JP2017208220A - Socket for electronic component and manufacturing method having evaluation process using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electronic component capable of switching the electrode pattern according to electronic components different in arrangement patterns of terminals, and to provide a manufacturing method having an evaluation process using the same.SOLUTION: A component mounting part 3 has multiple component side electrodes 4 provided on the mounting surface of an electronic component C, and multiple socket side electrodes 5 each configured to be freely extendable and contractable while connected electrically with these electrodes. A socket 2 has an upper electrode receiving part 8 and a lower electrode receiving part 9, each configured slidably. The socket side electrode 5 elongates from the component mounting part 3, and comes into contact with the upper electrode receiving part 8 or the lower electrode receiving part 9 facing in an elongation direction E, according to the slide position of the upper electrode receiving part 8 and the lower electrode receiving part 9.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component socket on which an electronic component is mounted and a manufacturing method having an evaluation process using the same.

The electronic component is attached to the electronic device by soldering the electronic component to the substrate, but is often attached via a socket.
For example, Patent Document 1 describes a socket that holds a chip-type LED (Light Emitting Diode) element and electrically connects the LED element and a cable. The socket includes a socket portion that is a rectangular parallelepiped housing, a fixed cover member, and a contact.

  The socket part has a chip attachment part that is open on the upper surface and formed in a concave shape. A contact insertion hole penetrating in the vertical direction is formed at the bottom of the chip mounting portion. A chip-type LED element is inserted into the chip mounting portion. The fixed cover member is attached to the socket part so that the opening part of the chip attaching part can be opened and closed, and the LED element is pressed and fixed from above in a closed position where the opening part is closed. One end of the contact is connected to the cable, and the other side contacts the terminal of the LED element by protruding from the bottom of the chip mounting portion through the contact insertion hole.

JP 2008-71968 A

  With the recent trend toward higher integration and multi-mounting of semiconductor components, the number of component terminals tends to increase, and various electronic components with different external shapes, terminal arrangement patterns, number of terminals, etc. are used in electronic devices. ing. On the other hand, in an electronic device, in the manufacturing process, the electrical characteristics of electronic components are measured for the purpose of removing defective products and the measurement results are evaluated. In this evaluation process, various electronic components as described above are evaluated.

  Evaluation of the electrical characteristics of the electronic component is performed, for example, by mounting the electronic component on an electrical property measurement board and electrically connecting each terminal of the electronic component to a test signal supply terminal provided on the measurement board. Is done. For this reason, conventionally, when the electronic component to be evaluated is changed and the terminal arrangement pattern is changed, it is necessary to reconnect the terminal and the corresponding test signal supply terminal each time.

  For example, consider a case where an electronic component is mounted on a measurement board using a socket described in Patent Document 1. In this case, when the electronic component to be evaluated is changed and the terminal arrangement pattern is changed, the terminal of the changed electronic component must be physically connected to the test signal supply terminal corresponding to the terminal.

  This invention solves the said subject, and aims at obtaining the manufacturing method which has the socket for electronic components which can switch an electrode pattern according to the electronic component from which the arrangement pattern of a terminal differs, and an evaluation process using the same To do.

The electronic component socket according to the present invention includes a component mounting portion and a socket portion.
The component mounting portion includes a plurality of first electrodes provided on a mounting surface of the electronic component, and a plurality of second electrodes each configured to be stretchable in a state of being electrically connected to the first electrode portion. Has a part. The socket portion has a plurality of electrode receiving portions each configured to be slidable. In this configuration, the second electrode portion extends from the component mounting portion, and contacts and is electrically connected to the electrode receiving portion facing in the extending direction according to the slide position of the electrode receiving portion.

  According to this invention, the second electrode portion electrically connected to the first electrode portion that contacts the terminal of the electronic component contacts the electrode receiving portion facing in the extension direction according to the slide position of the electrode receiving portion. And are electrically connected. By comprising in this way, the electrode pattern of a 1st electrode part can be switched according to the electronic component from which the arrangement pattern of a terminal differs.

