JP2017208404A - Substrate processing apparatus and cleaning method for substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily clean the inside of a switching valve.SOLUTION: In a substrate processing apparatus, a processing liquid supply part 5 individually supplies multiple kinds of processing liquid to a substrate 9. A mutual drain pipe 61 guides, to the outside of a chamber 11, the multiple kinds of processing liquid that has been supplied to the substrate 9. A switching valve 62 is connected, in the outside of the chamber 11, to the mutual drain pipe 61 and switches liquid-feeding destinations of the multiple kinds of processing liquid. A valve cleaning liquid supply part 63 supplies valve cleaning liquid to the switching valve 62. A liquid detection part 64 detects whether or not the valve cleaning liquid is present at a detection position in the mutual drain pipe 61. With this configuration, it becomes possible to easily clean the inside of the switching valve 62.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a substrate processing apparatus for processing a substrate and a cleaning method for cleaning the substrate processing apparatus.

  Conventionally, in a manufacturing process of a semiconductor substrate (hereinafter simply referred to as “substrate”), various processes are performed on the substrate. For example, a chemical solution such as etching is performed on the surface of the substrate by discharging the chemical solution from a nozzle onto a substrate having a resist pattern formed on the surface. In the coating processing apparatus of Patent Document 1, a resist solution is supplied from a resist solution discharge nozzle onto a wafer held by a spin chuck. Around the spin chuck, a cup for receiving a resist solution or the like scattered from the wafer in accordance with the coating process is disposed. An exhaust pipe for exhausting the inside of the cup and a drain pipe for discharging the resist solution received by the cup are provided on the cup bottom surface.

JP 2004-305966 A

  By the way, in the substrate processing apparatus, when performing processing by sequentially supplying a plurality of types of processing liquids to the substrate, the destinations of the plurality of types of processing liquids discharged from the cup are switched by a mechanism such as a switching valve. There is. In the substrate processing apparatus, there are cases where a plurality of types of processing liquids are used, which are mixed to cause phase separation or gelation to increase the viscosity or generate a solidified product. When such a high-viscosity gel-like substance or coagulated substance is generated in the switching valve, the switching valve is complicated, and the switching valve may be clogged, and the discharge of the processing liquid may be hindered.

  Therefore, in order to prevent clogging of the switching valve, a small amount of processing solution that dissolves the gel-like substance or coagulated substance (hereinafter collectively referred to simply as “gel-like substance”) is continuously supplied to the drain pipe. Although it is conceivable to flow, the gel-like substance other than the part in contact with the treatment liquid does not dissolve, and there is a risk of uneven cleaning. Moreover, there is a possibility that an adverse effect on the environment may be caused by continuously flowing a processing solution that is not used for wafer processing.

  The present invention has been made in view of the above problems, and an object thereof is to easily realize the cleaning of the inside of the switching valve.

  The invention according to claim 1 is a substrate processing apparatus for processing a substrate, wherein the chamber, a substrate holding part for holding the substrate in the chamber, and a process for individually supplying a plurality of types of processing liquids to the substrate A liquid supply unit; a common drain pipe for guiding the plurality of types of processing liquids supplied to the substrate to the outside of the chamber; and the plurality of types of the plurality of types of liquids connected to the common drain pipe outside the chamber. A switching valve that switches a destination of the processing liquid, a cleaning liquid supply unit that supplies the cleaning liquid to the switching valve, and a liquid detection unit that detects the presence or absence of the cleaning liquid at a detection position on the common drain pipe.

  The invention according to claim 2 is the substrate processing apparatus according to claim 1, wherein the switching valve in the closed state is controlled by controlling the switching valve, the cleaning liquid supply unit, and the liquid detection unit. And a control unit for confirming the filling of the cleaning liquid into the switching valve.

  A third aspect of the present invention is the substrate processing apparatus according to the first or second aspect, wherein the cleaning liquid supply unit is connected to the common drain pipe between the detection position and the switching valve. The

  Invention of Claim 4 is a substrate processing apparatus in any one of Claim 1 thru | or 3, Comprising: When the presence of the said washing | cleaning liquid is detected by the said liquid detection part, the said washing | cleaning liquid supply part is the said Stop supplying cleaning solution.

  A fifth aspect of the present invention is the substrate processing apparatus according to any one of the first to fourth aspects, further comprising a timer for measuring an elapsed time from the start of supplying the cleaning liquid to the switching valve in the closed state. And the controller stops supplying the cleaning liquid to the switching valve side after a predetermined time is measured by the timer.

  A sixth aspect of the present invention is the substrate processing apparatus according to any one of the first to fifth aspects, wherein after the switching valve filled with the cleaning liquid is opened, the output from the liquid detection unit is A cleaning determination unit that determines a cleaning result of the switching valve based on the detection, and when the liquid detection unit detects the presence of the cleaning liquid after a lapse of a predetermined time from the opening of the switching valve, the cleaning determination unit, It is determined that the switching valve is not properly cleaned.

