JP2017161964A - Film touch panel and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film touch panel which has high adhesion of an electrode conductor pattern formed of an extreme fine pattern to a resin film, is hardly broken, has a low sheet resistance, can cope with a large high-speed response type, and facilitates production, and to provide a method for producing the same.SOLUTION: A film touch panel 100 is formed by sticking two X and Y electrode films 101 and 102 formed by a plurality of Cu conductor patterns 1 in parallel with each other on a resin film 2 so that the Cu conductor patterns 1 are orthogonal to each other. Both of the Cu conductor patterns 1 are embedded in each of the resin films 2. Three surfaces embedded in the resin film 2 of the Cu conductor patterns 1 are blacked.SELECTED DRAWING: Figure 1

Description

  The present invention embeds an extremely fine pattern in a resin film and bonds the two resin films so that the extremely fine patterns intersect at right angles to form an X, Y electrode conductor pattern and its manufacturing method (very fine) Pattern creation and embedding method).

  A conventional touch panel has a pattern formed of ITO on a glass or resin film and is bonded at a right angle to form X and Y electrodes as a capacitance sensor. In this method, since the sheet resistance (50 to 100Ω / □) of the ITO film used for pattern formation is high when the size is increased, there is a problem in response characteristics when the size is increased, which is about 12 inches at most. In order to reduce the sheet resistance value, a method of forming on a resin film by an ink jet method, a printing method, a photolithographic method or the like using a metal material such as Ag nanoparticles (nano ink), Cu paste or the like is also considered. Yes. In this method, since a fine pattern is formed on the film surface, the adhesive force (peel strength) between the bottom surface of the pattern and the film surface is not high, and there is a problem in pattern stability (adhesion degree, disconnection) and cost.

JP 2014-215922 A

  The present invention has been made in view of the above-mentioned points, and the object thereof is to provide a high-speed, large-sized size that has a high degree of adhesion to the resin film of the electrode conductor pattern consisting of an extremely fine pattern and is difficult to break, and has a low sheet resistance. An object of the present invention is to provide an easy-to-manufacture film touch panel that can be adapted to a response type and a manufacturing method thereof.

The present invention is a film formed by laminating two electrode films formed by forming a plurality of electrode conductor patterns in parallel on a resin film so that the electrode conductor patterns intersect (preferably orthogonal). A touch panel is characterized in that both electrode conductor patterns are embedded in respective resin films.
Since the electrode conductor pattern is embedded in the resin film, the degree of adhesion to the resin film of the electrode conductor pattern composed of an extremely fine pattern is increased, and disconnection is difficult. Thereby, a large-sized film touch panel can be easily and inexpensively configured.

Further, the present invention is characterized in that three sides of the both electrode conductor patterns embedded in the resin film are blackened.
By the blackening treatment, fine irregularities are formed on the three sides, and the degree of adhesion to the resin film can be further increased.

  In the present invention, the film touch panel is preferably bonded to a glass plate or a plastic plate.

In the present invention, two electrode films are formed by forming a plurality of electrode conductor patterns in parallel on a resin film, and the electrode conductor patterns of the two electrode films intersect (preferably orthogonal). A method of manufacturing a film touch panel manufactured by bonding to a film, wherein the electrode film forms a resist forming step for forming a resist layer on a surface of a carrier material, and grooves for forming an electrode conductor pattern in the resist layer A groove forming step, a pattern forming step of forming an electrode conductor pattern by plating in the groove, a resist peeling step of peeling the resist layer, and a resin film on the surface of the carrier material on which the electrode conductor pattern is formed A pattern embedding step of embedding the electrode conductor pattern in the surface of the resin film by heating and pressing A carrier material removing step of removing the electrode film made of a resin film embedded with the electrode conductor pattern by removing the carrier material, is characterized in that it is manufactured by.
According to this manufacturing method, the degree of adhesion of the electrode conductor pattern to the resin film is high, it is difficult to disconnect, and the electrode conductive pattern is formed by plating, so the sheet resistance is low and it is compatible with large-sized high-speed response types Can be manufactured easily.

  Further, the present invention is characterized in that, following the resist stripping step, a blackening treatment step of performing blackening treatment on three sides of the electrode conductor pattern exposed on the surface of the carrier material in the resist stripping step is performed.

  For the production of the film touch panel according to the present invention, a general plating method (electroplating method) is used instead of vapor deposition or thin film formation by a sputtering method, and expensive materials such as nano ink (Ag, Cu) are not used. It can be used to form a stable fine pattern and can be embedded in a resin film base material to form an X, Y electrode conductor pattern having a stable adhesion. As a result, the cost can be increased and the size can be increased.

  Here, the specific manufacturing method of the said film touch panel is demonstrated. That is, first, as a carrier material, for example, a conductive material such as phosphor bronze, Ni plate, SUS plate or the like is used, and after forming a resist layer on this conductive material, grooves are formed using printing, photolithography, direct drawing method, etc. Form.

  For example, when a Ni plate (20 to 100 μm thick) is used for the carrier substrate, a resist is applied on one side, or a thin film (5 to 10 μm) is pasted to form a resist layer, followed by printing, photolithography, direct A groove to be an electrode conductor pattern is formed by drawing or the like. In the case of the direct drawing method, it is performed with a YAG laser (including harmonics), a Co2 laser, a semiconductor laser, a UV-LED, or the like in accordance with the resist material or film.

  After forming the groove to be the electrode conductor pattern, it is placed in an electroplating tank to form a Cu conductor. The conductor thickness may be about 3 to 5 μm. In this plating step, since the Cu conductor is plated by electroplating on the side where the resist layer is not formed, the plating may be prevented from being applied with a protective film or resist.

  After forming the Cu conductor pattern (that is, the electrode conductor pattern), the resist layer is peeled off, and then the Cu conductor surface (3 exposed surfaces) is subjected to blackening treatment (about 1 μm thick). A resin film (PET, PEN) serving as a base material is placed on the substrate, and hot pressing is performed at high temperature and pressure. In this case, the bubbles may be removed by applying a vacuum. In addition, it is performed for several tens of seconds under a load of several atmospheres at a temperature that matches the melting temperature (thermoplasticity) of the resin material. The thickness of the resin serving as the substrate is about 20 to 100 μm and does not decrease the light transmittance. The base material and the Cu conductor are cross-sectional surfaces that are in contact with the base material, and the surface is roughened by the blackening treatment, so that it serves as a wedge that increases the adhesion. This increases the peel strength of the fine pattern (electrode conductor pattern) and the substrate (resin film). In addition, the blackened Cu pattern also serves as a black matrix and suppresses reflection on the image.

  As described above, the Cu conductor (electrode conductor pattern) is embedded in the base material (resin film), and the one-piece type is placed in the etching tank, and Ni on the entire surface of one side is removed. Since this etching is selective etching, only Ni is removed.

  The film created by the above-mentioned method becomes a film sheet (electrode film) in which a Cu conductor pattern (electrode conductor pattern) is embedded in a base material (resin film), and two such film sheets are placed at right angles (both electrode conductor patterns are Bond (so as to be orthogonal) to form X and Y electrodes and a film touch panel.

  Further, since the upper surface of the Cu conductor pattern (electrode conductor pattern) of the present invention is flush with the surface of the base material (resin film), the surface side of the Cu conductor pattern (electrode conductor pattern) has a flat surface configuration, and the thickness of the optical adhesive material Can be thinned.

  According to the present invention, it is possible to form an electrode conductor pattern with a very fine pattern embedded in a resin film, thereby making it possible to increase the degree of adhesion of the electrode conductor pattern to the resin film, making it difficult to disconnect, and by plating. Since the electrode conductor pattern is formed, it is possible to provide an easy-to-manufacture film touch panel that has a low sheet resistance, can be used for a large-sized high-speed response type, and can be thin, light, and bendable (3D shape).

