JP2017175057A - Light-emitting device and illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device and an illumination device with the improved optical characteristics.SOLUTION: A light-emitting device can emit light with four or more kinds of colors including two or more kinds of primary colors. The light-emitting device includes: a first light-emitting element emitting light with a first color; a second light-emitting element provided adjacently to the first light-emitting element and emitting light with a second color whose distance to the first color in u'v' chromaticity chart is the longest; and a diffusion part that diffuses the light with the first color emitted from the first light-emitting element and the light with the second color emitted from the second light-emitting element.SELECTED DRAWING: Figure 1

Description

  Embodiments described herein relate generally to a light emitting device and a lighting device.

There is a light-emitting device including a plurality of types of light-emitting elements that emit different colors of light. Such a light-emitting device can irradiate light of all colors (full color) by controlling on / off of the light-emitting elements for each emission color.
Here, there is a problem that it is difficult to mix colors depending on the color of light.
Therefore, if a plurality of types of light emitting elements having different colors of emitted light are simply provided in a distributed manner, optical characteristics such as color unevenness and brightness unevenness may be deteriorated.
Therefore, even when a plurality of types of light emitting elements having different colors of emitted light are provided, it has been desired to develop a technique capable of improving optical characteristics such as color unevenness and luminance unevenness.

JP 2014-082236 A

  The problem to be solved by the present invention is to provide a light emitting device and an illuminating device capable of improving optical characteristics.

  The light emitting device according to the embodiment is a light emitting device that can emit light of four or more colors including two or more primary colors. The light-emitting device includes a first light-emitting element that emits light of a first color; and is provided adjacent to the first light-emitting element, and on the u′v ′ chromaticity diagram, A second light emitting element that emits light of a second color having the longest distance between; the light of the first color emitted from the first light emitting element; and the light emitted from the second light emitting element A diffusing portion for diffusing the second color light.

  According to the embodiment of the present invention, it is possible to provide a light-emitting device and an illumination device that can improve optical characteristics.

1 is a schematic plan view for illustrating a light emitting device 1 according to the present embodiment. It is the sectional view on the AA line in FIG. It is a schematic cross section for illustrating the illuminating device 100 which concerns on this Embodiment.

The invention according to the embodiment is a light emitting device capable of emitting light of four or more colors including two or more primary colors, and a first light emitting element that emits light of a first color; A second light-emitting element that is provided adjacent to the light-emitting element and emits light of a second color that has the longest distance from the first color on the u′v ′ chromaticity diagram; A light emitting device comprising: a diffusion unit that diffuses the first color light emitted from the first light emitting element and the second color light emitted from the second light emitting element. It is.
According to this light emitting device, even when a plurality of types of light emitting elements having different light colors are provided, optical characteristics such as color unevenness and luminance unevenness can be improved.

In addition, the first color can be red, and the second color can be blue or green.
Since the primary color has a narrow half-value width, it is difficult to mix the colors, but according to this light emitting device, the mixing of colors can be facilitated.

In addition, the first color can be green, and the second color can be blue.
Since the primary color has a narrow half-value width, it is difficult to mix the colors, but according to this light emitting device, the mixing of colors can be facilitated.

Further, the number of the first light emitting elements may be larger than the number of the second light emitting elements.
For example, a light-emitting element that emits red light easily absorbs light incident on the light-emitting element after being reflected by a sealing portion or the like. Therefore, if the number of the first light emitting elements that emit red light is increased, the amount of red light that is reduced by being absorbed can be compensated.

The invention which concerns on embodiment is an illuminating device provided with said light-emitting device; The housing | casing in which the said light-emitting device is accommodated.
According to this illumination device, even when a plurality of types of light emitting elements having different light colors are provided, optical characteristics such as color unevenness and brightness unevenness can be improved.

  Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.

(Light emitting device)
FIG. 1 is a schematic plan view for illustrating a light emitting device 1 according to the present embodiment.
In order to avoid complication, the sealing portion 40, the wiring pattern 12 and the like are omitted in FIG.
FIG. 2 is a cross-sectional view taken along the line AA in FIG.
As shown in FIGS. 1 and 2, the light emitting device 1 includes a substrate 10, a light emitting unit 20, a frame unit 30, and a sealing unit 40.

