JP2017175094A - Ceramic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic package which prevents adverse influences from being exerted upon electronic component mounting pads even if fine fragments are generated in measuring pads.SOLUTION: A ceramic package 1a comprises: a package body 2 including a substrate 3 consisting of a ceramic and having a pair of front faces 4 and 5 and a pair of frame bodies 7 and 8 individually laminated on the front faces 4 and 5; a pair of cavities 10 and 12 enclosed for each of the frame bodies 4 and 5 and defining the front faces 4 and 5 as bottom faces; a pair of crystal vibrator mounting pads 15 formed on the bottom face of one cavity 10 (the front face 4); and multiple electronic component mounting pads 26-28 formed on the bottom face of the other cavity 12 (the front face 5) and a pair of measuring pads 23 formed at the side of the other frame body 8 where the other cavity 12 is opened. The pair of measuring pads 23 are formed on the front face 5 of the substrate 3 in a recess 21 that is opened on a front face 9 of the other frame body 8 and a side face 14 of the package body 2.SELECTED DRAWING: Figure 2

Description

  The present invention has a pair of quartz crystal resonator mounting pads on one bottom surface of a pair of cavities opened on both surfaces of a ceramic package body, and a plurality of electronic component mounting pads on the bottom surface of the other cavity. And a ceramic package having a pair of measurement pads on the side of the frame having the other cavity.

For example, a plurality of integrated circuit element mounting pads and a pair of pairs are formed on one bottom surface of a pair of recessed spaces (cavities) that are formed of a flat substrate portion made of an insulating material and two frame portions and open to both main surfaces. And a pair of piezoelectric vibration element mounting pads on the bottom surface of the other recess space, and the plurality of integrated circuit element mounting pads are provided at the center of the bottom surface of the one recess space. In addition, a piezoelectric oscillator has been proposed in which the pair of measurement terminals are individually provided on both sides of the central portion of the bottom surface of the same concave space (see, for example, Patent Document 1).
According to the piezoelectric oscillator as described above, even if the entire size is reduced, after the integrated circuit element is mounted, the necessary electrical measurement of the piezoelectric vibration element is performed for each surface of the pair of measurement terminals. Measurement can be easily performed by bringing the tip of the pin into contact.

  However, as in the piezoelectric oscillator, when a plurality of integrated circuit element mounting pads and a pair of measurement terminals are formed on the bottom surface of the same recess space, for each surface of the pair of measurement terminals, When the sharp tip of the probe pin is brought into contact with and separated from the surface, a fine piece of the plating film near the surface of the measurement terminal or a fine piece of the conductor constituting the measurement terminal is generated. There is. When fine debris made of such a conductor is generated, an inadvertent short circuit may occur between a plurality of integrated circuit element mounting pads formed on the bottom surface of the same recess space, or above the integrated circuit element mounting pads. There is a possibility of adversely affecting the mountability of the integrated circuit element mounted on the board.

JP 2011-211449 A (pages 1 to 12, FIGS. 1 and 2)

  The present invention solves the problems described in the background art and has a pair of quartz crystal resonator mounting pads on one bottom surface of a pair of cavities opening on both sides of the package body, and on the bottom surface of the other cavity. The electronic component mounting pad has a plurality of electronic component mounting pads, and has a pair of measurement pads on the side of the frame having the other cavity. It is an object of the present invention to provide a ceramic package that does not adversely affect the above.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-described problems, the present invention was conceived by separating a cavity in which a plurality of pads for mounting electronic components and a recess or cavity in which a pair of measurement pads are provided are separated from each other. It is.
That is, a first ceramic package according to the present invention (Claim 1) is made of ceramic, and has a pair of surfaces and a pair of frames, and a pair of frames individually laminated on the pair of surfaces of the substrate, A pair of cavities surrounded by the frame and having the surface of the base as a bottom surface, a pair of quartz resonator mounting pads formed on the bottom surface of the one cavity, and the other A ceramic package comprising a plurality of electronic component mounting pads formed on the bottom surface of the cavity and a pair of measurement pads formed on the other frame body side where the other cavity opens. The pair of measurement pads may include a bottom surface of another cavity opened on the surface of the other frame body separated from the other cavity in plan view, or the other frame body. It is formed on a surface of said substrate at the surface and a recess that opens to the side surface of the package body, and wherein the.

