JP2017161818A - Wavelength conversion member manufacturing method and wavelength conversion member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wavelength conversion member manufacturing method by which cracks due to laser encapsulation less likely occur.SOLUTION: A manufacturing method is provided for a wavelength conversion member 1 comprising a container 2 including a frame-like sidewall 4, a resin and a phosphor filling the container 2, a cover member 5 arranged on the sidewall 4 of the container 2, the sidewall 4 including a pair of long sides opposing to each other and a pair of short sides opposing to each other. The manufacturing method for the wavelength conversion member 1 includes the steps of: preparing the container 2; filling the container 2 with the resin and the phosphor; arranging a cover member 5 on the sidewall 4 of the container 2 with a first glass frit 8 interposed therebetween; melting the first glass frit 8 by irradiating laser; and bonding the sidewall 4 and the cover member 5 of the container 2. The container 2 is encapsulated by irradiating laser when laser beam irradiation is performed such that an initial point and an endpoint for laser scanning are positioned on the short side of the sidewall 4 of the container 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a wavelength conversion member that converts the wavelength of light emitted from a light emitting diode (LED) or a laser diode (LD) to another wavelength, and a wavelength conversion member.

  In recent years, as a next-generation light-emitting device that replaces fluorescent lamps and incandescent lamps, attention has been focused on light-emitting devices using LEDs and LDs from the viewpoint of low power consumption, small size and light weight, and easy light quantity adjustment. As an example of such a next-generation light-emitting device, for example, in Patent Document 1, a wavelength conversion member that absorbs part of light from the LED and converts it into yellow light is disposed on the LED that emits blue light. A light emitting device is disclosed. In this light emitting device, white light that is a combined light of blue light emitted from the LED and yellow light emitted from the wavelength conversion member is emitted.

  Patent Document 1 describes a wavelength conversion member formed by encapsulating a resin layer in a transparent substrate. In Patent Document 1, the resin layer is composed of a resin and semiconductor fine particles (quantum dot phosphor) dispersed and held in the resin.

International Publication No. 2012/132232

  As a method of manufacturing a wavelength conversion member as in Patent Document 1, for example, a method of sealing the package by laser irradiation in a state where a glass substrate is placed on a package filled with a resin containing a phosphor is known. Yes. However, when the wavelength conversion member is manufactured by such a method, the wavelength conversion member may be cracked by laser sealing.

  The objective of this invention is providing the manufacturing method and wavelength conversion member of a wavelength conversion member which are hard to produce the crack by laser sealing.

  A wavelength conversion member manufacturing method according to the present invention includes a container having a frame-shaped side wall, a resin and a phosphor filled in the container, and a cover member disposed on the side wall of the container, The method for manufacturing a wavelength conversion member, wherein the side wall has a pair of long sides facing each other and a pair of short sides facing each other, the step of preparing the container, and a resin and a resin in the container A step of filling the phosphor; and the cover member is disposed on the side wall of the container via the first glass frit, and the first glass frit is melted by irradiating a laser, whereby the side wall of the container And joining the cover member, and when irradiating the laser, the laser scanning start point and end point are positioned on the short side on the side wall of the container. Irradiating the is characterized by sealing the container.

  In the method of manufacturing a wavelength conversion member according to the present invention, preferably, in the step of preparing the container, the container including a bottom plate and the side wall disposed on the bottom plate is prepared. In that case, in the step of preparing the container, the side wall is disposed on the bottom plate via a second glass frit, and the second glass frit is melted by firing, and the bottom plate and the side wall are joined. It is preferable to prepare the said container by making it.

  The method for manufacturing a wavelength conversion member according to the present invention may further include a step of forming a reflection member on a side surface of the side wall of the container.

  In the method for manufacturing a wavelength conversion member according to the present invention, the ratio of the length of the long side to the short side (long side / short side) is preferably 1.5 or more and 6.0 or less.

  In the method for manufacturing a wavelength conversion member according to the present invention, preferably, the cover member has a thickness of 0.2 mm or less.

  The wavelength conversion member according to the present invention includes a container having a frame-shaped side wall, a resin and a phosphor filled in the container, and a cover disposed on the side wall of the container so as to seal the container. A wavelength conversion member having a pair of long sides facing each other and a pair of short sides facing each other, wherein the side wall and the cover member of the container are lasers. Are joined via a first glass frit that is melted by irradiation, and a start point and an end point of laser scanning are located on the short side on the side wall of the container.

  In the wavelength conversion member according to the present invention, preferably, the container includes a bottom plate and the side wall disposed on the bottom plate, and the bottom plate and the side wall are joined via a second glass frit. Yes.

  In the wavelength conversion member according to the present invention, preferably, the first glass frit includes at least one metal selected from Fe, Mn, and Cu or a compound containing the metal.

  In the wavelength conversion member according to the present invention, preferably, the second glass frit does not include at least one metal selected from Fe, Mn, and Cu or a compound containing the metal.

  In the wavelength conversion member according to the present invention, preferably, the side wall is made of low-temperature co-sintered ceramics.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the wavelength conversion member which is hard to produce the crack by laser sealing can be provided.

It is a typical perspective view showing the wavelength conversion member concerning a 1st embodiment of the present invention. It is typical sectional drawing which follows the AA line of FIG. It is a typical top view by the side of the 2nd main surface in the side wall which comprises the wavelength conversion member which concerns on the 1st Embodiment of this invention. It is a typical perspective view for demonstrating the manufacturing method of the wavelength conversion member which concerns on the 1st Embodiment of this invention. It is a typical perspective view for demonstrating the manufacturing method of the wavelength conversion member which concerns on the 1st Embodiment of this invention. It is a typical perspective view for demonstrating the manufacturing method of the wavelength conversion member which concerns on the 1st Embodiment of this invention. It is a typical perspective view for demonstrating the manufacturing method of the wavelength conversion member which concerns on the 1st Embodiment of this invention. It is a typical perspective view for demonstrating the manufacturing method of the wavelength conversion member which concerns on the 1st Embodiment of this invention. It is a schematic plan view for demonstrating the laser irradiation method in the manufacturing method of the wavelength conversion member which concerns on the 1st Embodiment of this invention. It is a typical sectional view showing the wavelength conversion member concerning a 2nd embodiment of the present invention. It is a typical top view which shows the wavelength conversion member which concerns on the 3rd Embodiment of this invention.

  Hereinafter, preferred embodiments will be described. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments. Moreover, in each drawing, the member which has the substantially the same function may be referred with the same code | symbol.

[First Embodiment]
FIG. 1 is a schematic perspective view showing a wavelength conversion member according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view taken along line AA in FIG. As shown in FIGS. 1 and 2, the wavelength conversion member 1 includes a container 2, a resin 6, a phosphor 7, and a cover member 5. The resin 6 and the phosphor 7 constitute a resin layer 12. The resin layer 12 is filled in the recess 2 a of the container 2.

  The container 2 has a bottom plate 3 and a side wall 4. The planar shape of the bottom plate 3 is a rectangle. A frame-like side wall 4 is provided on the bottom plate 3. The side wall 4 has a first main surface 4a and a second main surface 4b facing each other. The first main surface 4a is disposed on the bottom plate 3 side. The second main surface 4 b is disposed on the side opposite to the bottom plate 3. Cover member 5 is arranged on second main surface 4b. The cover member 5 is provided so as to seal the container 2. More specifically, the cover member 5 is joined to the side wall 4 of the container 2 via the first glass frit 8. The first glass frit 8 is a glass frit that is melted by laser irradiation.

  FIG. 3 is a schematic plan view of the second main surface side of the side wall constituting the wavelength conversion member according to the first embodiment of the present invention.

  As shown in FIG. 3, the side wall 4 has a pair of short sides 4c1 and 4c2 facing each other and a pair of long sides 4d1 and 4d2 facing each other. The short sides 4c1 and 4c2 and the long sides 4d1 and 4d2 are linear. The second main surface 4b is the main surface of the side wall 4 on the first glass frit 8 side. In the present embodiment, the laser scanning start point 9 and end point 10 are located on the second side 4c1 of the side wall 4 on the short side 4c1 side. However, the start point 9 and the end point 10 of the laser scanning may be provided on the short side 4 c 2 side on the second main surface 4 b of the side wall 4. In the present specification, the short side 4c1 side of the second main surface 4b includes corner portions 4f and 4g. Moreover, the short side 4c2 side in the 2nd main surface 4b shall contain the corner | angular parts 4h and 4i.

