JP2010258719A - Acoustic transducer unit - Google Patents

Acoustic transducer unit Download PDF

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JP2010258719A
JP2010258719A JP2009105695A JP2009105695A JP2010258719A JP 2010258719 A JP2010258719 A JP 2010258719A JP 2009105695 A JP2009105695 A JP 2009105695A JP 2009105695 A JP2009105695 A JP 2009105695A JP 2010258719 A JP2010258719 A JP 2010258719A
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acoustic transducer
opening
acoustic
transducer unit
wire
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Hiroshi Hachinohe
啓 八戸
Takahiro Oguchi
貴弘 小口
Koki Sai
弘毅 崔
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an acoustic transducer unit in which wire bonding can be efficiently implemented without limitation. <P>SOLUTION: The acoustic transducer unit comprises: (a) a first member 30 with an opening 39 and a cavity part 38 communicating with the opening 39 are formed therein; (b) a second member 20 which is bonded to the first member 30 and covers the opening 39 of the first member 30; and (c) an acoustic transducer 2 which is disposed within the cavity part 38 of the first member 30 and transduces sound into an electric signal or transduces an electric signal into sound. A terminal electrode 52 formed on a surface 31 of the first member 30 surrounding the opening 39 and an electrode pad 6 formed on an upper face 2a of the acoustic transducing element 2 are electrically bonded via a wire 8. A difference between a height of the surface 31 of the first member 30 surrounding the opening 39 and that of the upper face 2a of the acoustic transducing element 2 on which the electrode pad 6 is formed is small. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明は、音響的トランスデューサユニットに関し、詳しくは、マイクやスピーカーなどの音響変換素子がハウジング内に収納された音響的トランスデューサユニットに関する。   The present invention relates to an acoustic transducer unit, and more particularly to an acoustic transducer unit in which an acoustic conversion element such as a microphone or a speaker is housed in a housing.

従来、音響的トランスデューサユニットの構成について、種々提案されている。   Conventionally, various configurations of acoustic transducer units have been proposed.

例えば図６及び図７の断面図に示すマイクロフォンパッケージ１０１は、セラミック多層基板１０３に形成された凹部１１３の底面１１３ａに、マイクロフォンチップ１０５やＬＳＩチップ１０７が搭載され、凹部１１３を覆うように、セラミック多層基板１０３の上面１０３ａに蓋部材１３１が接合されている。図６に示すように、マイクロフォンチップ１０５の上面１０５ａに形成された電極パッド１０５ｂと、ＬＳＩチップ１０７の上面１０７ａに形成された電極パッド１０７ｂとは、第１のワイヤ１３７によって電気的に接続されている。また、図７に示すように、ＬＳＩチップ１０７の上面１０７ａに形成された他の電極パッド１０７ｃは、第２のワイヤ１３９を用いて内部端子１１９と電気的に接続されている。内部端子１１９は、凹部１１３内に設けられた段差部１１５の上面１１５ａに形成されている。段差部１１５の上面１１５ａの高さ位置をＬＳＩチップ１０７の上面１０７ａの高さ位置と略同等とすることで、容易にワイヤボンディングを実施することができる（例えば、特許文献１参照）。   For example, in the microphone package 101 shown in the cross-sectional views of FIGS. 6 and 7, the microphone chip 105 and the LSI chip 107 are mounted on the bottom surface 113a of the recess 113 formed in the ceramic multilayer substrate 103, and the ceramic package 101 is covered so as to cover the recess 113. A lid member 131 is bonded to the upper surface 103 a of the multilayer substrate 103. As shown in FIG. 6, the electrode pad 105 b formed on the upper surface 105 a of the microphone chip 105 and the electrode pad 107 b formed on the upper surface 107 a of the LSI chip 107 are electrically connected by a first wire 137. Yes. As shown in FIG. 7, another electrode pad 107 c formed on the upper surface 107 a of the LSI chip 107 is electrically connected to the internal terminal 119 using the second wire 139. The internal terminal 119 is formed on the upper surface 115 a of the step portion 115 provided in the recess 113. By making the height position of the upper surface 115a of the stepped portion 115 substantially equal to the height position of the upper surface 107a of the LSI chip 107, wire bonding can be easily performed (see, for example, Patent Document 1).

特開２００８−６６９８３号公報JP 2008-66983 A

図７の構成において、凹部１１３が形成されたセラミック多層基板１０３の上面１０３ａは、ワイヤボンディングされる内部端子１１９が形成された段差部１１５の上面１１５ａより高い位置に存在し、ワイヤボンディングされる内部端子１１９の付近に、セラミック多層基板１０３の凹部１１３を形成する側壁部分が突出している。この側壁部分は、ワイヤボンディング工程の作業中に障害となるおそれがある。そのため、ワイヤボンディングの工程において使用する機械設備や工具等の選択範囲などが制限され、また、作業性を低下させる問題がある。   In the configuration of FIG. 7, the upper surface 103a of the ceramic multilayer substrate 103 in which the recess 113 is formed is located higher than the upper surface 115a of the stepped portion 115 in which the internal terminal 119 to be wire-bonded is formed. In the vicinity of the terminal 119, a side wall portion that forms the recess 113 of the ceramic multilayer substrate 103 protrudes. This side wall portion may become an obstacle during the wire bonding process. For this reason, there is a problem that the selection range of mechanical equipment and tools used in the wire bonding process is limited, and workability is lowered.

本発明は、かかる実情に鑑み、制約を受けずに効率よくワイヤボンディングを実施することができる音響的トランスデューサユニットを提供しようとするものである。   In view of such circumstances, the present invention is intended to provide an acoustic transducer unit that can efficiently perform wire bonding without being restricted.

本発明は、上記課題を解決するために、以下のように構成した音響的トランスデューサユニットを提供する。   In order to solve the above-described problems, the present invention provides an acoustic transducer unit configured as follows.

音響的トランスデューサユニットは、（ａ）開口と、該開口に連通する空洞部とが形成された第１部材と、（ｂ）前記第１部材に接合され、前記第１部材の前記開口を覆う第２部材と、（ｃ）前記第１部材の前記空洞部内に配置され、音響を電気信号に、又は電気信号を音響に変換する音響変換素子とを備える。前記第１部材と前記第２部材のうち少なくとも一方に、前記第１部材の前記空洞部と外部空間とを連通する音響経路が形成されている。前記第１部材の前記空洞部の深さと前記音響変換素子の高さとが略等しい。前記第１部材の前記開口の周囲を囲む面に端子電極が形成されている。前記音響変換素子は、前記第１部材の前記空洞部内に配置されたときに前記第１部材の前記開口付近に延在する面に電極パッドが形成されている。前記第１部材の前記端子電極と前記音響変換素子の前記電極パッドとがワイヤを介して電気的に接合されている。前記第１部材の前記開口の周囲を囲む面の高さと、前記音響変換素子の前記電極パッドが形成された前記面の高さとの差が小さい。   The acoustic transducer unit includes: (a) a first member in which an opening and a cavity communicating with the opening are formed; and (b) a first member that is joined to the first member and covers the opening of the first member. Two members, and (c) an acoustic conversion element that is disposed in the cavity of the first member and converts sound into an electrical signal or an electrical signal into sound. At least one of the first member and the second member is formed with an acoustic path that communicates the cavity of the first member and the external space. The depth of the cavity of the first member is substantially equal to the height of the acoustic transducer. A terminal electrode is formed on a surface surrounding the opening of the first member. The acoustic conversion element has an electrode pad formed on a surface extending near the opening of the first member when the acoustic conversion element is disposed in the cavity of the first member. The terminal electrode of the first member and the electrode pad of the acoustic conversion element are electrically joined via a wire. The difference between the height of the surface surrounding the opening of the first member and the height of the surface on which the electrode pad of the acoustic conversion element is formed is small.

上記構成によれば、第１部材の空洞部の深さと音響変換素子の高さとが略等しく、第１部材の開口の周囲を囲む面の高さと音響変換素子の電極パッドが形成された面の高さとの差が小さい。このように、音響変換素子の電極パッドが形成された面と第１部材の開口の周囲を囲む面とが同じ高さ、あるいは一方が他方よりも突出又は後退する寸法が小さいと、ワイヤボンディングの作業の際に制約を受ける干渉等が発生せず、効率よくワイヤボンディングを実施することができる。   According to the above configuration, the depth of the cavity of the first member is substantially equal to the height of the acoustic transducer, and the height of the surface surrounding the opening of the first member and the surface on which the electrode pad of the acoustic transducer is formed. The difference with height is small. As described above, if the surface on which the electrode pad of the acoustic conversion element is formed and the surface surrounding the opening of the first member have the same height, or if one of the dimensions protruding or retracting is smaller than the other, wire bonding Wire bonding can be carried out efficiently without causing interference or the like that is restricted during work.

好ましくは、前記第２部材は、前記第１部材に対向する主面のうち少なくとも前記ワイヤに対向する部分及びその近傍部分に、前記ワイヤが入り込む凹部が形成されている。   Preferably, the second member has a recess into which the wire enters in at least a portion facing the wire and a portion near the main surface facing the first member.

この場合、第２部材に形成された凹部によって、第１部材の端子電極と音響変換素子の電極パッドとを接続するワイヤと第２部材とが干渉しないようにすることができる。   In this case, the recess formed in the second member can prevent the second member from interfering with the wire connecting the terminal electrode of the first member and the electrode pad of the acoustic transducer.

好ましくは、前記第２部材は、前記第１部材に対向する前記主面の周縁に、前記第１部材側に突出する周壁部が形成されている。   Preferably, the second member is formed with a peripheral wall portion protruding toward the first member on a peripheral edge of the main surface facing the first member.

この場合、簡単な構成で、第２部材にワイヤとの干渉を避けるための凹部を形成することができる。また、第２部材の周壁部が第１部材と係合又は嵌合するように構成し、第１部材と第２部材の位置合わせ、組み立てを容易に行えるようにすることができる。   In this case, a recess for avoiding interference with the wire can be formed in the second member with a simple configuration. Moreover, it can comprise so that the surrounding wall part of a 2nd member may engage or fit with a 1st member, and it can enable it to perform alignment and an assembly of a 1st member and a 2nd member easily.

本発明の音響的トランスデューサユニットは、制約を受けずに効率よくワイヤボンディングを実施することができる。   The acoustic transducer unit of the present invention can efficiently perform wire bonding without being restricted.

音響的トランスデューサユニットの（ａ）部分断面分解斜視図、（ｂ）組立断面図である。（実施例１）FIG. 4A is a partially sectional exploded perspective view of an acoustic transducer unit, and FIG. (Example 1) （ａ）音響的トランスデューサユニットの部分断面分解斜視図、（ｂ）第２部材の斜視図、（ｃ）音響的トランスデューサユニットの分解断面図である。（実施例２）(A) Partial cross-sectional exploded perspective view of acoustic transducer unit, (b) Perspective view of second member, (c) Exploded sectional view of acoustic transducer unit. (Example 2) 音響的トランスデューサユニットの（ａ）分解斜視図、（ｂ）組立断面図である。（実施例２）2A is an exploded perspective view of an acoustic transducer unit, and FIG. (Example 2) 音響的トランスデューサユニットの（ａ）斜視図、（ｂ）断面図、（ｃ）断面図である。（実施例３）It is (a) perspective view, (b) sectional view, and (c) sectional view of an acoustic transducer unit. (Example 3) 音響的トランスデューサユニットの（ａ）斜視図、（ｂ）断面図、（ｂ）断面図である。（実施例４）It is (a) perspective view, (b) sectional view, (b) sectional view of an acoustic transducer unit. Example 4 音響的トランスデューサユニットの断面図である。（従来例）It is sectional drawing of an acoustic transducer unit. (Conventional example) 音響的トランスデューサユニットの断面図である。（従来例）It is sectional drawing of an acoustic transducer unit. (Conventional example)

以下、本発明の実施の形態について、図１〜図５を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

＜実施例１＞ 実施例１の音響的トランスデューサユニット１０について、図１を参照しながら説明する。   Example 1 An acoustic transducer unit 10 of Example 1 will be described with reference to FIG.

図１（ａ）は、音響的トランスデューサユニット１０の部分断面分解斜視図である。図１（ｂ）は、図１（ａ）の線Ａ−Ａに沿って切断した組立断面図である。図１に示すように、音響的トランスデューサユニット１０は、大略、第１部材３０と第２部材２０とにより構成されるハウジング内に、音響変換素子であるマイク素子２が収納されている。   FIG. 1A is a partial cross-sectional exploded perspective view of the acoustic transducer unit 10. FIG. 1B is an assembled cross-sectional view taken along line AA in FIG. As shown in FIG. 1, in the acoustic transducer unit 10, a microphone element 2 that is an acoustic conversion element is accommodated in a housing that is configured by a first member 30 and a second member 20.

第１部材３０は、筒部３２と底部３４とが結合された部材であり、筒部３２と底部３４とによって凹部３８が形成されている。凹部３８は、第１部材３０の上面３１ａに形成された開口３９に連通する空洞部である。第１部材３０の上面３１ａは、第１部材３０の開口３９の周囲を囲む面である。第１部材３０は、例えば樹脂材料を用いて、インサートモールド法により端子部材５０と一体に形成される。   The first member 30 is a member in which a cylindrical portion 32 and a bottom portion 34 are coupled, and a concave portion 38 is formed by the cylindrical portion 32 and the bottom portion 34. The recess 38 is a cavity that communicates with the opening 39 formed in the upper surface 31 a of the first member 30. The upper surface 31 a of the first member 30 is a surface surrounding the periphery of the opening 39 of the first member 30. The first member 30 is formed integrally with the terminal member 50 by, for example, a resin material using an insert molding method.

端子部材５０は、第１部材３０の上面３１ａに沿って延在する端子電極５２と、第１部材３０の下面３１ｂに沿って延在する外部端子５６と、第１部材３０の側面３１ｃに沿って延在し端子電極５２と外部端子５６とを接続する中間部分５４とを有する。端子部材５０は、金属などの導電材料、例えば銅により形成される。   The terminal member 50 includes a terminal electrode 52 that extends along the upper surface 31 a of the first member 30, an external terminal 56 that extends along the lower surface 31 b of the first member 30, and a side surface 31 c of the first member 30. And an intermediate portion 54 connecting the terminal electrode 52 and the external terminal 56. The terminal member 50 is formed of a conductive material such as metal, for example, copper.

マイク素子２は、音響を電気信号に変換する音響変換素子部（センサ部）４と周辺回路とを含むモジュール部品であり、例えばＭＥＭＳマイクである。マイク素子２の代わりに、スピーカー素子など、電気信号を音響に変換する音響変換素子を用いてもよい。   The microphone element 2 is a module component including an acoustic conversion element unit (sensor unit) 4 that converts sound into an electric signal and a peripheral circuit, and is, for example, a MEMS microphone. Instead of the microphone element 2, an acoustic conversion element that converts an electrical signal into sound, such as a speaker element, may be used.

マイク素子２は、第１部材３０の底部３４に搭載され、例えば下面２ｂが不図示の接着材によって底部３４の底面３５に固定される。マイク素子２の上面２ａには電極パッド６が形成されている。マイク素子２の上面２ａに形成された電極パッド６と、第１部材３０の上面３１ａに形成された端子電極５２とは、ワイヤ８を介して電気的に接続される。端子部材５０の外部端子５６は、音響的トランスデューサユニット１０が不図示の外部回路に実装される際に、不図示の外部回路に電気的に接続される。   The microphone element 2 is mounted on the bottom portion 34 of the first member 30, and the lower surface 2 b is fixed to the bottom surface 35 of the bottom portion 34 with an adhesive (not shown), for example. An electrode pad 6 is formed on the upper surface 2 a of the microphone element 2. The electrode pad 6 formed on the upper surface 2 a of the microphone element 2 and the terminal electrode 52 formed on the upper surface 31 a of the first member 30 are electrically connected via the wire 8. The external terminal 56 of the terminal member 50 is electrically connected to an external circuit (not shown) when the acoustic transducer unit 10 is mounted on an external circuit (not shown).

マイク素子２の高さは、第１部材３０の凹部３８の深さと略等しい。マイク素子２の上面２ａの高さと、第１部材３０の上面３１ａの高さの差は小さい。すなわち、マイク素子２の上面２ａに形成された電極パッド６と第１部材３０の上面３１に形成された端子電極５２とワイヤボンディングする際に、機械設備や工具の選択などの工程設計の自由度を制限する干渉等が発生しない程度に小さい。例えば、高さの差は０．６ｍｍ以下であることが好ましく、さらに０．４ｍｍ以下であることがより好ましい。したがって、マイク素子２の上面２ａに形成された電極パッド６と第１部材３０の上面３１に形成された端子電極５２とは、制約を受けずに効率よくワイヤボンディングを実施することができる。   The height of the microphone element 2 is substantially equal to the depth of the recess 38 of the first member 30. The difference between the height of the upper surface 2a of the microphone element 2 and the height of the upper surface 31a of the first member 30 is small. That is, when wire bonding is performed on the electrode pad 6 formed on the upper surface 2 a of the microphone element 2 and the terminal electrode 52 formed on the upper surface 31 of the first member 30, the degree of freedom in process design such as selection of mechanical equipment and tools. Is small enough to prevent interference. For example, the height difference is preferably 0.6 mm or less, and more preferably 0.4 mm or less. Therefore, the electrode pad 6 formed on the upper surface 2a of the microphone element 2 and the terminal electrode 52 formed on the upper surface 31 of the first member 30 can be efficiently wire-bonded without being restricted.

第２部材２０は、板状の本体部２１と周壁部２３とが結合された部材であり、本体部２１と周壁部２３とによって凹部２２が形成される。周壁部２３は、本体部２１の第１部材３０に対向する主面２１ｓの周縁に、第１部材３０側に突出するように形成されている。第２部材２０は、例えば樹脂を用いて形成される。   The second member 20 is a member in which a plate-like main body portion 21 and a peripheral wall portion 23 are combined, and the concave portion 22 is formed by the main body portion 21 and the peripheral wall portion 23. The peripheral wall portion 23 is formed on the peripheral edge of the main surface 21 s facing the first member 30 of the main body portion 21 so as to protrude toward the first member 30 side. The second member 20 is formed using a resin, for example.

図１（ｂ）に示すように、第２部材２０は、第１部材３０の上面３１に形成された開口３９を覆うように、下面２３ｓ，２１ｓのうち周壁部２３の先端面２３ｓが、接着剤、熱圧着、熱融着等によって第１部材３０の上面３１ａに接合される。これによって、マイク素子２は、第１部材３０の凹部３８と第２部材２０とによって形成された内部空間４０内に封止される。このとき、ワイヤ８は、第２部材２０の凹部２２に入り込む。   As shown in FIG. 1B, the second member 20 is bonded to the front end surface 23s of the peripheral wall portion 23 of the lower surfaces 23s and 21s so as to cover the opening 39 formed in the upper surface 31 of the first member 30. It is joined to the upper surface 31a of the first member 30 by an agent, thermocompression bonding, heat fusion, or the like. Accordingly, the microphone element 2 is sealed in the internal space 40 formed by the concave portion 38 of the first member 30 and the second member 20. At this time, the wire 8 enters the recess 22 of the second member 20.

第１部材３０の底部３４には、マイク素子２が配置された凹部３８と外部空間とを連通する音響経路として、貫通孔３６が形成されている。   A through hole 36 is formed in the bottom 34 of the first member 30 as an acoustic path that connects the recess 38 in which the microphone element 2 is disposed and the external space.

なお、マイク素子２が配置された内部空間４０と外部空間とを連通する音響経路は、第２部材２０に形成しても、第１部材３０と第２部材２０の両方に形成してもよい。また、内部空間４０から第１部材３０、第２部材２０を経て外部空間に至るように形成しても、内部空間４０から第２部材２０、第１部材３０を経て外部空間に至るように形成してもよい。また、複数本を形成しても、合流あるいは分岐するように形成してもよい。   The acoustic path that communicates the internal space 40 where the microphone element 2 is disposed and the external space may be formed in the second member 20 or in both the first member 30 and the second member 20. . Further, even if the inner space 40 is formed so as to reach the outer space via the first member 30 and the second member 20, the inner space 40 is formed so as to reach the outer space via the second member 20 and the first member 30. May be. Moreover, even if it forms two or more, you may form so that it may merge or branch.

前述した図６のように、ボンディングする二つのパッド１０５ｂ，１０７ｂに高さの差があると、ワイヤボンディング装置で焦点合わせ不良などによる認識不良が発生しやすくなる。また、搭載チップ一つ当たり、焦点を合わせ、画像を認識するまでに要する時間が必要となり、搭載チップ数が増えると、無視できない時間となり、生産性に影響を与える。また、チップ近傍にワイヤボンディングすることが難しく、ワイヤ配線スペースが必要で小型化できない。さらに、不要な容積が必要となり、マイク特性の最適化が困難になる。   As shown in FIG. 6 described above, if there is a difference in height between the two pads 105b and 107b to be bonded, a recognition failure due to a focusing failure or the like is likely to occur in the wire bonding apparatus. In addition, it takes time to focus and recognize an image for each mounted chip. When the number of mounted chips increases, it becomes a time that cannot be ignored, which affects productivity. In addition, it is difficult to perform wire bonding in the vicinity of the chip, and a wire wiring space is required, and the size cannot be reduced. Furthermore, an unnecessary volume is required, and it becomes difficult to optimize the microphone characteristics.

これに対し、実施例１の音響的トランスデューサユニット１０では、ワイヤボンディングパッド６，５２の高さの差が小さいため、上記の問題を回避できる。同時に、通常のワイヤボンディングツールやワイヤボンディング方法を用いても、マイク素子２の近傍にワイヤボンディングが可能となり、ワイヤを短くすることができるので、寄生容量を小さく抑え、Ｓ／Ｎ比の向上した音響的トランスデューサユニットを提供できる。   On the other hand, in the acoustic transducer unit 10 of the first embodiment, since the difference in height between the wire bonding pads 6 and 52 is small, the above problem can be avoided. At the same time, even if a normal wire bonding tool or wire bonding method is used, wire bonding can be performed in the vicinity of the microphone element 2, and the wire can be shortened, so that the parasitic capacitance is reduced and the S / N ratio is improved. An acoustic transducer unit can be provided.

また、位置の正確なボンディングが可能となり、良品率の向上、素子の小型化を実現でき、安価な音響的トランスデューサユニットを提供できる。   In addition, accurate bonding of the positions is possible, the yield rate can be improved, the element can be downsized, and an inexpensive acoustic transducer unit can be provided.

＜実施例２＞ 実施例２の音響的トランスデューサユニット１０ａについて、図２を参照しながら説明する。   Example 2 An acoustic transducer unit 10a of Example 2 will be described with reference to FIG.

実施例２の音響的トランスデューサユニット１０ａは、実施例１の音響的トランスデューサユニット１０と略同様に構成されている。以下では、実施例１と同じ構成部分には同じ符号を用い、実施例１との相違点を中心に説明する。   The acoustic transducer unit 10a according to the second embodiment is configured in substantially the same manner as the acoustic transducer unit 10 according to the first embodiment. In the following, the same reference numerals are used for the same components as in the first embodiment, and differences from the first embodiment will be mainly described.

図２（ａ）は、音響的トランスデューサユニット１０ａの部分断面分解斜視図である。図２（ｂ）は、図２（ａ）の線Ｂ−Ｂに沿って見た第２部材２０ａの斜視図である。図２（ｃ）は、図２（ａ）の線Ｃ−Ｃに沿って切断した分解断面図である。   FIG. 2A is a partial cross-sectional exploded perspective view of the acoustic transducer unit 10a. FIG. 2B is a perspective view of the second member 20a viewed along line BB in FIG. FIG. 2C is an exploded cross-sectional view taken along line CC in FIG.

図２に示すように、実施例２の音響的トランスデューサユニット１０ａは、第２部材２０ａが第１部材３０に嵌合するようになっている。   As shown in FIG. 2, in the acoustic transducer unit 10 a according to the second embodiment, the second member 20 a is fitted to the first member 30.

すなわち、第２部材２０ａは、実施例１と同様に板状の本体部２１ａと周壁部２３ａとが結合された部材である。ただし、実施例１とは異なり、図２（ｃ）に示すように、第２部材２０ａは第１部材３０より外側に広がるように形成されており、周壁部２３ａが第１部材３０の側面３１ｃに外嵌するようになっている。   That is, the second member 20a is a member in which the plate-like main body portion 21a and the peripheral wall portion 23a are coupled as in the first embodiment. However, unlike the first embodiment, as shown in FIG. 2C, the second member 20 a is formed so as to spread outward from the first member 30, and the peripheral wall portion 23 a is a side surface 31 c of the first member 30. It comes to fit outside.

また、図２（ｂ）に示すように、第２部材２０ａは、本体部２１ａの第１部材３０に対向する主面２１ｔに、周壁部２３ａよりも高さの低い突起部２４が形成されている。この突起部２４の先端面２４ｓは、第２部材２０ａが第１部材３０に嵌合するときに、第１部材３０の上面３１ａに当接して主面２１ｔの高さを規制し、図２（ｃ）に示すように、本体部２１ａの第１部材３０に対向する主面２１ｔがワイヤ８に干渉しないようにする。   Further, as shown in FIG. 2 (b), the second member 20a has a protrusion 24 having a height lower than that of the peripheral wall portion 23a on the main surface 21t facing the first member 30 of the main body portion 21a. Yes. When the second member 20a is fitted to the first member 30, the front end surface 24s of the projection 24 abuts against the upper surface 31a of the first member 30 to regulate the height of the main surface 21t, as shown in FIG. As shown in c), the main surface 21t facing the first member 30 of the main body 21a is prevented from interfering with the wire 8.

なお、図２では、端子部材について、端子電極５２ａ以外の部分について図示を省略している。また、第１部材３０の凹部３８と外部空間との間を連通する音響経路の図示を省略している。   In FIG. 2, the illustration of the terminal member other than the terminal electrode 52a is omitted. Further, illustration of an acoustic path communicating between the recess 38 of the first member 30 and the external space is omitted.

実施例２の音響的トランスデューサユニット１０ａは、電極パッド６が形成されたマイク素子２の上面２ａの高さと、第１部材３０の上面３１ａの高さとの差は小さいため、実施例１と同様に、制約を受けずに効率よくワイヤボンディングを実施することができる。また、第２部材２０ａが第１部材３０に外嵌するように構成することで、第１部材３０と第２部材２０ａの位置合わせ、組み立てを容易に行えるようにすることができる。   In the acoustic transducer unit 10a according to the second embodiment, the difference between the height of the upper surface 2a of the microphone element 2 on which the electrode pad 6 is formed and the height of the upper surface 31a of the first member 30 is small. Therefore, wire bonding can be performed efficiently without any restrictions. In addition, by configuring the second member 20a to be fitted on the first member 30, the first member 30 and the second member 20a can be easily aligned and assembled.

＜実施例３＞ 実施例３の音響的トランスデューサユニット１０ｂについて、図３を参照しながら説明する。   Example 3 An acoustic transducer unit 10b of Example 3 will be described with reference to FIG.

図３（ａ）は、音響的トランスデューサユニット１０ｂの分解斜視図である。図３（ｂ）は、図３（ａ）の線Ｂ−Ｂに沿って切断した組立断面図である。図３に示すように、実施例３の音響的トランスデューサユニット１０ｂは、実施例１の音響的トランスデューサユニット１０と略同様に構成されている。   FIG. 3A is an exploded perspective view of the acoustic transducer unit 10b. FIG. 3B is an assembled cross-sectional view taken along line BB in FIG. As shown in FIG. 3, the acoustic transducer unit 10b according to the third embodiment is configured in substantially the same manner as the acoustic transducer unit 10 according to the first embodiment.

ただし、実施例１とは異なり、第２部材２０ｂには、貫通孔２７が形成された板部材２６と、板部材２６の上面２６ａに接合され、貫通孔２７を塞ぐ封止層２８とを含む。板部材２６に形成された貫通孔２７は、図３（ｂ）に示すように、第２部材２０ｂが第１部材３０に接合されたときにワイヤ８が入り込む凹部として機能する。   However, unlike the first embodiment, the second member 20 b includes a plate member 26 in which the through hole 27 is formed, and a sealing layer 28 that is bonded to the upper surface 26 a of the plate member 26 and closes the through hole 27. . The through hole 27 formed in the plate member 26 functions as a recess into which the wire 8 enters when the second member 20b is joined to the first member 30, as shown in FIG.

貫通孔２７は、例えば、板部材２６になる平板状の部材に簡単な追加加工を施すことによって、低コストで形成することができる。封止層２８は、フィルム材等を板部材２６に貼り付けることによって容易に形成することができる。   The through-hole 27 can be formed at low cost, for example, by performing simple additional processing on a flat plate member that becomes the plate member 26. The sealing layer 28 can be easily formed by attaching a film material or the like to the plate member 26.

実施例３の音響的トランスデューサユニット１０ｂは、電極パッド６が形成されたマイク素子２の上面２ａの高さと、第１部材３０の上面３１ａの高さとの差を小さくすることによって、実施例１と同様に、制約を受けずに効率よくワイヤボンディングを実施することができる。また、第２部材２０ｂは簡単な形状であり、製造も容易であるため、製造コストを低減することができる。   The acoustic transducer unit 10b of the third embodiment is different from the first embodiment in that the difference between the height of the upper surface 2a of the microphone element 2 on which the electrode pad 6 is formed and the height of the upper surface 31a of the first member 30 is reduced. Similarly, wire bonding can be performed efficiently without being restricted. Moreover, since the 2nd member 20b is a simple shape and manufacture is also easy, manufacturing cost can be reduced.

＜実施例４＞ 実施例４の音響的トランスデューサユニットについて、図４を参照しながら説明する。   <Example 4> An acoustic transducer unit of Example 4 will be described with reference to FIG.

図４（ａ）は、実施例４の音響的トランスデューサユニットの第１部材３０ｃの斜視図である。図４（ｂ）は、図４（ａ）の線Ａ−Ａに沿って切断した断面図である。図４（ｂｃ）は、図４（ａ）の線Ａ−Ａに沿って切断した断面図であり、マイク素子２が搭載されたときの第１部材３０ｃの断面図である。   FIG. 4A is a perspective view of the first member 30c of the acoustic transducer unit of the fourth embodiment. FIG. 4B is a cross-sectional view taken along line AA in FIG. FIG. 4B is a cross-sectional view taken along line AA in FIG. 4A, and is a cross-sectional view of the first member 30c when the microphone element 2 is mounted.

図４に示すように、第１部材３０ｃは、実施例１と同様に筒部３２ｃと底部３４とが結合された部材であるが、実施例１と異なり、第１部材３０ｃの筒部３２ｃに突起部３２ｐが形成され、第１部材３０ｃの開口３９ｃの周囲を囲む面に段差が形成されている。第１部材の開口の周囲を囲む面のうち最も高くなる突起部３２ｐの先端面３２ｓには、端子電極５２ｃが形成されている。   As shown in FIG. 4, the first member 30 c is a member in which the cylindrical portion 32 c and the bottom portion 34 are coupled as in the first embodiment. However, unlike the first embodiment, the first member 30 c is formed on the cylindrical portion 32 c of the first member 30 c. The protrusion 32p is formed, and a step is formed on the surface surrounding the opening 39c of the first member 30c. A terminal electrode 52c is formed on the tip surface 32s of the protrusion 32p that is the highest among the surfaces surrounding the periphery of the opening of the first member.

端子電極５２ｃは、図４（ｃ）に示すように、第１部材３０ｃの凹部３８に搭載されたマイク素子２の上面２ａに形成された電極パッド６と、ワイヤ８を介して電気的に接続される。電極パッド６が形成されたマイク素子２の上面２ａの高さと、第１部材３０ｃの突起部３２ｐの先端面３２ｓの高さとの差を小さくすることで、実施例１と同様に、制約を受けずに効率よくワイヤボンディングを実施することができる。   As shown in FIG. 4C, the terminal electrode 52c is electrically connected to the electrode pad 6 formed on the upper surface 2a of the microphone element 2 mounted in the recess 38 of the first member 30c via the wire 8. Is done. By reducing the difference between the height of the upper surface 2a of the microphone element 2 on which the electrode pad 6 is formed and the height of the tip end surface 32s of the protrusion 32p of the first member 30c, there is a limitation as in the first embodiment. And wire bonding can be performed efficiently.

図示していないが、第１部材３０ｃに接合される第２部材は、第１部材３０ｃの開口３９ｃの周囲を囲む面に形成された段差部分に係合又は嵌合するように構成される。例えば、第１部材３０ｃの突起部３２ｐに対応して、第２部材の周壁部に切欠部を形成し、第２部材の周壁部の切欠部に第１部材３０ｃの突起部３２ｐが係合又は嵌合するように構成する。これによって、第１部材３０ｃと第２部材の位置合わせ、組み立てを容易に行えるようにすることができる。   Although not shown, the second member joined to the first member 30c is configured to engage or fit into a stepped portion formed on a surface surrounding the opening 39c of the first member 30c. For example, a notch is formed in the peripheral wall of the second member corresponding to the protrusion 32p of the first member 30c, and the protrusion 32p of the first member 30c is engaged with the notch of the peripheral wall of the second member. Configure to fit. Accordingly, the first member 30c and the second member can be easily aligned and assembled.

＜実施例５＞ 実施例５の音響的トランスデューサユニットについて、図５を参照しながら説明する。   <Example 5> An acoustic transducer unit of Example 5 will be described with reference to FIG.

図５（ａ）は、実施例５の音響的トランスデューサユニットの第１部材３０ｄの斜視図である。図５（ｂ）は、図５（ａ）の線Ａ−Ａに沿って切断した断面図である。図５（ｃ）は、図５（ａ）の線Ａ−Ａに沿って切断した断面図であり、マイク素子２が搭載されたときの第１部材３０ｄの断面図である。   FIG. 5A is a perspective view of the first member 30d of the acoustic transducer unit of the fifth embodiment. FIG.5 (b) is sectional drawing cut | disconnected along line AA of Fig.5 (a). FIG. 5C is a cross-sectional view taken along line AA in FIG. 5A, and is a cross-sectional view of the first member 30d when the microphone element 2 is mounted.

図５に示すように、第１部材３０ｄは、実施例１と同様に筒部３２ｄと底部３４とが結合された部材であるが、実施例１と異なり、筒部３２ｄに切欠部３２ｑが形成され、第１部材３０ｄの開口３９ｄの周囲を囲む面に段差が形成されている。第１部材３０ｄの開口３９の周囲を囲む面の、最も低い切欠部３２ｑの底面３２ｔに端子電極５２ｄが形成されている。   As shown in FIG. 5, the first member 30d is a member in which the cylindrical portion 32d and the bottom portion 34 are coupled in the same manner as in the first embodiment, but unlike the first embodiment, a notch portion 32q is formed in the cylindrical portion 32d. A step is formed on the surface surrounding the periphery of the opening 39d of the first member 30d. A terminal electrode 52d is formed on the bottom surface 32t of the lowest notch 32q on the surface surrounding the opening 39 of the first member 30d.

端子電極５２ｄは、図５（ｃ）に示すように、第１部材３０ｄの凹部３８に搭載されたマイク素子２の上面２ａに形成された電極パッド６と、ワイヤ８を介して電気的に接続される。電極パッド６が形成されたマイク素子２の上面２ａの高さと、第１部材３０ｄの切欠部３２ｑの底面３２ｔの高さとの差を小さくし、切欠部３２ｑを適宜な寸法・形状とすることで、実施例１と同様に、制約を受けずに効率よくワイヤボンディングを実施することができる。   As shown in FIG. 5C, the terminal electrode 52d is electrically connected to the electrode pad 6 formed on the upper surface 2a of the microphone element 2 mounted in the recess 38 of the first member 30d via the wire 8. Is done. By reducing the difference between the height of the upper surface 2a of the microphone element 2 on which the electrode pad 6 is formed and the bottom surface 32t of the notch 32q of the first member 30d, the notch 32q is appropriately sized and shaped. As in the first embodiment, wire bonding can be performed efficiently without being restricted.

第２部材２０ｄは、実施例２と同様に、第１部材３０ｄに外嵌するように構成されている。第１部材２０ｄは、上面３１ｔがワイヤ８よりも高くなるように、切欠部３２ｑが形成されているため、ワイヤ８が第２部材２０ｄに干渉しないようになっている。そのため、第２部材２０ｄは、実施例２とは異なり、第２部材２０ｄが第１部材３０ｄに嵌り込む深さを規定する突起部は形成されていない。したがって、実施例５の音響的トランスデューサユニットは、実施例２の音響的トランスデューサユニットよりも、第２部材の構成を簡単にすることができる。   Similarly to the second embodiment, the second member 20d is configured to be fitted on the first member 30d. Since the first member 20d has a notch 32q so that the upper surface 31t is higher than the wire 8, the wire 8 does not interfere with the second member 20d. Therefore, unlike the second embodiment, the second member 20d is not formed with a protrusion that defines the depth with which the second member 20d fits into the first member 30d. Therefore, the acoustic transducer unit according to the fifth embodiment can simplify the configuration of the second member as compared with the acoustic transducer unit according to the second embodiment.

＜まとめ＞ 以上に説明したように、第１部材の開口の周囲を囲む面に端子電極を形成し、この端子電極とワイヤを介して電気的に接続される電極パッドが形成されているマイク素子の上面の高さと端子電極が形成されている第１部材の開口の周囲を囲む面の高さとの差を小さくすることによって、制約を受けずに効率よくワイヤボンディングを実施することができる。   <Summary> As described above, the microphone element in which the terminal electrode is formed on the surface surrounding the periphery of the opening of the first member, and the electrode pad electrically connected to the terminal electrode through the wire is formed. By reducing the difference between the height of the upper surface and the height of the surface surrounding the periphery of the opening of the first member on which the terminal electrode is formed, wire bonding can be performed efficiently without being restricted.

なお、本発明は、上記実施の形態に限定されるものではなく、種々変更を加えて実施することが可能である。   The present invention is not limited to the above embodiment, and can be implemented with various modifications.

例えば、実施例１において、端子部材５０の外部端子５６側を延長し第２部材側に折り曲げ、音響的トランスデューサユニットを外部回路に実装するための端子部を、ハウジングの底面ではなく、ハウジングの上面に設けるようにしてもよい。この場合、同一パッケージで端子部材５０の折り曲げ方向を変えるだけで、実装時の音響経路の方向を簡単に変更でき、例えば、１種類のパッケージで上穴と下穴に対応できる。   For example, in Example 1, the terminal portion for extending the external terminal 56 side of the terminal member 50 and bending it to the second member side to mount the acoustic transducer unit in the external circuit is not the bottom surface of the housing but the top surface of the housing. You may make it provide in. In this case, the direction of the acoustic path at the time of mounting can be easily changed by simply changing the bending direction of the terminal member 50 in the same package. For example, one type of package can correspond to the upper hole and the lower hole.

２ マイク素子（音響変換素子）
６ 電極パッド
８ ワイヤ
１０，１０ａ，１０ｂ 音響的トランスデューサユニット
２０，２０ａ，２０ｂ，２０ｄ 第２部材
２１，２１ａ，２１ｄ 本体部
２２，２２ａ，２２ｄ 凹部
２３，２３ａ，２３ｄ 周壁部
２４ 突起部
２６ 板部材
２７ 貫通孔（凹部）
２８ 封止層
３０，３０ｃ，３０ｄ 第１部材
３２，３２ｃ，３２ｄ 筒部
３４ 底部
３６ 貫通孔（音響経路）
３８ 凹部（空洞部）
３９ 開口
５２，５２ｃ，５２ｄ 端子電極 2 Microphone element (acoustic transducer)
6 Electrode Pad 8 Wire 10, 10a, 10b Acoustic Transducer Unit 20, 20a, 20b, 20d Second Member 21, 21a, 21d Main Body 22, 22a, 22d Recess 23, 23a, 23d Peripheral Wall 24 Protrusion 26 Plate Member 27 Through-hole (concave)
28 Sealing layer 30, 30c, 30d First member 32, 32c, 32d Tube portion 34 Bottom portion 36 Through hole (acoustic path)
38 Recess (cavity)
39 Opening 52, 52c, 52d Terminal electrode

Claims (3)

開口と、該開口に連通する空洞部とが形成された第１部材と、
前記第１部材に接合され、前記第１部材の前記開口を覆う第２部材と、
前記第１部材の前記空洞部内に配置され、音響を電気信号に、又は電気信号を音響に変換する音響変換素子と、
を備え、
前記第１部材と前記第２部材のうち少なくとも一方に、前記第１部材の前記空洞部と外部空間とを連通する音響経路が形成され、
前記第１部材の前記空洞部の深さと前記音響変換素子の高さとが略等しく、
前記第１部材の前記開口の周囲を囲む面に端子電極が形成され、
前記音響変換素子は、前記第１部材の前記空洞部内に配置されたときに前記第１部材の前記開口付近に延在する面に電極パッドが形成され、
前記第１部材の前記端子電極と前記音響変換素子の前記電極パッドとがワイヤを介して電気的に接合され、
前記第１部材の前記開口の周囲を囲む面の高さと、前記音響変換素子の前記電極パッドが形成された前記面の高さとの差が小さいことを特徴とする、音響的トランスデューサユニット。 A first member in which an opening and a cavity communicating with the opening are formed;
A second member joined to the first member and covering the opening of the first member;
An acoustic transducer disposed in the cavity of the first member and converting sound into an electric signal or converting an electric signal into sound;
With
At least one of the first member and the second member is formed with an acoustic path that communicates the cavity of the first member and the external space,
The depth of the hollow portion of the first member is substantially equal to the height of the acoustic transducer,
A terminal electrode is formed on a surface surrounding the opening of the first member,
The acoustic conversion element has an electrode pad formed on a surface extending near the opening of the first member when the acoustic conversion element is disposed in the cavity of the first member.
The terminal electrode of the first member and the electrode pad of the acoustic conversion element are electrically joined via a wire,
The acoustic transducer unit, wherein a difference between a height of a surface surrounding the opening of the first member and a height of the surface on which the electrode pad of the acoustic conversion element is formed is small. 前記第２部材は、前記第１部材に対向する主面のうち少なくとも前記ワイヤに対向する部分及びその近傍部分に、前記ワイヤが入り込む凹部が形成されていることを特徴とする、請求項１に記載の音響的トランスデューサユニット。   The second member is characterized in that a concave portion into which the wire enters is formed in at least a portion facing the wire and a portion in the vicinity thereof on a main surface facing the first member. The acoustic transducer unit as described. 前記第２部材は、前記第１部材に対向する前記主面の周縁に、前記第１部材側に突出する周壁部が形成されていることを特徴とする、請求項２に記載の音響的トランスデューサユニット。   3. The acoustic transducer according to claim 2, wherein the second member is formed with a peripheral wall portion protruding toward the first member on a peripheral edge of the main surface facing the first member. unit.
JP2009105695A 2009-04-23 2009-04-23 Acoustic transducer unit Pending JP2010258719A (en)

Priority Applications (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017220874A (en) * 2016-06-09 2017-12-14 リオン株式会社 Microphone module for measurement
CN109417673A (en) * 2016-04-14 2019-03-01 罗伯特·博世有限公司 Interconnection MEMS (MEMS) device package being molded

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000236596A (en) * 1999-02-17 2000-08-29 Hosiden Corp Semiconductor electret condenser microphone
JP2001169379A (en) * 1999-12-13 2001-06-22 Hosiden Corp Semiconductor electret capacitor microphone
WO2005086532A2 (en) * 2004-03-01 2005-09-15 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
JP2008245267A (en) * 2007-02-26 2008-10-09 Yamaha Corp Silicon microphone

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000236596A (en) * 1999-02-17 2000-08-29 Hosiden Corp Semiconductor electret condenser microphone
JP2001169379A (en) * 1999-12-13 2001-06-22 Hosiden Corp Semiconductor electret capacitor microphone
WO2005086532A2 (en) * 2004-03-01 2005-09-15 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
JP2008245267A (en) * 2007-02-26 2008-10-09 Yamaha Corp Silicon microphone

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109417673A (en) * 2016-04-14 2019-03-01 罗伯特·博世有限公司 Interconnection MEMS (MEMS) device package being molded
JP2017220874A (en) * 2016-06-09 2017-12-14 リオン株式会社 Microphone module for measurement

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