JP2017508858A5 - - Google Patents

Description

To prepare the composition according to the invention, the base resin and the toughening agent were blended in a stirrer under vacuum at room temperature. Softener and optionally reactive diluent was added to the mixture and again stirred under vacuum . Next, the photoinitiator was added and stirred under vacuum . If an adhesion promoter was added, it was added in the final step and the mixture was again mixed at room temperature under vacuum .

The produced film shows a decrease in flexibility and toughness when softeners and reinforcing aids are not used. Here, high flexibility and toughness can be obtained under the influence of either a softener or a combination of a softener and a reinforcing aid. Use of a photoinitiator UV-2257 again, resulting in relatively more flexible film to have a higher toughness.

Claims (14)

(A) 30 to 90% by weight, preferably 50 to 85% by weight of at least one aromatic epoxy resin;
(B) 2-30% by weight, preferably 5-15% by weight of at least one core-shell rubber as reinforcing agent;
(C) 1 to 20% by weight, preferably 5 to 10% by weight of at least one softener comprising a reactive functional group selected from among epoxy groups, carboxylate groups, amino groups and / or hydroxyl groups; And (d) 1-4% by weight, preferably 1.5-2.5% by weight of at least one cationic photoinitiator, preferably a cationic photoinitiator comprising a sulfonium salt and / or an iodonium salt Photocurable epoxy resin composition.   2. Aromatic epoxy resin according to claim 1, characterized in that it is selected from diglycidyl ethers based on bisphenol A, F and / or S and epoxy novolacs, in particular from bisphenol A diglycidyl ether and bisphenol F diglycidyl ether. The photocurable epoxy resin composition as described.   The core-shell rubber is selected from a core-shell rubber having a core formed from polybutadiene and a shell formed from polybutadiene, polystyrene or polybutadiene-polystyrene copolymer, the core-shell rubber may optionally be dispersed in a matrix, 3. Photocurable epoxy resin composition according to claim 1 or 2, characterized in that is preferably selected from aromatic epoxy resins, in particular diglycidyl ethers based on bisphenol A, F and / or S and epoxy novolacs. object. Said at least one softening agent is a polymer or oligomer having a glass transition temperature of less than 20 ° C., preferably less than 0 ° C., even more preferably less than −30 ° C., very preferably less than −50 ° C., in particular polyester polyol, poly The photocurable epoxy resin composition according to claim 1, which is an ether polyol or a polyester / polyether polyol. Said at least one softener, comprises an epoxy group, in particular phenol monoglycidyl ether or monobasic or dibasic carboxylic acid (3,4-epoxycyclohexane-1-yl) methyl ester The photocurable epoxy resin composition according to any one of claims 1 to 3, wherein: Said at least one softener is polytetramethylene ether glycol, polycaprolactone diol or triol, cardanol glycidyl ether and dicarboxylic acid bis ((3,4-epoxycyclohexyl) methyl) ester, in particular bis ((3,4-epoxy). 6. The photocurable epoxy resin composition according to claim 1, wherein the photocurable epoxy resin composition is selected from the group consisting of cyclohexyl) methyl) adipate. The photoinitiator is selected from sulfonium and iodonium salts, the counter ions of which are hexafluoroantimonate, hexafluorophosphate, and (tetrakis (pentafluoroaryl) borate, in particular triarylsulfonium salts and bis (alkylphenyl). The photocurable epoxy resin composition according to claim 1, wherein the photocurable epoxy resin composition is selected from iodonium salts. The composition is:
(I) a reinforcing aid in an amount of preferably 0.1 to 10% by weight, particularly preferably 0.5 to 2.5% by weight; and / or (ii) preferably 0.1 to 10% by weight, in particular Reactive diluent, preferably in an amount of 5 to 10% by weight; and / or (iii) an adhesion promoter in an amount of preferably 0.1 to 3% by weight, particularly preferably 0.5 to 2% by weight. The photocurable epoxy resin composition according to claim 1, wherein the photocurable epoxy resin composition is contained.   The reactive diluent is selected from aliphatic or aromatic alcohols, in particular C12 / C14 fatty alcohols and alkylphenols, preferably para-tert-butylphenol, monoglycidyl ethers, and oxetanes, in particular trimethylolpropane oxetane (TMPO). The photocurable epoxy resin composition according to claim 8, wherein   The photocurable epoxy resin composition according to claim 8 or 9, wherein the adhesion promoter is selected from a chelate-modified epoxy resin and an epoxy-modified silane.   The reinforcing aid is selected from polyether polyols, in particular polyether polyol block copolymers, preferably one block of the copolymer is not soluble in the epoxy resin and the other block is soluble in the epoxy resin, A two-phase is formed, The photocurable epoxy resin composition in any one of Claims 8-10 characterized by the above-mentioned.   Use of the photocurable epoxy resin composition according to any of claims 1 to 11 as a sealing material, in particular for sealing metal-containing wires or electrical contacts for protection against electrochemical corrosion. A method for sealing a metal-containing wire or electrical contact for protection against electrochemical corrosion comprising:
(Iii) a step of applying the photocurable epoxy resin composition according to any one of claims 1 to 11 to a metal-containing electric wire or an electrical contact in a film shape; and (iv) a method of curing the film by exposure. .   Use according to claim 12 or method according to claim 13, characterized in that the metal-containing wire or electrical contact comprises or consists of aluminum.