JP2017174642A - Press-fit terminal - Google Patents

Press-fit terminal Download PDF

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JP2017174642A
JP2017174642A JP2016059695A JP2016059695A JP2017174642A JP 2017174642 A JP2017174642 A JP 2017174642A JP 2016059695 A JP2016059695 A JP 2016059695A JP 2016059695 A JP2016059695 A JP 2016059695A JP 2017174642 A JP2017174642 A JP 2017174642A
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hole
press
peripheral surface
inner peripheral
fit terminal
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智之 堀江
Tomoyuki Horie
智之 堀江
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Yazaki Corp
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Yazaki Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a press-fit terminal capable of efficiently removing a formed film formed on the inner peripheral surface of a through hole and suppressing the influence on a substrate.SOLUTION: In a press-fit terminal 1 including: an insertion portion 9 which is provided in a substrate 3 and is inserted into a through hole 7 in which a generation film 5 is formed on the inner peripheral surface; and a bulging portion 11 provided in the insertion portion 9 and brought into close contact with the inner peripheral surface of the through hole 7, a communication hole 13 communicating the inside and the outside of the insertion portion 9 and a housing part 15, provided inside the insertion portion 9, housing the generated film 5 which has passed through the communication hole 13 are provided in the insertion portion 9.SELECTED DRAWING: Figure 4

Description

本発明は、プレスフィット端子に関する。詳細には、基板のスルーホールの内周面に密着して挿通されるプレスフィット端子に関する。   The present invention relates to a press-fit terminal. Specifically, the present invention relates to a press-fit terminal that is inserted in close contact with an inner peripheral surface of a through hole of a substrate.

従来、プレスフィット端子としては、基板に設けられたスルーホールに挿通される挿通部としての圧入ピンと、この圧入ピンに設けられスルーホールの内周面に密着して接触された膨出部としてのキーとを備えたものが知られている(例えば、特許文献1参照)。   Conventionally, as a press-fit terminal, a press-fit pin as an insertion portion that is inserted into a through-hole provided in a substrate, and a bulge portion that is provided in this press-fit pin and is in close contact with the inner peripheral surface of the through-hole A device including a key is known (for example, see Patent Document 1).

ところで、近年、プレスフィット端子が接続される基板には、スルーホールに位置する導体部である銅などからなるめっきの酸化防止や半田付け性向上などのために、例えば、水溶性プレフラックス(OSP)による表面処理によってOSP膜などのような生成膜が表面に形成されている。   By the way, in recent years, for example, a water-soluble preflux (OSP) is used on a substrate to which a press-fit terminal is connected in order to prevent oxidation of plating made of copper or the like, which is a conductor portion located in a through hole, and to improve solderability. As a result of the surface treatment, a generated film such as an OSP film is formed on the surface.

このような生成膜が形成された基板には、スルーホールにプレスフィット端子の圧入ピンが挿通される際に、圧入ピンに設けられたキーがスルーホールの内周面と密着して摺動するように圧入され、スルーホールの内周面に形成された生成膜が除去され、スルーホールの内周面の新生面と圧入ピンのキーとを接触して金属同士の凝着を行うことができる。   When the press-fit pin of the press-fit terminal is inserted into the through-hole, the key provided on the press-fit pin slides in close contact with the inner peripheral surface of the through-hole on the substrate on which such a generated film is formed. Thus, the generated film formed on the inner peripheral surface of the through hole is removed, and the newly formed surface on the inner peripheral surface of the through hole and the key of the press-fit pin can be brought into contact with each other to perform adhesion between metals.

特開2007−250549号公報JP 2007-250549 A

しかしながら、上記特許文献1のようなプレスフィット端子では、膨出部とスルーホールの内周面との摺動によってある程度の生成膜を除去することができるが、除去された生成膜が膨出部の挿入方向の前方側に堆積されたり、除去しきれない生成膜が膨出部とスルーホールの内周面との間に介在してしまい、接触抵抗が増大してしまう恐れがあった。   However, in the press-fit terminal as in Patent Document 1, a certain amount of the generated film can be removed by sliding between the bulging portion and the inner peripheral surface of the through hole. There is a possibility that a generated film that is deposited on the front side in the insertion direction or cannot be removed is interposed between the bulging portion and the inner peripheral surface of the through hole, thereby increasing the contact resistance.

