JP2018024074A - Combined processing machine including laser processing head - Google Patents

Combined processing machine including laser processing head Download PDF

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JP2018024074A
JP2018024074A JP2017047620A JP2017047620A JP2018024074A JP 2018024074 A JP2018024074 A JP 2018024074A JP 2017047620 A JP2017047620 A JP 2017047620A JP 2017047620 A JP2017047620 A JP 2017047620A JP 2018024074 A JP2018024074 A JP 2018024074A
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laser processing
tool
processing head
head
laser
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JP6843386B2 (en
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敦 上河原
Atsushi Kamikawara
敦 上河原
高志 宮本
Takashi Miyamoto
高志 宮本
直人 益子
Naoto Masuko
直人 益子
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Nakamura Tome Precision Industry Co Ltd
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Nakamura Tome Precision Industry Co Ltd
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Priority to TW106209713U priority Critical patent/TWM557164U/en
Priority to US15/664,309 priority patent/US10464165B2/en
Priority to EP17184181.0A priority patent/EP3278918B1/en
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Abstract

PROBLEM TO BE SOLVED: To provide a combined processing machine combined with various kinds of laser processing heads.SOLUTION: A combined processing machine includes a laser processing head and a tool replaceably, and has an automatic replacement device of the laser processing head and the tool.SELECTED DRAWING: Figure 1

Description

本発明はレーザビームによるレーザ加工と、切削、研削等の機械加工とを備えた複合加工機に関する。   The present invention relates to a combined processing machine equipped with laser processing using a laser beam and machining such as cutting and grinding.

レーザビームを用いて、切断、穴開け、溶接、肉盛り、積層、表面改質等のレーザ加工が施されているが、従来はそれぞれ用途に合せてレーザ加工装置が製作されているため、それぞれ用途毎にレーザ加工機を準備しなければならず、広いスペースが必要となるだけでなくコスト面でも高くなる。
また、ワークによってはレーザ加工の前後に切削や研削等の機械加工が必要となる場合も多い。 Laser processing such as cutting, drilling, welding, overlaying, laminating, surface modification, etc. has been performed using a laser beam, but conventionally laser processing equipment has been manufactured according to each application, A laser processing machine must be prepared for each application, which not only requires a large space but also increases costs.
Further, depending on the workpiece, machining such as cutting and grinding is often required before and after laser processing.

特許文献１には、工作機械の主軸台にレーザ加工ヘッドを旋回機構にて設ける技術を開示するが、レーザ加工ヘッドを工具と自動交換可能にしたものではない。   Patent Document 1 discloses a technique in which a laser processing head is provided on a spindle head of a machine tool by a turning mechanism, but the laser processing head is not automatically replaceable with a tool.

特表２００２−５１５３４４号公報Special Table 2002-515344

本発明は、各種レーザ加工ヘッドと組み合せた複合加工機の提供を目的とする。   An object of the present invention is to provide a composite processing machine combined with various laser processing heads.

本発明に係る複合加工機は、レーザ加工ヘッドと工具とを交換可能に備え、前記レーザ加工ヘッド及び工具の自動交換装置を有することを特徴とする。   The multi-task machine according to the present invention is characterized in that a laser machining head and a tool can be exchanged, and the laser machining head and tool automatic changer are provided.

ここで、レーザ加工ヘッドとはレーザビームを照射し、切断、穴開け、溶接、肉盛り、積層、表面改質等の各種レーザ加工を行うためのヘッドをいう。
本発明で工具とは、バイトによる旋削加工、回転工具による切削加工、砥石等による研削加工等の各種機械加工に用いられる工具をいう。
複合加工機には、ワークをチャック保持又は回転制御する主軸台とレーザ加工ヘッドを装着可能にした工具主軸を備えている。
本発明においてはレーザ加工ヘッド及び工具の自動交換装置を有しているので、レーザ加工の前後の機械加工と連動できるので、複数の工程を一台の複合加工機で行うことができる。
また、レーザ加工ヘッドは工具を装着する工具主軸に装着可能であり、且つレーザ光の伝達経路のクランプ手段を有するのが好ましい。
ここで、レーザ光の伝達経路とは、伝送ファイバや必要に応じて光線の反射、変更ミラー等が含まれる。 Here, the laser processing head refers to a head for irradiating a laser beam and performing various laser processing such as cutting, drilling, welding, overlaying, lamination, and surface modification.
In the present invention, the tool refers to a tool used for various machining processes such as a turning process using a cutting tool, a cutting process using a rotating tool, and a grinding process using a grindstone.
The multi-tasking machine is provided with a spindle head for holding or rotating the workpiece and a tool spindle on which a laser machining head can be mounted.
In the present invention, since the laser processing head and the automatic tool changer are provided, it can be interlocked with the machining before and after the laser processing, so that a plurality of processes can be performed by a single combined processing machine.
The laser processing head can be mounted on a tool spindle on which a tool is mounted, and preferably has clamping means for a laser beam transmission path.
Here, the laser light transmission path includes a transmission fiber, reflection of a light beam, and a change mirror, if necessary.

本発明において、前記レーザ加工ヘッドはコリメータ部と集光部とに分離可能であり、
前記集光部は前記自動交換装置にて取り替え可能になっていてもよい。
ここでコリメータ部とは、レーザ発振器等から出力されるレーザ光をコリメート（平行光化）する光学系の共通部分をいい、集光部とはレーザ加工の用途に合せてレーザ光の集光距離を変えるための部分をいう。
よって本発明において、前記集光部は、切断、穴開け、溶接、肉盛り、積層、表面改質等のレーザ加工の用途に合せて取り替え可能になっているのが好ましい。 In the present invention, the laser processing head is separable into a collimator part and a condenser part,
The condensing unit may be replaceable by the automatic exchange device.
Here, the collimator unit refers to the common part of the optical system that collimates (collimates) the laser beam output from a laser oscillator or the like, and the condensing unit refers to the condensing distance of the laser beam according to the laser processing application. The part for changing.
Therefore, in this invention, it is preferable that the said condensing part can be replaced | exchanged according to the uses of laser processing, such as cutting, drilling, welding, build-up, lamination | stacking, and surface modification.

また、レーザ加工ヘッドにはレーザ加工の目的に応じて、アシストガス、シールドガス、肉盛りや溶接に用いる粉末や線材の供給部を有しており、それらをユニット化したレーザ加工ヘッドユニットとして工具主軸に装着、交換可能にしてもよい。   In addition, the laser processing head has a supply section for powder and wire used for assist gas, shield gas, build-up and welding according to the purpose of laser processing. It may be attached to the main shaft and replaceable.

本発明に係る複合加工機は、レーザ加工と機械加工とが行えるので、ワークの複雑な加工工程を一台の機械で行えるので汎用性が高く、全体としてコストダウンを図ることができる。   Since the multi-task machine according to the present invention can perform laser processing and machining, a complicated machining process of a workpiece can be performed by a single machine, so that the versatility is high and the overall cost can be reduced.

本発明に係る複合加工機の構成例を示す。The structural example of the multi-tasking machine which concerns on this invention is shown. 工具主軸にレーザ加工ヘッドを装着した状態を示す。The state which attached the laser processing head to the tool principal axis is shown. 集光部のコリメータ部への装着構造例を示す。（ａ）は集光部を装着した状態、（ｂ）は集光部を取り外した状態を示す。An example of the mounting structure of the condensing unit to the collimator unit is shown. (A) shows a state in which the light collecting unit is mounted, and (b) shows a state in which the light collecting unit is removed. 工具主軸の軸心とレーザビーム光とをオフセットさせた例を示す。An example in which the axis of the tool spindle and the laser beam are offset is shown. （ａ）、（ｂ）はレーザ加工ヘッドの工具主軸への装着構造例を示す。(A), (b) shows the example of the mounting structure to the tool spindle of a laser processing head. レーザ加工ヘッドの第２の実施例を示し、（ａ）は工具主軸に装着した状態、（ｂ）はヘッド部の断面図を示す。A second embodiment of the laser machining head is shown, (a) is a state where it is mounted on a tool spindle, and (b) is a sectional view of the head portion. レーザ加工ヘッドのクランプ例を示す。An example of clamping a laser processing head is shown. レーザ加工ヘッドのクランプ例を示す。An example of clamping a laser processing head is shown. レーザ加工ヘッドのクランプ例を示す。An example of clamping a laser processing head is shown.

本発明に係る複合加工機の構造例を以下、図面に基づいて説明するが本発明はこれに限定されない。   A structural example of the multi-task machine according to the present invention will be described below with reference to the drawings, but the present invention is not limited to this.

図１に、複合加工機１０の構造例を示す。
本実施例では、ワークＷをチャック保持し、回転制御可能な主軸台Ｌ１１，主軸台Ｒ１２を対向配置し、この上部側に工具主軸１３を配置した例になっている。
本明細書では、対向主軸台Ｌ，Ｒの軸線方向をＺ軸、工具主軸１３の切り込み方向をＸ軸、これに前後方向に直交する方向をＹ軸と表現する。
２つの主軸の少なくとも一方はＺ軸方向移動制御されている。
工具主軸１３は、少なくともＹ軸まわりに旋回制御（Ｂ軸制御）され、左右に配置したレーザ加工ヘッド自動交換装置１４及び工具自動交換装置１５との間にてレーザ加工ヘッド又は工具の引き取り、引き渡しを行うことができる。
ここで交換装置は図示を省略したが、公知のフィンガタイプ、アームタイプ等の構造を採用することができ、自動交換装置となっている。 In FIG. 1, the structural example of the multi-task machine 10 is shown.
In this embodiment, the workpiece W is chuck-held, and a spindle base L11 and a spindle base R12 that can be controlled to rotate are arranged opposite to each other, and the tool spindle 13 is arranged on the upper side.
In the present specification, the axial direction of the opposed spindle heads L and R is expressed as the Z axis, the cutting direction of the tool spindle 13 is expressed as the X axis, and the direction orthogonal to the front-rear direction is expressed as the Y axis.
At least one of the two main shafts is controlled to move in the Z-axis direction.
The tool spindle 13 is swiveled at least around the Y axis (B axis control), and the laser machining head or tool is picked up and delivered between the laser machining head automatic changer 14 and the tool automatic changer 15 arranged on the left and right. It can be performed.
Here, although the illustration of the exchange device is omitted, a known finger type, arm type, or other structure can be adopted, and an automatic exchange device is obtained.

レーザ加工ヘッド自動交換装置１４には、アシストガス管、シールドガス管、粉末・線材供給部等を組み合せてユニット化したレーザ加工ヘッド１６をレーザ加工目的に合せて複数種類のユニットをマガジンにセットしてあってもよい。
本実施例では、図２，３に示すように、レーザ加工ヘッド１６はコリメータ部１６ａと集光部１６ｂとが分離可能となっていて、この集光部１６ｂをレーザ加工の目的に合せて、集光方法、集光距離の異なる複数種類の集光部１６ｂをマガジンにセットした例になっている。 In the laser processing head automatic changer 14, a laser processing head 16 that is formed as a unit by combining an assist gas pipe, a shield gas pipe, a powder / wire supply unit, etc. is set in a magazine in accordance with the purpose of laser processing. May be.
In this embodiment, as shown in FIGS. 2 and 3, the laser processing head 16 can be separated into a collimator unit 16a and a condensing unit 16b, and this condensing unit 16b is adapted to the purpose of laser processing. In this example, a plurality of types of condensing units 16b having different condensing methods and condensing distances are set in a magazine.

コリメータ部１６ａはレーザビームの光学系の共通部分であり、集光部１６ｂはレーザビームの集光距離、方法を切断、穴開け、溶接、肉盛り、積層、表面改質等のレーザ加工目的に合せて調整した部分である。
これによりレーザヘッド自動交換装置１４に設けたマガジンに各種集光部をストックしておき、この自動交換装置にて工具主軸１３に装着してある集光部と取り換えるだけで各種レーザ加工ができる。 The collimator unit 16a is a common part of the laser beam optical system, and the condensing unit 16b is used for laser processing purposes such as laser beam condensing distance and method, cutting, drilling, welding, overlaying, stacking, and surface modification. It is the part adjusted together.
As a result, various laser processing can be performed simply by stocking various condensing units in a magazine provided in the laser head automatic exchanging device 14 and replacing the condensing unit mounted on the tool spindle 13 with this automatic exchanging device.

コリメータ部１６ａと集光部１６ｂとの分離方法に制限はない。
本実施例は図３に示すようにコリメータ部１６ａ側に周廻り、３点支持のボールプランジャー１６ｄを配設し、集光部１６ｂの周廻りに上下の円錐面で形成した把持凹部１６ｇをボールプランジャー１６ｄに差し込み装着及び引き抜き取り出し可能にした例となっている。
なお、ボールプランジャー１６ｄはボール１６ｅを周廻り中心方向にスプリング１６ｆで脱落しないように突出付勢してある。
ボールプランジャー１６ｄは周廻りに１２０°毎に３つ配置してあり、コリメータ部１６ａの軸心と集光部１６ｂの軸心が一致するようになっている。
また、集光部１６ｂがコリメータ部１６ａに対して相互に回転しないように、例えばキーとキー溝からなるロック機構を設けてもよい。 There is no restriction | limiting in the separation method of the collimator part 16a and the condensing part 16b.
In this embodiment, as shown in FIG. 3, the ball plunger 16d is supported around the collimator portion 16a, and a three-supported ball plunger 16d is provided. A gripping recess 16g formed by upper and lower conical surfaces is provided around the light collecting portion 16b. In this example, the ball plunger 16d can be inserted and pulled out.
The ball plunger 16d is urged so as not to drop off by the spring 16f around the ball 16e in the center direction.
Three ball plungers 16d are arranged every 120 ° around the circumference so that the axis of the collimator unit 16a and the axis of the light collecting unit 16b coincide.
Moreover, you may provide the locking mechanism which consists of a key and a key groove so that the condensing part 16b may not mutually rotate with respect to the collimator part 16a.

コリメータ部１６ａはレーザビームを伝送する伝送ファイバ１１６ｃ，コリメータレンズ１１６ａ，保護ガラス（第１）１１６ｂを有する例になっていて、集光部１６ｂは保護ガラス（第２）２１６ｂ，集光レンズ２１６ａ，保護ガラス（第３）２１６ｃ，ノズル２１６ｄを有する例になっているが、集光部１６ｂをコリメータ部１６ａに交換可能に脱着できれば、この構造例に限定されない。   The collimator unit 16a is an example having a transmission fiber 116c for transmitting a laser beam, a collimator lens 116a, and a protective glass (first) 116b. Although the example includes the protective glass (third) 216c and the nozzle 216d, the structure is not limited to this example as long as the light collecting unit 16b can be attached to and detached from the collimator unit 16a.

レーザ加工ヘッド１６は工具主軸１３への取付部１９を有し、図２に示すように工具主軸１３の軸心とレーザビーム１７の光線と一致させるように、複数の反射ミラー１８ａ，１８ｂを配置したタイプ及び図４に示すように、工具主軸１３の軸心とレーザビーム１７の光線とをオフセットさせたタイプが例として挙げられる。
取付部１９には図５に示すようにシャンク１９ａを有し、工具主軸１３にチャックされる。 The laser processing head 16 has an attachment portion 19 for the tool spindle 13 and a plurality of reflecting mirrors 18a and 18b are arranged so as to coincide with the axis of the tool spindle 13 and the beam of the laser beam 17 as shown in FIG. As shown in FIG. 4 and a type in which the axis of the tool spindle 13 and the beam of the laser beam 17 are offset as shown in FIG.
As shown in FIG. 5, the mounting portion 19 has a shank 19 a and is chucked by the tool spindle 13.

工具主軸１３からレーザ加工ヘッド１６を取り外すと、図１に示すように工具自動交換装置１５にてバイトや回転工具等の工具Ｔを工具主軸１３に装置し、各種切削加工を行うことができる。
また本実施例では、対向主軸台Ｌ，Ｒの下側にタレット刃物台２０を配置した例になっているが、必要に応じて複数のタレット刃物台やＢ軸制御されたその他の刃物台を設けてもよい。 When the laser machining head 16 is removed from the tool spindle 13, a tool T such as a cutting tool or a rotary tool is installed on the tool spindle 13 by an automatic tool changer 15 as shown in FIG.
Further, in this embodiment, the turret tool post 20 is arranged below the opposed headstocks L and R, but a plurality of turret tool post and other B tool controlled turrets are provided as necessary. It may be provided.

図６にレーザ加工ヘッドの第２の実施例を示す。
図３と共通する部分は、共通の符号を表記し、詳細な説明を省略する。
本実施例は、コリメータ部１６Ａに集光部（ノズル部）１６Ｂを装着する方法として、集光部１６Ｂ側にボールプランジャー１６ｄを設け、コリメータ部１６Ａ側に把持凹部１６Ｇを形成してある。 FIG. 6 shows a second embodiment of the laser processing head.
Portions common to those in FIG. 3 are denoted by common reference numerals, and detailed description thereof is omitted.
In the present embodiment, as a method of mounting the light collecting portion (nozzle portion) 16B on the collimator portion 16A, a ball plunger 16d is provided on the light collecting portion 16B side, and a gripping recess 16G is formed on the collimator portion 16A side.

複合加工機を、このように構成したことにより、主軸台にワークをチャック保持させ、各種レーザ加工をした後に各種工具を用いて切削、研削等の機械加工を行うことや、レーザ加工の前に機械加工を行うことができ、複数の異なる各種工程を一台の複合機で行うことができる。   By configuring the multi-task machine in this way, the workpiece is chucked and held on the headstock, and after various laser processing, machining such as cutting and grinding is performed using various tools, and before laser processing. Machining can be performed, and a plurality of different processes can be performed by a single multifunction device.

次に、取付部１９のクランプ構造について説明する。
レーザ加工ヘッドを工具主軸に装着できるとともに、主軸中心とレーザ光中心とが一致するようにすると、工具の移動制御や旋回制御に合せてレーザ加工ヘッドの制御も可能になる。
しかし、レーザ加工ヘッドには前述したように、レーザ光の伝達経路を確保するためのクランプ手段が必要であり、工具主軸が旋回する場合にも安定した位置決め手段が要求される。 Next, the clamp structure of the attachment portion 19 will be described.
When the laser processing head can be mounted on the tool spindle and the center of the spindle coincides with the center of the laser beam, the laser processing head can be controlled in accordance with the movement control and turning control of the tool.
However, as described above, the laser processing head requires clamping means for securing a laser beam transmission path, and stable positioning means are required even when the tool spindle rotates.

図７（ａ）は、工具主軸端面にピン１９ｂを設けてクランプさせる方法を示す。
図７（ｂ）は、レーザ光の伝達経路を工具主軸の上部に設けたクランプ手段１９ｃにクランプさせる方法を示す。
図８（ａ）は、工具主軸の端面に沿ってスライドするクランプ１９ｄを採用した例を示し、（ｂ），（ｃ）は工具主軸の下部にサブクランプ１９ｅを設けた例を示す。

図９は、レーザ光の伝達経路を工具主軸の上部に設けたローラ式クランプ１９ｆを設けた例を示す。
このように、両側一対のローラでクランプすると、工具主軸の旋回によるねじれをローラが吸収してくれる。 Fig.7 (a) shows the method of providing the pin 19b in the tool spindle end surface, and making it clamp.
FIG. 7B shows a method of clamping the laser light transmission path to the clamping means 19c provided on the upper part of the tool spindle.
FIG. 8A shows an example in which a clamp 19d that slides along the end face of the tool spindle is adopted, and FIGS. 8B and 8C show examples in which a sub clamp 19e is provided at the lower part of the tool spindle.

FIG. 9 shows an example in which a roller clamp 19f having a laser beam transmission path provided on the upper part of the tool spindle is provided.
In this way, when clamped by a pair of rollers on both sides, the roller absorbs the twist caused by the turning of the tool spindle.

１０ 複合加工機
１１ 主軸台Ｌ
１２ 主軸台Ｒ
１３ 工具主軸
１４ レーザ加工ヘッド自動交換装置
１５ 工具自動交換装置
１６ レーザ加工ヘッド
１６ａ コリメータ部
１６ｂ 集光部
１６ｃ チャック部
１６ｄ ボールプランジャー
１６ｇ 把持凹部
２０ タレット刃物台
１１６ａ コリメータレンズ
１１６ｂ 保護ガラス（第１）
１１６ｃ 伝送ファイバ
２１６ａ 集光レンズ
２１６ｂ 保護ガラス（第２）
２１６ｃ 保護ガラス（第３）
２１６ｄ ノズル 10 Combined processing machine 11 Headstock L
12 Headstock R
DESCRIPTION OF SYMBOLS 13 Tool spindle 14 Laser processing head automatic changer 15 Tool automatic changer 16 Laser processing head 16a Collimator part 16b Condensing part 16c Chuck part 16d Ball plunger 16g Holding recessed part 20 Turret tool post 116a Collimator lens 116b Protective glass (1st)
116c Transmission fiber 216a Condensing lens 216b Protective glass (second)
216c Protective glass (third)
216d nozzle

Claims (4)

レーザ加工ヘッドと工具とを交換可能に備え、
前記レーザ加工ヘッド及び工具の自動交換装置を有することを特徴とする複合加工機。 The laser processing head and tool can be exchanged,
A combined processing machine comprising the laser processing head and an automatic tool changer. 前記レーザ加工ヘッドはコリメータ部と集光部とに分離可能であり、
前記集光部は前記自動交換装置にて取り替え可能になっていることを特徴とする請求項1記載の複合加工機。 The laser processing head is separable into a collimator part and a condenser part,
2. The multi-tasking machine according to claim 1, wherein the condensing unit can be replaced by the automatic changer. 前記集光部は、切断、穴開け、溶接、肉盛り、積層、表面改質等のレーザ加工の用途に合せて取り替え可能になっていることを特徴とする請求項２記載の複合加工機。   3. The multi-tasking machine according to claim 2, wherein the condensing part is replaceable in accordance with a laser processing application such as cutting, drilling, welding, overlaying, laminating, and surface modification. 前記レーザ加工ヘッドは工具を装着する工具主軸に装着可能であり、且つレーザ光の伝達経路のクランプ手段を有することを特徴とする請求項１〜３のいずれかに記載の複合加工機。   The multi-tasking machine according to any one of claims 1 to 3, wherein the laser processing head is mountable on a tool spindle on which a tool is mounted, and has a laser beam transmission path clamping means.
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JP6563622B1 (en) * 2018-09-06 2019-08-21 ヤマザキマザック株式会社 Tool storage device, machine tool and combined processing machine
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US11919107B2 (en) 2018-09-06 2024-03-05 Yamazaki Mazak Corporation Tool storage, machine tool, hybrid working machine
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CN112008407A (en) * 2020-07-17 2020-12-01 南京航空航天大学 Material increase and decrease integrated multifunctional system based on coupling of machining and laser manufacturing
CN112372307A (en) * 2020-11-23 2021-02-19 贺州市乾创建材贸易有限公司 Polishing and fixed-length cutting device for building material forging round steel
WO2022118492A1 (en) * 2020-12-03 2022-06-09 Dmg森精機株式会社 Processing machine
WO2022254720A1 (en) * 2021-06-04 2022-12-08 Dmg森精機株式会社 Processing machine
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CN115351553A (en) * 2022-09-01 2022-11-18 常州市鹏睿机械有限公司 Welding device for low-pressure container shell

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