It is a top view which shows the socket for electronic components which concerns on Embodiment 1 of this invention. It is a cross-sectional arrow figure which shows a mode that the socket for electronic components which concerns on Embodiment 1 was cut | disconnected by the AA line of FIG. FIG. 3A is an enlarged cross-sectional view of a component mounting portion in the first embodiment. FIG. 3B is a cross-sectional view showing a component mounting portion on which electronic components are arranged. FIG. 3 is a cross-sectional view showing a configuration of a socket part in the first embodiment. 4 is a cross-sectional view showing a state where the upper electrode receiving portion is connected to the first fixed electrode portion and the lower electrode receiving portion is connected to the second fixed electrode portion in the electronic component socket according to Embodiment 1. FIG. 4 is a cross-sectional view showing a state where the upper electrode receiving portion is connected to the second fixed electrode portion and the lower electrode receiving portion is connected to the first fixed electrode portion in the electronic component socket according to Embodiment 1. FIG. It is a top view which shows an example of the electrode pattern in a component mounting part. It is a top view which shows the relationship of the slide position of the upper electrode receiving part and lower electrode receiving part corresponding to the electrode pattern of FIG. It is a top view which shows another example of the electrode pattern in a component mounting part. FIG. 10 is a top view showing a relationship of slide positions between the upper electrode receiving portion and the lower electrode receiving portion corresponding to the electrode pattern of FIG. 9. It is a top view which shows the state which the plate-shaped part of the component mounting part of the socket for electronic components which concerns on Embodiment 2 of this invention closed. 6 is a top view showing a state where a plate-like portion of a component mounting portion in Embodiment 2 is opened. FIG. It is a cross-sectional arrow figure which shows a mode that the component mounting part in Embodiment 2 was cut | disconnected by the FF line of FIG.

Embodiment 1 FIG.
FIG. 1 is a top view showing an electronic component socket 1 according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional arrow view showing a state in which the electronic component socket 1 is cut along the AA line in FIG. 1, and the arrow direction indicates the sliding direction B of the upper electrode receiving portion 8 and the lower electrode receiving portion 9. Is shown.
FIG. 3A is an enlarged cross-sectional view of the component mounting portion 3. FIG. 3B is a cross-sectional view showing the component mounting portion 3 in which the electronic component C is arranged. FIG. 4 is a cross-sectional view showing the configuration of the socket part 2 and shows a state in which the socket part 2 is cut along the line AA in FIG.

  The electronic component socket 1 is a socket used for evaluating the characteristics of an electronic component. For example, the socket 1 is used for evaluating the characteristics of an electronic component C composed of an LED element having two electrodes, a cathode and an anode. The electronic component socket 1 includes a socket portion 2 and a component mounting portion 3.

The socket part 2 is comprised from the housing | casing 2b in which the opening part 2a was formed, and is fixed in the state by which the component mounting part 3 was engage | inserted by this opening part 2a. For example, the component mounting portion 3 is fixed to the inner peripheral side of the opening 2a by a fixing mechanism (not shown) by being fitted into the opening 2a.
Further, the housing 2b and the component mounting portion 3 of the socket portion 2 are made of an electrically insulating material such as resin. The upper electrode receiving portion 8, the lower electrode receiving portion 9, the first fixed electrode portion 10, And a second fixed electrode portion 11.

The component mounting portion 3 is provided with a mounting surface 3 a and an outer frame portion 3 b on the outer edge of the mounting surface 3 a, and includes a component-side electrode portion 4, a socket-side electrode portion 5, a shaft portion 6, and an electrode spring 7.
The dimension of the mounting surface 3a of the component mounting part 3 is set to a dimension in which a component having the largest mounting surface dimension can be disposed among the electronic components to be evaluated so that electronic components having different mounting surface dimensions can be disposed.

As shown in FIG. 1, a plurality of component side electrode portions 4 arranged at equal intervals are provided on the mounting surface 3 a of the component mounting portion 3. As shown in FIG. 3B, the plurality of component-side electrode portions 4 are in contact with and electrically connected to terminals of the electronic component C mounted on the mounting surface 3a.
The component-side electrode unit 4 is a component that embodies the first electrode unit in the present invention, and is configured as, for example, a ball-shaped electrode unit.
When the electronic component C is disposed on the mounting surface 3a, the component-side electrode portion 4 is in point contact with the terminal of the electronic component C. By this point contact, the component side electrode part 4 and the terminal of the electronic component C are electrically connected.

  Further, by making the component-side electrode portion 4 a ball-shaped electrode portion, as shown in FIG. 3B, the diameter of the component-side electrode portion 4 is not brought into close contact between the terminal of the electronic component C and the mounting surface 3a. A distance D corresponding to is formed. Since the heat generated in the electronic component C is dissipated by the convection of air in the interval D, the deterioration of the characteristics of the electronic component C due to heat can be suppressed.

As shown in FIG. 3A, the socket-side electrode portion 5 is connected to the shaft portion 6 via an electrode spring 7. In this Embodiment 1, the case where the socket side electrode part 5 is a ball-shaped electrode part similarly to the component side electrode part 4 is shown. The shape of the socket-side electrode portion 5 is not limited to a ball shape, and may be any shape that can fit into the electrode receiving recesses 8a and 9b. For example, it may be a columnar electrode portion that can be passed through the electrode receiving recesses 8a and 9b.
Further, the second electrode portion in the present invention is an electrode portion configured to be stretchable while being electrically connected to the component side electrode portion 4, and in the first embodiment, the socket side electrode portion 5, the shaft A structure having the portion 6 and the electrode spring 7 is obtained. However, since the socket side electrode part 5 is a component which contacts the electrode receiving recessed part 8a, 9b, it describes as what the socket side electrode part 5 is a 2nd electrode part hereafter.

The shaft portion 6 is a rod-shaped member having electrical conductivity, and one end portion thereof is electrically and mechanically connected to the component side electrode portion 4. As shown in FIG. 3A, the shaft portion 6 is in a state of penetrating the component mounting portion 3 from the mounting surface 3a to the socket portion 2 side.
One end portion of the electrode spring 7 is electrically and mechanically connected to the portion of the shaft portion 6 protruding from the component mounting portion 3 to the socket portion 2 side.

  The shaft portion 6 is disposed on the inner peripheral side of the electrode spring 7 so that the electrode spring 7 expands and contracts without being laterally folded. That is, when the electrode spring 7 extends toward the socket portion 2 side, even if a lateral force is applied to the electrode spring 7, the shaft portion 6 contacts the inner periphery of the electrode spring 7. Lateral folding is prevented. The electrode spring 7 may be connected to a lead wire extending from the component-side electrode portion 4 without the shaft portion 6. However, in this configuration, since the function of preventing the electrode spring 7 from being folded laterally is lost, it is necessary to select a spring having few lateral folding as the electrode spring 7.

The electrode spring 7 is a spring member made of an electrically conductive material, and one end is electrically and mechanically connected to the shaft portion 6 and the other end is connected to the socket-side electrode portion 5. . That is, the component side electrode part 4 and the socket side electrode part 5 are electrically connected via the shaft part 6 and the electrode spring 7. Further, as shown in FIG. 3A, the electrode spring 7 extends due to the weight of the socket-side electrode portion 5, so that the socket-side electrode portion 5 is connected to the electrode receiving recess 8 a of the upper electrode receiving portion 8 or The electrode receiving recess 9b is reached and fitted.
In this way, the socket side electrode portion 5 and the upper electrode receiving portion 8 or the lower electrode receiving portion 9 are electrically connected.

The upper electrode receiving portion 8 and the lower electrode receiving portion 9 are components embodying the electrode receiving portion in the present invention, and are provided in two stages along the extending and contracting direction of the socket side electrode portion 5.
The upper electrode receiving portion 8 is a belt-like member made of an electrically conductive material that is provided on the opening 2a side of the housing 2b and slides along the slide guide portion 2c in the housing 2b. Further, as will be described later with reference to FIGS. 8 and 10, a plurality of upper electrode receiving portions 8 are provided side by side in a direction orthogonal to the sliding direction B in the same step. Each upper electrode receiving portion 8 is provided with a plurality of electrode receiving recessed portions 8a along the sliding direction B side by side on the component mounting portion 3 side, and an engaging protruding portion 8b corresponding to each electrode receiving recessed portion 8a. Is provided on the lower electrode receiving portion 9 side.

The lower electrode receiving portion 9 is provided at the lower stage of the upper electrode receiving portion 8 with the insulating wall portion 9a interposed therebetween, and slides in a direction parallel to the slide guide portion 2c inside the recess 2d of the housing 2b. It is a strip-shaped member made of a material having a property.
Further, as will be described later with reference to FIGS. 8 and 10, a plurality of lower electrode receiving portions 9 are provided side by side in a direction orthogonal to the sliding direction B at the same stage. In each of the lower electrode receiving portions 9, a plurality of electrode receiving recessed portions 9 b are formed side by side along the sliding direction B.
The insulating wall portion 9 a extending from the lower electrode receiving portion 9 toward the upper electrode receiving portion 8 is made of an electrically insulating material such as resin, and is formed between the upper electrode receiving portion 8 and the lower electrode receiving portion 9. Are insulated by an insulating wall 9a.

The 1st fixed electrode part 10 and the 2nd fixed electrode part 11 are each arrange | positioned at the both ends of the sliding direction B of the lower electrode receiving part 9 in the recessed part 2d.
The first fixed electrode portion 10 is a belt-like member made of an electrically conductive material, and as will be described later with reference to FIGS. 8 and 10, the lower electrode receiving portion 9 has a longitudinal direction on one side of the recess 2d. It is arrange | positioned so that it may orthogonally cross in the sliding direction B.

  The first fixed electrode portion 10 is provided with an engaging convex portion 10a on the bottom surface side of the concave portion 2d, and is provided with an engaging concave portion 10b on the component mounting portion 3 side. The upper electrode receiving portion 8 and the first fixed electrode portion 10 are electrically connected by engaging the engaging convex portion 8b with the engaging concave portion 10b. Moreover, the lower electrode receiving part 9 and the 1st fixed electrode part 10 are electrically connected by engaging the engaging convex part 10a with the electrode receiving recessed part 9b.

The second fixed electrode portion 11 is a belt-like member made of an electrically conductive material, and as will be described later with reference to FIGS. 8 and 10, the lower electrode receiving portion 9 has a longitudinal direction on the other side of the recess 2d. It is arrange | positioned so that it may orthogonally cross in the sliding direction B.
Similar to the first fixed electrode portion 10, the second fixed electrode portion 11 is provided with an engaging convex portion 11a on the bottom surface side of the concave portion 2d, and an engaging concave portion 11b on the component mounting portion 3 side. ing. The upper electrode receiving portion 8 and the second fixed electrode portion 11 are electrically connected by fitting the engaging convex portion 8b into the engaging concave portion 11b. Moreover, the lower electrode receiving part 9 and the 2nd fixed electrode part 11 are electrically connected because the engagement convex part 11a fits into the electrode receiving recessed part 9b.

Further, different potentials are applied to the first fixed electrode portion 10 and the second fixed electrode portion 11.
For example, consider a case where the electronic component C is a component composed of a plurality of LED elements, and a negative potential or a positive potential is applied to the terminal of the electronic component C. In this case, one of a negative potential and a positive potential is applied to the first fixed electrode portion 10, and the other potential is applied to the second fixed electrode portion 11. In this state, the upper electrode receiving portion 8 and the lower electrode receiving portion 9 are slid to be electrically connected to the fixed electrode portion to which a desired potential is applied, and the socket side electrode portion 5 becomes the potential of the corresponding terminal. The upper electrode receiving portion 8 or the lower electrode receiving portion 9 is electrically connected.

The socket part 2 may be provided with a slide mechanism shown in FIG.
In FIG. 4, the slide lever 12 is a member for sliding the lower electrode receiving portion 9 in the recess 2d, and the slide dial 13 is a member for sliding the upper electrode receiving portion 8 along the slide guide portion 2c. is there.
The slide lever 12 is provided for each lower electrode receiving portion 9, one end is connected to the lower electrode receiving portion 9, and the other end is passed through a through groove provided in the bottom surface of the recess 2 d. 2b is exposed to the outside. By moving the exposed end portion along the slide direction B, the lower electrode receiving portion 9 slides.

Two slide dials 13 are provided for each upper electrode receiving portion 8, and are gear-shaped members that engage with the engaging convex portions 8 b of the upper electrode receiving portion 8. As shown in FIG. 4, the two slide dials 13 are rotatably provided at both ends sandwiching the recess 2d.
A part of the slide dial 13 is exposed to the outside through a through groove provided in the housing 2b. When the slide dial 13 is rotated through the exposed portion, the rotational force is converted into a force in the sliding direction B by the engaging convex portion 8b. Thereby, the upper electrode receiving part 8 slides.

The slide mechanism shown in FIG. 4 is an example, and the upper electrode receiving portion 8 and the lower electrode receiving portion 9 may be slid by another mechanism.
That is, if the mechanism is capable of sliding the upper electrode receiving portion 8 and the lower electrode receiving portion 9 along the sliding direction B, the slide dial 13 that meshes with the engaging convex portion 8b of the upper electrode receiving portion 8 is provided. You may abbreviate | omit and can employ | adopt as the socket part 2 regardless of manual operation and automatic.

FIG. 5 is a cross-sectional view showing a state in which the upper electrode receiving portion 8 is connected to the first fixed electrode portion 10 and the lower electrode receiving portion 9 is connected to the second fixed electrode portion 11 in the electronic component socket 1. is there.
In FIG. 5, the upper electrode receiving portion 8 is slid toward the first fixed electrode portion 10, and the engaging convex portion 8 b is fitted in the engaging concave portion 10 b of the first fixed electrode portion 10. As a result, the upper electrode receiving portion 8 has the same potential as that of the first fixed electrode portion 10.
On the other hand, the lower electrode receiving part 9 is slid to the second fixed electrode part 11 side, and the engaging convex part 11a of the second fixed electrode part 11 is fitted in the electrode receiving concave part 9b. As a result, the lower electrode receiving portion 9 has the same potential as that of the second fixed electrode portion 11.

The socket-side electrode portion 5 extends from the component mounting portion 3, and the upper electrode receiving portion 8 or the lower electrode receiving portion 9 is opposed to the extending direction E according to the slide position of the upper electrode receiving portion 8 and the lower electrode receiving portion 9. To be electrically connected.
In the socket-side electrode portion 5 shown at the rightmost in FIG. 5, the upper electrode receiving portion 8 slides to the left and does not face the extending direction E, and the lower electrode receiving portion 9 at the lower stage has the extending direction. Opposite to E. Therefore, as shown in FIG. 5, the socket-side electrode portion 5 extends to the lower electrode receiving portion 9 and fits into the electrode receiving concave portion 9 b, and the second fixed electrode portion 11 is inserted through the lower electrode receiving portion 9. It becomes a potential. Further, the upper electrode receiving portion 8 faces the other socket side electrode portion 5 in FIG. Therefore, these socket-side electrode portions 5 extend to the upper electrode receiving portion 8 and are fitted into the electrode receiving recess portion 8a, so that the potential of the first fixed electrode portion 10 is obtained via the upper electrode receiving portion 8. .

FIG. 6 is a cross-sectional view showing a state where the upper electrode receiving portion 8 is connected to the second fixed electrode portion 11 and the lower electrode receiving portion 9 is connected to the first fixed electrode portion 10 in the electronic component socket 1. is there.
In FIG. 6, the upper electrode receiving portion 8 is slid toward the second fixed electrode portion 11, and the engaging convex portion 8 b is fitted in the engaging concave portion 11 b of the second fixed electrode portion 11. As a result, the upper electrode receiving portion 8 has the same potential as the potential of the second fixed electrode portion 11.
On the other hand, the lower electrode receiving part 9 is slid to the first fixed electrode part 10 side, and the engaging convex part 10a of the first fixed electrode part 10 is fitted in the electrode receiving concave part 9b. As a result, the lower electrode receiving portion 9 has the same potential as that of the first fixed electrode portion 10.

  6, the upper electrode receiving portion 8 slides to the right and does not face the extending direction E, and the lower electrode receiving portion 9 in the lower stage has the extending direction. Opposite to E. Accordingly, as shown in FIG. 6, the socket-side electrode portion 5 extends to the lower electrode receiving portion 9 and fits into the electrode receiving recessed portion 9 b, and the first fixed electrode portion 10 is inserted through the lower electrode receiving portion 9. It becomes a potential. Further, an upper electrode receiving portion 8 faces the other socket side electrode portion 5 in FIG. Accordingly, these socket side electrode portions 5 extend to the upper electrode receiving portion 8 and are fitted into the electrode receiving recess portion 8a, thereby becoming the potential of the second fixed electrode portion 11 through the upper electrode receiving portion 8. .

  FIG. 7 is a top view showing an example of an electrode pattern in the component mounting portion 3. FIG. 8 is a top view showing the relationship between the slide positions of the upper electrode receiving portion 8 and the lower electrode receiving portion 9 corresponding to the electrode pattern of FIG. In the electrode pattern shown in FIG. 7, among the terminals of the electronic component C, a positive potential is applied to the terminals that are in contact with the component-side electrode portions 4 in the regions 3a-1 and 3a-3 of the mounting surface 3a. 2 is a pattern in which a negative potential is applied to the terminal in contact with the component-side electrode portion 4 in FIG.

  When realizing this electrode pattern, a positive potential is applied to the first fixed electrode portion 10 shown in FIG. 8 and a negative potential is applied to the second fixed electrode portion 11. Then, the two upper electrode receiving portions 8 corresponding to the area immediately below the region 3a-2 are slid to a position outside the range corresponding to the mounting surface 3a. The four upper electrode receiving portions 8 corresponding directly below the regions 3a-1 and 3a-3 are electrically connected to the first fixed electrode portion 10 as slide positions that fall within the range immediately below the mounting surface 3a. Further, the six lower electrode receiving portions 9 are also electrically connected to the second fixed electrode portion 11 as slide positions that fall within the range immediately below the mounting surface 3a.

  In the state of the socket part 2 described above, the component mounting part 3 having the electrode pattern shown in FIG. 7 is attached to the opening 2a. At this time, since the two upper electrode receiving portions 8 corresponding to the region 3a-2 immediately below the mounting surface 3a are out of the range immediately below the mounting surface 3a, the socket-side electrode portion 5 directly below the region 3a-2 has a lower electrode. The receiving part 9 faces the extending direction E. As a result, the socket-side electrode portion 5 immediately below the region 3 a-2 extends to the lower electrode receiving portion 9 and fits into the electrode receiving recess 9 b, and becomes a negative potential via the lower electrode receiving portion 9.

  On the other hand, the four upper electrode receiving portions 8 immediately below the areas 3a-1 and 3a-3 are slide positions that fall within the range immediately below the mounting surface 3a, and therefore, the sockets directly below the areas 3a-1 and 3a-3. The upper electrode receiving portion 8 faces the side electrode portion 5 in the extending direction E. As a result, the socket-side electrode portion 5 immediately below the regions 3a-1 and 3a-3 extends to the upper electrode receiving portion 8 and fits into the electrode receiving concave portion 8a. Become.

  FIG. 9 is a top view showing another example of the electrode pattern in the component mounting portion 3. FIG. 10 is a top view showing the relationship between the slide positions of the upper electrode receiving portion 8 and the lower electrode receiving portion 9 corresponding to the electrode pattern of FIG. In the electrode pattern shown in FIG. 9, among the terminals of the electronic component C, a negative potential is applied to the terminals in contact with the component-side electrode portions 4 in the regions 3a-4 and 3a-5 of the mounting surface 3a. This is a pattern in which a positive potential is applied to the terminal in contact with the component side electrode portion 4 at −6.

When realizing this electrode pattern, a positive potential is applied to the first fixed electrode portion 10 shown in FIG. 10 and a negative potential is applied to the second fixed electrode portion 11.
Then, the four upper electrode receiving portions 8 are slid to be electrically connected to the first fixed electrode portion 10 so that the upper electrode receiving portion 8 is removed from the range immediately below the regions 3a-4 and 3a-5.
The two upper electrode receiving portions 8 adjacent to the region immediately below the regions 3a-4 and 3a-5 are electrically connected to the first fixed electrode portion 10 as a slide position within the region immediately below the mounting surface 3a. Connecting. Further, the six lower electrode receiving portions 9 are electrically connected to the second fixed electrode portion 11 as slide positions that fall within the range immediately below the mounting surface 3a.

  In the state of the socket portion 2 described above, the component mounting portion 3 having the electrode pattern shown in FIG. 9 is attached to the opening 2a. At this time, since the upper electrode receiving portion 8 is out of the range corresponding to the regions 3a-4 and 3a-5, the lower electrode receiving portion 5 is provided on the socket side electrode portion 5 immediately below the regions 3a-4 and 3a-5. The part 9 faces the extending direction E. As a result, the socket-side electrode portion 5 immediately below the regions 3a-4 and 3a-5 extends to the lower electrode receiving portion 9, is fitted into the electrode receiving recess 9b, and becomes a negative potential via the lower electrode receiving portion 9. .

  On the other hand, since the upper electrode receiving portion 8 corresponding to the region 3a-6 directly below the mounting surface 3a is a sliding position that falls within the range immediately below the mounting surface 3a, The receiving portion 8 faces the extending direction E. For this reason, the socket-side electrode portion 5 immediately below the region 3 a-6 extends to the upper electrode receiving portion 8 and fits into the electrode receiving recessed portion 8 a, and becomes a positive potential via the upper electrode receiving portion 8.

  Thus, only by changing the sliding position of the upper electrode receiving portion 8 and the lower electrode receiving portion 9, the socket side electrode out of the potentials applied to the first fixed electrode portion 10 and the second fixed electrode portion 11. The potential to be applied to the unit 5 can be switched. Thereby, unlike the conventional case, it is not necessary to facilitate the socket for each terminal arrangement pattern of the electronic component, and one electronic component socket 1 can correspond to various terminal arrangement patterns.

  In addition, although the case where the electrode receiving part has two stages of the upper electrode receiving part 8 and the lower electrode receiving part 9 is shown, three or more electrode receiving parts may be provided. For example, a configuration in which the sliding directions are orthogonal to each other may be used. That is, in the electronic component socket 1 according to the first embodiment, it is only necessary to have an electrode receiving portion corresponding to the potential or signal to be applied to the terminal of the electronic component.

In addition, the configuration in which the upper electrode receiving portion 8 and the lower electrode receiving portion 9 are provided in two stages along the expansion and contraction direction of the socket-side electrode section 5 is shown, but the configuration may not be provided in a plurality of stages.
For example, a plurality of electrode receiving portions may be arranged side by side on the same plane facing the socket-side electrode portion 5. Also in this structure, the socket side electrode part 5 contacts the electrode receiving part which opposes an extending | stretching direction according to the slide position of an electrode receiving part. The lower surfaces of these electrode receiving portions may be ground potential electrode receiving portions.

  Furthermore, although the structure which provided the two fixed electrode parts of the 1st fixed electrode part 10 and the 2nd fixed electrode part 11 was shown, three or more fixed electrode parts may be provided, and it fixes on the contrary It is not necessary to provide an electrode part. For example, you may provide a fixed electrode part for every electrode receiving part or every predetermined number of electrode receiving parts. Further, a configuration may be adopted in which a desired potential is directly applied to each electrode receiving portion without providing the fixed electrode portion.

  As described above, in the electronic component socket 1 according to the first embodiment, the socket-side electrode portion 5 has the upper electrode receiver that faces the extending direction according to the slide positions of the upper electrode receiving portion 8 and the lower electrode receiving portion 9. The portion 8 or the lower electrode receiving portion 9 is in contact with and electrically connected. Further, the socket-side electrode portion 5 is electrically connected to the component-side electrode portion 4 that is in contact with the terminal of the electronic component C. By comprising in this way, an electrode pattern can be switched according to the various electronic components from which the arrangement pattern of a terminal differs.

In the electronic component socket 1 according to the first embodiment, the upper electrode receiving portion 8 and the lower electrode receiving portion 9 are provided in two stages in the extending and contracting direction of the socket side electrode portion 5.
With such a configuration, the socket-side electrode portion 5 can be connected to the electrode receiving portion for each desired stage depending on the slide positions of the upper electrode receiving portion 8 and the lower electrode receiving portion 9.

  Furthermore, in the electronic component socket 1 according to Embodiment 1, the component-side electrode portion 4 is a ball-shaped electrode portion. With this configuration, the terminal of the electronic component C and the mounting surface 3a are not in close contact with each other, and a distance D corresponding to the diameter of the component-side electrode portion 4 is formed. Since the heat generated in the electronic component C is dissipated by the convection of air in the interval D, it is possible to suppress the deterioration of the characteristics of the electronic component C due to heat.

Embodiment 2. FIG.
FIG. 11 is a top view showing a state in which the plate-like portion 3c of the component mounting portion 3A of the electronic component socket 1 according to Embodiment 2 of the present invention is closed. FIG. 12 is a top view showing a state in which the plate-like portion 3c of the component mounting portion 3A is opened. 13 is a cross-sectional arrow view showing a state where the component mounting portion 3A is cut along the line FF in FIG. The component mounting portion 3A is provided with four plate-like portions 3c configured to be slidable along the mounting surface 3a and in contact with the electronic component C from four directions.

The plate-like portion 3c is a substantially triangular plate-like member as shown in FIGS. 11 and 12, and slides along the mounting surface 3a through the through groove portion 3b-1 provided in the outer frame portion 3b.
In a state where the four plate-like portions 3c are brought into contact with the electronic component C arranged on the mounting surface 3a from four directions, the four plate-like portions 3c are screwed with screws 3d provided on the outer frame portion 3b. Thereby, the electronic component C is fixed on the mounting surface 3a of the component mounting portion 3A.

With this configuration, any size electronic component can be sandwiched and fixed by the plate-like portion 3c as long as it can be placed inside the outer frame portion 3b.
Moreover, if it is a shape which can be inserted | pinched by the plate-shaped part 3c, it can fix even if the shape seen from the upper side is not a rectangular shape.

In addition, although the structure which pinches | interposes and fixes the electronic component C by the plate-shaped part 3c from four directions was shown, five directions or more may be sufficient and conversely may be two directions or more and three directions or less.
That is, the number of the plate-like portions 3c of the component mounting portion 3A may be any number and arrangement that can surround the electronic component C without deviation on the mounting surface 3a.

  As described above, the electronic component socket 1 according to Embodiment 2 includes the four plate-like portions 3c. Each of the four plate-like portions 3c is configured to be slidable along the mounting surface 3a, and is fixed in contact with the electronic component C disposed on the mounting surface 3a from four directions. By providing this configuration, any size or shape of electronic component can be fixed as long as it can be placed inside the outer frame portion 3b.

  Moreover, in the manufacturing process of an electronic device, the evaluation process which evaluates a characteristic by mounting | wearing the electronic component socket 1 shown in Embodiment 1 and Embodiment 2 with the electronic component which comprises this electronic device is implemented. Thereby, the characteristic of the various electronic components from which the arrangement pattern of a terminal differs can be evaluated using the socket 1 for electronic components.

  In the present invention, within the scope of the invention, any combination of each embodiment, any component of each embodiment can be modified, or any component can be omitted in each embodiment. .

  DESCRIPTION OF SYMBOLS 1 Socket for electronic components, 2 Socket part, 2a Opening part, 2b Case, 2c Slide guide part, 2d Recessed part, 3,3A Component mounting part, 3a Mounting surface, 3a-1-3a-6 area | region, 3b Outer frame part 3b-1 Through-groove part, 3c plate-like part, 3d screw, 4 component side electrode part, 5 socket side electrode part, 6 shaft part, 7 electrode spring, 8 upper electrode receiving part, 8a, 9b electrode receiving recessed part, 8b, 10a, 11a Engaging convex part, 9 Lower electrode receiving part, 9a Insulating wall part, 10 First fixed electrode part, 10b, 11b Engaging concave part, 11 Second fixed electrode part, 12 Slide lever, 13 Slide dial .

Claims (5)

A plurality of first electrode portions provided on the mounting surface of the electronic component, and a plurality of second electrode portions each configured to be stretchable in a state of being electrically connected to the first electrode portion. Component mounting part,
A socket portion having a plurality of electrode receiving portions each slidably configured,
The second electrode portion extends from the component mounting portion and is electrically connected in contact with the electrode receiving portion facing in the extending direction according to a slide position of the electrode receiving portion. Socket for electronic parts.   2. The electronic component socket according to claim 1, wherein the plurality of electrode receiving portions are provided in a plurality of stages in a direction in which the second electrode portion extends and contracts.   2. A plurality of plate-like portions that are configured to be slidable along the mounting surface and are fixed in contact with each other from a plurality of directions surrounding an electronic component disposed on the mounting surface. Or the socket for electronic components of Claim 2.   4. The electronic component socket according to claim 1, wherein the first electrode portion is a ball-shaped electrode portion. 5.   An electronic device manufacturing method comprising an evaluation step of mounting an electronic component constituting the electronic device on the electronic component socket according to any one of claims 1 to 4 and evaluating characteristics.

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