JP2017220874A - Microphone module for measurement - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a small-sized microphone module for measurement in which an MEMS (Micro Electro Mechanical Systems) element is used for a sound pressure detection part.SOLUTION: This microphone module for measurement comprises: a nearly cylindrical housing member 1; a capacitive MEMS element 41 housed in the housing member 1; a nearly cylindrical housing member 2 fixed to the housing member 1; and an external terminal 3 that is electrically connected to the capacitive MEMS element 41 and is provided in the housing member 2. The housing member 1 comprises: a sound collection port 11 in one end of the housing member 1; and a rectangular recessed part 12 in the other end of the housing member 1. The rectangular recessed part 12 is connected to the sound collection port 11, and the capacitive MEMS element 41 is housed in the rectangular recessed part 12. The housing member 2 comprises a rear chamber part 31 in the end of the housing member 1 side of two ends of the housing member 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a measurement microphone module.

  Capacitance microphones are widely used, including those for measurement. In a certain capacitance type microphone, a back electrode plate is disposed so as to face the diaphragm, and an elastic conductive member is disposed between the back electrode plate and the circuit board. The circuit board is electrically connected (see, for example, Patent Document 1).

  In another flat-plate microphone, an electrostatic capacitance type MEMS (Micro Electro Mechanical Systems) element is arranged on a substrate (see, for example, Patent Document 2). Generally, a structure of a large number of MEMS elements is formed in a semiconductor wafer, and then the semiconductor wafer is diced to create a large number of MEMS elements.

JP 2006-115008 A JP 2012-039406 A

  When the structure of the microphone described in Patent Document 1 is applied to a MEMS element, a contact force due to a conductive member for electrical conduction is applied to the back electrode of the MEMS element, so that the MEMS element is deformed due to a change in the contact force, The capacitance may change. In the MEMS element, it is difficult to make the contact force constant so that the capacitance does not change. In general, a small measurement microphone module has a mechanism for detecting sound pressure inside, and its shape and size are defined by the IEC standard. When an attempt is made to employ a MEMS element for the sound pressure detection unit of such a measurement microphone module, the above-described MEMS element is assumed to be arranged on a circuit board. It is difficult to arrange a circuit board and use it as a sound pressure detector.

  The present invention has been made in view of the above problems, and an object of the present invention is to obtain a small measurement microphone module using a MEMS element as a sound pressure detection unit.

  The measurement microphone module according to the present invention includes a substantially cylindrical first housing member, a capacitive MEMS element housed in the first housing member, and a substantially cylindrical second member fixed to the first housing member. A housing member and an external terminal electrically connected to the capacitive MEMS element and installed on the second housing member. The first housing member includes a sound collection port at one end of the first housing member and a rectangular rectangular recess at the other end of the first housing member. The rectangular recess is connected to the sound collection port, and the capacitive MEMS element is accommodated in the rectangular recess with a gap with respect to the second accommodation member. In addition, the second housing member includes a rear chamber portion at an end portion on the first housing member side of the two end portions of the second housing member.

  According to the present invention, a small measurement microphone module using a MEMS element as a sound pressure detection unit can be obtained.

FIG. 1 is a perspective view showing a measurement microphone module according to an embodiment of the present invention. FIG. 2 is a perspective view showing the housing member 1 in FIG. FIG. 3 is a perspective view showing the housing member 2 in FIG. 1. FIG. 4 is a cross-sectional view showing the housing member 2 in FIG. FIG. 5 is a perspective view showing an example of a capacitive MEMS element used in the measurement microphone module shown in FIG. FIG. 6 is a perspective view showing a vibrating membrane member and a back electrode member in the capacitive MEMS element 41 shown in FIG. FIG. 7 is a perspective view showing the housing member 1 shown in FIG. 2 in a state in which the capacitive MEMS element 41 shown in FIG. 5 is arranged.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a measurement microphone module according to an embodiment of the present invention.

  The measurement microphone module shown in FIG. 1 includes a substantially cylindrical housing member 1, a substantially cylindrical housing member 2, an external terminal 3, and a capacitive MEMS element 41.

  The housing members 1 and 2 are formed of an insulating member such as ceramic. If the dimensional accuracy can be satisfied, the housing members 1 and 2 may be formed of an insulating resin. The housing member 2 is fixed to the housing member 1. The housing members 1 and 2 have substantially the same outer diameter, are arranged along the same axial direction, and are fixed to each other with an adhesive or the like.