The substrate 10 has a base 11 and a wiring pattern 12.
The base 11 has a plate shape. The substrate 11 is preferably formed using a material having high thermal conductivity. The material having high thermal conductivity can be, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), or a metal plate whose surface is covered with an insulating material. When the surface of the metal plate is covered with an insulating material, the insulating material may be made of an organic material or an inorganic material.

  The wiring pattern 12 includes a mounting pad 12a, a wiring part 12b, a conductive via 12c, and an input terminal 12d. The mounting pad 12 a is provided on one surface of the base body 11. The mounting pad 12 a is provided inside the frame portion 30.

  The wiring part 12b is provided on the surface of the base 11 opposite to the side on which the mounting pad 12a is provided. One end of the wiring portion 12b is electrically connected to the mounting pad 12a through the conductive via 12c. The other end of the wiring part 12b is electrically connected to the input terminal 12d.

  The conductive via 12c penetrates the base 11 in the thickness direction. One end of the conductive via 12c is electrically connected to the mounting pad 12a. The other end of the conductive via 12c is electrically connected to the wiring portion 12b.

The input terminal 12d is provided on the surface of the base 11 opposite to the side on which the mounting pad 12a is provided. There is no particular limitation on the position of the input terminal 12d. The input terminal 12d can be provided near the periphery of the base 11, for example.
The wiring portion 12b and the input terminal 12d can also be provided on the surface of the base 11 on the side where the mounting pad 12a is provided. In this case, the conductive via 12c can be omitted. Further, the input terminal 12 d can be provided outside the frame portion 30.

Further, one set of the mounting pad 12a, the wiring portion 12b, the conductive via 12c, and the input terminal 12d can be provided for each type of light emitting element (for each light emitting element 20y to 20b2).
In addition, a power supply, a control device, and the like (not shown) provided outside the light emitting device 1 are electrically connected to the input terminal 12d provided for each type of light emitting element. Therefore, the light emitting device 1 can irradiate light of all colors (full color) by controlling turning on and off for each type of light emitting element.
Further, the substrate 11 can have a single layer structure as illustrated in FIG. 2 or a multilayer structure.

  The material of the wiring pattern 12 is not particularly limited as long as it is a conductive material. The material of the wiring pattern 12 can be a metal such as silver, copper, gold, or tungsten, for example. When the material of the base 11 is ceramic, the substrate 10 can be formed using, for example, the LTCC (Low Temperature Co-fired Ceramics) method. For example, the substrate 10 can be formed by simultaneously firing the base 11 and the wiring pattern 12 at a temperature of 900 ° C. or lower.

  Further, a heat spreader (not shown) can be provided on the surface of the substrate 10 opposite to the side on which the light emitting unit 20 is provided. A heat spreader (not shown) can be connected to the substrate 10 via thermal conductive grease or solder. If a heat spreader (not shown) is provided, conduction and dispersion of heat generated in the light emitting unit 20 can be achieved. Therefore, the power applied to the light emitting unit 20 can be increased, so that the amount of light emitted from the light emitting device 1 can be increased. Moreover, since it becomes easy to ensure a heat conduction path | route, it can suppress that the temperature of the sealing part 40 and by extension, the temperature of the light emission part 20 rise.

  The light emitting unit 20 includes light emitting elements 20y, 20o, 20r, 20c, 20b1, 20g, and 20b2. The light emitting elements 20y, 20o, 20r, 20c, 20b1, 20g, and 20b2 are provided on one surface of the substrate 10.

The light emitting element 20y emits yellow light, for example. The light emitting element 20y emits light having a peak wavelength of 570 nm or more and 590 nm or less, for example. The light emitting element 20y may include, for example, a light emitting diode that emits blue light, and a phosphor that is provided on the light emission surface of the light emitting diode and emits yellow fluorescent light.
The light emitting element 20o emits orange light, for example. For example, the light emitting element 20o emits light having a peak wavelength exceeding 590 nm and not more than 620 nm. The light emitting element 20o may include, for example, a light emitting diode that emits blue light, and a phosphor that is provided on the light emitting surface of the light emitting diode and emits amber fluorescence.
The light emitting element 20r emits red light, for example. The light emitting element 20r can be, for example, a light emitting diode that emits light having a peak wavelength of 610 nm or more and 660 nm or less.

