JP2017208149A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2017208149A JP2017208149A JP2016097870A JP2016097870A JP2017208149A JP 2017208149 A JP2017208149 A JP 2017208149A JP 2016097870 A JP2016097870 A JP 2016097870A JP 2016097870 A JP2016097870 A JP 2016097870A JP 2017208149 A JP2017208149 A JP 2017208149A
- Authority
- JP
- Japan
- Prior art keywords
- error correction
- correction code
- area
- semiconductor device
- spare
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000012937 correction Methods 0.000 claims abstract description 111
- 230000006870 function Effects 0.000 claims abstract description 27
- 239000000872 buffer Substances 0.000 abstract description 36
- 238000000034 method Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 7
- 238000013507 mapping Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000006386 memory function Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/08—Error detection or correction by redundancy in data representation, e.g. by using checking codes
- G06F11/10—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's
- G06F11/1008—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/38—Response verification devices
- G11C29/42—Response verification devices using error correcting codes [ECC] or parity check
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/08—Error detection or correction by redundancy in data representation, e.g. by using checking codes
- G06F11/10—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's
- G06F11/1008—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices
- G06F11/1068—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices in sector programmable memories, e.g. flash disk
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/08—Error detection or correction by redundancy in data representation, e.g. by using checking codes
- G06F11/10—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's
- G06F11/1008—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices
- G06F11/1048—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices using arrangements adapted for a specific error detection or correction feature
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/44—Indication or identification of errors, e.g. for repair
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C2029/0411—Online error correction
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/52—Protection of memory contents; Detection of errors in memory contents
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Read Only Memory (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
- Memory System (AREA)
- Detection And Correction Of Errors (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
Abstract
Description
本例の場合、ページバッファ/センス回路180は、セクタ0〜セクタ3の4つのセクタに分割されたレギュラー領域300と、スペア0、スペア1、スペア2、スペア3の4つのセクタに分割されたスペア領域310とを有する。レギュラー領域300の1つのセクタは、512バイトから構成され、スペア領域310の1つのセクタは、16バイトから構成される。
120:入出力バッファ 130:ECC回路
140:アドレスレジスタ 150:コンフィギュレーションレジスタ
160:コントローラ 170:ワード線選択回路
180:ページバッファ/センス回路 190:列選択回路
300:レギュラー領域 310:スペア領域
Claims (11)
- メモリアレイと、
前記メモリアレイに記憶するデータまたは前記メモリアレイから読み出されたデータの誤りを訂正する機能を備え、かつ誤り訂正のための生成した誤り訂正符号を格納領域に格納する機能を備えた誤り訂正手段と、
前記格納領域を外部から設定可能な設定手段と、
を有する半導体装置。 - 前記設定手段は、外部から前記格納領域を設定するためのアドレス情報を受け取り、当該アドレス情報に基づき前記格納領域を設定する、請求項1に記載の半導体装置。
- 前記アドレス情報は、前記誤り訂正符号を格納するための先頭アドレスと、前記誤り訂正符号のサイズとを含む、請求項1または2に記載の半導体装置。
- 前記設定手段は、外部からのコマンドに基づき前記格納領域を設定する、請求項1ないし3いずれか1つに記載の半導体装置。
- 前記設定手段は、不揮発性レジスタに前記アドレス情報を保持する、請求項2に記載の半導体装置。
- 半導体装置はさらに、前記設定手段に設定された情報を外部へ出力する出力手段を含む、請求項1ないし5いずれか1つに記載の半導体装置。
- 前記出力手段は、前記アドレス情報に含まれるサイズが、前記誤り訂正符号のサイズより小さいとき、警告情報を出力する、請求項6に記載の半導体装置。
- 前記出力手段は、前記アドレス情報に含まれる先頭アドレスの数が、連続してプログラムできる最大回数より大きいとき、警告情報を出力する、請求項6に記載の半導体装置。