According to the first ceramic package, the pair of measurement pads are formed on a bottom surface of a cavity different from the other cavity on which a plurality of pads for mounting electronic components are formed on the bottom surface, Or it forms in the ceiling surface (surface of a base) in the above-mentioned crevice independent of the above-mentioned other cavity. Therefore, a partition included in one of the frame members shields between the other cavity and another cavity, or between the other cavity and the recess.
As a result, when the tip of the probe pin is brought into contact with and separated from the surface of the pair of measurement pads, fine fragments of the plating film near the surface of the measurement pad, or the measurement Even if a fine fragment of the conductor constituting the pad is generated, the fragment cannot enter the other cavity where the plurality of electronic component mounting pads are formed. Therefore, an inadvertent short circuit is caused between the pads for mounting a plurality of electronic components, or adverse effects on the mountability of the electronic components to be mounted after the pads for mounting the plurality of electronic components are prevented. be able to.

The ceramic constituting the package body is made of, for example, a high temperature fired ceramic such as alumina, or a low temperature high temperature fired ceramic such as glass-ceramic.
Further, when the ceramic is a high-temperature fired ceramic, the quartz crystal resonator mounting pad, the electronic component mounting pad, and the measurement pad are made of, for example, W (tungsten) or Mo (molybdenum). When the ceramic is a low-temperature fired ceramic, for example, it is made of Cu (copper) or Ag (silver).
Further, the pair of front surfaces are relative names, for example, one can be referred to as a front surface and the other can be referred to as a back surface.
Further, the frame has the same or similar outer shape in plan view, and has a rectangular through-hole penetrating along the thickness direction.
Further, the concave portion has an L-shaped opening in a side view across the surface of the other frame body, the side surface of the package body, and two surfaces, and the ceiling surface of the concave portion is the surface of the base body. It is formed from a part of.
The measurement pad may be electrically connected to the crystal resonator mounting pad, and in addition to this, the electronic component mounting pad may be electrically connected.
In addition, the electronic components to be mounted on the electronic component mounting pad are, for example, an integrated circuit (IC), a semiconductor element, a chip capacitor, a resistor, an inductor, a transistor, a temperature measuring element, and the like.

  A second ceramic package according to the present invention (Claim 2) is made of ceramic, has a pair of surfaces, and has a pair of surfaces, a pair of frames individually laminated on the pair of surfaces of the substrate, A pair of cavities surrounded by the frame body and having the surface of the base as a bottom surface, a pair of quartz resonator mounting pads formed on the bottom surface of the one cavity, and the other A ceramic package comprising a plurality of electronic component mounting pads formed on the bottom surface of the cavity and a pair of measurement pads formed on the other frame body side where the other cavity opens. The pair of measurement pads are parallel to the surface of the other frame body in the recess opening to the surface of the other frame body and the side surface of the package body on the surface side. Is formed on the surface, characterized in that.

According to the second ceramic package, the pair of measurement pads includes a stepped surface (ceiling) of the recess that is located apart from the other cavity in which a plurality of pads for mounting electronic components are formed on the bottom surface. The partition wall included in one of the frame bodies shields between the other cavity and the recess. As a result, even if the above-mentioned fine debris is generated when the pointed tip of the probe pin is brought into contact with or separated from the surfaces of the pair of measurement pads, the debris is Cannot enter the cavity. Therefore, it is possible to prevent the inadvertent short circuit and the adverse effect on the mountability of electronic components.
The other frame is formed by integrally laminating two or more ceramic layers.
Further, the step surface of the concave portion is a ceiling surface of the concave portion, and is constituted by a part of the surface of any one ceramic layer constituting the other frame body.

Further, according to the present invention, the pair of measurement pads are formed on the bottom surfaces of the cavities different from the cavities and different from each other, the surface of the base in the different concave portions, or the step surfaces of the different concave portions. Also included is a ceramic package (claim 3).
According to this, the pair of measurement pads are different from the other cavity in which a plurality of pads for mounting electronic components are formed on the bottom surface, and the bottom surfaces of different cavities and the recesses different from each other. It is formed on the surface of the base or on the step surface (ceiling surface) of the recesses different from each other. For this reason, it is possible to prevent such an inadvertent short circuit and an adverse effect on the mountability of electronic components.
The bottom surfaces of the different cavities, the surface of the base in the recesses, or the stepped surface of the recesses are set at the same position in the thickness direction of the package body. As a result, the pair of measurement pads formed on the pair of bottom surfaces, the pair of surfaces, or the pair of stepped surfaces also have the same height (level) in the thickness direction. Can be reliably contacted.

In addition, according to the present invention, the pair of measurement pads are different from the cavity and are formed on the bottom surface of the same cavity, the surface of the base in the same recess, or the step surface of the same recess. A ceramic package (Claim 4) is also included.
According to this, the pair of measurement pads is different from the other cavity in which a plurality of pads for mounting electronic components are formed on the bottom surface, and the bottom surface of the same cavity and the surface of the base in the same recess Alternatively, it is formed on the step surface of the same recess. For this reason, it is possible to prevent such an inadvertent short circuit and an adverse effect on the mountability of electronic components.

The top view which shows one form of the 1st ceramic package by this invention. The vertical cross section (end surface) figure along the arrow of the XX line in FIG. (A) is a side view along the arrow V in FIG. 2, and (B) is a visual perspective view of the ceramic package looking up obliquely from below. The bottom view of the said ceramic package. The horizontal sectional view along the arrow of the YY line in FIG. The bottom view of the 1st ceramic package which has a different form. Furthermore, the bottom view of the 1st ceramic package which has a different form. The vertical cross section (end surface) figure of the 1st ceramic package which has another form. The vertical cross section (end surface) figure of the 1st ceramic package which is another form. The vertical cross section (end face) figure which shows one form of the 2nd ceramic package by this invention. The vertical cross section (end surface) figure of the 2nd ceramic package which has a different form.

Hereinafter, modes for carrying out the present invention will be described.
As shown in FIGS. 1 to 4, the first ceramic package 1 a according to an embodiment of the present invention is individually opened in a box-shaped package body 2 and an upper surface 7 and a lower surface 9 of the package body 2. A pair of upper and lower cavities 10, 12, a pair of crystal resonator mounting pads 15 formed on the bottom surface 4 of one (upper) cavity 10, and a plurality of pads formed on the bottom surface 5 of the other (lower) cavity 12. Electronic component mounting pads 26 to 28, a pair of left and right recesses 21 positioned on both ends of the lower surface 9 of the package body 2, and a measurement pad 23 individually formed on the ceiling surface 5 of the recess 21. It is equipped with.

The package body 2 is made of, for example, alumina (ceramic), and has a flat plate-like base body 3 having a rectangular shape in plan view and having a pair of opposing surfaces 4 and 5, and the surface 4 of the base body 3. 5 integrally includes a pair of upper and lower frames 6 and 8 that are individually stacked on top of each other. The frame bodies 6 and 8 have rectangular through holes having a rectangular frame shape in plan view and different sizes in plan view along the thickness direction.
The front surfaces 4 and 5 of the base 3 are also the bottom surfaces 4 and 5 of the cavities 10 and 12, and the front surface (back surface) 5 is also the ceiling surface 5 of the recess 21.
Further, the pair of cavities 10 and 12 are different in size in plan view, the surfaces 4 and 5 of the base body 3 are the bottom surfaces, and the inner wall surfaces of the through holes for the frame bodies 6 and 8 are the four side surfaces. 11 and 13.

Further, as shown in FIGS. 1 to 3, a metallized layer 20 is formed on almost the entire upper surface 7 having a rectangular frame shape in plan view in one frame body 6.
A rectangular metal lid is joined to the metallized layer 20 via a brazing material such as Ag brazing, or a rectangular frame-like metal frame is joined via the brazing material. And a metal lid is seam welded onto the metal frame. As a result, the crystal resonator 17 that is mounted in the one cavity 10 is sealed from the outside.
In addition, as shown in FIGS. 1 and 3 to 5, between the pair of side surfaces 14 (corners) adjacent to each other at right angles in the package body 2, an arc shape (quarter circle) shape is seen in plan view. The recess 25 is formed along the thickness direction, and a curved recess conductor 24 is formed along the curved inner wall surface of the recess 25. The upper end of each recess conductor 24 is connected to the metallized layer 20.

Further, as shown in FIGS. 1 and 2, the bottom surface 4 of one cavity 10 having a relatively wide plan view has a pair of front and rear crystal mounting pads 15 on the left side of the figure and a center of the right side of the figure. A pillow 18 having a rectangular shape in plan view is formed. The pair of quartz crystal resonator mounting pads 15 have a rectangular shape in plan view, and are connected to routing wires 15 a extending along the long side surface 11 of the cavity 10.
Note that a rectangular crystal resonator 17 in a plan view is mounted in a horizontal posture on the upper side of each of the pair of crystal resonator mounting pads 15 via a conductive adhesive 16 later. The pillow 18 is provided to prevent contact between the vibrator 17 and the bottom surface 4 of the cavity 10.

  2 to 5, the lower surface (front surface) 9 of the other frame body 8 and the package body are provided between the both end sides of the front surface (back surface) 5 and the other frame body 8 in the base 3. A pair of left and right recesses 21 that are open in an L shape when viewed from the side are located across the two faces of the short side face 14 in FIG. The recess 21 includes a side surface 22 on three sides and a horizontal ceiling surface 5, and the ceiling surface 5 is formed from a part of the surface 5 of the base 3. For each ceiling surface 5, a measurement pad 23 having a rectangular shape in bottom view is formed. The pair of left and right measurement pads 23 can be individually conducted through the pair of quartz vibrator mounting pads 15 and via conductors 19 penetrating the base body C1.

Also, as shown in FIGS. 4 and 5, pads 26 to 28 for mounting electronic components are formed on the bottom surface 5 of the other cavity 12 that is relatively narrow in plan view. Of these, the electronic component mounting pads 26 and 28 on both the left and right sides are recessed as shown in FIG. 5 via wirings 26 a and 28 a extending along the upper and lower side surfaces 13 on the bottom surface 5. The conductors 24 are individually connected. The pair of electronic component mounting pads 27 located on the center side of the bottom surface 8 is connected to the wiring 27a extending on the bottom surface 5 in parallel with the vertical direction shown in the figure. For example, the wiring 27a can be electrically connected to the via conductor 19 on the distal end side of the wiring 15a through another via conductor (not shown).
For example, an integrated circuit (IC, electronic component) 30 is mounted on the electronic component mounting pads 26 to 28 via the same brazing material as shown in FIGS. The

Further, as shown in the bottom view of FIG. 4, mounting electrodes 29 each having a substantially L-shape in bottom view are individually formed on the four corners of the lower surface (front surface) 9 of the other frame body 8. The lower end of the recessed conductor 24 is individually connected to the working electrode 29.
The mounting electrode 29 is utilized when the ceramic package 1a is mounted on a surface electrode on the side of a mother board (not shown) later by brazing or the like.
The metallized layer 20 made of a conductor, the via conductor 19, the pads 15, 23, 26 to 28, the recessed conductor 24, and the mounting electrode 29 are made of W or Mo.
In addition, as shown in FIGS. 2, 4, and 5, the gap between the other cavity 12 and the pair of left and right recesses 21 is blocked by a partition wall 8 w having a rectangular cross section included in the other frame body 8. Yes.

Further, instead of the pair of left and right recesses 21 as described above, as shown in the bottom view of FIG. 6, the frame body 8 is provided for each central portion of the pair of upper and lower long sides on the lower surface 9 of the other frame body 8. A pair of upper and lower recesses 21a that open across two surfaces of the lower surface 9 of the package body 2 and the long side surface 14 of the package body 2 are formed symmetrically, and the measurement pad 23 is formed on the ceiling surface 5 of each recess 21a. The ceramic package 1a may be formed separately.
Also in the first ceramic package 1a, as shown in FIG. 6, the space between the other cavity 12 and the pair of upper and lower recesses 21a is blocked by a partition wall 8w having a rectangular cross section included in the other frame body 8. ing.

Further, in place of the pair of left and right or pair of upper and lower recesses 21a as described above, as shown in the bottom view of FIG. 9 is formed with a single concave portion 21b formed of a ceiling surface 5 and three side surfaces 22 and having a relatively wide width at a position between a pair of mounting electrodes 29 located on the corner side of the nine. The ceramic package 1a may be used. A pair of measurement pads 23 are formed adjacent to the ceiling surface 5 of the recess 21b.
Also in the first ceramic package 1a, as shown in FIG. 6, the other cavity 12 and the recess 21b are blocked by a partition wall 8w having a rectangular cross section included in the other frame body 8.
The concave portion 21b may be formed on the center side of one of the upper and lower long sides of the lower surface 9 of the other frame body 8.

FIG. 8 is a vertical cross-sectional view showing a first ceramic package 1b having a different configuration. The ceramic package 1b has the same package body 2, a pair of upper and lower cavities 10 and 12, a pair of quartz resonator mounting pads 15, a metallized layer 20, and electronic component mounting pads 26 to 27, and the like. In addition, as shown in FIG. 8, another cavity 31 that opens to the bottom surface 9 is further formed on the other frame body 8 side that forms the package body 2, in addition to the cavity 12. The cavity 31 includes four side surfaces 32 and a ceiling surface 5 that is a part of the surface 5 of the base 3, and a pair of measurement pads 23 are formed on the ceiling surface 5.
Also in the first ceramic package 1b, as shown in FIG. 8, the gap between the other cavity 12 and the other cavity 31 is blocked by a partition wall 8w having a rectangular cross section included in the other frame body 8. Yes.

FIG. 9 is a vertical cross-sectional view showing the first ceramic package 1b having a further different form. The ceramic package 1b includes the same package body 2, a pair of upper and lower cavities 10 and 12, a pair of quartz resonator mounting pads 15, a metallized layer 20, and electronic component mounting pads 26 to 27, and the like. In addition, as shown in FIG. 8, a pair of left and right cavities 31 a that open to the bottom surface 9 on both sides of the cavity 12 are further provided on the other frame body 8 side forming the package body 2. Is formed. The cavity 31 a is composed of four side surfaces 32 and a ceiling surface 5 that is a part of the surface 5 of the base 3, and a measuring pad 23 is formed on the relatively narrow ceiling surface 5.
Also in the first ceramic package 1b, as shown in FIG. 9, the space between the other cavity 12 and each of the cavities 31a is blocked by a partition wall 8w having a rectangular cross section included in the other frame body 8. .

  According to the first ceramic packages 1a and 1b as described above, the pair of measurement pads 23 includes the other cavity 12 in which a plurality of the electronic component mounting pads 26 to 28 are formed on the bottom surface 5. Is formed on the bottom surface 5 of another cavity 31, 31 a, or is formed on the surface 5 of the base 3 in the recesses 21, 21 a, 21 b independent of the other cavity 12. Therefore, between the other cavity 12 and the other cavities 31 and 31a, or between the other cavity 12 and the recesses 21, 21a, and 21b, a rectangular cross section included in one of the frame bodies 8, respectively. The partition wall 8w is shut off.

  As a result, when the tips of the probe pins are brought into contact with and separated from the surfaces of the pair of measurement pads 23, fine fragments of the plating film near the surface of the measurement pads 23, and the measurement Even if a fine piece of the conductor constituting the pad for use is generated, the piece cannot enter the other cavity 12 in which the plurality of electronic component mounting pads 26 to 28 are formed. Accordingly, an inadvertent short-circuit between the plurality of electronic component mounting pads 26 to 28 is caused, or an electronic circuit such as an integrated circuit mounted on the upper side of the plurality of electronic component mounting pads 26 to 28. An adverse effect on the mountability of the component 30 can be prevented.

FIG. 10 is a vertical sectional view showing a second ceramic package 1c according to an embodiment of the present invention.
As shown in FIG. 10, the second ceramic package 1c includes the same package body 2, a pair of upper and lower cavities 10 and 12, a pair of quartz resonator mounting pads 15, a metallized layer 20, and an electronic component mounting. 10 and the other frame body 8 constituting the package body 2 is formed by integrally laminating a ceramic layer 8a on the upper layer side and a ceramic layer 8b on the lower layer side, as shown in FIG. It is.

As shown in FIG. 10, a pair of left and right recesses 21c are symmetrically arranged on the left and right sides of the other cavity 12 located at the center of the bottom surface 9 of the package body 2, and the recesses 21c are respectively formed on the lower ceramic layer. The side surface 22 of three sides formed in 8b and a step surface (ceiling surface) 33 which is also one surface of the ceramic layer 8a on the upper layer side, and a measurement pad 23 is individually formed for each step surface 33. ing.
In the second ceramic package 1c, as shown in FIG. 10, the gap between the other cavity 12 and the recess 21c is blocked by a partition wall 8w having a rectangular cross section included in the other frame body 8.

  FIG. 11 is a vertical sectional view showing a second ceramic package 1c having a different form. As shown in FIG. 11, the second ceramic package 1c also has the same package body 2, a pair of upper and lower cavities 10, 12, a pair of quartz resonator mounting pads 15, a metallized layer 20, and an electronic component mounting. The other frame body 8 constituting the package body 2 is also composed of two upper and lower ceramic layers 8a and 8b.

As shown in FIG. 11, a single concave portion 21d having a large size in plan view is disposed on the left side of the other cavity 12 located on the right side of the bottom surface 9 of the package body 2, and the concave portion 21d is also formed of a ceramic on the lower layer side. The side surface 22 has three sides formed in the layer 8b and a relatively wide step surface (ceiling surface) 33 which is also one surface of the upper ceramic layer 8a. A pair of measurement pads 23 is provided on the step surface 33. Is formed adjacent to the left and right.
The single recess 21d may have a form in which a pair of measurement pads 23 can be formed adjacent to each other along the front-rear direction of FIG.
Also in the second ceramic package 1c, as shown in FIG. 11, the other cavity 12 and the recess 21d are blocked by a partition wall 8w having a rectangular cross section included in the other frame body 8.

The second ceramic package 1c as described above can achieve the same effects as those of the first ceramic packages 1a and 1b.
In addition, since the other cavity 12 on which the electronic component 30 is mounted can be made relatively deep, it is possible to easily cope with the mounting of the electronic component 30 having various thicknesses, and the step surfaces 33 of the recesses 21c and 21d become relatively shallow. In addition, the probe pin can be contacted easily and accurately.
It should be noted that, instead of the recesses 21c and 21d in the ceramic package 1c, the four side surfaces 22 formed on the ceramic layer 8b and a relatively wide step surface (ceiling surface) 33 which is also one surface of the ceramic layer 8a. It is good also as a form which formed a pair of cavity or the single cavity.

