JP2017167033A - Measuring apparatus and processing line having the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring apparatus capable of measuring both inner diameter and depth of a hole of an object by a single laser displacement meter and a processing line having the same.SOLUTION: A measuring apparatus includes a laser displacement meter 1 and an optical path change machine 2. The optical path change machine 2 changes an optical path of a laser beam emitted from the laser displacement meter 1. The location of the optical path change machine 2 can be switched between a change position of the laser displacement meter 1 on an optical axis and a retreat position dislocated from an optical axis of the laser displacement meter 1. A processing line includes a plurality of processors and a work loader that transfers a work from one processor to the other. The above measuring apparatus is attached onto the work loader.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a measuring device that measures the inner diameter and depth of a hole of an object using a laser displacement meter, and a processing line including the measuring device.

  As an apparatus for measuring the inner diameter of a hole in an object with a laser displacement meter, for example, the invention of Patent Document 1 has been proposed. This is for measuring the inner diameter of the tube, a laser displacement meter that emits a laser beam in the tube axis direction, and a reflection that reflects the laser beam in the radial direction and irradiates the inner surface of the tube Equipped with a bowl.

JP 7-43119 A

  Conventionally, the inner diameter of a tubular body could be measured with such an apparatus, but there was a case where it was desired to measure the depth as well as the inner diameter of a closed hole. However, since the invention of Patent Document 1 has a structure in which the laser beam emitted from the laser displacement meter is reflected by 90 degrees, the depth of the hole cannot be measured. Therefore, although a separate laser displacement meter is required to measure the depth, there are problems in that the cost is increased by providing a plurality of laser displacement meters and the size of the apparatus is increased.

  The present invention has been made in view of the above circumstances, and provides a measuring apparatus capable of measuring both the inner diameter and the depth of a hole of an object with a single laser displacement meter, and a processing line including the measuring apparatus. Objective.

  The invention according to claim 1 of the present invention includes a laser displacement meter and an optical path changer, and the optical path changer changes an optical path of a laser beam emitted from the laser displacement meter. The position can be switched between a change position on the optical axis of the laser displacement meter and a retracted position off the optical axis of the laser displacement meter.

  A second aspect of the present invention is characterized in that the distance between the laser displacement meter and the optical path changer at the change position is variable.

  The invention according to claim 3 of the present invention is characterized in that the laser displacement meter and the optical path changer are integrated and are movable in three orthogonal directions with the optical axis of the laser displacement meter as one axis.

  The invention of claim 4 of the present invention comprises a plurality of processing machines and a work loader for transferring a work from one processing machine to another processing machine, and the work loader is provided with the measurement according to claim 1, 2 or 3. A device is attached.

  According to the first aspect of the present invention, by switching the position of the optical path changer, both the inner diameter and the depth of the hole can be measured with one laser displacement meter. That is, by turning the laser displacement meter toward the hole of the object and setting the optical path changer to the change position, the laser beam can be bent and irradiated to the inner peripheral surface of the hole to measure the inner diameter. By setting the position to the retracted position, the laser beam can be moved straight to irradiate the bottom surface of the hole to measure the depth. Since only one laser displacement meter is required, the cost can be reduced and the apparatus can be downsized.

  According to the invention of claim 2 of the present invention, since the range of the distance between the laser displacement meter and the target surface that can be measured is determined, if the distance between the laser displacement meter and the optical path changer is changed, The measurable distance range between the optical path changer and the target surface also changes. Therefore, the range of the inner diameter of the hole that can be measured can also be changed.

  According to the third aspect of the present invention, the laser displacement meter and the optical path changer can be freely moved with respect to the object, so that an arbitrary position of the object can be measured.

  According to the invention of claim 4 of the present invention, since the workpiece can be measured during the transfer of the workpiece by the work loader, the machining cycle time can be shortened, and the entire machining line can be downsized. it can.

It is a side view of the principal part of the measuring apparatus of this invention, and shows the case where an optical path changer exists in a change position. It is a side view of the principal part of the measuring apparatus of this invention, and shows the case where an optical path changer exists in a retracted position. It is a front view of the principal part of the measuring apparatus of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a general view of the measuring apparatus of this invention, (a) is a side view, (b) is a front view. It is an enlarged view (longitudinal sectional view of a shaft) of an optical path changer part. It is explanatory drawing of operation | movement of a distance adjustment mechanism, (a) shows the state which raised the guide member, (b) shows the state which lowered the guide member. (A) is explanatory drawing of the measurable range of a laser displacement meter, (b), (c) is explanatory drawing at the time of changing the distance between a laser displacement meter and an optical path changer. (A)-(d) is explanatory drawing which shows the procedure of the measurement by the measuring apparatus of this invention. (A)-(g) is a schematic diagram which shows the example of the process shape which can be measured with the measuring apparatus of this invention. It is a schematic diagram of the processing line provided with the measuring apparatus of this invention.

  A specific configuration of the measuring apparatus of the present invention will be described with reference to the drawings. In the following description, front and rear indicate the front side and the rear side when the apparatus is viewed from the front (FIG. 3, FIG. 4B), and left and right indicate the left and right when the apparatus is viewed from the front. As shown in FIGS. 1 to 4, the measuring apparatus includes a laser displacement meter 1 and an optical path changer 2 that changes an optical path of a laser beam emitted from the laser displacement meter 1, and further includes an optical path changer 2. A shaft 3 to be attached, a rotation mechanism 4 that rotates the shaft 3, a switching mechanism 5 that switches the optical path changer 2 between a change position and a retracted position, a distance adjustment mechanism 6 that changes the distance between the laser displacement meter 1 and the optical path changer 2, and laser displacement A moving mechanism 7 is provided for moving the total 1, the optical path changer 2 and other mechanisms. Hereinafter, each component will be described in detail. However, the state where the optical path changer 2 is at the change position is used as a reference.

  The moving mechanism 7 moves the entire apparatus in three orthogonal axes, and includes an X-axis rail 71 extending in the left-right direction, a Y-axis rail 72 extending in the front-rear direction, and a Z-axis rail 73 extending in the up-down direction. An X-axis slider 74, a Y-axis slider 75, and a Z-axis slider 76 are slidable with respect to the rail. The X-axis rail 71 is fixed to the upper side of the Y-axis slider 75, the Z-axis rail 73 is fixed to the front side of the X-axis slider 74, and the flat base 13 is attached to the front side of the Z-axis slider 76. It is fixed vertically.

  The laser displacement meter 1 is attached to the front side surface of the base 13. The laser displacement meter 1 is an existing unit that measures the distance to a target surface by irradiating the target surface with a laser beam. The laser displacement meter 1 is provided on a substantially rectangular parallelepiped main body 11 and one surface of the main body 11. The launch port 12 is provided with the launch port 12 facing downward. Therefore, the optical axis of the laser displacement meter 1 coincides with the Z axis.

  Further, a shaft 3 is provided immediately below the launch port 12 of the laser displacement meter 1. The shaft 3 has a cylindrical shape extending vertically, and the center axis thereof coincides with the optical axis of the laser displacement meter 1, and the outer diameter of the shaft 3 is larger than the inner diameter of the hole of the workpiece to be measured. It has become a small one. And as shown in FIG. 5, the optical path changer 2 is provided in the lower end part inside the shaft 3. As shown in FIG. The optical path changer 2 has a mirror surface 21 inclined at an angle of 45 degrees with respect to the central axis of the shaft 3, and a passage hole 31 is formed on the side surface of the shaft 3 facing the mirror surface 21. The laser beam emitted from the emission port 12 of the laser displacement meter 1 travels along the central axis inside the shaft 3, is reflected by the mirror surface 21 of the optical path changer 2, and the optical path is bent 90 degrees, and passes through the shaft 3. The light passes through the hole 31 and is irradiated to the outside of the shaft 3.

  The shaft 3 is rotatable around its central axis by the rotation mechanism 4. The rotation mechanism 4 includes a sleeve 41 that rotatably supports the shaft 3, a motor 42, gears 43 and 44 that connect the shaft 3 and the motor 42, and a belt 45. More specifically, a horizontal support plate 51 extending in the left-right direction is provided below the launch port 12 of the laser displacement meter 1, and a round hole is formed in the support plate 51 at a position directly below the launch port 12. Accordingly, a substantially cylindrical sleeve 41 is inserted into the round hole from below. The sleeve 41 has a flange portion 46 protruding to the outer peripheral side at the upper portion, and the flange portion 46 is in contact with the lower surface of the support plate 51. And the bearing 47 is attached to the upper end part and lower end part inside the sleeve 41, and the shaft 3 is rotatably supported by the upper and lower bearings 47. The shaft 3 protrudes above and below the sleeve 41, and a gear 43 is extrapolated to the upper protruding portion. Further, the lower protrusion length corresponds to the depth of the hole of the workpiece to be measured. Further, a motor 42 having a rotation axis parallel to the central axis of the shaft 3 is provided on the left side of the support plate 51, and a gear 44 is extrapolated to the rotation axis of the motor 42. The gear 43 of the shaft 3 and the gear 44 of the motor 42 are aligned in height, and a belt 45 is hung on both gears 43, 44, so that the shaft 3 can be arbitrarily rotated by the motor 42. Thereby, the laser beam emitted from the laser displacement meter 1 can be irradiated in an arbitrary horizontal direction. A tension pulley 48 for applying tension to the belt 45 is provided at a position between the gears 43 and 44 of the support plate 51.

  Further, the position of the shaft 3 and the rotation mechanism 4 including the optical path changer 2 is switched by the switching mechanism 5. The switching mechanism 5 includes a support plate 51 that supports the shaft 3 and the rotation mechanism 4, a rotation arm 52 that rotates the support plate 51, a support shaft 53 that is integral with the rotation arm 52, and a support arm 54 that supports the support shaft 53. And an air cylinder 55 and a gear 56 and a rack 57 that connect the support shaft 53 and the air cylinder 55. More specifically, a vertical auxiliary base 61 is provided on the right side of the base 13 in the same manner as the base 13, and a support arm 54 protruding toward the front side is attached to the auxiliary base 61. A round hole penetrating in the left-right direction is formed at the distal end portion of the support arm 54, and a support shaft 53 is inserted into the round hole, and the support shaft 53 is rotatable around the left-right direction axis. . A rotating arm 52 extending downward is fixed to the left end portion of the support shaft 53 (a portion between the support arm 54 and the laser displacement meter 1). The rotary arm 52 is substantially L-shaped with the lower end bent toward the rear side, and the right end of the support plate 51 is fixed to the lower surface. A gear 56 is extrapolated to the right end portion of the support shaft 53. Further, an air cylinder 55 having a piston that operates in the vertical direction is provided on the upper side of the auxiliary base 61, and a rack 57 is attached to the piston of the air cylinder 55, and the rack 57 is moved up and down by the air cylinder 55. It is free. The gear 56 and the rack 57 of the support shaft 53 are aligned at the left and right positions, and the gear 56 and the rack 57 are engaged with each other, so that the support shaft 53 can be arbitrarily rotated by a so-called rack and pinion system. As the support shaft 53 rotates, the rotation arm 52 also rotates, and the support plate 51 attached to the tip of the rotation arm 52, the shaft 3 attached to the support plate 51, and the rotation mechanism 4 also move together. To do. As shown in FIG. 1, the rotation range of the support shaft 53 is 90 degrees from the state where the shaft 3 is downward (vertical) to the state where the shaft 3 is forward (horizontal) as shown in FIG. It is the range. If the shaft 3 is in the state of FIG. 1 downward, the optical path changer 2 is positioned on the optical axis of the laser displacement meter 1, and the laser beam emitted from the laser displacement meter 1 is bent 90 degrees by the optical path changer 2. It is done. The position of the optical path changer 2 at this time is called a change position. On the other hand, if the shaft 3 is in the forward state shown in FIG. 2, the optical path changer 2 deviates from the optical axis of the laser displacement meter 1 and the laser beam goes straight. The position of the optical path changer 2 at this time is called a retracted position.

Furthermore, the shaft 3, the rotation mechanism 4, and the switching mechanism 5 including the optical path changer 2 are moved up and down by the distance adjustment mechanism 6. The distance adjusting mechanism 6 includes an auxiliary base 61 to which the switching mechanism 5 is attached, a guide member 62 to which the auxiliary base 61 is attached, and a linear actuator 63 that moves the guide member 62 up and down. More specifically, a linear actuator 63 having a drive shaft that moves up and down is attached to the right side portion of the Z-axis slider 76, and a guide member 62 that is slidable up and down is provided on the front side of the linear actuator 63. is there. The guide member 62 has an upper end bent toward the rear side, and a drive shaft of the linear actuator 63 is connected to the bent portion, and can be arbitrarily moved up and down by the linear actuator 63. An auxiliary base 61 is attached to the front side surface of the guide member 62. The base 13, the laser displacement meter 1 and the linear actuator 63 fixed to the Z-axis slider 76 are integrated, and the linear actuator 63 moves the guide member 62 up and down as shown in FIGS. 6 (a) and 6 (b). As a result, the shaft 3, the rotation mechanism 4, and the switching mechanism 5 move up and down with respect to the laser displacement meter 1. Thereby, the distance between the laser displacement meter 1 and the optical path changer 2 at the change position can be changed. As shown in FIG. 6A, when the guide member 62 is raised, the laser displacement meter The distance L1 between 1 and the optical path changer 2 is shortened. As shown in FIG. 6B, when the guide member 62 is lowered, the distance L2 between the laser displacement meter 1 and the optical path changer 2 is increased. As shown in FIG. 7 (a), the laser displacement meter 1 has a minimum measurement distance _Rmin and a maximum measurement distance _Rmax determined with respect to the distance to the target surface that can be measured, and a measurable range ΔR between them. Therefore, if the distance between the laser displacement meter 1 and the optical path changer 2 is changed in this way, the measurable distance range between the optical path changer 2 and the target surface also changes. That is, as shown in FIG. 7B, if the distance R1 between the laser displacement meter 1 and the optical path changer 2 is shortened, the measurable range ΔR is from the optical path changer 2 (the optical axis of the laser displacement meter 1). Move away. On the other hand, as shown in FIG. 7C, if the distance R2 between the laser displacement meter 1 and the optical path changer 2 is increased, the measurable range ΔR becomes the optical path changer 2 (the optical axis of the laser displacement meter 1). Get closer. Therefore, the range of the inner diameter of the hole that can be measured can also be changed.

  Next, a method for performing measurement using this measuring apparatus will be described with reference to FIG. Here, it is assumed that a plurality of holes H1 and H2 are formed in the workpiece W and it is confirmed by measurement whether the inner diameter and depth of each hole H1 and H2 are as per the design drawing. In the initial state, the optical path changer 2 is in the change position. First, the workpiece W is fixed at a predetermined position within the movable range of the measuring apparatus so that the holes H1 and H2 face upward. At this time, the position is set lower than that so that the lower end of the shaft 3 does not hit the workpiece W. Subsequently, the moving mechanism 7 is operated to move the measuring device in the left-right direction (X-axis direction) and the front-rear direction (Y-axis direction), so that the optical axis of the laser displacement meter 1 (the central axis of the shaft 3) is It matches with the position of the first hole H1 (FIG. 8A). First, in order to measure the inner diameter of the hole H1, the measuring device is moved downward (Z-axis direction), and the shaft 3 is inserted into the first hole H1 of the workpiece W (FIG. 8B). At this time, since the assumed inner diameter of the hole H1 is known from the design drawing, the distance adjusting mechanism 6 is operated and the distance between the laser displacement meter 1 and the optical path changer 2 is set so that the inner diameter is within the measurable range. Adjust the distance. When a laser beam is emitted from the laser displacement meter 1, the laser beam is bent 90 degrees by the optical path changer 2 provided at the lower end portion of the shaft 3 and irradiated to the inner peripheral surface of the hole H 1, and the shaft 3 is rotated by the rotating mechanism 4. Is rotated and irradiated over the entire circumference of the inner circumferential surface, whereby the inner diameter of the hole H1 is measured. Next, in order to measure the depth of the hole H1, the moving mechanism 7 is operated, the measuring device is moved upward (Z-axis direction), and the shaft 3 is pulled out from the hole H1 of the workpiece W. At this time, since the assumed depth of the hole H1 is known from the design drawing, the height position of the measuring device is adjusted so that the depth is within the measurable range. Subsequently, the switching mechanism 5 operates to switch the position of the optical path changer 2 from the changed position to the retracted position (FIG. 8C). Then, when a laser beam is emitted from the laser displacement meter 1, the laser beam goes straight downward and is irradiated onto the bottom surface of the hole H1, and the depth of the hole H1 is measured. Next, when the position of the measuring device is lowered, the moving mechanism 7 is operated and raised to the initial height position, and then the switching mechanism 5 is operated to retract the position of the optical path changer 2. Switch from position to change position. Then, the moving mechanism 7 is operated to move the measuring device in the left-right direction (X-axis direction) and the front-rear direction (Y-axis direction), so that two optical axes (center axis of the shaft 3) of the laser displacement meter 1 are moved. The measurement is performed in the same manner as the first hole H1 by matching with the position of the eye hole H2 (FIG. 8D). In this way, the measurement of the inner diameter and depth for all the holes H1, H2 is completed. The operation of each part of the above measuring device is programmed in a control device (not shown) and is automatically performed.

  Further, according to this measuring apparatus, in addition to the measurement of the inner diameter and the depth of a hole having a deep depth relative to the inner diameter as shown in FIGS. 9A and 9B, FIGS. The inner diameter and depth of a counterbore hole whose depth is shallow with respect to the inner diameter as shown in FIG. As described above, by changing the distance between the laser displacement meter 1 and the optical path changer 2 by the distance adjusting mechanism 6, the measurable inner diameter range changes, and the moving mechanism 7 changes the height position of the laser displacement meter. By changing the range of measurable depth, it is possible to handle holes with greatly different inner diameters and depths. Furthermore, about a stepped hole as shown in FIG.9 (e), the internal shape can be measured by moving a measuring apparatus up and down by the moving mechanism 7, measuring an internal diameter. For the hole having the O-ring groove as shown in FIG. 9F, the inner diameter of the O-ring groove is measured by adjusting the height position of the passage hole 31 of the shaft 3 to the O-ring groove by the moving mechanism 7. be able to. Furthermore, about the tap hole as shown in FIG.9 (g), the number of taps and a pitch can be measured by moving a measuring apparatus up and down with the moving mechanism 7, measuring an internal diameter.

  According to the measuring apparatus configured in this way, as described above, both the inner diameter and the depth of the hole are measured by one laser displacement meter 1 by switching the position of the optical path changer 2 between the changed position and the retracted position. it can. Thereby, since only one laser displacement meter 1 is required, the cost can be reduced and the apparatus can be downsized. Further, by changing the distance between the laser displacement meter 1 and the optical path changer 2 by the distance adjusting mechanism 6, the range of the inner diameter of the measurable hole can be changed, and the height of the laser displacement meter 1 can be changed by the moving mechanism 7. By changing the position, the measurable hole depth range can be changed. Furthermore, since the laser displacement meter 1 and the optical path changer 2 can be moved freely with respect to the object by the moving mechanism 7, it is possible to measure an arbitrary position of the object.

  Next, a processing line equipped with this measuring device will be described. As shown in FIG. 10, this processing line runs on a plurality of processing machines 101 a and 101 b arranged in the front-rear direction, a guide rail 103 extending in the front-rear direction on the left side of the arranged processing machines 101 a and 101 b, and the guide rail 103. A work loader 102 is provided. Each processing machine 101a, 101b performs various types of processing, such as cutting processing with a tool, laser processing, and electrical discharge processing, on the workpiece W. The work loader 102 is for transferring the workpiece W from one processing machine 101a to another processing machine 101b, and includes a loading / unloading arm 121 for loading and unloading the workpiece W from the processing machines 101a and 101b. The carry-in / out arm 121 holds the workpiece W at the tip, rotates around the vertical axis, and moves the workpiece W from the right side of the guide rail 103 (processing machine 101a, 101b side) to the left side of the guide rail 103 (processing). The other side of the machine 101a, 101b) or in the opposite direction. And the said measuring apparatus 100 is attached to the left side part (opposite side of the processing machines 101a and 101b) of the work loader 102. FIG. The measuring apparatus 100 is attached so that the Y-axis direction coincides with the extending direction of the guide rail 103, and the workpiece W moved to the left side by the carry-in / out arm 121 falls within the measurable range of the measuring apparatus 100. is there.

  According to the processing line configured in this manner, first, after the workpiece W is processed by the first processing machine 101a, the workpiece W is unloaded from the processing machine 101a by the loading / unloading arm 121, and the loading / unloading arm is further loaded. 121 turns and the workpiece W moves to the left side of the workpiece loader 102. And while the work loader 102 moves from the 1st processing machine 101a to the 2nd processing machine 101b, the measuring apparatus 100 operate | moves and it carries out by the 1st processing machine 101a of the workpiece | work W in said way. Measure the machined part. When the work loader 102 arrives at the second processing machine 101b, the loading / unloading arm 121 turns to move the work W to the right side of the work loader 102, and the loading / unloading arm 121 further moves the work W to the processing machine 101b. It is brought in. Thereafter, the workpiece W is processed by the second processing machine 101b. After that, during the transfer of the workpiece W by the work loader 102, the measuring unit 100 measures the processing portion of the workpiece W by the second processing machine 101b in the same manner as after the processing by the first processing machine 101a. As described above, since the workpiece W can be measured while the workpiece W is being transferred by the workpiece loader 102, the machining cycle time can be shortened, and there is no need to provide a separate measuring device. The entire processing line can be downsized.

  The present invention is not limited to the above embodiment. For example, the optical path changer may be composed of a prism that bends the optical path by refraction in addition to the one that reflects the laser beam and bends the optical path as described above. An example of the configuration of the rotation mechanism that rotates the optical path changer (shaft), the switching mechanism that switches the position of the optical path changer, and the distance adjustment mechanism that changes the distance between the laser displacement meter and the optical path changer is shown. Any configuration may be used as long as it performs an equivalent operation. Furthermore, the processing line may include three or more processing machines.

DESCRIPTION OF SYMBOLS 1 Laser displacement meter 2 Optical path change device 100 Measuring apparatus 101a, 101b Processing machine 102 Work loader W Workpiece

Claims (4)

Equipped with laser displacement meter and optical path changer,
The optical path changer changes the optical path of the laser beam emitted from the laser displacement meter, and the position of the optical path changer is changed from the change position on the optical axis of the laser displacement meter and the optical axis of the laser displacement meter. A measuring apparatus that can be switched to a retracted position.   2. The measuring apparatus according to claim 1, wherein a distance between the laser displacement meter and the optical path changer at the change position is variable.   3. The measuring apparatus according to claim 1, wherein the laser displacement meter and the optical path changer are integrated and are movable in three orthogonal directions with the optical axis of the laser displacement meter as one axis. A plurality of processing machines and a work loader that transfers workpieces from one processing machine to another,
A processing line, wherein the measuring device according to claim 1, 2 or 3 is attached to a work loader.

Images