The light emitting element 20c, the light emitting element 20b1, and the light emitting element 20b2 emit blue light.
For example, the light emitting element 20c emits cyan light. The light emitting element 20c can be, for example, a light emitting diode that emits light having a peak wavelength of 500 nm or more and 505 nm or less.
The light emitting element 20b1 can be, for example, a light emitting diode that emits blue light having a peak wavelength of about 475 nm.
The light emitting element 20b2 can be, for example, a light emitting diode that emits blue light having a peak wavelength of about 450 nm.

  The light emitting element 20g emits green light, for example. The light emitting element 20g can be, for example, a light emitting diode that emits light having a peak wavelength exceeding 505 nm and not exceeding 540 nm.

  The light emitting elements 20y to 20b2 are mounted on the mounting pad 12a using a COB (Chip on Board) method. The light emitting elements 20y to 20b2 are bonded onto the mounting pads 12a1 to 12g1 via a silver paste, a silver nano paste, or the like. The light emitting elements 20y to 20b2 can be upper and lower electrode type light emitting diodes, flip chip type light emitting diodes, or the like.

  Here, in the upper and lower electrode type light emitting diode, the light emitting layer for generating light is provided on the opposite side (upper side) to the substrate 10 side in the light emitting diode. On the other hand, in the flip-chip type light emitting diode, the light emitting layer for generating light is provided on the substrate 10 side (lower side) inside the light emitting diode. The light emitting layer provided in the light emitting diode becomes a heat source. Therefore, heat dissipation can be improved by using a flip chip type light emitting diode in which a light emitting layer serving as a heat source is provided closer to the substrate 10. On the other hand, when the light emitting diode is of the upper and lower electrode type, the upper electrode and the mounting pad 12a are electrically connected via the wiring 21, so that the degree of freedom regarding the mounting position of the mounting pad 12a can be increased. Therefore, the wiring pattern 12 can be easily designed even when the light emitting elements 20y to 20b2 are mounted with high density.

The light emitting elements 20y to 20b2 illustrated in FIG. 2 are all upper and lower electrode type light emitting diodes. However, if necessary, all of the light emitting elements 20y to 20b2 may be flip chip type light emitting diodes, or upper and lower electrode type light emitting diodes and flip chip type light emitting diodes may be mixed.
For example, in the light emitting element 20r that emits red light, the light emission efficiency may decrease or the emission color may shift as the temperature increases. Further, the phosphors provided in the light emitting elements 20y and 20o can serve as a heat source. Therefore, the light emitting elements 20y, 20o, and 20r can be flip-chip type light emitting diodes with high heat dissipation.

  When the light emitting elements 20y to 20b2 are upper and lower electrode type light emitting diodes, electrodes (lower electrodes) on the substrate 10 side of the light emitting elements 20y to 20b2 are lead-free solder (SAC: SnAgCu or the like), gold tin (AuSn). ) It is electrically connected to the mounting pad 12a through a conductive bonding material such as an alloy paste, a silver paste, or a silver nanopaste. The electrodes (upper electrodes) on the opposite side to the substrate 10 side of the light emitting elements 20y to 20b2 are electrically connected to the mounting pad 12a via the wiring 21. The wiring 21 can be connected using, for example, a wire bonding method.

  When the light emitting elements 20y to 20b2 are flip chip type light emitting diodes, the electrodes of the light emitting elements 20y to 20b2 are made of a conductive bonding material such as lead-free solder, gold-tin alloy paste, silver paste, or silver nano paste. And is electrically connected to the mounting pad 12a.

