JP2017162945A - Lead frame for multi-row led and manufacturing method thereof, and led package and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame for multi-row LED which allows for compaction and thinning by improving heat dissipation characteristics of the lead frame itself, while improving adhesion of reflector resin to the pads or leads of the lead frame, and capable of reducing the cost by reducing the amount of reflector resin used.SOLUTION: In a lead frame for multi-row LED where a plurality of lead frame regions for LED are arranged and connected, respectively, via a coupling part 17, individual lead frame regions are formed in a region where a reflector resin part 15 is formed in a region surrounding at least the periphery of the pads and leads on the upper surface of a metal plate 1. In a region of the metal plate where the reflector resin part, surrounding the periphery of the pads and leads, is formed, a core 27 for reflector resin part is formed to project upward from the surface of the pads and leads.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a multi-row LED lead frame and a manufacturing method thereof, and an LED package and a manufacturing method thereof.

2. Description of the Related Art Optical semiconductor devices equipped with LED (Light Emitting Diode) elements have come to be used in various devices such as general lighting and displays such as televisions, mobile phones, and OA devices.
In these optical semiconductor devices, as LED packages that have been developed to meet demands for thinning and mass production, LED elements are conventionally mounted on lead frames having electrically insulated pad portions and lead portions, An LED in which a reflector resin portion is formed so as to surround a pad portion and a lead portion on the side on which the LED element is mounted, and the inner space on the side on which the LED element is mounted is sealed by the transparent resin portion. There is a package.

  In this type of LED package, for example, as shown in FIG. 7, the lead frame 10 includes a pad portion 11 and a lead portion 12 that is spaced apart from the pad portion 11. In addition, an LED element 20 is mounted on the pad portion 11 on the upper surface side of the lead frame 10, and the LED element 20 and the lead portion 12 are connected via a bonding wire 14 or the like. In addition, a reflector resin portion 15 that reflects light is formed around the LED element 20 so as to surround the pad portion 11 and the lead portion 12. The internal space surrounded by the reflector resin portion 15 and mounted with the LED element 20 is sealed with a transparent resin portion 16 made of a transparent resin.

  In addition, since the pad portion 11 and the lead portion 12 on the upper surface side of the lead frame 10 are flat and have poor adhesion to the reflector resin portion 15, the adhesion between the metal lead frame 10 and the reflector resin portion 15 is improved. In order to give the reflector resin portion 15 an anchor effect, a recess 19 is formed on the lower surface side of the lead frame 10 by half etching.

  Conventional LED packages having such a configuration are described in, for example, the following Patent Documents 1 and 2.

In FIG. 5 of Japanese Patent Laid-Open No. 2013-232506 shown as Patent Document 1 and FIG. 4 of Japanese Patent Laid-Open No. 2013-232508 shown as Patent Document 2, the upper surface side of the pad portion and the lead portion is a flat surface, and the lower surface side. 1 shows an LED package using a lead frame in which a concave portion for reflector resin is formed.

JP 2013-232506 A JP 2013-232508 A

By the way, the LED package manufactured using the above-mentioned multi-row lead frame is required to be small and thin.
However, although the heat from the LED element is released to the outside through the metal forming the lead part and the pad part, a certain amount of volume is required for the metal of the lead part and the pad part in order to sufficiently dissipate the heat, There is a limitation in reducing the size and thickness of the lead portion and the pad portion in the lead frame used for manufacturing the LED package.

  In addition, as described above, since the surface of the pad portion and the lead portion where the reflector resin portion is formed is formed flat as described above, the conventional lead frame is in close contact with the metal forming the lead frame substrate and the reflector resin portion. There is a risk that it is weak and may drop out. In order to improve the adhesion between the metal lead frame and the reflector resin, it is necessary to form a recess by half-etching the lower surface side of the lead frame as in the LED packages described in Patent Documents 1 and 2. However, the volume of the metal of the lead frame is reduced by the amount of forming the recess, and the heat dissipation effect is hindered. On the other hand, as described above, a certain amount of volume is required for the metal in order to dissipate heat from the metal of the lead portion and the pad portion. As a result, it is difficult to make the metal plate thin in the conventional lead frame in which the surface of the pad portion or lead portion where the reflector resin portion is formed is flat and the concave portion is provided on the lower surface side of the lead frame.

Moreover, since reflector resin is expensive, it is desired to reduce the amount of use.
However, in the conventional LED package, since the reflector resin portion is formed on the pad portion and the lead portion formed on a flat surface, the amount of use increases and the cost increases.

  The present invention has been made in view of such a problem, improves the heat dissipation effect, enables a reduction in size and thickness, and improves the adhesion between the pad portion and the lead portion and the reflector resin, Is intended to provide a multi-row LED lead frame and a method for manufacturing the same, and an LED package and a method for manufacturing the same.

  In order to achieve the above object, a multi-row LED lead frame according to the present invention is a multi-row LED lead frame in which a plurality of LED lead frame regions are arranged and connected via a connecting portion. In each of the lead frame regions, the reflector resin portion is formed in a region surrounding at least the pad portion and the lead portion on the upper surface side of the metal plate, and surrounds the periphery of the pad portion and the lead portion in the metal plate. In the region where the reflector resin portion is formed, there is a reflector resin portion core portion protruding above the surfaces of the pad portion and the lead portion.

  In the multi-row LED lead frame of the present invention, it is preferable that the core portion for the reflector resin portion is subjected to a roughening treatment.

  Also, the method for manufacturing a multi-column LED lead frame according to the present invention is a method for manufacturing a multi-column LED lead frame in which a plurality of LED lead frame regions are arranged and connected via connecting portions, respectively. On the upper surface side of the metal plate, an etching resist film for forming a core portion for the reflector resin portion is formed on the outer periphery of the pad portion and the outer periphery of the lead portion, respectively, and on the lower surface side of the metal plate, A step of forming an etching resist film covering a predetermined position corresponding to the pad portion and the lead portion; and half etching from the upper surface side of the metal plate, and the pad at a depth where the half etching is performed on the metal plate And a core portion for the reflector resin portion protruding from the lead portion and the lead portion, and through etching is performed from the lower surface side of the metal plate. A step of forming the pad portion and the lead portion, wherein the pad portion and the lead portion are penetrated and provided with a connecting portion, and the pad portion and the lead partitioned with the connecting portion. The pad portion including the reflector resin portion core and the lead portion is interposed between the partitioned pad portion and the lead portion, and is filled with reflector resin between the portion and the connecting portion. Forming a reflector resin portion that surrounds the outer periphery of the portion so as to protrude above the LED element mounted on the LED element mounting surface of the pad portion.

  In the method for manufacturing a lead frame for a multi-row type LED of the present invention, it is preferable that when the reflector resin part core is formed, the reflector resin part core is subjected to a roughening treatment.

  In addition, the LED package according to the present invention is an individual LED package formed by cutting a multi-row LED package in which a plurality of LED package regions are arranged and connected via a connecting portion, and is formed by through etching. A pad portion and a lead portion each having a connecting portion formed from a metal plate, and covering the connecting portion and being interposed between the pad portion and the lead portion, and the pad portion and the lead. A reflector resin part surrounding an outer periphery of the part, and the connecting part is exposed as part of a cut surface formed by cutting the multi-row LED package together with the reflector resin part, and the metal In the region of the plate where the reflector resin portion surrounding the pad portion and the lead portion is formed, the pad portion and the lead are formed. It is characterized by having a reflector resin portion wick section formed to project upward from the surface of the parts.

  In the LED package of the present invention, it is preferable that the core portion for the reflector resin portion is subjected to a roughening treatment.

  Further, in the LED package manufacturing method according to the present invention, the reflector resin portion is formed in an area surrounding at least the pad portion and the lead portion on the upper surface side of the metal plate, and the pad portion and the lead portion of the metal plate are formed. A plurality of LED lead frame regions each having a reflector resin portion core portion formed so as to protrude above the surfaces of the pad portion and the lead portion are arranged in a region where the reflector resin portion surrounding the periphery is formed. A step of preparing a lead frame for a multi-row type LED connected via a wire, a step of mounting an LED element on the pad portion on the upper surface side of the metal plate, and the reflector resin on the upper surface side of the metal plate A step of providing a transparent resin portion surrounded by a portion and filling an internal space in which the LED element is mounted; and in the reflector resin portion It is characterized by having the steps of cutting a portion surrounding the outer periphery of the pad portion and the lead portion with the coupling portion.

  Further, in the LED package manufacturing method of the present invention, in the step of preparing the multi-row LED lead frame, the multi-row LED lead frame to be prepared is roughened on the core portion of the reflector resin portion. Is preferably applied.

  According to the present invention, the heat dissipation effect can be improved, the size and thickness can be reduced, the adhesion between the pad portion and the lead portion and the reflector resin can be improved, and the amount of the reflector resin used can be reduced, and the cost can be reduced. A multi-row LED lead frame that can be reduced and a manufacturing method thereof, and an LED package and manufacturing method thereof can be obtained.

1 is a cross-sectional view showing a schematic configuration of pad portions and lead portions of individual lead frame regions in a multi-row type LED lead frame according to an embodiment of the present invention. FIG. FIG. 2 is a cross-sectional view showing a schematic configuration of individual lead frame regions in a multi-column LED lead frame according to an embodiment of the present invention which is completed by forming a reflector resin on the lead frame shown in FIG. 1. It is a top view which shows schematic structure of the lead frame for multi-row type LED concerning one Embodiment of this invention. It is sectional drawing of the LED package concerning one Embodiment of this invention. It is explanatory drawing which shows an example of the manufacturing process of the lead frame for multi-row type LED shown in FIG. It is explanatory drawing which shows an example of the manufacturing process of the LED package using the lead frame for multi-row type LED manufactured through the process shown in FIG. It is sectional drawing which shows schematic structure of the conventional LED package.

  Prior to the description of the embodiments, the background of deriving the present invention and the effects of the present invention will be described.

Background to Deriving the Present Invention The present inventor paid attention to increasing the volume of the metal that forms the base material of the lead frame in order to enhance the heat dissipation characteristics of the LED package. It was conceived that the core part for the reflector resin part was projected in the area where the reflector resin part surrounding the periphery of the pad part and the lead part on the upper surface side was formed with the metal constituting the lead frame above the surface of these areas. . When the core portion for the reflector resin portion is projected, the volume of the metal that forms the base material of the lead frame increases, so that improvement in heat dissipation characteristics can be expected.

  And if the reflector resin part is formed so that the protruding core part for the reflector resin part is inserted, the adhesion between the lead frame pad part and the lead part and the reflector resin part is improved, The effect of preventing the reflector resin portion from coming off from the pad portion and the lead portion is enhanced.

  On the other hand, by forming such a core part for the reflector resin part and ensuring the adhesion with the reflector resin part, the adhesion between the lead frame pad part and the lead part and the reflector resin part, which has been conventionally performed, can be achieved. It has also been found that the volume of the concave portion due to the half etching process from the lower surface side of the lead portion and the pad portion for improvement can be minimized. If the volume of the recess formed on the lower surface side can be minimized, the exposed area on the lower surface side of the lead portion and the pad portion can be increased, and the heat dissipation characteristics can be further improved.

  However, in order to form the core part for the reflector resin part so as to protrude from the base material of the lead frame, the core part for the reflector resin part is formed from the upper surface side with respect to the metal plate forming the base material of the lead frame. The portion to be left is left without being etched, while the periphery of the portion where the core portion for the reflector resin portion is formed, the pad portion, and the lead portion must be half-etched. When the pad part and the lead part are formed by half etching, the etched surface of the pad part and the lead part is unevenly formed, so that when this surface is used as a reflective surface, the light from the LED element is not reflected. There is concern about some adverse effects on reflection. On the other hand, if minute irregularities are formed unevenly, the effect of improving the adhesion with the reflector resin portion can be expected.

  Therefore, the present inventors actually formed a core part for the reflector resin part in which the pad part and the lead part protruded from the upper surface side by half etching with respect to the base material of the lead frame, and the pad part and lead part subjected to the half etching. The LED surface was plated to form a reflective surface, the LED element was mounted, and the reflector resin part was formed in a state where the core part for the reflector resin part was inserted to manufacture an LED package. As a result, the reflective surface formed on the half-etched surface in which minute irregularities were unevenly formed by plating the etched surface does not adversely affect the reflection of light from the LED element, and the performance of the LED package It was confirmed that there was no significant impact on In addition, the reflected light from the LED may be scattered on the surface where the minute irregularities are unevenly formed, which may cause the effect of canceling the unevenness of the reflected light caused by scratches formed on the base material of the lead frame. confirmed. As described above, it has been found that an LED package that can withstand practical use can be manufactured by using the lead frame in which the core portion for the reflector resin portion is projected by half etching from the upper surface and the pad portion and the lead portion are formed. Completed.

Advantageous Effects of the Present Invention The multi-row LED lead frame of the present invention is a multi-row LED lead frame in which a plurality of LED lead frame regions are arranged and connected via a connecting portion. In the frame region, the reflector resin portion is formed in a region surrounding at least the pad portion and the lead portion on the upper surface side of the metal plate, and the reflector resin portion surrounding the pad portion and the lead portion in the metal plate is formed. In the region, a reflector resin portion core portion is formed so as to protrude above the surfaces of the pad portion and the lead portion.

According to the multi-row LED lead frame of the present invention, the metal volume corresponding to the provision of the reflector resin core portion protruding above the surface of the pad portion and the lead portion increases, and the heat dissipation characteristics are improved. .
Further, by forming the reflector resin portion so that the core portion for the reflector resin portion is inserted, the adhesion between the LED element mounting region and the wire bonding region and the reflector resin portion is improved.
Furthermore, as a result of ensuring the adhesiveness with the reflector resin portion by the core portion for the reflector resin portion, the volume of the concave portion formed to improve the adhesiveness with the reflector resin portion is minimized on the lower surface side of the base material of the lead frame. The exposed area on the lower surface side of the lead part and the pad part is enlarged, and the heat dissipation characteristics are further improved.
Moreover, the reflector resin part is formed so that the core part for the reflector resin part is inserted, so that the reflector resin is formed on the LED element mounting area and the wire bonding area of the conventional flat pad part and lead part. Compared to the case where the multi-row type LED lead frame having the configuration in which the portion is formed is used, the amount of use of the reflector resin can be reduced by reducing the volume of the core portion for the reflector resin portion. As a result, cost can be reduced.

In the multi-row LED lead frame of the present invention, preferably, the core portion for the reflector resin portion is subjected to a roughening treatment.
If it does in this way, the adhesiveness of a reflector resin part will improve further.

  In addition, the multi-row LED lead frame manufacturing method of the present invention is a multi-row LED lead frame manufacturing method in which a plurality of LED lead frame regions are arranged and connected via connecting portions, respectively. An etching resist film for forming a core portion for the reflector resin portion is formed on the outer periphery of the pad portion and the outer periphery of the lead portion on the upper surface side of the metal plate, respectively, and the pad portion is formed on the lower surface side of the metal plate. And a step of forming an etching resist film covering a predetermined position corresponding to the lead portion, and half-etching is performed from the upper surface side of the metal plate, and the metal plate protrudes from the pad portion and the lead portion at the depth of the half-etching. A core portion for the reflector resin portion is formed, and through etching is performed from the lower surface side of the metal plate so that the pad portion and the lead portion penetrate, and The step of forming the pad portion and the lead portion including the connecting portion, and the reflector resin is filled between the pad portion and the lead portion partitioned by the connecting portion, covering the connecting portion, and the partitioned pad And a reflector that surrounds the outer periphery of the pad portion including the core portion for the reflector resin portion and the lead portion so as to protrude above the LED element mounted on the LED element mounting surface of the pad portion. Forming a resin portion.

  If constituted like the manufacturing method of the lead frame for multi-row type LED of the present invention, the core for the reflector resin part protrudes from the pad part and the lead part at the depth of half etching by half etching from the upper surface side of the metal plate. Since the portion can be formed, it is possible to obtain a multi-row type LED lead frame in which the adhesion between the reflector resin core and the reflector resin is improved when the reflector resin is filled and molded. Furthermore, since the surface formed by half-etching is a surface in which minute irregularities are formed non-uniformly, there is also an effect that the adhesion to the reflector resin is higher than that of a smooth surface.

Moreover, in the manufacturing method of the lead frame for multi-row type LEDs, preferably, when the core portion for the reflector resin portion is formed, a roughening process is performed on the core portion for the reflector resin portion.
If it does in this way, the adhesiveness of a reflector resin part will improve further.

  Also, the LED package of the present invention is an individual LED package formed by cutting a multi-row LED package in which a plurality of LED package regions are arranged and connected via a connecting portion, and through through etching. The pad portion and the lead portion, each of which is formed from a metal plate in a predetermined shape having a connecting portion, covers the connecting portion, is interposed between the pad portion and the lead portion, and surrounds the outer periphery of the pad portion and the lead portion. It has a reflector resin part, and the connecting part is exposed as a part of the cut surface formed by cutting the multi-row LED package together with the reflector resin part. Further, the pad part and the lead part of the metal plate are exposed. Reflector resin part that is formed to protrude above the surface of the pad part and lead part in the area where the reflector resin part surrounding the periphery is formed Having a core portion.

  As in the LED package of the present invention, if the reflector resin core portion is formed so as to protrude above the surfaces of the pad portion and the lead portion, the metal volume corresponding to the reflector resin core portion is provided. This increases the heat dissipation characteristics, improves the adhesion between the pad portion and the lead portion and the reflector resin, and reduces the amount of use of the reflector resin as much as the reflector resin core portion is provided, thereby reducing the cost. In addition, as a result of improving the heat dissipation characteristics of the lead frame, the durability of the LED package is improved.

Moreover, in the LED package of this invention, Preferably, the core part for reflector resin parts is roughened.
If it does in this way, the adhesiveness of a reflector resin part will improve further.

  In the LED package manufacturing method of the present invention, the reflector resin portion is formed at least in a region surrounding the periphery of the pad portion and the lead portion on the upper surface side of the metal plate, and around the pad portion and the lead portion in the metal plate. A plurality of LED lead frame regions each having a reflector resin portion core projecting upward from the surface of the pad portion and the lead portion are arranged in a region where the surrounding reflector resin portion is formed, and are connected via a connecting portion. The step of preparing the multi-row LED lead frame, the step of mounting the LED element on the pad portion on the upper surface side of the metal plate, and the LED element is surrounded by the reflector resin portion on the upper surface side of the metal plate, The step of providing a transparent resin part that fills the mounted internal space is connected to the part surrounding the outer periphery of the pad part and lead part in the reflector resin part. And a step of cutting with.

  If configured like the manufacturing method of the LED package of the present invention, the volume of the metal corresponding to the provision of the core portion for the reflector resin is increased, the exposed area on the lower surface side of the pad portion and the lead portion is increased, and the heat dissipation characteristics are excellent. It is possible to obtain an LED package in which the adhesiveness between the pad portion and the lead portion and the reflector resin is improved, and the amount of the reflector resin used is reduced by the amount provided with the reflector resin core portion.

Hereinafter, an example of the multi-row type LED lead frame of the present invention will be described with reference to FIGS.
FIG. 1 is a cross-sectional view showing a schematic configuration of pad portions and lead portions in individual lead frame regions in a multi-row type LED lead frame according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a schematic configuration of individual lead frame regions in a multi-row LED lead frame according to an embodiment of the present invention, which is completed by forming a reflector resin on the lead frame shown in FIG. FIG. 3 is a plan view showing a schematic configuration of a multi-row LED lead frame according to an embodiment of the present invention.

As shown in FIG. 2, the multi-row LED lead frame of the present embodiment has reflectors on the pad portion 11 and the lead portion 12 that are manufactured by half-etching the metal plate 1 that forms the base material of the lead frame 10. Resin portion 15 is formed.
The pad portion 11 and the lead portion 12 in each lead frame region are formed in a predetermined shape each having a connecting portion 17 shown in FIG. 3 from the metal plate 1 forming the base material of the lead frame 10.

In addition, a reflector resin portion core portion 27 protruding upward from these surfaces is formed around the upper surface of the pad portion 11 and the lead portion 12. And the reflector resin part 15 protrudes above the LED element 20 mounted on the LED element mounting surface of the pad part 11 so as to surround the outer periphery of the pad part 11 and the lead part 12 including the core part 27 for the reflector resin part. Is formed. The pad portion 11 and the lead portion 12 are formed with a reflective plating layer 13a on the entire surface including the core portion 27 for the reflector resin portion.

Next, an example of the LED package of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view of an LED package according to an embodiment of the present invention.
In the LED package of this embodiment, the LED element 20 is mounted on the LED element mounting surface of the pad portion 11, and the surface of the LED element 20 and the lead portion 12 is bonded by a bonding wire 14.
The transparent resin portion 16 is surrounded by the reflector resin portion 15 on the upper surface side of the pad portion 11 and the lead portion 12, and seals the internal space in which the LED element 20 is mounted.

Next, an example of a method for manufacturing a multi-row LED lead frame and a method for manufacturing an LED package according to the present invention will be described with reference to FIG.
In addition, since the pre-process and post-process of each process, such as a washing process and a drying process, are general processes, description is abbreviate | omitted.

  First, as shown in FIG. 5 (a), a copper alloy material having a thickness of 0.3 mm is prepared as the metal plate 1 that forms the base material of the lead frame 10, and pilot holes are formed at the edges of the outer frame portion. A dry film resist was laminated on both sides as shown in FIG. Conventionally, a copper alloy material having a thickness of about 0.2 mm is used. However, since the lead frame of the present invention has a large etching amount, a copper alloy material having a thickness of 0.25 mm to 0.45 mm was used.

Next, as shown in FIG. 5 (c), the pad portion 10, the lead portion 12, and the connecting portion 17 are formed on the upper surface side of the lead frame base material, and the reflector resin portion core portion 27 is not etched. A glass mask on which the remaining predetermined pattern is drawn is prepared, and on the lower surface side, a glass mask on which the predetermined pattern for forming the pad portion 10, the lead portion 12, and the connecting portion 17 is drawn is prepared. The resist mask 31 for etching was formed on both surfaces by determining the position of the glass mask based on the above and performing exposure and development.
Exposure and development are performed by a conventionally known method. For example, by irradiating ultraviolet rays in a state covered with a glass mask, reducing the solubility of the dry film resist portion irradiated with the ultraviolet rays that passed through the glass mask with respect to the developer, and removing other portions, A resist mask is formed. Although a negative dry film resist is used here as a resist, a negative liquid resist may be used for forming a resist mask. Furthermore, by using a positive dry film resist or a liquid resist, the solubility of the resist portion irradiated with ultraviolet rays that has passed through the glass mask is increased in the developing solution, and the resist mask is removed by removing the portion. You may make it form.

  Next, as shown in FIG. 5 (d), half etching is performed from the upper surface side to a depth of about 0.1 mm using an etching solution to form the pad portion 11 and the lead portion 12, and the reflector resin core. The part 27 was formed so as to remain without being etched on the upper surface side of the pad part 11 and the lead part 12. In addition, the pad portion 11 and the lead portion 12 were separated by a through etching process from the lower surface side performed simultaneously. Further, the connecting portion 17 was also formed by etching from the upper surface side and from the lower surface side. As a result of etching, the thickness of the pad portion 11 and the lead portion 12 was about 0.2 mm, and the height of the reflector resin core portion 27 was about 0.1 mm. The height of the reflector resin core portion 1627 may be 0.05 mm to 0.25 mm.

  Next, as shown in FIG. 5 (e), the resist mask 31 for etching on both sides is peeled off, and the entire surface including the pad portion 11 and the reflector resin core portion 27 in the lead portion 12 is plated, and a reflective plating layer is formed. 13a was formed. As the plating treatment, for example, a Ni plating layer is laminated in an order of 1.0 μm, a Pd plating layer is 0.03 μm, an Au plating layer is 0.003 μm, and an Ag plating layer is laminated in order of 2.0 μm. The Ag plating layer is preferably bright plating.

  Next, using a mold, as shown in FIG. 5 (f), a reflector resin is filled between the pad portion 11 formed with the connecting portion 17 and the lead portion 12 to cover the connecting portion 17. From the LED element 20 that is interposed between the pad part 11 and the lead part 12 and includes the pad part 11 including the reflector resin core part 27 and the outer periphery of the lead part 12 on the LED element mounting surface of the pad part 11. A reflector resin portion 15 is formed so as to protrude upward. As a result, the lead frame for a multi-row LED of this example was obtained.

  Next, as shown in FIG. 6A, the LED element 20 is mounted on the LED element mounting surface of the pad portion 11 of the multi-row LED lead frame of the present embodiment manufactured through the process shown in FIG. At the same time, as shown in FIG. 6B, the LED element 20 and the lead portion 12 were wire-bonded by the bonding wire 14.

  Next, as shown in FIG. 6C, on the upper surface side of the pad portion 11 and the lead portion 12, a transparent resin is filled so as to fill the internal space surrounded by the reflector resin portion 15 and in which the LED element 20 is mounted. The transparent resin part 16 was formed by filling and sealing with resin.

  Next, as shown in FIG. 6 (d), the part surrounding the outer periphery of the pad part 11 and the lead part 12 in the reflector resin part 15 was cut together with the part where the connecting part 17 is formed. This obtained the LED package of the present Example.

DESCRIPTION OF SYMBOLS 1 Metal plate 10 Lead frame 11 Pad part 12 Lead part 13a Reflective plating layer 14 Bonding wire 15 Reflector resin part 16 Transparent resin part 17 Connection part 19 Recess 20 LED element 27 Reflector resin part core part 31 Etching resist mask

Claims (8)

A plurality of LED lead frame regions are arranged, each connected via a connecting portion, a multi-row LED lead frame,
Individual lead frame areas
The reflector resin part is formed in a region surrounding at least the pad part and the lead part on the upper surface side of the metal plate,
In the metal plate, in a region where the reflector resin portion surrounding the pad portion and the lead portion is formed, a reflector resin portion core portion is formed so as to protrude above the surface of the pad portion and the lead portion. A multi-frame LED lead frame characterized by the above.   The lead frame for a multi-row LED according to claim 1, wherein the core portion for the reflector resin portion is subjected to a roughening process. A plurality of LED lead frame regions are arranged, and each is a manufacturing method of a multi-row LED lead frame connected via a connecting portion,
On the upper surface side of the metal plate, an etching resist film for forming a core portion for the reflector resin portion is formed on the outer periphery of the pad portion and the outer periphery of the lead portion, respectively, and on the lower surface side of the metal plate, Forming a resist film for etching covering a predetermined position corresponding to the pad portion and the lead portion;
Half-etching is performed from the upper surface side of the metal plate, and the reflector resin portion core portion protruding from the pad portion and the lead portion is formed at a depth of the half-etching in the metal plate, and the metal plate A step of performing through etching from the lower surface side, the pad portion and the lead portion are penetrating, and the pad portion and the lead portion are provided with a connecting portion;
Filling a reflector resin between the pad portion and the lead portion partitioned with the connecting portion, covering the connecting portion, and interposing between the partitioned pad portion and the lead portion, Forming a reflector resin portion that surrounds the pad portion including the core portion for the reflector resin portion and the outer periphery of the lead portion so as to protrude above the LED element mounted on the LED element mounting surface of the pad portion;
The manufacturing method of the lead frame for multi-row type LED characterized by having.   4. The method for manufacturing a lead frame for a multi-row LED according to claim 3, wherein when the reflector resin part core part is formed, a roughening process is performed on the reflector resin part core part. A plurality of LED package regions are arranged, and each LED package is formed by cutting a multi-row LED package connected via a connecting portion,
By the through etching, from the metal plate, the pad part and the lead part formed in a predetermined shape each having a connecting part,
Covering the connecting portion, interposed between the pad portion and the lead portion, and having a reflector resin portion surrounding the pad portion and the outer periphery of the lead portion,
The connecting portion is exposed as a part of a cut surface formed by cutting the multi-row LED package together with the reflector resin portion, and
In the metal plate, in a region where the reflector resin portion surrounding the pad portion and the lead portion is formed, a reflector resin portion core portion is formed so as to protrude above the surface of the pad portion and the lead portion. LED package characterized by   The LED package according to claim 5, wherein the core portion for the reflector resin portion is subjected to a roughening process. The reflector resin portion is formed in a region surrounding at least the pad portion and the lead portion on the upper surface side of the metal plate, and the reflector resin portion surrounding the pad portion and the lead portion in the metal plate is formed. In addition, a plurality of LED lead frame regions each having a reflector resin portion core portion projecting upward from the surfaces of the pad portion and the lead portion are arranged and connected via a connecting portion, respectively. Preparing the frame;
On the upper surface side of the metal plate, a step of mounting an LED element on the pad portion;
On the upper surface side of the metal plate, a step of providing a transparent resin portion that is surrounded by the reflector resin portion and fills the internal space in which the LED element is mounted;
Cutting the portion surrounding the pad portion and the lead portion in the reflector resin portion together with the connecting portion;
A method for manufacturing an LED package, comprising:   8. In the step of preparing the multi-row LED lead frame, the multi-row LED lead frame to be prepared is subjected to a roughening process on the core portion of the reflector resin portion. The manufacturing method of the LED package as described in 2.