JP2017204543A - Printed Wiring Board - Google Patents
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- JP2017204543A JP2017204543A JP2016094915A JP2016094915A JP2017204543A JP 2017204543 A JP2017204543 A JP 2017204543A JP 2016094915 A JP2016094915 A JP 2016094915A JP 2016094915 A JP2016094915 A JP 2016094915A JP 2017204543 A JP2017204543 A JP 2017204543A
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Abstract
Description
本発明は、プリント配線板に関する。 The present invention relates to a printed wiring board.
電子機器の小型化及び高性能化に伴い、電子機器の中に搭載されるプリント配線板は、高多層化、薄物化、スルーホールの小径化、スルーホールの間隔の狭小化等による高密度化が進んでいる。さらに、携帯電話、モバイルコンピュータ等の携帯情報端末機器に搭載されるプリント配線板には、マイクロプロセッシングユニット（Micro Processing Unit：ＭＰＵ）をプリント配線板上に直接搭載するプラスチックパッケージ及び各種モジュール用のプリント配線板をはじめとして、大容量の情報を高速に処理することが求められている。そのため、信号処理の高速化、低伝送損失化、更なるダウンサイジング化が必要となってきており、プリント配線板はより一層の高密度化が進み、これまで以上の微細配線が要求されている。 Along with miniaturization and high performance of electronic devices, printed wiring boards mounted in electronic devices have higher density due to higher layers, thinner materials, smaller through-hole diameters, and narrower through-hole spacing. Is progressing. Furthermore, for printed wiring boards mounted on portable information terminal devices such as mobile phones and mobile computers, a plastic package in which a micro processing unit (MPU) is directly mounted on the printed wiring board and printed for various modules. There is a demand for processing high-capacity information at high speed, including wiring boards. Therefore, higher signal processing speed, lower transmission loss, and further downsizing are required, and printed wiring boards are becoming increasingly denser, requiring finer wiring than ever before. .
上記のような事情に伴い、ＭＰＵを搭載するプリント配線板及びモジュール用プリント配線板には、これまで以上の接続信頼性を確保するために、耐熱性に優れた材料が要求されるようになってきた（例えば、特許文献１参照）。 Due to the circumstances as described above, a printed wiring board for mounting an MPU and a printed wiring board for a module are required to have a material having excellent heat resistance in order to ensure connection reliability higher than ever. (For example, see Patent Document 1).
また、近年の環境問題に対する急速な関心の高まりに伴い、プリント配線板の薄型化も進んでいる。しかし、基材が薄くなればなるほど、基材のそりの発生が問題となりやすく、基材の破れも起こりやすい。また、基材として用いるプリプレグ（ガラスクロス、炭素繊維のような繊維状補強材に、硬化剤などの添加物を混合したエポキシ樹脂などの熱硬化性樹脂を含浸させ、加熱又は乾燥して半硬化状態にした強化プラスチック成形材料をいう。）が薄くなると、樹脂量が少ない為、埋め込み性は以前より厳しくなっている。 In addition, with the recent rapid increase in interest in environmental problems, printed wiring boards are becoming thinner. However, the thinner the substrate, the more likely it is that the substrate is warped and the substrate is more likely to tear. Moreover, a prepreg used as a base material (impregnated with a thermosetting resin such as an epoxy resin in which an additive such as a curing agent is mixed with a fibrous reinforcing material such as glass cloth or carbon fiber, and is semi-cured by heating or drying. When it becomes thinner, the embedding is more severe than before because the amount of resin is small.
上記を鑑みて、本発明は、従来のプリント配線板よりもそりが小さく、埋め込み性が良く、かつ、破れが発生しにくいプリント配線板を提供することを目的とする。 In view of the above, an object of the present invention is to provide a printed wiring board that has a smaller warp than conventional printed wiring boards, has good embeddability, and is less likely to break.
本発明者らは、前記目的を達成するために鋭意研究を重ねた結果、以下の本発明を完成するに到った。 As a result of intensive studies to achieve the above object, the present inventors have completed the following present invention.