1 is a perspective view showing a film touch panel 100. FIG. 1 is a perspective view showing an X electrode film 101. FIG. 2 is a perspective view showing a Y electrode film 102. FIG. FIG. 4 is an enlarged cross-sectional view taken along the line a-a ′ of FIG. 3. It is manufacturing method explanatory drawing of the film touch panel 100. FIG. It is manufacturing method explanatory drawing of the film touch panel 100. FIG. It is manufacturing method explanatory drawing of the film touch panel 100. FIG. It is manufacturing method explanatory drawing of the film touch panel 100. FIG. It is manufacturing method explanatory drawing of the film touch panel 100. FIG. It is manufacturing method explanatory drawing of the film touch panel 100. FIG. It is manufacturing method explanatory drawing of the film touch panel 100. FIG. It is manufacturing method explanatory drawing of the film touch panel 100. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a view showing a film touch panel 100 according to an embodiment of the present invention, and is a perspective view after bonding X and Y electrode films 101 and 102 together. 2 is a perspective view of the X electrode film 101, FIG. 3 is a perspective view of the Y electrode film 102, and FIG. 4 is an enlarged cross-sectional view taken along the line aa ′ of FIG. 5 to 12 are explanatory views of the production method of the present invention.

  Here, the structure of the film touch panel 100 will be described together with its manufacturing method. FIG. 5 shows a state in which the resist layer 4 is applied (about 5 μm) to the Ni plate (carrier material) 3. In the case of using roll-to-roll and film bonding as a resist layer, the state shown in FIG.

  FIG. 6 shows a state in which after the resist layer 4 is baked, a groove 6 serving as an electrode conductor pattern is formed by a laser (direct drawing). The laser 5 is selected according to the material of the resist layer 4 and the like. For example, a YAG laser (first, second, third, fourth harmonic), Co2 laser, semiconductor laser, UV-LED, or the like is used. Further, when the grooves 6 are formed by printing or photolithography, exposure and development are performed in a batch exposure or step.

  FIG. 7 shows a state in which the Ni plate 3 in which the groove 6 is formed in the resist layer 4 is immersed in the electroplating tank 7 and plating is performed in the groove 6. A DC voltage is applied between the Ni plate 3 in which the groove 6 is formed in the resist layer 4 and the electrode 9 in the electroplating tank 7, and the Cu plating thickness is adjusted by the product of current and time. The Cu plating thickness may be about 3 μm.

  FIG. 8 shows a state in which the Ni plate 3 in which the Cu conductor pattern (electrode conductor pattern) is plated in the groove 6 is immersed in the resist stripping tank 11. In this case, the resist stripping solution 12 is stripped with an alkaline solution (sodium hydroxide).

  FIG. 9 shows a state in which the Ni plate 3 with the Cu conductor pattern (electrode conductor pattern) 1 from which the resist layer 4 has been peeled is immersed in the blackening treatment tank 13. By performing blackening treatment (alkali treatment) only on the three surfaces exposed on the Ni plate 3 of the Cu conductor pattern (electrode conductor pattern) 1, the three surfaces of the Cu conductor pattern (electrode conductor pattern) 1 function as wedges. Therefore, the resin film 16 described below is firmly adhered to the resin.

  FIG. 10 shows a state where the Ni plate 3 and the resin film (base material) 16 on which the blackened Cu conductor pattern is formed are stacked on the vacuum hot press base 17. In the case of roll-to-roll, it may be performed in a high temperature state of the pressure roller.

  FIG. 11 shows a state in which the Ni plate 3 on which the blackened Cu conductor pattern 1 is formed and the resin film 16 are pressure-bonded are immersed in the etching solution 20 of the selective etching tank 19. Since the etching solution 20 is selective etching that etches only Ni, after the etching, the resin film 16 in which the Cu conductor pattern 1 is embedded, that is, the X electrode film 101 (see FIG. 2) or the Y electrode film 102 (see FIG. 3). It ’s done.

  FIG. 12 shows a case where the batch process described above is manufactured by roll-to-roll. A rolled Ni plate (thickness of about 20 μm) 22 and a rolled dry film (thickness of about 10 μm) 23 are bonded together while being wound up by a high-temperature pressure roller 24 to form a Cu conductor pattern by direct drawing, photolithography, printing, or the like 25. A groove is formed, and then a Cu conductor pattern is formed in the electroplating tank 27 and washed with water. Then, the dry film is washed with alkali in the peeling tank 28 and peeled off, followed by washing with water. Thereafter, the three surfaces of the Cu conductor pattern are blackened in the blackening treatment tank 29 and washed with water. A film 30 (PET, PEN) as a base material is bonded to the blackened Cu conductor pattern surface side by high-temperature pressure welding, and the Cu conductor pattern is embedded in the film 30 and integrated. Thereafter, the entire Ni on one side is removed only in the selective etching tank 33. Finally, the electrode films 101 and 102 in FIG. 2 and FIG. The electrode film 35 is crossed at right angles as X and Y electrode films 101 and 102 and bonded together with an optical adhesive material to form a film touch panel 100. It is also possible to use a method in which an electrode-formed film is wound up without being cut by the cutter 34, the X electrode roll and the Y electrode roll are bonded together, and then cut.

  In the manufacturing method of the present invention, a phosphor bronze plate or a SUS plate may be used instead of the Ni plate of the carrier material. For example, when a phosphor bronze plate is used, Ni plating is formed on the entire surface of one side of the phosphor bronze plate to a thickness of about 3 μm, and the subsequent process is the same as the manufacturing process using the Ni plate. A Cu conductor pattern embedding step is performed in the processing and the resin film. Then, two types of selective etching are performed. First, phosphor bronze etching is performed. In this case, the Cu conductor pattern is protected by a resin film and a Ni plate. Next, selective etching of Ni is performed. The subsequent steps are the same as the above-described steps.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. Moreover, as long as there is no contradiction in the objective, a structure, etc., the embodiment shown by the said description and each figure can combine the description content of each other. In addition, the above description and the description of each drawing can be an independent embodiment even if it is a part of it, and the embodiment of the present invention is an embodiment in which the above description and each drawing are combined. It is not limited to.

1 Cu conductor pattern (blackened)
2,16 Resin film (base material, base material, PET, PEN)
3 Carrier materials (Ni, phosphor bronze, etc.)
4 Resist layer 5 Laser (UV laser or photolithography)
6 groove (pattern groove)
7 Electroplating tank (Cu)
8 Plating solution (for Cu)
DESCRIPTION OF SYMBOLS 9 Electrode 11 Resist stripping tank 12 Resist stripping solution 13 Blackening processing tank 14 Blacking processing liquid 17 Vacuum hot press base 19 Selective etching tank 20 Etching liquid (for Ni)
22 Ni roll 23 Film roll or resist film 24 Pressure contact roll (high temperature)
25 Direct drawing or photolithography or printing 26 Development or film peeling + water washing 27 Electroplating (Cu) + water washing 28 Resist peeling + film peeling + water washing 29 Blackening treatment + water washing 30 Base material (film roll)
31 Pressing roll (high temperature)
32 Cooling roll 33 Selective etching + Washing 34 Cutter 35 Electrode film 100 Film touch panel 101 X electrode film 102 Y electrode film

Claims (5)

A film touch panel formed by laminating two electrode films formed by forming a plurality of electrode conductor patterns in parallel on a resin film so that the electrode conductor patterns intersect,
A film touch panel, wherein both the electrode conductor patterns are embedded in respective resin films. The film touch panel according to claim 1,
A film touch panel in which three surfaces of the electrode conductor patterns embedded in the resin film are blackened.   The film touch panel which bonded the film touch panel of Claim 1 or 2 to the glass plate or the plastic plate. Prepare two electrode films formed by forming a plurality of electrode conductor patterns in parallel on the resin film,
A method of manufacturing a film touch panel manufactured by pasting the electrode films so that the electrode conductor patterns intersect with each other,
The electrode film is
A resist forming step of forming a resist layer on the surface of the carrier material;
A groove forming step of forming a groove to be an electrode conductor pattern in the resist layer;
A pattern forming step of forming an electrode conductor pattern by plating in the groove;
A resist stripping step for stripping the resist layer;
A pattern embedding step of embedding the electrode conductor pattern in the surface of the resin film by heat-pressing the resin film on the surface of the carrier material on which the electrode conductor pattern is formed;
A carrier material removing step of taking out an electrode film made of a resin film in which the electrode conductor pattern is embedded by removing the carrier material;
A method for manufacturing a film touch panel, which is manufactured by: It is a manufacturing method of the film touch panel according to claim 4,
A method of manufacturing a film touch panel, comprising performing a blackening treatment step of blackening three surfaces of the electrode conductor pattern exposed on the surface of the carrier material in the resist peeling step after the resist peeling step.

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