JP2017218490A - Coating agent, resin cured film, and laminate - Google Patents
Coating agent, resin cured film, and laminate Download PDFInfo
- Publication number
- JP2017218490A JP2017218490A JP2016113000A JP2016113000A JP2017218490A JP 2017218490 A JP2017218490 A JP 2017218490A JP 2016113000 A JP2016113000 A JP 2016113000A JP 2016113000 A JP2016113000 A JP 2016113000A JP 2017218490 A JP2017218490 A JP 2017218490A
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- JP
- Japan
- Prior art keywords
- group
- coating agent
- compound
- component
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 107
- 229920005989 resin Polymers 0.000 title claims abstract description 107
- 239000011248 coating agent Substances 0.000 title claims abstract description 98
- -1 divinyl compound Chemical class 0.000 claims abstract description 43
- 150000001875 compounds Chemical class 0.000 claims abstract description 32
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 12
- 239000012948 isocyanate Substances 0.000 claims abstract description 12
- 150000002513 isocyanates Chemical group 0.000 claims abstract description 11
- 125000000129 anionic group Chemical group 0.000 claims abstract description 8
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 7
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 7
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims abstract description 6
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 31
- 125000004432 carbon atom Chemical group C* 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- 238000000576 coating method Methods 0.000 description 21
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 10
- 150000002148 esters Chemical class 0.000 description 10
- 239000003505 polymerization initiator Substances 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 125000005442 diisocyanate group Chemical group 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 7
- 150000003384 small molecules Chemical class 0.000 description 7
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 6
- 238000010526 radical polymerization reaction Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000003085 diluting agent Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 5
- 229920006255 plastic film Polymers 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000007942 carboxylates Chemical group 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 239000007809 chemical reaction catalyst Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- KHAVLLBUVKBTBG-UHFFFAOYSA-N dec-9-enoic acid Chemical compound OC(=O)CCCCCCCC=C KHAVLLBUVKBTBG-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical group OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- 238000003856 thermoforming Methods 0.000 description 3
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- PVAXDNMSAIUMRM-UHFFFAOYSA-N 1,1,2,2,3,3,3-heptafluoropropyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)C(F)(F)OC(=O)C=C PVAXDNMSAIUMRM-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical group CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical group OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 2
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 2
- GNKZMNRKLCTJAY-UHFFFAOYSA-N 4'-Methylacetophenone Chemical compound CC(=O)C1=CC=C(C)C=C1 GNKZMNRKLCTJAY-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 235000019445 benzyl alcohol Nutrition 0.000 description 2
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- PVEOYINWKBTPIZ-UHFFFAOYSA-N but-3-enoic acid Chemical compound OC(=O)CC=C PVEOYINWKBTPIZ-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- RKSYJNCKPUDQET-UHFFFAOYSA-N n,n-dipropylprop-2-enamide Chemical compound CCCN(CCC)C(=O)C=C RKSYJNCKPUDQET-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- SXGAFIBXULBQMK-UHFFFAOYSA-N (2-hydroxyphenyl)methyl prop-2-enoate Chemical compound OC1=CC=CC=C1COC(=O)C=C SXGAFIBXULBQMK-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- SWFHGTMLYIBPPA-UHFFFAOYSA-N (4-methoxyphenyl)-phenylmethanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 SWFHGTMLYIBPPA-UHFFFAOYSA-N 0.000 description 1
- PHWXYKUZSUKPCM-ALCCZGGFSA-N (z)-2-pentan-3-ylbut-2-enedioic acid Chemical compound CCC(CC)C(\C(O)=O)=C\C(O)=O PHWXYKUZSUKPCM-ALCCZGGFSA-N 0.000 description 1
- GYXUNDYSSCDRAG-UHFFFAOYSA-N 1,1,2,2,2-pentafluoroethyl prop-2-enoate Chemical compound FC(F)(F)C(F)(F)OC(=O)C=C GYXUNDYSSCDRAG-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- PCHXZXKMYCGVFA-UHFFFAOYSA-N 1,3-diazetidine-2,4-dione Chemical group O=C1NC(=O)N1 PCHXZXKMYCGVFA-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
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- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- WVFLGSMUPMVNTQ-UHFFFAOYSA-N n-(2-hydroxyethyl)-2-[[1-(2-hydroxyethylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCO WVFLGSMUPMVNTQ-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-N pent-4-enoic acid Chemical compound OC(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-N 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- WPBNLDNIZUGLJL-UHFFFAOYSA-N prop-2-ynyl prop-2-enoate Chemical compound C=CC(=O)OCC#C WPBNLDNIZUGLJL-UHFFFAOYSA-N 0.000 description 1
- 229940080818 propionamide Drugs 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- AQHHHDLHHXJYJD-UHFFFAOYSA-N propranolol Chemical compound C1=CC=C2C(OCC(O)CNC(C)C)=CC=CC2=C1 AQHHHDLHHXJYJD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000036556 skin irritation Effects 0.000 description 1
- 231100000475 skin irritation Toxicity 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical group 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical group OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- AMJYHMCHKZQLAY-UHFFFAOYSA-N tris(2-isocyanatophenoxy)-sulfanylidene-$l^{5}-phosphane Chemical compound O=C=NC1=CC=CC=C1OP(=S)(OC=1C(=CC=CC=1)N=C=O)OC1=CC=CC=C1N=C=O AMJYHMCHKZQLAY-UHFFFAOYSA-N 0.000 description 1
- MTAHZRMCRJONNA-UHFFFAOYSA-N trityl prop-2-enoate Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(OC(=O)C=C)C1=CC=CC=C1 MTAHZRMCRJONNA-UHFFFAOYSA-N 0.000 description 1
- 229960002703 undecylenic acid Drugs 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical group NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
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Abstract
Description
本発明は、硬化性樹脂を含むコーティング剤、樹脂硬化膜及びそれを備える積層体に関する。 The present invention relates to a coating agent containing a curable resin, a cured resin film, and a laminate including the same.
従来、プラスチックや紙、金属、繊維、ガラス、木材などの基材表面には摩擦による擦傷や熱による変質、埃や水の付着による汚染などからの保護のために、樹脂成分が含まれるコーティング剤によるコーティング加工がなされている。特に、重合や架橋により硬化する硬化性樹脂を配合したコーティング剤は、形成される樹脂硬化膜が耐擦傷性に優れているため、多用されている。 Conventionally, a coating agent containing a resin component on the surface of a substrate such as plastic, paper, metal, fiber, glass, or wood to protect it from abrasion due to friction, alteration due to heat, contamination due to adhesion of dust or water, etc. The coating process is done. In particular, a coating agent containing a curable resin that is cured by polymerization or crosslinking is frequently used because the formed resin cured film is excellent in scratch resistance.
ところで、上記の樹脂硬化膜に要求される特性として、例えば、コーティング加工したプラスチックなどの熱成形時においても変性しない耐熱性や、傷が付いたとしても傷を修復できる自己修復性がある。また、基材が熱に弱い物品である場合には、高温を要しない方法で樹脂硬化膜が形成されることが求められる。 By the way, characteristics required for the above-mentioned resin cured film include, for example, heat resistance that does not denature even during thermoforming of coated plastic and the like, and self-repairing ability that can repair a scratch even if it is scratched. Moreover, when a base material is an article weak to heat, it is calculated | required that a resin cured film is formed by the method which does not require high temperature.
これまでにも、活性エネルギー線硬化性のコーティング剤が提案されており、樹脂硬化膜の自己修復性についての検討もなされている。例えば、下記特許文献1には、有機イソシアネートと、ポリカーボネートジオール及びヒドロキシ変性(メタ)アクリレートとを反応させることによって得られるウレタン(メタ)アクリレートを含む活性エネルギー線硬化性組成物が開示されている。 So far, active energy ray-curable coating agents have been proposed, and self-healing properties of cured resin films have been studied. For example, Patent Document 1 below discloses an active energy ray-curable composition containing urethane (meth) acrylate obtained by reacting organic isocyanate with polycarbonate diol and hydroxy-modified (meth) acrylate.
上記特許文献1に記載のウレタン(メタ)アクリレートは、コーティング剤の粘度が高くなり過ぎる傾向にあり、取り扱いが困難となることや塗布ムラが生じやすくなること等、コーティング加工性に問題が起こる場合があった。溶剤などによりコーティング剤の粘度を下げる方法では、多量の溶剤を用いなければならず、後で留去させる工程が煩雑となったり、溶剤の揮発量が多くなり作業環境が悪化したりする等の点で望ましくない。 The urethane (meth) acrylate described in Patent Document 1 has a tendency that the viscosity of the coating agent tends to be too high, and it becomes difficult to handle and uneven coating tends to occur. was there. In the method of reducing the viscosity of the coating agent with a solvent, etc., a large amount of solvent must be used, and the process of distilling off later becomes complicated, or the working environment deteriorates because the amount of volatilization of the solvent increases. Undesirable in terms.
本発明は上記従来の問題に鑑みてなされたものであり、硬化性樹脂の含有濃度を十分に高めても十分に低い粘度を有することができ、自己修復性及び耐熱性に優れた樹脂硬化膜を形成することができるコーティング剤、該コーティング剤により形成される樹脂硬化膜及びそれを備える積層体を提供することを目的とする。 The present invention has been made in view of the above-mentioned conventional problems, and can have a sufficiently low viscosity even when the content concentration of the curable resin is sufficiently increased, and is a cured resin film excellent in self-repairability and heat resistance. It is an object of the present invention to provide a coating agent capable of forming a film, a cured resin film formed by the coating agent, and a laminate including the same.
本発明者らは、上記の課題を解決すべく鋭意研究を重ねた結果、特定の構造を有する硬化性樹脂を用いることにより、上記課題を解決できることを見出し、本発明を完成させるに至った。 As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by using a curable resin having a specific structure, and have completed the present invention.
本発明のコーティング剤は、(A)ポリイソシアネート、(B)下記一般式(1−1)で表される化合物、及び、(C)ヒドロキシ基を少なくとも2個有するポリシロキサン、を反応させて得られるイソシアネート基末端プレポリマーと、(D1)炭素数2〜13のジオール化合物、(D2)アニオン性親水基と少なくとも2個の活性水素とを有する化合物、及び(D3)下記一般式(2)で表されるヒドロキシアルキル(メタ)アクリレートからなる群より選ばれる少なくとも1種の化合物と、を反応させて得られる硬化性樹脂を含有する。 The coating agent of the present invention is obtained by reacting (A) polyisocyanate, (B) a compound represented by the following general formula (1-1), and (C) polysiloxane having at least two hydroxy groups. An isocyanate group-terminated prepolymer, (D1) a diol compound having 2 to 13 carbon atoms, (D2) a compound having an anionic hydrophilic group and at least two active hydrogens, and (D3) in the following general formula (2) It contains a curable resin obtained by reacting at least one compound selected from the group consisting of the hydroxyalkyl (meth) acrylates represented.
[式(1−1)中、R11及びR12はそれぞれ独立に水素原子又はメチル基を表し、R21及びR22はそれぞれ独立に単結合又はエーテル結合を含んでいてもよい炭素数1〜12のアルキレン基を表し、Xは下記一般式(1−2)で表される2価の基を表し、
{式(1−2)中、A11及びA12はそれぞれ独立に炭素数2〜4のアルキレン基を表し、R31及びR32はそれぞれ独立に炭素数1〜3のアルキル基、フェニル基又はハロゲノ基を表し、R4は単結合、−CR5 2−(ただし、R5は水素原子、炭素数1〜3のアルキル基又はフェニル基を表す)で表される基又は−SO2−を表し、b1及びb2はそれぞれ独立に0〜2の整数を表し、c1及びc2はそれぞれ独立に0〜10の整数を表す。}
aは1〜10の整数を表す。]
[In Formula (1-1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 21 and R 22 each independently represent a carbon number 1 to 1 that may contain a single bond or an ether bond. 12 represents an alkylene group, X represents a divalent group represented by the following general formula (1-2),
{Wherein (1-2), A 11 and A 12 represents an alkylene group having 2 to 4 carbon atoms each independently, R 31 and R 32 each independently represents an alkyl group having 1 to 3 carbon atoms, a phenyl group or Represents a halogeno group, R 4 represents a single bond, —CR 5 2 — (wherein R 5 represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms or a phenyl group) or —SO 2 —. B1 and b2 each independently represent an integer of 0 to 2, and c1 and c2 each independently represent an integer of 0 to 10. }
a represents an integer of 1 to 10. ]
[式(2)中、R5は水素原子又はメチル基を表し、R6は炭素数2〜10のアルキレン基を表す。]
Wherein (2), R 5 represents a hydrogen atom or a methyl group, R 6 represents an alkylene group having 2 to 10 carbon atoms. ]
本発明のコーティング剤は、上記特定の硬化性樹脂を含有することにより、その含有濃度を十分に高めても十分に低い粘度を有することができ、コーティング加工性に優れている。また、本発明のコーティング剤は、そのような低い粘度を有しながらも、自己修復性及び耐熱性に優れた樹脂硬化膜を形成することができる。 By containing the specific curable resin, the coating agent of the present invention can have a sufficiently low viscosity even when the content concentration is sufficiently increased, and is excellent in coating processability. Moreover, the coating agent of this invention can form the resin cured film excellent in self-repairing property and heat resistance, while having such a low viscosity.