（１） 基材と、
前記基材のうち少なくとも所定範囲の基材の領域である基材部分領域の一方の表面に形成された金属製の複数の小円形パターンと、
前記基材部分領域の他方の表面に形成された金属製の複数の大円形パターンとを有し、
各大円形パターンは各小円形パターンより大きく、
前記基材部分領域の一方の表面に直交する平面視方向において、見かけ上、各小円形パターンの一部が各大円形パターンの一部に重なっている、プリント配線板。
(1) a base material;
A plurality of small circular patterns made of metal formed on one surface of a base material partial region that is a region of at least a predetermined range of the base material among the base materials,
A plurality of large circular patterns made of metal formed on the other surface of the base material partial region,
Each large circular pattern is larger than each small circular pattern,
A printed wiring board in which a part of each small circular pattern is overlapped with a part of each large circular pattern in a plan view direction orthogonal to one surface of the base material partial region.
（２） 前記基材部分領域は、前記基材の周囲の領域の全部又はその一部である、（１）に記載のプリント配線板。 (2) The printed wiring board according to (1), wherein the base material partial region is all or a part of a region around the base material.
（３） 前記平面視方向において、見かけ上、各大円形パターンの４つの部分は、それぞれ、前記複数の小円形パターンのうちの４つの小円形パターンの一部に重なっている、（１）又は（２）に記載のプリント配線板。 (3) In the planar view direction, apparently, the four parts of each large circular pattern respectively overlap a part of the four small circular patterns of the plurality of small circular patterns, (1) or The printed wiring board according to (2).
（４） 各大円形パターンの直径は、各小円形パターンの直径の１．２〜１．６倍である、（１）から（３）のいずれかに記載のプリント配線板。 (4) The printed wiring board according to any one of (1) to (3), wherein the diameter of each large circular pattern is 1.2 to 1.6 times the diameter of each small circular pattern.
（５） 前記平面視方向において、見かけ上、各大円形パターンの縁部と各小円形パターンの縁部とが交わる鋭角の角度が、３０°以上である、（１）から（４）のいずれかに記載のプリント配線板。 (5) Any one of (1) to (4), in which the acute angle at which the edge of each large circular pattern and the edge of each small circular pattern intersect is 30 ° or more in the planar view direction The printed wiring board according to crab.
本発明によれば、基材のそりが小さく、埋め込み性が良く、かつ、破れが発生しにくいプリント配線板を提供することができる。 According to the present invention, it is possible to provide a printed wiring board in which the warp of the base material is small, the embedding property is good, and the tearing hardly occurs.
図１から図３を参照して、本発明に係るプリント配線板１及びその製造方法を説明する。
図１に示すように、プリント配線板１は、基材２と、金属製の複数の小円形パターン４と、金属製の複数の大円形パターン６とを有する。
A printed wiring board 1 and a method for manufacturing the same according to the present invention will be described with reference to FIGS.
As shown in FIG. 1, the printed wiring board 1 includes a substrate 2, a plurality of metal small circular patterns 4, and a plurality of metal large circular patterns 6.
（基材）
基材２は、一方の表面３と他方の表面（裏面）５とを有する板状の基板であり、プリプレグの硬化物等の従来公知の絶縁材料が挙げられる。
図２に示すように、基材２は、基材２の周囲（所定幅の周囲）の領域（額縁状の領域）である基材周囲部分領域（基材部分領域）２Ａと、その中央の範囲の領域である基材中央部分領域２Ｂとを有する。
一方の表面３は、基材周囲部分領域２Ａの表面である周囲表面３ａと、基材中央部分領域２Ｂの表面であり、周囲表面３ａの内側である中央表面３ｂとを有する。
他方の表面５も、基材周囲部分領域２Ａの表面である周囲表面５ａと、基材中央部分領域２Ｂの表面であり、周囲表面５ａの内側である中央表面５ｂとを有する。
基材２の一方の表面３に直交する平面視方向Ｖ（基材周囲部分領域２Ａの一方の表面に直交する平面視方向、図１参照）において、見かけ上、周囲表面３ａと周囲表面５ａとは重なり、中央表面３ｂと中央表面５ｂとが重なる。
(Base material)
The base material 2 is a plate-like substrate having one surface 3 and the other surface (back surface) 5, and includes conventionally known insulating materials such as a cured product of prepreg.
As shown in FIG. 2, the base material 2 includes a base material peripheral part region (base part partial region) 2 </ b> A that is a region (frame-like region) around the base material 2 (peripheral width), and the center thereof. It has the base-material center part area | region 2B which is an area | region of the range.