これに対して膨出部とスルーホールの内周面との接触荷重を高く設定し、スルーホールの内周面に形成された生成膜の除去率を上げることが考えられるが、接触荷重を高くし過ぎてしまうと、基板の導通部であるめっきを剥がしてしまう恐れがあった。   On the other hand, it is conceivable to increase the contact load between the bulge and the inner peripheral surface of the through hole to increase the removal rate of the formed film formed on the inner peripheral surface of the through hole. If it is too much, the plating which is the conductive part of the substrate may be peeled off.

そこで、この発明は、スルーホールの内周面に形成された生成膜を効率的に除去し、基板への影響を抑制することができるプレスフィット端子の提供を目的としている。   Accordingly, an object of the present invention is to provide a press-fit terminal capable of efficiently removing a generated film formed on the inner peripheral surface of a through hole and suppressing an influence on a substrate.

請求項1記載の発明は、基板に設けられ内周面に生成膜が形成されたスルーホールに挿通される挿通部と、この挿通部に設けられ前記スルーホールの内周面に密着して接触された膨出部とを備えたプレスフィット端子であって、前記挿通部には、前記挿通部の内部と外部とを連通した連通孔と、前記挿通部の内部に設けられ前記連通孔を通過した前記生成膜を収容する収容部とが設けられていることを特徴とする。   According to the first aspect of the present invention, there is provided an insertion portion that is provided on the substrate and is inserted into a through hole in which a generated film is formed on an inner peripheral surface, and an inner peripheral surface of the through hole that is provided in the insertion portion and is in close contact with the through hole A press-fit terminal provided with a bulging portion, wherein the insertion portion has a communication hole communicating with the inside and the outside of the insertion portion, and is provided inside the insertion portion and passes through the communication hole. And an accommodating portion for accommodating the generated film.

このプレスフィット端子では、挿通部に、挿通部の内部と外部とを連通した連通孔と、挿通部の内部に設けられ連通孔を通過した生成膜を収容する収容部とが設けられているので、膨出部とスルーホールの内周面との摺動によってスルーホールの内周面から除去された生成膜が堆積することがない。   In this press-fit terminal, the insertion portion is provided with a communication hole that communicates the inside and the outside of the insertion portion, and a housing portion that is provided inside the insertion portion and accommodates the generated film that has passed through the communication hole. The generated film removed from the inner peripheral surface of the through hole is not deposited by sliding between the bulging portion and the inner peripheral surface of the through hole.

このため、膨出部とスルーホールの内周面との摺動によってスルーホールの内周面に形成された生成膜を効率的に除去することができ、膨出部とスルーホールの内周面の新生面との接触面積を十分に確保することができ、膨出部とスルーホールとの金属同士の凝着を安定して行うことができる。   For this reason, the generated film formed on the inner peripheral surface of the through hole by sliding between the bulged portion and the inner peripheral surface of the through hole can be efficiently removed, and the inner peripheral surface of the bulged portion and the through hole A sufficient contact area with the new surface can be ensured, and adhesion of the metal between the bulging portion and the through hole can be performed stably.

加えて、スルーホールの内周面に形成された生成膜を効率的に除去することができるので、膨出部とスルーホールの内周面との接触荷重を高くし過ぎることがなく、基板の導通部であるめっきを剥がすなど、基板への影響を抑制することができる。   In addition, since the generated film formed on the inner peripheral surface of the through hole can be efficiently removed, the contact load between the bulging portion and the inner peripheral surface of the through hole is not excessively increased, and the substrate The influence on the substrate can be suppressed, for example, by removing the plating that is the conductive portion.

従って、このようなプレスフィット端子では、挿通部に連通孔と収容部とを設けることにより、スルーホールの内周面に形成された生成膜を効率的に除去し、基板への影響を抑制することができる。   Accordingly, in such a press-fit terminal, by providing the insertion hole with the communication hole and the accommodating portion, the generated film formed on the inner peripheral surface of the through hole is efficiently removed, and the influence on the substrate is suppressed. be able to.

請求項2記載の発明は、請求項1記載のプレスフィット端子であって、前記連通孔は、前記挿通部の前記スルーホールの挿入方向に対して前記膨出部より前側に配置されていることを特徴とする。   Invention of Claim 2 is the press fit terminal of Claim 1, Comprising: The said communicating hole is arrange | positioned ahead of the said bulging part with respect to the insertion direction of the said through hole of the said insertion part. It is characterized by.

このプレスフィット端子では、連通孔が、挿通部のスルーホールの挿入方向に対して膨出部より前側に配置されているので、膨出部の挿入方向の前方側に堆積しようとする生成膜を効率よく、連通孔を介して収容部に導くことができ、スルーホールの内周面に形成された生成膜をさらに効率的に除去することができる。   In this press-fit terminal, since the communication hole is arranged in front of the bulging portion with respect to the insertion direction of the through hole of the insertion portion, the generated film to be deposited on the front side in the insertion direction of the bulging portion is formed. It can be efficiently guided to the accommodating portion through the communication hole, and the generated film formed on the inner peripheral surface of the through hole can be more efficiently removed.

本発明によれば、スルーホールの内周面に形成された生成膜を効率的に除去し、基板への影響を抑制することができるプレスフィット端子を提供することができるという効果を奏する。   According to the present invention, there is an effect that it is possible to provide a press-fit terminal that can efficiently remove the generated film formed on the inner peripheral surface of the through hole and suppress the influence on the substrate.

本発明の実施の形態に係るプレスフィット端子の斜視図である。It is a perspective view of a press fit terminal concerning an embodiment of the invention. 本発明の実施の形態に係るプレスフィット端子が接続される基板の断面図である。It is sectional drawing of the board | substrate with which the press fit terminal which concerns on embodiment of this invention is connected. 本発明の実施の形態に係るプレスフィット端子を基板に接続するときの断面図である。It is sectional drawing when connecting the press fit terminal which concerns on embodiment of this invention to a board | substrate. 本発明の実施の形態に係るプレスフィット端子を基板に接続したときの断面図である。It is sectional drawing when the press fit terminal which concerns on embodiment of this invention is connected to the board | substrate. 本発明の実施の形態に係るプレスフィット端子の他例を示す斜視図である。It is a perspective view which shows the other example of the press fit terminal which concerns on embodiment of this invention.

図1〜図5を用いて本発明の実施の形態に係るプレスフィット端子について説明する。   A press-fit terminal according to an embodiment of the present invention will be described with reference to FIGS.

本実施の形態に係るプレスフィット端子1は、基板3に設けられ内周面に生成膜5が形成されたスルーホール7に挿通される挿通部9と、この挿通部9に設けられスルーホール7の内周面に密着して接触された膨出部11とを備えている。   The press-fit terminal 1 according to the present embodiment includes an insertion portion 9 that is provided in the substrate 3 and is inserted into a through hole 7 in which a generation film 5 is formed on an inner peripheral surface, and a through hole 7 that is provided in the insertion portion 9. And a bulging portion 11 in close contact with and in contact with the inner peripheral surface.

そして、挿通部9には、挿通部9の内部と外部とを連通した連通孔13と、挿通部9の内部に設けられ連通孔13を通過した生成膜5を収容する収容部15とが設けられている。   The insertion portion 9 is provided with a communication hole 13 that communicates the inside and the outside of the insertion portion 9 and a storage portion 15 that is provided inside the insertion portion 9 and that accommodates the generated film 5 that has passed through the communication hole 13. It has been.

また、連通孔13は、挿通部9のスルーホール7の挿入方向に対して膨出部11より前側に配置されている。   The communication hole 13 is disposed on the front side of the bulging portion 11 with respect to the insertion direction of the through hole 7 of the insertion portion 9.

図1〜図4に示すように、基板3は、複数の電子部品(不図示)などが搭載され、各電子部品を電気的に接続する回路を構成する導通部が、銅などの導電性材料によりめっき17として形成されたプリント配線基板からなる。   As shown in FIGS. 1 to 4, the substrate 3 has a plurality of electronic components (not shown) and the like, and a conductive portion that constitutes a circuit that electrically connects the electronic components is a conductive material such as copper. It consists of a printed wiring board formed as plating 17.

この基板3は、めっき17の酸化防止、或いは本実施の形態においては行わないが、基板3に接続されるプレスフィット端子1などの接続部材を固定するための半田付け性を向上させるために、水溶性プレフラックス(OSP)によって表面処理が施され、表面に生成膜5としてのOSP膜が形成されている。   In order to improve the solderability for fixing the connection member such as the press-fit terminal 1 connected to the substrate 3, this substrate 3 is not subjected to oxidation prevention of the plating 17 or in the present embodiment. A surface treatment is performed by water-soluble preflux (OSP), and an OSP film as the generation film 5 is formed on the surface.

このような基板3には、導通部であるめっき17の部分に、基板3を厚さ方向に貫通するようにスルーホール7が設けられ、このスルーホール7にプレスフィット端子1を挿入することによって、基板3とプレスフィット端子1とが電気的に接続される。   In such a substrate 3, a through hole 7 is provided so as to penetrate the substrate 3 in the thickness direction in a portion of the plating 17 that is a conductive portion, and the press-fit terminal 1 is inserted into the through hole 7. The substrate 3 and the press-fit terminal 1 are electrically connected.

プレスフィット端子1は、銅などの導電性材料からなり、一端側が電源や機器などに電気的に接続され、他端側に基板3に接続される挿通部9が設けられている。   The press-fit terminal 1 is made of a conductive material such as copper, and is provided with an insertion portion 9 that is electrically connected at one end side to a power source or equipment and connected to the substrate 3 at the other end side.

挿通部9は、基板3のスルーホール7内を挿通可能に設けられ、基板3の一面側から他側面側に向けてスルーホール7内に挿入される。この挿通部9には、膨出部11が設けられている。   The insertion portion 9 is provided so as to be able to pass through the through hole 7 of the substrate 3 and is inserted into the through hole 7 from one side of the substrate 3 toward the other side. The insertion portion 9 is provided with a bulging portion 11.

膨出部11は、スルーホール7の内径より僅かに大きな外径に設定され、スルーホール7に挿通部9を挿入したときに、スルーホール7の内周面と密着しながら摺動するようにスルーホール7内に圧入される。   The bulging portion 11 is set to have an outer diameter slightly larger than the inner diameter of the through hole 7, and slides in close contact with the inner peripheral surface of the through hole 7 when the insertion portion 9 is inserted into the through hole 7. It is press-fitted into the through hole 7.

このように膨出部11をスルーホール7に圧入することにより、半田付けを行うことなく、基板3にプレスフィット端子1を固定することができると共に、膨出部11とスルーホール7の内周面とを密着して接触させ、基板3とプレスフィット端子1との接続信頼性を保持することができる。   By press-fitting the bulging portion 11 into the through hole 7 in this way, the press-fit terminal 1 can be fixed to the substrate 3 without performing soldering, and the inner periphery of the bulging portion 11 and the through hole 7 can be fixed. The surface can be brought into close contact with each other, and the connection reliability between the substrate 3 and the press-fit terminal 1 can be maintained.

ここで、膨出部11をスルーホール7に圧入する際に、膨出部11とスルーホール7の内周面との摺動によって、スルーホール7の内周面に位置するめっき17の表面に形成された生成膜5を除去することができる。   Here, when the bulging portion 11 is press-fitted into the through hole 7, the sliding between the bulging portion 11 and the inner peripheral surface of the through hole 7 causes the surface of the plating 17 located on the inner peripheral surface of the through hole 7 to slide. The formed production film 5 can be removed.

しかしながら、めっき17の表面から剥がされた生成膜5は、膨出部11の挿入方向の前方側に堆積したり、堆積量が増えてしまうと、膨出部11の挿入方向の後方側に生成膜5が残存してしまい、膨出部11とスルーホール7の内周面(めっき17)との間に生成膜5が介在し、接触抵抗の増加や基板3に対するプレスフィット端子1の保持力の低下を引き起こす恐れがあった。   However, the generated film 5 peeled off from the surface of the plating 17 is deposited on the front side in the insertion direction of the bulging portion 11 or is generated on the rear side in the insertion direction of the bulging portion 11 when the amount of deposition increases. The film 5 remains, and the generated film 5 is interposed between the bulging portion 11 and the inner peripheral surface (plating 17) of the through hole 7 to increase the contact resistance and the holding force of the press-fit terminal 1 against the substrate 3. There was a risk of causing a decline.

そこで、挿通部9には、挿通部9の内部と外部とを連通した連通孔13と、挿通部9の内部に設けられ連通孔13を通過した生成膜5を収容する収容部15とが設けられている。   Therefore, the insertion portion 9 is provided with a communication hole 13 that communicates the inside and the outside of the insertion portion 9 and a housing portion 15 that is provided inside the insertion portion 9 and accommodates the generated film 5 that has passed through the communication hole 13. It has been.

連通孔13は、挿通部9のスルーホール7の挿入方向に対して膨出部11より前側に複数配置され、膨出部11を設けることによって形成された挿通部9の内部空間と外部とを連通している。   A plurality of communication holes 13 are arranged in front of the bulging portion 11 with respect to the insertion direction of the through hole 7 of the insertion portion 9, and the internal space of the insertion portion 9 formed by providing the bulging portion 11 and the outside are provided. Communicate.

収容部15は、膨出部11を設けることによって形成された挿通部9の内部空間となっており、複数の連通孔13を介して外部に連通されている。   The accommodating portion 15 is an internal space of the insertion portion 9 formed by providing the bulging portion 11, and is communicated to the outside through a plurality of communication holes 13.

このような連通孔13と収容部15とには、膨出部11とスルーホール7の内周面との摺動によって、スルーホール7の内周面に位置するめっき17の表面に形成された生成膜5が剥がされ、この剥がされた生成膜5が連通孔13を介して収容部15内に収容される。   The communication hole 13 and the accommodating portion 15 are formed on the surface of the plating 17 located on the inner peripheral surface of the through hole 7 by sliding between the bulging portion 11 and the inner peripheral surface of the through hole 7. The generated film 5 is peeled off, and the peeled generated film 5 is accommodated in the accommodating portion 15 through the communication hole 13.

このように剥がされた生成膜5を連通孔13と収容部15とに収容することにより、膨出部11の挿入方向の前方側に剥がされた生成膜5が堆積することがないと共に、堆積量も増えることがなく、膨出部11の挿入方向の後方側に生成膜5が残存することを抑制することができる。   By accommodating the peeled production film 5 in the communication hole 13 and the accommodation portion 15, the production film 5 peeled off is not deposited on the front side in the insertion direction of the bulging portion 11. The amount does not increase, and the generation film 5 can be prevented from remaining on the rear side in the insertion direction of the bulging portion 11.

このため、膨出部11とスルーホール7の内周面との摺動によって、スルーホール7の内周面に形成された生成膜5を効率的に除去することができ、スルーホール7の内周面に位置するめっき17の表面である新生面の接触面積を十分に確保することができ、膨出部11とめっき17との金属同士の凝着を安定して行い、基板3とプレスフィット端子1との接続信頼性を向上することができる。   Therefore, the generated film 5 formed on the inner peripheral surface of the through hole 7 can be efficiently removed by sliding between the bulging portion 11 and the inner peripheral surface of the through hole 7. The contact area of the new surface, which is the surface of the plating 17 located on the peripheral surface, can be sufficiently secured, and the metal adhesion between the bulging portion 11 and the plating 17 is stably performed, and the substrate 3 and the press-fit terminal The connection reliability with 1 can be improved.

加えて、スルーホール7の内周面に形成された生成膜5を効率的に除去することができるので、膨出部11とスルーホール7の内周面との接触荷重を必要以上に高くし過ぎることがなく、膨出部11の圧入において、スルーホール7内のめっき17を剥がすなど、プレスフィット端子1の接続における基板3への影響を抑制することができる。   In addition, since the generated film 5 formed on the inner peripheral surface of the through hole 7 can be efficiently removed, the contact load between the bulging portion 11 and the inner peripheral surface of the through hole 7 is increased more than necessary. Therefore, the influence on the substrate 3 in the connection of the press-fit terminal 1 can be suppressed, such as peeling off the plating 17 in the through-hole 7 in the press-fitting of the bulging portion 11.

なお、剥がされた生成膜5であるOSPは、金属粉などと異なり、絶縁物であるので、連通孔13や収容部15に収容された状態のままにしておいてもよいが、エアブローなどによって除去してもよい。   In addition, since the OSP which is the peeled product film 5 is an insulator, unlike the metal powder or the like, it may be left in the state of being accommodated in the communication hole 13 or the accommodating portion 15, but may be left by air blow or the like. It may be removed.

ここで、挿通部9や膨出部11は、図5に示すように、挿通部9aの長さ方向に沿ってスリット19を設け、膨出部11aを球状に形成させてもよい。   Here, as shown in FIG. 5, the insertion part 9 and the bulging part 11 may be provided with a slit 19 along the length direction of the insertion part 9a to form the bulging part 11a in a spherical shape.

このような挿通部9aにおいても、挿通部9aのスルーホール7の挿入方向に対して膨出部11aより前側に複数の連通孔13を設け、挿通部9aの内部に複数の連通孔13と連通する収容部15を設ければよい。   Also in such an insertion part 9a, a plurality of communication holes 13 are provided in front of the bulging part 11a in the insertion direction of the through hole 7 of the insertion part 9a, and the plurality of communication holes 13 communicate with the inside of the insertion part 9a. What is necessary is just to provide the accommodating part 15 to perform.

このようなプレスフィット端子1では、挿通部9に、挿通部9の内部と外部とを連通した連通孔13と、挿通部9の内部に設けられ連通孔13を通過した生成膜5を収容する収容部15とが設けられているので、膨出部11とスルーホール7の内周面との摺動によってスルーホール7の内周面から除去された生成膜5が堆積することがない。   In such a press-fit terminal 1, the insertion portion 9 accommodates the communication hole 13 that connects the inside and the outside of the insertion portion 9 and the generated film 5 that is provided inside the insertion portion 9 and passes through the communication hole 13. Since the accommodating portion 15 is provided, the generated film 5 removed from the inner peripheral surface of the through hole 7 due to sliding between the bulging portion 11 and the inner peripheral surface of the through hole 7 is not deposited.

このため、膨出部11とスルーホール7の内周面との摺動によってスルーホール7の内周面に形成された生成膜5を効率的に除去することができ、膨出部11とスルーホール7の内周面の新生面との接触面積を十分に確保することができ、膨出部11とスルーホール7との金属同士の凝着を安定して行うことができる。   For this reason, the generated film 5 formed on the inner peripheral surface of the through hole 7 can be efficiently removed by sliding between the bulging portion 11 and the inner peripheral surface of the through hole 7. A sufficient contact area between the inner peripheral surface of the hole 7 and the new surface can be ensured, and adhesion of the metal between the bulging portion 11 and the through hole 7 can be performed stably.

加えて、スルーホール7の内周面に形成された生成膜5を効率的に除去することができるので、膨出部11とスルーホール7の内周面との接触荷重を高くし過ぎることがなく、基板3の導通部であるめっき17を剥がすなど、基板3への影響を抑制することができる。   In addition, since the generated film 5 formed on the inner peripheral surface of the through hole 7 can be efficiently removed, the contact load between the bulging portion 11 and the inner peripheral surface of the through hole 7 may be excessively increased. In addition, it is possible to suppress the influence on the substrate 3 such as peeling off the plating 17 which is the conductive portion of the substrate 3.

従って、このようなプレスフィット端子1では、挿通部9に連通孔13と収容部15とを設けることにより、スルーホール7の内周面に形成された生成膜5を効率的に除去し、基板3への影響を抑制することができる。   Therefore, in such a press-fit terminal 1, by providing the insertion hole 9 with the communication hole 13 and the accommodating part 15, the generated film 5 formed on the inner peripheral surface of the through hole 7 can be efficiently removed, and the substrate 3 can be suppressed.

また、連通孔13は、挿通部9のスルーホール7の挿入方向に対して膨出部11より前側に配置されているので、膨出部11の挿入方向の前方側に堆積しようとする生成膜5を効率よく、連通孔13を介して収容部15に導くことができ、スルーホール7の内周面に形成された生成膜5をさらに効率的に除去することができる。   Further, since the communication hole 13 is disposed in front of the bulging portion 11 with respect to the insertion direction of the through hole 7 of the insertion portion 9, the generated film to be deposited on the front side in the insertion direction of the bulging portion 11. 5 can be efficiently guided to the accommodating portion 15 through the communication hole 13, and the generated film 5 formed on the inner peripheral surface of the through hole 7 can be more efficiently removed.

なお、本発明の実施の形態に係るプレスフィット端子では、連通孔が複数設けられているが、これに限らず、連通孔は1つであってもよいが、膨出部とスルーホールとの接触領域の全域に均一に連通孔を複数設けることが好ましい。   In the press-fit terminal according to the embodiment of the present invention, a plurality of communication holes are provided. However, the present invention is not limited to this, and the number of communication holes may be one. It is preferable to provide a plurality of communication holes uniformly over the entire contact area.

また、連通孔の開口は、円形となっているが、これに限らず、三角や菱形などの角形であってもよい。   Moreover, although the opening of the communication hole is circular, it is not limited to this and may be a square such as a triangle or a rhombus.

1…プレスフィット端子
3…基板
5…生成膜
7…スルーホール
9,9a…挿通部
11,11a…膨出部
13…連通孔
15…収容部
DESCRIPTION OF SYMBOLS 1 ... Press fit terminal 3 ... Board | substrate 5 ... Generated film 7 ... Through-hole 9, 9a ... Insertion part 11, 11a ... Expansion part 13 ... Communication hole 15 ... Accommodating part

Claims (2)

基板に設けられ内周面に生成膜が形成されたスルーホールに挿通される挿通部と、この挿通部に設けられ前記スルーホールの内周面に密着して接触された膨出部とを備えたプレスフィット端子であって、
前記挿通部には、前記挿通部の内部と外部とを連通した連通孔と、前記挿通部の内部に設けられ前記連通孔を通過した前記生成膜を収容する収容部とが設けられていることを特徴とするプレスフィット端子。
An insertion portion provided in the substrate and inserted into a through hole having a generated film formed on an inner peripheral surface thereof, and a bulging portion provided in the insertion portion and in close contact with and contacted with the inner peripheral surface of the through hole. Press-fit terminals,
The insertion portion is provided with a communication hole that communicates the inside and the outside of the insertion portion, and a storage portion that is provided inside the insertion portion and that stores the generated film that has passed through the communication hole. A press-fit terminal characterized by
請求項1記載のプレスフィット端子であって、
前記連通孔は、前記挿通部の前記スルーホールの挿入方向に対して前記膨出部より前側に配置されていることを特徴とするプレスフィット端子。
The press-fit terminal according to claim 1,
The press-fit terminal, wherein the communication hole is disposed in front of the bulging portion with respect to the insertion direction of the through hole of the insertion portion.
JP2016059695A 2016-03-24 2016-03-24 Press-fit terminal Abandoned JP2017174642A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020129614A (en) * 2019-02-08 2020-08-27 矢崎総業株式会社 Connection structure for circuit board and terminal, and, terminal
CN112544016A (en) * 2018-07-25 2021-03-23 苏州品翔电通有限公司 Fisheye terminal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121186U (en) * 1983-02-03 1984-08-15 日立電線株式会社 Connection terminal for coaxial cable
JP2006054116A (en) * 2004-08-12 2006-02-23 Tyco Electronics Amp Kk Compliant pin and electric connector using compliant pin
JP2008544450A (en) * 2005-07-08 2008-12-04 ジェイ.エス.ティー.コーポレーション Press-fit pin
JP2013218848A (en) * 2012-04-06 2013-10-24 Daiichi Seiko Co Ltd Connector terminal for press fit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121186U (en) * 1983-02-03 1984-08-15 日立電線株式会社 Connection terminal for coaxial cable
JP2006054116A (en) * 2004-08-12 2006-02-23 Tyco Electronics Amp Kk Compliant pin and electric connector using compliant pin
JP2008544450A (en) * 2005-07-08 2008-12-04 ジェイ.エス.ティー.コーポレーション Press-fit pin
JP2013218848A (en) * 2012-04-06 2013-10-24 Daiichi Seiko Co Ltd Connector terminal for press fit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112544016A (en) * 2018-07-25 2021-03-23 苏州品翔电通有限公司 Fisheye terminal
JP2020129614A (en) * 2019-02-08 2020-08-27 矢崎総業株式会社 Connection structure for circuit board and terminal, and, terminal
JP7338982B2 (en) 2019-02-08 2023-09-05 矢崎総業株式会社 Connection structure between circuit board and terminal

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