JP2006331666A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket usable without being influenced by a package size of an IC of a measurement object and the number of solder balls, and capable of restraining a development cost and a development period relating to the IC socket in the development of an IC. <P>SOLUTION: This IC socket is provided with: a socket base 13 having a plurality of first holes 17c allowing measurement terminals 4 to be attached and detached thereto/therefrom in a first area thereof; a first floating base 11 vertically movably held above the socket base 13 and having a plurality of second holes 17a corresponding to the plurality of holes 17c in a second area nearly equivalent to the first area; and a second floating base 12 detachably arranged above the first floating base 11 and provided with an insertion area 19 allowing the IC 6 of a measurement object to be inserted therein in a third area having a size smaller than that of the second area. In the socket base 13, the measurement terminals 4 are mounted to the first holes, within the plurality of first holes 17c, corresponding to a plurality of terminals 9 provided for the IC 6. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC socket.

  IC sockets are known that are used to measure the electrical characteristics of an IC packaged with an IC chip. FIG. 1 is a schematic cross-sectional view showing a configuration of a conventional IC socket. The IC socket 101 includes a socket base frame 116, a socket base 113, a floating base 111, an alignment member 114, a floating spring 115, and a probe pin 104.

  The socket base frame 116 is a frame surrounding the socket base 113 and the floating base 111. The socket base 113 is fixed and the floating base 111 is movably held. The socket base 113 has a plurality of first holes 117c in a first region as a central region. The plurality of first holes 117c are provided with probe pins 104 as measurement terminals used in measurement. The floating pedestal 111 is held on the upper surface of the socket pedestal 113 so as to be movable up and down. The second area corresponding to the upper side of the first area has a concave insertion area 119 into which the IC 106 to be measured can be inserted. The insertion region 119 has a plurality of second holes 117a corresponding to them above the plurality of first holes 117c. The alignment member 114 fixes the positional relationship between the socket base 113 and the floating base 111. The floating spring 115 holds the floating pedestal 111 such that it can move up and down within a predetermined range with respect to the socket pedestal 113.

  The IC 106 to be measured is pressed against the insertion region 119 of the IC socket 101 with a predetermined load by the lid 102. The lid 102 includes a Z-direction adjusting unit 121, a device pressing member 122, and a lid frame 123. The lid frame 123 movably holds the Z-direction adjusting unit 121 and the device pressing member 122. The Z direction adjustment unit 121 sets the position of the device pressing unit 122 in the Z direction. The device pressing member 122 protrudes from the lower part of the lid frame 123 by the length set by the Z-direction adjusting unit 121.

  FIG. 2 is a plan view of the floating base 111 in FIG. A taper 118 is provided on the inlet side of the insertion region 119. At the bottom of the insertion region 119, a plurality of second holes 117a are provided corresponding to the solder balls 109 (positions of input / output pins) of the IC 106 to be measured.

A method for measuring the IC 106 using the IC socket 101 and the lid 102 will be described.
The IC 106 is inserted into the insertion area 119 of the floating base 111 by a predetermined device or the like. The length DDh of one side of the insertion region 119 having a square cross section perpendicular to the Z axis is substantially equal to the length DDc of one side of the IC 106 (where DDh> DDc). Therefore, in order to perform the insertion operation, it is necessary to bring the IC 106 to an accurate position on the insertion region 119. However, since the taper 118 is provided at the entrance portion of the insertion region 119, the insertion can be easily performed even if it is slightly deviated. Thereby, the solder ball 109 of the IC 106 comes into contact with the upper opening of the second hole 117a. The floating pedestal 111 floats from the socket pedestal 113 by a predetermined distance LLh3.

  Thereafter, the IC 106 is pressed against the bottom of the insertion region 119 of the floating base 111 by the device pressing member 122 as the lower surface of the lid frame 123 is pressed against the upper surface of the socket base frame 116. Here, the length DDp of one side of the device pressing member 122 having a square cross section perpendicular to the Z axis is substantially equal to the length DDc of one side of the IC 106 (where DDh> DDp). Therefore, the entire upper surface of the IC 106 is pressed evenly, so that the IC 106 is not damaged due to an uneven force.

  Here, the length to the lower surface of the device pressing member 122 of the lid 102 is LLD, the height not including the solder ball 109 of the IC 106 is H1, the depth of the upper surface portion of the floating pedestal 111 is LLh1, and the lower surface portion of the floating pedestal 111 LLh2, and the distance to the floating pedestal 111 on the basis of the upper surface portion of the socket pedestal 113 is LLh3. At this time, LLD, LLh1, H1, and LLh3 are set so that the working distance of the LLD + Z direction adjusting unit 121 is greater than LLh1−H1 + LLh3. Therefore, the Z direction adjustment unit 121 of the lid 102 can be adjusted in the Z direction. Thereby, the lower surface of the device pressing member 122 can press the IC 106 from its upper surface to the bottom of the insertion region 119.

The Z-direction adjusting unit 121 can push down the IC 106 as much as represented by the working distance of the LLD + Z-direction adjusting unit 121> LLh1-H1 + LLh3. Then, by the operation in the Z-axis direction, the probe pin 104 of the socket base 113 is inserted into the second hole 117c and can come into contact with the solder ball 109. When the solder ball 109 is in contact with the probe pin 104, the electrical characteristics of the IC 106 can be measured. The probe pin 104 is guaranteed electrical contact by applying an appropriate load from the measurement target. When the appropriate load is g, g is established in the form of g = f ₁ (LLD + Z-direction adjustment unit 121 working distance−LLh1 + H0−LLh3). Here, f ₁ (x) is a function of x. However, since a load cannot be applied to g more than appropriate, the distance of LLh3 is set as the load limit so as to be the upper limit of the load.

  As a related technique, Japanese Patent Application Laid-Open No. 2002-164136 discloses a BGA IC socket. This BGA IC socket includes a pin fixing block and a top plate. The pin fixing block has planted a probe pin. The top plate has a hole through which the tip of the probe pin passes and a portion for positioning the BGA type IC to be measured, and is movable up and down via a floating mechanism provided in the pin fixing block. The IC socket for BGA mounts the BGA type IC to be measured on the top plate, performs contact positioning between the solder bump and the probe pin of the BGA type IC to be measured, and lowers the pressure head to connect the solder bump and the probe pin. The electrical characteristics of the BGA type IC to be measured are measured by pressing. The top plate is divided into a part on which the BGA type IC to be measured is placed and a part to be positioned. The part for positioning the separated BGA type IC to be measured is composed of a position adjusting member for finely adjusting the contact position of the BGA type IC to be measured placed on the part to be described above.

  According to the gazette, this technique aims to eliminate the trouble when the BGA type IC (DUT) to be measured is attached to and detached from the IC socket, facilitate contact positioning, and improve the positioning accuracy. That is, in this BGA IC socket, it is assumed that the size of the BGA IC to be measured (including the number of pins, the position of the pins, etc.) is predetermined (fixed). The part where the separated BGA IC to be measured is positioned is for fine adjustment of the contact position of the BGA IC to be measured. Therefore, the portion to be positioned cannot move greatly.

JP 2002-164136 A

  The conventional IC socket 101 is prepared after the IC 106 to be measured is determined in advance. That is, after determining the IC 106 to be measured, the length DDp of one side DDp of the device pressing member 122 and the length DDh of one side of the insertion region 119 are determined according to the package size, and the number of solder balls (input / output pins) The number of the plurality of second holes 117a and the plurality of first holes 117c is determined according to the above. Therefore, it is necessary to design and manufacture a new IC socket 101 and lid 102 for each IC 106 package size. Therefore, development cost and development period are required each time. An IC socket that can be used without being affected by the package size of the IC to be measured and the number of solder balls (input / output pins) is desired.

  Accordingly, an object of the present invention is to provide an IC socket that can be used without being affected by the package size of the IC to be measured and the number of solder balls (input / output pins).

  Another object of the present invention is to provide an IC socket capable of suppressing the development cost and development period related to the IC socket in the development of the IC.

  Hereinafter, means for solving the problem will be described using the numbers and symbols used in the best mode for carrying out the invention. These numbers and symbols are added in parentheses in order to clarify the correspondence between the description of the claims and the best mode for carrying out the invention. However, these numbers and symbols should not be used for interpreting the technical scope of the invention described in the claims.

Therefore, in order to solve the above problems, the IC socket of the present invention is a plate-shaped socket base (13, 63) having a plurality of first holes (17c, 67c) to which the measurement terminals (4, 54) can be attached and detached. And a first floating pedestal (11) having a plurality of second holes (17a, 67a) corresponding to the plurality of first holes (17c, 67c). 61) and a plurality of solder balls (9, 9a, 59, 59a) provided above the first floating base (11, 61) and possessed by the ICs (6, 6a, 56, 56a) to be measured. An insertion region (19, 19a, 19b, 69, 69a) into which the IC (6, 6a, 56, 56a) can be inserted is formed so as to come into contact with the corresponding one of the second holes (17a, 67a). Plate-like second floaty Grayed base (12,12a, 12b, 62); and a. The socket base (13, 63) is provided with a measurement terminal (4, 54) corresponding to the plurality of solder balls (9, 9a, 59, 59a) among the plurality of first holes (17c, 67c). It is done.
In the present invention, the floating base is divided into a first floating base and a second floating base. As a result, a measurement terminal corresponding to the IC to be measured is attached to the socket base and the second floating base is made such that the IC can be inserted, so that measurement is performed using the common socket base and the first floating base. be able to.

In the above IC socket, the second floating pedestal (62) includes a plurality of divided floating pedestals (62a, 62b, 62c, 62d) movable in a direction parallel to the upper surface of the first floating pedestal (61). Also good. In that case, each of the plurality of divided floating pedestals (62a, 62b, 62c, 62d) constitutes a part of the edge of the insertion region (69). The size of the area of the insertion region can be changed by moving (62a, 62b, 62c, 62d) of the divided second floating base in a predetermined direction.
In the present invention, the area of the insertion region can be changed by moving (changing) the plurality of divided floating pedestals. As a result, even for ICs of different sizes, measurement can be performed using the common socket base, the first floating base, and the second floating base without changing the second floating base.

  According to the present invention, the IC socket can be used without being affected by the package size of the IC to be measured and the number of solder balls (input / output pins), and the development cost and development period of the IC socket in the development of the IC can be suppressed. Can be obtained.

  Hereinafter, embodiments of the IC socket of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
First, the configuration of the first embodiment of the IC socket of the present invention will be described. FIG. 3 is a schematic cross-sectional view showing the configuration of the first embodiment of the IC socket of the present invention. This figure shows the case where the IC 6 to be measured is small. The IC socket 1 includes a socket base frame 16, a socket base 13, a first floating base 11, a second floating base 12, an alignment member 14, a floating spring 15, and a probe pin 4.
It comprises.

  The socket base frame 16 is a frame that surrounds the socket base 13, the first floating base 11, and the second floating base 12. The socket pedestal frame 16 holds the socket pedestal 13 fixedly at the lower part (bottom side), and movably holds the first floating pedestal 11 and the second floating pedestal 12 at the upper part of the socket pedestal 13.