One surface 3 includes a peripheral surface 3a that is a surface of the base material peripheral portion region 2A and a central surface 3b that is a surface of the base material central portion region 2B and is inside the peripheral surface 3a.
The other surface 5 also has a peripheral surface 5a that is a surface of the base material peripheral portion region 2A and a central surface 5b that is a surface of the base material central portion region 2B and is inside the peripheral surface 5a.
In a plan view direction V orthogonal to one surface 3 of the base material 2 (a plan view direction perpendicular to one surface of the base material peripheral portion region 2A, see FIG. 1), the peripheral surface 3a and the peripheral surface 5a apparently And the central surface 3b and the central surface 5b overlap.
（基材周囲部分領域（基材部分領域））
図１及び図２に示すように、基材周囲部分領域２Ａは、非パターン形成部分２ａと、小円形パターン形成部分２ｂと、重複円形パターン形成部分２ｃと、大円形パターン形成部分２ｄとを有する。
非パターン形成部分２ａは、平面視方向Ｖにおいて、見かけ上、後述する小円形パターン４及び大円形パターン６の両方ともが形成されていない部分である。
小円形パターン形成部分２ｂは、平面視方向Ｖにおいて、見かけ上、小円形パターン４のみが形成されている部分である。
重複円形パターン形成部分２ｃは、平面視方向Ｖにおいて、見かけ上、小円形パターン４及び大円形パターン６の両方ともが形成されている部分である。
大円形パターン形成部分２ｄは、平面視方向Ｖにおいて、見かけ上、大円形パターン６のみが形成されている部分である。
(Substrate surrounding area (base material area))
As shown in FIGS. 1 and 2, the base material surrounding portion region 2A includes a non-pattern forming portion 2a, a small circular pattern forming portion 2b, an overlapping circular pattern forming portion 2c, and a large circular pattern forming portion 2d. .
The non-pattern forming portion 2a is a portion in which both the small circular pattern 4 and the large circular pattern 6 to be described later are not formed in the plan view direction V.
The small circular pattern forming portion 2b is a portion where only the small circular pattern 4 is apparently formed in the plan view direction V.
The overlapping circular pattern forming portion 2 c is a portion where both the small circular pattern 4 and the large circular pattern 6 are apparently formed in the plan view direction V.
The large circular pattern forming portion 2d is a portion where only the large circular pattern 6 is apparently formed in the plan view direction V.
（円形パターン）
図２に示すように、複数の小円形パターン４は、周囲表面３ａに、縦横に整列した配列状に形成されている。複数の大円形パターン６は、周囲表面５ａに、縦横に整列した配列状に形成されている。
各大円形パターン６及び各小円形パターン４は、いずれも、円であるが、これに限定されず、円のアスペクト比（１つの円における長径と短径との比率）が、０．９〜１．０の範囲であればよく、好ましくは、０．９５〜１．０がよい。
各大円形パターン６は、各小円形パターン４より大きい。
各小円形パターン４は、表面３のうち、基材２の小円形パターン形成部分２ｂの表面と、４つの重複円形パターン形成部分２ｃの表面とに形成されている。
各大円形パターン６は、表面５のうち、基材２の大円形パターン形成部分２ｄの表面と、４つの重複円形パターン形成部分２ｃの表面とに形成されている。
したがって、平面視方向Ｖにおいて、見かけ上、各小円形パターン４の一部が各大円形パターン６の一部に重なっている。
(Circular pattern)
As shown in FIG. 2, the plurality of small circular patterns 4 are formed on the peripheral surface 3 a in an array aligned vertically and horizontally. The plurality of large circular patterns 6 are formed on the peripheral surface 5a in an array aligned vertically and horizontally.
Each of the large circular pattern 6 and each small circular pattern 4 is a circle, but is not limited to this, and the aspect ratio of the circle (ratio of major axis to minor axis in one circle) is 0.9 to It may be in the range of 1.0, preferably 0.95 to 1.0.
Each large circular pattern 6 is larger than each small circular pattern 4.
Each small circular pattern 4 is formed on the surface 3 on the surface of the small circular pattern forming portion 2b of the substrate 2 and on the surface of the four overlapping circular pattern forming portions 2c.
Each of the large circular patterns 6 is formed on the surface 5 on the surface of the large circular pattern forming portion 2d of the base material 2 and on the surfaces of the four overlapping circular pattern forming portions 2c.
Therefore, in the plan view direction V, a part of each small circular pattern 4 apparently overlaps a part of each large circular pattern 6.
図２に示すように、大円形パターン６の直径ｂは、小円形パターン４の直径ａの１．２〜１．６倍であることが好ましく、基材２のそりの発生防止の観点から、１．２５〜１．５５倍であることがより好ましく、１．３〜１．５倍であることが特に好ましい。
小円形パターン４の直径ａは、特に制限されないが、密度の観点から、０．５〜３．５ｍｍであることが好ましく、１〜３ｍｍであることがより好ましい。
大円形パターン６の直径ｂは、小円形パターン４の直径ａより大きければ、特に制限されないが、基材２のそりの発生防止の観点から、０．６〜５．３ｍｍであることが好ましく、１．３〜４．５ｍｍであることがより好ましい。
小円形パターン４及び大円形パターン６は、金属製の円形パターンであれば、特に限定されないが、安価で電気伝導率が高いという観点から、銅が好ましい。
As shown in FIG. 2, the diameter b of the large circular pattern 6 is preferably 1.2 to 1.6 times the diameter a of the small circular pattern 4. From the viewpoint of preventing warpage of the base material 2, The ratio is more preferably 1.25 to 1.55 times, and particularly preferably 1.3 to 1.5 times.
The diameter a of the small circular pattern 4 is not particularly limited, but is preferably 0.5 to 3.5 mm, and more preferably 1 to 3 mm from the viewpoint of density.
The diameter b of the large circular pattern 6 is not particularly limited as long as it is larger than the diameter a of the small circular pattern 4, but is preferably 0.6 to 5.3 mm from the viewpoint of preventing warpage of the base material 2, It is more preferable that it is 1.3-4.5 mm.
The small circular pattern 4 and the large circular pattern 6 are not particularly limited as long as they are metal circular patterns, but copper is preferable from the viewpoint of low cost and high electrical conductivity.
図３に示すように、平面視方向Ｖにおいて、各大円形パターン６の縁部（円周部）と各小円形パターン４の縁部（円周部）とが交わる交点Ｑにおける、大円形パターン６の縁部の接線６ｚと、小円形パターン４の縁部の接線４ｚとが為す角度のうち鋭角の角度ｄは、３０°以上であることが好ましく、４０°以上であることが好ましく、５０°以上であることが好ましい。 As shown in FIG. 3, in the plan view direction V, the large circular pattern at the intersection Q where the edge (circumferential part) of each large circular pattern 6 and the edge (circumferential part) of each small circular pattern 4 intersect. Among the angles formed by the tangent 6z of the edge 6 and the tangent 4z of the edge of the small circular pattern 4, the acute angle d is preferably 30 ° or more, preferably 40 ° or more, 50 It is preferable that it is more than °.
なお、プリント配線板１では、基材２は、基材周囲部分領域２Ａと基材中央部分領域２Ｂとで形成されたとして、説明したが、少なくとも基材周囲部分領域２Ａがあればよく、基材中央部分領域２Ｂが無くてもよい。
また、基材２は、基材部分領域として、額縁状に基材周囲部分領域２Ａがある（領域の全部）として説明したが、対向する両辺のみを基材部分領域としてもよい（領域の一部）し、隣接する２辺のみを基材部分領域としてもよい（領域の一部）。また、上述の基材部分領域は、中央部の一部も含まれていてもよい。
In the printed wiring board 1, the base material 2 has been described as being formed of the base material peripheral part region 2 </ b> A and the base material central part region 2 </ b> B. The material center partial region 2B may be omitted.
Moreover, although the base material 2 demonstrated as a base material partial area | region 2A of base material surrounding part area | regions in the frame shape (all the area | regions), it is good also considering only both the opposing sides as a base material partial area (one area | region) Part), and only two adjacent sides may be used as the base material partial region (part of the region). Moreover, a part of center part may be contained in the above-mentioned base material partial area | region.