  A seventh aspect of the present invention is the substrate processing apparatus according to any one of the first to fifth aspects, wherein the output from the liquid detection unit is performed after the switching valve filled with the cleaning liquid is opened. A cleaning determination unit that determines a cleaning result of the switching valve based on the liquid detection unit, the liquid detection unit is capable of measuring a moving speed of the liquid level of the cleaning liquid at the detection position on the common drain pipe, When the moving speed of the liquid level of the cleaning liquid measured by the liquid detection unit is lower than the threshold speed, the cleaning determination unit determines that the switching valve is not properly cleaned.

  The invention according to claim 8 is the substrate processing apparatus according to claim 7, wherein when the cleaning determination unit determines that the cleaning of the switching valve is defective, the switching is controlled by the control unit. The valve is closed, and the cleaning liquid supply unit supplies the cleaning liquid to the switching valve and fills it.

  A ninth aspect of the present invention is the substrate processing apparatus according to any one of the first to eighth aspects, wherein the cleaning liquid is the same as one of the plurality of types of processing liquids.

  A tenth aspect of the present invention is the substrate processing apparatus according to any one of the first to ninth aspects, further comprising a dirt detection unit that detects dirt on the liquid or the inner surface at the detection position on the common drain pipe. Prepare.

  According to an eleventh aspect of the present invention, a chamber, a substrate holding unit that holds a substrate in the chamber, a processing liquid supply unit that individually supplies a plurality of types of processing liquids to the substrate, and the substrate are supplied. A common drain pipe that guides the plurality of types of processing liquids to the outside of the chamber; and a switching valve that is connected to the common drain pipe and switches a destination of the plurality of types of processing liquids. A method of cleaning a substrate processing apparatus to be processed, comprising: a) supplying a cleaning liquid to the switching valve in a closed state, filling the switching valve with the cleaning liquid and cleaning; b) after the step a) And opening the switching valve.

  A twelfth aspect of the present invention is the substrate processing apparatus cleaning method according to the eleventh aspect, wherein the step a) detects the presence of the cleaning liquid at a detection position on the common drain pipe. And a step of confirming the filling of the cleaning liquid into the switching valve.

  A thirteenth aspect of the present invention is the substrate processing apparatus cleaning method according to the eleventh or twelfth aspect of the present invention, wherein c) at a detection position on the common drain pipe after a predetermined time has elapsed since the step b). When the presence of the cleaning liquid is detected, the method further includes a step of determining that the switching valve is poorly cleaned.

  A fourteenth aspect of the present invention is the substrate processing apparatus cleaning method according to the eleventh or twelfth aspect of the present invention, wherein d) after the step b), the liquid of the cleaning liquid at the detection position on the common drain pipe. The method further includes the step of measuring the moving speed of the surface and determining that the cleaning of the switching valve is defective when the moving speed of the liquid surface of the cleaning liquid is lower than a threshold speed.

  According to a fifteenth aspect of the present invention, there is provided the substrate processing apparatus cleaning method according to the fourteenth aspect, wherein if the cleaning of the switching valve is determined to be defective in step e) and step d), the switching valve Is further provided with the step of supplying the cleaning liquid in a closed state and filling the switching valve with the cleaning liquid for cleaning.

  A sixteenth aspect of the present invention is the substrate processing apparatus cleaning method according to any one of the eleventh to fifteenth aspects, wherein in the step a), the switching valve is closed and the substrate holding portion is moved to the substrate holding portion. This is a step of holding the substrate, supplying a cleaning liquid to the substrate, supplying the cleaning liquid flowing from the substrate into the chamber into the switching valve, filling, and cleaning.

  In the present invention, the inside of the switching valve can be easily cleaned.

It is a figure which shows the structure of the substrate processing apparatus which concerns on one embodiment. It is a block diagram which shows a process liquid supply part and a process liquid discharge part. It is a figure which shows the flow of washing | cleaning of a switching valve. It is a block diagram which shows a process liquid supply part and a process liquid discharge part.

  FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is a single-wafer type apparatus that processes semiconductor substrates 9 (hereinafter simply referred to as “substrates 9”) one by one. The substrate processing apparatus 1 performs processing by supplying a processing liquid to the substrate 9. In FIG. 1, a part of the configuration of the substrate processing apparatus 1 is shown in cross section.

  The substrate processing apparatus 1 includes a chamber 11, a substrate holding unit 31, a substrate rotating mechanism 33, a cup unit 4, a processing liquid supply unit 5, a processing liquid discharge unit 6, and a control unit 7. Inside the chamber 11, the substrate holding part 31, the cup part 4 and the like are accommodated. The control unit 7 controls each component of the substrate processing apparatus 1. The control unit 7 is a general computer system including a CPU that performs various arithmetic processes, a ROM that stores basic programs, a RAM that stores various information, and the like. The functions of the control unit 71 and the cleaning determination unit 72 are realized by the control unit 7. In other words, the control unit 7 includes a control unit 71 and a cleaning determination unit 72.

  The substrate holding part 31 is a substantially disk-shaped member centering on the central axis J1 which faces the up-down direction. The substrate 9 is disposed above the substrate holding unit 31. The substrate 9 is held by the substrate holding unit 31 in a horizontal state in the chamber 11. The substrate rotation mechanism 33 is disposed below the substrate holding unit 31. The substrate rotation mechanism 33 rotates the substrate 9 together with the substrate holder 31 around the central axis J1. The substrate rotation mechanism 33 is accommodated in a rotation mechanism accommodating portion 34 having a substantially cylindrical shape with a lid.