  The socket pedestal 13 has a rectangular plate shape, and has a plurality of first holes 17c (through holes) in a first region which is a rectangular region at the center thereof. The first region has a size corresponding to the package size of the largest IC 6 to be measured. The pitch of the plurality of first holes 17c has an interval corresponding to the pitch of the solder balls 9 (input / output pins) of the IC 6 to be measured. The plurality of first holes 17c are detachably attachable to the probe pins 4 as measurement terminals used when measuring the electrical characteristics of the IC 6. The probe pin 4 is attached at a position (number) corresponding to the solder ball 9 (input / output pin) of the IC 6 to be measured.

  The alignment member 14 is fixed to a predetermined location on the upper surface of the socket base 13 so as to extend vertically from the upper surface. The alignment member 14 is fixed so that the first floating base 11 and the second floating base 12 cannot move in a direction parallel to the upper surface of the socket base 13 and can move in a direction perpendicular to the upper surface. is doing.

  The floating spring 15 is fixed to a predetermined location on the upper surface of the socket base 13 so as to extend vertically from the upper surface. The floating spring 15 holds the first floating pedestal 11 with respect to the socket pedestal 13 by its elastic force so that it can move up and down within a predetermined range.

  The first floating base 11 is provided above the socket base 13 so as to be movable up and down. The first floating pedestal 11 has a rectangular shape, and has a plurality of second holes 17a (through holes) corresponding to the plurality of first holes 17c in a second region substantially equal to the first region above the first region. Have When measuring the electrical characteristics of the IC 6, the plurality of second holes 17 a are inserted with the probe pins 4 from below when the first floating base 11 is lowered toward the socket base 13. The thickness of the first floating base 11 is Lh1.

  The plurality of second holes 17 a have a taper 18 a at an end portion on the upper surface side (the second floating pedestal 12 side) of the first floating pedestal 11. When measuring the electrical characteristics of the IC 6, the plurality of substantially spherical solder balls 9 fit into the drop of the taper 18 a. Thereby, alignment with respect to several 2nd hole 17a of IC6 can be performed more easily.

  The second floating base 12 is detachably provided above the first floating base 11. The second floating pedestal 12 has a rectangular shape, and has an insertion region 19 (through hole) into which the IC 6 to be measured can be inserted in a third region having a size equal to or smaller than the second region above the second region. The insertion region 19 has a taper 18 b that assists the alignment of the IC 6 at the end on the upper surface side of the second floating pedestal 12. The thickness of the second floating base 12 is Lh2.

  The insertion region 19 is formed to have a size corresponding to the package size of the IC 6 to be measured. By preparing the second floating base 12 suitable for the size of the package of the IC 6 to be measured, the electrical characteristics of the IC 6 can be measured using the common socket base 13 and the first floating base 11. That is, even if the IC 6 to be measured changes, the common socket base 13 and the first floating base 11 can be used, so that the cost and time for designing and manufacturing the IC socket 1 can be reduced.

  The shape of the insertion region of the second floating base is shown here as a square, but is not limited to this shape. That is, the present invention can be applied to any IC having a smaller package size than the first region of the socket base 13 regardless of its shape. The shape of the insertion region of the second floating pedestal can be designed based on, for example, an IC standard.

  The second floating pedestal 12 can be removed by removing the socket pedestal frame 16 from the socket pedestal 13 and then withdrawing it from the alignment member 14. Thereafter, by inserting another second floating pedestal 12 into the alignment member 14 and attaching the socket pedestal frame 16 to the socket pedestal 13, the IC socket 1 suitable for the size of the package of the IC 6 to be measured can be obtained.

  The IC 6 to be measured is pressed against the insertion area 19 of the IC socket 1 by the lid 2 with a predetermined load. The lid 2 includes a Z-direction adjusting unit 21, a device pressing member 22, and a lid frame 23.

  The lid frame 23 movably holds the Z-direction adjusting unit 21 and the device pressing member 22. The Z direction adjusting unit 21 sets the position of the device pressing unit 22 in the Z direction. The device pressing member 22 protrudes from the lower part of the lid frame 23 by the length set by the Z-direction adjusting unit 21. The pressing surface that applies a load to the IC 6 in the device pressing member 22 has a size that is approximately the same as or larger than that of the second region.

  Since the pressing surface of the device pressing member 22 has a size equal to or larger than the second region, the same lid 2 can be used even if the IC 6 to be measured is changed and the second floating base 12 is changed. Thereby, even if IC6 of a measuring object changes, the cost and time concerning the design and manufacture of the lid | cover 2 can be reduced.

  FIG. 4 is a view of the IC socket 1 in FIG. 3 as viewed from above. The second floating pedestal 12 is fixed by an alignment member 14 at its end. The second floating pedestal 12 has an insertion region 19 opened as a through hole in a central region thereof, and a taper 18b is provided on the upper surface side thereof. Here, this 2nd floating base 12 has illustrated what is used with respect to the case where IC6 of measurement object has the solder ball 9 (input / output pin) number 5x5. That is, the insertion region 19 is opened so that 5 × 5 ICs 6 corresponding to the number of solder balls 9 (input / output pins) can be inserted.

  The first floating pedestal 11 is below the second floating pedestal 12 and is similarly fixed at the end thereof by an alignment member 14. The first floating base 11 is provided with a plurality of second holes 17a, and a taper 18a is provided on the upper surface side thereof. The first floating pedestal 11 exemplifies the one used for the case where the maximum package size assumed as the IC 6 to be measured is 13 × 13 solder balls 9 (input / output pins).

A method for measuring IC 6 using IC socket 1 and lid 2 in the case of FIGS. 3 and 4 will be described.
The second floating pedestal 12 of the IC socket 1 has been changed in advance to one having an appropriate insertion area 19 based on the package size of the IC 6 to be measured (corresponding to the number of solder balls 9 and the like). The IC 6 is inserted into the insertion area 19 of the second floating base 12 by a predetermined device or the like. The length Dh1 of one side of the insertion region 19 having a square cross section perpendicular to the Z axis is substantially equal to the length Dc1 of one side of the IC 6 that is also square (where Dh1> Dc1). Therefore, in order to perform the insertion operation, it is necessary to bring the IC 6 to an accurate position on the insertion area 19. However, since the taper 18a for the solder ball 9 is provided in the second hole 17a in addition to the taper 18b at the entrance portion of the insertion region 19, the IC 6 can be easily inserted and positioned. As a result, the solder ball 9 of the IC 6 fits in the taper 18a of the opening on the upper side of the second hole 17a. The lower surface of the second floating pedestal 12 is in contact with the upper surface of the first floating pedestal 11, but the first floating pedestal 11 is lifted from the socket pedestal 13 by a predetermined distance Lh3.

  Thereafter, the IC 6 is pressed against the opening of the second hole 17 a of the first floating base 11 by the device pressing member 22 as the lower surface of the lid frame 23 is pressed against the upper surface of the socket base frame 16. Here, the length Dp1 of one side of the device pressing member 22 having a square cross section perpendicular to the Z-axis is sufficiently larger than the length Dc1 of one side of the IC 6. As a result, the entire upper surface of the IC 6 is pressed evenly, so that the IC 6 is not damaged due to an uneven force. Further, since the second floating pedestal 12 is thin, the IC 6 can be pushed by the device pressing member 22 at the initial stage of pressing.

  Here, when the length of the lid 2 to the lower surface of the device pressing member 22 is LD, the height of the IC 6 is H0, and the distance to the first floating base 11 with respect to the upper surface portion of the socket base 13 is Lh3, LD + Z LD, Lh3, and H0 are set so that the working distance of the direction adjusting unit 21 >> Lh3 + H0, and the Z direction adjusting unit 21 of the lid 2 can be adjusted in the Z direction. Thereby, the lower surface of the device pressing member 22 can press the IC 6 from the upper surface to the bottom of the insertion region 19.

The IC 6 can contact (connect) the probe pin 4 inserted into the second hole 17 c of the socket base 13 through the solder ball 9 by the device pressing member 22 and the Z-direction adjusting unit 21. When the solder balls 9 come into contact with the probe pins 4, the electrical characteristics of the IC 6 can be measured. The probe pin 4 is guaranteed to be electrically contacted by applying an appropriate load from the object to be measured. If the appropriate load is g, g is established as g = f ₂ (Lh1 + Lh2-Lh3-H0). To do. Here, f ₂ (x) is a function of x.

  Here, assuming that H0 and Lh2 are constant and Lh3 is set to the maximum load by the lid 22 and the distance is reduced to 0, the load or pressing force applied to the probe pin 4 is determined by the thickness Lh1 of the second floating pedestal 12. Will be.

  Next, a case where the measurement target IC 6 is large will be described. FIG. 5 is a schematic sectional view showing another configuration of the first embodiment of the IC socket of the present invention. FIG. 6 is an enlarged view of the vicinity of the portion V in FIG. This figure is different from the case of FIG. 3 in that the second floating base 12a having a large insertion area 19a is used corresponding to the large IC 6a. The thickness of the second floating base 12a is Lh1a. The length Dh2 of one side of the insertion region 19a having a square cross section perpendicular to the Z axis is substantially equal to the length Dc2 of one side of the IC 6a that is also square (where Dh2> Dc2). Here, the IC 6a means the maximum package size as a measurement object in the example of the IC socket of the present invention. Accordingly, the probe pins 4 corresponding to the solder balls 9a are inserted into all of the first holes 17c prepared in the socket base 13.

  FIG. 7 is a view of the IC socket 1 in FIG. 5 as viewed from above. The insertion area 19a of the second floating pedestal 12a can insert the maximum package size as a measurement target. In this example, the IC 6a to be measured is used when the number of solder balls 9a (input / output pins) is 13 × 13. In other words, the insertion region 19a is opened so that ICs 6a corresponding to 13 × 13 solder balls 9a (input / output pins) can be inserted.

A method for measuring the IC 6a using the IC socket 1 and the lid 2 in the case of FIGS.
The second floating pedestal 12a of the IC socket 1 is changed in advance to one having an appropriate insertion region 19a based on the package size of the IC 6a to be measured. The probe pins 4 are inserted into all the first holes 17c of the socket base 13. However, the other members can be the same as those shown in FIGS.

  The IC 6a is inserted into the insertion area 19a of the second floating base 12a by a predetermined device or the like. The length Dh2 of one side of the insertion region 19a is substantially equal to the length Dc2 of one side of the IC 6a (where Dh2> Dc2). Since the taper 18b and the taper 18a are provided in the second hole 17a, the IC 6a can be easily inserted and positioned. As a result, the solder ball 9a of the IC 6a fits in the taper 18a of the opening on the upper side of the second hole 17a.

  Thereafter, the IC 6 a is pressed against the opening of the second hole 17 a of the first floating base 11 by the device pressing member 22 as the lower surface of the lid frame 23 is pressed against the upper surface of the socket base frame 16. Here, the length Dp1 of one side of the device pressing member 22 is greater than or equal to the length Dc2 of one side of the IC 6a. Therefore, the same lid 2 as in FIGS. 3 and 4 can be used. That is, even if the IC 6a to be measured is changed, the cost and time required for designing and manufacturing the lid 2 can be reduced.

  Also in this case, as shown in FIGS. 5 and 6, the length of the lid 2 up to the lower surface of the device pressing member 22 is LD, the height of the IC 6a is H0, and the first floating portion is based on the upper surface portion of the socket base 13. Assuming that the distance to the base 11 is Lh3, LD, Lh3, and H0 are set so that the working distance of the LD + Z direction adjusting unit 21 >> Lh3 + H0, and the Z direction adjusting unit 21 of the lid 2 can adjust the Z direction. It becomes possible. Thereby, the lower surface of the device pressing member 22 can press the IC 6a from the upper surface to the bottom of the insertion region 19a.

The IC 6a can contact (connect) the probe pin 4 inserted into the second hole 17c of the socket base 13 through the solder ball 9a by the device pressing member 22 and the Z-direction adjusting unit 21. When the solder balls 9a come into contact with the probe pins 4, the electrical characteristics of the IC 6a can be measured. The probe pin 4 is guaranteed to be electrically contacted by applying an appropriate load from the object to be measured. When the appropriate load is g, g is established as g = f ₂ (Lh1a + Lh2-Lh3-H0). To do.

  Here, assuming that H0 and Lh2 are constant, and the maximum load by the lid 22 is Lh3 and the distance becomes 0 due to sinking, the load or pressing force applied to the probe pin 4 is determined by the thickness Lh1a of the second floating pedestal 12a. Will be. That is, the difference between the case where the IC6 in FIG. 3 is a small package and the case where the IC6a is large in FIG. 5 is the thickness Lh1 (Lh1a) of the second floating base 12 (12a).

  As described above, in the present invention, the floating pedestal of the IC socket is divided into the first floating pedestal and the second floating pedestal. That is, the probe pin is separated into a first floating pedestal that protrudes from below and a second floating pedestal that aligns and holds the IC. Thereby, in the socket pedestal and the first floating pedestal, holes can be formed in an area equal to or larger than the IC package size at the same interval as the ball pitch. Accordingly, if the IC has the same ball pitch, the same socket base and first floating base can be used even if the IC package size is changed by using the second floating base with the insertion area changed.

  In the present invention, a taper is provided at the entrance portion of the hole through which the probe pin passes in the first floating base. Thereby, a solder ball can be stably stored in the entrance part of a hole. The structure of the first floating pedestal makes it possible to align and hold the IC more easily and accurately. In addition, since the first floating base is responsible for the positioning and holding of the solder balls, the second floating base only needs to indicate the external position of the IC. 2 The thickness of the floating pedestal could be reduced, and it could have a function as a pressurizing adjustment material. Therefore, the depth in the Z direction of the floating pedestal 111 in FIG. 1 for aligning the package is not required, and the pressing member is adjusted to the size of the maximum IC package size assumed as a measurement target. Can do. That is, the same pressing member (lid) can be used even if the IC package size changes. However, when the IC package size is changed, the number of solder balls is also changed, and the number of probe pins corresponding to the solder balls is also changed. However, since the appropriate load applied to the probe pin cannot be changed to obtain electrical contact, the pressure for pressing the package with the device pressing member is changed. For this reason, the device is pressed by making the second floating pedestal thinner as the IC area becomes larger and pressing the device with the device pressing member until the upper surface of the second floating pedestal and the upper surface of the package are the same height. The pressure pushed by the member is adjusted.

  In the above embodiment, the device pressing member 22 of the lid 2 has the same size regardless of the package size of the IC to be measured. However, the device pressing member 22 of the lid 2 can be changed in accordance with the size of the IC 6 (package size) to be measured. FIG. 7 shows an IC socket in such a case.

  FIG. 8 is a schematic sectional view showing another configuration of the IC socket according to the first embodiment of the present invention. The point that the thickness of the second floating base 12b is thick and the shape of the device pressing member 22b are different from the case of FIG. This effect has an effect that when an IC is mounted on a socket by using an automatic transfer machine during mass production, the distance in which the package naturally falls due to the deep Z direction is increased, and the positional deviation is less likely to occur. Moreover, since the shape of the device pressing member 22 is convex, a surface that comes into contact with the upper surface of the second floating pedestal 12b is generated, and the load applied to the probe pin 4 can be adjusted by the thickness of the second floating pedestal. .

  Also in this case, the same effect as in the case of FIGS. 3 to 7 can be obtained.

(Second Embodiment)
The configuration of the second embodiment of the IC socket of the present invention will be described. FIG. 9 is a schematic cross-sectional view showing the configuration of the second embodiment of the IC socket of the present invention. This figure shows a case where the IC 56 to be measured is small. The IC socket 51 includes a socket base frame 66, a socket base 63, a first floating base 61, a second floating base 62, an alignment member 64, a floating spring 65, and a probe pin 54.
It comprises.

  The present embodiment is different from the first embodiment in that the second floating pedestal 62 is divided into a plurality of parts and is movably provided. Thereby, even if the size of the IC 56 (package size) to be measured is changed, the electrical characteristics can be measured using the same IC socket 51.

  The socket base frame 66 is a frame that surrounds the socket base 63, the first floating base 61, and the second floating base 62. The socket pedestal frame 66 holds the socket pedestal 63 fixedly at the lower part thereof, and movably holds the first floating pedestal 61 and the second floating pedestal 62 at the upper part of the socket pedestal 63.

  The socket pedestal 63 has a rectangular plate shape, and has a plurality of first holes 67c (through holes) in a first region which is a rectangular region at the center thereof. The first region has a size corresponding to the package size of the largest IC 56 to be measured. The pitch of the plurality of first holes 67c has an interval corresponding to the pitch of the solder balls 59 (input / output pins) of the IC 56 to be measured. The plurality of first holes 67c are detachably attachable to the probe pins 54 as measurement terminals used when measuring the electrical characteristics of the IC 56. The probe pin 54 is attached at a position (number) corresponding to the solder ball 59 of the IC 56 to be measured.

  The alignment member 64 is fixed to a predetermined location on the upper surface of the socket base 63 so as to extend vertically from the upper surface. The alignment member 64 fixes the first floating base 61 so that the first floating base 61 cannot move in a direction parallel to the upper surface of the socket base 63 and can move in a direction perpendicular to the upper surface.

  The floating spring 65 is fixed to a predetermined location on the upper surface of the socket base 63 so as to extend vertically from the upper surface. The floating spring 65 holds the first floating base 61 with respect to the socket base 63 so as to be movable up and down within a predetermined range by its elastic force.

  The first floating base 61 is provided above the socket base 63 so as to be movable up and down. The first floating pedestal 61 has a rectangular shape, and has a plurality of second holes 67a (through holes) corresponding to the plurality of first holes 67c in a second region substantially equal to the first region above the first region. Have When measuring the electrical characteristics of the IC 56, the plurality of second holes 67 a are inserted with the probe pins 54 from below when the first floating base 61 descends toward the socket base 63.

  The plurality of second holes 67 a have a taper 68 a at an end portion on the upper surface side (the second floating pedestal 62 side) of the first floating pedestal 61. When measuring the electrical characteristics of the IC 56, the plurality of substantially spherical solder balls 59 are fitted into the drop of the taper 68a. Thereby, alignment with respect to several 2nd hole 67a of IC56 can be performed more easily.

  The first floating pedestal 61 further has fixing holes 81 and 82 into which a fixing member 58 for fixing the second floating pedestal 62 is inserted. The fixing holes 81 and 82 are provided along the direction in which the second floating base 62 moves outside the second region. In addition, although there are two fixing holes here, you may have many more fixing holes. Thereby, the 2nd floating base 12 can be fixed in each of a plurality of positions.

  The second floating pedestal 62 includes a plurality of divided floating pedestals 62a, 62b, 62c, and 62d. The divided floating pedestals 62 a to 62 d are movable on the upper surface of the first floating pedestal 61 so as to slide along the upper surface of the first floating pedestal 61. The movement is performed along a groove provided on the upper surface of the first floating base 61 (not shown in the figure). The divided floating bases 62 a to 62 d are fixed by inserting the fixing member 58 into the fixing hole 81 or the fixing hole 82.

  At this time, each of the divided floating pedestals 62a to 62d preferably moves in a radial direction with respect to the approximate center of the second region. This makes it possible to efficiently form a desired rectangular insertion region 69 used for the IC 56 having a similar shape. Furthermore, each of the plurality of divided floating pedestals 62a to 62d is preferably movable so that the insertion region 69 is a square. This is because the cross section perpendicular to the Z-axis direction of the IC 56 is often square.

  Each of the divided floating pedestals 62a to 62d has a shape obtained by dividing the second floating pedestal 12 in the first embodiment into four parts. An insertion region 69 into which the IC 56 to be measured can be inserted is formed in a third region surrounded by the four divided floating bases 62a to 62d. Each of the divided floating pedestals 62a to 62d has a taper 68b that assists the alignment of the IC 56 at the end of the upper surface on the side forming the third region.

  The insertion region 69 is formed to have a size corresponding to the package size of the IC 56 to be measured. By moving each of the divided floating pedestals 62a to 62d so as to be suitable for the size of the package of the IC 56 to be measured, the electrical power of the IC 56 is obtained using the common socket pedestal 63, the first floating pedestal 61, and the second floating pedestal 62. Measurement of mechanical characteristics. That is, even if the IC 56 to be measured changes, the common socket pedestal 63, the first floating pedestal 61, and the second floating pedestal 62 can be used, thereby reducing the cost and time required for designing and manufacturing the IC socket 51. it can.

  The IC 56 to be measured is pressed against the insertion area 69 of the IC socket 51 by the lid 52 with a predetermined load. The lid 52 includes a Z-direction adjusting unit 71, a device pressing member 72, and a lid frame 73. The Z direction adjusting unit 71, the device pressing member 72, and the lid frame 73 are the same as those in the first embodiment except that the device pressing member 72 is preferably changed according to the size of the IC 56 to be measured. 21, the device pressing member 22, and the lid frame 23.

  FIG. 10 is a view of the IC socket 51 in FIG. 9 as viewed from above. The second floating pedestal 62 is divided into divided floating pedestals 62a to 62d. The divided floating pedestal 62a is fixed to the fixing hole 58a by a fixing member 58a. The movement of the divided floating pedestal 62 a is performed along the groove 80 a of the first floating pedestal 61. Similarly, the divided floating pedestal 62b is fixed to the fixing hole 82b by the fixing member 58b. The movement of the divided floating pedestal 62 b is performed along the groove 80 b of the first floating pedestal 61. The split floating pedestal 62c is fixed to the fixing hole 82c by a fixing member 58c. The split floating pedestal 62 c is moved along the groove 80 c of the first floating pedestal 61. The divided floating pedestal 62d is fixed by a fixing hole 58d by a fixing member 58d. The movement of the divided floating pedestal 62d is performed along the groove 80d of the first floating pedestal 61. In this way, each of the divided floating pedestals 62a to 62d is moved in a radial direction with respect to the approximate center of the second region.

  The divided floating pedestals 62a to 62d have an insertion region 69 formed in a region surrounded by the divided floating pedestals 62a to 62d, and a taper 68b is provided on the upper surface side thereof. Here, the divided floating pedestals 62a to 62d exemplify those used when the IC 56 to be measured has 5 × 5 solder balls 59 (input / output pins). That is, the insertion area 69 is opened so that the ICs 56 corresponding to 5 × 5 solder balls 59 (input / output pins) can be inserted.

  The first floating pedestal 61 is below the second floating pedestal 62 and is similarly fixed at the end thereof by an alignment member 64. The first floating base 61 is provided with a plurality of second holes 67a, and a taper 68a is provided on the upper surface side thereof. The first floating pedestal 61 exemplifies the one used for the case where the maximum package size assumed as the IC 56 to be measured is 11 × 11 solder balls 59 (input / output pins).

A method for measuring the IC 56 using the IC socket 51 and the lid 52 in the case of FIGS. 9 and 10 will be described.
The split floating pedestals 62a to 62d of the IC socket 51 are moved so as to form an appropriate insertion region 69 based on the package size (corresponding to the number of solder balls 59) of the IC 56 to be measured. The IC 56 is inserted into the insertion region 69 formed by the divided floating bases 62a to 62d by a predetermined device or the like. The length Dh1 of one side of the insertion region 69 having a square cross section perpendicular to the Z axis is substantially equal to the length Dc1 of one side of the IC 56 that is also square (where Dh1> Dc1). Since the taper 68b and the taper 68a are provided in the second hole 67a, the IC 56 can be easily inserted and positioned. As a result, the solder ball 59 of the IC 56 fits in the taper 68a of the opening on the upper side of the second hole 67a. The lower surfaces of the divided floating pedestals 62a to 62d are in contact with the upper surface of the first floating pedestal 61, but the first floating pedestal 61 floats from the socket pedestal 63 by a predetermined distance Lh3.

  Thereafter, the IC 56 is pressed against the opening of the second hole 67 a of the first floating base 61 by the device pressing member 72 as the lower surface of the lid frame 73 is pressed against the upper surface of the socket base frame 66. Here, the length Dp1 of one side of the device pressing member 72 having a square cross section perpendicular to the Z-axis is substantially equal to the length Dc1 of one side of the IC 56. Therefore, almost the entire upper surface of the IC 56 is pressed evenly, so that the IC 56 is not damaged due to an uneven force.

  Here, the length of the lid 52 to the lower surface of the device pressing member 72 is LD, the height of the IC 56 not including the solder ball 59 is H1, the depth of the second floating pedestal 62 is Lh1, and the thickness of the first floating pedestal 61 is When Lh2 is Lh2 and the distance to the first floating pedestal 61 with reference to the upper surface portion of the socket pedestal 63 is Lh3, LD, Lh1, H1, Lh3 so that the working distance of the LD + Z direction adjusting unit 71 is greater than Lh1−H1 + Lh3. Is set, and the Z direction adjustment unit 71 of the lid 52 can be adjusted in the Z direction. Thereby, the lower surface of the device pressing member 72 can press the IC 56 from the upper surface to the second hole 67 a of the first floating base 61 in the insertion region 69 opened by the second floating base 62.

The IC 56 can be pushed down as long as the working distance of the LD + Z direction adjusting unit 71> Lh1−H1 + Lh3. Then, the probe pin 54 of the socket base 63 is inserted into the second hole 67a of the first floating base 61 by this operation in the Z-axis direction, and can come into contact with the solder ball 59. When the solder ball 59 contacts the probe pin 54, the electrical characteristics of the IC 56 can be measured. The probe pin 54 is electrically contacted by applying an appropriate load from the object to be measured. When the appropriate load is g, g is g = f ₃ (operating distance of the LD + Z direction adjusting unit 71−Lh1 + H0). -Lh3). Here, f ₃ (x) is a function of x. However, since a load cannot be applied to g more than appropriate, the distance Lh3 is set to be the upper limit of the load as a load limit.

  Here, if the device pressing member 72 is convex like the conventional example 122 in FIG. 1 and exists exclusively by the IC 56 (= if the LD of the device pressing member 72 can be designed exclusively), the protrusion side The surface excluding the protruding portion may contact the upper surface of the second floating pedestal 62, and the IC 56 may be pushed. That is, if the appropriate load g is applied to the probe pin 54 when the distance of Lh3 becomes 0, it is only necessary to design the LD so that LD = Lh1-H1.

  Next, a case where the measurement target IC 6 is large will be described. FIG. 11 is a block diagram showing another configuration of the IC socket according to the second embodiment of the present invention. FIG. 12 is an enlarged view near the portion W in FIG. This figure is different from the case of FIG. 9 in that the insertion area 69a is enlarged by moving the divided floating bases 62a to 62d in response to the large IC 56a. The length Dh2 of one side of the insertion region 69a having a square cross section perpendicular to the Z axis is substantially equal to the length Dc2 of one side of the IC 56a that is also square (where Dh2> Dc2). Here, the IC 56a has the largest package size as a measurement target. Accordingly, the probe pin 54 is inserted into the first hole 67c of the socket base 63 corresponding to the solder ball 59a.

  FIG. 13 is a view of the IC socket 51 in FIG. 11 as viewed from above. An insertion region 69a formed by the divided floating bases 62a to 62d can insert a package size larger than that in FIG. 9 as a measurement target. In this example, the IC 56a to be measured is used when the number of solder balls 59a (input / output pins) is 9 × 9. That is, the insertion area 69a is opened so that the ICs 56a corresponding to 9 × 9 solder balls 59a (input / output pins) can be inserted.

  As for the measurement method of the IC 56a using the IC socket 51 and the lid 52 in the case of FIGS. 11 to 13, except that the size (Dp2) of the device pressing member 72 is changed based on the package size of the IC 56a. And since it is the same as that of the case of FIG. 10, the description is abbreviate | omitted.

  Also in this case, the magnitude of the load with which the device pressing member 72 presses the IC 56a is determined by designing the LD1 so that LD1 = Lh1-H2.

  Also in the present embodiment, as in the first embodiment, the thickness of the second floating pedestal 62 (the divided floating pedestals 62a to 62d) is reduced, and the size (Dp1) of the device pressing member 72 is increased. It is also possible to make it common regardless of the package size of the IC.

  As described above, in the present invention, the floating pedestal of the IC socket is divided into the first floating pedestal and the second floating pedestal. That is, the probe pin is separated into a first floating pedestal that protrudes from below and a second floating pedestal that aligns and holds the IC. Thereby, in the socket pedestal and the first floating pedestal, holes can be formed in an area equal to or larger than the IC package size at the same interval as the ball pitch. As a result, if the IC has the same ball pitch, the same socket base and first floating base can be used even if the IC package size changes by simply changing the insertion area of the second floating base.

  In the present invention, a taper is provided at the entrance portion of the hole through which the probe pin passes in the first floating base. Thereby, a solder ball can be stably stored in the entrance part of a hole. The structure of the first floating pedestal makes it possible to align and hold the IC more easily and accurately. Further, by dividing the second floating pedestal and making it movable in a direction perpendicular to the Z-axis direction, the same second floating pedestal can be used even if the IC package size changes. Therefore, even if the IC package size changes, the same socket base, first floating base, and second floating base can be used.

FIG. 1 is a schematic cross-sectional view showing a configuration of a conventional IC socket. FIG. 2 is a plan view of the floating base 111 in FIG. FIG. 3 is a schematic cross-sectional view showing the configuration of the first embodiment of the IC socket of the present invention. FIG. 4 is a view of the IC socket 1 in FIG. 3 as viewed from above. FIG. 5 is a schematic sectional view showing another configuration of the first embodiment of the IC socket of the present invention. FIG. 6 is an enlarged view of the vicinity of the V portion in FIG. FIG. 7 is a view of the IC socket 1 in FIG. 5 as viewed from above. FIG. 8 is a schematic sectional view showing another configuration of the IC socket according to the first embodiment of the present invention. FIG. 9 is a schematic cross-sectional view showing the configuration of the second embodiment of the IC socket of the present invention. FIG. 10 is a view of the IC socket 51 in FIG. 8 as viewed from above. FIG. 11 is a block diagram showing another configuration of the IC socket according to the second embodiment of the present invention. FIG. 12 is an enlarged view of the vicinity of the W portion in FIG. FIG. 13 is a view of the IC socket 51 in FIG. 11 as viewed from above.

Explanation of symbols

1, 51, 101 IC socket 2, 52, 102 Lid 4, 54, 104 Probe pin 6, 6a, 56, 56a, 106 IC
9, 9a, 59, 59a, 109 Solder ball 11, 61 First floating base 12, 12a, 12b, 62 Second floating base 13, 63, 113 Socket base 14, 64, 114 Positioning member 15, 65, 115 Floating Spring 16, 66, 116 Socket base frame 17a, 67a, 117a Second hole 17c, 67c, 117c First hole 18, 18a, 18b, 68a, 68b, 118 Taper 19, 19a, 19b, 69, 69a, 119 Insertion Region 21, 71, 121 Z direction adjustment part 22, 72, 122 Device pressing member 23, 73, 123 Lid frame 58 Fixing member 80 (80a, 80b, 80c, 80d) Groove 81 (81a, 81b, 81c, 81d), 82 (82a, 82b, 82c, 82d) fixing hole 111 Floating base

Claims (10)

A plate-shaped socket base having a plurality of first holes to which the measurement terminals can be attached and detached;
A plate-like first floating pedestal held above the socket pedestal so as to be movable up and down and having a plurality of second holes corresponding to the plurality of first holes;
An insertion region that is provided above the first floating base and into which the IC can be inserted is formed so that a plurality of solder balls of the IC to be measured come into contact with a corresponding one of the plurality of second holes. A plate-like second floating pedestal,
The socket base is an IC socket in which the measurement terminal is attached to one corresponding to the plurality of solder balls among the plurality of first holes. The IC socket according to claim 1,
Each of the plurality of second holes has a taper at an end on the second floating pedestal side. In the IC socket according to claim 1 or 2,
The second floating pedestal is detachable and has a through-hole having approximately the same size as the IC as the insertion region. IC socket. In the IC socket according to any one of claims 1 to 3,
When the IC inserted into the insertion area is pressed against the first floating pedestal by a pressing member having a pressing surface larger than the third area, the pressing force is adjusted by the thickness of the second floating pedestal. IC socket. The IC socket according to claim 4,
An IC socket, wherein the pressing surface of the pressing member has a size larger than that of the second region. The IC socket according to any one of claims 1 to 5,
The insertion area is a substantially square IC socket. In the IC socket according to claim 1 or 2,
The second floating pedestal includes a plurality of divided floating pedestals movable in a direction parallel to the upper surface of the first floating pedestal,
Each of the plurality of divided floating pedestals constitutes a part of an edge of the insertion region. IC socket. The IC socket according to claim 7,
The number of the plurality of divided floating pedestals is four IC sockets. The IC socket according to claim 8,
Each of the plurality of divided floating pedestals is movable in a radial direction with respect to the center of the second region. IC socket. The IC socket according to claim 8,
Each of the plurality of divided floating pedestals is movable so that the insertion region is a square IC socket.

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