また、本発明のコーティング剤は、上記特定の硬化性樹脂が活性光線によるラジカル重合反応で十分に硬化できることから、カチオン硬化系のコーティング剤と比較して、後硬化反応に起因する硬化時間の長期化等の問題が生じにくいという利点も有している。 In addition, the coating agent of the present invention can sufficiently cure the specific curable resin by a radical polymerization reaction with actinic rays, and therefore has a longer curing time due to a post-curing reaction than a cationic curing coating agent. There is also an advantage that problems such as conversion are less likely to occur.
本発明はまた、上記本発明に係るコーティング剤を硬化してなる、樹脂硬化膜を提供する。 The present invention also provides a cured resin film obtained by curing the coating agent according to the present invention.
本発明の樹脂硬化膜は、上記本発明に係るコーティング剤の硬化物であることにより、優れた自己修復性及び耐熱性を有することができる。また、本発明の樹脂硬化膜は、上記本発明に係るコーティング剤がコーティング加工性に優れていることから、塗布ムラが抑制され、良好な外観を有することができる。 The cured resin film of the present invention is a cured product of the coating agent according to the present invention, so that it can have excellent self-repairability and heat resistance. Moreover, since the coating agent which concerns on the said this invention is excellent in coating processability, the coating nonuniformity is suppressed and the resin cured film of this invention can have a favorable external appearance.
本発明はまた、基材と、該基材上に設けられた、上記本発明に係る樹脂硬化膜とを備える積層体を提供する。 The present invention also provides a laminate comprising a substrate and the cured resin film according to the present invention provided on the substrate.
硬化性樹脂の含有濃度を十分に高めても十分に低い粘度を有することができ、自己修復性及び耐熱性に優れた樹脂硬化膜を形成することができるコーティング剤、該コーティング剤により形成される樹脂硬化膜及びそれを備える積層体を提供することができる。 Even if the content of the curable resin is sufficiently increased, the coating agent can have a sufficiently low viscosity, and can form a cured resin film excellent in self-repairability and heat resistance, and is formed by the coating agent. A cured resin film and a laminate including the resin cured film can be provided.
本実施形態のコーティング剤は、(A)ポリイソシアネート(以下、(A)成分という場合もある)、(B)下記一般式(1−1)で表される化合物(以下、(B)成分という場合もある)、及び、(C)ヒドロキシ基を少なくとも2個有するポリシロキサン(以下、(C)成分という場合もある)、を反応させて得られるイソシアネート基末端プレポリマーと、(D1)炭素数2〜13のジオール化合物(以下、(D1)成分という場合もある)、(D2)アニオン性親水基と少なくとも2個の活性水素とを有する化合物(以下、(D2)成分という場合もある)、及び(D3)下記一般式(2)で表されるヒドロキシアルキル(メタ)アクリレート(以下、(D3)成分という場合もある)からなる群より選ばれる少なくとも1種の化合物(以下、(D)成分という場合もある)と、を反応させて得られる硬化性樹脂を含有する。 The coating agent of this embodiment includes (A) polyisocyanate (hereinafter sometimes referred to as (A) component), (B) a compound represented by the following general formula (1-1) (hereinafter referred to as (B) component) In some cases), and (C) an isocyanate group-terminated prepolymer obtained by reacting (C) a polysiloxane having at least two hydroxy groups (hereinafter also referred to as component (C)), and (D1) carbon number 2 to 13 diol compounds (hereinafter also referred to as (D1) component), (D2) a compound having an anionic hydrophilic group and at least two active hydrogens (hereinafter also referred to as (D2) component), And (D3) at least one compound selected from the group consisting of hydroxyalkyl (meth) acrylates represented by the following general formula (2) (hereinafter sometimes referred to as (D3) component) (Hereinafter, (sometimes referred to D) component) containing a curable resin obtained by reacting, with.
[式(1−1)中、R11及びR12はそれぞれ独立に水素原子又はメチル基を表し、R21及びR22はそれぞれ独立に単結合又はエーテル結合を含んでいてもよい炭素数1〜12のアルキレン基を表し、Xは下記一般式(1−2)で表される2価の基を表し、
{式(1−2)中、A11及びA12はそれぞれ独立に炭素数2〜4のアルキレン基を表し、R31及びR32はそれぞれ独立に炭素数1〜3のアルキル基、フェニル基又はハロゲノ基を表し、R4は単結合、−CR5 2−(ただし、R5は水素原子、炭素数1〜3のアルキル基又はフェニル基を表す)で表される基又は−SO2−を表し、b1及びb2はそれぞれ独立に0〜2の整数を表し、c1及びc2はそれぞれ独立に0〜10の整数を表す。}
aは1〜10の整数を表す。]
[In Formula (1-1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 21 and R 22 each independently represent a carbon number 1 to 1 that may contain a single bond or an ether bond. 12 represents an alkylene group, X represents a divalent group represented by the following general formula (1-2),
{Wherein (1-2), A 11 and A 12 represents an alkylene group having 2 to 4 carbon atoms each independently, R 31 and R 32 each independently represents an alkyl group having 1 to 3 carbon atoms, a phenyl group or Represents a halogeno group, R 4 represents a single bond, —CR 5 2 — (wherein R 5 represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms or a phenyl group) or —SO 2 —. B1 and b2 each independently represent an integer of 0 to 2, and c1 and c2 each independently represent an integer of 0 to 10. }
a represents an integer of 1 to 10. ]
なお、本明細書において、式(1−1)及び式(1−2)中、aが2以上の場合、複数あるA11、A12、R31、R32及びR4はそれぞれ同一であっても異なっていてもよく、b1が2である場合、複数あるR31はそれぞれ同一であっても異なっていてもよく、b2が2である場合、複数あるR32はそれぞれ同一であっても異なっていてもよい。 In the present specification, in the formulas (1-1) and (1-2), when a is 2 or more, a plurality of A 11 , A 12 , R 31 , R 32 and R 4 are the same. When b1 is 2, a plurality of R 31 may be the same or different, and when b2 is 2, a plurality of R 32 may be the same. May be different.
[式(2)中、R5は水素原子又はメチル基を表し、R6は炭素数2〜10のアルキレン基を表す。]
Wherein (2), R 5 represents a hydrogen atom or a methyl group, R 6 represents an alkylene group having 2 to 10 carbon atoms. ]
(A)成分としては、2個以上のイソシアネート基を有する化合物を用いることができ、例えば、ジイソシアネート、トリイソシアネート、テトライソシアネート、ジイソシアネートの二量体もしくは三量体などの変性ポリイソシアネートが挙げられる。 As the component (A), a compound having two or more isocyanate groups can be used, and examples thereof include modified polyisocyanates such as diisocyanate, triisocyanate, tetraisocyanate, diisocyanate dimer or trimer.
ジイソシアネートとしては、例えば、脂肪族ジイソシアネート、脂環式ジイソシアネート及び芳香族ジイソシアネートが挙げられる。これらのジイソシアネートとしては、例えば、ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート等の脂肪族ジイソシアネート化合物;イソホロンジイソシアネート、水添キシリレンジイソシアネート、ジシクロヘキシルメタンジイソシアネート、ノルボルナンジイソシアネート、1,3−ビス(イソシアナトメチル)シクロヘキサン等の脂環式ジイソシアネート化合物;トリレンジイソシアネート、ジフェニルメタンジイソシアネート(MDI)、ナフタレンジイソシアネート、トリジンジイソシアネート、キシリレンジイソシアネート、テトラメチルキシリレンジイソシアネート等の芳香族ジイソシアネート化合物等が挙げられる。 Examples of the diisocyanate include aliphatic diisocyanate, alicyclic diisocyanate, and aromatic diisocyanate. Examples of these diisocyanates include aliphatic diisocyanate compounds such as hexamethylene diisocyanate and trimethylhexamethylene diisocyanate; isophorone diisocyanate, hydrogenated xylylene diisocyanate, dicyclohexylmethane diisocyanate, norbornane diisocyanate, 1,3-bis (isocyanatomethyl) cyclohexane. And alicyclic diisocyanate compounds such as tolylene diisocyanate, diphenylmethane diisocyanate (MDI), naphthalene diisocyanate, tolidine diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, and the like.
トリイソシアネート、テトライソシアネートとしては、例えば、トリフェニルメタントリイソシアネート、ジメチルトリフェニルメタンテトライソシアネート、トリス(イソシアナートフェニル)−チオフォスファート等が挙げられる。 Examples of the triisocyanate and tetraisocyanate include triphenylmethane triisocyanate, dimethyltriphenylmethane tetraisocyanate, and tris (isocyanatophenyl) -thiophosphate.
ジイソシアネートから誘導される変性ポリイソシアネートとしては、2個以上のイソシアネート基を有するものであれば特に制限はなく、例えば、ビウレット構造、イソシアヌレート構造、ウレタン構造、ウレトジオン構造、アロファネート構造、三量体構造などを有するポリイソシアネート、トリメチロールプロパンの脂肪族イソシアネートのアダクト体、ポリメリックMDIなどが挙げられる。 The modified polyisocyanate derived from diisocyanate is not particularly limited as long as it has two or more isocyanate groups. For example, biuret structure, isocyanurate structure, urethane structure, uretdione structure, allophanate structure, trimer structure And the like, adducts of aliphatic isocyanates of trimethylolpropane, polymeric MDI, and the like.
(A)成分は、形成される樹脂硬化膜の着色がより抑えられ、自己修復性がより優れるという観点から、ジイソシアネートが好ましく、脂肪族ジイソシアネート及び脂環式ジイソシアネートがより好ましく、ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、ジシクロヘキシルメタンジイソシアネート、ノルボルナンジイソシアネート及び1,3−ビス(イソシアナトメチル)シクロヘキサンがさらに好ましい。 The component (A) is preferably a diisocyanate, more preferably an aliphatic diisocyanate and an alicyclic diisocyanate, more preferably hexamethylene diisocyanate, isophorone, from the viewpoint that coloring of the formed resin cured film is further suppressed and self-healing properties are more excellent. More preferred are diisocyanate, dicyclohexylmethane diisocyanate, norbornane diisocyanate and 1,3-bis (isocyanatomethyl) cyclohexane.
ポリイソシアネートは1種を単独で用いても2種以上を組み合わせて用いてもよい。 Polyisocyanate may be used individually by 1 type, or may be used in combination of 2 or more type.
(B)成分は、上記一般式(1−1)で表される化合物であるが、一般式(1−1)中のR11及びR12は、コーティング剤の低粘度化による加工性向上(特には、基材等への塗布における操作性向上)という観点から、水素原子が好ましい。 The component (B) is a compound represented by the above general formula (1-1), but R 11 and R 12 in the general formula (1-1) are improved in workability by reducing the viscosity of the coating agent ( In particular, a hydrogen atom is preferable from the viewpoint of improvement in operability in application to a substrate or the like.
一般式(1−1)中のR21及びR22は、形成される樹脂硬化膜の自己修復性及び耐熱性がより優れるという観点から、単結合が好ましい。 R 21 and R 22 in the general formula (1-1) are preferably single bonds from the viewpoint that the cured resin film to be formed is more excellent in self-repairability and heat resistance.
R21又はR22がエーテル結合を含んでいてもよい炭素数1〜12のアルキレン基である場合、例えば、メチレン基、エチレン基、トリメチレン基、プロピレン基、n−ブチレン基、n−ペンチレン基、n−ヘキシレン基、n−ヘプチレン基、n−オクチレン基、−(CH2)2−O−CH2−等が挙げられる。 When R 21 or R 22 is an alkylene group having 1 to 12 carbon atoms that may contain an ether bond, for example, a methylene group, an ethylene group, a trimethylene group, a propylene group, an n-butylene group, an n-pentylene group, n- hexylene group, n- heptylene group, n- octylene group, - (CH 2) 2 -O -CH 2 - , and the like.
一般式(1−2)中のA11及びA12は、形成される樹脂硬化膜の自己修復性及び耐熱性がより優れるという観点から、エチレン基及びプロピレン基が好ましく、エチレン基がより好ましい。 A 11 and A 12 in the general formula (1-2) are preferably an ethylene group and a propylene group, and more preferably an ethylene group, from the viewpoint that the cured resin film formed is more excellent in self-repairability and heat resistance.
一般式(1−2)中のc1及びc2は、形成される樹脂硬化膜の自己修復性及び耐熱性がより優れるという観点から、0〜4が好ましく、0〜2がより好ましい。 C1 and c2 in the general formula (1-2) are preferably 0 to 4 and more preferably 0 to 2 from the viewpoint that the cured resin film formed is more excellent in self-repairability and heat resistance.
一般式(1−2)中のR31及びR32は、形成される樹脂硬化膜の自己修復性及び耐熱性がより優れるという観点から、炭素数1〜3のアルキル基が好ましい。 R 31 and R 32 in the general formula (1-2) are preferably an alkyl group having 1 to 3 carbon atoms from the viewpoint that the cured resin film to be formed is more excellent in self-repairability and heat resistance.
一般式(1−2)中のb1及びb2は、形成される樹脂硬化膜の自己修復性及び耐熱性がより優れるという観点から、0が好ましい。 B1 and b2 in the general formula (1-2) are preferably 0 from the viewpoint that the cured resin film to be formed is more excellent in self-repairability and heat resistance.
一般式(1−2)中のR4は、形成される樹脂硬化膜の自己修復性及び耐熱性がより優れるという観点から、−CR5 2−で表される基が好ましく、R5としては水素原子又はメチル基が好ましく、メチル基がより好ましい。 R 4 in the general formula (1-2), from the viewpoint of self-healing property and heat resistance of the resin cured film to be formed more excellent, -CR 5 2 - preferably a group represented by, as R 5 is A hydrogen atom or a methyl group is preferable, and a methyl group is more preferable.
一般式(1−1)中のaは、形成される樹脂硬化膜の自己修復性及び耐熱性がより優れるという観点から、1〜6が好ましく、1〜3がより好ましい。 In the general formula (1-1), 1 to 6 is preferable and 1 to 3 is more preferable from the viewpoint that the cured resin film to be formed has better self-repairability and heat resistance.
一般式(1)で表される化合物は、例えば下記一般式(3)で表される化合物と、末端不飽和カルボン酸との反応により得ることができる。
[式(3)中、X及びaは、上記一般式(1−1)におけるX及びaと同義である。]
The compound represented by the general formula (1) can be obtained, for example, by reacting a compound represented by the following general formula (3) with a terminal unsaturated carboxylic acid.
[In Formula (3), X and a are synonymous with X and a in the said General formula (1-1). ]
一般式(3)で表される化合物は、例えば、ビスフェノール系化合物又はビフェニル系化合物と、エピクロロヒドリンとの反応により得ることができる。ビスフェノール系化合物としては、例えば、ビスフェノールA、ビスフェノールF、ビスフェノールAD、ビスフェノールS、それらのベンゼン環にハロゲノ基が置換されたもの、それらのアルキレンオキサイド付加物等が挙げられる。ビフェニル系化合物としては、例えば、4,4’−ジヒドロキシ−3,3’,5,5’−テトラメチルビフェニル等が挙げられる。 The compound represented by the general formula (3) can be obtained, for example, by a reaction between a bisphenol compound or a biphenyl compound and epichlorohydrin. Examples of the bisphenol compound include bisphenol A, bisphenol F, bisphenol AD, bisphenol S, those having a halogeno group substituted on their benzene rings, and their alkylene oxide adducts. Examples of the biphenyl compound include 4,4'-dihydroxy-3,3 ', 5,5'-tetramethylbiphenyl and the like.
末端不飽和カルボン酸としては、下記一般式(4)で表される化合物が挙げられる。
[式(4)中、R7は上記一般式(1−1)におけるR11及びR12と同義であり、R8は上記一般式(1−2)におけるR21及びR22と同義である。]
Examples of the terminal unsaturated carboxylic acid include compounds represented by the following general formula (4).
[In Formula (4), R 7 has the same meaning as R 11 and R 12 in General Formula 1-1, and R 8 has the same meaning as R 21 and R 22 in General Formula 1-2. . ]
式(4)で表される化合物としては、例えば、アクリル酸、メタクリル酸、3−ブテン酸、4−ペンテン酸、5−ヘキセン酸、6−ヘプテン酸、7−オクテン酸、8−ノネン酸、9−デセン酸、10−ウンデセン酸、3−アリルオキシプロピオン酸等が挙げられる。これらの中でも、コーティング剤の低粘度化と、形成される樹脂硬化膜の自己修復性及び耐熱性とを高水準で両立する観点から、アクリル酸及びメタクリル酸が好ましい。 Examples of the compound represented by the formula (4) include acrylic acid, methacrylic acid, 3-butenoic acid, 4-pentenoic acid, 5-hexenoic acid, 6-heptenoic acid, 7-octenoic acid, 8-nonenoic acid, Examples include 9-decenoic acid, 10-undecenoic acid, and 3-allyloxypropionic acid. Among these, acrylic acid and methacrylic acid are preferable from the viewpoint of achieving both a low viscosity of the coating agent and a self-restoring property and heat resistance of the formed resin cured film at a high level.
(C)成分としては、コーティング剤の低粘度化と、形成される樹脂硬化膜の耐熱性とを高水準で両立する観点から、下記一般式(5)で表される化合物が好ましい。
[式(5)中、A21及びA22はそれぞれ独立に炭素数2〜4のアルキレン基を表し、d1及びd2はそれぞれ独立に0〜25の整数を表し、R81及びR82はそれぞれ独立に単結合又は炭素数1〜6のアルキレン基を表し、eは10〜500の整数を表す。]
As the component (C), a compound represented by the following general formula (5) is preferable from the viewpoint of achieving both low viscosity of the coating agent and heat resistance of the formed resin cured film at a high level.
[In Formula (5), A 21 and A 22 each independently represent an alkylene group having 2 to 4 carbon atoms, d 1 and d 2 each independently represent an integer of 0 to 25, and R 81 and R 82 are each independently Represents a single bond or an alkylene group having 1 to 6 carbon atoms, and e represents an integer of 10 to 500. ]
A21及びA22としては、エチレン基、プロピレン基が挙げられ、コーティング剤の低粘度化と、形成される樹脂硬化膜の耐熱性とを高水準で両立する観点から、エチレン基が好ましい。 Examples of A 21 and A 22 include an ethylene group and a propylene group, and an ethylene group is preferable from the viewpoint of achieving both low viscosity of the coating agent and heat resistance of the formed resin cured film at a high level.
式(5)中のd1及びd2は、コーティング剤の低粘度化と、形成される樹脂硬化膜の耐熱性とを高水準で両立する観点から、0(即ち−(A21O)−及び−(OA22)−が単結合)〜15が好ましく、0〜10がより好ましい。 D1 and d2 in the formula (5) are 0 (that is,-(A 21 O)-and-from the viewpoint of achieving both low viscosity of the coating agent and heat resistance of the formed resin cured film at a high level. (OA 22) - is preferably a single bond) to 15, 0 being more preferred.
式(5)中のR81及びR82は、コーティング剤の低粘度化と、形成される樹脂硬化膜の耐熱性とを高水準で両立する観点から、単結合又は炭素数1〜3のアルキレン基が好ましく、炭素数1〜3のアルキレン基がより好ましい。 R 81 and R 82 in the formula (5) are each a single bond or an alkylene having 1 to 3 carbon atoms from the viewpoint of achieving both low viscosity of the coating agent and heat resistance of the formed resin cured film at a high level. Group is preferable, and an alkylene group having 1 to 3 carbon atoms is more preferable.
R81及びR82が炭素数1〜6のアルキレン基である場合、例えば、メチレン基、エチレン基、プロピレン基、トリメチレン基、n−ブチレン基、n−ペンチレン基、n−ヘキシレン基等が挙げられる。 When R 81 and R 82 are alkylene groups having 1 to 6 carbon atoms, examples include methylene group, ethylene group, propylene group, trimethylene group, n-butylene group, n-pentylene group, and n-hexylene group. .
式(5)中のeは、コーティング剤の低粘度化と、形成される樹脂硬化膜の耐熱性とを高水準で両立する観点から、15〜100が好ましく、15〜50がより好ましい。 E in Formula (5) is preferably 15 to 100, and more preferably 15 to 50, from the viewpoint of achieving both low viscosity of the coating agent and heat resistance of the formed resin cured film at a high level.
(D)成分は、(D1)炭素数2〜13のジオール化合物、(D2)アニオン性親水基と少なくとも2個の活性水素とを有する化合物、及び(D3)上記一般式(2)で表されるヒドロキシアルキル(メタ)アクリレートからなる群より選ばれる少なくとも1種の化合物である。 The component (D) is represented by (D1) a diol compound having 2 to 13 carbon atoms, (D2) a compound having an anionic hydrophilic group and at least two active hydrogens, and (D3) the general formula (2). And at least one compound selected from the group consisting of hydroxyalkyl (meth) acrylates.
(D1)成分としては、例えば、エチレングリコール、プロピレングリコール、1,3−プロパンジオール、1,4−ブタンジオール、1,5−ヘプタンジオール、ネオペンチルグリコール、1,6−ヘキサンジオール、3−メチル−1,5−ペンタンジオール等のアルカンジオール、ジエチレングリコール、トリエチレングリコール、テトラエチレングリコール、ジプロピレングリコール、トリプロピレングリコール等のエーテル基を有するジオール、1,4−シクロヘキサンジオール、1,4−シクロヘキサンジメタノール等のシクロアルカンジオールが挙げられる。形成される樹脂硬化膜の自己修復性がより優れるという観点から、アルカンジオール及びエーテル基を有するジオールが好ましく、炭素数2〜6のアルカンジオールがより好ましい。 Examples of the component (D1) include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-heptanediol, neopentyl glycol, 1,6-hexanediol, and 3-methyl. -Alkanediols such as 1,5-pentanediol, diols having ether groups such as diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, tripropylene glycol, 1,4-cyclohexanediol, 1,4-cyclohexanedi And cycloalkanediols such as methanol. From the viewpoint that the self-healing property of the formed resin cured film is more excellent, alkanediol and diol having an ether group are preferable, and alkanediol having 2 to 6 carbon atoms is more preferable.
(D2)成分におけるアニオン性親水基としては、カルボキシ基(−COOH)、カルボキシレート基(−COO−)、スルホ基(−SO3H)、スルホネート基(−SO3 −)が挙げられる。得られる硬化性樹脂のアルコール、ケトン及びアセテート等の親水性溶媒や水等への乳化性がより優れるという観点から、カルボキシ基、カルボキシレート基が好ましい。 Examples of the anionic hydrophilic group in the component (D2) include a carboxy group (—COOH), a carboxylate group (—COO − ), a sulfo group (—SO 3 H), and a sulfonate group (—SO 3 − ). From the viewpoint that the resulting curable resin is more excellent in emulsifiability in hydrophilic solvents such as alcohol, ketone and acetate, water and the like, a carboxy group and a carboxylate group are preferable.
(D2)成分としては、例えば、2,2−ジメチロールプロピオン酸、2,2−ジメチロールブタン酸、2,2’−ジメチロールペンタン酸及びそれらの塩等の炭素数3〜8のカルボキシル基及び/又はカルボキシレート基含有化合物、5−スルホイソフタル酸、スルホテレフタル酸、4−スルホフタル酸、5−[4−スルホフェノキシ]イソフタル酸等のジカルボン酸及びそれらの塩と、エチレングリコール、プロピレングリコール、1,4−ブタンジオール、1,6−ヘキサンジオール、ネオペンチルグリコール等の低分子量ポリオールとを反応させて得られるスルホ基及び/又はスルホネート基含有ポリエステルポリオールが挙げられる。これらは1種を単独で又は2種以上を組み合わせて用いることができる。また、カルボキシル基を有するジオールと、芳香族ジカルボン酸、脂肪酸ジカルボン酸等とを反応させて得られるペンダント型カルボキシル基を有するポリエステルポリオール又はその塩も(D2)成分として挙げられる。更に、前記の反応の際にカルボキシル基を有さないジオールをさらに混合して反応させて得られたものであってもよい。得られる硬化性樹脂の上記親水性溶媒や水等への乳化性がより優れるという観点から、2,2−ジメチロールプロピオン酸、2,2−ジメチロールブタン酸が好ましい。 Examples of the component (D2) include C2-C8 carboxyl groups such as 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, 2,2'-dimethylolpentanoic acid, and salts thereof. And / or a carboxylate group-containing compound, 5-sulfoisophthalic acid, sulfoterephthalic acid, 4-sulfophthalic acid, dicarboxylic acids such as 5- [4-sulfophenoxy] isophthalic acid and salts thereof, ethylene glycol, propylene glycol, Examples thereof include a sulfo group and / or a sulfonate group-containing polyester polyol obtained by reacting with a low molecular weight polyol such as 1,4-butanediol, 1,6-hexanediol, or neopentyl glycol. These can be used individually by 1 type or in combination of 2 or more types. Moreover, the polyester polyol which has a pendant type carboxyl group obtained by making diol which has a carboxyl group, aromatic dicarboxylic acid, fatty acid dicarboxylic acid, etc. react, or its salt is also mentioned as (D2) component. Further, it may be obtained by further mixing and reacting a diol having no carboxyl group during the above reaction. 2,2-dimethylolpropionic acid and 2,2-dimethylolbutanoic acid are preferred from the viewpoint that the resulting curable resin is more excellent in emulsifiability in the hydrophilic solvent and water.
(D3)成分としては、形成される樹脂硬化膜の自己修復性がより優れるという観点から、一般式(2)におけるR5が水素原子であることが好ましい。 As the component (D3), R 5 in the general formula (2) is preferably a hydrogen atom from the viewpoint that the cured resin film to be formed has better self-healing properties.
一般式(2)におけるR6は、炭素数2〜10のアルキレン基が直鎖状であっても分岐鎖状であってもよく、例えば、メチレン基、エチレン基、プロピレン基、トリメチレン基、n−ブチレン基、n−ペンチレン基、n−ヘキシレン基、n−ヘプチレン基、n−オクチレン基等が挙げられる。形成される樹脂硬化膜の自己修復性がより優れるという観点から、R6は、炭素数は2〜6のアルキレン基が好ましい。このようなヒドロキシアルキル(メタ)アクリレートとしては、ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレート、2−ヒドロキシブチルアクリレート、4−ヒドロキシブチルアクリレート、6−ヒドロキシヘキシルアクリレート等が挙げられる。 R 6 in the general formula (2) may be a linear or branched alkylene group having 2 to 10 carbon atoms, such as a methylene group, an ethylene group, a propylene group, a trimethylene group, n -Butylene group, n-pentylene group, n-hexylene group, n-heptylene group, n-octylene group, etc. are mentioned. R 6 is preferably an alkylene group having 2 to 6 carbon atoms from the viewpoint that the self-healing property of the cured resin film to be formed is more excellent. Examples of such hydroxyalkyl (meth) acrylates include hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 4-hydroxybutyl acrylate, and 6-hydroxyhexyl acrylate.
(D)成分は、形成される樹脂硬化膜の自己修復性がより優れるという観点から、少なくとも(D1)炭素数2〜13のジオール化合物を含むことが好ましい。また、得られる硬化性樹脂の上記親水性溶媒や水等への乳化性がより優れるという観点から、少なくとも(D2)アニオン性親水基と少なくとも2個の活性水素とを有する化合物を含むことが好ましい。 The component (D) preferably contains at least (D1) a diol compound having 2 to 13 carbon atoms from the viewpoint that the cured resin film to be formed is more excellent in self-repairability. Moreover, from the viewpoint that the emulsifiability of the obtained curable resin in the hydrophilic solvent or water is more excellent, it is preferable to include a compound having at least (D2) an anionic hydrophilic group and at least two active hydrogens. .
本実施形態のコーティング剤は、上記(A)成分、上記(B)成分、及び上記(C)成分を反応させて得られるイソシアネート基末端プレポリマーと、上記(D)成分とを反応させる工程を備える製造方法によって得ることができる。 The coating agent of this embodiment comprises the step of reacting the isocyanate group-terminated prepolymer obtained by reacting the component (A), the component (B), and the component (C) with the component (D). It can obtain by the manufacturing method provided.
本実施形態の方法では、(A)成分、(B)成分及び(C)成分を反応させてイソシアネート基末端プレポリマーを得、次にイソシアネート基末端プレポリマーに上述した(D)成分を反応させることができる。 In the method of this embodiment, the (A) component, the (B) component, and the (C) component are reacted to obtain an isocyanate group-terminated prepolymer, and then the above-mentioned (D) component is reacted with the isocyanate group-terminated prepolymer. be able to.
イソシアネート基末端プレポリマーを製造する際、(A)成分、(B)成分及び(C)成分は、(B)成分及び(C)成分に由来するヒドロキシ基の数に対し、(A)成分に由来するイソシアネート基の数が過剰となるような配合量で反応させることが好ましい。 When the isocyanate group-terminated prepolymer is produced, the component (A), the component (B) and the component (C) are combined with the component (A) with respect to the number of hydroxy groups derived from the component (B) and the component (C). It is preferable to make it react by the compounding quantity that the number of the isocyanate group derived from becomes excess.
形成される樹脂硬化膜の自己修復性がより優れるという観点から、(A)成分、(B)成分及び(C)成分は、(A)成分に由来するイソシアネート基と(B)成分及び(C)成分に由来するヒドロキシ基とのモル比が、イソシアネート基:ヒドロキシ基=100:50〜100:95となるように反応させることが好ましく、100:70〜100:90となるように反応させることがより好ましい。 From the viewpoint that the self-healing property of the cured resin film to be formed is more excellent, the component (A), the component (B) and the component (C) are composed of an isocyanate group derived from the component (A), the component (B) and the component (C). ) It is preferable to make it react so that the molar ratio with the hydroxy group derived from a component may become isocyanate group: hydroxy group = 100: 50-100: 95, and it is made to react so that it may become 100: 70-100: 90. Is more preferable.
(B)成分及び(C)成分の配合比率は、コーティング剤の低粘度化と、形成される樹脂硬化膜の自己修復性とを高水準で両立する観点から、モル比で(B)成分:(C)成分=1:9〜9:1が好ましく、3:7〜8:2がより好ましく、5:5〜7:3がさらに好ましい。 The blending ratio of the component (B) and the component (C) is a molar ratio of the component (B) from the viewpoint of achieving both low viscosity of the coating agent and self-healing property of the cured resin film to be formed at a high level. Component (C) is preferably 1: 9 to 9: 1, more preferably 3: 7 to 8: 2, and still more preferably 5: 5 to 7: 3.
反応温度としては40〜150℃が好適であり、必要に応じて触媒を添加してもよい。触媒としては、例えば、カルボン酸の金属塩(カリウム、錫、ビスマス等)が挙げられ、具体的にはジブチル錫ジラウレート、スタナスオクトエート、ジブチル錫−2−エチルヘキサノエート等が挙げられる。触媒の配合量としては、反応物(例えば、(A)成分、(B)成分及び(C)成分)の合計質量に対して0.001〜0.1質量%が好適であり、0.005〜0.03質量%がより好適である。また、反応中又は反応終了後に、イソシアネート基と反応しない有機溶剤や希釈剤等を添加することができる。 As reaction temperature, 40-150 degreeC is suitable, and you may add a catalyst as needed. Examples of the catalyst include carboxylic acid metal salts (potassium, tin, bismuth, etc.), and specific examples include dibutyltin dilaurate, stannous octoate, dibutyltin-2-ethylhexanoate, and the like. As a compounding quantity of a catalyst, 0.001-0.1 mass% is suitable with respect to the total mass of a reaction material (for example, (A) component, (B) component, and (C) component), 0.005 -0.03 mass% is more suitable. Further, an organic solvent or a diluent that does not react with the isocyanate group can be added during or after the reaction.
有機溶剤としては、例えば、アセトン、メチルエチルケトン、トルエン、テトラヒドロフラン、ジオキサン、ジメチルホルムアミド、N−メチルピロリドン等を使用することができる。 As the organic solvent, for example, acetone, methyl ethyl ketone, toluene, tetrahydrofuran, dioxane, dimethylformamide, N-methylpyrrolidone and the like can be used.
希釈剤としては、例えば、炭素数1〜12のアルコール又は多価アルコールと(メタ)アクリル酸とのエステル、スチレン、α−メチルスチレン、(メタ)アクリル酸アミド等のエチレン性不飽和単量体が挙げられる。中でも前記エステル又はスチレンが好ましい。 Examples of the diluent include ethylenically unsaturated monomers such as esters of C1-C12 alcohols or polyhydric alcohols with (meth) acrylic acid, styrene, α-methylstyrene, (meth) acrylic acid amide. Is mentioned. Among these, the ester or styrene is preferable.
次に、上記の反応で得られたイソシアネート基末端プレポリマーに(D)成分を反応させることができる。(D)成分は、(D1)成分〜(D3)成分をそれぞれ単独で使用してもよく2種又は3種を併用してもよい。また、(D1)成分〜(D3)成分のそれぞれにおいて、複数の化合物を併用することもできる。形成される樹脂硬化膜の自己修復性がより優れるという観点から、(D1)成分を使用することが好ましい。また、得られる硬化性樹脂の上記親水性溶媒や水等への乳化性がより優れるという観点から、(D2)成分を使用することが好ましい。 Next, (D) component can be made to react with the isocyanate group terminal prepolymer obtained by said reaction. As the component (D), the components (D1) to (D3) may be used alone or in combination of two or three. In each of the components (D1) to (D3), a plurality of compounds can be used in combination. From the viewpoint that the cured resin film to be formed is more excellent in self-healing properties, it is preferable to use the component (D1). Moreover, it is preferable to use (D2) component from a viewpoint that the emulsifiability to the said hydrophilic solvent, water, etc. of the curable resin obtained is more excellent.
(D)成分における(D1)成分〜(D3)成分の配合量については、形成される樹脂硬化膜の自己修復性がより優れるという観点から、(D)成分の総モル数に対し、(D1)成分は50〜100モル%が好ましく、80〜100モル%がより好ましく、(D2)成分は0〜50モル%が好ましく、0〜20モル%がより好ましく、(D3)成分は0〜50モル%が好ましく、0〜20モル%がより好ましい。また、(D2)成分を配合する場合は、得られる硬化性樹脂の上記親水性溶媒や水等への乳化性がより優れるという観点から、得られる硬化性樹脂に対しアニオン性親水基が0.05〜5.0質量%の量で含まれるよう調整することが好ましく、0.1〜3.0質量%の量で含まれるよう調整することがより好ましい。 About the compounding quantity of (D1) component-(D3) component in (D) component, from the viewpoint that the self-repair property of the resin cured film formed is more excellent, (D1) with respect to the total number of moles of (D) component. ) Component is preferably 50 to 100 mol%, more preferably 80 to 100 mol%, (D2) component is preferably 0 to 50 mol%, more preferably 0 to 20 mol%, and (D3) component is 0 to 50 mol%. The mol% is preferable, and 0 to 20 mol% is more preferable. Moreover, when mix | blending (D2) component, an anionic hydrophilic group is 0.00 with respect to the obtained curable resin from a viewpoint that the emulsifiability to the said hydrophilic solvent, water, etc. of the obtained curable resin is more excellent. It is preferable to adjust so that it may be contained in the amount of 05-5.0 mass%, and it is more preferable to adjust so that it may be included in the amount of 0.1-3.0 mass%.
また、本発明の効果を損なわない範囲でイソシアネート基末端プレポリマーに低分子量化合物を反応させてもよい。低分子量化合物としては、分子量が400以下のものが好ましく、300以下のものがより好ましい。このような低分子量化合物としては、例えば、トリメチロールプロパン、ペンタエリスリトール、ソルビトール等の3価以上の低分子量アルコール、エチレンジアミン、プロピレンジアミン、ヘキサメチレンジアミン、ジアミノシクロヘキシルメタン、ピペラジン、2−メチルピペラジン、イソホロンジアミン、ジエチレントリアミン、トリエチレンテトラミン等の低分子量ポリアミン等が挙げられる。 Moreover, you may make a low molecular weight compound react with an isocyanate group terminal prepolymer in the range which does not impair the effect of this invention. The low molecular weight compound preferably has a molecular weight of 400 or less, more preferably 300 or less. Examples of such low molecular weight compounds include trimethylolpropane, pentaerythritol, sorbitol and other trivalent or higher molecular weight alcohols, ethylenediamine, propylenediamine, hexamethylenediamine, diaminocyclohexylmethane, piperazine, 2-methylpiperazine, isophorone. Low molecular weight polyamines such as diamine, diethylenetriamine, and triethylenetetramine are listed.
上記の場合の(D)成分及び低分子量化合物の配合量としては、イソシアネート基末端プレポリマーのイソシアネート基が残留しない量が好ましい。例えば、イソシアネート基末端プレポリマー中のイソシアネート基の量を滴定などの手法で測定し、(D)成分及び低分子量化合物中のイソシアネート基と反応し得る基の量が、測定されたイソシアネート基の量と当量以上、好ましくは当量超1.2倍当量以下となるように(D)成分及び低分子量化合物の配合量を設定することができる。 As a compounding quantity of (D) component and a low molecular weight compound in said case, the quantity in which the isocyanate group of an isocyanate group terminal prepolymer does not remain is preferable. For example, the amount of isocyanate group in the isocyanate group-terminated prepolymer is measured by a technique such as titration, and the amount of the isocyanate group in the component (D) and the low molecular weight compound that can react with the isocyanate group is measured. The blending amount of the component (D) and the low molecular weight compound can be set so as to be equivalent to or more, preferably more than equivalent and 1.2 times equivalent or less.
イソシアネート基末端プレポリマーと(D)成分及び必要に応じて低分子量化合物との反応は、例えば、20〜100℃の温度で行うことでき、イソシアネート基が残留しなくなるまで続けることが好ましい。イソシアネート基の残留は、滴定やIRにおけるイソシアネート基由来のピーク観測により確認することができる。 The reaction between the isocyanate group-terminated prepolymer, the component (D) and, if necessary, the low molecular weight compound can be carried out, for example, at a temperature of 20 to 100 ° C., and is preferably continued until no isocyanate group remains. The residual isocyanate group can be confirmed by titration or peak observation derived from the isocyanate group in IR.
硬化性樹脂の重量平均分子量としては、例えば、3000〜150000が挙げられ、取り扱い性がより優れるという観点から、5000〜80000が好ましい。硬化性樹脂の平均分子量は、例えば、(A)成分、(B)成分、(C)成分及び(D)成分の使用量のモル比を調整することによって調整することができる。なお、硬化性樹脂の平均分子量は、例えばゲルパーミエイションクロマトグラフィー(GPC)を用い、ポリエチレングリコール換算法又はポリスチレン換算法により求めることができる。 As a weight average molecular weight of curable resin, 3000-150,000 is mentioned, for example, and 5000-80000 are preferable from a viewpoint that a handleability is more excellent. The average molecular weight of the curable resin can be adjusted, for example, by adjusting the molar ratio of the usage amounts of the component (A), the component (B), the component (C), and the component (D). In addition, the average molecular weight of curable resin can be calculated | required by the polyethylene glycol conversion method or the polystyrene conversion method, for example using gel permeation chromatography (GPC).
本実施形態のコーティング剤は、上述した反応により得られる硬化性樹脂(以下、本実施形態の硬化性樹脂という場合もある)を含有する。コーティング剤における本実施形態の硬化性樹脂の含有量は、用途により適宜調整され得るが、例えば、コーティング剤全量を基準として、30質量%以上が好ましく、50質量%以上がより好ましく、85質量%以上が更に好ましい。 The coating agent of the present embodiment contains a curable resin obtained by the above-described reaction (hereinafter sometimes referred to as the curable resin of the present embodiment). Although content of the curable resin of this embodiment in a coating agent can be suitably adjusted with a use, for example, 30 mass% or more is preferable on the basis of coating agent whole quantity, 50 mass% or more is more preferable, 85 mass% The above is more preferable.
本実施形態のコーティング剤においては、上述した反応により得られる硬化性樹脂をそのままコーティング剤としてもよいし、他の成分を配合してコーティング剤としてもよい。他の成分としては、コーティング剤の用途によっても異なるが、例えば、重合開始剤、光増感剤、硬化促進剤、粘度を調整するための有機溶媒、及び反応性希釈剤等が挙げられる。本実施形態のコーティング剤は重合開始剤を含有することが好ましい。なお、重合開始剤、光増感剤、硬化促進剤等の硬化性樹脂の重合反応を促進する成分は、本実施形態のコーティング剤の貯蔵安定性が低下することによるポットライフの発生を防止できるとの観点から、コーティング剤を基材等に塗布する直前に配合されることが好適である。 In the coating agent of this embodiment, the curable resin obtained by the above-described reaction may be used as it is, or other components may be blended to form a coating agent. Examples of other components include a polymerization initiator, a photosensitizer, a curing accelerator, an organic solvent for adjusting the viscosity, and a reactive diluent, although they vary depending on the application of the coating agent. The coating agent of this embodiment preferably contains a polymerization initiator. In addition, the component which accelerates | stimulates polymerization reaction of curable resin, such as a polymerization initiator, a photosensitizer, and a hardening accelerator, can prevent generation | occurrence | production of the pot life by the storage stability of the coating agent of this embodiment falling. From the viewpoint of the above, it is preferable that the coating agent is blended immediately before the coating agent is applied to the substrate or the like.
重合開始剤は硬化性樹脂の重合反応を促進するために含有される。重合開始剤としては、熱重合開始剤、及び光によりラジカルを発生する光重合開始剤が挙げられる。耐熱性の低い基材(例えば、プラスチックフィルム等)にも使用可能であるという観点から、光重合開始剤を用いることが好ましい。 A polymerization initiator is contained in order to accelerate the polymerization reaction of the curable resin. Examples of the polymerization initiator include a thermal polymerization initiator and a photopolymerization initiator that generates radicals by light. It is preferable to use a photopolymerization initiator from the viewpoint that it can be used for a substrate having low heat resistance (for example, a plastic film).
光重合開始剤としては、例えば、2,2−ジエトキシアセトフェノン、ベンゾフェノン、p−メトキシベンゾフェノン、ベンゾイルメチルエーテル、4−クロロベンゾフェノン、4,4’−ジメトキシベンゾフェノン、アセトフェノン、プロピオンフェノン、キサントン、ベンゾイルぎ酸メチル、ベンジル、ナフトキノン、4−メチルアセトフェノン、アントラキノン、過安息香酸t−ブチル、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド、2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノプロパン−1−オン、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)ブタン−1−オン、2−ヒドロキシ−2−メチル−1−フェニルプロパン−1−オン、1−ヒドロキシシクロヘキシルフェニルケトン、3,6−ビス(2−モルホリノイソブチル)−9−ブチルカルバゾール、ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチルペンチルホスフィンオキサイド、チオキサントン誘導体等が挙げられる。中でも、硬化速度の観点から、ベンゾフェノン、ベンゾイルぎ酸メチル、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド、1−ヒドロキシシクロヘキシルフェニルケトン及び2−ヒドロキシ−2−メチル−1−フェニルプロパン−1−オンが好ましい。これらの光重合開始剤は1種を単独で用いてもよく2種以上を併用してもよい。本実施形態においては、さらに光増感剤を併用することができる。光増感剤としては、例えば、モノ、ジ又はトリエタノールアミン、N−メチルジエタノールアミン、4−ジメチルアミノ安息香酸アルキル(アルキル基の炭素数1〜3)、4−ジメチルアミノアセトフェノン等が挙げられる。 Examples of the photopolymerization initiator include 2,2-diethoxyacetophenone, benzophenone, p-methoxybenzophenone, benzoylmethyl ether, 4-chlorobenzophenone, 4,4′-dimethoxybenzophenone, acetophenone, propionphenone, xanthone, benzoylgi. Acid methyl, benzyl, naphthoquinone, 4-methylacetophenone, anthraquinone, t-butyl perbenzoate, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2-methyl-1- [4- (methylthio) phenyl] -2- Morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1 -Hydroxycyclo Cyclohexyl phenyl ketone, 3,6-bis (2-morpholino isobutyl) -9-butyl-carbazole, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentyl phosphine oxide, thioxanthone derivatives, and the like. Among these, from the viewpoint of curing speed, benzophenone, methyl benzoylformate, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-2-methyl-1-phenylpropan-1-one Is preferred. These photoinitiators may be used individually by 1 type, and may use 2 or more types together. In the present embodiment, a photosensitizer can be used in combination. Examples of the photosensitizer include mono-, di- or triethanolamine, N-methyldiethanolamine, alkyl 4-dimethylaminobenzoate (alkyl group having 1 to 3 carbon atoms), 4-dimethylaminoacetophenone, and the like.
熱重合開始剤としては、公知の有機過酸化物及びアゾ化合物等が挙げられる。有機過酸化物としては、例えば、ケトンパーオキサイド、パーオキシケタール、ハイドロパーオキサイド(クメンハイドロパーオキサイド等)、ジアリルパーオキサイド、ジアシルパーオキサイド(ベンゾイルパーオキサイド、ラウロイルパーオキサイド等)、パーオキシエステル(t−ブチルパーオキシ−2−エチルヘキサノエート)、パーオキシジカーボネート、カリウムパーサルフェート、過酸化水素等が挙げられる。アゾ化合物としては、例えば、2,2’−アゾビス(イソブチロニトリル)、2,2’−アゾビス(2,4−ジメチルバレロニトリル)、ジメチル2,2’−アゾビス(2−メチル)プロピオネート、2,2’−アゾビス(イソ酪酸)ジメチル、4,4’−アゾビス(4−シアノペンタ酸)、2,2’−アゾビス(2−アミジノプロパン)2塩酸塩、及び2,2’−アゾビス{2−メチル−N−〔2−(1−ヒドロキシブチル)〕−プロピオンアミド}、2,2’−アゾビス〔2−メチル−N−(2−ヒドロキシエチル)プロピオンアミド〕等が挙げられる。これらの中でも、硬化速度の観点から2,2’−アゾビス(イソブチロニトリル)及びジメチル2,2’−アゾビス(2−メチル)プロピオネートが好ましい。これらの熱重合開始剤は1種を単独で用いてもよく2種以上を併用してもよい。 Examples of the thermal polymerization initiator include known organic peroxides and azo compounds. Examples of the organic peroxide include ketone peroxide, peroxyketal, hydroperoxide (cumene hydroperoxide, etc.), diallyl peroxide, diacyl peroxide (benzoyl peroxide, lauroyl peroxide, etc.), peroxyester ( t-butylperoxy-2-ethylhexanoate), peroxydicarbonate, potassium persulfate, hydrogen peroxide, and the like. Examples of the azo compound include 2,2′-azobis (isobutyronitrile), 2,2′-azobis (2,4-dimethylvaleronitrile), dimethyl 2,2′-azobis (2-methyl) propionate, 2,2'-azobis (isobutyric acid) dimethyl, 4,4'-azobis (4-cyanopentanoic acid), 2,2'-azobis (2-amidinopropane) dihydrochloride, and 2,2'-azobis {2 -Methyl-N- [2- (1-hydroxybutyl)]-propionamide}, 2,2′-azobis [2-methyl-N- (2-hydroxyethyl) propionamide] and the like. Among these, 2,2'-azobis (isobutyronitrile) and dimethyl 2,2'-azobis (2-methyl) propionate are preferable from the viewpoint of curing speed. These thermal polymerization initiators may be used alone or in combination of two or more.
コーティング剤における重合開始剤の含有量としては、本実施形態の硬化性樹脂100質量部に対し、10質量部以下が好ましく、5質量部以下がより好ましい。 As content of the polymerization initiator in a coating agent, 10 mass parts or less are preferable with respect to 100 mass parts of curable resin of this embodiment, and 5 mass parts or less are more preferable.
硬化促進剤としては、例えば、ナフテン酸コバルト、ジメチルアニリン及びアセチルアセトンが挙げられる。 Examples of the curing accelerator include cobalt naphthenate, dimethylaniline, and acetylacetone.
有機溶媒としては、例えば、メチルエチルケトン、メチルイソブチルケトン、トルエン、酢酸ブチル、メトキシプロパノール、メトキシプロピルアセテート、メトブタ(3−メトキシブタノール)、酢酸3−メトキシブチル、エチレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテル、ジエチレングリコールモノエチルエーテル、トリエチレングリコールモノエチルエーテル、エチレングリコールモノエチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート、エチレングリコールモノブチルエーテル、ジエチレングリコールモノブチルエーテル、エチレングリコールモノブチルエーテルアセテート、ジエチレングリコールモノブチルエーテルアセテート等が挙げられる。 Examples of the organic solvent include methyl ethyl ketone, methyl isobutyl ketone, toluene, butyl acetate, methoxypropanol, methoxypropyl acetate, methobuta (3-methoxybutanol), 3-methoxybutyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether. , Diethylene glycol monoethyl ether, triethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether acetate and the like.
反応性希釈剤としては、例えば、スチレンモノマー類、ジエン類、アクリルモノマー類、ビニル化合物、不飽和ジカルボン酸ジエステル、イミド化合物等が挙げられる。 Examples of reactive diluents include styrene monomers, dienes, acrylic monomers, vinyl compounds, unsaturated dicarboxylic acid diesters, and imide compounds.
スチレンモノマー類としては、スチレン、アルキル、ニトロ、シアノ、ハロゲン等で置換されたスチレン誘導体、ジビニルベンゼン等が挙げられる。 Examples of styrene monomers include styrene derivatives substituted with styrene, alkyl, nitro, cyano, halogen, and the like, divinylbenzene, and the like.
ジエン類としては、ブタジエン、2,3−ジメチルブタジエン、イソプレン、クロロプレン等が挙げられる。 Examples of dienes include butadiene, 2,3-dimethylbutadiene, isoprene, chloroprene and the like.
アクリルモノマー類としては、炭素数1〜18の分岐又は直鎖のアルキル基を有するアクリル酸、炭素数5〜10の二環系炭化水素基を有するアクリル酸、炭素数6〜14の芳香族炭化水素基を有するアクリル酸、炭素数6〜14の芳香族炭化水素基を有するアクリル酸のアルキレンオキサイド付加物、ベンジルアルコール(又はそのアルキレンオキサイド(1〜5モル)付加物)のアクリル酸エステル、アクリル酸アリル、アクリル酸プロパギル、アクリル酸ピペロニル、アクリル酸サリチル、アクリル酸フリル、アクリル酸フルフリル、アクリル酸テトラヒドロフルフリル、アクリル酸ピラニル、アクリル酸フェネチル、アクリル酸クレジル、アクリル酸トリフェニルメチル、アクリル酸クミル、アクリル酸3−(N,N−ジメチルアミノ)プロピル、アクリル酸−2−ヒドロキシエチル、アクリル酸−2−ヒドロキシプロピル、ジアクリル酸1,6−ヘキサンジオール、ジアクリル酸トリシクロデカンジオール、トリメチロールプロパン(又はそのアルキレンオキサイド(1〜15モル)付加物)のトリアクリル酸エステル、ペンタエリスリトール(又はそのアルキレンオキサイド(1〜15モル)付加物)のトリアクリル酸エステル、ペンタエリスリトール(又はそのアルキレンオキサイド(1〜20モル)付加物)のテトラアクリル酸エステル、ジトリメチロールプロパン(又はそのアルキレンオキサイド(1〜20モル)付加物)のテトラアクリル酸エステル、ジペンタエリスリトール(又はそのアルキレンオキサイド(1〜30モル)付加物)のヘキサアクリル酸エステル、アクリル酸−1,1,1−トリフルオロエチル、アクリル酸パーフルオルエチル、アクリル酸パーフルオロ−n−プロピル、アクリル酸パーフルオロ−i−プロピル等のアクリル酸エステル類;アクリル酸アミド、アクリル酸N,N−ジメチルアミド、アクリル酸N,N−ジエチルアミド、アクリル酸N,N−ジプロピルアミド、アクリル酸N,N−ジ−i−プロピルアミド、アクリル酸アントラセニルアミド等のアクリル酸アミド;アクリル酸アニリド、アクリロイルニトリル、アクロレイン等が挙げられる。 Examples of acrylic monomers include acrylic acid having a branched or straight chain alkyl group having 1 to 18 carbon atoms, acrylic acid having a bicyclic hydrocarbon group having 5 to 10 carbon atoms, and aromatic carbonization having 6 to 14 carbon atoms. Acrylic acid having a hydrogen group, an alkylene oxide adduct of acrylic acid having an aromatic hydrocarbon group having 6 to 14 carbon atoms, an acrylate ester of benzyl alcohol (or its alkylene oxide (1 to 5 mol) adduct), acrylic Allyl acid, propargyl acrylate, piperonyl acrylate, salicyl acrylate, furyl acrylate, furfuryl acrylate, tetrahydrofurfuryl acrylate, pyranyl acrylate, phenethyl acrylate, cresyl acrylate, triphenylmethyl acrylate, cumyl acrylate Acrylic acid 3- (N, N-dimethylamino) ) Addition of propyl, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 1,6-hexanediol diacrylate, tricyclodecanediol diacrylate, trimethylolpropane (or its alkylene oxide (1-15 mol)) Product) triacrylic ester, pentaerythritol (or its alkylene oxide (1-15 mol) adduct), triacrylic ester, pentaerythritol (or its alkylene oxide (1-20 mol) adduct) tetraacrylic acid Esters, tetraacrylic acid ester of ditrimethylolpropane (or its adduct of alkylene oxide (1 to 20 mol)), hexaacrylic acid ester of dipentaerythritol (or its adduct of alkylene oxide (1 to 30 mol)) Acrylate, acrylic acid esters such as 1,1,1-trifluoroethyl acrylate, perfluoroethyl acrylate, perfluoro-n-propyl acrylate, perfluoro-i-propyl acrylate; Acrylic acid such as acrylic acid N, N-dimethylamide, acrylic acid N, N-diethylamide, acrylic acid N, N-dipropylamide, acrylic acid N, N-di-i-propylamide, acrylic acid anthracenylamide Amides; acrylic acid anilide, acryloylnitrile, acrolein and the like.
ビニル化合物としては、塩化ビニル、塩化ビニリデン、フッ化ビニル、フッ化ビニリデン、N−ビニルピロリドン、ビニルピリジン、酢酸ビニル等が挙げられる。 Examples of the vinyl compound include vinyl chloride, vinylidene chloride, vinyl fluoride, vinylidene fluoride, N-vinyl pyrrolidone, vinyl pyridine, vinyl acetate and the like.
不飽和ジカルボン酸ジエステルとしては、シトラコン酸ジエチル、マレイン酸ジエチル、フマル酸ジエチル、イタコン酸ジエチル等が挙げられる。 Examples of the unsaturated dicarboxylic acid diester include diethyl citraconic acid, diethyl maleate, diethyl fumarate, diethyl itaconate and the like.
イミド化合物としては、N−フェニルマレイミド、N−シクロヘキシルマレイミド、N−ラウリルマレイミド、N−(4−ヒドロキシフェニル)マレイミドなどのモノマレイミド化合物、N−アクリロイルフタルイミド等が挙げられる。 Examples of the imide compound include monomaleimide compounds such as N-phenylmaleimide, N-cyclohexylmaleimide, N-laurylmaleimide, N- (4-hydroxyphenyl) maleimide, and N-acryloylphthalimide.
中でも、本実施形態の硬化性樹脂との相容性、蒸気圧、皮膚刺激、樹脂組成物の低粘度化の観点から、ベンジルアルコール(又はそのアルキレンオキサイド(1〜5モル)付加物)のアクリル酸エステル、ジアクリル酸1,6−ヘキサンジオール、ジアクリル酸トリシクロデカンジオール、トリメチロールプロパン(又はそのアルキレンオキサイド(1〜15モル)付加物)のトリアクリル酸エステル、ペンタエリスリトール(又はそのアルキレンオキサイド(1〜15モル)付加物)のトリアクリル酸エステル、ペンタエリスリトール(又はそのアルキレンオキサイド(1〜20モル)付加物)のテトラアクリル酸エステル、ジトリメチロールプロパン(又はそのアルキレンオキサイド(1〜20モル)付加物)のテトラアクリル酸エステル、ジペンタエリスリトール(又はそのアルキレンオキサイド(1〜30モル)付加物)のヘキサアクリル酸エステル、スチレンが好ましい。 Among these, from the viewpoints of compatibility with the curable resin of the present embodiment, vapor pressure, skin irritation, and low viscosity of the resin composition, acrylic acid of benzyl alcohol (or its adduct of alkylene oxide (1 to 5 mol)). Acid ester, 1,6-hexanediol diacrylate, tricyclodecanediol diacrylate, trimethylolpropane (or its adduct of alkylene oxide (1 to 15 mol)), pentaerythritol (or its alkylene oxide ( 1-15 mol) adduct) triacrylate ester, pentaerythritol (or its alkylene oxide (1-20 mol) adduct) tetraacrylate ester, ditrimethylolpropane (or its alkylene oxide (1-20 mol)) Additive) Tetraacrylic acid Este , Hexa acrylate esters of dipentaerythritol (or alkylene oxide (1 to 30 mol) adduct), styrene is preferred.
反応性希釈剤は1種を単独で用いてもよいし2種以上を混合して使用することもできる。 A reactive diluent may be used individually by 1 type, and 2 or more types can also be mixed and used for it.
本実施形態のコーティング剤には、用途に応じて、本発明の効果を損なわない範囲で上述した成分以外の添加剤を含有させてもよい。このような添加剤としては、例えば、レベリング剤、可塑剤、消泡剤、紫外線吸収剤、酸化防止剤、粘性制御剤等が挙げられる。 The coating agent of the present embodiment may contain additives other than the components described above within a range not impairing the effects of the present invention, depending on the application. Examples of such additives include leveling agents, plasticizers, antifoaming agents, ultraviolet absorbers, antioxidants, viscosity control agents, and the like.
本実施形態のコーティング剤は、20℃における粘度が、1000mPa・s未満であることが好ましく、800mPa・s以下であることがより好ましく、500mPa・s以下であることが更に好ましい。なお、上記粘度は、B型粘度計(4号ローター、60rpm)を用いて測定された値を意味する。本実施形態においては、コーティング剤における本実施形態の硬化性樹脂の含有量が、コーティング剤全量を基準として、30質量%以上である場合に、上記粘度条件を満たしていることが好ましい。 The coating agent of this embodiment preferably has a viscosity at 20 ° C. of less than 1000 mPa · s, more preferably 800 mPa · s or less, and even more preferably 500 mPa · s or less. In addition, the said viscosity means the value measured using the B-type viscometer (No. 4 rotor, 60 rpm). In the present embodiment, it is preferable that the viscosity condition is satisfied when the content of the curable resin of the present embodiment in the coating agent is 30% by mass or more based on the total amount of the coating agent.
本実施形態のコーティング剤は、例えば、透明性が求められるカラーフィルターなどの光学材料の保護層形成用コーティング剤、自動車のボディに塗工するクリア塗料、プラスチックフィルムの表面保護用のトップコート剤、プラスチック部品保護用コート剤、プラスチックフィルムにトップコートして真空成形などの熱成形やインモールド成形に用いられるコート剤として用いることができる。 The coating agent of the present embodiment includes, for example, a coating agent for forming a protective layer of an optical material such as a color filter that requires transparency, a clear paint applied to the body of an automobile, a top coat agent for protecting the surface of a plastic film, It can be used as a coating agent for protecting plastic parts or a coating agent used for thermoforming such as vacuum forming or in-mold forming by top-coating a plastic film.
次に、本発明に係る樹脂硬化膜について説明する。本発明に係る樹脂硬化膜は、上記本実施形態のコーティング剤を硬化させて得られるものであり、例えば、コーティング剤中の硬化性樹脂をラジカル重合反応により硬化させることにより形成することができる。 Next, the cured resin film according to the present invention will be described. The cured resin film according to the present invention is obtained by curing the coating agent of the present embodiment, and can be formed, for example, by curing a curable resin in the coating agent by a radical polymerization reaction.
本実施形態の樹脂硬化膜は、基材上に設けられた上記本実施形態のコーティング剤の塗膜を硬化することにより形成できる。 The cured resin film of the present embodiment can be formed by curing the coating film of the coating agent of the present embodiment provided on the substrate.
基材は特に限定されず、例えば自動車等の金属製品、フィルムや成型品などのプラスチック製品、光学材料などのガラス製品、家具などの木材製品、紙などが挙げられる。また、樹脂硬化膜の基材への密着性を高めるために基材に予め下塗り層等を設けてもよい。 The substrate is not particularly limited, and examples thereof include metal products such as automobiles, plastic products such as films and molded products, glass products such as optical materials, wood products such as furniture, and paper. Moreover, in order to improve the adhesiveness of the resin cured film to the base material, an undercoat layer or the like may be provided in advance on the base material.
コーティング剤の塗膜は、本実施形態のコーティング剤を基材等に塗布することにより得ることができる。塗布する方法としては特に限定されず、例えば、スピンコート法、はけ塗り、スプレー法(吹き付け)、ディップコート法、ブレードコート法、ロールコート法、インクジェット印刷、グラビア印刷、スクリーン印刷、フレキソ印刷、バーコート法、ダイコート法等、公知の方法が挙げられる。また、塗布後、必要に応じて乾燥処理を施してもよい。乾燥条件としては特に限定されず、コーティング剤に含まれる有機溶媒の種類や量等に応じて適宜選択され得るが、例えば60〜200℃で1〜60分間という条件が挙げられる。 The coating film of the coating agent can be obtained by applying the coating agent of the present embodiment to a substrate or the like. The application method is not particularly limited. For example, spin coating, brush coating, spraying (spraying), dip coating, blade coating, roll coating, ink jet printing, gravure printing, screen printing, flexographic printing, Known methods such as a bar coating method and a die coating method may be used. Moreover, you may perform a drying process as needed after application | coating. It does not specifically limit as drying conditions, Although it can select suitably according to the kind, quantity, etc. of the organic solvent contained in a coating agent, For example, the conditions of 1 to 60 minutes at 60-200 degreeC are mentioned.
塗膜の厚みとしては、樹脂硬化膜の用途によって異なり特に限定されないが、例えば、形成される樹脂硬化膜の厚みが1〜100μmとなるように設定することができ、3〜40μmとなるように設定することが好適である。 The thickness of the coating varies depending on the use of the cured resin film and is not particularly limited. For example, the thickness of the formed cured resin film can be set to be 1 to 100 μm and be 3 to 40 μm. It is preferable to set.
コーティング剤の塗膜を硬化させる方法としては、特に制限されず、常温常圧で該塗膜を放置し硬化させてもよいし、該塗膜に対し加熱や加圧、活性エネルギー線照射等を施し硬化させてもよい。硬化時間がより短いという観点から、加熱や加圧、活性エネルギー線照射等を施すことが好ましく、耐熱性の低い基材にも適用できるという観点からは、活性エネルギー線照射を施すことが好ましい。本実施形態においては、例えば、コーティング剤中の硬化性樹脂をラジカル重合反応により硬化させることにより、樹脂硬化膜を形成してもよい。 The method for curing the coating film of the coating agent is not particularly limited, and the coating film may be allowed to cure at room temperature and normal pressure. The coating film may be heated, pressurized, or irradiated with active energy rays. It may be applied and cured. From the viewpoint that the curing time is shorter, it is preferable to apply heating, pressurization, active energy ray irradiation and the like, and from the viewpoint that it can be applied to a substrate having low heat resistance, it is preferable to apply active energy ray irradiation. In this embodiment, for example, the cured resin film may be formed by curing a curable resin in the coating agent by a radical polymerization reaction.
活性エネルギー線としては、可視光、赤外線、紫外線、X線、α線、β線、γ線、電子線等が挙げられる。中でも、安全性や反応効率の観点から、紫外線及び電子線が好ましい。 Examples of active energy rays include visible light, infrared rays, ultraviolet rays, X-rays, α rays, β rays, γ rays, and electron beams. Of these, ultraviolet rays and electron beams are preferable from the viewpoints of safety and reaction efficiency.
活性エネルギー線の照射条件は、活性エネルギー線の種類により適宜選択することができるが、例えば、紫外線の好ましい照射条件として、照度1〜1000mW/cm2、照射量としては0.1〜10000mJ/cm2が挙げられる。 The irradiation condition of the active energy ray can be appropriately selected depending on the type of the active energy ray. For example, as a preferable irradiation condition of ultraviolet rays, the illuminance is 1 to 1000 mW / cm 2 , and the irradiation amount is 0.1 to 10,000 mJ / cm. 2 is mentioned.
活性エネルギー線の照射装置としては、例えば、高圧水銀ランプ、低圧水銀ランプ、メタルハライドランプ、エキシマランプなどのランプ光源、アルゴンイオンレーザーやヘリウムネオンレーザーなどのパルス、連続のレーザー光源、LED光源などを用いることができる。 As an active energy ray irradiation device, for example, a lamp light source such as a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, or an excimer lamp, a pulse such as an argon ion laser or a helium neon laser, a continuous laser light source, or an LED light source is used. be able to.
加熱する場合の温度は、基材やコーティング剤中の重合開始剤の種類等により適宜調整され得るが、40〜200℃が挙げられる。 Although the temperature in the case of heating can be suitably adjusted with the base material, the kind of polymerization initiator in a coating agent, etc., 40-200 degreeC is mentioned.
本発明に係る積層体は、基材と、基材上に設けられた上記本実施形態の樹脂硬化膜とを備える。基材は、上述したものが挙げられる。 The laminated body which concerns on this invention is equipped with a base material and the resin cured film of this embodiment provided on the base material. Examples of the substrate include those described above.
本実施形態の樹脂硬化膜は、基材上に設けられたコーティング層に含まれる態様で設けられていてもよい。本実施形態の積層体においては、本実施形態の樹脂硬化膜が含まれるコーティング層が基材上に配置されていてもよいし、基材とコーティング層との間に他の層が配置されていてもよい。 The cured resin film of the present embodiment may be provided in a form included in the coating layer provided on the substrate. In the laminate of this embodiment, the coating layer containing the cured resin film of this embodiment may be disposed on the base material, and other layers are disposed between the base material and the coating layer. May be.
本実施形態の樹脂硬化膜の厚みとしては用途によって異なり特に限定されないが、例えば、1〜100μmが好適であり、3〜40μmがより好適である。 The thickness of the cured resin film of the present embodiment varies depending on the application and is not particularly limited. For example, 1 to 100 μm is preferable, and 3 to 40 μm is more preferable.
以下に、本発明を実施例によりさらに説明するが、本発明はこれらの実施例により何ら制限されるものではない。 EXAMPLES The present invention will be further described below with reference to examples, but the present invention is not limited to these examples.
<コーティング剤及び樹脂硬化膜の製造>
(実施例1)
撹拌機、温度計、還流冷却器、空気ガス導入管及び滴下ロートを備えた反応容器に、下記式(i)で表されるビスフェノールA型エポキシ化合物を680質量部(2モル)、付加反応触媒としてトリフェニルホスフィンを5質量部、及びラジカル重合禁止剤としてメチルヒドロキノンを1質量部、加えた。ここに、アクリル酸を296質量部(4.1モル)滴下し、110℃で反応させ、下記式(ii)で表される化合物B−1を得た。
<Manufacture of coating agent and resin cured film>
Example 1
In a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, an air gas introduction pipe and a dropping funnel, 680 parts by mass (2 mol) of a bisphenol A type epoxy compound represented by the following formula (i), an addition reaction catalyst 5 parts by weight of triphenylphosphine and 1 part by weight of methylhydroquinone as a radical polymerization inhibitor were added. 296 mass parts (4.1 mol) of acrylic acid was dripped here, it was made to react at 110 degreeC, and the compound B-1 represented by following formula (ii) was obtained.
式(ii)で表される化合物B−1を22.6質量部、ヘキサメチレンジイソシアネートを7.9質量部、イソホロンジイソシアネートを10.4質量部、下記式(5−1)で表される両末端にヒドロキシ基を有するポリジメチルシロキサン(重量平均分子量2000)(以下、「水酸基両末端ポリシロキサン(分子量2000)」という)を56質量部、メチルエチルケトンを100質量部、ウレタン反応触媒(日東化成(株)社製、製品名:ネオスタンU−600(ビスマス系触媒))を0.1質量部、及びラジカル重合禁止剤(メチルヒドロキノン)を0.1質量部混合し、80℃にて反応させ、1,4ブタンジオールを1.8質量部添加し、イソシアネート基が無くなるまで反応させ、硬化性樹脂のメチルエチルケトン溶液を得た。得られたメチルエチルケトン溶液5gをシャーレに取り、これを105℃の乾燥機中に3時間放置した後の残分から、メチルエチルケトン溶液の硬化性樹脂濃度を算出すると、50質量%であった。
[式(iii)中、e1は18〜28の整数を表す。]
22.6 parts by mass of compound B-1 represented by formula (ii), 7.9 parts by mass of hexamethylene diisocyanate, 10.4 parts by mass of isophorone diisocyanate, both represented by the following formula (5-1) 56 parts by mass of polydimethylsiloxane having a hydroxyl group at the terminal (weight average molecular weight 2000) (hereinafter referred to as “hydroxyl-terminated polysiloxane (molecular weight 2000)”), 100 parts by mass of methyl ethyl ketone, urethane reaction catalyst (Nitto Kasei Co., Ltd.) ) Made by the company, product name: Neostan U-600 (bismuth catalyst) and 0.1 part by mass of radical polymerization inhibitor (methylhydroquinone) are mixed and reacted at 80 ° C. , 4-butanediol was added in an amount of 1.8 parts by mass and reacted until the isocyanate group disappeared to obtain a methyl ethyl ketone solution of a curable resin. 5 g of the obtained methyl ethyl ketone solution was placed in a petri dish, and the curable resin concentration of the methyl ethyl ketone solution was calculated from the residue after leaving it in a dryer at 105 ° C. for 3 hours.
[In formula (iii), e1 represents an integer of 18 to 28. ]
上記で得られた溶液に、光重合開始剤として1−ヒドロキシシクロヘキシルフェニルケトンを、硬化性樹脂40質量部に対して、2質量部となる割合で混合し、コーティング剤を得た。 To the solution obtained above, 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator was mixed at a ratio of 2 parts by mass with respect to 40 parts by mass of the curable resin to obtain a coating agent.
得られたコーティング剤をポリエステルフィルム上にアプリケーターを用いて塗布し、80℃で10分間乾燥させ、膜厚が約100μmである塗膜を形成した。次に、塗膜に紫外線(UVC波)を照射量500mJ/cm2で照射して樹脂硬化膜を得た。 The obtained coating agent was applied onto a polyester film using an applicator and dried at 80 ° C. for 10 minutes to form a coating film having a thickness of about 100 μm. Next, the coating film was irradiated with ultraviolet rays (UVC waves) at an irradiation amount of 500 mJ / cm 2 to obtain a cured resin film.
(実施例2〜11、及び比較例1〜7)
原料組成を表1〜5のように替えたこと以外は実施例1と同様にして、コーティング剤及び樹脂硬化膜を得た。
(Examples 2 to 11 and Comparative Examples 1 to 7)
A coating agent and a cured resin film were obtained in the same manner as in Example 1 except that the raw material composition was changed as shown in Tables 1 to 5.
なお、表中の下記表記について以下に説明する。 In addition, the following notation in a table | surface is demonstrated below.
「B−2」:以下の手順で製造された下記式(v)で表される化合物である。 “B-2”: a compound represented by the following formula (v) produced by the following procedure.
撹拌機、温度計、還流冷却器、空気ガス導入管及び滴下ロートを備えた反応容器に、下記式(iv)で表されるビスフェノールA型エポキシ化合物を1816質量部、付加反応触媒としてトリフェニルホスフィンを10質量部、及びラジカル重合禁止剤としてメチルヒドロキノンを2質量部、加えた。ここに、アクリル酸を296質量部滴下し、110℃で反応させ、下記式(v)で表される化合物B−2を得た。 In a reaction vessel equipped with a stirrer, thermometer, reflux condenser, air gas introduction pipe and dropping funnel, 1816 parts by mass of bisphenol A type epoxy compound represented by the following formula (iv), triphenylphosphine as an addition reaction catalyst 10 parts by mass and 2 parts by mass of methylhydroquinone as a radical polymerization inhibitor were added. 296 mass parts of acrylic acid was dripped here, it was made to react at 110 degreeC, and the compound B-2 represented by following formula (v) was obtained.
「水酸基両末端ポリシロキサン(分子量3200)」:下記式(5−2)で表される両末端にヒドロキシ基を有するポリジメチルシロキサン(重量平均分子量3200)である。
[式(vi)中、e2は28〜38の整数を表す。]
“Hydroxyl terminal polysiloxane (molecular weight 3200)”: polydimethylsiloxane having a hydroxy group at both ends (weight average molecular weight 3200) represented by the following formula (5-2).
[In the formula (vi), e2 represents an integer of 28 to 38. ]
「水酸基両末端ポリシロキサン−2(分子量3200)」:下記一般式(5−3)で表される両末端にヒドロキシ基を有するポリジメチルシロキサン(重量平均分子量3200)である。
[式(5−3)中、e3は23〜33の整数を表す。]
“Hydroxyl terminal polysiloxane-2 (molecular weight 3200)”: Polydimethylsiloxane (weight average molecular weight 3200) having hydroxy groups at both ends represented by the following general formula (5-3).
[In formula (5-3), e3 represents an integer of 23 to 33. ]
「B’」:下記式(vii)で表される化合物である。
「PCD(分子量2000)」:ポリカーボネートジオール(数平均分子量2000)(旭ケミカルズ(株)社製、デュラノール T6002)である。 “PCD (molecular weight 2000)”: Polycarbonate diol (number average molecular weight 2000) (manufactured by Asahi Chemicals Corporation, Duranol T6002).
「PPG(分子量2000)」:ポリプロピレングリコール(重量平均分子量2000)である。 “PPG (molecular weight 2000)”: polypropylene glycol (weight average molecular weight 2000).
「PTG(分子量2000)」:ポリテトラメチレングリコール(重量平均分子量2000)である。 “PTG (molecular weight 2000)”: polytetramethylene glycol (weight average molecular weight 2000).
[粘度]
実施例及び比較例で得られた硬化性樹脂のメチルエチルケトン溶液(硬化性樹脂の固形分濃度が50質量%)について、該溶液を20℃とし、B型粘度計(4号ローター、60rpm)を用いて粘度の測定を行った。その結果を表1〜4に示す。粘度が1000mPa・sを超えると取り扱いが困難となる。
[viscosity]
About the methyl ethyl ketone solution of the curable resin obtained in Examples and Comparative Examples (the solid content concentration of the curable resin is 50% by mass), the solution is set to 20 ° C., and a B-type viscometer (No. 4 rotor, 60 rpm) is used. The viscosity was measured. The results are shown in Tables 1-4. When the viscosity exceeds 1000 mPa · s, handling becomes difficult.
[自己修復性の評価]
実施例及び比較例で得られた樹脂硬化物に対し、真鍮ブラシにて荷重100g/cm2で同じ場所を一方向に3回、擦過処理を行った。擦過処理前と擦過処理後1日静置した後とで、擦過処理した場所のヘイズ値を全自動直読ヘイズコンピューターHGM−2DP(スガ試験機(株)社製)を用いて測定し、ヘイズ値の差を算出した。その結果を表1〜4に示す。差が4.5以下であれば自己修復性が優れることを示す。
[Evaluation of self-healing]
The cured resin obtained in the examples and comparative examples was subjected to a rubbing treatment in the same place three times in one direction with a load of 100 g / cm 2 with a brass brush. The haze value of the place subjected to the rubbing treatment was measured using a fully automatic direct reading haze computer HGM-2DP (manufactured by Suga Test Instruments Co., Ltd.) before and after being left to stand for 1 day after the rubbing treatment. The difference was calculated. The results are shown in Tables 1-4. If the difference is 4.5 or less, the self-repairing property is excellent.
なお、実施例の樹脂硬化物においては擦過処理後3分間で擦過処理による傷が目視では確認できない程、修復したが、比較例の硬化物においては擦過処理後、ヘイズ値測定が可能となる程度に傷が修復するまでに1日を要するものがあったため、擦過処理後、1日の静置時間を設けた。 In the cured resin products of the examples, the scratches due to the rubbing treatment were repaired so that they could not be visually confirmed in 3 minutes after the rubbing treatment. However, in the cured products of the comparative examples, the haze value could be measured after the rubbing treatment. In some cases, it took 1 day until the wound was repaired.
[耐熱性の評価]
実施例及び比較例で得られたコーティング剤をポリプロピレンフィルムに一滴落とし、80℃で10分間乾燥させた後、紫外線(UVC波)を照射量500mJ/cm2で照射し樹脂硬化物を得た。得られた樹脂硬化物について示差熱重量分析を行った。測定方法は、空気を50ml/分で注入しながら、10℃/minの昇温速度にて室温から400℃まで昇温したときの樹脂硬化物の質量減量を測定し、質量が90質量%となる温度を測定した。その結果を表1〜4に示す。温度が270℃以上であれば耐熱性が優れることを示す。
[Evaluation of heat resistance]
One drop of the coating agent obtained in Examples and Comparative Examples was dropped on a polypropylene film, dried at 80 ° C. for 10 minutes, and then irradiated with ultraviolet rays (UVC waves) at an irradiation amount of 500 mJ / cm 2 to obtain a cured resin. The obtained resin cured product was subjected to differential thermogravimetric analysis. The measurement method was to measure the weight loss of the cured resin when the temperature was raised from room temperature to 400 ° C. at a rate of temperature increase of 10 ° C./min while injecting air at 50 ml / min. Was measured. The results are shown in Tables 1-4. If temperature is 270 degreeC or more, it shows that heat resistance is excellent.
表1〜3に示されるように、実施例1〜11のコーティング剤は、硬化性樹脂の含有濃度が50質量%であっても粘度が十分に低く、取り扱い性に優れており、なおかつ自己修復性及び耐熱性に優れた樹脂硬化膜を形成することができることが確認された。一方、比較例においては、コーティング剤が十分に低い粘度を有すること、並びに形成される樹脂硬化膜が優れた自己修復性及び耐熱性を有することを、同時に達成することができない。 As shown in Tables 1 to 3, the coating agents of Examples 1 to 11 have a sufficiently low viscosity and excellent handling properties even when the content of the curable resin is 50% by mass, and self-repair. It was confirmed that a cured resin film excellent in heat resistance and heat resistance can be formed. On the other hand, in the comparative example, it is impossible to simultaneously achieve that the coating agent has a sufficiently low viscosity and that the formed resin cured film has excellent self-healing property and heat resistance.
本発明によれば、硬化性樹脂の含有濃度を十分に高めても十分に低い粘度を有することができ、自己修復性及び耐熱性に優れた樹脂硬化膜を形成することができるコーティング剤、該コーティング剤により形成される樹脂硬化膜及びそれを備える積層体を提供することができる。本発明のコーティング剤によれば、優れた自己修復性及び耐熱性を有する樹脂硬化膜を加熱せずに形成することができる。本発明のコーティング剤は、コーティング加工性(特には、基材等への塗布等の操作性)に優れた粘度を有することができ、塗布ムラや樹脂硬化膜上のしわ等の発生を抑制することができる。本発明のコーティング剤は、例えば、透明性が求められるカラーフィルターなどの光学材料の保護層形成用コーティング剤や、自動車のボディに塗工するクリア塗料、プラスチックフィルムの表面保護用のトップコート剤、プラスチック部品保護用コート剤、プラスチックフィルムにトップコートして真空成形などの熱成形やインモールド成形に用いられるコート剤として用いることができる。 According to the present invention, the coating agent can have a sufficiently low viscosity even when the concentration of the curable resin is sufficiently increased, and can form a cured resin film excellent in self-repairability and heat resistance, A cured resin film formed of a coating agent and a laminate including the same can be provided. According to the coating agent of the present invention, a cured resin film having excellent self-repairing properties and heat resistance can be formed without heating. The coating agent of the present invention can have a viscosity excellent in coating processability (particularly, operability such as application to a substrate, etc.) and suppress the occurrence of uneven coating and wrinkles on a cured resin film. be able to. The coating agent of the present invention is, for example, a coating agent for forming a protective layer of an optical material such as a color filter that requires transparency, a clear paint applied to the body of an automobile, a top coating agent for protecting the surface of a plastic film, It can be used as a coating agent for protecting plastic parts or a coating agent used for thermoforming such as vacuum forming or in-mold forming by top-coating a plastic film.
Claims (3)
(D1)炭素数2〜13のジオール化合物、(D2)アニオン性親水基と少なくとも2個の活性水素とを有する化合物、及び(D3)下記一般式(2)で表されるヒドロキシアルキル(メタ)アクリレートからなる群より選ばれる少なくとも1種の化合物と、
を反応させて得られる、硬化性樹脂を含有する、コーティング剤。
[式(1−1)中、R11及びR12はそれぞれ独立に水素原子又はメチル基を表し、R21及びR22はそれぞれ独立に単結合又はエーテル結合を含んでいてもよい炭素数1〜12のアルキレン基を表し、Xは下記一般式(1−2)で表される2価の基を表し、
{式(1−2)中、A11及びA12はそれぞれ独立に炭素数2〜4のアルキレン基を表し、R31及びR32はそれぞれ独立に炭素数1〜3のアルキル基、フェニル基又はハロゲノ基を表し、R4は単結合、−CR5 2−(ただし、R5は水素原子、炭素数1〜3のアルキル基又はフェニル基を表す)で表される基又は−SO2−を表し、b1及びb2はそれぞれ独立に0〜2の整数を表し、c1及びc2はそれぞれ独立に0〜10の整数を表す。}
aは1〜10の整数を表す。]
[式(2)中、R5は水素原子又はメチル基を表し、R6は炭素数2〜10のアルキレン基を表す。] An isocyanate group-terminated prepolymer obtained by reacting (A) a polyisocyanate, (B) a compound represented by the following general formula (1-1), and (C) a polysiloxane having at least two hydroxy groups; ,
(D1) a diol compound having 2 to 13 carbon atoms, (D2) a compound having an anionic hydrophilic group and at least two active hydrogens, and (D3) a hydroxyalkyl (meth) represented by the following general formula (2) At least one compound selected from the group consisting of acrylates;
A coating agent containing a curable resin, obtained by reacting the above.
[In Formula (1-1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 21 and R 22 each independently represent a carbon number 1 to 1 that may contain a single bond or an ether bond. 12 represents an alkylene group, X represents a divalent group represented by the following general formula (1-2),
{Wherein (1-2), A 11 and A 12 represents an alkylene group having 2 to 4 carbon atoms each independently, R 31 and R 32 each independently represents an alkyl group having 1 to 3 carbon atoms, a phenyl group or Represents a halogeno group, R 4 represents a single bond, —CR 5 2 — (wherein R 5 represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms or a phenyl group) or —SO 2 —. B1 and b2 each independently represent an integer of 0 to 2, and c1 and c2 each independently represent an integer of 0 to 10. }
a represents an integer of 1 to 10. ]
Wherein (2), R 5 represents a hydrogen atom or a methyl group, R 6 represents an alkylene group having 2 to 10 carbon atoms. ]
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