JP2017522735A - Method, apparatus and mobile terminal for realizing heat dissipation of mobile terminal - Google Patents
Method, apparatus and mobile terminal for realizing heat dissipation of mobile terminal Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000003507 refrigerant Substances 0.000 claims abstract description 192
- 238000001816 cooling Methods 0.000 claims description 9
- 239000002826 coolant Substances 0.000 claims description 6
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- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
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- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
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Abstract
本発明は移動端末の放熱を実現する方法、装置及び相応な移動端末を開示する。該方法は、冷媒放熱装置を設置した移動端末を起動するステップ（１０１）と、冷媒放熱装置内における冷媒が移動端末の動作時に発熱する熱を吸収し、移動端末を低温環境で動作させるステップ（１０２）と、を含む。【選択図】図１The present invention discloses a method, apparatus and corresponding mobile terminal for realizing heat dissipation of the mobile terminal. The method includes a step (101) of starting a mobile terminal provided with a refrigerant heat dissipation device, and a step of operating the mobile terminal in a low temperature environment by absorbing heat generated by the refrigerant in the refrigerant heat dissipation device when the mobile terminal operates ( 102). [Selection] Figure 1
Description
本発明は、移動体通信分野に属する放熱技術に関し、特に移動端末の放熱を実現する方法、装置及び移動端末に関する。 The present invention relates to a heat dissipation technique belonging to the field of mobile communication, and more particularly to a method, an apparatus, and a mobile terminal for realizing heat dissipation of a mobile terminal.
科学技術の進歩に伴って、現在に携帯電話などの移動端末の動作速度が益々高くなり、移動端末製品の厚さが益々薄くなる。それとともに、移動端末の応用範囲も幅広くなり、例えば、ユーザーが電話をかけたり、ゲームをしたり、ビデオを再生したりするなどに用いられる。移動端末の広範囲の使用によって、移動端末の発熱問題をもたらし、さらに発熱に起因するユーザーエクスペリエンスや様々なセキュリティの問題がより顕著になる。 With the advancement of science and technology, the operating speed of mobile terminals such as mobile phones is increasing at present, and the thickness of mobile terminal products is decreasing. At the same time, the application range of mobile terminals is widened. For example, the mobile terminal is used for making calls, playing games, playing videos, and the like. The wide use of the mobile terminal brings about a heat generation problem of the mobile terminal, and the user experience and various security problems caused by the heat generation become more prominent.
移動端末の発熱問題を解決するために、従来の解決方法として、主に、大面積のＰＣＢ回路基板又は放熱しやすい構造を用いる方法、放熱膜、熱伝導性接着剤などの専用放熱、熱伝導性材料を用い、熱を移動端末の内部において均等に放熱させることにより、局所の温度が高過ぎることを防止する方法が含まれる。また、例えば、チップ内部の温度を検出し、特定の閾値よりも高いと、ＣＰＵの動作周波数を下げることにより、移動端末の動作消耗電力を低減させ、温度を下げるという方法がさらに挙げられる。 In order to solve the heat generation problem of mobile terminals, the conventional solutions mainly include a method using a PCB circuit board having a large area or a structure that easily dissipates heat, a dedicated heat dissipation and heat conduction such as a heat dissipation film and a heat conductive adhesive. A method for preventing the local temperature from being too high by using a conductive material and dissipating heat evenly inside the mobile terminal is included. In addition, for example, a method of detecting the temperature inside the chip and lowering the operating frequency of the mobile terminal by lowering the operating frequency of the mobile terminal by lowering the operating frequency of the CPU when the temperature is higher than a specific threshold can be further mentioned.
しかしながら、上記放熱方法はいずれも局限性がある。まず、従来の移動端末は小型化の傾向があり、製品の厚さは益々薄くなり、このような構造設計の場合、後期で薄いグラファイトシート又は熱伝導性接着剤などの材料を追加することにより端末の動作温度を低減させるしかなく、局限性が大きく、それは、温度が十分に高いと、グラファイトシート又は熱伝導性接着剤によって熱平衡を実現しても、移動端末全体の熱が依然としてとても高いからである。また、チップの温度に対してＣＰＵ周波数低減を行うなどの方法は実施しにくく、チップの内部温度又は回路基板の温度とユーザーが感じる可能の温度との差が大きすぎ、異なる回路設計、異なる動作環境、異なる構造設計によって両方の温度差が大きいため、設計ごとに大量の試験を行ってモデルを構築する必要があり、コストが高い。それにもかかわらず、ユーザーが実際に感じる温度を正確に反映できない。 However, any of the above heat dissipation methods is localized. First of all, conventional mobile terminals tend to be miniaturized, and the thickness of products is becoming increasingly thinner. In the case of such a structural design, by adding materials such as a thin graphite sheet or a heat conductive adhesive later in the structure design There is no choice but to reduce the operating temperature of the terminal, which is highly localized, because if the temperature is high enough, the heat of the entire mobile terminal is still very high even if thermal equilibrium is achieved by graphite sheet or heat conductive adhesive It is. Moreover, it is difficult to implement a method such as reducing the CPU frequency with respect to the temperature of the chip, and the difference between the internal temperature of the chip or the temperature of the circuit board and the temperature that can be felt by the user is too large. Since the temperature difference between the environment and different structural designs is large, it is necessary to build a model by conducting a large amount of tests for each design, which is expensive. Nevertheless, it does not accurately reflect the temperature actually felt by the user.
従来の技術的問題を解決するために、本発明の実施例は移動端末の放熱を実現する方法、装置及び移動端末を提供する。 In order to solve the conventional technical problems, embodiments of the present invention provide a method, apparatus and mobile terminal for realizing heat dissipation of a mobile terminal.
本発明の実施例は移動端末の放熱を実現する方法を提供し、該方法は、
冷媒放熱装置を設置した移動端末を起動し、冷媒放熱装置内における冷媒が移動端末の動作時に発熱する熱を吸収し、移動端末を低温環境で動作させることを含む。
Embodiments of the present invention provide a method for realizing heat dissipation of a mobile terminal, the method comprising:
This includes starting a mobile terminal in which the refrigerant heat dissipating device is installed, absorbing heat generated by the refrigerant in the refrigerant heat dissipating device when the mobile terminal is operating, and operating the mobile terminal in a low temperature environment.
該方法は、前記移動端末をオフにすると、前記冷媒放熱装置内における冷媒を導出して冷却し、冷却後の冷媒を冷媒放熱装置に再注入することをさらに含む。 The method further includes deriving and cooling the refrigerant in the refrigerant heat dissipating device when the mobile terminal is turned off, and reinjecting the cooled refrigerant into the refrigerant heat dissipating device.
該方法は、前記移動端末をオフにすると、冷媒放熱装置を設置した前記移動端末全体を冷却することをさらに含む。 The method further includes cooling the entire mobile terminal provided with the refrigerant heat dissipation device when the mobile terminal is turned off.
前記移動端末内に１つ又は複数の冷媒放熱装置が設置される。 One or a plurality of refrigerant heat dissipation devices are installed in the mobile terminal.
本発明の実施例は移動端末の放熱を実現する装置をさらに提供し、前記装置は上記の冷媒放熱装置であり、前記冷媒放熱装置は冷媒収容室、冷媒導出装置、及びプラグを備え、
前記冷媒収容室は冷媒収容室に設けられた出口を介して冷媒導出装置の一端に接続され、前記冷媒導出装置の他端にポートが設けられ、前記プラグは前記ポートを介して前記冷媒導出装置の内部に挿入され、前記冷媒収容室内に収容される冷媒を密封する。
An embodiment of the present invention further provides an apparatus for realizing heat dissipation of a mobile terminal, wherein the apparatus is the refrigerant heat dissipation apparatus, and the refrigerant heat dissipation apparatus includes a refrigerant storage chamber, a refrigerant outlet apparatus, and a plug,
The refrigerant accommodating chamber is connected to one end of the refrigerant deriving device via an outlet provided in the refrigerant accommodating chamber, a port is provided at the other end of the refrigerant deriving device, and the plug is connected to the refrigerant deriving device via the port. And the refrigerant accommodated in the refrigerant accommodating chamber is sealed.
前記冷媒収容室は不規則な形状のものであり、前記冷媒収容室の周囲の隣接するモジュールとの相補的な構造関係によって、移動端末の係合部に係止される。 The refrigerant storage chamber has an irregular shape and is locked to the engaging portion of the mobile terminal by a complementary structural relationship with adjacent modules around the refrigerant storage chamber.
前記冷媒収容室は熱伝導性プラスチックからなる。 The refrigerant storage chamber is made of a heat conductive plastic.
前記プラグの構造は前記冷媒導出装置の内部構造にマッチングする。 The structure of the plug matches the internal structure of the refrigerant derivation device.
本発明の実施例は移動端末の放熱を実現する装置をさらに提供し、前記装置は上記の冷媒放熱装置であり、前記冷媒放熱装置は、冷媒を収容するための密閉した冷媒収容室を備える。 An embodiment of the present invention further provides an apparatus for realizing heat dissipation of a mobile terminal, wherein the apparatus is the above-described refrigerant heat dissipation apparatus, and the refrigerant heat dissipation apparatus includes a sealed refrigerant accommodating chamber for accommodating a refrigerant.
本発明の実施例は移動端末をさらに提供し、前記移動端末の内部に、冷媒収容室、冷媒導出装置及びプラグを備えた前記冷媒放熱装置が設置され、又は、前記移動端末の内部に、密閉した冷媒収容室を備えた冷媒放熱装置が設置される。 An embodiment of the present invention further provides a mobile terminal, wherein the refrigerant heat dissipation device including a refrigerant storage chamber, a refrigerant outlet device, and a plug is installed in the mobile terminal, or the mobile terminal is hermetically sealed. A refrigerant heat dissipating device including the refrigerant containing chamber is installed.
本発明の実施例に係る移動端末の放熱を実現する方法、装置及び移動端末によれば、冷媒放熱装置を設置した移動端末を起動し、冷媒放熱装置内における冷媒が移動端末の動作時に発熱する熱を吸収し、移動端末を低温環境で動作させる。上記から分かるように、本発明の実施例は冷媒冷却能力が高い特徴を用い、冷媒放熱装置を移動端末の高熱源に設置し、移動端末が高負荷で動作する時、高熱源が大量の熱を発熱し、冷媒が熱を迅速に吸収し、高熱源の相対低温を維持する。通信端末が低負荷で動作する又はスリープする時、高熱源の発熱した熱が少なく、この時、冷媒により吸収される熱が少なく、それにより移動端末の内部の熱平衡状態を実現する。移動端末をオフにする時、移動端末を低温環境に置き、内蔵した冷媒を冷却してもよく、移動端末の内部における冷媒を導出して冷却してもよい。本発明の実施例によれば、移動端末のシステム特性を確保するとともに、移動端末のユーザーエクスペリエンスを効果的に向上させることができる。 According to a method, apparatus, and mobile terminal for realizing heat dissipation of a mobile terminal according to an embodiment of the present invention, the mobile terminal provided with the refrigerant heat dissipation device is activated, and the refrigerant in the refrigerant heat dissipation device generates heat when the mobile terminal is operated. Absorb heat and operate the mobile terminal in a low temperature environment. As can be seen from the above, the embodiment of the present invention uses the feature that the refrigerant cooling capacity is high, and when the refrigerant heat dissipating device is installed in the high heat source of the mobile terminal and the mobile terminal operates at a high load, the high heat source The refrigerant absorbs heat quickly and maintains the relative low temperature of the high heat source. When the communication terminal operates at a low load or goes to sleep, the heat generated by the high heat source is small, and at this time, the heat absorbed by the refrigerant is small, thereby realizing a thermal equilibrium state inside the mobile terminal. When the mobile terminal is turned off, the mobile terminal may be placed in a low temperature environment to cool the built-in refrigerant, or the refrigerant inside the mobile terminal may be led out and cooled. According to the embodiment of the present invention, it is possible to ensure the system characteristics of the mobile terminal and effectively improve the user experience of the mobile terminal.
本発明の実施例において、冷媒放熱装置を設置した移動端末を起動し、冷媒放熱装置内における冷媒が移動端末の動作時に発熱する熱を吸収し、移動端末を低温環境で動作させる。 In an embodiment of the present invention, a mobile terminal provided with a refrigerant heat dissipation device is activated, the refrigerant in the refrigerant heat dissipation device absorbs heat generated during operation of the mobile terminal, and the mobile terminal is operated in a low temperature environment.
該実施例の方法は、前記移動端末をオフにすると、前記冷媒放熱装置内における冷媒を導出して冷却し、冷却後の冷媒を冷媒放熱装置に再注入すること、又は、
前記移動端末をオフにすると、冷媒放熱装置を設置した前記移動端末を直接に冷却することをさらに含む。
In the method of the embodiment, when the mobile terminal is turned off, the refrigerant in the refrigerant heat dissipation device is led out and cooled, and the cooled refrigerant is reinjected into the refrigerant heat dissipation device, or
When the mobile terminal is turned off, it further includes directly cooling the mobile terminal provided with the refrigerant heat dissipation device.
勿論、本発明の実施例に係る冷媒放熱装置は、動作時に発熱量が大きいほかの装置内に設置されてもよいが、本発明の実施例は移動端末を例として説明する。 Of course, the refrigerant heat dissipating device according to the embodiment of the present invention may be installed in another device that generates a large amount of heat during operation, but the embodiment of the present invention will be described by taking a mobile terminal as an example.
以下、図面及び具体的な実施例を参照して本発明を更に詳細に説明する。 Hereinafter, the present invention will be described in more detail with reference to the drawings and specific examples.
図１は本発明の実施例に係る移動端末の放熱を実現する方法のフローチャートであり、図１に示すように、以下のステップ１０１〜１０２を含む。
FIG. 1 is a flowchart of a method for realizing heat dissipation of a mobile terminal according to an embodiment of the present invention, and includes the
ステップ１０１では、冷媒放熱装置を設置した移動端末を起動する。
In
ここで、前記冷媒放熱装置は移動端末の動作時に発熱量が最も大きい位置、例えばＣＰＵ、電源管理（ＰＭ）モジュール、又は電力増幅器などに設置される。従って、移動端末内に１つ又は複数の冷媒放熱装置が設置されることができる。 Here, the refrigerant heat dissipating device is installed at a position where the heat generation amount is the largest when the mobile terminal operates, for example, a CPU, a power management (PM) module, or a power amplifier. Accordingly, one or more refrigerant heat dissipating devices can be installed in the mobile terminal.
前記冷媒放熱装置内には冷媒が充填され、前記冷媒はブルーアイス流体であってもよい。前記ブルーアイス流体は高性能蓄冷又は蓄熱媒体であり、ブルーアイスを冷凍して優れた保冷源を形成し、ブルーアイスは加熱して熱源として使用でき、水を発生させ、且つ制限なく再利用が可能である。ブルーアイスによる冷却、又は加熱時のエネルギー変換は完全に物理過程であり、化学反応がなく、何の有害物質成分が発生することもない。ブルーアイスは中間的エネルギーに対して高速吸収及び徐放特性を有する。 The refrigerant radiating device may be filled with a refrigerant, and the refrigerant may be a blue ice fluid. The blue ice fluid is a high performance cold storage or heat storage medium, which forms a good cold source by freezing blue ice, which can be used as a heat source by heating, generating water and being reused without limitation Is possible. Energy conversion during cooling or heating with blue ice is a completely physical process, there is no chemical reaction, and no harmful substance components are generated. Blue ice has fast absorption and sustained release characteristics for intermediate energy.
ステップ１０２では、冷媒放熱装置内における冷媒が移動端末の動作時に発熱する熱を吸収し、移動端末を低温環境で動作させる。
In
冷媒放熱装置を設置した移動端末を起動すると、動作を開始し、なお、起動直後の移動端末自体が熱平衡状態にあり、すなわち、冷媒放熱装置と移動端末の内部におけるほかのモジュールとの温度が同一で、熱交換がない。移動端末が動作し始めると、移動端末の内部における高熱源、例えば上記のＣＰＵ、ＰＭモジュール、又は電力増幅器などが発熱し始め、熱平衡状態を維持するために、冷媒放熱装置内における冷媒は前記高熱源が発熱する熱を吸収し、最終的に熱平衡を達成し、移動端末を低温環境で動作させ、それによりシステム性能を確保し、ユーザーエクスペリエンスを向上させる。 When the mobile terminal installed with the refrigerant heat dissipation device is activated, the operation starts, and the mobile terminal itself immediately after the activation is in a thermal equilibrium state, that is, the temperature of the refrigerant heat dissipation device and other modules inside the mobile terminal are the same. And there is no heat exchange. When the mobile terminal starts to operate, a high heat source inside the mobile terminal, for example, the CPU, the PM module, or the power amplifier starts to generate heat, and in order to maintain a thermal equilibrium state, The heat source absorbs the heat generated and eventually achieves thermal equilibrium, allowing the mobile terminal to operate in a cold environment, thereby ensuring system performance and improving the user experience.
ここで、移動端末が高負荷の動作状態にあると、移動端末の高熱源は大量の熱を発熱し、この時、冷媒放熱装置内における冷媒が熱を十分に吸収して、移動端末の温度を迅速に低減させ、移動端末を低温環境で動作させる。 Here, when the mobile terminal is in a high load operating state, the high heat source of the mobile terminal generates a large amount of heat, and at this time, the refrigerant in the refrigerant heat dissipation device sufficiently absorbs the heat, and the temperature of the mobile terminal The mobile terminal is operated in a low temperature environment.
移動端末が非高負荷の動作状態、例えば、スリープ状態にあると、移動端末が発熱する熱は少なく、この時、冷媒放熱装置内における冷媒により吸収される熱は少ない。 When the mobile terminal is in a non-high-load operation state, for example, in a sleep state, the mobile terminal generates little heat, and at this time, the heat absorbed by the refrigerant in the refrigerant heat dissipation device is small.
なお、移動端末の動作時、冷媒放熱装置内における冷媒はほかのモジュールとリアルタイムに熱交換し、すなわち、移動端末の内部が熱平衡状態に達していない限り、冷媒放熱装置内における冷媒はほかのモジュールと熱交換する。 When the mobile terminal is operating, the refrigerant in the refrigerant heat dissipation device exchanges heat with other modules in real time, that is, the refrigerant in the refrigerant heat dissipation device is in other modules unless the interior of the mobile terminal has reached a thermal equilibrium state. Exchange heat with.
本発明の一つの実施例では、該方法は、前記移動端末をオフにすると、前記冷媒放熱装置内における冷媒を導出して冷却し、冷却後の冷媒を冷媒放熱装置に再注入すること、又は、
前記移動端末をオフにすると、冷媒放熱装置を設置した前記移動端末全体を冷却することをさらに含む。
In one embodiment of the present invention, when the mobile terminal is turned off, the method derives and cools the refrigerant in the refrigerant heat dissipation device and reinjects the cooled refrigerant into the refrigerant heat dissipation device, or ,
When the mobile terminal is turned off, it further includes cooling the entire mobile terminal provided with the refrigerant heat dissipating device.
ここで、前記移動端末をオフにすると、前記冷媒放熱装置内における冷媒を導出し、前記冷媒を再利用可能な冷媒とすると、使用済みの冷媒を低温環境に置き、冷媒に冷熱エネルギーを十分に吸収させた後、移動端末における前記冷媒放熱装置に再注入する。 Here, when the mobile terminal is turned off, the refrigerant in the refrigerant heat dissipating device is derived, and when the refrigerant is a reusable refrigerant, the used refrigerant is placed in a low-temperature environment, and the refrigerant is sufficiently supplied with cold energy. After being absorbed, it is reinjected into the refrigerant heat dissipation device in the mobile terminal.
本発明の実施例では、前記低温環境は、温度が室温２５℃よりも遥かに低い環境であり、低温環境の温度範囲が約−１０〜１０℃である。 In an embodiment of the present invention, the low temperature environment is an environment whose temperature is much lower than 25 ° C., and the temperature range of the low temperature environment is about −10 to 10 ° C.
移動端末内における冷媒を導出できない、或いはユーザーが冷媒を導出する意図がない場合、オフ状態の移動端末を低温環境に置き、内蔵した冷媒に冷熱エネルギーを十分に吸収させて冷媒を冷却する。移動端末の内部モジュールの通常動作可能な温度範囲が約−３０〜８０℃であるため、ここで移動端末を低温環境に置いても移動端末の性能を損なうことがない。 When the refrigerant in the mobile terminal cannot be derived or the user does not intend to derive the refrigerant, the mobile terminal in the off state is placed in a low-temperature environment, and the built-in refrigerant sufficiently absorbs cold energy to cool the refrigerant. Since the normal operating temperature range of the internal module of the mobile terminal is about −30 to 80 ° C., even if the mobile terminal is placed in a low temperature environment, the performance of the mobile terminal is not impaired.
以下、一つの具体的な実施例を参照して本発明を説明する。 The present invention will now be described with reference to one specific embodiment.
発熱量が大きい高性能移動端末を例とし、移動端末の内部に冷媒放熱装置を設置して放熱を行い、移動端末を低温環境で動作させ、それによりシステム性能を確保するとともに、ユーザーエクスペリエンスを向上させる。 Taking a high-performance mobile terminal with a large amount of heat generation as an example, install a refrigerant heat dissipation device inside the mobile terminal to dissipate heat, operate the mobile terminal in a low temperature environment, thereby ensuring system performance and improving user experience Let
移動端末の高負荷動作時、例えばビデオ再生時、冷媒放熱装置を用いていない移動端末は発熱量が大きく、従来の放熱方法を用い、性能を犠牲にし、例えば、ＣＰＵが周波数を低減すると、実験により測定した移動端末の高熱源での最高温度はまだ５４℃と高い。 When a mobile terminal is operating at a high load, for example, during video playback, a mobile terminal that does not use the refrigerant heat dissipation device generates a large amount of heat, uses a conventional heat dissipation method, and sacrifices performance. The maximum temperature at the high heat source of the mobile terminal measured by is still as high as 54 ° C.
本発明の実施例に係る方法によれば、同移動端末を例とし、高熱源の位置に冷媒放熱装置を設置し、高負荷動作時、移動端末全体の温度が著しく低減し、室温まで下げることができ、ＣＰＵなどの性能も回復し、すなわちシステム性能を確保するとともにユーザーエクスペリエンスを向上させる。本発明の実施例では、移動端末の温度低減幅は２５〜６０℃であることができる。 According to the method of the embodiment of the present invention, the mobile terminal is taken as an example, and the refrigerant heat dissipating device is installed at the position of the high heat source, and the temperature of the entire mobile terminal is remarkably reduced to a room temperature during high load operation. The performance of the CPU and the like is also restored, that is, the system performance is secured and the user experience is improved. In the embodiment of the present invention, the temperature reduction width of the mobile terminal may be 25-60 ° C.
本実施例に係る方法において、冷媒放熱装置は移動端末内に固定され、冷媒の導出が不能であり、移動端末をオフにすると、移動端末を低温環境に置き、冷媒に冷熱エネルギーを吸収させて冷却させることができる。 In the method according to the present embodiment, the refrigerant heat dissipation device is fixed in the mobile terminal, the refrigerant cannot be derived, and when the mobile terminal is turned off, the mobile terminal is placed in a low temperature environment and the refrigerant absorbs cold energy. Can be cooled.
以下、本発明の実施例に係る冷媒放熱装置を説明する。 Hereinafter, the refrigerant heat dissipation device according to the embodiment of the present invention will be described.
本発明の実施例に係る冷媒放熱装置は冷媒収容室、冷媒導出装置、及びプラグを備え、前記冷媒収容室は冷媒収容室に設けられた出口を介して冷媒導出装置の一端に接続され、前記冷媒導出装置の他端にポートが設けられ、前記プラグは前記ポートを介して前記冷媒導出装置の内部に挿入され、前記冷媒収容室内に収容される冷媒を密封する。 A refrigerant heat dissipation device according to an embodiment of the present invention includes a refrigerant storage chamber, a refrigerant discharge device, and a plug, and the refrigerant storage chamber is connected to one end of the refrigerant discharge device via an outlet provided in the refrigerant storage chamber, A port is provided at the other end of the refrigerant derivation device, and the plug is inserted into the refrigerant derivation device via the port to seal the refrigerant accommodated in the refrigerant accommodation chamber.
具体的に、前記冷媒収容室の構造は図２、３に示され、冷媒を収容することに用いられる。前記冷媒収容室２０は通常、不規則な形状のものであり、主として移動端末の内部と前記冷媒放熱装置の周囲の隣接するほかのモジュールの構造及び形状に決められ、前記冷媒収容室２０は前記周囲の隣接するモジュールとの相補的な構造関係により隣接モジュール間に係止され、それにより移動端末の内部に固定される。勿論、少数例である場合、前記冷媒収容室２０は規則的な形状のものであってもよい。前記冷媒収容室に１つの出口２０１がさらに設けられ、前記出口２０１が冷媒導出装置（図２では図示せず）に接続される。前記冷媒収容室の厚さは移動端末の厚さ未満であり、勿論、前記冷媒収容室は厚さが不均一なものであってもよい。
Specifically, the structure of the refrigerant storage chamber is shown in FIGS. 2 and 3 and is used to store the refrigerant. The
前記冷媒収容室は熱伝導性プラスチックからなってもよく、金属材料の使用が禁止される。 The refrigerant storage chamber may be made of a heat conductive plastic, and the use of a metal material is prohibited.
前記冷媒導出装置の一端は冷媒収容室における出口２０１を介して冷媒収容室に接続され、前記冷媒導出装置は前記冷媒収容室の内部と連通する。
One end of the refrigerant derivation device is connected to the refrigerant accommodation chamber via an
前記冷媒導出装置の他端にポートは設けられ、前記ポートは移動端末の側面又は裏面に位置する。図４は本発明の実施例に係る冷媒放熱装置におけるプラグの構成斜視図であり、前記プラグ４０１は、前記ポートを介して前記冷媒導出装置の内部に挿入され、前記プラグ４０１の構造が前記冷媒導出装置の内部構造にマッチングする。前記プラグ４０１の冷媒導出装置内部に対する挿入深さは、冷媒収容室における出口２０１に到達する深さ以下に設定される。前記ポートでのプラグ４０１は移動端末の外表面よりも高く、ポートに接触する部分がソフトコロイド構造として設置され、それによりプラグ４０１の密封性を確保する。
A port is provided at the other end of the refrigerant derivation device, and the port is located on the side surface or the back surface of the mobile terminal. FIG. 4 is a configuration perspective view of a plug in the refrigerant heat dissipating device according to the embodiment of the present invention. The
ここで、移動端末が通常に動作する時、前記プラグ４０１は前記ポートを密封し、冷媒の導出又は注入が必要である時、前記プラグを開く。
Here, when the mobile terminal operates normally, the
ここで、前記冷媒放熱装置は冷媒を導出可能な移動端末に用いられる。 Here, the refrigerant heat dissipating device is used in a mobile terminal capable of extracting the refrigerant.
本発明の一つの実施例では、冷媒を導出不能な移動端末については、移動端末の内部に一つの密閉した冷媒収容室が設けられるだけでよく、すなわち、前記冷媒放熱装置は、冷媒を収容する密閉した冷媒収容室を備える。前記密閉した冷媒収容室の構造設計については上記技術案を参照してもよい。 In one embodiment of the present invention, for a mobile terminal from which refrigerant cannot be derived, it is only necessary to provide one sealed refrigerant storage chamber inside the mobile terminal, that is, the refrigerant heat dissipation device stores the refrigerant. A sealed refrigerant storage chamber is provided. You may refer the said technical plan about the structural design of the said sealed refrigerant | coolant storage chamber.
以下、本発明の実施例に係る冷媒導出・注入過程を簡単に説明する。 Hereinafter, a refrigerant derivation / injection process according to an embodiment of the present invention will be briefly described.
本発明の実施例に係る冷媒導出・注入装置の構造は、図５に示され、冷媒導出時、まずバルーン５０２を押し、次にホース５０１を冷媒導出装置のポートに接続し、その後、バルーン５０２を放し、冷媒を冷媒放熱装置から導出し、さらにホース５０１を経由してバルーン５０２に導入し、さらにホース５０３を経由して最終的に冷媒回収装置５０４に到達する。
The structure of the refrigerant derivation / injection apparatus according to the embodiment of the present invention is shown in FIG. 5. At the time of refrigerant derivation, the
再利用可能な冷媒を使用する場合、冷媒回収装置５０４により収集された冷媒を低温環境、例えば冷蔵庫に置き、冷媒に冷熱エネルギーを十分に吸収させることができる。
When a reusable refrigerant is used, the refrigerant collected by the
移動端末５０に冷媒を注入する時、バルーン５０２を押してホース５０３を冷媒回収装置５０４に入れ、バルーン５０２を放し、すなわち冷媒を冷媒回収装置５０４から導出し、順にホース５０３、５０２及び５０１を経由して移動端末５０のポートに到達し、継続的に冷媒導出装置を経由して冷媒収容室内に注入する。上記冷媒導出・注入方法として、従来の方法が挙げられ、ここで詳細に説明しない。
When injecting the refrigerant into the
本発明の実施例は移動端末をさらに提供し、前記移動端末の内部に上記の冷媒放熱装置が設置され、移動端末を低温環境で動作させ、ユーザーエクスペリエンスを向上させる。 The embodiment of the present invention further provides a mobile terminal, and the refrigerant heat dissipating device is installed in the mobile terminal to operate the mobile terminal in a low temperature environment and improve a user experience.
上記から分かるように、本発明の実施例は冷媒冷却能力が高い特徴を用い、冷媒放熱装置を移動端末の高熱源に設置し、移動端末が高負荷で動作する時、高熱源が大量の熱を発熱し、冷媒が熱を迅速に吸収し、高熱源の相対低温を維持する。通信端末が低負荷で動作する又はスリープする時、高熱源が発熱した熱は少なく、この時、冷媒により吸収される熱が少なく、それにより移動端末の内部の熱平衡状態を実現する。移動端末をオフにする時、移動端末を低温環境に置き、内蔵した冷媒を冷却してもよく、移動端末の内部における冷媒を導出して冷却してもよい。本発明の実施例によれば、移動端末のシステム性能を確保するとともに、移動端末のユーザーエクスペリエンスを効果的に向上させることができる。 As can be seen from the above, the embodiment of the present invention uses the feature that the refrigerant cooling capacity is high, and when the refrigerant heat dissipating device is installed in the high heat source of the mobile terminal and the mobile terminal operates at a high load, the high heat source has a large amount of heat. The refrigerant absorbs heat quickly and maintains the relative low temperature of the high heat source. When the communication terminal operates at a low load or goes to sleep, the heat generated by the high heat source is small, and at this time, the heat absorbed by the refrigerant is small, thereby realizing a thermal equilibrium state inside the mobile terminal. When the mobile terminal is turned off, the mobile terminal may be placed in a low temperature environment to cool the built-in refrigerant, or the refrigerant inside the mobile terminal may be led out and cooled. According to the embodiment of the present invention, it is possible to ensure the system performance of the mobile terminal and effectively improve the user experience of the mobile terminal.
上記は本発明の好ましい実施例だけであり、本発明の保護範囲を限定するものではない。 The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention.
Claims (10)
前記冷媒収容室は冷媒収容室に設けられた出口を介して冷媒導出装置の一端に接続され、前記冷媒導出装置の他端にポートが設けられ、前記プラグは前記ポートを介して前記冷媒導出装置の内部に挿入され、前記冷媒収容室内に収容される冷媒を密封する移動端末の放熱を実現する装置。 A device for realizing heat dissipation of a mobile terminal, which is a refrigerant heat dissipation device according to any one of claims 1 to 4, comprising a refrigerant storage chamber, a refrigerant outlet device, and a plug,
The refrigerant accommodating chamber is connected to one end of the refrigerant deriving device via an outlet provided in the refrigerant accommodating chamber, a port is provided at the other end of the refrigerant deriving device, and the plug is connected to the refrigerant deriving device via the port. The apparatus which implement | achieves heat dissipation of the mobile terminal inserted in the inside and sealing the refrigerant | coolant accommodated in the said refrigerant | coolant accommodation chamber.
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| PCT/CN2014/089065 WO2015117379A1 (en) | 2014-07-25 | 2014-10-21 | Method and device for realizing heat dissipation of mobile terminal, and mobile terminal |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6449983B2 (en) | 2019-01-09 |
| KR101922095B1 (en) | 2019-02-20 |
| WO2015117379A1 (en) | 2015-08-13 |
| KR20170039219A (en) | 2017-04-10 |
| CN105324005A (en) | 2016-02-10 |
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