  The treatment liquid supply unit 5 individually supplies a plurality of types of treatment liquids to the substrate 9. The processing liquid supply unit 5 includes a first nozzle 51, a second nozzle 52, and a third nozzle 53. Each of the first nozzle 51 and the second nozzle 52 supplies a processing liquid from above the substrate 9 toward the upper main surface of the substrate 9 (hereinafter referred to as “upper surface 91”). In a state where the processing liquid is supplied from the first nozzle 51 to the substrate 9, the second nozzle 52 and the third nozzle 53 are retracted to the outside in the radial direction of the substrate 9. When the processing liquid is supplied from the second nozzle 52 to the substrate 9, the first nozzle 51 and the third nozzle 53 retreat outward in the radial direction of the substrate 9, and the second nozzle 52 is above the substrate 9. To position. The third nozzle 53 supplies the processing liquid from above the substrate 9 toward the peripheral region (that is, the edge portion) of the upper surface 91 of the substrate 9. In FIG. 1, the first nozzle 51, the second nozzle 52, and the third nozzle 53 are drawn above the substrate 9. As illustrated in FIG. 1, the processing liquid supply unit 5 may also include a lower nozzle that is disposed below the substrate 9 and supplies the processing liquid to the lower main surface of the substrate 9.

  The cup portion 4 is an annular member centered on the central axis J <b> 1 and is disposed around the substrate 9 and the substrate holding portion 31. The cup part 4 includes an upper cup part 41, a lower cup part 42, and a cup moving mechanism 43. The upper cup portion 41 is a substantially cylindrical member centered on the central axis J1. The upper cup portion 41 is disposed on the outer side in the radial direction of the substrate 9 and the substrate holding portion 31 and covers the sides of the substrate 9 and the substrate holding portion 31 over the entire circumference. The upper cup portion 41 receives a processing liquid and the like scattered from the rotating substrate 9 toward the periphery. The cup moving mechanism 43 moves the upper cup portion 41 in the vertical direction. The upper cup portion 41 is moved by a cup moving mechanism 43 between a processing position that is a position around the substrate 9 shown in FIG. 1 and a retracted position below the processing position.

  The lower cup part 42 is a bottomed substantially cylindrical member centering on the central axis J1. The lower cup portion 42 is disposed on the radially outer side of the rotation mechanism housing portion 34 below the upper cup portion 41. For example, the lower cup portion 42 is fixed to the outer surface of the rotation mechanism housing portion 34. The lower cup part 42 is connected to the lower part of the upper cup part 41. Specifically, the lower end portion of the upper cup portion 41 is inserted into the lower cup portion 42. The lower cup part 42 receives the processing liquid received by the upper cup part 41. At the bottom of the lower cup portion 42, a drain port 44 for discharging the processing liquid received by the lower cup portion 42 is provided. Connected to the drain port 44 is a common drain pipe 61 of the processing liquid discharge section 6 that guides the processing liquid and the like to the outside of the chamber 11. The common drain pipe 61 extends downward from the drain port 44. For example, the common drain pipe 61 may extend substantially vertically downward, or may extend downward while being inclined with respect to the vertical direction.

  FIG. 2 is a block diagram illustrating the processing liquid supply unit 5 and the processing liquid discharge unit 6 of the substrate processing apparatus 1. In FIG. 2, configurations other than the processing liquid supply unit 5 and the processing liquid discharge unit 6 are also shown. The first nozzle 51 is connected to a chemical liquid supply source 54, a substrate cleaning liquid supply source 55, and an IPA (isopropyl alcohol) supply source 56. The second nozzle 52 is connected to the filler solution supply source 57. The third nozzle 53 is connected to the IPA supply source 56.

  The chemical solution delivered from the chemical solution supply source 54 is supplied to the central portion of the upper surface 91 of the substrate 9 through the first nozzle 51. As the chemical solution, for example, an etching solution such as hydrofluoric acid or an aqueous tetramethylammonium hydroxide solution is used. The substrate cleaning liquid sent from the substrate cleaning liquid supply source 55 is also supplied to the central portion of the upper surface 91 of the substrate 9 through the first nozzle 51. For example, pure water (DIW: deionized water) or carbonated water is used as the substrate cleaning liquid. The IPA sent from the IPA supply source 56 to the first nozzle 51 is supplied to the central portion of the upper surface 91 of the substrate 9 through the first nozzle 51.

  At the lower end of the first nozzle 51, for example, a plurality of discharge ports for chemical solution, cleaning solution, and IPA are provided, and different types of processing liquids are supplied to the upper surface 91 of the substrate 9 via different pipes and discharge ports. To be supplied. In the processing liquid supply unit 5, for example, instead of the first nozzle 51, a plurality of processing liquid nozzles that supply the chemical liquid, the cleaning liquid, and the IPA to the central portion of the upper surface 91 of the substrate 9 may be provided.

  The filler solution sent from the filler solution supply source 57 to the second nozzle 52 is supplied to the central portion of the upper surface 91 of the substrate 9 through the second nozzle 52. As the filler solution, for example, a solution in which a polymer that is a solid solute is dissolved in a solvent is used. When the polymer is water-insoluble, for example, IPA is used as the solvent. The polymer is solidified by evaporation of the solvent on the substrate 9 and is sublimated in a device different from the substrate processing apparatus 1, and is also called a sublimation agent. Further, the filler solution has a property of causing phase separation to become a gel-like substance by mixing with a specific liquid (for example, water) different from the solvent.

  The IPA sent from the IPA supply source 56 to the third nozzle 53 is supplied to the peripheral area of the upper surface 91 of the substrate 9 through the third nozzle 53.

  The processing of the substrate 9 in the substrate processing apparatus 1 is performed in the order of chemical processing, cleaning processing, IPA replacement processing, filler filling processing, edge rinse processing, and drying processing, for example. Specifically, first, a chemical solution is applied to the substrate 9 by supplying the chemical solution from the first nozzle 51 to the rotating substrate 9. Subsequently, the supply of the chemical liquid is stopped, and the cleaning liquid is supplied from the first nozzle 51 to the rotating substrate 9, whereby the cleaning process for the substrate 9 is performed. Next, the supply of the cleaning liquid is stopped, and IPA is supplied from the first nozzle 51 to the rotating substrate 9, whereby the cleaning liquid on the substrate 9 is replaced with IPA.

  Furthermore, after the supply of IPA is stopped and the filler solution is supplied from the second nozzle 52 to the rotating substrate 9 for a predetermined time, the rotation speed of the substrate 9 is reduced, and the entire upper surface 91 of the substrate 9 is The state covered with the filler solution is maintained. As a result, the filler solution is filled between the patterns on the upper surface 91 of the substrate 9. Thereafter, the rotational speed of the substrate 9 is increased, and IPA is supplied from the third nozzle 53 to the peripheral region of the upper surface 91 of the substrate 9, thereby performing an edge rinse process for removing the filler solution in the peripheral region of the substrate 9. Is called. And the rotational speed of the board | substrate 9 is increased and the drying process of the board | substrate 9 is performed. The chemical solution, cleaning solution, IPA and filler solution supplied onto the substrate 9 during the above processing are received by the cup portion 4 and discharged to the common drain pipe 61 of the processing solution discharge portion 6 through the drain port 44. Is done.

  The treatment liquid discharge unit 6 includes a switching valve 62, a valve cleaning liquid supply unit 63, and a liquid detection unit 64 in addition to the common drain pipe 61 described above. The common drain pipe 61 is a drain pipe for guiding a plurality of types of processing liquid supplied from the processing liquid supply unit 5 to the substrate 9 to the outside of the chamber 11. The switching valve 62 is connected to the common drain pipe 61 outside the chamber 11. The switching valve 62 switches destinations of a plurality of types of processing liquids guided from the chamber 11 by the common drain pipe 61.

  In the example shown in FIG. 2, three liquid supply pipes 621 a, 621 b, and 621 c are connected to the switching valve 62. The switching valve 62 is a so-called triple valve having three valves 62a, 62b, and 62c. In the switching valve 62, by switching the built-in valves 62a, 62b, 62c, the liquid flowing in from the common drain pipe 61 is changed to any one of the three liquid feeding pipes 621a, 621b, 621c (a plurality of feeding pipes). A liquid tube may be selected). In addition, by closing all the valves 62a, 62b, and 62c of the switching valve 62, the liquid is not guided to any of the three liquid supply pipes 621a, 621b, and 621c, and the liquid is temporarily stored in the switching valve 62. Can also be stored. In the switching valve 62, for example, IPA discharged from the chamber 11 is guided to the uppermost liquid supply pipe 621a in the drawing. Moreover, the filler solution discharged | emitted from the chamber 11 is guide | induced to the 2nd liquid feeding pipe | tube 621b from the upper side in a figure. Further, the chemical liquid and the substrate cleaning liquid discharged from the chamber 11 are guided to the lowermost liquid supply pipe 621c in the drawing.

  The valve cleaning liquid supply unit 63 is a cleaning liquid supply unit that supplies the valve cleaning liquid to the switching valve 62. The valve cleaning liquid is a cleaning liquid used for cleaning the switching valve 62. As the valve cleaning liquid, various liquids having a property of dissolving the polymer formed into a gel substance may be used. The valve cleaning liquid is, for example, the same liquid as the solvent of the filler solution. In the above example, IPA is used as the valve cleaning liquid. In this case, the valve cleaning liquid is the same as one of the plurality of types of processing liquids supplied from the processing liquid supply unit 5 to the substrate 9.

  The liquid detection unit 64 includes, for example, an optical sensor including a light projecting unit and a light receiving unit facing each other across the common drain pipe 61, or a sensor such as a capacitance sensor attached to the wall surface of the common drain pipe 61. And the presence or absence of the valve cleaning liquid at the detection position on the common drain pipe 61 is detected. The detection position may be any position on the common drain pipe 61 that connects the drain port 44 and the switching valve 62. Preferably, the detection position by the liquid detection unit 64 is outside the chamber 11. The liquid detection unit 64 is attached to the common drain pipe 61 outside the chamber 11, for example. The attachment position of the liquid detection unit 64 is the detection position described above. In the example shown in FIG. 2, the valve cleaning liquid supply unit 63 is connected to the common drain pipe 61 between the detection position by the liquid detection unit 64 and the switching valve 62.