Next, the arrangement of the light emitting elements 20y to 20b2 will be described.
A region where the light emitting element is provided (for example, a region inside the frame 30) has a central region 14 and a peripheral region 13 surrounding the central region 14. The peripheral region 13 has an annular shape.
As described above, in the light emitting element 20r that emits red light, the light emission efficiency may decrease or the emission color may shift as the temperature rises. If the light emission efficiency is lowered or the light emission color is shifted, color unevenness and brightness unevenness may occur. Therefore, it is preferable to determine the arrangement position of the light emitting element 20r in consideration of heat dissipation. In this case, the peripheral region 13 is easier to dissipate heat than the central region 14. Therefore, the light emitting element 20r is preferably provided in the peripheral region 13.

  When a plurality of light emitting elements 20r are collected in the peripheral region 13, it seems that when the light emitting device 1 emits only red light, ring-shaped light is irradiated on the irradiation surface. However, red light is easy to diffuse because of its long wavelength and wide half width. Therefore, even if the plurality of light emitting elements 20r are collected in the peripheral region 13, the irradiation surface can be prevented from being irradiated with ring-shaped red light.

  Further, the light emitting elements 20c, 20b1, and 20b2 that emit blue light have a short wavelength and a narrow half-value width, and thus are difficult to diffuse. Therefore, when the light emitting elements 20c, 20b1, and 20b2 are collected in the peripheral region 13, when the light emitting device 1 emits only blue or cyan light, the ring-shaped light may be irradiated onto the irradiation surface. Therefore, the light emitting elements 20c, 20b1, and 20b2 are preferably provided in the central region 14.

  Note that the light emitting elements 20c, 20b1, and 20b2 are less likely to decrease in light emission efficiency or shift in light emission color as the temperature rises. Therefore, even if the light emitting elements 20c, 20b1, and 20b2 are provided in the central region 14 that is difficult to dissipate heat, there is little risk of color unevenness and luminance unevenness.

Further, considering that white light is emitted from the light emitting device 1, the total number of the light emitting elements 20c, 20b1, and 20b2 is about ¼ of the total number of the light emitting elements 20y, 20o, 20r, and 20g. Therefore, if the small number of light emitting elements 20c, 20b1, and 20b2 are provided in the central area 14 having a small area, the distance between the light emitting elements is prevented from becoming excessively long or excessively short. be able to.
Further, the number of light emitting elements 20r can be larger than the number of light emitting elements 20g and the total number of light emitting elements 20c, 20b1, and 20b2. The light emitting element 20r that emits red light easily absorbs light reflected by the sealing portion 40 and the like and incident on the light emitting element 20r. Therefore, if the number of the light emitting elements 20r is increased, the amount of red light that is reduced by being absorbed can be compensated.

  The light emitting element 20y that emits yellow light and the light emitting element 20o that emits orange light have phosphors. Therefore, when the light emitting elements 20y and 20o are adjacent to the light emitting elements 20c, 20b1, and 20b2 that emit light having a short wavelength, the light having a short wavelength emitted from the light emitting elements 20c, 20b1, and 20b2 enters the phosphor. Unintended fluorescence may occur. If unintended fluorescence occurs, color reproducibility may be reduced. Therefore, it is preferable that the light emitting elements 20y and 20o are not adjacent to the light emitting elements 20c, 20b1, and 20b2 as much as possible.

  For example, the light emitting elements 20y and 20o are preferably provided in the peripheral region 13 as much as possible. Note that even if red light having a long wavelength is incident on the phosphors of the light emitting elements 20y and 20o, no fluorescence is generated. Therefore, even if the light emitting element 20r that emits red light and the light emitting elements 20y and 20o are provided in the peripheral region 13, there is no possibility that unintended fluorescence is generated.

  That is, at least some of the plurality of light emitting elements 20y, the plurality of light emitting elements 20o, and the plurality of light emitting elements 20r are outside the region where the plurality of light emitting elements 20c, the plurality of light emitting elements 20b1, and the plurality of light emitting elements 20b2 are provided. Is provided.

  Further, since the light emitting element 20r does not have a phosphor, there is no possibility that unintended fluorescence is generated even if the light emitting element 20r and the light emitting elements 20c, 20b1, and 20b2 are adjacent to each other. Therefore, it is more preferable to provide the light emitting element 20r between the light emitting elements 20y and 20o and the light emitting elements 20c, 20b1, and 20b2. In this way, since the distance between the light emitting elements 20y and 20o and the light emitting elements 20c, 20b1, and 20b2 can be increased, the occurrence of unintended fluorescence in the light emitting elements 20y and 20o can be suppressed. it can.

  In this case, the number of light emitting elements 20y and 20o adjacent to the light emitting elements 20c, 20b1 and 20b2 is preferably smaller than the number of light emitting elements 20r adjacent to the light emitting elements 20c, 20b1 and 20b2.

  In addition, since the light emitting element 20g emits light having a longer wavelength than the light emitting elements 20c, 20b1, and 20b2, the light emitting element 20g may be provided between the light emitting elements 20y and 20o and the light emitting elements 20c, 20b1, and 20b2. it can. In this case, it is more preferable to provide the light emitting element 20g between the light emitting element 20r and the light emitting elements 20c, 20b1, and 20b2. In this way, since the distance between the light emitting elements 20y and 20o and the light emitting elements 20c, 20b1, and 20b2 can be further increased, the occurrence of unintended fluorescence in the light emitting elements 20y and 20o is further suppressed. be able to.

In addition, when the area of the light emitting surface 40a of the sealing portion 40 (the light emitting area of the light emitting device 1) is S1, and the total area of the light emitting elements 20y to 20b2 is S2, S2 / S1 is less than 0.2. By doing so, since the distance between the light emitting elements 20y to 20b2 becomes long, it becomes easy to suppress the occurrence of unintended fluorescence in the light emitting elements 20y and 20o.
However, if S2 / S1 is less than 0.2, the distance between the light emitting elements 20y to 20b2 becomes too long, and a larger light emitting area is required to obtain the same amount of light.

On the other hand, when S2 / S1 exceeds 0.3, the distance between the light emitting elements 20y to 20b2 becomes too short, and unintended fluorescence easily occurs in the light emitting elements 20y and 20o.
Therefore, it is preferable that S2 / S1 be 0.2 or more and 0.3 or less.

Furthermore, there is a problem that it is difficult to mix colors depending on the color of light.
Therefore, if a plurality of types of light emitting elements having different colors of emitted light are simply provided in a distributed manner, optical characteristics such as color unevenness and brightness unevenness may be deteriorated.
According to the knowledge obtained by the present inventors, color mixing can be facilitated by shortening the distance between the light emitting elements in which the difference in color of emitted light becomes large.
For example, color mixing can be facilitated by providing adjacent light emitting elements that increase the color difference of emitted light.

In this case, the light color difference can be obtained from the distance on the u′v ′ chromaticity diagram.
Therefore, when arranging a plurality of types of light emitting elements having different colors of emitted light, a distance is obtained for each color of light using the u′v ′ chromaticity diagram, and light emitting elements having longer distances are provided adjacent to each other. What should I do?

In this case, among the colors of light emitted from the light emitting elements 20y to 20b2, those having the longest distance on the u′v ′ chromaticity diagram are red light and green light.
Therefore, as can be seen from FIG. 1, the light emitting element 20g is provided adjacent to the light emitting element 20r as much as possible.
In the u′v ′ chromaticity diagram, the next longest distances are green light and blue light.
Therefore, as can be seen from FIG. 1, the light emitting element 20g is provided as close as possible to the light emitting elements 20c, 20b1, and 20b2.
In this case, as can be seen from FIG. 1, the light emitting element 20g can be provided between the light emitting element 20r and the light emitting elements 20c, 20b1, and 20b2.

  As described above, the light emitting elements 20c, 20b1, and 20b2 are provided on the center side of the region where the light emitting elements are provided, and the light emitting element 20r is provided on the peripheral side of the region where the light emitting elements are provided. Therefore, as can be seen from FIG. 1, the light emitting elements 20c, 20b1, 20b2, the light emitting element 20g, and the light emitting element 20r are arranged in this order from the center side to the peripheral side of the region where the light emitting elements are provided. be able to.

