intuitively grasp the degree of L failure.

  Further, the processing unit 25 responds to the switching operation of the display screen by the operation unit 21 based on the other notification image data D4, as shown in FIG. 7, the other notification image G4 (inspected substrate image G2a and The color bar G3) is displayed on the display unit 22. Thereby, the substrate to be inspected indicating the measurement result (degree of defect: the value of the “good judgment ratio” value of the via V in this example) for each via V in the 20 substrates to be inspected X, X. The image G2a is displayed side by side with the color bar G3 (another example of the process of “notifying the measurement result visually”).

  In the notification image G4 (inspected substrate image G2a), a corresponding via is selected according to the “good determination ratio” for each via V calculated based on the reference value data D0 and the measured value data D1, D1,. The brightness of the image Gv is made different. In the notification image G4 (inspected substrate image G2a), the via image Gv of each via V is drawn corresponding to the actual position of the via V on the inspected substrate X. Therefore, by referring to the inspected substrate image G2a displayed on the display unit 22 together with the color bar G3, it is possible to intuitively grasp the degree of the defect of the via V formed in each part of the inspected substrate X.

  In place of the display on the display unit 22, the notification image data D4 is output to the printing unit 23 so that the notification image G4 (the inspected substrate image G2a and the color bar G3) is printed on the paper surface. (A further example of the process of “notifying the measurement result visually”). Thereby, the via V formed in each part of the substrate X to be inspected by referring to the notification image G4 printed on the paper surface in the same manner as when the notification image G4 displayed on the display unit 22 is referred to. It is possible to intuitively grasp the degree of defects.

  Thereafter, by designating each “specific value” other than the “good determination ratio” as necessary, the pattern image Gl corresponding to the designated “specific value” based on the calculation result by the processing unit 25. Or a notification image G4 in which the brightness of the via image Gv is made different is displayed or printed. Thereby, by referring to the notification image G4, the degree of failure of the conductor pattern L and the via V formed on each part of the substrate X to be inspected (“preliminarily defined”) from a viewpoint different from the “good determination ratio”. It is possible to intuitively grasp the “size”.

  Thus, in this data processing apparatus 2 and its measurement result notification method, the degree of failure can be specified based on each “measurement value (value of measurement value data D1)” for N substrates X to be inspected. A “predetermined value” is calculated for each “conductor path (via V or conductor pattern L)”, and each “conductor path” is determined according to the position of each “conductor path” on each substrate X to be inspected. Using the substrate image data D2 of the “inspected substrate image (inspected substrate images G1, G2)” in which a plurality of “conductor path images (pattern images Gl and via images Gv)” shown in FIG. The notification image data D4 is generated by changing a predetermined one of the hue, brightness, and saturation of each “conductor path image” corresponding to the “predetermined value” and generating For each “conductor path” based on the notified image data D4 Visually notifying by displaying or printing the size of the predefined value. " In addition, the board inspection system 100 includes the data processing apparatus 2 described above and the measurement apparatus 1 that performs measurement processing on each “conductor path” in each board to be inspected X and acquires each “measurement value”. Configured.

  Therefore, according to this data processing apparatus 2, its measurement result notification method, and this board inspection system 100, the measurement values and the like for each conductor pattern L and via V in a plurality of boards to be inspected X are displayed in a list form. Unlike the printed measurement result (inspection result), the conductor formed at any position on each inspected substrate X by referring to the inspected substrate images G1a and G2a of the displayed notification image G4 The degree of defect of the pattern L is large, the degree of defect of the conductor pattern L formed at which position is small, or the degree of defect of the via V formed at which position of each substrate to be inspected X is large, It is possible to intuitively grasp at which position the degree of defect of the via V is small, and each conductor pattern is determined by the difference in brightness of each pattern image Gl and via image Gv. It is possible to intuitively grasp the magnitude of “predetermined value” indicating the degree of failure for each of the lines L and the size of “predetermined value” indicating the degree of failure for each via V. . Thereby, even a person unfamiliar with the inspection using this type of apparatus can easily identify the cause of a defect occurring in each “conductor path” in the plurality of substrates X to be inspected.

  In addition, according to the data processing apparatus 2, the measurement result notification method, and the board inspection system 100 including such a data processing apparatus 2, the “measured value” for each “conductor path” in the N test boards X "Dispersion value", "standard deviation value" of "measurement value" for each "conductor path" in N test boards X, and "measurement value" for each "conductor path" in N test boards X “Variation coefficient”, “error rate” of “measured value” for each “conductor path” in N number of inspected boards X, “measured value” for “conductor path” in N number of inspected boards X “Standard score”, “average value” of “measured value” for each “conductor path” in N test boards X, “process capability index” for each “conductor path” in N test boards X, and N Of the inspected substrate X, the “measured value” satisfying a predetermined condition among the inspected substrates X is measured. Any ratio "by generating a notification image data D4 calculated by the" predefined value ", the degree of failure of the conductor pattern L and each via V can be accurately grasped.

  Furthermore, according to the data processing device 2, the measurement result notification method, and the substrate inspection system 100 including such a data processing device 2, the color bar G3 that can specify the size of the “predetermined value”. Are drawn side by side with the “substrate image to be inspected” to generate the notification image data D4, so that the degree of failure of each conductor pattern L and each via V is determined (“predetermined value”). It is possible to more easily grasp the size).

  Note that the configurations of the “measurement result notification device” and the “measurement system” and the processing content of the “measurement result notification method” are not limited to the above example. For example, as an example of “a pre-defined one of hue, lightness, and saturation”, the “lightness” of a black “conductor path image (pattern image Gl or via image Gv) is set to a“ predetermined value ( In the above example, the process of generating the notification image data D4 with different values depending on “good determination ratio” etc.) has been described as an example. However, the “conductor path image” of any color other than black has been described. The “notification image data” can be generated by changing the “brightness” according to the “predetermined value”. Also, instead of the process of changing the “brightness”, the “hue” or “saturation” of the color of the “conductor path image” is changed according to the “predetermined value” and the “notification image data” is changed. It can also be generated.

  Further, the example in which one conductor pattern L or one via V is measured as one “conductor path” and the measurement result is notified has been described, but a plurality of continuous conductor patterns L are defined as one “conductor path”. Alternatively, it is possible to adopt a configuration and a method in which one or more continuous conductor patterns L and vias V are used as one “conductor path”, and this is measured to notify the measurement result. Further, it is possible to adopt a configuration and method for notifying only the measurement result of the conductor pattern L as the “conductor path” or notifying only the measurement result of the via V as the “conductor path”.

  In addition, the measurement apparatus 1 that executes the measurement process for the inspected substrate X via the measurement jig 11 and the scanner 12 has been described as an example, but the configuration of the “measurement apparatus” in the “measurement system” is as follows. It is not limited to the above, and it is configured with a “measuring device” capable of performing measurement processing on the “substrate to be inspected” by independently moving each measurement probe by the probe moving mechanism and probing it at an arbitrary probing point. You can also

DESCRIPTION OF SYMBOLS 100 Board | substrate inspection system 1 Measuring apparatus 2 Data processing apparatus 11 Jig for measurement 13 Measuring part 15, 25 Processing part 22 Display part 23 Printing part D0 Reference value data D1 Measurement value data D2 Board image data D3 Color bar image data D4 For notification Image data G1, G1a, G2, G2a Substrate image to be inspected G3 Color bar G4 Image for notification G11, G12, Pattern image Gv Via image L1, L2, Conductor pattern V1, V2, ... Via X Inspected substrate

Claims (5)

Based on the measured values for the respective conductor paths for each of the inspected substrates measured by the measurement process for the same type of inspected substrates provided with the plurality of conductor paths, N sheets (N is A measurement result notification device including a processing unit that visually notifies a measurement result so that the degree of failure of each of the conductor paths in the inspected substrate of 2 or more natural numbers can be specified for each of the conductor paths; ,
The processing unit calculates a predetermined value that can specify the degree of the defect for each of the conductor paths based on the measured values of the N substrates to be inspected. Using the substrate image data of the board image to be inspected in which a plurality of conductor path images representing the respective conductor paths are arranged according to the positions of the respective conductor paths on the substrate, the respective conductor path images in the board image to be inspected are used. Notification image data is generated by changing a predetermined one of hue, lightness, and saturation corresponding to the predetermined value, and each of the above-described notification image data is generated based on the generated notification image data. A measurement result notification device that notifies the magnitude of the predetermined value for each conductor path.   The processing unit includes a variance value of the measurement values for each of the conductor paths in the N test substrates, a standard deviation value of the measurement values for the conductor paths in the N test substrates, The coefficient of variation of the measured value for each conductor path in the board to be inspected, the error rate of the measured value for each conductor path in the N boards to be inspected, and the conductor path for each conductor path in the N boards to be inspected Standard score of measured values, average value of the measured values for each conductor path in the N test substrates, process capability index for each conductor path in the N test substrates, and N test targets 2. The notification image data is generated by calculating, as the predetermined value, any of the ratios of the inspected substrates in which the measurement values satisfying a predetermined condition among the substrates are measured. Measurement result notification device.   3. The measurement result notification device according to claim 1, wherein the processing unit generates the notification image data by drawing a color bar capable of specifying the size of the predetermined value side by side with the substrate image to be inspected. .   A measurement result notification device according to any one of claims 1 to 3, and a measurement device that performs measurement processing on each conductor path in each substrate to be inspected and acquires each measurement value. Measuring system. Based on the measured values for the respective conductor paths for each of the inspected substrates measured by the measurement process for the same type of inspected substrates provided with the plurality of conductor paths, N sheets (N is A measurement result notification method for visually informing a measurement result in such a manner that the degree of failure of each conductor path in the inspected substrate of 2 or more natural numbers can be specified for each conductor path,
Based on the measured values for the N substrates to be inspected, a predetermined value capable of specifying the degree of the defect is calculated for each conductor path, and each conductor in each of the substrates to be inspected is calculated. Using the substrate image data of the inspected board image in which a plurality of conductor path images representing the respective conductor paths are arranged according to the position of the path, the hue, brightness, and color of each of the conductor path images in the inspected board image The notification image data is generated by changing a predetermined one of the degrees corresponding to the predetermined value, and based on the generated notification image data, for each conductor path A measurement result notifying method for notifying the size of a predefined value.