  As will be described later, the capacitive MEMS element 41 is accommodated in the accommodating member 1.

  The external terminal 3 is installed in the housing member 2 and is electrically connected to the capacitive MEMS element 41 housed in the housing member 1 through wire bonding, a wiring pattern, or the like.

  FIG. 2 is a perspective view showing the housing member 1 in FIG.

  As shown in FIGS. 1 and 2, the housing member 1 includes a sound collection port 11 at one end of the housing member 1 and a rectangular recess 12 having a rectangular shape at the other end of the housing member 1.

  The rectangular recess 12 is connected to the sound collection port 11, and the housing member 1 has a cylindrical shape due to the sound collection port 11 and the rectangular recess 12. In this embodiment, the sound collection port 11 is formed in a circular shape, but may have other shapes (such as a square).

  A capacitive MEMS element 41 is accommodated in the rectangular recess 12. Therefore, the depth of the rectangular recess 12 (dimension in the direction parallel to the axis) is set to exceed the height of the capacitive MEMS element 41, and the vertical and horizontal dimensions of the rectangular recess 12 (perpendicular to the axis). The dimension in the direction) is set to be substantially the same as the vertical and horizontal dimensions of the capacitive MEMS element 41 so that the capacitive MEMS element 41 can be accommodated in the rectangular recess 12 with a gap. The inner diameter of the sound collection port 11 is set to be smaller than the width of the rectangular recess 12 in the planar direction.

  Further, for example, as shown in FIG. 2, conductive land portions 21 and 22 and conductive connection portions 23 and 24 are formed on one end surface of the housing member 1, and the conductive land portion 21. And the conductive connection portion 23 are electrically connected by a wiring pattern, and the conductive land portion 22 and the conductive connection portion 24 are electrically connected by a wiring pattern. The conductive land portion 21 and the conductive connection portion 23 are electrically insulated from the conductive land portion 22 and the conductive connection portion 24.

  For example, when the housing member 1 is formed of ceramic, before sintering, the land portions 21 and 22, the connection portions 23 and 24, and the above-described wiring pattern are formed of silver paste or the like, together with the housing member 1 as a ceramic member. Sintered.

  The land portions 21 and 22 are wire bonded to the capacitive MEMS element 41 accommodated in the rectangular recess 12.

  FIG. 3 is a perspective view showing the housing member 2 in FIG. 1. FIG. 4 is a cross-sectional view showing the housing member 2 in FIG.

  The housing member 2 has a shape in which only the end portion on the housing member 1 side is opened, and thus includes a rear chamber portion 31 at the end portion on the housing member 1 side.

  Further, the housing member 2 further includes a cutout portion 32 at a position corresponding to the land portions 21 and 22. The notch 32 is formed in a shape and size so that a wire, a ball or the like in wire bonding between the land portions 21 and 22 and the capacitive MEMS element 41 does not interfere with the housing member 2.

  In this embodiment, the storage member 2 further includes through holes 33 and 34.

  As shown in FIG. 4, each of the through holes 33 and 34 extends from one of the two end surfaces of the housing member 2 to the other, and the external terminal 3 is one of the two ends of the housing member 2. The through holes 33 and 34 are electrically connected to the pins 3a and 3b of the external terminal 3 through the wiring patterns 35 and 36, respectively, at the end opposite to the end on the housing member 1 side. Yes.

  In this embodiment, the through holes 33 and 34 are formed at positions corresponding to the connection portions 23 and 24, respectively, and the end portions of the through holes 33 and 34 are used when the housing members 1 and 2 are fixed to each other. It functions as a connection part that is opposed to and electrically connected to the connection parts 23 and 24, respectively. For example, the end portions of the through holes 33 and 34 are electrically connected and fixed to the connection portions 23 and 24 with a conductive adhesive or the like, respectively.

  The through holes 33 and 34 are provided at different positions, and connection portions similar to the connection portions 23 and 24 are formed on the end surface of the housing member 2 at positions corresponding to the connection portions 23 and 24. And the through holes 33 and 34 may be electrically connected by a wiring pattern or the like.