  The frame part 30 has a frame shape. The frame portion 30 is provided on the surface of the substrate 10 on which the light emitting elements 20y to 20b2 are provided. The frame part 30 is provided so as to surround the light emitting elements 20y to 20b2. The frame portion 30 can be formed of, for example, a resin such as PBT (polybutylene terephthalate) or PC (polycarbonate), ceramics, or the like.

Moreover, when the material of the frame part 30 is resin, particles made of titanium oxide or the like can be mixed to improve the reflectance with respect to the light irradiated from the light emitting elements 20y to 20b2. Note that the particles are not limited to titanium oxide particles, and particles made of a material having a high reflectance with respect to light emitted from the light emitting elements 20y to 20b2 may be mixed. Moreover, the frame part 30 can also be formed from white resin, for example. That is, the frame part 30 can have both the function of defining the region where the sealing part 40 is formed and the function of the reflector. In addition, the shape of the frame part 30 is not necessarily limited to what was illustrated, and can be changed suitably.
Moreover, the frame part 30 is not necessarily required and can be omitted. In addition, when the frame part 30 is not provided, the shape of the sealing part 40 can be made into a dome shape etc., for example.

  The sealing part 40 is provided inside the frame part 30. When the light emission surface 40 a of the sealing portion 40 is a flat surface, the height of the sealing portion 40 is preferably lower than the height of the frame portion 30. If it does in this way, when supplying resin mentioned below, it can control that resin overflows to the outside of frame part 30. The sealing part 40 is provided so as to cover the light emitting elements 20y to 20b2. When the light emission surface 40a of the sealing portion 40 is a flat surface, the height of the sealing portion 40 is, for example, about 2 to 5 times the thickness of the light emitting elements 20y to 20b2. it can. The thickness dimension of the light emitting elements 20y to 20b2 can be about 0.1 mm.

  Moreover, the light emission surface 40a of the sealing portion 40 may be, for example, a dome-shaped curved surface.

Further, the sealing portion 40 can be provided with a diffusion portion 40b.
The diffusion unit 40b diffuses the light emitted from the light emitting elements 20y to 20b2.
The diffusing portion 40b can be, for example, fine irregularities provided on the light emitting surface 40a. There are no particular limitations on the size and shape of the irregularities, as long as the light incident on the diffusion portion 40b is diffused.
The unevenness can be provided in the entire region of the light emitting surface 40a or in a predetermined region. The density of the unevenness may be constant or may be partially different.

  The unevenness is formed, for example, by performing blasting or chemical treatment on the light emitting surface 40a of the sealing portion 40, or pressing the mold material against the light emitting surface 40a when forming the sealing portion 40. Can do.

  Further, as the diffusing portion 40b, a layer containing a diffusing material (for example, particles such as silicon oxide) may be provided on the sealing portion 40 or on the light emitting surface 40a side of the sealing portion 40. However, when a layer including a diffusing material is provided, the light extraction efficiency may be deteriorated. Therefore, it is more preferable that the diffusing portion 40b has fine unevenness provided on the light emission surface 40a.

  If the diffusing portion 40b is provided, the light emitted from the light emitting elements 20y to 20b2 can be diffused, so that the occurrence of color unevenness can be further suppressed. Moreover, it can further suppress that ring-shaped light is irradiated to an irradiation surface, or the area of an irradiation surface becomes narrow.

The sealing part 40 is formed from a material having translucency. The sealing part 40 can be formed from transparent resins, such as silicone resin, for example. In this case, it is preferable to form the sealing part 40 from methyl silicone resin. This is because methyl silicone resin has heat resistance and flexibility. In this case, the hardness of the methyl silicone resin is preferably about Shore A20 to A40.
The sealing part 40 can be formed by supplying resin inside the frame part 30, for example. For example, the resin can be supplied using a liquid dispensing apparatus such as a dispenser.

(Method for manufacturing light-emitting device 1)
Next, a method for manufacturing the light emitting device 1 will be illustrated.
First, the light emitting elements 20 y to 20 b 2 are mounted on the substrate 10 having the wiring pattern 12. At this time, the arrangement of the light emitting elements 20y to 20b2 is set to be as described above. In addition, since a known technique can be applied to mounting of the light emitting elements 20y to 20b2, detailed description thereof is omitted.
Next, the frame part 30 is provided so that the light emitting elements 20y-20b2 may be enclosed. In this case, the frame-shaped frame portion 30 may be bonded to the substrate 10, or a resin may be applied to the substrate 10 in a frame shape and cured.

Next, a resin having translucency is supplied inside the frame portion 30 to form the sealing portion 40.
For example, the resin can be supplied using a liquid dispensing apparatus such as a dispenser. At this time, the shape of the light emission surface 40a of the sealing portion 40 is controlled by adjusting the viscosity of the resin to be supplied. For example, by supplying a resin having a low viscosity, the light emission surface 40a of the sealing portion 40 is made flat. For example, by supplying a resin having a high viscosity, the light emission surface 40a of the sealing portion 40 is formed into a dome-shaped curved surface. Note that the viscosity of the resin to be supplied can be determined, for example, by conducting experiments or simulations in advance.
Further, the diffusing portion 40b is formed by performing blasting or chemical treatment on the light emitting surface 40a of the sealing portion 40, or pressing the mold material against the light emitting surface 40a when forming the sealing portion 40. .

Next, if necessary, a heat spreader is provided on the surface of the substrate 10 opposite to the side on which the light emitting elements 20y to 20b2 are provided.
The light emitting device 1 can be manufactured as described above.

(Lighting device)
Next, the illumination device 100 according to the present embodiment is illustrated.
FIG. 3 is a schematic cross-sectional view for illustrating the lighting device 100 according to the present embodiment.
The lighting device 100 illustrated in FIG. 3 is a projector that is installed in a building, a stadium, or the like. In addition, the illuminating device 100 which concerns on this Embodiment is not necessarily limited to a projector. The illuminating device 100 should just be what can irradiate full color light.
As illustrated in FIG. 3, the illumination device 100 includes an irradiation unit 110 and a light source unit 120.

The irradiation unit 110 includes a housing 111 and a reflector 112.
The casing 111 has a box shape. The casing 111 can be formed from, for example, an aluminum alloy. The end of the housing 111 opposite to the light source 120 side is open. This opening is closed by a translucent cover (not shown). A hole 111 a is provided at the end of the housing 111 on the light source unit 120 side.

  The reflector 112 is provided inside the housing 111. A flange 112a that protrudes outward is provided at the end of the reflector 112 opposite to the light source 120 side. The flange 112 a is fixed to a mounting plate (not shown) provided on the inner wall of the housing 111.

  The reflector 112 can be a cylindrical body having both ends opened. The reflector 112 has a form in which the cross-sectional dimension gradually decreases toward the light source unit 120 side. The inner surface of the reflector 112 is a mirror surface. The end of the reflector 112 on the light source unit 120 side is provided inside the hole 111a. The end of the reflector 112 on the light source unit 120 side is provided at a position facing the light emitting device 1. For example, a hemispherical lens may be arranged on the light emission side of the light emitting device 1. Further, the light exit surface of the lens can be subjected to a diffusion treatment or a diffusion sheet can be attached. If the diffusion treatment is performed or a diffusion sheet is attached, the light emitted from the light emitting elements 20y to 20b2 can be diffused, so that the occurrence of color unevenness can be further suppressed.

The light source unit 120 includes the light emitting device 1, the housing 121, the mounting unit 122, the heat radiating unit 123, the packing 124, the heat radiating fins 125, and the heat pipe 126.
The housing 121 has a box shape. The housing 121 can be formed from, for example, an aluminum alloy. A hole is provided at the end of the housing 121 on the irradiation unit 110 side. Inside the hole portion, the light emitting device 1 attached to the attachment portion 122 is provided. That is, the light emitting device 1 is housed in the housing 121.

  The attachment portion 122 has a plate shape. The attachment portion 122 can be formed from, for example, an aluminum alloy. The attachment portion 122 is attached to the heat dissipation portion 123 using a fastening member such as a screw. A concave portion is provided on the end surface of the mounting portion 122 on the irradiation unit 110 side. The light emitting device 1 is attached inside the recess.

The heat dissipation part 123 has a plate shape. The heat dissipation part 123 can be formed from, for example, an aluminum alloy. The heat radiating part 123 is attached to the inside of the housing 121 using a fastening member such as a screw (not shown).
The packing 124 has an annular shape. The packing 124 is provided between the heat radiating portion 123 and the inner wall surface of the housing 121.

  The radiation fin 125 has a thin plate shape. A plurality of radiating fins 125 are provided. The heat radiation fins 125 can be formed from, for example, an aluminum alloy. The heat radiating fins 125 are provided on the surface of the heat radiating portion 123 opposite to the side on which the mounting portion 122 is provided.

The heat pipe 126 is provided between the heat radiating part 123 and the heat radiating fins 125. A plurality of heat pipes 126 can be provided.
In addition, a control device (not shown) for controlling the light emitting device 1 can be provided. For example, the control device controls lighting and extinguishing for each of the light emitting elements 20y to 20b2. Moreover, a control apparatus controls the electric power supplied for every light emitting element 20y-20b2, and controls the light emission output for every light emitting element 20y-20b2.

In addition, the light source unit 120 may further include a diffusion unit 127.
The diffusion part 127 can be a plate-like body formed from, for example, glass or transparent resin. The diffusion part 127 may have fine irregularities on the surface. There is no particular limitation on the size and shape of the unevenness, and it is only necessary that the light incident on the diffusion unit 127 (light emitted from the light emitting device 1) is diffused.
Further, the unevenness can be provided in the entire region of the plate-like body or in a predetermined region. The density of the unevenness may be constant or may be partially different.

  The unevenness can be formed, for example, by subjecting the surface of the plate-like body to blasting or chemical treatment, or pressing the mold material against the surface of the plate-like body when forming the plate-like body.

  In addition, the diffusion unit 127 can be a plate-like body including a diffusion material (for example, particles such as silicon oxide), for example. However, if the plate-like body includes a diffusing material, the light extraction efficiency may be deteriorated. Therefore, it is more preferable that the diffusing portion 127 is a plate-like body having fine irregularities on the surface.

  If the diffusing portion 127 is provided, the light emitted from the light emitting elements 20y to 20b2 can be diffused, so that the occurrence of color unevenness can be further suppressed. Moreover, it can further suppress that ring-shaped light is irradiated to an irradiation surface, or the area of an irradiation surface becomes narrow.

  Note that at least one of the diffusion unit 40b and the diffusion unit 127 described above can be provided. In this case, in consideration of light extraction efficiency, it is preferable that either the diffusion unit 40b or the diffusion unit 127 is provided.

  As mentioned above, although several embodiment of this invention was illustrated, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof. Further, the above-described embodiments can be implemented in combination with each other.

  DESCRIPTION OF SYMBOLS 1 Light-emitting device, 10 board | substrate, 11 base | substrate, 12 wiring pattern, 12a mounting pad, 12b wiring part, 12c conductive via, 12d input terminal, 20y-20b2 light emitting element, 30 frame part, 40 sealing part, 40a Light emission surface 40b Diffusion unit, 100 Illumination device, 110 Irradiation unit, 111 Housing, 120 Light source unit, 127 Diffusion unit

Claims (5)

A light emitting device capable of emitting light of four or more colors including two or more primary colors,
A first light emitting element that emits light of a first color;
Second light emission that is provided adjacent to the first light emitting element and emits light of a second color that has the longest distance from the first color on the u′v ′ chromaticity diagram. With elements;
A diffusing unit that diffuses the first color light emitted from the first light emitting element and the second color light emitted from the second light emitting element;
A light emitting device comprising: The first color is red;
The light emitting device according to claim 1, wherein the second color is blue or green. The first color is green;
The light emitting device according to claim 1, wherein the second color is blue.   The light emitting device according to claim 2 or 3, wherein the number of the first light emitting elements is larger than the number of the second light emitting elements. A light emitting device according to any one of claims 1 to 4;
A housing for storing the light emitting device;
A lighting device comprising: