CN112831302A - Cationic environment-friendly semiconductor underfill adhesive and preparation method thereof - Google Patents
Cationic environment-friendly semiconductor underfill adhesive and preparation method thereof Download PDFInfo
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- CN112831302A CN112831302A CN202110128493.7A CN202110128493A CN112831302A CN 112831302 A CN112831302 A CN 112831302A CN 202110128493 A CN202110128493 A CN 202110128493A CN 112831302 A CN112831302 A CN 112831302A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a cation environment-friendly semiconductor underfill adhesive and a preparation method thereof, wherein the cation environment-friendly semiconductor underfill adhesive comprises the following components in percentage by weight: 20-50% of epoxy resin, 0.1-5% of cationic initiator, 50-75% of filler, 0.1-3% of silane coupling agent and 0.5-3% of toughening agent; the cation environment-friendly semiconductor underfill adhesive prepared by the invention is environment-friendly and safe, has good compatibility with soldering flux, high flowing speed and strong bonding property after curing, ensures the reliability of packaged semiconductor chip devices, and is suitable for FC-BGA/CSP packaging processes.
Description
Technical Field
The invention relates to the technical field of filling adhesives, in particular to a cationic environment-friendly semiconductor bottom filling adhesive and a preparation method thereof.
Background
With the popularization of 5G technology and the commercialization of 5 nm chip processes, 3 nm processes are under development and are rapidly entering the batch production stage. Further push for the increase of the Integration of Integrated Circuits (ICs), with the advent of Ultra Large Scale Integrated Circuits (ULSIC) and GSIC Large Scale Integrated circuits (Giga Scale Integration) in succession.
In an FC (Flip-chip) Flip chip, which is one of the bare chip packaging technologies, metal bumps (bumps) are formed on an electrode region of an LSI chip, and then the solder bumps are reflow-soldered to the electrode region on a printed substrate. The occupied area of the package is basically the same as the size of the chip, and the package is smaller in volume and thinner in packaging technology. The welding points on the electrode area of the LSI chip are arranged in a ball grid array so as to meet the requirement of rapid increase of the pin number, and the LSI chip also has the advantages of reduction of parasitic parameters, small signal transmission delay, great improvement of use frequency and the like.
Because the clearance between the chip and the PCB is only 30-50 μm or less during chip packaging, the PCB is coated with the soldering flux, and the underfill is required to have good compatibility with the soldering flux. So that during capillary filling, the flowing speed is high, a fully uniform and cavity-free adhesive layer can be formed after curing, and the bonding performance is strong, thereby ensuring the reliability of the packaged semiconductor chip device. However, the compatibility of the existing filling adhesive and the soldering flux is poor, and the actual production and processing requirements are difficult to meet.
Disclosure of Invention
The invention aims to provide the cation environment-friendly semiconductor underfill adhesive and the preparation method thereof, the cation environment-friendly semiconductor underfill adhesive prepared by the method is environment-friendly and safe, has good compatibility with soldering flux, high flowing speed and strong bonding property after curing, ensures the reliability of packaged semiconductor chip devices, and is suitable for FC-BGA/CSP packaging process.
In order to achieve the purpose, the invention adopts the following technical scheme:
the cationic environment-friendly semiconductor underfill comprises the following components in percentage by weight: 20-50% of epoxy resin, 0.1-5% of cationic initiator, 50-75% of filler, 0.1-3% of silane coupling agent and 0.5-3% of toughening agent.
Preferably, the epoxy resin is one or a mixture of any two of bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin.
Preferably, the epoxy resin is a mixture of bisphenol a epoxy resin, bisphenol F epoxy resin and cycloaliphatic epoxy resin, and the weight ratio of the bisphenol a epoxy resin, the bisphenol F epoxy resin and the cycloaliphatic epoxy resin is 0.5:4: 2.
Preferably, the alicyclic epoxy resin is one or a mixture of any more of 3, 4-epoxycyclohexylmethyl 3, 4-epoxycyclohexyl formate, bis ((3, 4-epoxycyclohexyl) methyl) adipate, 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane;
wherein the structural formula of the 3, 4-epoxy cyclohexyl methyl 3, 4-epoxy cyclohexyl formate is as follows:
the structural formula of bis ((3, 4-epoxycyclohexyl) methyl) adipate is:
the structural formula of the 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane is as follows:
preferably, the cationic initiator is one or a mixture of any two of diphenylonium salts of elements in the VIIA main group of the periodic table and triphenylonium salts of elements in the VIA main group of the periodic table.
Preferably, the diphenyl onium salt is diphenyl iodonium salt, and the diphenyl iodonium salt is one of 4-octyloxy diphenyl iodonium hexafluoroantimonate and 4- ((2-hydroxytetradecyl) phenyl) iodonium hexafluoroantimonate or a mixture thereof; the triphenylonium salt is a triphenylsulfonium salt.
Preferably, the diphenyliodonium salt cation has the formula:
the structural formula of the triphenyl sulfonium salt cation is as follows:
the anion paired with the onium salt cation is: BF (BF) generator4 -、PF6 -、AsF6 -、SbF6 -、B(C6F5)4 -、B(C4H2(CF3))4 -One or any mixture of several of them.
Preferably, the filler is fused spherical silica powder; the toughening agent is a core-shell rubber CSR toughening agent.
Preferably, the silane coupling agent is one or a mixture of any more of KH-560, A-186, KH-570, KH-580 and KH-590.
A preparation method of an environment-friendly cationic semiconductor underfill adhesive specifically comprises the following steps:
s1: weighing 25-50 parts of epoxy resin, wherein the weight ratio of bisphenol A epoxy resin to bisphenol F epoxy resin to alicyclic epoxy resin is 0.5:4:2, adding the epoxy resin into a reaction kettle, uniformly stirring, adding 0.1-5 parts of UV cationic initiator, and stirring for dissolving to form a uniform solution;
s2: adding 50-75 parts of filler, 0.1-3 parts of silane coupling agent and 0.5-3 parts of toughening agent into the reaction kettle, and stirring for 1-3 hours in vacuum;
s3: controlling the temperature at room temperature, and standing and defoaming in vacuum for 1-3 hours to prepare the cationic environment-friendly semiconductor underfill.
Lewis acid-base theory: any substance (molecule, ion or radical) that accepts an electron pair is called an acid. Any substance (molecule, ion or radical) that gives an electron pair is called a base. Acids are acceptors of electron pairs and bases are donors of electron pairs, which are also known as lewis acids and lewis bases. The essence of the acid-base reaction is that the base donates an electron pair to form a coordinate bond with the acid, and the reaction product is referred to as an acid-base complex.
For example, hydrogen ion H+Is a cation, the outermost layer outside the nucleus thereofThe sub-track 1S is empty and can accept an electron pair to fill its empty 1S atomic track. Therefore, hydrogen ion H+The cation is known as a lewis acid. The oxygen atom in the epoxy group, the outermost atom orbital 2P of which has 2 lone pair electrons, can be provided. Therefore, the oxygen atom in the epoxy group is a Lewis base.
The reaction mechanism of cationic curing:
1. the onium salt cation is photolyzed under the induction of UV (ultraviolet) light to produce Lewis acid hydrogen ion H+Also called protons, are cations:
2. lewis acid H generated by iodonium salt photolysis+Cation, initiating epoxy group ring opening polymerization curing:
therefore, the curing process is referred to as epoxy UV (ultraviolet) photo-cationic curing.
3. The main active component of the soldering flux is mainly rosin or organic acid. The main component of rosin is resin acid, and the molecular structure of the resin acid is as follows:
from the molecular structure, rosin and organic acids are both carboxylic acids. The active components of organic acid in the soldering flux mainly comprise aliphatic dibasic acid, aromatic acid, amino acid and the like. They are acids, and the function of them in the soldering process is to remove the oxide of the solder and the soldered surface, provide a clean soldering surface, make the solder have good wettability on the soldering surface, so that the soldering is reliable and no cold joint is produced.
The common point of the rosin and the organic acid is that the rosin and the organic acid can generate hydrogen cation H+The lewis acid can attack oxygen atoms of epoxy groups to participate in a cationic curing reaction of the epoxy resin, so that the underfill can smoothly pass through the surface polluted by the soldering flux, the flowing speed is high, a fully uniform and cavity-free adhesive layer can be finally formed, and the adhesive force is strong.
In addition, the cation curing reaction speed is high, heating is not needed, the low-carbon energy-saving environment-friendly effect is achieved, and the chip and other thermal-sensitive microelectronic components are not damaged. The shrinkage rate of the adhesive layer formed after curing is small, stress is reduced, and the adhesive layer can be continuously cured after the UV light source is removed, so that the adhesive layer is completely cured.
After the technical scheme is adopted, the invention has the following beneficial effects:
1. the invention uses a cation curing scheme to initiate ring-opening polymerization of epoxy groups under the attack of cations. The epoxy groups undergo ring opening polymerization, and once initiated by the UV onium salt ions, the flux also participates in the cationic curing reaction. Therefore, the problem of compatibility of the underfill and the soldering flux is solved, the underfill has good wettability on the surface polluted by the soldering flux, the flowing speed is high, a fully uniform and cavity-free adhesive layer is formed, and the adhesive force is strong. A
2. The filler adopts fused spherical silicon dioxide powder, can reduce the coefficient of linear thermal expansion (CTE) of the underfill, enables the CTE of the underfill to be matched with the CTE of a chip, a welding spot and a PCB, eliminates stress, and ensures the reliability of a chip packaging device when the chip packaging device is subjected to thermal shock and high and low temperature circulation.
3. The silane coupling agent is added, so that the wetting effect of the epoxy resin on the filler is facilitated, the epoxy resin and the filler form a uniform underfill system, the viscosity is reduced, and the fluidity of the underfill is improved. Meanwhile, the method is also beneficial to improving the wettability of the underfill to the surfaces of the substrates such as the surface of a semiconductor chip, the surface of a welding spot and the like, and enhancing the adhesive force of the underfill to the substrates, thereby enhancing the adhesive force.
4. The toughening agent adopts the core-shell rubber CSR toughening agent, so that the elasticity of the underfill can be improved, the external physical impact force can be absorbed instantly, and the impact resistance, falling resistance and falling resistance of the semiconductor chip packaging device are enhanced.
5. The invention has strict material selection, meets the RoHS directive of European Union, meets the strict requirements of the semiconductor industry, and also meets the requirements of environmental protection and safety, for example, 4- ((2-hydroxytetradecyl) phenyl) iodonium hexafluoroantimonate is preferred as an iodonium salt, thereby ensuring that the product of the invention becomes an environment-friendly underfill adhesive product.
6. The invention has simple formula, reduces the quality risk of products, ensures the quality stability of batches and is convenient for large-scale industrialization and commercialization.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
Weighing 46.8 parts of epoxy resin, wherein 3.6 parts of bisphenol A epoxy resin, 28.8 parts of bisphenol F epoxy resin and 14.4 parts of 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane, and putting into a reaction kettle. After stirring uniformly, adding 0.1 part of UV cationic initiator 4- ((2-hydroxytetradecyl) phenyl) iodonium hexafluoroantimonate, stirring and dissolving to form a uniform solution. 50 parts of fused spherical silica powder, 0.1 part of silicon KH-570 alkane coupling agent and 3 parts of CSR toughening agent are added into the reaction kettle and stirred for 1 hour in vacuum. Then, controlling the temperature at room temperature, and standing and defoaming for 2 hours in vacuum to obtain the cationic environment-friendly semiconductor underfill.
Example 2
Weighing 20.5 parts of epoxy resin, wherein 1.6 parts of bisphenol A epoxy resin, 12.6 parts of bisphenol F epoxy resin and 6.3 parts of 3, 4-epoxy cyclohexyl methyl 3, 4-epoxy cyclohexyl formate, and putting into a reaction kettle. After stirring uniformly, adding 2 parts of UV cationic initiator 4- ((2-hydroxytetradecyl) phenyl) iodonium hexafluoroantimonate, stirring and dissolving to form a uniform solution. 75 parts of fused spherical silica powder, 1.5 parts of A-186 silane coupling agent and 1 part of CSR toughening agent are added into the reaction kettle and stirred for 3 hours in vacuum. Then, controlling the temperature at room temperature, and standing and defoaming for 2 hours in vacuum to obtain the cationic environment-friendly semiconductor underfill.
Example 3
30 parts of epoxy resin, wherein 2.3 parts of bisphenol A epoxy resin, 18.5 parts of bisphenol F epoxy resin and 9.2 parts of bis ((3, 4-epoxycyclohexyl) methyl) adipate are weighed and put into a reaction kettle. After stirring uniformly, adding 5 parts of UV cationic initiator 4- ((2-hydroxytetradecyl) phenyl) iodonium hexafluoroantimonate, stirring and dissolving to form a uniform solution. And adding 60 parts of fused spherical silica powder, 3 parts of A-186 silane coupling agent and 2 parts of CSR toughening agent into the reaction kettle, and stirring for 1 hour in vacuum. Then, controlling the temperature at room temperature, and standing and defoaming for 3 hours in vacuum to obtain the cationic environment-friendly semiconductor underfill.
Example 4
Weighing 22.7 parts of epoxy resin, wherein 1.8 parts of bisphenol A epoxy resin, 14 parts of bisphenol F epoxy resin and 6.9 parts of 3, 4-epoxy cyclohexyl methyl 3, 4-epoxy cyclohexyl formate, and putting into a reaction kettle. After stirring uniformly, 1.8 parts of UV cationic initiator 4- ((2-hydroxytetradecyl) phenyl) iodonium hexafluoroantimonate is added, and the mixture is stirred and dissolved to form a uniform solution. And adding 73 parts of fused spherical silica powder, 1 part of KH-560 silane coupling agent and 1.5 parts of CSR toughening agent into the reaction kettle, and stirring for 1 hour in vacuum. Then, controlling the temperature at room temperature, and standing and defoaming for 3 hours in vacuum to obtain the cationic environment-friendly semiconductor underfill.
Comparative examples
Weighing 2 parts of bisphenol A epoxy resin, 36 parts of bisphenol F epoxy resin, 2 parts of KH-560 silane coupling agent and 2 parts of CSR toughening agent, and putting into a reaction kettle to stir uniformly. 49 parts of fused spherical silica powder was further charged and stirred in vacuum for 2 hours. Then, 5 parts of modified amine curing agent and 4 parts of imidazole catalyst are added, the temperature is controlled at room temperature, and the mixture is stirred for 3 hours in vacuum. And standing and defoaming for 2 hours in vacuum to obtain the common underfill.
Experimental example 1 cure speed test:
the environmental temperature of an actual production machine is simulated and tested under the condition of 30 ℃ by referring to the standard ASTM C881.
Example 2 flow rate test:
the components of the semiconductor device used were composed of a circuit substrate of FR5 grade and a BGA chip of 0.4mm thickness, and a CMOS element of 10mm corner. And connected with the electrode on the circuit substrate and the half angle of 25 μm height around the chip, and the surfaces of the circuit substrate and the chip are coated with flux in advance. At one end of the chip, the cationic environment-friendly semiconductor underfill is dispensed by a dispenser, the environmental temperature of an actual production machine is simulated, and the time seconds required for the coating surface of the adhesive to reach the opposite filling is observed when the temperature is tested to be 30 ℃.
Experimental example 3 void fraction test:
taking a sample of which the flow speed is tested in the experimental example 2, solidifying the sample, slicing the sample, observing the number of cavities under a microscope, and calculating the cavity rate to represent the compatibility of the product and the soldering flux.
Experimental example 4 coefficient of linear expansion CTE test:
reference is made to the standard ASTM E831.
Example 5 shear strength test:
reference is made to the standard ASTM D1002.
The test results are shown in the following table:
the data in the table show that the cationic environment-friendly semiconductor underfill has good compatibility with the soldering flux, high flowing speed, rapid curing, low coefficient of linear expansion (CTE) and strong bonding force, ensures the reliability of semiconductor chip packaging devices, and is environment-friendly and safe.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The cation environment-friendly semiconductor underfill is characterized by comprising the following components in percentage by weight: 20-50% of epoxy resin, 0.1-5% of cationic initiator, 50-75% of filler, 0.1-3% of silane coupling agent and 0.5-3% of toughening agent.
2. The environment-friendly cationic semiconductor underfill according to claim 1, wherein: the epoxy resin is one or a mixture of any more of bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin.
3. The environment-friendly cationic semiconductor underfill according to claim 2, wherein: the epoxy resin is a mixture of bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin, and the weight ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin to the alicyclic epoxy resin is 0.5:4: 2.
4. The environment-friendly cationic semiconductor underfill according to claim 2, wherein: the alicyclic epoxy resin is one or a mixture of any more of 3, 4-epoxycyclohexylmethyl 3, 4-epoxycyclohexyl formate, bis ((3, 4-epoxycyclohexyl) methyl) adipate, and 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane.
5. The environment-friendly cationic semiconductor underfill according to claim 1, wherein: the cationic initiator is one or a mixture of any two of diphenylonium salts of VIIA main group elements in the periodic table of elements and triphenylonium salts of VIA main group elements in the periodic table of elements.
6. The environment-friendly cationic semiconductor underfill according to claim 5, wherein: the diphenyl onium salt is diphenyl iodonium salt, and the diphenyl iodonium salt is one or a mixture of 4-octyloxy diphenyl iodonium hexafluoroantimonate and 4- ((2-hydroxytetradecyl) phenyl) iodonium hexafluoroantimonate; the triphenylonium salt is a triphenylsulfonium salt.
7. The environment-friendly cationic semiconductor underfill according to claim 6, wherein: the structural formula of the diphenyl iodonium salt cation is as follows:
the structural formula of the triphenyl sulfonium salt cation is as follows:
the anion paired with the onium salt cation is: BF (BF) generator4 -、PF6 -、AsF6 -、SbF6 -、B(C6F5)4 -、B(C4H2(CF3))4 -One or any mixture of several of them.
8. The environment-friendly cationic semiconductor underfill according to claim 1, wherein: the filler is fused spherical silicon dioxide powder; the toughening agent is a core-shell rubber CSR toughening agent.
9. The environment-friendly cationic semiconductor underfill according to claim 1, wherein: the silane coupling agent is one or a mixture of any one of KH-560, A-186, KH-570, KH-580 and KH-590.
10. The preparation method of the cationic environment-friendly semiconductor underfill according to any one of claims 1 to 9, comprising the following steps:
s1: weighing 25-50 parts of epoxy resin, wherein the weight ratio of bisphenol A epoxy resin to bisphenol F epoxy resin to alicyclic epoxy resin is 0.5:4:2, adding the epoxy resin into a reaction kettle, uniformly stirring, adding 0.1-5 parts of UV cationic initiator, and stirring for dissolving to form a uniform solution;
s2: adding 50-75 parts of filler, 0.1-3 parts of silane coupling agent and 0.5-3 parts of toughening agent into the reaction kettle, and stirring for 1-3 hours in vacuum;
s3: controlling the temperature at room temperature, and standing and defoaming in vacuum for 1-3 hours to prepare the cationic environment-friendly semiconductor underfill.
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| US20160376435A1 (en) * | 2014-03-07 | 2016-12-29 | Henkel Ag & Co. Kgaa | Photocurable epoxy resin systems |
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2021
- 2021-01-29 CN CN202110128493.7A patent/CN112831302A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20160376435A1 (en) * | 2014-03-07 | 2016-12-29 | Henkel Ag & Co. Kgaa | Photocurable epoxy resin systems |
| CN108546536A (en) * | 2018-05-17 | 2018-09-18 | 深圳飞世尔新材料股份有限公司 | A kind of OLED frames encapsulation Wear Characteristics of Epoxy Adhesive mixture and preparation method thereof |
| CN109439251A (en) * | 2018-10-19 | 2019-03-08 | 苏州昇攀新材料技术有限公司 | A kind of light-cured epoxy adhesive and preparation method thereof for smart card encapsulating |
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| 陈昭: "环氧模塑料(EMC)的设计和性能", 《电子工业专用设备》 * |
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