  For example, when the housing member 2 is formed of ceramic, the through holes 33 and 34 are disposed in the housing member 2 in advance before sintering, the external terminals 3 are fixed to the housing member 2, and the wiring pattern 35, 36 is formed of silver paste or the like and sintered together with the housing member 2.

  FIG. 5 is a perspective view showing an example of the capacitive MEMS element 41 used in the measurement microphone module shown in FIG. FIG. 6 is a perspective view showing the vibrating membrane member 42 and the back electrode member 43 in the capacitive MEMS element 41 shown in FIG.

  As shown in FIGS. 5 and 6, the capacitive MEMS element 41 includes a rectangular vibrating membrane member 42, a back electrode member 43, and an insulating layer member 44. As shown in FIG. 5, the vibrating membrane member 42 and the insulating layer member 44, and the insulating layer member 44 and the back electrode member 43 are fixed to each other with an adhesive, for example. The insulating layer member 44 may be an adhesive resin as long as it has sufficient insulating properties.

  The insulating layer member 44 fixes the vibrating membrane member 42 and the back electrode member 43 in an insulated state with a predetermined gap.

  The vibrating membrane member 42 is a semiconductor member having a rectangular (substantially square here) flat plate shape, and includes a frame portion 42a and a vibrating membrane portion 42b thinner than the frame portion 42a. The vibration film part 42b has a rectangular shape (here, approximately square shape), is positioned inside the frame part 42a, and an inclined surface part is provided between the frame part 42a and the vibration film part 42b.

  For example, the vibrating membrane member 42 is created by digging a center portion of a silicon chip having a predetermined thickness and a predetermined size in a silicon wafer by etching, and dicing the silicon wafer into individual chips. Thereby, the vibrating membrane member 42 (that is, the frame portion 42a and the vibrating membrane portion 42b) is integrally formed as one member.

  The back electrode member 43 is a semiconductor member, and includes a support portion 43a and a main electrode portion 43b.

  The four support portions 43a extend vertically from the four sides of the rectangular main electrode portion 43b having the same plane size as the vibrating membrane portion 42b. The insulating layer member 44 is fixed to the support portion 43a. In addition, a hole (not shown) is formed in the main electrode portion 43b as necessary so that the air between the vibration membrane portion 42b and the main electrode portion 43b can freely move when the vibration membrane portion 42b vibrates. Is done.

  For example, the back electrode member 43 is a silicon chip having a predetermined thickness and a predetermined size on a silicon wafer, and unnecessary portions other than the shape of the back electrode member 43 are removed by etching or the like, and the silicon wafer is diced into individual chips. Created by separating. Thereby, the back electrode member 43 (that is, the support part 43a and the main electrode part 43b) is integrally formed as one member.

  FIG. 7 is a perspective view showing the housing member 1 shown in FIG. 2 in a state in which the capacitive MEMS element 41 shown in FIG. 5 is arranged.

  The capacitive MEMS element 41 shown in FIG. 5 is housed in the rectangular recess 12 of the housing member 1 as shown in FIG. 7, and is fixed to the rectangular recess 12 with an adhesive (for example, an adhesive having elasticity after curing). Is done.

  Thus, after the capacitive MEMS element 41 is fixed to the rectangular recess 12, one of the land parts 21 and 22 and the vibrating membrane member 42 are wire-bonded, and the other of the land parts 21 and 22 and the back electrode member. 43 is wire-bonded.

  In the state where the capacitive MEMS element 41 is housed in the rectangular recess 12 of the housing member 1, the back surface of the capacitive MEMS element 41 (that is, the back surface of the back electrode member 43) and the end surface of the housing member 1 Are substantially the same height, and wire bonding can be easily performed. That is, since the conditions for wire bonding between one of the land portions 21 and 22 and the vibrating membrane member 42 and wire bonding between the other land portion 21 and 22 and the back electrode member 43 can be equalized, the final measurement High reliability can be obtained while reducing the cost of the microphone module.

  Thereafter, the housing member 1 and the housing member 2 are fixed to each other while the connection portions 23 and 24 of the housing member 1 and the through holes 33 and 34 of the housing member 2 are electrically connected to each other. At that time, the connecting portion 23 and the connecting portion 24 are in an insulated state (that is, the through hole 33 and the through hole 34 are in an insulated state).

  For example, on the mutually opposing end surfaces of the housing members 1 and 2, only the space between the connecting portions 23 and 24 of the housing member 1 and the through holes 33 and 34 of the housing member 2 is fixed with a conductive adhesive, respectively. About a part, a filler (adhesive) is filled into the clearance gap between the accommodating members 1 and 2 from the outside, and both are fixed to each other. At this time, in order to prevent a pressure difference between the rear chamber portion 31 and the outside air, a minute through hole may be provided in the rear chamber portion 31 so as to communicate with the outside air.

  By arranging the housing members 1 and 2 and the capacitive MEMS element 41 in this way, the capacitive MEMS element 41 is arranged so as to have an acoustic coaxial structure.

  Note that when the housing members 1 and 2 are fixed to each other, the housing member 1 so that the back surface of the capacitive MEMS element 41 housed in the rectangular recess 12 of the housing member 1 does not contact the end surface of the housing member 2. The depth of the rectangular recess 12 may be larger than the height of the capacitive MEMS element 41, and a gap may be provided between the back surface of the capacitive MEMS element 41 and the end face of the housing member 2. Thereby, irrespective of the vertical and horizontal dimensions of the capacitive MEMS element 41, it is possible to prevent the housing member 2 from contacting the back surface of the capacitive MEMS element 41 and changing its capacitance. . In general, the sensitivity of the capacitive MEMS element 41 is proportional to the variable capacitance of the capacitive MEMS element 41, in other words, the area of the vibrating membrane portion 42b. Therefore, in order to increase the sensitivity of the capacitive MEMS element 41, it is necessary to use a MEMS element having a large area. As described above, by making the depth of the rectangular recess 12 of the housing member 1 greater than the height of the capacitive MEMS element 41, it is possible to mold the outer diameter of the housing member 1 without contacting the housing member 2. The sensitivity of the measurement microphone module can be increased by using the capacitive MEMS element 41 having the maximum vertical and horizontal dimensions that can be accommodated in the largest rectangular recess 12.

  For example, the outer diameter of the housing members 1 and 2 is about 6 mm, the height when the housing members 1 and 2 are fixed to each other is about 3.5 mm, and the vertical and horizontal dimensions of the capacitive MEMS element 41 are as follows. Are about 3.80 mm (diagonal about 5.37 mm), and the height of the capacitive MEMS element 41 is about 0.6 mm. In that case, for example, the height of the vibrating membrane member 42 (that is, the frame portion 42a) and the height of the back electrode member 43 are the same and about 0.3 mm, and the height of the vibrating membrane portion 42b of the vibrating membrane member 42 is set. The (thickness) is about 2 μm. At this time, the depth of the rectangular recess 12 of the housing member 1 is approximately 6.50 mm, and the vertical and horizontal dimensions of the rectangular recess 12 are approximately 3.85 mm (diagonal approximately 5.44 mm).

  Next, the operation of the measurement microphone module will be described.

  In the microphone module for measurement according to this embodiment, the vibration film part 42b of the capacitive MEMS element 41 vibrates according to the sound pressure that enters from the sound collection port 11, and this vibration causes the vibration film part 42b. And the distance between the back electrode member 43 and the capacitance of the capacitive MEMS element 41 (that is, the capacitance between the vibrating membrane member 42 and the back electrode member 43) changes accordingly. To do. At this time, it is possible to obtain desired frequency characteristics by adjusting the shape and volume of the rear chamber portion 31 formed on the back surface side of the capacitive MEMS element 41.

  The vibrating membrane member 42 of the capacitive MEMS element 41 is connected to the pin 3a of the external terminal 3 via the land 21, the connecting portion 23, the through hole 33, the wiring pattern 35, etc., and the capacitive MEMS element The back electrode member 43 of 41 is connected to the pin 3b of the external terminal 3 through the land 22, the connection portion 24, the through hole 34, the wiring pattern 36, and the like. Therefore, the electrostatic capacitance between the pin 3a and the pin 3b changes according to the sound pressure detected by the capacitive MEMS element 41.

  As described above, the measurement microphone module according to the above embodiment includes the substantially cylindrical housing member 1, the capacitive MEMS element 41 housed in the housing member 1, and the substantially fixed member to the housing member 1. A cylindrical housing member 2 and an external terminal 3 that is electrically connected to the capacitive MEMS element 41 and installed in the housing member 2 are provided. The housing member 1 includes a sound collection port 11 at one end of the housing member 1 and a rectangular rectangular recess 12 at the other end of the housing member 1. The rectangular recess 12 is connected to the sound collection port 11, and the capacitive MEMS element 41 is accommodated in the rectangular recess 12. In addition, the housing member 2 includes a rear chamber portion 31 at the end on the housing member 1 side of the two ends of the housing member 2.

  As a result, a small measurement microphone module using the MEMS element for the sound pressure detection unit is obtained.

  Further, since the substantially rectangular capacitive MEMS element 41 is accommodated in the rectangular recess 12, the capacitive MEMS element 41 can be easily positioned and fixed with respect to the accommodating member 1.

  Since the rectangular recess 12 may be used for positioning and fixing of the capacitive MEMS element 41, the diagonal dimension of the rectangular recess 12 and the outer diameter of the housing member 1 are made substantially the same so that the capacitive MEMS element 41 can be used. The vibrating membrane part 42b can be made larger. Thereby, the sensitivity (electrical output per unit sound pressure) of a small measurement microphone module can be increased.

  Various changes and modifications to the above-described embodiment will be apparent to those skilled in the art. Such changes and modifications may be made without departing from the spirit and scope of the subject matter and without diminishing its intended advantages. That is, such changes and modifications are intended to be included within the scope of the claims.

  For example, in the above-described embodiment, the through holes 33 and 34 are arranged in the side wall of the housing member 2. Instead, the through holes 33 and 34 are replaced with the bottom plate portion (that is, the housing member) of the housing member 2. It may be arranged at the end opposite to the first side) and penetrate between the one end surface and the other end surface of the bottom plate portion. In that case, the above-mentioned connection part (connection part electrically connected to the connection parts 23 and 24 of the storage member 1) is provided on the end surface of the side wall of the storage member 2, and the connection part and the through holes 33 and 34 Are electrically connected by a wiring pattern or the like.

  Further, in the above embodiment, the pins 3 a and 3 b of the external terminal 3 may be penetrated through the bottom plate portion of the housing member 2 instead of the through holes 33 and 34. In that case, the above-mentioned connection part (connection part electrically connected to each of the connection parts 23 and 24 of the storage member 1) is provided on the end surface of the side wall of the storage member 2, and the connection part and the pin 3 a of the external terminal 3. , 3b are electrically connected by a wiring pattern or the like along the end surface on the housing member 1 side.

  In the above embodiment, a solid bar-like conductive penetrating member (for example, a metal bar-like member) may be used instead of the through holes 33 and 34.

  The present invention can be applied to a measurement microphone module used in, for example, a sound level meter.

1 housing member (an example of a first housing member)
2 housing member (an example of a second housing member)
3 External terminal 11 Sound collection port 12 Rectangular recess 21, 22 Land 23, 24 Connection (example of first connection)
31 Rear chamber portion 32 Notch portion 33, 34 Through hole (example of conductive penetrating member)
41 Capacitive MEMS element 42 Vibration film member 42a Frame part 42b Vibration film part 43 Back electrode member

The measurement microphone module according to the present invention includes a substantially cylindrical first housing member, a capacitive MEMS element housed in the first housing member, and a substantially cylindrical second member fixed to the first housing member. A housing member and an external terminal electrically connected to the capacitive MEMS element and installed on the second housing member. The first housing member includes a sound collection port at one end of the first housing member and a rectangular rectangular recess at the other end of the first housing member. The rectangular recess is connected to the sound collection port, and the capacitive MEMS element is accommodated in the rectangular recess with a gap with respect to the second accommodation member. In addition, the second housing member includes a rear chamber portion at an end portion on the first housing member side of the two end portions of the second housing member. The capacitive MEMS element has a substantially square shape having substantially the same vertical and horizontal dimensions. The first housing member further includes a land portion on the end surface of the first housing member, and the land portion is wire-bonded to the capacitive MEMS element. The capacitive MEMS element includes a vibrating membrane member, a back electrode member, and an insulating layer member. The insulating layer member fixes the vibrating membrane member and the back electrode member to each other in an insulated state with a predetermined gap. The depth of the rectangular recess exceeds the height of the capacitive MEMS element so that the wire bonding conditions between the land portion and the back electrode member are equal between the back surface of the back electrode member and the end surface of the first housing member. Are approximately the same height. The vertical and horizontal dimensions of the rectangular recess are substantially the same as the vertical and horizontal dimensions of the capacitive MEMS element so that the capacitive MEMS element can be accommodated with a gap in the rectangular recess. The Furthermore, the vibrating membrane member includes a frame portion and a vibrating membrane portion thinner than the frame portion, the vibrating membrane portion is located inside the frame portion, and an inclined surface portion is provided between the frame portion and the vibrating membrane portion. The back electrode member is provided with four support portions and a main electrode portion, and the main electrode portion has the same plane size as the vibrating membrane portion, and the four support portions are the main electrode portions. The insulating layer member is fixed to the four support portions.

The measurement microphone module according to the present invention includes a substantially cylindrical first housing member, a capacitive MEMS element housed in the first housing member, and a substantially cylindrical second member fixed to the first housing member. A housing member and an external terminal electrically connected to the capacitive MEMS element and installed on the second housing member. The first housing member includes a sound collection port at one end of the first housing member and a rectangular rectangular recess at the other end of the first housing member. The rectangular recess is connected to the sound collection port, and the capacitive MEMS element is accommodated in the rectangular recess with a gap with respect to the second accommodation member. In addition, the second housing member includes a rear chamber portion at an end portion on the first housing member side of the two end portions of the second housing member. The capacitive MEMS element has a substantially square shape having substantially the same vertical and horizontal dimensions. The first housing member further includes a land portion on the end surface of the first housing member, and the land portion is wire-bonded to the capacitive MEMS element. The capacitive MEMS element includes a vibrating membrane member, a back electrode member, and an insulating layer member. The insulating layer member fixes the vibrating membrane member and the back electrode member to each other in an insulated state with a predetermined gap. The depth of the rectangular recess exceeds the height of the capacitive MEMS element so that the wire bonding conditions between the land portion and the back electrode member are equal between the back surface of the back electrode member and the end surface of the first housing member. Are approximately the same height. The vertical and horizontal dimensions of the rectangular recess are substantially the same as the vertical and horizontal dimensions of the capacitive MEMS element so that the capacitive MEMS element can be accommodated with a gap in the rectangular recess. The Furthermore, the vibrating membrane member includes a frame portion and a vibrating membrane portion thinner than the frame portion, the vibrating membrane portion is located inside the frame portion, and an inclined surface portion is provided between the frame portion and the vibrating membrane portion. The back electrode member is provided with four support portions and a main electrode portion, and the main electrode portion has the same plane size as the vibrating membrane portion, and the four support portions are the main electrode portions. The insulating layer member is fixed to the four support portions. Further, the second housing member has a shape in which an end portion on the first housing member side is opened, and the rear chamber portion is connected to the rectangular recess, and has a substantially cylindrical shape having a volume capable of obtaining a desired frequency characteristic. It is a hollow part.

Claims (4)

A substantially cylindrical first housing member;
A capacitive MEMS element housed in the first housing member;
A substantially cylindrical second housing member fixed to the first housing member;
An external terminal electrically connected to the capacitive MEMS element and installed on the second housing member;
The first housing member includes a sound collection port at one end of the first housing member, and a rectangular concave portion having a rectangular shape at the other end of the first housing member,
The rectangular recess is connected to the sound collection port,
The capacitive MEMS element is accommodated in the rectangular recess,
The second housing member includes a rear chamber portion at an end portion on the first housing member side of two end portions of the second housing member,
A microphone module for measurement. The first housing member further includes a land portion on an end surface of the first housing member,
The land portion is wire-bonded to the capacitive MEMS element,
The second housing member further includes a notch at a position corresponding to the land portion;
The measurement microphone module according to claim 1. The first housing member further includes a first connection portion on an end surface of the first housing member,
The first connection portion is electrically connected to the land portion by a wiring pattern,
The second housing member further includes a second connection portion on an end surface of the second housing member,
The second connecting portion is provided at a position facing the first connecting portion when the second containing member is fixed to the first containing member,
The second connection portion is electrically connected to the external terminal;
The measurement microphone module according to claim 2. The second housing member further includes a conductive penetrating member extending from one of the two end surfaces of the second housing member to the other,
The external terminal is disposed at an end portion on the opposite side to the end portion on the first housing member side, out of the two end portions of the second housing member,
The second connecting portion is electrically connected to the external terminal via the conductive penetrating member;
The measurement microphone module according to claim 3.

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