JP2017527780A5 - - Google Patents

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Publication number
JP2017527780A5
JP2017527780A5 JP2016575210A JP2016575210A JP2017527780A5 JP 2017527780 A5 JP2017527780 A5 JP 2017527780A5 JP 2016575210 A JP2016575210 A JP 2016575210A JP 2016575210 A JP2016575210 A JP 2016575210A JP 2017527780 A5 JP2017527780 A5 JP 2017527780A5
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Japan
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different
aperture
collection
images
wafer
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JP2016575210A
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Japanese (ja)
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JP2017527780A (ja
JP6652511B2 (ja
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Priority claimed from US14/749,564 external-priority patent/US9709510B2/en
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JP2016575210A 2014-06-26 2015-06-26 ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定 Active JP6652511B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201462017264P 2014-06-26 2014-06-26
US62/017,264 2014-06-26
US201562111402P 2015-02-03 2015-02-03
US62/111,402 2015-02-03
US14/749,564 2015-06-24
US14/749,564 US9709510B2 (en) 2014-06-26 2015-06-24 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
PCT/US2015/038115 WO2015200856A1 (en) 2014-06-26 2015-06-26 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection

Publications (3)

Publication Number Publication Date
JP2017527780A JP2017527780A (ja) 2017-09-21
JP2017527780A5 true JP2017527780A5 (cg-RX-API-DMAC7.html) 2018-07-26
JP6652511B2 JP6652511B2 (ja) 2020-02-26

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JP2016575210A Active JP6652511B2 (ja) 2014-06-26 2015-06-26 ウェハ検査中に集光アパーチャ内に位置付けられる光学要素の構成の決定

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US (2) US9709510B2 (cg-RX-API-DMAC7.html)
JP (1) JP6652511B2 (cg-RX-API-DMAC7.html)
KR (1) KR102269512B1 (cg-RX-API-DMAC7.html)
CN (2) CN106415249B (cg-RX-API-DMAC7.html)
IL (1) IL248647B (cg-RX-API-DMAC7.html)
WO (1) WO2015200856A1 (cg-RX-API-DMAC7.html)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10062156B2 (en) * 2016-02-25 2018-08-28 Kla-Tencor Corporation Method and system for detecting defects on a substrate
WO2018096526A1 (en) * 2016-11-23 2018-05-31 Nova Measuring Instruments Ltd. Optical system and method for measuring parameters of patterned structures in microelectronic devices
US10429315B2 (en) * 2017-07-18 2019-10-01 Samsung Electronics Co., Ltd. Imaging apparatus and imaging method
JP7115826B2 (ja) * 2017-07-18 2022-08-09 三星電子株式会社 撮像装置および撮像方法
CN109425619B (zh) * 2017-08-31 2021-12-28 深圳中科飞测科技股份有限公司 光学测量系统及方法
CN109425618B (zh) * 2017-08-31 2021-12-28 深圳中科飞测科技股份有限公司 光学测量系统及方法
US10607119B2 (en) * 2017-09-06 2020-03-31 Kla-Tencor Corp. Unified neural network for defect detection and classification
WO2019099285A1 (en) * 2017-11-15 2019-05-23 Corning Incorporated Methods and apparatus for detecting surface defects on glass sheets
US11067389B2 (en) 2018-03-13 2021-07-20 Kla Corporation Overlay metrology system and method
JP7144605B2 (ja) 2018-10-12 2022-09-29 エーエスエムエル ネザーランズ ビー．ブイ． アライメントセンサの検出システム
US10902582B2 (en) * 2019-01-17 2021-01-26 Applied Materials Israel, Ltd. Computerized system and method for obtaining information about a region of an object
US11815470B2 (en) 2019-01-17 2023-11-14 Applied Materials Israel, Ltd. Multi-perspective wafer analysis
CN110006684A (zh) * 2019-03-13 2019-07-12 广州金域医学检验中心有限公司 数字病理切片的生成系统和方法
JP7236170B2 (ja) * 2019-03-29 2023-03-09 国立大学法人大阪大学 光検出装置、光検出方法、光検出装置の設計方法、試料分類方法、及び、不良検出方法
JP7261903B2 (ja) * 2019-05-06 2023-04-20 エーエスエムエル ネザーランズ ビー．ブイ． 暗視野顕微鏡
US10921261B2 (en) 2019-05-09 2021-02-16 Kla Corporation Strontium tetraborate as optical coating material
US11011366B2 (en) 2019-06-06 2021-05-18 Kla Corporation Broadband ultraviolet illumination sources
US11255797B2 (en) 2019-07-09 2022-02-22 Kla Corporation Strontium tetraborate as optical glass material
CN114616657A (zh) 2019-11-04 2022-06-10 东京毅力科创株式会社 用于校准多个晶圆检查系统(wis)模块的系统和方法
US11624607B2 (en) 2020-01-06 2023-04-11 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
JP7671558B2 (ja) 2020-03-10 2025-05-02 東京エレクトロン株式会社 トラックシステムに統合するための長波赤外線熱センサ
US11738363B2 (en) 2021-06-07 2023-08-29 Tokyo Electron Limited Bath systems and methods thereof
US12488452B2 (en) 2021-06-16 2025-12-02 Tokyo Electron Limited Wafer bath imaging
US12072606B2 (en) 2021-07-30 2024-08-27 Kla Corporation Protective coating for nonlinear optical crystal
KR102695451B1 (ko) * 2021-12-03 2024-08-23 참엔지니어링(주) 하전입자를 이용한 시료 처리 장치
US11899338B2 (en) 2021-12-11 2024-02-13 Kla Corporation Deep ultraviolet laser using strontium tetraborate for frequency conversion
IL317785A (en) * 2022-09-13 2025-02-01 Asml Netherlands Bv The metrology method and the associated metrology instrument
EP4339703A1 (en) * 2022-09-13 2024-03-20 ASML Netherlands B.V. Metrology method and associated metrology device
US20250383294A1 (en) * 2024-06-18 2025-12-18 Kla Corporation Speckle noise reduction using pupil masks

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7957066B2 (en) * 2003-02-21 2011-06-07 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US7041998B2 (en) 2003-03-24 2006-05-09 Photon Dynamics, Inc. Method and apparatus for high-throughput inspection of large flat patterned media using dynamically programmable optical spatial filtering
US20060012781A1 (en) 2004-07-14 2006-01-19 Negevtech Ltd. Programmable spatial filter for wafer inspection
WO2006091782A1 (en) * 2005-02-25 2006-08-31 Accent Optical Technologies, Inc. Apparatus and method for enhanced critical dimension scatterometry
JP4625716B2 (ja) * 2005-05-23 2011-02-02 株式会社日立ハイテクノロジーズ 欠陥検査装置及び欠陥検査方法
US7345825B2 (en) * 2005-06-30 2008-03-18 Kla-Tencor Technologies Corporation Beam delivery system for laser dark-field illumination in a catadioptric optical system
US7345754B1 (en) 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
KR101422256B1 (ko) * 2009-06-19 2014-07-22 케이엘에이-텐코어 코오포레이션 극자외선 마스크 블랭크들상의 결함들을 검출하기 위한 검사 시스템들 및 방법들
KR20110055787A (ko) 2009-11-20 2011-05-26 재단법인 서울테크노파크 레이저를 이용한 접합웨이퍼 검사장치
NL2007765A (en) * 2010-11-12 2012-05-15 Asml Netherlands Bv Metrology method and inspection apparatus, lithographic system and device manufacturing method.
IL217843A (en) * 2011-02-11 2016-11-30 Asml Netherlands Bv A system and method for testing, a lithographic system, a cell for lithographic processing, and a method for producing a device
WO2012126684A1 (en) * 2011-03-24 2012-09-27 Asml Netherlands B.V. Substrate and patterning device for use in metrology, metrology method and device manufacturing method
JP5898322B2 (ja) * 2011-10-12 2016-04-06 ベンタナ メディカル システムズ， インコーポレイテッド 多焦点干渉計画像取得
US8614790B2 (en) * 2011-12-12 2013-12-24 Applied Materials Israel, Ltd. Optical system and method for inspection of patterned samples
EP2823288B1 (en) * 2012-03-07 2021-05-05 KLA-Tencor Corporation Wafer and reticle inspection systems and method for selecting illumination pupil configurations
NL2010401A (en) * 2012-03-27 2013-09-30 Asml Netherlands Bv Metrology method and apparatus, lithographic system and device manufacturing method.
US8896827B2 (en) 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools
KR101442792B1 (ko) 2012-08-31 2014-09-23 (주)유텍시스템 사파이어 웨이퍼의 검사 방법
US9075027B2 (en) * 2012-11-21 2015-07-07 Kla-Tencor Corporation Apparatus and methods for detecting defects in vertical memory
US9091650B2 (en) * 2012-11-27 2015-07-28 Kla-Tencor Corporation Apodization for pupil imaging scatterometry
US9726617B2 (en) * 2013-06-04 2017-08-08 Kla-Tencor Corporation Apparatus and methods for finding a best aperture and mode to enhance defect detection

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