- 前記メモリアレイは、レギュラー領域とスペア領域とを含み、前記スペア領域が前記格納領域を含む、請求項1に記載の半導体装置。
- 請求項1ないし9いずれか1つに記載の半導体装置と、
前記半導体装置と接続された外部コントローラとを含み、
前記外部コントローラは、前記格納領域を設定するためのアドレス情報を前記半導体装置へ出力する、システム。 - 外部コントローラは、前記設定手段に設定された情報を受け取り、当該受け取られた情報に基づき前記アドレス情報を出力する、請求項10に記載のシステム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016097870A JP6258399B2 (ja) | 2016-05-16 | 2016-05-16 | 半導体装置 |
TW106113864A TWI637395B (zh) | 2016-05-16 | 2017-04-26 | 半導體儲存裝置及其記憶體系統 |
KR1020170059400A KR101950758B1 (ko) | 2016-05-16 | 2017-05-12 | 반도체 장치 |
US15/594,670 US10496474B2 (en) | 2016-05-16 | 2017-05-15 | Semiconductor storage device and memory system having the same |
CN201710339908.9A CN107402836B (zh) | 2016-05-16 | 2017-05-15 | 半导体存储装置及其存储器系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016097870A JP6258399B2 (ja) | 2016-05-16 | 2016-05-16 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017208149A true JP2017208149A (ja) | 2017-11-24 |
JP6258399B2 JP6258399B2 (ja) | 2018-01-10 |
Family
ID=60297542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016097870A Active JP6258399B2 (ja) | 2016-05-16 | 2016-05-16 | 半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10496474B2 (ja) |
JP (1) | JP6258399B2 (ja) |
KR (1) | KR101950758B1 (ja) |
CN (1) | CN107402836B (ja) |
TW (1) | TWI637395B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022137391A (ja) * | 2021-03-09 | 2022-09-22 | ウィンボンド エレクトロニクス コーポレーション | 半導体記憶装置および誤り検出訂正方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI659308B (zh) * | 2017-12-08 | 2019-05-11 | 旺宏電子股份有限公司 | 記憶體裝置及其操作方法 |
CN111026675B (zh) * | 2019-12-06 | 2022-02-15 | 华中科技大学 | 一种高效的闪存数据刷新方法及基于闪存的固态硬盘 |
CN113495674B (zh) | 2020-04-01 | 2023-10-10 | 长鑫存储技术有限公司 | 读写方法及存储器装置 |
EP3964941B1 (en) | 2020-04-01 | 2024-02-28 | Changxin Memory Technologies, Inc. | Read-write method and memory device |
EP3964940A4 (en) | 2020-04-01 | 2022-08-17 | Changxin Memory Technologies, Inc. | READ/WRITE METHOD AND STORAGE DEVICE |
CN113495671B (zh) | 2020-04-01 | 2023-10-17 | 长鑫存储技术有限公司 | 读写方法及存储器装置 |
EP3936996A4 (en) | 2020-04-01 | 2022-07-06 | Changxin Memory Technologies, Inc. | READ-WRITE METHOD AND STORAGE DEVICE |
EP3985494B1 (en) | 2020-04-01 | 2024-01-17 | Changxin Memory Technologies, Inc. | Read-write method and memory device |
CN113495675B (zh) | 2020-04-01 | 2023-08-11 | 长鑫存储技术有限公司 | 读写方法及存储器装置 |
CN113495672B (zh) | 2020-04-01 | 2023-08-11 | 长鑫存储技术有限公司 | 读写方法及存储器装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004280790A (ja) * | 2003-02-28 | 2004-10-07 | Toshiba Microelectronics Corp | Ecc制御装置 |
JP2014522075A (ja) * | 2011-08-12 | 2014-08-28 | マイクロン テクノロジー, インク. | メモリデバイスおよびメモリデバイスのための構成方法 |
JP2015056184A (ja) * | 2013-09-12 | 2015-03-23 | シーゲイト テクノロジー エルエルシー | メモリにおけるデータの管理のための方法および装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8135935B2 (en) * | 2007-03-20 | 2012-03-13 | Advanced Micro Devices, Inc. | ECC implementation in non-ECC components |
KR101403429B1 (ko) * | 2007-10-09 | 2014-06-03 | 삼성전자주식회사 | 멀티 비트 프로그래밍 장치 및 방법 |
JP2010152989A (ja) | 2008-12-25 | 2010-07-08 | Toshiba Corp | 不揮発性半導体記憶装置 |
US8555141B2 (en) * | 2009-06-04 | 2013-10-08 | Lsi Corporation | Flash memory organization |
US20110041039A1 (en) * | 2009-08-11 | 2011-02-17 | Eliyahou Harari | Controller and Method for Interfacing Between a Host Controller in a Host and a Flash Memory Device |
US9727414B2 (en) * | 2010-12-01 | 2017-08-08 | Seagate Technology Llc | Fractional redundant array of silicon independent elements |
US8560922B2 (en) * | 2011-03-04 | 2013-10-15 | International Business Machines Corporation | Bad block management for flash memory |
