CN209767908U - Circuit board with heat radiation structure - Google Patents
Circuit board with heat radiation structure Download PDFInfo
- Publication number
- CN209767908U CN209767908U CN201821960517.5U CN201821960517U CN209767908U CN 209767908 U CN209767908 U CN 209767908U CN 201821960517 U CN201821960517 U CN 201821960517U CN 209767908 U CN209767908 U CN 209767908U
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- CN
- China
- Prior art keywords
- circuit board
- heat
- board body
- box body
- conducting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a circuit board with heat radiation structure, including the circuit board body, circuit board body one side is provided with takes top open-ended box body, the opening part bonds there is the sealed frame that matches with the opening, sealed frame matches with the circuit board body, circuit board body butt is at sealed frame inner wall, the appearance chamber that forms the water storage is surrounded to box body and circuit board body, be provided with the heat-conducting plate in the box body, the circuit board body includes the copper base, fixedly connected with heat conduction strip between copper base and the heat-conducting plate, it is provided with a plurality of canals to run through on the box body wall, the inboard waterproof ventilated membrane that bonds in pore. The working heat of the circuit board body is absorbed by the copper substrate, the heat is conducted to the heat conducting plate through the heat conducting strip, the water in the containing cavity accelerates the cooling of the heat conducting plate, and the water vapor evaporated by heating the water in the containing cavity permeates the waterproof breathable film to be discharged out of the containing cavity, so that the heat dissipation efficiency of the circuit board is accelerated.
Description
Technical Field
The utility model relates to a circuit board technical field specifically discloses a circuit board with heat radiation structure.
Background
In recent years, electronic technology has been rapidly advanced, electronic devices have become more precise, and particularly, in the case of miniaturization and precision of electronic components, the temperature of the circuit board is high due to more and more heat generated by the operation of the electronic components, and thus the heat dissipation requirement of the circuit board is also higher. The heat dissipation performance of the circuit board in the market is still insufficient, and improvement is needed.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a circuit board with a heat dissipation structure to solve the problems in the prior art, and a unique structure is provided to improve the heat dissipation performance of the circuit board.
For solving the prior art problem, the utility model discloses a circuit board with heat radiation structure, including the circuit board body, circuit board body one side is provided with takes top open-ended box body, the opening part bonds there is the sealed frame that matches with the opening, sealed frame matches with the circuit board body, circuit board body butt is at sealed frame inner wall, the box body surrounds the appearance chamber that forms the water storage with the circuit board body, be provided with the heat-conducting plate in the box body, the circuit board body includes the copper base, fixedly connected with heat conduction strip between copper base and the heat-conducting plate, it is provided with a plurality of canals to run through on the box body wall, the inboard waterproof ventilated membrane that bonds in.
Preferably, the circuit board body contains control module, holds the intracavity and is provided with the level gauge of being connected with control module data, and box body one side is run through and is provided with the water inlet, and the water inlet side is provided with the plug of closed water inlet.
Preferably, the heat conducting strips are arranged helically.
Preferably, a loudspeaker electrically connected with the control module is arranged on one side of the circuit board body.
Preferably, sealing frame one side is provided with the breach, and just lie in breach one side on the circuit board body and be provided with the notch.
The utility model has the advantages that: the utility model discloses a circuit board with heat radiation structure sets up unique structure, and circuit board body work heat will be absorbed by the copper substrate, and on the heat-conducting plate was conducted to through the heat conducting strip to the heat, the cooling of heat-conducting plate was accelerated to the water that holds in the chamber, and the vapor of the water heating evaporation that holds in the chamber sees through waterproof ventilated membrane discharge outside holding the chamber for the radiating efficiency of circuit board. The structure is simple, and the heat dissipation performance of the circuit board can be improved.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of the circuit board of the present invention.
Fig. 2 is a schematic diagram of the appearance structure of the circuit board of the present invention.
The reference signs are: the circuit board comprises a circuit board body 1, a box body 2, a pore channel 20, a sealing frame 3, a notch 30, a containing cavity 4, a heat conducting plate 5, a copper substrate 6, a heat conducting strip 7, a waterproof breathable film 8, a liquid level meter 9, a water inlet 10, a rubber plug 11, a loudspeaker 12 and a notch 13.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1 to 2.
The embodiment of the utility model discloses circuit board with heat radiation structure, including circuit board body 1, 1 one side of circuit board body is provided with takes top open-ended box body 2, the opening part bonds there is the sealed frame 3 that matches with the opening, sealed frame 3 matches with circuit board body 1, 1 butt of circuit board body is at sealed frame 3 inner wall, box body 2 surrounds the appearance chamber 4 that forms the water storage with circuit board body 1, be provided with heat-conducting plate 5 in the box body 2, circuit board body 1 includes copper base 6, fixedly connected with heat conduction strip 7 between copper base 6 and the heat-conducting plate 5, it is provided with a plurality of pores 20 to run through on 2 walls of box body, pore 20 inboard bonds has the waterproof ventilated membrane 8 of closed pore 20.
The concrete principle does, and 1 work heat of circuit board body will be absorbed by copper substrate 6, and the heat conducts heat-conducting plate 5 through heat conduction strip 7 on, holds the cooling that the water in chamber 4 quickened heat-conducting plate 5, holds the water in chamber 4 outside the chamber 4 is held in the vapor permeation of waterproof ventilated membrane 8 discharge by the heating evaporation for the radiating efficiency of circuit board. The structure is simple, and the heat dissipation performance of the circuit board can be improved.
Based on above-mentioned embodiment, circuit board body 1 contains control module, is provided with the level gauge 9 of being connected with control module data in holding the chamber 4, and 2 one sides of box body run through and are provided with water inlet 10, and water inlet 10 side is provided with the plug 11 of closed water inlet 10. The liquid level meter 9 can monitor the water level height in the accommodating cavity 4 in real time and send data to the control module, and when the water level in the accommodating cavity 4 is low, the rubber plug 11 can be taken down to conveniently add water into the accommodating cavity 4 so as to ensure the continuous cooling of the circuit board.
Based on above-mentioned embodiment, heat conduction strip 7 is the heliciform setting, increases heat conduction strip 7 and holds the area of contact of chamber 4 normal water, promotes circuit board cooling efficiency.
Based on the above embodiment, the circuit board body 1 is provided with a speaker 12 electrically connected to the control module at one side. When the monitored water level in the cavity 4 is lower than the set standard, the control module controls the loudspeaker 12 to give an alarm sound to remind a user of adding water.
Based on the above embodiment, the sealing frame 3 is provided with the notch 30 on one side, and the circuit board body 1 is provided with the notch 13 on one side of the notch 30. Breach 30 sets up to match the shape with the finger, and the finger is placed and is put on breach 30 and to be chosen notch 13 and can take out circuit board body 1 from sealed frame 3, reduces and dismantles the degree of difficulty, and the convenience is maintained circuit board body 1.
The above examples only represent 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. A circuit board with a heat dissipation structure comprises a circuit board body (1) and is characterized in that, a box body (2) with an opening at the top is arranged on one side of the circuit board body (1), a sealing frame (3) matched with the opening is bonded at the opening, the sealing frame (3) is matched with the circuit board body (1), the circuit board body (1) is abutted against the inner wall of the sealing frame (3), the box body (2) and the circuit board body (1) surround to form a cavity (4) for storing water, a heat conducting plate (5) is arranged in the box body (2), the circuit board body (1) comprises a copper substrate (6), a heat conducting strip (7) is fixedly connected between the copper substrate (6) and the heat conducting plate (5), the wall surface of the box body (2) is provided with a plurality of holes (20) in a penetrating mode, and waterproof breathable films (8) for sealing the holes (20) are bonded on the inner sides of the holes (20).
2. The circuit board with the heat dissipation structure according to claim 1, wherein the circuit board body (1) comprises a control module, a liquid level meter (9) connected with the control module is arranged in the cavity (4), a water inlet (10) is arranged on one side of the box body (2) in a penetrating manner, and a rubber plug (11) for closing the water inlet (10) is arranged on the side of the water inlet (10).
3. The circuit board with a heat dissipation structure as defined in claim 1, wherein the heat conducting strips (7) are arranged in a spiral shape.
4. The circuit board with a heat dissipation structure according to claim 2, wherein a speaker (12) electrically connected to the control module is disposed on one side of the circuit board body (1).
5. The circuit board with a heat dissipation structure according to claim 1, wherein a notch (30) is formed on one side of the sealing frame (3), and a notch (13) is formed on the circuit board body (1) and located on one side of the notch (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821960517.5U CN209767908U (en) | 2018-11-27 | 2018-11-27 | Circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821960517.5U CN209767908U (en) | 2018-11-27 | 2018-11-27 | Circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209767908U true CN209767908U (en) | 2019-12-10 |
Family
ID=68744751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821960517.5U Expired - Fee Related CN209767908U (en) | 2018-11-27 | 2018-11-27 | Circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209767908U (en) |
-
2018
- 2018-11-27 CN CN201821960517.5U patent/CN209767908U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191210 Termination date: 20211127 |