また、プリント配線板１は、基材２の一方の表面３には、小円形パターン４しか形成せず、他方の表面５には、大円形パターン６しか形成していないとして説明したが、これに限定されず、例えば、基材２を３つのブロックに分け、第１のブロックでは、一方の表面３には、小円形パターン４しか形成せず、他方の表面５には、大円形パターン６しか形成せず、第２のブロックでは、一方の表面３には、大円形パターン６しか形成せず、他方の表面５には、小円形パターン４しか形成せず、第３のブロックでは、小円形パターン４及び大円形パターン６を形成しないようにした大小混載のプリント配線板としてもよい。
このとき、前記大小混載のプリント配線板の第１ブロックと第２ブロックとで、額縁状の領域を形成してもよい。
The printed wiring board 1 has been described as having only the small circular pattern 4 formed on one surface 3 of the substrate 2 and only the large circular pattern 6 formed on the other surface 5. For example, the base material 2 is divided into three blocks. In the first block, only the small circular pattern 4 is formed on one surface 3 and the large circular pattern 6 is formed on the other surface 5. In the second block, only the large circular pattern 6 is formed on one surface 3 and only the small circular pattern 4 is formed on the other surface 5 in the second block. A large and small printed wiring board in which the circular pattern 4 and the large circular pattern 6 are not formed may be used.
At this time, a frame-like region may be formed by the first block and the second block of the mixed printed wiring board.
また、各小円形パターン４は、表面３のうち、基材２の小円形パターン形成部分２ｂの表面と、４つの重複円形パターン形成部分２ｃの表面とに形成されているとして説明したが、これに限定されず、小円形パターン４が形成されている重複円形パターン形成部分２ｃの数は、１以上であればよく、好ましくは２から６であり、より好ましくは、３から５であり、さらに好ましくは、４である。 Moreover, although each small circular pattern 4 demonstrated as having been formed in the surface 3 on the surface of the small circular pattern formation part 2b of the base material 2, and the surface of the four overlapping circular pattern formation parts 2c among the surfaces 3, The number of overlapping circular pattern forming portions 2c on which the small circular patterns 4 are formed is not limited to 1, but may be 1 or more, preferably 2 to 6, more preferably 3 to 5, Preferably, 4.
プリント配線板１の大円形パターン６及び小円形パターン４は、金属箔貼り積層板の両面の金属をサブトラクト法（金属板の不要な部分を除去して必要な部分を残し導電部とする方法）などのプリント配線板の製造方法において公知の方法により加工することで得ることができる。 The large circular pattern 6 and the small circular pattern 4 of the printed wiring board 1 are obtained by subtracting the metal on both sides of the metal foil-laminated laminate (a method of removing unnecessary portions of the metal plates and leaving necessary portions to be conductive portions). It can obtain by processing by a well-known method in the manufacturing method of printed wiring boards.
金属箔貼り積層板としては、例えば、プリント配線板用として用いられる従来公知のものを使用できる。
金属箔貼り積層板は、例えば、目的とするプリント配線板１の厚みに合わせて、プリプレグを単層のままとする、又は、２枚以上積層し、その片面又は両面に金属箔を重ね、加熱加圧して製造することができる。
金属箔貼り積層板に使用する金属としては、主に、銅箔又はアルミ箔を用いるが、他の金属箔を用いてもよい。金属箔の厚みは、通常、２〜２００μｍであることが好ましい。
また、加熱加圧は、一般的な方法により行えばよく、例えば、多段プレス、多段真空プレス、連続成形、オートクレーブ成形機等を使用することが好ましい。加熱加圧は、好ましくは、温度１３０〜２３０℃、圧力０．５〜１０ＭＰａ、より好ましくは、温度１６０〜２１０℃、圧力１〜４ＭＰａの条件で０．１〜５時間行う。これらの条件は、プリプレグの特性、使用する熱硬化性樹脂の反応性、プレス機の能力、目標とする積層板の厚み等により適宜決定することが好ましい。
As the metal foil-clad laminate, for example, a conventionally known one used for printed wiring boards can be used.
The metal foil-clad laminate is, for example, left as a single layer of the prepreg according to the desired thickness of the printed wiring board 1, or laminated two or more sheets, and the metal foil is laminated on one or both sides and heated. It can be manufactured under pressure.
As a metal used for a metal foil-clad laminate, a copper foil or an aluminum foil is mainly used, but other metal foils may be used. The thickness of the metal foil is usually preferably 2 to 200 μm.
The heating and pressurization may be performed by a general method. For example, it is preferable to use a multistage press, a multistage vacuum press, continuous molding, an autoclave molding machine, or the like. The heating and pressurization is preferably performed at a temperature of 130 to 230 ° C. and a pressure of 0.5 to 10 MPa, more preferably at a temperature of 160 to 210 ° C. and a pressure of 1 to 4 MPa for 0.1 to 5 hours. These conditions are preferably determined as appropriate depending on the properties of the prepreg, the reactivity of the thermosetting resin used, the ability of the press, the target thickness of the laminate, and the like.
本発明のプリント配線板をプリプレグ、金属箔等と適宜組み合わせて積層、加工することで、多層配線板を得ることもできる。 A multilayer wiring board can also be obtained by laminating and processing the printed wiring board of the present invention in an appropriate combination with a prepreg, metal foil or the like.
以下、本発明を実施例に基づいて具体的に説明するが、本発明はこれに限定されるものではない。実施例及び比較例では、表面５に形成された円形パターンの直径ｂと表面３に形成された円形パターンの直径ａの比（直径比ｂ／ａ）、表面３及び表面５の円形パターンの重なり具合を種々変化させている積層板を作製した。 EXAMPLES Hereinafter, although this invention is demonstrated concretely based on an Example, this invention is not limited to this. In the examples and comparative examples, the ratio of the diameter b of the circular pattern formed on the surface 5 to the diameter a of the circular pattern formed on the surface 3 (diameter ratio b / a), and the overlap of the circular patterns of the surface 3 and the surface 5 Laminated plates having various conditions were produced.
（実施例１）
５００×５００ｍｍの銅張積層板（商品名「MCL-E-679FG」、日立化成株式会社製）の両面の周囲に、図２に示すパターン（小円形パターン４の直径ａが１ｍｍ、大円形パターン６の直径ｂが１．４ｍｍ、直径比（ｂ／ａ）が１．４）を形成したプリント配線板１を作製した。
次に、図４に示すように、プリプレグＰ（商品名「GEA-679FG」、日立化成株式会社製）と、金属箔Ｍ（導体、商品名「GTS」、古河電気工業株式会社製）を用いて、温度１８５℃、圧力３ＭＰａ、時間９０分の条件下で加熱加圧処理することにより、四層板を作製した。
Example 1
A pattern shown in FIG. 2 (diameter a of small circular pattern 4 is 1 mm, large circular pattern) around both sides of a 500 × 500 mm copper-clad laminate (trade name “MCL-E-679FG”, manufactured by Hitachi Chemical Co., Ltd.) The printed wiring board 1 in which the diameter b of No. 6 was 1.4 mm and the diameter ratio (b / a) was 1.4) was produced.
Next, as shown in FIG. 4, prepreg P (trade name “GEA-679FG”, manufactured by Hitachi Chemical Co., Ltd.) and metal foil M (conductor, trade name “GTS”, manufactured by Furukawa Electric Co., Ltd.) are used. Then, a four-layer plate was produced by heat and pressure treatment under conditions of a temperature of 185 ° C., a pressure of 3 MPa, and a time of 90 minutes.
（実施例２）
大円形パターン６の直径を１．３ｍｍにし、直径比（ｂ／ａ）を１．３に変更したこと以外は実施例１と同様の操作を行った。
(Example 2)
The same operation as in Example 1 was performed except that the diameter of the large circular pattern 6 was changed to 1.3 mm and the diameter ratio (b / a) was changed to 1.3.
（実施例３）
大円形パターン６の直径を１．５ｍｍにし、直径比（ｂ／ａ）を１．５に変更したこと以外は実施例１と同様の操作を行った。
(Example 3)
The same operation as in Example 1 was performed except that the diameter of the large circular pattern 6 was changed to 1.5 mm and the diameter ratio (b / a) was changed to 1.5.
（比較例１）
図５に示すように、実施例１で形成した表面３の小円形パターン４と同じパターン（円形パターン６ａ）を表面５に形成したプリント配線板を作製した。すなわち、直径比（円形パターン６ａの直径ｂ／小円形パターン４の直径ａ）は１であり、また、基材２の一方の表面３を見た場合において、表面３に形成された小円形パターン４は、表面５に形成された円形パターン６ａに重なっている。換言すると、基材周囲部分領域２Ａは、非パターン形成部分２ａと重複円形パターン形成部分２ｃとしかない。なお、加熱加圧処理は実施例１と同様の条件で行った。
(Comparative Example 1)
As shown in FIG. 5, a printed wiring board in which the same pattern (circular pattern 6 a) as the small circular pattern 4 on the surface 3 formed in Example 1 was formed on the surface 5 was produced. That is, the diameter ratio (diameter b of the circular pattern 6a / diameter a of the small circular pattern 4) is 1, and the small circular pattern formed on the surface 3 when one surface 3 of the substrate 2 is viewed. 4 overlaps the circular pattern 6 a formed on the surface 5. In other words, the base material surrounding part region 2A is only the non-pattern forming part 2a and the overlapping circular pattern forming part 2c. The heat and pressure treatment was performed under the same conditions as in Example 1.
（比較例２）
図２において、直径比（ｂ／ａ）を１に変更したこと以外は実施例１と同様の操作を行った。
(Comparative Example 2)
In FIG. 2, the same operation as in Example 1 was performed except that the diameter ratio (b / a) was changed to 1.
（比較例３）
実施例１で用いた銅張積層板（商品名「MCL-E-679FG」、日立化成株式会社）において、その両面の周囲にベタで銅を存在するプリント配線板（額縁状に銅が存在するプリント配線板）を用意した。該プリント配線基板を使用して、実施例１と同様に四層板を作製した。
(Comparative Example 3)
In the copper clad laminate used in Example 1 (trade name “MCL-E-679FG”, Hitachi Chemical Co., Ltd.), a printed wiring board having solid copper around both sides thereof (copper exists in a frame shape) A printed wiring board) was prepared. Using this printed wiring board, a four-layer board was produced in the same manner as in Example 1.
（比較例４）
図６に示すように、小円形パターン４の直径ａ及び大円形パターン６の直径ｂは実施例１と同様であるが、平面視方向Ｖにおいて、見かけ上、小円形パターン４の中心と大円形パターン６の中心と一致するように、小円形パターン４が大円形パターン６の中に配置されたプリント配線板を作製した。
(Comparative Example 4)
As shown in FIG. 6, the diameter a of the small circular pattern 4 and the diameter b of the large circular pattern 6 are the same as those in the first embodiment. A printed wiring board in which the small circular pattern 4 was arranged in the large circular pattern 6 so as to coincide with the center of the pattern 6 was produced.
＜評価＞
以上のように作製した四層板のそり特性評価、埋め込み性の評価方法及びパターン端部の破れ状態を確認した。
<Evaluation>
The four-layer plate produced as described above was evaluated for warpage characteristics, a method for evaluating embeddability, and the state of pattern edge breakage.
（そりの測定方法）
そりは四層板を平置きにした状態で、四隅のそり最大値を、直尺により測定した。
(Measurement method of sled)
The sled was measured with a straight scale, with the maximum sled at the four corners in a state where the four-layer plate was placed flat.
（埋め込み性の評価方法）
四層板の両表面の導体をエッチングし、プリント配線板の周囲を目視にて観察し、ボイドなど異常の有無を確認し、表１中に「○」「×」で記した。表１中の「○」は「ボイドなし」、「×」は「ボイドあり」である。
(Embedment evaluation method)
The conductors on both surfaces of the four-layer board were etched, and the periphery of the printed wiring board was visually observed to check for the presence or absence of abnormalities such as voids. In Table 1, “◯” indicates “no void”, and “×” indicates “with void”.
（破れ状態の評価方法）
破れ状態については、パターンにおいて、導体の有無による導体とプリプレグとの間の界面における破れ状態を、最外層の金属箔をエッチング後、目視にて確認した。
(Evaluation method of torn state)
About the torn state, in the pattern, the torn state at the interface between the conductor and the prepreg due to the presence or absence of the conductor was visually confirmed after etching the outermost metal foil.
以上の評価結果を表１に示した。 The above evaluation results are shown in Table 1.
表１から、実施例１〜３では、そりが小さく、埋め込み性が良く、破れが発生しにくいプリント配線板を得ることができた。
一方で、比較例１は、直径比（ｂ／ａ）が１であるため、反りが大きく、また、プリント配線板の表裏で円形パターンが重なり、円形パターンのリング状の縁部が一致しているため、そこを起点に破れが発生した。
また、比較例２は、直径比（ｂ／ａ）が１であるため、反りが大きかった。
比較例３は、プリント配線板の周囲にベタで銅層が形成されているため、反りが大きく、また、埋め込み性が良好ではなかった。
比較例４は、プリント配線板の表裏で銅パターンが重なり、円形パターンのリング状の縁部が一致しているため、そこを起点に破れが発生した。
From Table 1, in Examples 1 to 3, it was possible to obtain a printed wiring board having a small warp, good embedding property, and less likely to break.
On the other hand, in Comparative Example 1, since the diameter ratio (b / a) is 1, warping is large, and the circular patterns overlap on the front and back of the printed wiring board, and the ring-shaped edges of the circular patterns coincide. Because of this, there was a break from that point.
In Comparative Example 2, since the diameter ratio (b / a) was 1, warping was large.
In Comparative Example 3, since the solid copper layer was formed around the printed wiring board, the warpage was large and the embedding property was not good.
In Comparative Example 4, since the copper patterns overlapped on the front and back sides of the printed wiring board and the ring-shaped edges of the circular pattern coincided with each other, tearing occurred from that point.
１ プリント配線板
２ 基材
２Ａ 基材周囲部分領域（基材部分領域）
２Ｂ 基材中央部分領域
２ａ 非パターン形成部分
２ｂ 小円形パターン形成部分
２ｃ 重複円形パターン形成部分
２ｄ 大円形パターン形成部分
３ 基材の一方の表面
３ａ 周囲表面
３ｂ 中央表面
４ 小円形パターン
５ 基材の他方の表面（裏面）
５ａ 周囲表面
５ｂ 中央表面
６ 大円形パターン
ａ 小円形パターンの直径
ｂ 大円形パターンの直径
ｐ プリプレグ
DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Base material 2A Base material surrounding partial area (base material partial area)
2B Substrate central part region 2a Non-pattern forming part 2b Small circular pattern forming part 2c Overlapping circular pattern forming part 2d Large circular pattern forming part 3 One surface of base 3a Surrounding surface 3b Central surface 4 Small circular pattern 5 The other surface (back)
5a Surrounding surface 5b Center surface 6 Large circular pattern a Small circular pattern diameter b Large circular pattern diameter p Prepreg
Claims (5)
前記基材のうち少なくとも所定範囲の基材の領域である基材部分領域の一方の表面に形成された金属製の複数の小円形パターンと、
前記基材部分領域の他方の表面に形成された金属製の複数の大円形パターンとを有し、
各大円形パターンは各小円形パターンより大きく、
前記基材部分領域の一方の表面に直交する平面視方向において、見かけ上、各小円形パターンの一部が各大円形パターンの一部に重なっている、プリント配線板。 A substrate;
A plurality of small circular patterns made of metal formed on one surface of a base material partial region that is a region of at least a predetermined range of the base material among the base materials,
A plurality of large circular patterns made of metal formed on the other surface of the base material partial region,
Each large circular pattern is larger than each small circular pattern,
A printed wiring board in which a part of each small circular pattern is overlapped with a part of each large circular pattern in a plan view direction orthogonal to one surface of the base material partial region.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177538A (en) * | 1992-12-04 | 1994-06-24 | Ibiden Co Ltd | Inner board |
| JPH0851258A (en) * | 1994-08-05 | 1996-02-20 | Sharp Corp | Dummy pattern on printed wiring board |
| JPH11177191A (en) * | 1997-12-12 | 1999-07-02 | Mitsubishi Electric Corp | Printed circuit board and multi-layer printed circuit board |
| JP2005039240A (en) * | 2003-06-24 | 2005-02-10 | Ngk Spark Plug Co Ltd | Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure composed of semiconductor element, intermediate substrate, and substrate |
-
2016
- 2016-05-10 JP JP2016094915A patent/JP6711122B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177538A (en) * | 1992-12-04 | 1994-06-24 | Ibiden Co Ltd | Inner board |
| JPH0851258A (en) * | 1994-08-05 | 1996-02-20 | Sharp Corp | Dummy pattern on printed wiring board |
| JPH11177191A (en) * | 1997-12-12 | 1999-07-02 | Mitsubishi Electric Corp | Printed circuit board and multi-layer printed circuit board |
| JP2005039240A (en) * | 2003-06-24 | 2005-02-10 | Ngk Spark Plug Co Ltd | Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure composed of semiconductor element, intermediate substrate, and substrate |
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