JP2017525834A - 透過性シロキサン封入剤及び接着剤 - Google Patents
透過性シロキサン封入剤及び接着剤 Download PDFInfo
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- JP2017525834A JP2017525834A JP2017518605A JP2017518605A JP2017525834A JP 2017525834 A JP2017525834 A JP 2017525834A JP 2017518605 A JP2017518605 A JP 2017518605A JP 2017518605 A JP2017518605 A JP 2017518605A JP 2017525834 A JP2017525834 A JP 2017525834A
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- YBNBOGKRCOCJHH-UHFFFAOYSA-N hydroxy-[4-[hydroxy(dimethyl)silyl]phenyl]-dimethylsilane Chemical compound C[Si](C)(O)C1=CC=C([Si](C)(C)O)C=C1 YBNBOGKRCOCJHH-UHFFFAOYSA-N 0.000 description 1
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- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- 239000012279 sodium borohydride Substances 0.000 description 1
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- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
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- 238000007725 thermal activation Methods 0.000 description 1
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- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 1
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- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
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- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- RYINGNAZWSKAII-UHFFFAOYSA-N triethoxy-[3-(1h-imidazol-2-yl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCC1=NC=CN1 RYINGNAZWSKAII-UHFFFAOYSA-N 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- VQTPBGMQDVXUBG-UHFFFAOYSA-N triethoxy-[3-[(3-methyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(C)COC1 VQTPBGMQDVXUBG-UHFFFAOYSA-N 0.000 description 1
- OKMFHWDLPIWPOX-UHFFFAOYSA-N trimethoxy(1-trimethoxysilylpropan-2-yl)silane Chemical compound CO[Si](OC)(OC)CC(C)[Si](OC)(OC)OC OKMFHWDLPIWPOX-UHFFFAOYSA-N 0.000 description 1
- JPMBLOQPQSYOMC-UHFFFAOYSA-N trimethoxy(3-methoxypropyl)silane Chemical compound COCCC[Si](OC)(OC)OC JPMBLOQPQSYOMC-UHFFFAOYSA-N 0.000 description 1
- LQASLKRKZDJCBO-UHFFFAOYSA-N trimethoxy(3-trimethoxysilylpropyl)silane Chemical compound CO[Si](OC)(OC)CCC[Si](OC)(OC)OC LQASLKRKZDJCBO-UHFFFAOYSA-N 0.000 description 1
- OTRIBZPALGOVNZ-UHFFFAOYSA-N trimethoxy(4-trimethoxysilylbutyl)silane Chemical compound CO[Si](OC)(OC)CCCC[Si](OC)(OC)OC OTRIBZPALGOVNZ-UHFFFAOYSA-N 0.000 description 1
- MAFPECYMNWKRHR-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylpentyl)silane Chemical compound CO[Si](OC)(OC)CCCCC[Si](OC)(OC)OC MAFPECYMNWKRHR-UHFFFAOYSA-N 0.000 description 1
- BHZKBFGLZZRETK-UHFFFAOYSA-N trimethoxy(phenanthren-9-yl)silane Chemical compound C1=CC=C2C([Si](OC)(OC)OC)=CC3=CC=CC=C3C2=C1 BHZKBFGLZZRETK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000003809 water extraction Methods 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7706—Aluminates
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
Description
SiR1aR24−a
ここで
aは1〜3であり、
R1は反応性基であり、
R2はアルキル基又はアリール基である。
SiR3bR4cR54−(b+c)
ここで
R3は架橋官能基であり、
R4は反応性基であり、
R5はアルキル基又はアリール基であり、
b=1〜2、c=1〜(4−b)である。
SiR9fR10g
ここで
R9は反応性基であり、
f=1〜4、及び
R10はアルキル又はアリール基であり、
g=4−fである。
シロキサンポリマーvii:撹拌棒及び還流冷却器を備えた250mL丸底フラスコに、ジイソブチルシランジオール(18.6g、60mol%)及び2−(3,4−エポキシシクロヘキシル)エチル]トリメトキシシラン(17.32g、40mol%)。フラスコを窒素雰囲気下で80℃に加熱し、メタノール1mLに溶解した水酸化バリウム一水和物0.019gをシラン混合物に滴下した。アルコキシシランと反応したジフェニルシランジオールの間、シラン混合物を80℃で30分間攪拌した。30分後、形成されたメタノールを真空下で蒸発させた。。シロキサンポリマーは75mPasの粘度及び710のMwを有していた。
メタノール中のジフェニルシランジオール(100.0g、0.46mol)、3−(トリメトキシシリル)プロピルメタクリレート(62.6g、0.25mol)、メチルトリメトキシシラン(17.2g、0.13mol)及びBaO(0.1g)を500mLフラスコに入れ、1時間。揮発性物質を減圧下で蒸発させ、透明な樹脂を得た。
実施例1から得られたポリマー樹脂25gをアセトン50gに溶解した。溶液が濁るまで0.01M HClを添加した。撹拌を室温で8時間続けた。過剰の水を加えてポリマーを沈殿させ、その後、得られたポリマーを分離し、乾燥させた。ポリマーを30gのメチルtert−ブチルエーテル(MTBE)に溶解し、5gのヘキサメチルジシロキサン、続いて0.05gのピリジン塩酸塩を添加した。撹拌を室温で24時間続けた。未反応成分を減圧留去し、得られた樹脂をMTBE水抽出法で洗浄した。溶媒を減圧下で蒸発させ、透明な樹脂(22.9g)を得た。
以下の組成物の例は、例示のために与えられたものであり、本発明を限定するものではない。
比較例6、高屈折率材料:実施例X1に記載したように調製した高屈折率ポリマー樹脂8.6gを、固体を有する1,2−プロパンジオールモノメチルエーテルアセテート(PGMEA)中のZrO 2ナノ粒子溶液5.7gとブレンドした50%の含有量。接着促進剤としてオリゴマー3−メタクリルオキシプロピルトリメトキシシラン0.4g、界面活性剤(BYK Chemie製BYK−307)20gを溶液に添加した。この溶液に、光開始剤(DarocuR1173、BASF製)0.26gを加えた。
得られた材料を100mmのシリコンウェハ上に2000rpmでスピンコートした。このフィルムをホットプレート上で80℃5分で焼き付け、3000mJ/cm2の線量でUV硬化させた。屈折率は、ポリマー樹脂とZrO 2ナノ粒子の重量比を変えることによって調整した。
Claims (81)
- 接着剤又は封入剤のための組成物であって、
分子量が300〜150,000g/molであり、5rpm粘度計における25℃での粘度が1000〜100000mPa・secであるシロキサンポリマーと、
紫外線照射時にシロキサンポリマーの硬化を促進する硬化剤と
を含み、
前記組成物は、可視スペクトルにおいて、1mm以下の厚さで95%以上の光透過率を有する可視光に対して透過性であり、
シロキサンポリマーは、ヒドロシリル化なしで形成され、その中にSiに結合した全ての基に比べて5モル%未満のSi−OH基を有し、Si−H結合を実質的に有さない材料である、組成物。 - 1ミクロン以下の平均粒子サイズを有する粒子をさらに含む、請求項1に記載の組成物。
- 平均粒径が400nm未満である、請求項1又は2に記載の組成物。
- 前記平均粒径が100nm未満である、請求項1〜3のいずれか一項に記載の組成物。
- 硬化剤が光開始剤である、請求項1〜4のいずれか一項に記載の組成物。
- シロキサンポリマーが2モル%未満のSi−OH基を有する、請求項1〜5のいずれか一項に記載の組成物。
- シロキサンポリマーが1モル%未満のSi−OH基を有する、請求項1〜6のいずれか一項に記載の組成物。
- シロキサンポリマーがSi−OH基を実質的に有さない、請求項1〜7のいずれか一項に記載の組成物。
- シロキサンポリマーがSi−H基を実質的に有さない、請求項1〜8のいずれか一項に記載の組成物。
- シロキサンポリマーがSi−OH基を有さない、請求項1〜9のいずれか一項に記載の組成物。
- 前記シロキサンポリマーが、シロキサン主鎖中のSiに結合したアリール又はアルキル有機基を有する、請求項1〜10のいずれか一項に記載の組成物。
- シロキサンポリマーがアリールを有するが、シロキサン主鎖中のSiに結合したアルキル基を有さない、請求項1〜11のいずれか一項に記載の組成物。
- 波長632.8nmで1.30〜1.45の屈折率を有する、請求項1〜12のいずれか一項に記載の組成物。
- 632.8nmの波長で1.55〜1.95の屈折率を有する、請求項1〜13のいずれか一項に記載の組成物。
- 波長632.8nmにおいて1.55〜1.85の屈折率を有する、請求項1〜14のいずれか一項に記載の組成物。
- 632.8nmの波長で1.6〜1.8の屈折率を有する、請求項1〜15のいずれか一項に記載の組成物。
- UV光により硬化された場合、4%未満の質量損失を有するであろう、請求項1〜16のいずれか一項に記載の組成物。
- UV光で硬化した場合、2%未満の質量損失を有するであろう、請求項1〜17のいずれか一項に記載の組成物。
- UV光により硬化された場合、1%未満の質量損失を有するであろう、請求項1〜18のいずれか一項に記載の組成物。
- 基板上に形成されたシロキサンポリマーフィルムであって、
可視光線透過率が95%以上で可視光線に対して透過性を有し、Si−OH基含有量が5モル%未満であるUV硬化型シロキサンポリマーフィルムが基板上に保持されたものSiに結合した基、Si−H結合を実質的に有さない、フィルム。 - 1ミクロン未満の平均粒径を有するシロキサンポリマーフィルム内の粒子をさらに含む、請求項20に記載のフィルム。
- 632.8nmの波長で1.3〜1.45の屈折率を有する、請求項20又は21に記載のフィルム。
- 632.8nm波長で1.4〜1.4545の屈折率を有する、請求項20〜22のいずれか一項に記載のフィルム。
- 波長632.8nmで1.58〜1.9545の屈折率を有する、請求項20〜23のいずれか一項に記載のフィルム。
- 波長632.8nmで1.65〜1.85の屈折率を有する、請求項20〜24のいずれか一項に記載のフィルム。
- 632.8nmの波長で1.65以上の屈折率を有する、請求項20〜25のいずれか一項に記載のフィルム。
- 632.8nm波長で1.45未満の屈折率を有する、請求項20〜26のいずれか一項に記載のフィルム。
- 632.8nmの波長で1.4未満の屈折率を有する、請求項20〜27のいずれか一項に記載のフィルム。
- 200℃の熱を72時間印加した後、可視スペクトルにおける光透過率の低下が5%未満である、請求項20〜28のいずれか一項に記載のフィルム。
- 200℃の熱を500時間印加した後、可視スペクトルにおける光透過率の低下が5%未満である、請求項20〜29のいずれか一項に記載のフィルム。
- 100,000mJの水銀UVランプ露光後、可視スペクトルにおける光透過率の低下が5%未満である、請求項20〜30のいずれか一項に記載のフィルム。
- 100,000,000mJの水銀UVランプ露光後、可視スペクトルにおける光透過率の低下が5%未満である、請求項20〜31のいずれか一項に記載のフィルム。
- 100,000mJの水銀UVランプ暴露及び150℃で72時間の熱印加後、可視スペクトルにおける光透過率の低下が5%未満である、請求項20〜32のいずれか一項に記載のフィルム。
- 同時に10,000,000mJの365nmのUV波長暴露と150℃での72時間の加熱の後に、可視スペクトルにおける光透過率の低下が5%未満である、請求項20〜33のいずれか一項に記載のフィルム。
- 前記フィルムが0.01未満の光学複屈折を有する、請求項20〜34のいずれか一項に記載のフィルム。
- 少なくとも200℃に加熱した場合に2%未満の質量損失を有するように熱的に安定である、請求項20〜35のいずれか一項に記載のフィルム。
- 少なくとも300℃に加熱した場合に2%未満の質量損失を有するように熱的に安定である、請求項20〜36のいずれか一項に記載のフィルム。
- 少なくとも200℃で加熱した場合に1%未満の質量損失を有するように熱的に安定である、請求項20〜37のいずれか一項に記載のフィルム。
- 前記粒子が400nm未満の平均粒径を有する、請求項20〜38のいずれか一項に記載のフィルム。
- 前記粒子が100nm未満の平均粒径を有する、請求項20〜39のいずれか一項に記載のフィルム。
- 前記粒子が25nm未満の平均粒径を有する、請求項20〜40のいずれか一項に記載のフィルム。
- 前記粒子が、酸化チタン、酸化アルミニウム、窒化アルミニウム、又は窒化ホウ素を含む、請求項20〜41のいずれか一項に記載のフィルム。
- ヘイズが5%未満である、請求項20〜42のいずれか一項に記載のフィルム。
- 2%未満のヘイズを有する、請求項20〜43のいずれか一項に記載のフィルム。
- 前記粒子がセラミック粒子である、請求項20〜44のいずれか一項に記載のフィルム。
- 前記セラミック粒子が酸化物粒子である、請求項20〜45のいずれか一項に記載のフィルム。
- 前記セラミック粒子が窒化物粒子である、請求項20〜46のいずれか一項に記載のフィルム。
- 亜鉛、アルミニウム、イットリウム、イッテルビウム、タングステン、チタンシリコン、チタン、アンチモン、サマリウム、ニッケル、ニッケルコバルト、モリブデン、マグネシウム、マンガン、ランタニド、鉄、インジウムスズ、銅、コバルトアルミニウム、クロム、セシウム、又はカルシウムの酸化物を含む、請求項20〜47のいずれか一項に記載のフィルム。
- 前記粒子が、窒化アルミニウム、窒化タンタル、窒化ホウ素、窒化チタン、窒化銅、窒化モリブデン、窒化タングステン、窒化鉄、窒化ケイ素、窒化インジウム、窒化ガリウム又は炭素である、請求項20〜48のいずれか一項に記載のフィルム。窒化物。
- シロキサンポリマー中にSi−H基を有さない、請求項20〜49のいずれか一項に記載のフィルム。
- 前記粒子が、400nm未満の平均粒子サイズを有するナノ粒子であり、前記ナノ粒子が、チタン、タンタル、アルミニウム、ジルコニウム、ハフニウム又はセレンの酸化物である、請求項20〜50のいずれか一項に記載のフィルム。
- 前記粒子が、シリカ、中空シリカ、ZrO2、ZrO2、TiO2、Ta2O5、アンチモンスズ酸化物、又はSnO2である、請求項20〜51のいずれか一項に記載のフィルム。
- 前記基板が、ガラス、石英、サファイア、有機ポリマー又はハイブリッド有機−無機ポリマーを含む、請求項20〜52のいずれか一項に記載のフィルム。
- 前記基材が、ポリエチレンテレフタレート又はポリメチルメタクリレートを含む、請求項20〜53のいずれか一項に記載のフィルム。
- ディスプレイの一部である、請求項20〜54のいずれか一項に記載のフィルム。
- タッチスクリーンディスプレイの一部である、請求項20〜55のいずれか一項に記載のフィルム。
- OLEDデバイスの一部である、請求項20〜56のいずれか一項に記載のフィルム。
- LCDディスプレイの一部である、請求項20〜56のいずれか一項に記載のフィルム。
- 前記基材が可撓性基材である、請求項20〜58のいずれか一項に記載のフィルム。
- シロキサンポリマーが有機アリール基を含む、請求項20〜59のいずれか一項に記載のフィルム。
- 前記アリール基がフェニル基である、請求項20〜60のいずれか一項に記載のフィルム。
- 前記基板をディスプレイ内の別の基板に接着する接着剤である、請求項20〜61のいずれか一項に記載のフィルム。
- 前記基板が、その上に容量性タッチセンシティブデバイスを有する基板であり、前記別の基板がカバーガラスである、請求項20〜62のいずれか一項に記載のフィルム。
- 前記基板は、その上に形成されたタッチセンシティブなカアクティブアレイを有するカバーガラスであり、前記別の基板は、液晶セル及びカラーフィルタのアレイを含む基板である、請求項20〜63のいずれか一項に記載のフィルム。
- 前記基板は、液晶セル及びカラーフィルタのアレイを含む基板であり、前記別の基板は、その上に形成されたタッチセンシティブ容量性又は抵抗性アレイを有する基板である、請求項20〜64のいずれか一項に記載のフィルム。
- LEDランプの接着剤又は封入剤である、請求項20〜65のいずれか一項に記載のフィルム。
- フィルムがLEDランプ内の封入剤である、請求項20〜66のいずれか一項に記載のフィルム。
- フィルムが燐光体を含む、請求項20〜67のいずれか一項に記載のフィルム。
- 前記蛍光体が、イットリウム−アルミニウム−ガーネット蛍光体を含む、請求項20〜68のいずれか一項に記載のフィルム。
- 前記蛍光体がケイ酸塩蛍光体を含む、請求項20〜69のいずれか一項に記載のフィルム。
- 前記蛍光体が窒化物蛍光体を含む、請求項20〜70のいずれか一項に記載のフィルム。
- シロキサン粒子フィルムの製造方法であって、
ヒドロシリル化を伴わずに形成され、その中にSi−OH基を実質的に有さず、その中にSi−H基を実質的に有さないシロキサンポリマーを含むシロキサン組成物を基板上に堆積させるステップであって、前記シロキサン組成物は、紫外線照射時にシロキサンポリマーの硬化を促進する硬化剤を含む、ステップを含み、
前記シロキサン組成物は300〜150,000g/molの分子量及び5rpm粘度計及び25℃で1000〜100,000mPa・secの粘度を有し、
前記方法はさらに、
堆積したシロキサン組成物に紫外線を照射して組成物を硬化させて硬化膜を形成するステップを含み、
前記硬化膜は、可視光線に対して、可視光線透過率が95%以上である、方法。 - 前記組成物が、インクジェット、ディスペンス、又はジェットスプレーによって堆積される、請求項72に記載の方法。
- 前記組成物が接着剤であり、前記基材がロールツーロールプロセスの基材である、請求項72又は73に記載の方法。
- ロールツーロールプロセスが、ディスプレイパネルを作製するプロセスである、請求項72〜74のいずれか一項に記載の方法。
- 基板が少なくとも1つの発光ダイオードを含み、組成物がその上に封入剤として堆積される、請求項72〜75のいずれか一項に記載の方法。
- 1ミクロン未満の平均粒径を有する粒子をさらに含む、請求項72〜76のいずれか一項に記載の方法。
- 前記粒子が400nm未満の平均粒径を有する、請求項72〜77のいずれか一項に記載の方法。
- 前記粒子が100nm未満の平均粒径を有する、請求項72〜78のいずれか一項に記載の方法。
- 前記粒子が25nm未満の平均粒子サイズを有する、請求項72〜79のいずれか一項に記載の方法。
- 前記基板がウェハであり、前記シロキサンポリマーの堆積及び硬化の後に前記ウェハが単一化される、請求項72〜80のいずれか一項に記載の方法。
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