The present invention is not limited to the above embodiments.
For example, the ceramic constituting the package body 2 may be a high-temperature fired ceramic such as aluminum nitride or mullite, or a low-temperature fired ceramic such as glass-ceramic. In the latter case, Cu or Ag is applied to the conductors such as the pads 15, 23, 26 to 28.
Further, the package main body 2, the pair of cavities 10, 13, 31, 31a, or the recesses 21a to 21d may have a square shape or a rectangular shape in plan view.
Further, in the pair of measurement pads, one measurement pad is formed on the bottom surface of the cavity, and the other measurement pad is formed on the surface of the base in the recess or on the step surface of the recess. May be.
The pillow 18 may be made of the same ceramic as the ceramic constituting the base body C1.
In addition, each of the ceramic packages 1a to 1c may have a multi-cavity form (a plurality of the ceramic packages 1a to 1c arranged side by side in the vertical and horizontal directions).

  According to the present invention, a pair of quartz resonator mounting pads are provided on one bottom surface of a pair of cavities opened on both surfaces of the package body, and a plurality of electronic component mounting pads are provided on the bottom surface of the other cavity. A ceramic package having a pair of measurement pads can be reliably provided that does not adversely affect the electronic component mounting pads even if such fine fragments are generated.

1a-1c …………………… Ceramic package 2 ……………………………… Package body 3 ……………………………… Base 4,5 …………… ........... surface (bottom surface of cavity / ceiling surface of recess)
6,8 ………………………… Frame body 7,9 ………………………… The surface of the frame body (upper / lower surface of the package body)
10, 12 …………………… Cavity 15 …………………………… Pads for mounting crystal resonators 21, 21 a to 21 d ………… Recessed portion 23 ……………………… …… Measurement pads 26 to 28 …………………… Pads 31, 31a for mounting electronic components ………………… Another cavity 33 …………………………… Recessed ceiling)

Claims (4)

A package main body made of ceramic and having a flat substrate having a pair of surfaces and a pair of frames individually laminated on the pair of surfaces of the substrate;
A pair of cavities surrounded by each frame and having the surface of the base as the bottom;
A pair of quartz crystal resonator mounting pads formed on the bottom surface of the one cavity;
A plurality of electronic component mounting pads formed on the bottom surface of the other cavity;
A pair of measurement pads formed on the other frame side where the other cavity opens, and a ceramic package comprising:
The pair of measurement pads may include a bottom surface of another cavity opened on the surface of the other frame body separated from the other cavity in plan view, or the surface of the other frame body and a side surface of the package body. Formed on the surface of the substrate in the recess opening to
A ceramic package characterized by that. A package main body made of ceramic and having a flat substrate having a pair of surfaces and a pair of frames individually laminated on the pair of surfaces of the substrate;
A pair of cavities surrounded by each frame and having the surface of the base as the bottom;
A pair of quartz crystal resonator mounting pads formed on the bottom surface of the one cavity;
A plurality of electronic component mounting pads formed on the bottom surface of the other cavity;
A pair of measurement pads formed on the other frame side where the other cavity opens, and a ceramic package comprising:
The pair of measurement pads are formed on a stepped surface parallel to the surface of the other frame body in a recess opening to the surface of the other frame body and the side surface of the package body on the surface side.
A ceramic package characterized by that. The pair of measurement pads are formed on the bottom surfaces of the cavities different from the cavities and different from each other, the surface of the base in the different recesses, or the step surfaces of the recesses different from each other.
The ceramic package according to claim 1 or 2, wherein The pair of measurement pads are different from the cavity and are formed on the bottom surface of the same cavity, the surface of the base in the same recess, or the step surface of the same recess.
The ceramic package according to claim 1 or 2, wherein

Images