US8719646B2 (en) * | 2012-04-30 | 2014-05-06 | Freescale Semiconductor, Inc. | Non-volatile memory (NVM) reset sequence with built-in read check |
US9122626B2 (en) * | 2013-05-13 | 2015-09-01 | Seagate Technology Llc | Linearly related threshold voltage offsets |
JP6131207B2 (ja) * | 2014-03-14 | 2017-05-17 | ウィンボンド エレクトロニクス コーポレーション | 半導体記憶装置 |
CN104951405B (zh) * | 2014-03-28 | 2019-09-06 | 三星电子株式会社 | 存储系统以及对存储系统执行和验证写保护的方法 |
US9984007B2 (en) * | 2014-03-28 | 2018-05-29 | Samsung Electronics Co., Ltd. | Storage system and method for performing and authenticating write-protection thereof |
-
2016
- 2016-05-16 JP JP2016097870A patent/JP6258399B2/ja active Active
-
2017
- 2017-04-26 TW TW106113864A patent/TWI637395B/zh active
- 2017-05-12 KR KR1020170059400A patent/KR101950758B1/ko active IP Right Grant
- 2017-05-15 CN CN201710339908.9A patent/CN107402836B/zh active Active
- 2017-05-15 US US15/594,670 patent/US10496474B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004280790A (ja) * | 2003-02-28 | 2004-10-07 | Toshiba Microelectronics Corp | Ecc制御装置 |
JP2014522075A (ja) * | 2011-08-12 | 2014-08-28 | マイクロン テクノロジー, インク. | メモリデバイスおよびメモリデバイスのための構成方法 |
JP2015056184A (ja) * | 2013-09-12 | 2015-03-23 | シーゲイト テクノロジー エルエルシー | メモリにおけるデータの管理のための方法および装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022137391A (ja) * | 2021-03-09 | 2022-09-22 | ウィンボンド エレクトロニクス コーポレーション | 半導体記憶装置および誤り検出訂正方法 |
US11755209B2 (en) | 2021-03-09 | 2023-09-12 | Winbond Electronics Corp. | Semiconductor memory device and error detection and correction method |
Also Published As
Publication number | Publication date |
---|---|
KR101950758B1 (ko) | 2019-02-21 |
KR20170129060A (ko) | 2017-11-24 |
US10496474B2 (en) | 2019-12-03 |
TW201742080A (zh) | 2017-12-01 |
US20170329670A1 (en) | 2017-11-16 |
JP6258399B2 (ja) | 2018-01-10 |
CN107402836A (zh) | 2017-11-28 |
CN107402836B (zh) | 2020-12-22 |
TWI637395B (zh) | 2018-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6258399B2 (ja) | 半導体装置 | |
US9230669B2 (en) | Memory system and method of operation thereof | |
US8125825B2 (en) | Memory system protected from errors due to read disturbance and reading method thereof | |
CN107403636B (zh) | 读取非易失性存储设备的方法 | |
JP6131207B2 (ja) | 半導体記憶装置 | |
US10395753B2 (en) | Semiconductor memory device and programming method thereof | |
US20130061113A1 (en) | Method of correcting errors and memory device using the same | |
US11409470B2 (en) | Memory system, memory controller, and method of operating memory system | |
JP2006302342A (ja) | 不揮発性半導体メモリ装置とメモリシステム | |
US9105346B2 (en) | Semiconductor device and method for operating the same | |
US11467903B2 (en) | Memory system and operating method thereof | |
KR101651573B1 (ko) | 반도체 기억장치 및 그 프로그래밍 방법 | |
CN112037837A (zh) | 存储器系统、存储器控制器和存储器设备 | |
US20230376211A1 (en) | Controller for controlling one-time programmable memory, system, and operation method thereof | |
US11544003B2 (en) | Memory system, memory controller, and method of operating memory system | |
US11507323B2 (en) | Memory device and operating method thereof | |
US11275524B2 (en) | Memory system, memory controller, and operation method of memory system | |
US20230075808A1 (en) | Memory system and operating method determining target status read check period in thermal throttling mode | |
JP5710815B1 (ja) | 半導体記憶装置 | |
TWI521530B (zh) | 半導體記憶裝置及其編程方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170823 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170927 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171205 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20171206 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6258399 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |