JP6595871B2 - Press-fit terminal - Google Patents

Description

  The present invention relates to a press-fit terminal that is press-fitted into a through-hole of a circuit board and performs conductive connection with the through-hole by contact pressure.

  In recent years, press-fit terminals that do not require soldering and can be easily electrically connected to through-holes in circuit boards have become widespread.

  In press-fit terminals, the hole fitting part that is press-fitted into the through-hole of the printed circuit board contacts the inner peripheral surface of the through-hole while being compressed in the radial direction, and is brought into electrical connection with the through-hole by the contact pressure. It is a terminal.

  Patent Document 1 below discloses a technique for joint-connecting a plurality of press-fit terminals press-fitted into a plurality of through holes formed on a circuit board by a circuit pattern provided on the circuit board.

  FIG. 6 is a longitudinal sectional view of the periphery of the through hole 110 of the conventional circuit board 100 used in the technique of Patent Document 1, and FIG. 7 is a through hole 110 shown in FIG. It is a longitudinal cross-sectional view which shows the state by which press fitting was carried out.

  The through-hole 110 shown in FIG. 6 includes a cylindrical conductor layer 111 that covers the inner peripheral surface of the hole 102 formed through the multilayer substrate body 101 and a ring-shaped conductor that covers the opening edge of the hole 102. And a land 112 which is a layer.

  The conductor layer 111 and the land 112 provided in the through hole 110 are continuous without a gap and are electrically connected to each other.

Further, in order to prevent oxidation of the respective conductor layers of the through holes 110, a preflux layer (rust preventive film) 113 covering the surfaces of these conductor layers is provided.
The preflux layer 113 is an insulating film.

  The press-fit terminal 200 is a terminal fitting formed by press-molding a metal plate. The hole fitting portion 210 is set to have a maximum outer diameter larger than the inner diameter of the cylindrical conductor layer 111 of the through hole 110, and when the hole fitting portion 210 is press-fitted into the through hole 110, the hole fitting portion 210 is elastically deformed in the reduced diameter direction. The contact pressure makes contact with the conductor layer 111. The press-fit terminal 200 is plated with a metal such as tin (Sn) or nickel (Ni) after press molding.

  Conventionally, the preflux layer 113 formed in the through hole 110 is not particularly removed, and the hole fitting portion 210 is press-fitted into the through hole 110 where the preflux layer 113 remains. The preflux layer 113 is peeled off from the conductor layer 111 by rubbing when the hole fitting portion 210 is press-fitted, and the hole fitting portion 210 comes into contact with the exposed conductor layer 111, so that the hole fitting portion 210 is removed. And the conductor layer 111 are electrically connected.

JP 2006-216501 A

  However, the removal action of the preflux layer 113 due to rubbing at the time of press-fitting the hole fitting portion 210 is affected by contact pressure at the time of press-fitting the hole fitting portion 210 into the through hole 110.

  FIG. 8 shows the relationship between the contact pressure of the hole fitting portion 210 and the contact resistance between the contacted hole fitting portion 210 and the conductor layer 111.

  In FIG. 8, the horizontal axis indicates the contact pressure (load) of the hole fitting portion 210, and the vertical axis indicates the contact resistance. In FIG. 8, the characteristic line f <b> 1 is when the preflux layer 113 is not formed on the conductor layer of the through hole 110 and the hole fitting portion 210 directly contacts the conductor layer 111 of the through hole 110. The correlation between the load and the contact resistance is shown. This characteristic line f1 shows that even if the contact pressure (load) is low, the contact resistance is low and a good conduction state can be obtained.

  In FIG. 8, a characteristic line f <b> 2 is a case where the preflux layer 113 is formed on the conductor layer of the through hole 110. This characteristic line f2 indicates that when the contact pressure (load) is decreased, the contact resistance is rapidly increased in accordance with the decrease of the contact pressure, leading to poor conduction. That is, when the hole fitting portion 210 is press-fitted with the preflux layer 113 remaining, if the contact pressure is low, the insulating preflux layer 113 cannot be sufficiently removed, and the remaining preflux layer 113 remains. Therefore, it is shown that a conduction failure occurs.

  That is, in the conventional case where the hole fitting portion 210 is press-fitted into the through hole 110 in a state where the preflux layer 113 remains on the conductor layer of the through hole 110, the hole fitting portion must be increased unless the contact pressure is increased. The effect of peeling and removing the preflux layer 113 due to the rubbing of 210 was lowered, and there was a possibility that poor conduction occurred due to the remaining preflux layer 113.

  However, when the contact pressure of the hole fitting portion 210 is increased, the plating on the surface of the hole fitting portion 210 is scraped off, the conduction performance is reduced, or the circuit board 100 at the periphery of the through-hole 110 due to the contact load. There was a risk of whitening. The whitening of the circuit board 100 is a phenomenon in which the function as the board is impaired due to a crack in the board caused by a load or an impact acting on the board.

  Further, when the preflux layer 113 is scraped off by the contact pressure of the hole fitting portion 210, the shavings 113a of the preflux layer 113 are accumulated at the front end portion of the hole fitting portion 210 as shown in FIG. However, the preflux layer 113 may be scraped again into the hole fitting portion 210 to cause contact failure.

  Therefore, an object of the present invention is to solve the above-mentioned problems, and without increasing the contact pressure between the hole fitting portion of the press-fit terminal and the inner peripheral surface of the through hole, the through hole of the hole fitting portion and the circuit board can be obtained. To provide a press-fit terminal capable of ensuring a stable conductive connection with the inner peripheral surface of a hole and preventing inconveniences such as plating-off of a press-fit terminal and whitening of a circuit board. It is in.

  The above-described object of the present invention is achieved by the following configuration.

(1) The inner periphery of the through hole is located on the front end side of the hole fitting portion that is in a state of being electrically connected to the conductor layer on the inner periphery of the through hole while being press-fitted into the through hole of the circuit board. The press-fit terminal is provided with a flux-removing protrusion for scraping the pre-flux layer in a state of being coated on the conductor layer. The flux-removing protrusion is orthogonal to the longitudinal direction of the press-fit terminal. Projecting outwards in opposite directions along the orthogonal direction and continuing across the entire region in the orthogonal direction, and a central axis of the press-fit terminal from the central part of the orthogonal direction of the protruding part A press-fit terminal comprising: a central shaft portion coaxially protruding toward the front end side .

  (2) The flux removal protrusion is in a state of protruding to the back side of the circuit board in a state of passing through the through hole when the press fitting of the hole fitting portion into the through hole is completed. The press-fit terminal according to (1) above, which is characterized.

(3) The surface of the protrusion on the side of the central shaft portion functions as a flux holding surface that holds the preflux layer scraped off when inserted into the through hole. 2. A press-fit terminal according to 2.

(4) The inner periphery of the through-hole is located on the front end side of the hole fitting portion that is in a state of being electrically connected to the conductor layer on the inner periphery of the through-hole while being press-fitted into the through-hole of the circuit board. In the press-fit terminal, wherein the flux removal protrusion is provided with a flux removal protrusion for removing the preflux layer in a state of being coated on the conductor layer , the surface of the flux removal protrusion is not plated. a state, flop-less fit terminal, wherein in a state where the base metal is exposed.

(5) The press-fit terminal according to (4), wherein the flux removal protrusion has the same shape as the hole fitting portion.

  According to the configuration of (1) above, when press-fitting into the through hole of the circuit board, the flux removal protrusion located on the front end side of the hole fitting portion comes into contact with the preflux layer and scrapes off the preflux layer. Therefore, the hole fitting portion can be in direct contact with the conductor layer on the inner periphery of the through hole. Therefore, even if the contact pressure is low, the contact resistance is kept low, and a stable conductive connection with the through hole can be achieved.

  And even if the contact pressure of the hole fitting portion is low, a stable conductive connection can be secured between the hole fitting portion and the fitting pressure of the hole fitting portion to the through hole so that the contact pressure is lowered. A light interference fit can be set. As a result, it is possible to prevent inconveniences such as peeling of the plating layer on the surface of the hole fitting portion and whitening of the peripheral portion of the through hole of the circuit board, which occur when a high contact pressure is set.

  Moreover, the hole fitting portion directly contacts the conductor layer on the inner periphery of the through hole, so that the contact resistance can be kept low. Therefore, the current capacity can be increased without changing the terminal dimensions, compared to the conventional press-fit terminal where the preflux layer hinders contact between the hole fitting portion and the conductor layer of the through hole. A press-fit terminal with a large rated current can be obtained.

  In addition, the hole fitting part directly contacts the conductor layer of the through hole, and adhesion occurs in the contact part due to contact between metals, and this adhesion is a holding force for fixing the hole fitting part to the through hole. Works effectively. Therefore, even if the contact pressure is low, the mechanical coupling strength between the hole fitting portion and the through hole is increased, and it is possible to prevent the electrical connection state from becoming unstable due to vibration or the like.

  According to the configuration of (2) above, when the hole fitting portion is press-fitted into the through-hole, the pre-flux layer scraped off by the flux removal protrusion and attached to the flux removal protrusion is formed through the hole fitting portion. When the press-fitting into the hole is completed, it is discharged out of the through hole together with the flux removal protrusion. Therefore, although the preflux layer is scraped off, it is possible to prevent the occurrence of inconvenience that the preflux layer remains in the through hole and reattaches to the electrical connection portion in the through hole.

  According to the configuration of (3) above, when the hole fitting portion is press-fitted into the through hole, the preflux layer scraped off by the flux removal protrusion is held on the flux holding surface of the flux removal protrusion without being scattered. Therefore, scraping of the preflux layer can be prevented from scattering to the side of the subsequent hole fitting portion and being caught between the hole fitting portion and the inner conductor layer of the through hole. The reliability of the conductive connection between the fitting portion and the through hole can be improved.

  According to the configuration of (4) above, the flux removal protrusion exposes the base metal without being subjected to metal plating such as tin or nickel. Thereby, the characteristic of a base metal with high hardness is utilized and high cutting performance can be ensured with respect to the preflux layer. Further, since the flux removal protrusion does not participate in electrical connection, it does not affect the conduction performance between the hole fitting portion and the through hole without performing metal plating for improving conductivity.

  According to the configuration of (5) above, the flux removal protrusion has the same shape as the hole fitting portion, and thus contacts the inner surface of the through hole in the same state as the hole fitting portion. Therefore, the preflux can be reliably removed so as to be suitable for the hole fitting portion.

  According to the press-fit terminal according to the present invention, the contact pressure between the hole fitting portion of the press-fit terminal and the inner peripheral surface of the through hole is not increased between the hole fitting portion and the inner peripheral surface of the through hole of the circuit board. In addition, it is possible to ensure a stable conductive connection, and it is possible to prevent the occurrence of inconveniences such as plating-off of press-fit terminals and whitening of circuit boards.

  The present invention has been briefly described above. Furthermore, the details of the present invention will be further clarified by reading through a mode for carrying out the invention described below (hereinafter referred to as “embodiment”) with reference to the accompanying drawings. .

FIG. 1 is a longitudinal sectional view of a first embodiment of a press-fit terminal according to the present invention and a through hole of a circuit board into which the press-fit terminal is press-fitted. FIG. 2 is a longitudinal sectional view showing a state in which the press-fit terminal according to the first embodiment of the present invention is being fitted into the through hole of the circuit board. FIG. 3 is a longitudinal sectional view showing a state in which the press-fit terminal according to the first embodiment of the present invention has been fitted into the through hole of the circuit board. FIG. 4 is a longitudinal sectional view showing a state where press-fit terminals according to the second embodiment of the present invention have been press-fitted. FIG. 5 is a graph showing the correlation between the drawing length and the drawing load of the press-fit terminal shown in FIG. FIG. 6 is a longitudinal sectional view showing a structure of a through hole of a conventional circuit board. FIG. 7 is a longitudinal sectional view showing a state in which a conventional press-fit terminal has been press-fitted into the through hole shown in FIG. FIG. 8 is a graph showing the correlation between the contact pressure to the through hole of the press-fit terminal and the contact resistance.

  Hereinafter, a preferred embodiment of a press-fit terminal according to the present invention will be described in detail with reference to the drawings.

  1 to 3 show a first embodiment of a press-fit terminal according to the present invention. FIG. 1 shows a first embodiment of a press-fit terminal according to the present invention and a circuit into which the press-fit terminal is press-fitted. FIG. 2 is a longitudinal sectional view showing a state in which the press-fit terminal of the first embodiment of the present invention is being fitted into the through hole of the circuit board, and FIG. 3 is a first embodiment of the present invention. It is a longitudinal cross-sectional view of the state which the press-fit terminal of the form completed fitting to the through hole of the circuit board.

  The press-fit terminal 3 according to the first embodiment is a press-molded product formed by punching a metal plate, and is press-fitted into the through-hole 110 of the circuit board 100 as shown in FIGS. The hole fitting part 31 which electrically connects with the conductor layer 111 of the circumference | surroundings, and the flux deletion protrusion 32 comprised in the front end side of the insertion direction rather than this hole fitting part 31 are provided.

  The through hole 110 of the circuit board 100 includes a cylindrical conductor layer 111 that covers the inner peripheral surface of the hole 102 formed through the multilayer substrate body 101 and a ring-shaped conductor layer that covers the opening edge of the hole 102. And a land 112.

