JP2018018963A - Depth measuring method for back drill processing, and measuring device - Google Patents

Depth measuring method for back drill processing, and measuring device Download PDF

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JP2018018963A
JP2018018963A JP2016148266A JP2016148266A JP2018018963A JP 2018018963 A JP2018018963 A JP 2018018963A JP 2016148266 A JP2016148266 A JP 2016148266A JP 2016148266 A JP2016148266 A JP 2016148266A JP 2018018963 A JP2018018963 A JP 2018018963A
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hole
conductive plating
spindle
substrate
depth
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JP6654523B2 (en
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堀田恭平
Kyohei Hotta
時永勝典
Katsunori Tokinaga
薗田耕平
Kohei Sonoda
荒木裕次郎
Yujiro Araki
高光秀幸
Hideyuki Takamitsu
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Via Mechanics Ltd
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Via Mechanics Ltd
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Abstract

PROBLEM TO BE SOLVED: To measure a depth of back drill processing with respect to a substrate on which the back drill processing has been performed.SOLUTION: A substrate including a hole on which back drill processing has been performed is mounted on a grounded table. A conductive machine tool comprises a contact part of a diameter smaller than a diameter of a portion in which a conductive plating part has been removed in the back drill processing, and larger than a diameter of a portion in which the conductive plating part has not been removed. Such a machine tool with conductivity is inserted into the hole on which the back drill processing has been performed, on the substrate. The contact part is brought into contact with the conductive plating part that is residual in the hole and a time point in which a current starts flowing through an inspection hole formed on the substrate and electrically connected with the conductive plating part is detected. Based on the detected time point, a depth of the back drill processing is detected.SELECTED DRAWING: Figure 1

Description

本発明は、バックドリル加工が行われた多層基板に対してバックドリル加工の深さを測定する方法及び装置に関する。   The present invention relates to a method and an apparatus for measuring the depth of back drilling on a multilayer substrate on which back drilling has been performed.

多層プリント基板のＬＳＩ（大規模集積回路）等の電子部品を実装するために、内層にある所定の導体配線層と接続するための端子として、貫通穴を形成し、それに導電メッキを施している。しかしながら、その貫通穴のメッキ部が目的とする導体配線層までの距離よりも長いため、その長すぎる部分（以下、スタブという）を短くしなければ、インピーダンス不整合や信号遅延、波形なまりが発生するという問題がある。   In order to mount electronic components such as LSI (Large Scale Integrated Circuit) on a multilayer printed circuit board, through holes are formed as terminals for connection to a predetermined conductor wiring layer in the inner layer, and conductive plating is applied thereto. . However, since the plated part of the through hole is longer than the distance to the target conductor wiring layer, impedance mismatching, signal delay, and waveform rounding will occur unless the excessively long part (hereinafter referred to as stub) is shortened. There is a problem of doing.

そこで、メッキした後に前記貫通穴の径より僅かに大きな径のドリルで、前記導体配線層の手前までバックドリル加工（スタブ除去加工）し、スタブとなるメッキ層を取り除くことが必要である。   Therefore, it is necessary to remove the plating layer that becomes the stub by performing back drilling (stub removal processing) just before the conductor wiring layer with a drill having a diameter slightly larger than the diameter of the through hole after plating.

バックドリル加工では、いかに余分なスタブを取り除くことが出来るかが重要であり、高精度な深さ制御を実現するために、例えば特許文献１と２に開示される技術があるが、基板に凹凸があったり層が多くなったりすると、必ずしも目標通りの深さに加工されているとは限らない。従って、あたためてバックドリル加工の深さを測定する必要が生じるが、特許文献１と２ではその点についての言及はない。   In back drilling, it is important how much extra stubs can be removed, and there are techniques disclosed in Patent Documents 1 and 2, for example, in order to realize highly accurate depth control. If there is a crack or the number of layers increases, it is not always processed to the desired depth. Therefore, it is necessary to warmly measure the depth of back drilling, but Patent Documents 1 and 2 do not mention this point.

特開2009-4585号公報JP 2009-4585 特開2014-113662号公報Japanese Unexamined Patent Publication No. 2014-113662

そこで、本発明は、バックドリル加工が行われた基板に対してバックドリル加工の深さを測定できるようにすることを目的とするものである。   Therefore, an object of the present invention is to make it possible to measure the depth of back drilling on a substrate on which back drilling has been performed.

本願において開示される発明のうち、代表的なバックドリル加工の深さ測定方法は、バックドリル加工された穴を有する基板を接地されているテーブルに載置し、前記バックドリル加工において導電メッキ部が除去された部分の径より小さく導電メッキ部が除去されていない部分の径より大きい径の接触部を備える工具であって導電性を有するものを前記基板のバックドリル加工された穴に挿入し、前記接触部が前記穴に残された導電メッキ部に接触して前記基板に形成された前記導電メッキ部と電気的に接続された検査用の穴を介して電流が流れ始める時点を検出し、当該検出時点に基づいてバックドリル加工の深さを検出する。   Among the inventions disclosed in the present application, a representative depth measurement method for back drilling is to place a substrate having a back drilled hole on a grounded table, and in the back drilling process, a conductive plating portion. A tool having a contact portion having a diameter smaller than the diameter of the portion where the conductive plating portion is removed and larger than the diameter of the portion where the conductive plating portion is not removed and having conductivity is inserted into the back-drilled hole of the substrate. Detecting when the contact portion contacts the conductive plating portion left in the hole and current starts to flow through the inspection hole electrically connected to the conductive plating portion formed in the substrate. The depth of back drilling is detected based on the detection time.

また、本願において開示される発明のうち、代表的なバックドリル加工の深さ測定装置は、基板にドリルでバックドリル加工を行う場合には当該ドリルを保持し前記バックドリル加工において導電メッキ部が除去された部分の径より小さく導電メッキ部が除去されていない部分の径より大きい径の接触部を備える工具であって導電性を有するものを保持することができるスピンドルと、バックドリル加工された前記基板を載置するためのテーブルであって接地されているものと、前記スピンドルと前記テーブルを互いに水平方向に相対移動させる水平駆動部と、前記スピンドルと前記テーブルを互いに垂直方向に相対移動させる垂直駆動部と、前記スピンドルに保持された前記工具がバックドリル加工された穴に挿入されて前記接触部が前記穴に残された導電メッキ部に接触して前記基板に形成された前記導電メッキ部と電気的に接続された検査用の穴を介して流れる電流を検出する電流検出部と、前記水平駆動部と前記垂直駆動部を制御する全体制御部であって前記電流検出部での検出時点に基づいてバックドリル加工の深さを検出するものとを備えることを特徴とする。   In addition, among the inventions disclosed in the present application, a representative back-drilling depth measuring device holds the drill when performing back-drilling with a drill on a substrate, and the conductive plating portion is provided in the back-drilling. A spindle having a contact portion smaller than the diameter of the removed portion and having a contact portion with a diameter larger than the diameter of the portion where the conductive plating portion is not removed, and a spindle capable of holding the conductive portion, and back drilled A table for placing the substrate, which is grounded, a horizontal drive unit that relatively moves the spindle and the table in the horizontal direction, and a relative movement of the spindle and the table in the vertical direction. The vertical drive unit and the tool held by the spindle are inserted into a back-drilled hole so that the contact unit is A current detection unit for detecting a current flowing through an inspection hole electrically connected to the conductive plating unit formed on the substrate in contact with the conductive plating unit remaining on the substrate; and the horizontal driving unit; An overall control unit that controls the vertical drive unit, and that detects a back drilling depth based on a detection time point in the current detection unit.

本発明によれば、バックドリル加工が行われた基板に対してバックドリル加工の深さを測定できるようになる。   ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to measure the depth of a back drill process with respect to the board | substrate with which the back drill process was performed.

本発明の一実施例を説明するための図である。It is a figure for demonstrating one Example of this invention. 図１におけるバックドリル加工の深さを測定するための深さ測定工具の断面模式図である。It is a cross-sectional schematic diagram of the depth measurement tool for measuring the depth of the back drill process in FIG.

図１は、本発の一実施例を説明するための図である。図１において、１はプリント基板に穴あけを行う場合に当該プリント基板が載置されるテーブルであり、接地されている。２はプリント基板に穴あけを行う場合にドリルを保持し回転させるスピンドル、３はテーブル１を水平な２次元方向（図において、左右方向と紙面に垂直な方向）に移動させスピンドル２に対して水平方向の相対移動を行わせるテーブル水平駆動部、４はスピンドル２を垂直方向に移動させテーブル１に対して垂直方向の相対移動を行わせるスピンドル垂直駆動部、５はスピンドル２の先端側に図示を省略するシリンダを介して契合しているプレッシャフットであり、スピンドル２が降下する場合、途中までは共に移動し、それ以後はスピンドル２と独立に垂直方向に移動できるようになっている。プレッシャフット５の下端には、プリント基板に穴あけを行う場合にその上面を押し付けるためのブッシュ６が取付けられている。   FIG. 1 is a diagram for explaining an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a table on which a printed board is placed when drilling a printed board, and is grounded. 2 is a spindle that holds and rotates a drill when drilling holes in a printed circuit board, and 3 is a table that moves horizontally in a two-dimensional direction (in the figure, the left-right direction and the direction perpendicular to the paper surface). The table horizontal drive unit 4 for moving the direction relative to each other, 4 is the spindle vertical drive unit for moving the spindle 2 in the vertical direction and performs the relative movement in the vertical direction with respect to the table 1, and 5 is shown on the tip side of the spindle 2. The pressure foot is engaged via a cylinder to be omitted, and when the spindle 2 is lowered, it moves together partway and thereafter can move in the vertical direction independently of the spindle 2. A bush 6 is attached to the lower end of the pressure foot 5 to press the upper surface of the printed board when drilling holes.

７はスピンドル２と連結されたずれ検出器である。このずれ検出器７は、スピンドル２とプレッシャフット５とを共に降下させた場合、スピンドル２と共に降下し、ブッシュ６がプリント基板の上面位置に到達し、プレッシャフット５だけがそれ以上降下できなくなって、スピンドル２とプレッシャフット５が垂直方向に互いにずれた時を検出し、例えばプログラム制御の処理装置によって実現される全体制御部８へ検出信号を出力するものである。   A deviation detector 7 is connected to the spindle 2. When the spindle 2 and the pressure foot 5 are lowered together, the deviation detector 7 is lowered together with the spindle 2, the bush 6 reaches the upper surface position of the printed circuit board, and only the pressure foot 5 cannot be lowered any more. When the spindle 2 and the pressure foot 5 are deviated from each other in the vertical direction, a detection signal is output to the overall control unit 8 realized by, for example, a program control processing device.

プリント基板に穴あけを行う場合、テーブル水平駆動部３やスピンドル垂直駆動部４が全体制御部８によって制御されるようになっている。穴あけを行うための制御機構としては、他に種々の要素と接続線を有するが、以上までは穴あけ装置として良く知られている構成である。 When punching a printed board, the table horizontal drive unit 3 and the spindle vertical drive unit 4 are controlled by the overall control unit 8. As a control mechanism for drilling, there are various other elements and connection lines, but the configuration so far is well known as a drilling device.

１１はテーブル１の上に載置されたバックドリル加工の深さを測定すべき多層のプリント基板である。１２はバックドリル加工された貫通穴、１３と１４は内部配線層、１５は貫通穴１２の上部表面に形成された上部外層端子、１６は貫通穴１２の下部表面に形成された下部外層端子、１７は内部配線層１３と１４を接続する導電メッキ部である。ここの構造は、貫通穴１２の全長にわたって内側に導電メッキが施された後、最上位側にある内部配線層１３の位置よりも上側部分及び最下位側にある内部配線層１４の位置よりも下側部分がバックドリル加工によって除去され、内部配線層１３と１４間に導電メッキ部１７が残された形になっている。プリント基板１１の回路形成のためのエリアである回路用領域１８には、このような貫通穴１２が多数形成されている。   Reference numeral 11 denotes a multilayer printed circuit board on which the depth of back drilling mounted on the table 1 is to be measured. 12 is a back-drilled through hole, 13 and 14 are internal wiring layers, 15 is an upper outer layer terminal formed on the upper surface of the through hole 12, 16 is a lower outer layer terminal formed on the lower surface of the through hole 12, Reference numeral 17 denotes a conductive plating portion that connects the internal wiring layers 13 and 14. In this structure, the conductive plating is applied to the inner side over the entire length of the through hole 12, and then the upper portion of the inner wiring layer 13 on the uppermost side and the position of the inner wiring layer 14 on the lowermost side. The lower portion is removed by back drilling, and the conductive plating portion 17 is left between the internal wiring layers 13 and 14. A large number of such through holes 12 are formed in the circuit region 18 which is an area for circuit formation of the printed circuit board 11.

１９はプリント基板１１の本来の回路形成のためのエリアでない検査用領域２０に形成された検査用貫通穴である。この検査用貫通穴１９に形成された導電メッキ部２１は上部外層端子２２、下部外層端子２３及び内部配線層２４と接続されている。貫通穴１２の導電メッキ部１７が接続された最上位側の内部配線層１３あるいは最下位側にある内部配線層１４は、特定の検査用貫通穴２０に形成された導電メッキ部２１と接続された内部配線層２４と同じであるか電気的接続されており、その上部外層端子２２と下部外層端子２３に接続されている。検査用領域１９にはこのような検査用貫通穴２０がいくつか形成されており、それぞれ回路用領域１８のいずれかの貫通穴１２の導電メッキ部１７と接続されている。   Reference numeral 19 denotes an inspection through hole formed in the inspection region 20 which is not an area for forming an original circuit of the printed circuit board 11. The conductive plating portion 21 formed in the inspection through hole 19 is connected to the upper outer layer terminal 22, the lower outer layer terminal 23 and the internal wiring layer 24. The uppermost internal wiring layer 13 to which the conductive plated portion 17 of the through hole 12 is connected or the lowermost internal wiring layer 14 is connected to the conductive plated portion 21 formed in the specific through hole 20 for inspection. The internal wiring layer 24 is the same as or electrically connected to the upper outer layer terminal 22 and the lower outer layer terminal 23. Several inspection through holes 20 are formed in the inspection region 19, and each of the inspection through holes 20 is connected to the conductive plating portion 17 of one of the through holes 12 in the circuit region 18.

次に、バックドリル加工の深さを測定する場合について説明する。９はバックドリル加工の深さを測定するための深さ測定工具で、スピンドル２で保持できる構造になっている。
深さ測定工具９は、例えば、図２の断面模式図に示すように、円形の導体から成り、先端部９１と中央部９２とスピンドル２で保持する後端部（シャンク部）９３を含む。中央部９２の径は、図１における貫通穴１２の導電メッキ部１７が残っているバックドリル非加工部分の径より大きく、導電メッキ部１７が除去されたバックドリル加工部分の径より小さくなっている。従って、深さ測定工具９がバックドリル加工された貫通穴１２に挿入された場合、残されている導電メッキ部１７に中央部９２の先端部９１付近が接触するまでは、すり抜ける形となる。 Next, a case where the depth of back drilling is measured will be described. Denoted at 9 is a depth measuring tool for measuring the depth of back drilling, which has a structure that can be held by the spindle 2.
For example, as shown in the schematic cross-sectional view of FIG. 2, the depth measurement tool 9 includes a circular conductor, and includes a front end portion 91, a central portion 92, and a rear end portion (shank portion) 93 held by the spindle 2. The diameter of the central portion 92 is larger than the diameter of the back drill non-processed portion where the conductive plating portion 17 of the through hole 12 in FIG. 1 remains, and is smaller than the diameter of the back drill processed portion where the conductive plating portion 17 is removed. Yes. Therefore, when the depth measurement tool 9 is inserted into the back-drilled through-hole 12, it will slip through until the vicinity of the tip 91 of the central portion 92 contacts the remaining conductive plating portion 17.

貫通穴１２のバックドリル加工の深さを測定する場合、全体制御部８の制御の下で、以下のように動作する。
先ず、テーブル水平駆動部３によりテーブル１を水平な２次元方向に移動させ、貫通穴１２の座標データに基づき、深さ測定工具９を貫通穴１２の上方位置に合わせる。ここで、電源線２５からスピンドル２の駆動用モータに電流検出用の電源を供給すると、駆動用モータには固定子と回転子間に静電容量が存在するので、深さ測定工具９は所定の電位に保たれる。次に、スピンドル２を回転させない状態で、スピンドル垂直駆動部４によりスピンドル２を降下させていく。ブッシュ６がプリント基板１１の上面位置に到達し、プレッシャフット５だけがそれ以上降下できなくなって、ずれ検出器７でスピンドル２とプレッシャフット５が垂直方向に互いにずれた時を検出すると、全体制御部８はその時のスピンドル垂直駆動部４での送り位置Ｐ1を貫通穴１２の座標データとともに記憶部１０に記憶しておく。 When measuring the depth of back drilling of the through hole 12, it operates as follows under the control of the overall control unit 8.
First, the table 1 is moved in a horizontal two-dimensional direction by the table horizontal drive unit 3, and the depth measuring tool 9 is adjusted to the upper position of the through hole 12 based on the coordinate data of the through hole 12. Here, when power for detecting current is supplied from the power supply line 25 to the drive motor of the spindle 2, the drive motor has a capacitance between the stator and the rotor. Is maintained at the potential. Next, the spindle 2 is lowered by the spindle vertical drive unit 4 in a state where the spindle 2 is not rotated. When the bush 6 reaches the upper surface position of the printed circuit board 11 and only the pressure foot 5 cannot be lowered any more, and the deviation detector 7 detects when the spindle 2 and the pressure foot 5 are displaced from each other in the vertical direction, the entire control is performed. The unit 8 stores the feed position P1 at the spindle vertical drive unit 4 at that time together with the coordinate data of the through hole 12 in the storage unit 10.

スピンドル垂直駆動部４によりスピンドル２がさらに降下すると、深さ測定工具９の先端部９１が貫通穴１２の導電メッキ部１７と導通するようになり、そこで電源線２５から深さ測定工具９、内部配線層１３、内部配線層２４、検査用貫通穴２０の導電メッキ部２１及び下部外層端子２３を経由して接地されているテーブル１に電流が流れ始めるようになる。
ここで、電流検出部２６が電源線２５に流れる電流を検出すると、電流検出部２６の検出信号を受けた全体制御部８はスピンドル垂直駆動部４のそれ以上の送りを止めるとともに、その時のスピンドル垂直駆動部４での送り位置Ｐ２を貫通穴１２のバックドリル加工最終位置と決定し、貫通穴１２の座標データとともに記憶部１０に格納する。その後、全体制御部８は今回検出の送り位置Ｐ２と先に記憶しておいた送り位置Ｐ１とに基づいて貫通穴１２のバックドリル加工の深さを算出し、貫通穴１２の座標データとともに記憶部１０に格納する。
プリント基板１１に形成された他の貫通穴１２の場合も、同様にして、貫通穴１２のバックドリル加工の深さを算出し、その座標データとともに記憶部１０に格納する。 When the spindle 2 is further lowered by the spindle vertical drive unit 4, the tip 91 of the depth measurement tool 9 is brought into conduction with the conductive plating part 17 of the through hole 12. Current starts to flow through the wiring layer 13, the internal wiring layer 24, the conductive plated portion 21 of the inspection through hole 20, and the lower outer layer terminal 23 to the grounded table 1.
Here, when the current detection unit 26 detects the current flowing through the power supply line 25, the overall control unit 8 that has received the detection signal from the current detection unit 26 stops further feeding of the spindle vertical drive unit 4 and the spindle at that time. The feed position P2 in the vertical drive unit 4 is determined as the back drilling final position of the through hole 12 and stored in the storage unit 10 together with the coordinate data of the through hole 12. Thereafter, the overall control unit 8 calculates the back drilling depth of the through hole 12 based on the feed position P2 detected this time and the previously stored feed position P1, and stores it together with the coordinate data of the through hole 12. Stored in the unit 10.
Similarly, in the case of other through holes 12 formed in the printed circuit board 11, the depth of back drilling of the through holes 12 is calculated and stored in the storage unit 10 together with the coordinate data.

以上により、貫通穴１２の最上位側にある内部配線層１３の位置よりも上側部分のバックドリル加工の深さを測定することができる。最下位側にある内部配線層１４の位置よりも下側部分のバックドリル加工の深さを測定する場合は、プリント基板１１の上下を反転させ、上記と同様に行えばよい。   As described above, it is possible to measure the depth of back drilling in the upper part of the inner wiring layer 13 on the uppermost side of the through hole 12. When measuring the depth of back drilling in the lower part of the lowermost side than the position of the internal wiring layer 14, the printed board 11 may be turned upside down and performed in the same manner as described above.

以上の実施例によれば、プリント基板１１の各貫通穴１２について、バックドリル加工の深さを測定でき、そのデータを記憶部１０に格納することができる。   According to the above embodiment, the depth of back drilling can be measured for each through hole 12 of the printed circuit board 11, and the data can be stored in the storage unit 10.

なお、以上の実施例においては、プリント基板１１の上面位置の送り位置Ｐ１を各貫通穴毎に検出することにしたが、上面位置の変動が少ないことが判っているなら、特定の貫通穴の上面位置を代表としてバックドリル加工の深さを算出するようにしてもよい。   In the above embodiment, the feed position P1 of the upper surface position of the printed circuit board 11 is detected for each through hole. However, if it is known that the variation of the upper surface position is small, a specific through hole The depth of the back drilling process may be calculated using the upper surface position as a representative.

また、以上の実施例においては、スピンドル２の駆動用モータに電流検出用の電源を供給することにより、スピンドル２側から深さ測定工具９を所定の電位に保つようにしたが、別な手段で測定工具９を所定の電位に保つようになっていてもよい。   In the above embodiment, the depth measuring tool 9 is maintained at a predetermined potential from the spindle 2 side by supplying a current detection power source to the drive motor of the spindle 2. The measuring tool 9 may be kept at a predetermined potential.

また、図２に示した深さ測定工具９では、中央部９２の径は一定としたが、先端部９１付近以外は小さくなっていてもよい。   In the depth measuring tool 9 shown in FIG. 2, the diameter of the central portion 92 is constant, but it may be small except in the vicinity of the distal end portion 91.

１：テーブル ２：スピンドル ３：テーブル水平駆動部 ４：スピンドル垂直駆動部
５：プレッシャフット ５：ブッシュ ７：ずれ検出部 ８：全体制御部
９：深さ測定工具 １０：記憶部 １１：プリント基板 １２：貫通穴
１３、１４、２４：内部配線層 １５、２２：上部外層端子、
１６、２３：下部外層端子 １７、２１：導電メッキ部 １８：回路用領域、
１９：検査用領域 ２０：検査用貫通穴 ２５：電源線 ２６：電流検出部
1: Table 2: Spindle 3: Table horizontal drive unit 4: Spindle vertical drive unit 5: Pressure foot 5: Bush 7: Deviation detection unit 8: Overall control unit 9: Depth measurement tool 10: Storage unit 11: Printed circuit board 12 : Through hole 13, 14, 24: Internal wiring layer 15, 22: Upper outer layer terminal,
16, 23: Lower outer layer terminals 17, 21: Conductive plating portion 18: Circuit area,
19: Inspection area 20: Inspection through hole 25: Power supply line 26: Current detector

Claims (2)

バックドリル加工された穴を有する基板を接地されているテーブルに載置し、前記バックドリル加工において導電メッキ部が除去された部分の径より小さく導電メッキ部が除去されていない部分の径より大きい径の接触部を備える工具であって導電性を有するものを前記基板のバックドリル加工された穴に挿入し、前記接触部が前記穴に残された導電メッキ部に接触して前記基板に形成された前記導電メッキ部と電気的に接続された検査用の穴を介して電流が流れ始める時点を検出し、当該検出時点に基づいてバックドリル加工の深さを検出することを特徴とするバックドリル加工の深さ測定方法。   A substrate having a back-drilled hole is placed on a grounded table and is smaller than the diameter of the portion where the conductive plating portion is removed in the back drilling and larger than the diameter of the portion where the conductive plating portion is not removed. A tool having a diameter contact portion and having conductivity is inserted into the back drilled hole of the substrate, and the contact portion contacts the conductive plating portion left in the hole and is formed on the substrate. Detecting a time point at which a current starts to flow through an inspection hole electrically connected to the conductive plating portion, and detecting a back drilling depth based on the detected time point. Drilling depth measurement method. 基板にドリルでバックドリル加工を行う場合には当該ドリルを保持し前記バックドリル加工において導電メッキ部が除去された部分の径より小さく導電メッキ部が除去されていない部分の径より大きい径の接触部を備える工具であって導電性を有するものを保持することができるスピンドルと、バックドリル加工された前記基板を載置するためのテーブルであって接地されているものと、前記スピンドルと前記テーブルを互いに水平方向に相対移動させる水平駆動部と、前記スピンドルと前記テーブルを互いに垂直方向に相対移動させる垂直駆動部と、前記スピンドルに保持された前記工具がバックドリル加工された穴に挿入されて前記接触部が前記穴に残された導電メッキ部に接触して前記基板に形成された前記導電メッキ部と電気的に接続された検査用の穴を介して流れる電流を検出する電流検出部と、前記水平駆動部と前記垂直駆動部を制御する全体制御部であって前記電流検出部での検出時点に基づいてバックドリル加工の深さを検出するものとを備えることを特徴とするバックドリル加工の深さ測定装置。
When back drilling is performed on a substrate by a drill, the diameter of the contact is smaller than the diameter of the portion where the conductive plating portion is removed and the conductive plating portion is not removed in the back drill processing. A spindle that can hold a conductive tool having a portion, a table for placing the back-drilled substrate and grounded, and the spindle and the table A horizontal driving unit for moving the spindle and the table relative to each other in a horizontal direction, a vertical driving unit for moving the spindle and the table relative to each other in a vertical direction, and the tool held by the spindle inserted into a back-drilled hole. The contact portion contacts the conductive plating portion left in the hole and is in electrical contact with the conductive plating portion formed on the substrate. A current detection unit for detecting a current flowing through the inspection hole, and an overall control unit for controlling the horizontal drive unit and the vertical drive unit, and back drill based on the detection time in the current detection unit A depth measuring device for back drilling, comprising: a device for detecting a processing depth.
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