  In the substrate processing apparatus 1, for example, when the switching valve 62 is likely to be clogged with a gel material generated by mixing the filler solution and pure water, the control unit 7 controls the valve cleaning liquid supply unit 63 and the like to switch the switching valve 62. The inside of the valve 62 is cleaned. In addition, even when the switching valve 62 is not clogged, the switching valve 62 may be periodically cleaned to prevent the switching valve 62 from being clogged.

  Hereinafter, the flow of cleaning the switching valve 62 will be described with reference to FIG. When the switching valve 62 is cleaned, first, the switching valve 62 is controlled by the control unit 71 of the control unit 7, and all the valves 62a, 62b, 62c of the switching valve 62 are closed (step). S11). Further, the liquid detection unit 64 is controlled by the control unit 71, so that the liquid detection by the liquid detection unit 64 is started.

  Subsequently, when the valve cleaning liquid supply unit 63 is controlled by the control unit 71, supply of the valve cleaning liquid to the switching valve 62 in the closed state is started. The valve cleaning liquid supplied from the valve cleaning liquid supply unit 63 is filled in the switching valve 62 (step S12). When the switching valve 62 is filled with the valve cleaning liquid, the valve cleaning liquid is stored in the common drain pipe 61. In the common drain pipe 61, the liquid level of the valve cleaning liquid moves from the switching valve 62 toward the liquid detection unit 64 (that is, rises) as the valve cleaning liquid is supplied.

  Then, by detecting the presence of the valve cleaning liquid at the detection position by the liquid detection unit 64, the filling of the valve cleaning liquid into the switching valve 62 is indirectly confirmed (step S13). In the substrate processing apparatus 1, for example, when the presence of the valve cleaning liquid is detected by the liquid detection unit 64, the valve cleaning liquid supply unit 63 is controlled by the control unit 71 and supply of the valve cleaning liquid is stopped. Alternatively, a timer (not shown) for measuring a predetermined time from the start of supply of the valve cleaning liquid by the valve cleaning liquid supply unit 63 is provided, and supply of the valve cleaning liquid is stopped after the predetermined time elapses. By detecting the presence, the filling of the valve cleaning liquid into the switching valve 62 may be confirmed. In other words, a timer is provided for measuring an elapsed time from the start of supplying the valve cleaning liquid to the switching valve 62 in the closed state, and the control unit 71 measures the valve cleaning liquid toward the switching valve 62 after measuring the predetermined time by the timer. Stop supplying. By adding and using such a control in combination, even if the cleaning liquid is present, the liquid detection unit 64 is not able to detect the cleaning liquid by mistake. This can be prevented. When the liquid detection unit 64 detects the valve cleaning liquid before the predetermined time has elapsed from the start of supply of the valve cleaning liquid, the control unit 71 controls the valve cleaning liquid supply unit 63 and stops supplying the valve cleaning liquid.

  In the substrate processing apparatus 1, the switching valve 62 is cleaned by maintaining the state in which the switching valve 62 is filled with the valve cleaning liquid. After a lapse of a predetermined time from step S13, the switching valve 62 is opened, and the valve cleaning liquid in the switching valve 62 and the common drain pipe 61 is discharged (step S14). The valve cleaning liquid is discharged from, for example, the lowermost liquid supply pipe 621c in the drawing where the filler solution is guided.

  In the substrate processing apparatus 1, after the switching valve 62 filled with the valve cleaning liquid is opened, the cleaning determination unit 72 of the control unit 7 determines whether or not the cleaning result of the switching valve 62 is good based on the output from the liquid detection unit 64. Is determined (step S15). Specifically, after a lapse of a predetermined time from opening of the switching valve 62 in step S14, information indicating the presence or absence of the valve cleaning liquid at the detection position is sent from the liquid detection unit 64 to the cleaning determination unit 72. The predetermined time is set to a time longer than the time necessary for the valve cleaning liquid to move below the detection position (that is, to the switching valve 62 side) when the switching valve 62 is functioning normally. .

  If the presence of the valve cleaning liquid is not detected by the liquid detection unit 64 after the predetermined time has elapsed from the opening of the switching valve 62, the cleaning determination unit 72 determines that the valve cleaning liquid in the switching valve 62 has been discharged normally, and the switching is performed. It is determined that the cleaning of the valve 62 has been suitably completed. On the other hand, if the liquid detection unit 64 detects the presence of the valve cleaning liquid even after the predetermined time has elapsed after the switching valve 62 is opened, the cleaning determination unit 72 normally discharges the valve cleaning liquid in the switching valve 62. It is determined that the switching valve 62 is not properly cleaned.

  As described above, the substrate processing apparatus 1 includes the chamber 11, the substrate holding unit 31, the processing liquid supply unit 5, the common drain pipe 61, the switching valve 62, the valve cleaning liquid supply unit 63, the liquid A detection unit 64. The substrate holding unit 31 holds the substrate 9 in the chamber 11. The treatment liquid supply unit 5 individually supplies a plurality of types of treatment liquids to the substrate 9. The common drain pipe 61 guides a plurality of types of processing liquid supplied to the substrate 9 to the outside of the chamber 11. The switching valve 62 is connected to the common drain pipe 61 outside the chamber 11 and switches the destinations of the plurality of types of processing liquids. The valve cleaning liquid supply unit 63 supplies the valve cleaning liquid to the switching valve 62. The liquid detector 64 detects the presence or absence of the valve cleaning liquid at the detection position on the common drain pipe 61. Thereby, as described above, the inside of the switching valve 62 can be easily cleaned.

  Further, the control unit 71 controls the switching valve 62, the valve cleaning liquid supply unit 63, and the liquid detection unit 64, so that the valve cleaning liquid is supplied to the switching valve 62 in the closed state, and the valve cleaning liquid into the switching valve 62 is supplied. Filling is confirmed. As a result, the switching valve 62 can be reliably filled with the valve cleaning liquid, and as a result, the cleaning of the interior of the switching valve 62 can be realized more easily.

  The valve cleaning liquid supply unit 63 is connected to a common drain pipe 61 between the detection position and the switching valve 62. Thereby, it is possible to prevent the valve cleaning liquid being supplied from the valve cleaning liquid supply unit 63 to the switching valve 62 from being detected by the liquid detection unit 64. For this reason, it is not necessary to stop the liquid detection unit 64 during the supply of the valve cleaning liquid to the switching valve 62. As a result, the cleaning process of the switching valve 62 can be simplified.

  As described above, in the substrate processing apparatus 1, when the presence of the valve cleaning liquid is detected by the liquid detection unit 64, the valve cleaning liquid supply unit 63 stops supplying the valve cleaning liquid. Thereby, excessive supply of the valve cleaning liquid can be prevented. Further, the valve cleaning liquid is the same as one of the plurality of types of processing liquids supplied from the processing liquid supply unit 5. Thereby, the liquid supply mechanism in the substrate processing apparatus 1 can be simplified.

  The substrate processing apparatus 1 further includes a cleaning determination unit 72 that determines a cleaning result of the switching valve 62 based on an output from the liquid detection unit 64 after the switching valve 62 filled with the valve cleaning liquid is opened. The cleaning determination unit 72 determines that the switching valve 62 is poorly cleaned when the liquid detection unit 64 detects the presence of the valve cleaning liquid after a predetermined time has elapsed since the switching valve 62 was opened. Thereby, the washing | cleaning result of the switching valve 62 can be judged automatically in above-mentioned step S15.

  In step S15, the quality of the cleaning result may be determined by a method different from the above. For example, the liquid detector 64 is provided that can measure the moving speed of the liquid level of the valve cleaning liquid at the detection position on the common drain pipe 61, and after the switching valve 62 filled with the valve cleaning liquid is opened, The downward moving speed of the valve cleaning liquid at the detection position (that is, the moving speed toward the switching valve 62) is sent from the liquid detection unit 64 to the cleaning determination unit 72.

  When the moving speed of the liquid level of the valve cleaning liquid measured by the liquid detection unit 64 is lower than a preset threshold speed, the cleaning determination unit 72 has discharged the valve cleaning liquid in the switching valve 62 normally. It is determined that the switching valve 62 is not properly cleaned. The threshold speed is, for example, a speed at which the liquid level of the valve cleaning liquid moves downward or a speed slightly slower than the speed when the switching valve 62 is functioning normally. On the other hand, when the moving speed of the liquid level of the valve cleaning liquid measured by the liquid detection unit 64 is equal to or higher than the threshold speed, the cleaning determination unit 72 determines that the valve cleaning liquid in the switching valve 62 has been discharged normally. Then, it is determined that the cleaning of the switching valve 62 has been preferably completed.

  As described above, in the substrate processing apparatus 1, when the moving speed of the liquid level of the valve cleaning liquid measured by the liquid detection unit 64 is lower than the threshold speed, the cleaning determination unit 72 indicates that the switching valve 62 is poorly cleaned. Therefore, the cleaning result of the switching valve 62 can be automatically determined. Further, even if the valve cleaning liquid is discharged from the switching valve 62, it is possible to determine that the cleaning of the switching valve 62 is defective if it cannot be discharged at a normal flow rate.

  In the substrate processing apparatus 1, when the moving speed of the liquid level of the valve cleaning liquid is lower than the threshold speed, and the cleaning determination unit 72 determines that the switching valve 62 is not cleaned properly, the switching valve 62 is controlled by the control unit 71. Is closed again, and the valve cleaning liquid supply unit 63 supplies and fills the switching valve 62 with the valve cleaning liquid. Then, the switching valve 62 is cleaned again by maintaining the state in which the switching valve 62 is filled with the valve cleaning liquid. Thus, in the substrate processing apparatus 1, when it is determined that the cleaning of the switching valve 62 is defective, the switching valve 62 can be repeatedly cleaned.

  Various changes can be made in the substrate processing apparatus 1 described above.

  For example, in the above-described embodiment, all of the valves 62a, 62b, and 62c of the switching valve 62 are closed in order to place the switching valve 62 in a closed state, but the present invention is not limited to this. For example, as shown in FIG. 4, a single valve 622 is provided on the liquid supply pipe 621 b, the valves 62 a and 62 c are closed in the valve 62, the valve 62 b is not closed, and the valve 622 is closed instead of the valve 62 b. In this way, the same closed state of the valve 62 as described above can be realized, and the same effect can be obtained.

  Further, the valve cleaning liquid supply unit 63 may be connected to the common drain pipe 61 between the detection position of the liquid detection unit 64 and the drain port 44. Alternatively, the valve cleaning liquid supply unit 63 is not connected to the common drain pipe 61 and supplies the valve cleaning liquid into the cup section 4, thereby allowing the valve cleaning liquid supply section 63 to pass through the cup section 4, the drain port 44, and the common drain pipe 61. The valve cleaning liquid may be supplied to the switching valve 62.

  In the substrate processing apparatus 1, the cleaning determination unit 72 is not necessarily provided. For example, when the cleaning determination unit 72 is omitted from the control unit 7 and the switching valve 62 is opened after the cleaning is completed, the operator visually checks the discharge state of the valve cleaning liquid from the switching valve 62 and the operator sets the switching valve 62. A cleaning result may be determined.

  In the substrate processing apparatus 1, the plurality of types of processing liquids supplied from the processing liquid supply unit 5 to the substrate 9 are not limited to the above-described example, and may be variously changed. Further, the valve cleaning liquid supplied from the valve cleaning liquid supply unit 63 to the switching valve 62 may be variously changed. For example, an acidic treatment liquid and an alkaline treatment liquid that produce precipitates when mixed with the plurality of kinds of treatment liquids may be included. In this case, a liquid that dissolves the precipitate is used as the valve cleaning liquid.

  In the substrate processing apparatus 1, liquid other than the valve cleaning liquid from the valve cleaning liquid supply unit 63 may be supplied to the switching valve 62 as the cleaning liquid. For example, in the edge rinsing process described above, after the switching valve 62 is closed, IPA is supplied from the IPA supply source 56 through the third nozzle 53 onto the substrate 9 held by the substrate holding unit 31. Then, the switching valve 62 may be cleaned by supplying and filling the IPA flowing from the substrate 9 into the chamber 11 into the switching valve 62 in the closed state from the common drain pipe 61. In this case, the third nozzle 53 is also a cleaning liquid supply unit that supplies the cleaning liquid to the switching valve 62. In this case, the valve cleaning liquid supply unit 63 may supply the cleaning liquid simultaneously with the supply of the cleaning liquid from the third nozzle 53 described above, or may be omitted from the substrate processing apparatus 1.

  Further, in the substrate processing apparatus 1, a liquid detection unit 64 that detects the presence or absence of the valve cleaning liquid at the detection position on the common drain pipe 61 is used, but the liquid detection unit 64 includes the presence or absence of the valve cleaning liquid. In addition to detecting the contamination, it also functions as a contamination detection unit that detects the contamination of the processing liquid and the cleaning solution at the detection position on the common drain pipe 61 and / or the contamination of the inner surface at the detection position on the common drain pipe 61. You can do it. For example, a first threshold value for detecting presence / absence of liquid and a second threshold value for detecting contamination of the liquid are set in the optical sensor used as the liquid detection unit 64. In this case, the liquid detection unit 64 has a function as a contamination detection unit, and also serves as the contamination detection unit. With this configuration, during the processing of the substrate 9, the degree of contamination of the processing liquid and the cleaning liquid in the common drain pipe 61 or the dirt on the inner surface of the common drain pipe 61 becomes severe, and the common drain pipe 61 and the switching valve 62 become dirty. When the risk of clogging becomes high, the degree of contamination can be detected, and the detection valve can be used as a trigger to start cleaning the switching valve 62 described above. As a result, the cleaning operation can be performed before the switching valve 62 is clogged, and the occurrence of clogging can be prevented in advance. In the substrate processing apparatus 1, it is also preferable that a dirt detection unit that detects the above-described dirt is provided separately from the liquid detection unit 64. Even with this configuration, the same operational effects as described above can be obtained.

  The substrate processing apparatus 1 described above may be used for processing glass substrates used in display devices such as liquid crystal display devices, plasma displays, and FEDs (field emission displays) in addition to semiconductor substrates. Alternatively, the substrate processing apparatus 1 described above may be used for processing of an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, a solar cell substrate, and the like.

  The configurations in the above-described embodiments and modifications may be combined as appropriate as long as they do not contradict each other.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 5 Processing liquid supply part 9 Substrate 11 Chamber 31 Substrate holding part 61 Common drain pipe 62 Switching valve 63 Valve cleaning liquid supply part 64 Liquid detection part 71 Control part 72 Cleaning judgment part 91 (Substrate) upper surface J1 central axis Steps S11 to S15

Claims (16)

A substrate processing apparatus for processing a substrate,
A chamber;
A substrate holder for holding the substrate in the chamber;
A treatment liquid supply unit for individually supplying a plurality of types of treatment liquids to the substrate;
A common drain pipe for guiding the plurality of types of processing liquids supplied to the substrate to the outside of the chamber;
A switching valve that is connected to the common drain pipe outside the chamber, and switches a destination of the plurality of types of processing liquids;
A cleaning liquid supply unit for supplying a cleaning liquid to the switching valve;
A liquid detector for detecting the presence or absence of the cleaning liquid at a detection position on the common drain pipe;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The controller further includes a controller that controls the switching valve, the cleaning liquid supply unit, and the liquid detection unit to supply the cleaning liquid to the switching valve in a closed state, and confirms the filling of the cleaning liquid into the switching valve. A substrate processing apparatus. The substrate processing apparatus according to claim 1, wherein:
The substrate processing apparatus, wherein the cleaning liquid supply unit is connected to the common drain pipe between the detection position and the switching valve. A substrate processing apparatus according to any one of claims 1 to 3,
The substrate processing apparatus, wherein when the presence of the cleaning liquid is detected by the liquid detection unit, the cleaning liquid supply unit stops supplying the cleaning liquid. The substrate processing apparatus according to claim 1, wherein:
A timer for measuring an elapsed time from the start of supplying the cleaning liquid to the switching valve in the closed state;
The substrate processing apparatus, wherein the controller stops supplying the cleaning liquid to the switching valve side after a predetermined time is measured by the timer. A substrate processing apparatus according to any one of claims 1 to 5,
A cleaning determination unit that determines a cleaning result of the switching valve based on an output from the liquid detection unit after the switching valve filled with the cleaning liquid is opened;
The substrate processing characterized in that, when the liquid detection unit detects the presence of the cleaning liquid after a lapse of a predetermined time from the opening of the switching valve, the cleaning determination unit determines that the switching valve is poorly cleaned. apparatus. A substrate processing apparatus according to any one of claims 1 to 5,
A cleaning determination unit that determines a cleaning result of the switching valve based on an output from the liquid detection unit after the switching valve filled with the cleaning liquid is opened;
The liquid detection unit is capable of measuring the moving speed of the liquid surface of the cleaning liquid at the detection position on the common drain pipe;
The substrate processing apparatus, wherein when the moving speed of the liquid level of the cleaning liquid measured by the liquid detecting unit is lower than a threshold speed, the cleaning determining unit determines that the switching valve is poorly cleaned. . The substrate processing apparatus according to claim 7,
When the cleaning determination unit determines that the switching valve is not properly cleaned, the switching valve is closed by the control of the control unit, and the cleaning liquid supply unit supplies the cleaning liquid to the switching valve. A substrate processing apparatus. A substrate processing apparatus according to any one of claims 1 to 8,
The substrate processing apparatus, wherein the cleaning liquid is the same as one of the plurality of types of processing liquids. A substrate processing apparatus according to any one of claims 1 to 9,
A substrate processing apparatus, further comprising a contamination detection unit that detects contamination at a detection position on the common drain pipe or contamination on the inner surface. A chamber, a substrate holding unit for holding a substrate in the chamber, a processing liquid supply unit for individually supplying a plurality of types of processing liquids to the substrate, and the plurality of types of processing liquids supplied to the substrate in the chamber And a switching valve that is connected to the common drain pipe and switches a destination of the plurality of types of processing liquids, and cleaning the substrate processing apparatus for processing the substrate Because
a) supplying a cleaning liquid to the switching valve in a closed state, filling the switching valve with the cleaning liquid, and cleaning;
b) after the step a), opening the switching valve;
A cleaning method for a substrate processing apparatus, comprising: A method for cleaning a substrate processing apparatus according to claim 11,
The substrate processing apparatus, wherein the step a) includes a step of confirming the filling of the cleaning liquid into the switching valve by detecting the presence of the cleaning liquid at a detection position on the common drain pipe. Cleaning method. A method for cleaning a substrate processing apparatus according to claim 11 or 12,
c) further comprising the step of determining that the cleaning of the switching valve is defective when the presence of the cleaning liquid is detected at the detection position on the common drain pipe after a predetermined time has elapsed from the step b). A method for cleaning a substrate processing apparatus. A method for cleaning a substrate processing apparatus according to claim 11 or 12,
d) After the step b), the moving speed of the liquid level of the cleaning liquid at the detection position on the common drain pipe is measured, and when the moving speed of the liquid level of the cleaning liquid is lower than a threshold speed, the switching valve A method for cleaning a substrate processing apparatus, further comprising: determining that the cleaning of the substrate is defective. A method for cleaning a substrate processing apparatus according to claim 14,
e) When it is determined in step d) that the switching valve is not properly cleaned, the switching valve is closed to supply the cleaning liquid, and the switching valve is filled with the cleaning liquid for cleaning. A method for cleaning a substrate processing apparatus, further comprising: A method for cleaning a substrate processing apparatus according to any one of claims 11 to 15,
In the step a), the switching valve is closed, the substrate is held by the substrate holding portion, the cleaning liquid is supplied to the substrate, and the cleaning liquid that has flowed from the substrate to the chamber is removed from the common drain pipe. A method of cleaning a substrate processing apparatus, comprising the step of supplying into the switching valve, filling and cleaning.

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