  The conductor layer 111 and the land 112 provided in the through hole 110 are continuous without a gap and are electrically connected to each other.

Further, in order to prevent oxidation of the respective conductor layers of the through holes 110, a preflux layer (rust preventive film) 113 covering the surfaces of these conductor layers is provided.
The preflux layer 113 is an insulating film.

  The hole fitting portion 31 of the press-fit terminal 3 has a spindle shape in which the maximum width is set larger than the inner diameter of the cylindrical conductor layer 111 of the through hole 110, and when the press fitting terminal 3 is press-fitted into the through hole 110, the diameter is reduced. It is elastically deformed in the direction and contacts with the conductor layer 111 by the contact pressure. The press-fit terminal 3 is plated with a metal such as tin (Sn) or nickel (Ni) on the surface of the portion excluding the flux removal protrusion 32 after press molding.

  The flux removal protrusion 32 of the press-fit terminal 3 has a width (length along the radial direction of the through hole 11) that is slightly larger than the inner diameter of the cylindrical conductor layer 111 of the through hole 110. , And a small-diameter central shaft portion 322 provided at the center of the protrusion 321. In addition, the protrusion part 321 may be formed in the cyclic | annular form (gutter shape).

  The protruding portion 321 is formed in an arcuate curved surface that protrudes radially outward. When the hole fitting portion 31 is press-fitted into the through hole 110, the protruding portion 321 enters the through hole 110 before the hole fitting portion 31. The protruding portion 321 is a protruding portion that scrapes off the preflux layer 113 by rubbing the preflux layer 113 coated on the conductor layer 111 on the inner periphery of the through hole 110.

  When the protrusion 321 is inserted into the through-hole 110, the entire periphery contacts the preflux layer 113 covered with the conductor layer 111 and is pushed into the through-hole 110, so that the entire conductor layer 111 is The peripheral preflux layer 113 is scraped off.

  The curved surface on the side of the central shaft portion 322 of the protruding portion 321 is a flux holding surface 321a for holding the preflux layer 113 scraped off by the protruding portion 321. In order to facilitate the insertion of the press-fit terminal 3 into the through hole 11, the central shaft portion 322 is reduced in diameter.

  The flux removal protrusion 32 exposes the base metal without being subjected to a plating treatment such as tin (Sn) or nickel (Ni) for improving the conductivity on the surface.

  Further, as shown in FIG. 3, the flux removal protrusion 32 passes through the through hole 110 and protrudes to the back side of the circuit board 100 when the press fitting of the hole fitting portion 31 into the through hole 110 is completed. Is set.

  In the press-fit terminal 3 of the first embodiment described above, when the press-fit terminal 3 is press-fitted into the through hole 110 of the circuit board 100, the flux removal protrusion 32 positioned on the front end side in the insertion direction with respect to the hole fitting portion 31 has the preflux layer. In contact with 113, the preflux layer 113 is scraped off. Therefore, the hole fitting portion 31 can be in direct contact with the conductor layer 111 on the inner periphery of the through hole 110. Therefore, even if the contact pressure is low, the contact resistance is kept low, and a stable conductive connection with the through hole 110 can be achieved.

  And even if the contact pressure of the hole fitting part 31 is low, a stable conductive connection can be ensured between the hole fitting part 31 and the fitting of the hole fitting part 31 to the through hole 110 is reduced to the contact pressure. Can be set to a light interference fit. This prevents the occurrence of inconveniences such as peeling of the plating layer on the surface of the hole fitting portion 31 and whitening of the peripheral portion of the through hole 110 of the circuit board 100 that occur when a high contact pressure is set. Can do.

  In addition, the hole fitting portion 31 directly contacts the conductor layer 111 on the inner periphery of the through hole 110, so that the contact resistance can be kept low. Therefore, when compared with a conventional press-fit terminal in which the preflux layer 113 hinders contact between the hole fitting portion 31 and the conductor layer 111 of the through hole 110, the current capacity is increased without changing the terminal dimensions. And a press-fit terminal with a large rated current can be obtained.

  Further, the hole fitting portion 31 directly contacts the conductor layer 111 of the through hole 110, and adhesion occurs at the contact portion due to contact between metals, and this adhesion causes the hole fitting portion 31 to the through hole 110. It works effectively as a holding force to fix. Therefore, even if the contact pressure is low, the mechanical coupling strength between the hole fitting portion 31 and the through hole 110 is increased, and it is possible to prevent the electrical connection state from becoming unstable due to vibration or the like.

  Further, according to the configuration of the press-fit terminal 3 of the first embodiment, when the hole fitting portion 31 is press-fitted into the through hole 110, the preflux layer that is scraped off by the flux removal protrusion 32 and attached to the flux removal protrusion 32. The shavings 113 are discharged out of the through hole 110 together with the flux removal protrusion 32 when the press fitting of the hole fitting portion 31 into the through hole 110 is completed. For this reason, the preflux layer 113 is scraped but remains in the through hole 110 and can be prevented from being reattached to the electrical connection portion in the through hole 110.

  Further, according to the configuration of the press-fit terminal 3 of the first embodiment, the preflux layer 113 scraped off by the flux removal protrusion 32 when the hole fitting portion 31 is press-fitted into the through hole 110 is not scattered and flux It is held on the flux holding surface 321 a of the deletion protrusion 32. Therefore, scraping of the preflux layer 113 is prevented from scattering to the subsequent hole fitting portion 31 side and being caught between the hole fitting portion 31 and the conductor layer 111 on the inner periphery of the through hole 110. Therefore, the reliability of the conductive connection between the hole fitting portion 31 and the through hole 110 can be improved.

  Moreover, according to the structure of the press fit terminal 3 of 1st Embodiment, the flux deletion protrusion 32 has exposed base metal, without performing metal plating, such as tin and nickel. Thereby, the characteristics of the base metal having high hardness are utilized, and high cutting performance can be secured for the preflux layer 113. Further, since the flux removal protrusion 32 does not participate in electrical connection, it does not affect the conduction performance between the hole fitting portion 31 and the through hole 110 without performing metal plating for improving conductivity. .

Next, a second embodiment of the press-fit terminal according to the present invention will be described.
FIG. 4 is a longitudinal sectional view of a second embodiment of a press-fit terminal according to the present invention and a through hole of a circuit board into which the press-fit terminal is press-fitted.

  3A of press fit terminals of this embodiment are the structures which have the flux deletion protrusion 32A of the same shape as the hole fitting part 31 in the front-end | tip of the hole fitting part 31 instead of the flux deletion protrusion 32 of 1st Embodiment. . In the flux removal protrusion 32A, the slope on the tip side is a flux holding surface 321A. Since other configurations are the same as those of the first embodiment described above, description of the same configurations will be omitted or simplified.

  Similar to the hole fitting portion 31, the flux removal protrusion 32 </ b> A has a spindle shape in which the maximum width is set larger than the inner diameter of the cylindrical conductor layer 111 of the through hole 110, and is pressed into the through hole 110. Elastically deforms in the direction of diameter reduction. The flux removal protrusion 32A may be plated with tin, nickel, or the like, but it is preferable that the flux removal protrusion 32A is not plated because the base metal is in direct contact with the conductor layer 111 and the flux removal function is enhanced.

  According to the press-fit terminal 3A of the present embodiment, in addition to the effects of the first embodiment described above, the following effects are further obtained.

  Since the flux removal protrusion 32A has the same shape as the hole fitting portion 31, the flux removal protrusion 32A is in the same state as the state where the hole fitting portion 31 contacts the conductor layer 111 of the through hole 110, and the through hole 110 In contact with the conductive layer 111. For example, the contact load between the flux removal protrusion 32 </ b> A and the conductor layer 111 is the same as the contact load between the hole fitting portion 31 and the conductor layer 111. Further, the flux removal protrusion 32 </ b> A is in contact with the conductor layer 111 at the same portion as the hole fitting portion 31. Therefore, the preflux layer 113 is reliably removed from the inner surface of the conductor layer 111 where the hole fitting portion 31 is in contact so that the hole fitting portion 31 is suitable, and the hole fitting portion 31 and the conductor layer 111 are removed. Reliable contact is obtained.

  Further, the preflux layer 113 is reliably removed by the flux removal protrusion 32A, so that the contact area (adhesion area) between the hole fitting portion 31 and the conductor layer 111 can be increased, and the contact reliability is improved. High and high terminal holding force can be realized.

Further, when the flux removal protrusion 32A is not plated, the flux removal rate is increased, and the edge portion of the through hole 110 is slightly deformed when the flux removal protrusion 32A is inserted into the through hole 110. Can be smooth. Thereby, when the hole fitting part 31 to which plating is applied is press-fitted into the through hole 110, the plating layer of the hole fitting part 31 is reduced from being scraped to the edge part of the through hole 110.
In FIG. 4, the conductor layer 111 on the inner surface of the through hole 110 is in a state where the flux layer is removed.

  FIG. 5 is a graph showing the relationship between the pull-out length from the through hole and the pull-out load (holding force) by the above-described second embodiment and a conventional press-fit terminal. The pull-out load (holding force) of the conventional press-fit terminal is about 15 N, whereas the pull-out load (holding force) of the copper press-fit terminal 3A of the second embodiment in which the flux removal protrusion 32A is tin-plated. ) Is about 30 N, and it can be seen that the terminal holding force is increased about twice. Further, in the copper press-fit terminal 3A of the second embodiment, the flux removal protrusion 32A is not plated with tin, but the pulling-out load (holding force) is about 37 N, which shows that the terminal holding force is further increased.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

  For example, the flux removal protrusion 32 has a curved surface shape with a concave flux holding surface 321a, or an inclined surface shape in which the outer peripheral side protrudes in the insertion direction, so that the portion in contact with the preflux layer 113 has an edge shape, It is also conceivable to improve the machinability.

  However, when the flux deletion protrusion 32 is formed in an edge shape, it is necessary to accurately form the protrusion length in the radial direction of the flux deletion protrusion 32 so that the edge does not damage the conductor layer 111.

  Here, the features of the above-described embodiments of the press-fit terminal according to the present invention will be briefly summarized and listed in the following [1] to [5], respectively.

  [1] A hole fitting portion that is electrically connected to the inner conductor layer (111) of the through hole (110) while being press-fitted into the through hole (110) of the circuit board (100). A flux removal protrusion (32) for scraping the preflux layer (113) in a state of being covered on the conductor layer (111) on the inner periphery of the through hole (110) is provided on the front end side from 31). A press-fit terminal (3).

  [2] The flux removal protrusion (32) is in a state in which the hole fitting portion (31) has passed through the through hole (110) when the press fitting of the hole fitting portion (31) into the through hole (110) is completed. The press-fit terminal (3) according to the above [1], wherein the press-fit terminal (3) is in a state of protruding to the back side of the circuit board (100).

  [3] The flux removal protrusion (32) includes a flux holding surface (321a) in a state of holding the shaved preflux layer (113) in a state of being inserted into the through hole (110). The press-fit terminal (3) according to the above [1] or [2], wherein

  [4] Any of the above [1] to [3], wherein the flux removal protrusion (32) is in a state where the surface is not plated and the base metal is exposed. A press-fit terminal (3) as described in 1.

  [5] The press-fit terminal (3A) according to any one of [1] to [4], wherein the flux removal protrusion (32A) has the same shape as the hole fitting portion (31). .

3, 3A Press-fit terminal 31 Hole fitting portion 32, 32A Flux removal protrusion 100 Circuit board 110 Through hole 111 Conductor layer 113 Preflux layer 321a Flux holding surface

Claims (5)

The conductor on the inner periphery of the through hole is on the front end side of the hole fitting portion that is in a state of being electrically connected to the conductor layer on the inner periphery of the through hole when being press-fitted into the through hole of the circuit board. In a press-fit terminal , characterized in that it is provided with a flux removal protrusion for scraping the preflux layer in a state of being coated on the layer ,
The flux removal protrusions protrude outwardly in opposite directions along the orthogonal direction orthogonal to the longitudinal direction of the press-fit terminal and are continuous over the entire region in the orthogonal direction, and the protrusions A press-fit terminal comprising: a central shaft portion protruding from the center portion in the orthogonal direction to the front end side coaxially with the central axis line of the press-fit terminal .   The flux removal protrusion is in a state of protruding to the back side of the circuit board in a state of passing through the through hole when the press-fitting of the hole fitting portion into the through hole is completed. The press-fit terminal according to claim 1. 3. The surface of the protrusion on the side of the central shaft portion functions as a flux holding surface that holds the preflux layer scraped off when inserted into the through hole. 4. Press-fit terminal. The conductor on the inner periphery of the through hole is on the front end side of the hole fitting portion that is in a state of being electrically connected to the conductor layer on the inner periphery of the through hole when being press-fitted into the through hole of the circuit board. In a press-fit terminal, characterized in that it is provided with a flux removal protrusion for scraping the preflux layer in a state of being coated on the layer,
The flux remove projections is a state in which plating processing is not applied to the surface, flop-less fit terminal, wherein in a state where the base metal is exposed. The press-fit terminal according to claim 4, wherein the flux removal protrusion has the same shape as the hole fitting portion.

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