JP2018014415A - Heat radiation structure - Google Patents
Heat radiation structure Download PDFInfo
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- JP2018014415A JP2018014415A JP2016143264A JP2016143264A JP2018014415A JP 2018014415 A JP2018014415 A JP 2018014415A JP 2016143264 A JP2016143264 A JP 2016143264A JP 2016143264 A JP2016143264 A JP 2016143264A JP 2018014415 A JP2018014415 A JP 2018014415A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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Abstract
Description
本発明は、放熱構造に関する。 The present invention relates to a heat dissipation structure.
電子基板に実装された電子部品は、電子部品の動作時に発熱することがある。そこで、電子部品の熱を放熱する放熱構造が提案されている（例えば、特許文献１参照）。 An electronic component mounted on an electronic board may generate heat during operation of the electronic component. Therefore, a heat dissipation structure that dissipates the heat of the electronic component has been proposed (see, for example, Patent Document 1).
特許文献１には、電子基板の一方の面に電子部品を実装し、電子基板の他方の面に冷却器を当接させる放熱構造が示されている。この放熱構造では、電子部品の熱を、電子基板を介して冷却器に伝達させて、電子部品の熱を放熱させる。 Patent Document 1 discloses a heat dissipation structure in which an electronic component is mounted on one surface of an electronic substrate, and a cooler is brought into contact with the other surface of the electronic substrate. In this heat dissipation structure, the heat of the electronic component is transferred to the cooler via the electronic substrate to dissipate the heat of the electronic component.
上述のような電子部品の熱を放熱する放熱構造において、放熱効率の向上が求められている。そこで、例えば図４に示す電子機器１００のように、電子部品の熱を、冷却器といった放熱部に、電子基板を介することなく伝達させる放熱構造が考えられる。
なお、以下に示す各図には、説明と理解を容易にするために、図中にＸＹＺ直交座標系を設けたが、これらは単に図中の向きを統一して説明するために設定したものであり、絶対的な座標を示すものではない。
In the heat dissipation structure that dissipates heat of the electronic component as described above, improvement in heat dissipation efficiency is required. Therefore, for example, as in the electronic device 100 illustrated in FIG. 4, a heat dissipation structure that transmits heat of the electronic component to a heat dissipation unit such as a cooler without passing through the electronic substrate is conceivable.
Each figure shown below is provided with an XYZ Cartesian coordinate system in the figure for ease of explanation and understanding, but these are simply set in order to explain the directions in a unified manner. It does not indicate absolute coordinates.
電子機器１００は、第１の電子部品１０、第２の電子部品２０、電子基板３０、ヒートシンク４０、放熱グリス５０、６０、および半田部７０を備える。 The electronic device 100 includes a first electronic component 10, a second electronic component 20, an electronic substrate 30, a heat sink 40, heat radiation grease 50 and 60, and a solder part 70.
第１の電子部品１０は、電子基板３０の他方の面（Ｙプラス方向側の面）にスルーホール実装される。具体的には、第１の電子部品１０は、電子基板３０の他方の面側に設けられ、本体１１と、本体１１の一方の面から伸びる２つの端子１２と、を備える。２つの端子１２のそれぞれは、電子基板３０に設けられた２つのスルーホールのそれぞれに挿通された状態で、半田部７０により電子基板３０に固着される。
一方、第２の電子部品２０は、電子基板３０の他方の面に表面実装される。
The first electronic component 10 is through-hole mounted on the other surface (the surface on the Y plus direction side) of the electronic substrate 30. Specifically, the first electronic component 10 is provided on the other surface side of the electronic substrate 30 and includes a main body 11 and two terminals 12 extending from one surface of the main body 11. Each of the two terminals 12 is fixed to the electronic substrate 30 by the solder portion 70 in a state of being inserted into each of two through holes provided in the electronic substrate 30.
On the other hand, the second electronic component 20 is surface-mounted on the other surface of the electronic substrate 30.
ヒートシンク４０は、電子基板３０の他方の面側に、電子基板３０との間に間隔を空けて設けられる。
ヒートシンク４０には、凹部４１が形成される。凹部４１には、第１の電子部品１０の本体１１が、凹部４１の壁部に当接しない状態で挿入される。凹部４１の壁部と本体１１との間には、放熱グリス５０が設けられる。
また、ヒートシンク４０と第２の電子部品２０との間には、放熱グリス６０が設けられる。
The heat sink 40 is provided on the other surface side of the electronic substrate 30 with a space from the electronic substrate 30.
A recess 41 is formed in the heat sink 40. The main body 11 of the first electronic component 10 is inserted into the recess 41 without contacting the wall portion of the recess 41. A heat dissipation grease 50 is provided between the wall portion of the recess 41 and the main body 11.
Further, a heat radiation grease 60 is provided between the heat sink 40 and the second electronic component 20.
以上の電子機器１００では、第１の電子部品１０の熱は、電子基板３０を介してではなく、放熱グリス５０を介してヒートシンク４０に伝達される。また、第２の電子部品２０の熱は、電子基板３０を介してではなく、放熱グリス６０を介してヒートシンク４０に伝達される。 In the electronic device 100 described above, the heat of the first electronic component 10 is transmitted to the heat sink 40 not via the electronic substrate 30 but via the heat dissipation grease 50. Further, the heat of the second electronic component 20 is transmitted to the heat sink 40 not via the electronic substrate 30 but via the heat radiation grease 60.
しかし、上述の電子機器１００では、凹部４１の体積分だけ、ヒートシンク４０の体積が小さくなる。このため、第１の電子部品１０の熱の放熱効率を十分には向上させることができないおそれがあった。 However, in the electronic device 100 described above, the volume of the heat sink 40 is reduced by the volume of the recess 41. For this reason, there is a possibility that the heat radiation efficiency of the first electronic component 10 cannot be sufficiently improved.
そこで、本発明は、上述の課題に鑑みてなされたものであり、電子部品の熱の放熱効率を十分に向上させる放熱構造を提供する。 Therefore, the present invention has been made in view of the above-described problems, and provides a heat dissipation structure that sufficiently improves the heat dissipation efficiency of electronic components.
本発明の１またはそれ以上の実施形態は、電子基板の一方の面に実装された電子部品の熱を放熱する放熱構造であって、前記電子基板の他方の面側に、前記電子基板との間に間隔を空けて設けられた放熱部と、前記電子部品の端子と前記放熱部との間に設けられた熱伝導部と、を備えることを特徴とする。 One or more embodiments of the present invention is a heat dissipation structure that dissipates heat of an electronic component mounted on one surface of an electronic substrate, and the other surface side of the electronic substrate is connected to the electronic substrate. It is characterized by comprising a heat dissipating part provided with a space in between, and a heat conducting part provided between the terminal of the electronic component and the heat dissipating part.
本発明の１またはそれ以上の実施形態によれば、電子部品の熱の放熱効率を十分に向上させることができる。 According to one or more embodiments of the present invention, the heat dissipation efficiency of electronic components can be sufficiently improved.
以下、本発明の実施の形態について図面を参照しながら説明する。なお、以下の実施形態における構成要素は適宜、既存の構成要素などとの置き換えが可能であり、また、他の既存の構成要素との組み合わせを含む様々なバリエーションが可能である。このため、以下の実施形態の記載をもって、特許請求の範囲に記載された発明の内容を限定するものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the constituent elements in the following embodiments can be appropriately replaced with existing constituent elements, and various variations including combinations with other existing constituent elements are possible. For this reason, the description of the following embodiments does not limit the contents of the invention described in the claims.
＜第１実施形態＞
図１を用いて、本発明の第１実施形態について説明する。
<First Embodiment>
A first embodiment of the present invention will be described with reference to FIG.
図１は、本発明による放熱構造を用いた電子機器１を示す側面図である。電子機器１は、図４に示した従来例に係る電子機器１００とは、第１の電子部品１０の代わりに第１の電子部品１０Ａを備える点と、ヒートシンク４０の代わりにヒートシンク４０Ａを備える点と、放熱グリス５０の代わりに放熱グリス５０Ａを備える点と、で異なっており、他の部分については同様の形態をしている。このため、電子機器１００と同様の形態をしている部分については、同一の符号を付して、その説明を省略する。 FIG. 1 is a side view showing an electronic apparatus 1 using a heat dissipation structure according to the present invention. The electronic device 1 is different from the electronic device 100 according to the conventional example shown in FIG. 4 in that the first electronic component 10 </ b> A is provided instead of the first electronic component 10 and the heat sink 40 </ b> A is provided instead of the heat sink 40. And the point which is equipped with the thermal radiation grease 50A instead of the thermal radiation grease 50, and the other part has the same form. For this reason, about the part which has the same form as the electronic device 100, the same code | symbol is attached | subjected and the description is abbreviate | omitted.
第１の電子部品１０Ａは、第１の電子部品１０と同様に、本体１１と、本体１１の一方の面から伸びる２つの端子１２と、を備える。これら２つの端子１２は、銅で構成される。
第１の電子部品１０Ａは、電子基板３０の一方の面（Ｙマイナス方向側の面）にスルーホール実装される。具体的には、第１の電子部品１０Ａは、電子基板３０の一方の面側に設けられ、２つの端子１２のそれぞれは、電子基板３０に設けられた２つのスルーホールのそれぞれを介して電子基板３０の他方の面側に突出する。端子１２のうち、電子基板３０の他方の面側に突出している部分は、半田部７０により電子基板３０に固着される。
なお、本実施形態では、図１に示すように、半田部７０は、端子１２のうち、電子基板３０の他方の面側に突出している部分を、全て覆っている。このため、放熱グリス５０Ａは、端子１２のうち、電子基板３０の他方の面側に突出している部分に、半田部７０を介して接することになる。
As with the first electronic component 10, the first electronic component 10 </ b> A includes a main body 11 and two terminals 12 extending from one surface of the main body 11. These two terminals 12 are made of copper.
The first electronic component 10 </ b> A is through-hole mounted on one surface (the surface on the Y minus direction side) of the electronic substrate 30. Specifically, the first electronic component 10 </ b> A is provided on one surface side of the electronic substrate 30, and each of the two terminals 12 is an electron via each of two through holes provided in the electronic substrate 30. It protrudes to the other surface side of the substrate 30. A portion of the terminal 12 that protrudes to the other surface side of the electronic substrate 30 is fixed to the electronic substrate 30 by the solder portion 70.
In the present embodiment, as shown in FIG. 1, the solder portion 70 covers all portions of the terminal 12 that protrude to the other surface side of the electronic substrate 30. For this reason, the heat dissipation grease 50 </ b> A comes into contact with the portion of the terminal 12 that protrudes to the other surface side of the electronic substrate 30 via the solder portion 70.
放熱部としてのヒートシンク４０Ａは、電子基板３０の他方の面側に、電子基板３０との間に間隔を空けて設けられる。なお、図４に示したヒートシンク４０には、凹部４１が形成されていたが、本実施形態に係るヒートシンク４０Ａには、ヒートシンク４０Ａの放熱特性に影響を与える第１の電子部品１０Ａの本体１１が、その壁部に当接しない状態で挿入されるような凹部４１は形成されない。 The heat sink 40 </ b> A as a heat radiating portion is provided on the other surface side of the electronic substrate 30 with a space between the electronic substrate 30. In addition, although the recessed part 41 was formed in the heat sink 40 shown in FIG. 4, the main body 11 of the first electronic component 10A that affects the heat dissipation characteristics of the heat sink 40A is included in the heat sink 40A according to the present embodiment. The concave portion 41 that is inserted without being in contact with the wall portion is not formed.
熱伝導部としての放熱グリス５０Ａは、端子１２とヒートシンク４０Ａとの間に設けられる。 The heat dissipation grease 50A as the heat conducting portion is provided between the terminal 12 and the heat sink 40A.
図２は、放熱グリス５０Ａの有無による第１の電子部品１０Ａの温度変化を示す図である。図２において、縦軸は、第１の電子部品１０Ａの温度を示し、横軸は、時間を示す。
また、図２において、時間０（ゼロ）は、第１の電子部品１０Ａに通電していない状態で第１の電子部品１０Ａの温度を上昇させて、第１の電子部品１０Ａの温度が１００度になったタイミングである。
FIG. 2 is a diagram illustrating a temperature change of the first electronic component 10A depending on the presence or absence of the heat dissipation grease 50A. In FIG. 2, the vertical axis indicates the temperature of the first electronic component 10A, and the horizontal axis indicates time.
In FIG. 2, at time 0 (zero), the temperature of the first electronic component 10A is raised to 100 ° C. by raising the temperature of the first electronic component 10A while the first electronic component 10A is not energized. This is the timing.
実線のグラフは、電子機器１において、放熱グリス５０Ａを設けた場合における第１の電子部品１０Ａの温度変化を示している。一方、一点鎖線のグラフは、電子機器１において、放熱グリス５０Ａを設けなかった場合における第１の電子部品１０Ａの温度変化を示している。
図２では、放熱グリス５０Ａを設けた場合、放熱グリス５０Ａを設けなかった場合と比べて、第１の電子部品１０Ａの温度が５００ｓｅｃ後には、約７度低くなっている。
The solid line graph shows the temperature change of the first electronic component 10 </ b> A when the heat dissipation grease 50 </ b> A is provided in the electronic device 1. On the other hand, the dashed-dotted line graph shows the temperature change of the first electronic component 10A when the electronic device 1 is not provided with the heat dissipation grease 50A.
In FIG. 2, when the heat dissipation grease 50A is provided, the temperature of the first electronic component 10A is about 7 degrees lower after 500 seconds than when the heat dissipation grease 50A is not provided.
以上のように、電子機器１は、電子基板３０の一方の面に第１の電子部品１０Ａを実装し、電子基板３０の他方の面にヒートシンク４０Ａを設ける。また、第１の電子部品１０Ａの端子１２のうち電子基板３０の他方の面側に突出している部分と、ヒートシンク４０Ａと、の間に放熱グリス５０Ａを設ける。このため、第１の電子部品１０Ａの熱を、端子１２および放熱グリス５０Ａを介してヒートシンク４０Ａに伝達することができる。
このため、第１の電子部品１０Ａの本体１１を挿入するための凹部４１（図４参照）が不要になる。したがって、ヒートシンク４０Ａの体積を確保することができるので、第１の電子部品１０Ａの熱の放熱効率を十分に向上させることができる。
また、第１の電子部品１０Ａとヒートシンク４０Ａとを、それぞれ電子基板３０の異なる面側に設けることができる。このため、電子部品とヒートシンクとを、本実施形態のようにそれぞれ電子基板３０の異なる面側に設ける場合と、図４に示したように電子基板３０の同一の面側に設ける場合と、を選択することができる。したがって、電子部品を含む回路の回路設計の自由度を、向上させることもできる。
As described above, in the electronic device 1, the first electronic component 10 </ b> A is mounted on one surface of the electronic substrate 30, and the heat sink 40 </ b> A is provided on the other surface of the electronic substrate 30. Further, a heat radiation grease 50A is provided between a portion of the terminal 12 of the first electronic component 10A that protrudes to the other surface side of the electronic substrate 30 and the heat sink 40A. For this reason, the heat of the first electronic component 10A can be transmitted to the heat sink 40A via the terminal 12 and the heat dissipation grease 50A.
For this reason, the recessed part 41 (refer FIG. 4) for inserting the main body 11 of 10 A of 1st electronic components becomes unnecessary. Therefore, since the volume of the heat sink 40A can be secured, the heat radiation efficiency of the first electronic component 10A can be sufficiently improved.
Further, the first electronic component 10 </ b> A and the heat sink 40 </ b> A can be provided on different surfaces of the electronic substrate 30, respectively. Therefore, when the electronic component and the heat sink are provided on different sides of the electronic substrate 30 as in the present embodiment, and when provided on the same surface side of the electronic substrate 30 as shown in FIG. You can choose. Therefore, the degree of freedom in circuit design of a circuit including electronic components can be improved.
また、電子機器１は、端子１２を、電子基板３０に設けられたスルーホールを介して、電子基板３０の他方の面側に突出させ、端子１２のうち、電子基板３０の他方の面側に突出している部分を、半田部７０により覆って、半田部７０を介して端子１２と放熱グリス５０Ａとが接するようにする。このため、いわゆるスルーホール実装された第１の電子部品１０Ａの熱を、ヒートシンク４０Ａに伝達することができる。 In addition, the electronic device 1 causes the terminal 12 to protrude to the other surface side of the electronic substrate 30 through a through hole provided in the electronic substrate 30, and to the other surface side of the electronic substrate 30 among the terminals 12. The protruding part is covered with the solder part 70 so that the terminal 12 and the heat dissipation grease 50A are in contact with each other through the solder part 70. For this reason, the heat of the first electronic component 10A mounted with a so-called through hole can be transmitted to the heat sink 40A.
また、電子機器１は、端子１２を銅で構成した。銅は、熱伝導率の高い物質であるため、第１の電子部品１０Ａの熱の放熱効率をさらに向上させることができる。 Moreover, the electronic device 1 comprised the terminal 12 with copper. Since copper is a substance having high thermal conductivity, the heat radiation efficiency of the first electronic component 10A can be further improved.
なお、本実施形態では、端子１２を、銅で構成した。しかし、これに限らず、端子１２を、例えば鋼といった芯材を、銅で覆って形成してもよい。 In the present embodiment, the terminal 12 is made of copper. However, the present invention is not limited to this, and the terminal 12 may be formed by covering a core material such as steel with copper.
また、本実施形態では、半田部７０により、端子１２のうち、電子基板３０の他方の面側に突出している部分を、全て覆った。しかし、これに限らず、端子１２のうち、電子基板３０の他方の面側に突出している部分に、半田部７０で覆われていない部分があってもよい。具体例としては、端子１２に半田付けを行った後に、端子１２の先端部をカットすることにより、端子１２の先端部が半田に覆われていない場合や電子基板３０からの離脱を防止するために、端子１２の折り曲げ処理を行なった後に、端子１２の先端部のみに半田付けを行なう場合がある。上記の例示では、端子１２のうち、電子基板３０の他方の面側に突出している部分であって、半田部７０に覆われていない部分は、半田部７０を介することなく放熱グリス５０Ａに直接接することになる。 In the present embodiment, the solder portion 70 covers all portions of the terminal 12 that protrude to the other surface side of the electronic substrate 30. However, the present invention is not limited to this, and a portion of the terminal 12 that protrudes toward the other surface of the electronic substrate 30 may be a portion that is not covered with the solder portion 70. As a specific example, after soldering the terminal 12, the tip of the terminal 12 is cut to prevent the tip of the terminal 12 from being covered with solder or from being detached from the electronic substrate 30. In addition, after the terminal 12 is bent, only the tip of the terminal 12 may be soldered. In the above example, the portion of the terminal 12 that protrudes to the other surface side of the electronic substrate 30 and is not covered by the solder portion 70 is directly connected to the heat dissipation grease 50 </ b> A without the solder portion 70 interposed therebetween. Will be in touch.
＜第２実施形態＞
図３を用いて、本発明の第２実施形態について説明する。
Second Embodiment
A second embodiment of the present invention will be described with reference to FIG.
図３は、本発明による放熱構造を用いた電子機器１Ａを示す側面図である。電子機器１Ａは、図１に示した本発明の第１実施形態に係る電子機器１とは、第１の電子部品１０Ａの代わりに第１の電子部品１０Ｂを備える点と、電子基板３０に貫通孔８０が形成されている点と、で異なっており、他の部分については同様の形態をしている。このため、電子機器１と同様の形態をしている部分については、同一の符号を付して、その説明を省略する。 FIG. 3 is a side view showing an electronic apparatus 1A using the heat dissipation structure according to the present invention. The electronic device 1A is different from the electronic device 1 according to the first embodiment of the present invention shown in FIG. 1 in that the electronic device 1A includes a first electronic component 10B instead of the first electronic component 10A, and penetrates the electronic substrate 30. The difference is that the hole 80 is formed, and the other parts have the same form. For this reason, about the part which has the same form as the electronic device 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.
第１の電子部品１０Ｂは、本体１１Ａと、本体１１Ａの一方の面から伸びる端子１２Ａと、を備える。端子１２Ａは、銅で構成される。
第１の電子部品１０Ｂは、電子基板３０の一方の面（Ｙマイナス方向側の面）に表面実装される。具体的には、第１の電子部品１０Ｂは、電子基板３０の一方の面側に設けられ、端子１２は、電子基板３０の一方の面に当接し、半田部７０により電子基板３０に固着される。
The first electronic component 10B includes a main body 11A and a terminal 12A extending from one surface of the main body 11A. The terminal 12A is made of copper.
The first electronic component 10B is surface-mounted on one surface (the surface on the Y minus direction side) of the electronic substrate 30. Specifically, the first electronic component 10 </ b> B is provided on one surface side of the electronic substrate 30, and the terminal 12 abuts on one surface of the electronic substrate 30 and is fixed to the electronic substrate 30 by the solder portion 70. The
貫通孔８０は、電子基板３０を貫通して形成される。貫通孔８０の孔壁には、孔壁熱伝導部８１が、電子基板３０の一方の面から電子基板３０の他方の面まで延在して設けられる。孔壁熱伝導部８１は、熱伝導性を有しており、例えば銅で構成される。 The through hole 80 is formed through the electronic substrate 30. A hole wall heat conducting portion 81 is provided on the hole wall of the through hole 80 so as to extend from one surface of the electronic substrate 30 to the other surface of the electronic substrate 30. The hole wall heat conduction part 81 has heat conductivity and is made of, for example, copper.
孔壁熱伝導部８１のうち、電子基板３０の一方の面側の部分には端子１２Ａが接し、電子基板３０の他方の面側の部分には放熱グリス５０Ａが接する。 Of the hole wall heat conducting portion 81, the terminal 12 </ b> A is in contact with a portion on one surface side of the electronic substrate 30, and the heat radiation grease 50 </ b> A is in contact with a portion on the other surface side of the electronic substrate 30.
以上のように、電子機器１Ａは、電子基板３０の一方の面に第１の電子部品１０Ｂを実装し、電子基板３０の他方の面にヒートシンク４０Ａを設ける。また、電子基板３０に貫通孔８０を形成し、貫通孔８０の孔壁に、熱伝導性を有する孔壁熱伝導部８１を、電子基板３０の一方の面から電子基板３０の他方の面まで延在して設ける。また、端子１２Ａは、孔壁熱伝導部８１のうち、電子基板３０の一方の面側の部分に接し、放熱グリス５０Ａは、孔壁熱伝導部８１のうち、電子基板３０の他方の面側の部分に接する。このため、第１の電子部品１０Ｂの端子１２Ａと、ヒートシンク４０Ａと、の間には、孔壁熱伝導部８１を介して端子１２Ａに接している放熱グリス５０Ａが設けられる。したがって、第１の電子部品１０Ｂの熱を、端子１２Ａ、孔壁熱伝導部８１、および放熱グリス５０Ａを介してヒートシンク４０Ａに伝達することができる。
このため、第１の電子部品１０Ｂの本体１１Ａを挿入するための凹部４１（図４参照）が不要になる。したがって、ヒートシンク４０Ａの体積を確保することができるので、第１の電子部品１０Ｂの熱の放熱効率を十分に向上させることができる。
また、第１の電子部品１０Ｂとヒートシンク４０Ａとを、それぞれ電子基板３０の異なる面側に設けることができる。このため、電子部品とヒートシンクとを、本実施形態のようにそれぞれ電子基板３０の異なる面側に設ける場合と、図４に示したように電子基板３０の同一の面側に設ける場合と、を選択することができる。したがって、電子部品を含む回路の回路設計の自由度を、向上させることもできる。
As described above, in the electronic apparatus 1 </ b> A, the first electronic component 10 </ b> B is mounted on one surface of the electronic substrate 30, and the heat sink 40 </ b> A is provided on the other surface of the electronic substrate 30. Further, a through hole 80 is formed in the electronic substrate 30, and a hole wall heat conducting portion 81 having thermal conductivity is formed on the hole wall of the through hole 80 from one surface of the electronic substrate 30 to the other surface of the electronic substrate 30. Extend and provide. The terminal 12A is in contact with a portion of the hole wall heat conducting portion 81 on one surface side of the electronic substrate 30, and the heat dissipation grease 50A is the hole wall heat conducting portion 81 of the other surface side of the electronic substrate 30. It touches the part. For this reason, between the terminal 12A of the 1st electronic component 10B and the heat sink 40A, the thermal radiation grease 50A which is in contact with the terminal 12A through the hole wall heat conduction part 81 is provided. Therefore, the heat of the first electronic component 10B can be transmitted to the heat sink 40A via the terminal 12A, the hole wall heat conducting portion 81, and the heat dissipation grease 50A.
For this reason, the recessed part 41 (refer FIG. 4) for inserting the main body 11A of the 1st electronic component 10B becomes unnecessary. Therefore, since the volume of the heat sink 40A can be ensured, the heat radiation efficiency of the first electronic component 10B can be sufficiently improved.
Further, the first electronic component 10B and the heat sink 40A can be provided on different surfaces of the electronic substrate 30, respectively. Therefore, when the electronic component and the heat sink are provided on different sides of the electronic substrate 30 as in the present embodiment, and when provided on the same surface side of the electronic substrate 30 as shown in FIG. You can choose. Therefore, the degree of freedom in circuit design of a circuit including electronic components can be improved.
また、電子機器１Ａは、端子１２Ａを、電子基板３０の一方の面に当接させるとともに、孔壁熱伝導部８１および放熱グリス５０Ａを介してヒートシンク４０Ａに接するようにする。このため、いわゆる表面実装された第１の電子部品１０Ｂの熱を、ヒートシンク４０Ａに伝達することができる。 In addition, the electronic device 1A makes the terminal 12A abut on one surface of the electronic substrate 30 and is in contact with the heat sink 40A via the hole wall heat conduction portion 81 and the heat radiation grease 50A. For this reason, the heat of the so-called surface-mounted first electronic component 10B can be transmitted to the heat sink 40A.
また、電子機器１Ａは、端子１２Ａを銅で構成した。銅は、熱伝導率の高い物質であるため、第１の電子部品１０Ｂの熱の放熱効率をさらに向上させることができる。 In the electronic apparatus 1A, the terminal 12A is made of copper. Since copper is a substance having a high thermal conductivity, the heat radiation efficiency of the first electronic component 10B can be further improved.
なお、本実施形態では、端子１２Ａを、銅で構成した。しかし、これに限らず、端子１２Ａを、例えば鋼といった芯材を、銅で覆って形成してもよい。 In the present embodiment, the terminal 12A is made of copper. However, the present invention is not limited thereto, and the terminal 12A may be formed by covering a core material such as steel with copper.
以上、この発明の実施形態につき、図面を参照して詳述してきたが、具体的な構成はこの実施形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計なども含まれる。 The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and includes a design that does not depart from the gist of the present invention.
１、１Ａ、１００ 電子機器
１０、１０Ａ、１０Ｂ 第１の電子部品
１１、１１Ａ 本体
１２、１２Ａ 端子
２０ 第２の電子部品
３０ 電子基板
４０、４０Ａ ヒートシンク（放熱部）
４１ 凹部
５０、５０Ａ、６０ 放熱グリス（熱伝導部）
７０ 半田部
８０ 貫通孔
８１ 孔壁熱伝導部
1, 1A, 100 Electronic device 10, 10A, 10B First electronic component 11, 11A Main body 12, 12A Terminal 20 Second electronic component 30 Electronic substrate 40, 40A Heat sink (heat dissipation part)
41 Concave part 50, 50A, 60 Radiation grease (heat conduction part)
70 Solder part 80 Through hole 81 Hole wall heat conduction part
Claims (5)
前記電子基板の他方の面側に、前記電子基板との間に間隔を空けて設けられた放熱部と、
前記電子部品の端子と前記放熱部との間に設けられた熱伝導部と、を備えることを特徴とする放熱構造。 A heat dissipation structure that dissipates heat from an electronic component mounted on one surface of an electronic board,
On the other surface side of the electronic substrate, a heat dissipating part provided with a space between the electronic substrate,
A heat dissipation structure, comprising: a heat conducting portion provided between the terminal of the electronic component and the heat dissipation portion.
前記電子部品の端子は、前記貫通孔を介して前記電子基板の他方の面側に突出し、
前記熱伝導部は、前記電子部品の端子のうち、前記電子基板の他方の面側に突出している部分に接することを特徴とする請求項１に記載の放熱構造。 The electronic board is provided with a through-hole penetrating the electronic board,
The terminal of the electronic component protrudes to the other surface side of the electronic substrate through the through hole,
2. The heat dissipation structure according to claim 1, wherein the heat conducting portion is in contact with a portion of the terminal of the electronic component that protrudes to the other surface side of the electronic substrate.
前記熱伝導部は、前記半田部を介して前記電子部品の端子に接することを特徴とする請求項２に記載の放熱構造。 Of the terminals of the electronic component, a portion protruding to the other surface side of the electronic substrate is fixed to the electronic substrate by a solder portion,
The heat dissipation structure according to claim 2, wherein the heat conducting portion is in contact with a terminal of the electronic component via the solder portion.
前記貫通孔の孔壁には、熱伝導性を有する孔壁熱伝導部が、前記電子基板の一方の面から前記電子基板の他方の面まで延在して設けられ、
前記電子部品の端子は、前記孔壁熱伝導部のうち、前記電子基板の一方の面側の部分に接し、
前記熱伝導部は、前記孔壁熱伝導部のうち、前記電子基板の他方の面側の部分に接することを特徴とする請求項１に記載の放熱構造。 The electronic board is provided with a through-hole penetrating the electronic board,
The hole wall of the through hole is provided with a hole wall heat conducting portion having thermal conductivity extending from one surface of the electronic substrate to the other surface of the electronic substrate,
The terminal of the electronic component is in contact with a part on one surface side of the electronic substrate in the hole wall heat conducting portion,
2. The heat dissipation structure according to claim 1, wherein the heat conducting portion is in contact with a portion of the hole wall heat conducting portion on the other surface side of the electronic substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2016143264A JP2018014415A (en) | 2016-07-21 | 2016-07-21 | Heat radiation structure |
| PCT/JP2017/015568 WO2018016144A1 (en) | 2016-07-21 | 2017-04-18 | Heat dissipating structure |
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| JP2016143264A JP2018014415A (en) | 2016-07-21 | 2016-07-21 | Heat radiation structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220377931A1 (en) * | 2019-11-13 | 2022-11-24 | Lg Innotek Co., Ltd. | Converter |
| US11946657B2 (en) | 2021-03-30 | 2024-04-02 | Daikin Industries, Ltd. | Electric component and refrigeration apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001068607A (en) * | 1999-08-31 | 2001-03-16 | Hitachi Ltd | Cooling structure for electronic component |
| US7176707B1 (en) * | 2006-02-23 | 2007-02-13 | Lockheed Martin Corporation | Back side component placement and bonding |
| WO2015076050A1 (en) * | 2013-11-20 | 2015-05-28 | 日立オートモティブシステムズ株式会社 | Electronic control apparatus mounting structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03128965U (en) * | 1990-04-11 | 1991-12-25 | ||
| JP4344753B2 (en) * | 2007-02-22 | 2009-10-14 | シークス株式会社 | Electronic component mounting method on circuit board |
-
2016
- 2016-07-21 JP JP2016143264A patent/JP2018014415A/en active Pending
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2017
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001068607A (en) * | 1999-08-31 | 2001-03-16 | Hitachi Ltd | Cooling structure for electronic component |
| US7176707B1 (en) * | 2006-02-23 | 2007-02-13 | Lockheed Martin Corporation | Back side component placement and bonding |
| WO2015076050A1 (en) * | 2013-11-20 | 2015-05-28 | 日立オートモティブシステムズ株式会社 | Electronic control apparatus mounting structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220377931A1 (en) * | 2019-11-13 | 2022-11-24 | Lg Innotek Co., Ltd. | Converter |
| US11946657B2 (en) | 2021-03-30 | 2024-04-02 | Daikin Industries, Ltd. | Electric component and refrigeration apparatus |
| EP4318570A4 (en) * | 2021-03-30 | 2024-10-09 | Daikin Ind Ltd | Electrical component and refrigeration device |
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