  Returning to FIG. 2, the wavelength conversion member 1 converts the wavelength of the excitation light emitted from the light source. More specifically, excitation light enters from the bottom plate 3 in the wavelength conversion member 1. The incident excitation light passes through the bottom plate 3 and enters the resin layer 12. The phosphor 7 in the resin layer 12 is excited by the excitation light, and the fluorescence is emitted. The fluorescent light or the mixed light of the fluorescent light and the excitation light is emitted through the cover member 5.

  Hereinafter, with reference to FIGS. 4-8, the manufacturing method of the wavelength conversion member 1 is demonstrated.

(Manufacturing method of wavelength conversion member)
4 to 8 are schematic perspective views for explaining the method for manufacturing the wavelength conversion member according to the first embodiment of the present invention.

  First, the container 2 is prepared as follows.

  As shown in FIG. 4, the 2nd glass frit 11 is printed on the baseplate 3, and it bakes. Under the present circumstances, baking can be performed at the temperature of 300 to 550 degreeC, for example. Subsequently, as shown in FIG. 5, the side wall 4 is arranged on the bottom plate 3 so that the first main surface 4 a shown in FIG. 2 is placed on the portion where the second glass frit 11 is provided. In addition, the side wall 4 should just be provided so that at least one part may overlap with the part in which the 2nd glass frit 11 is provided in planar view. But it is preferable that the side wall 4 is provided so that it may overlap with the part in which the 2nd glass frit 11 is provided in planar view.

  Next, the container 2 is obtained by firing with the side wall 4 disposed on the bottom plate 3 via the second glass frit 11. In this case, the firing can be performed, for example, in an electric furnace. Moreover, baking can be performed at the temperature of 590 degreeC-650 degreeC, for example.

  The container 2 may be one in which the bottom plate 3 and the side wall 4 are integrally formed.

  Then, as shown in FIG. 6, the 1st glass frit 8 is printed on the 2nd main surface 4b of the side wall 4 in the obtained container 2, and it bakes. Under the present circumstances, baking can be performed at the temperature of 300 to 550 degreeC, for example. After firing, as shown in FIG. 7, resin and phosphor are filled into the recess 2 a of the container 2 to form a resin layer 12. The resin layer 12 may be formed so as to completely fill the concave portion 2 a of the container 2, or may be formed so as to leave a part of the void in the concave portion 2 a of the container 2. Further, in the resin layer 12, it is desirable that the phosphor is dispersed in the resin.

  Next, as shown in FIG. 8, the cover member 5 is disposed on the second main surface 4 b of the side wall 4 in a portion where the first glass frit 8 is provided. In addition, the cover member 5 should just be provided so that at least one part may overlap with the part in which the 1st glass frit 8 is provided in planar view. But it is preferable that the cover member 5 is provided so that it may overlap with the part in which the 1st glass frit 8 is provided in planar view.

  Next, on the second main surface 4 b of the side wall 4, with the cover member 5 disposed via the first glass frit 8, the laser 14 is irradiated from the laser light source 13 to seal the recess 2 a of the container 2. Stop. Hereinafter, the irradiation method of the laser 14 will be described in more detail with reference to FIG.

  FIG. 9 is a schematic plan view for explaining a laser irradiation method in the method of manufacturing a wavelength conversion member according to the first embodiment of the present invention.

  When irradiating with laser, first, the starting point 9 is irradiated with laser. Subsequently, the laser is scanned along the direction of the arrow and circulated. The circulated laser is irradiated from the start point 9 to the end point 10. Thereby, the recess of the container is sealed. As in the present embodiment, the end point 10 of the laser scanning may be a position exceeding the starting point 9 after the laser is circulated, or may be the same position as the starting point 9. If the start point 9 and the end point 10 of the laser scanning are located on the short side 4c1 or the short side 4c2 side on the second main surface 4b of the side wall 4, there is no particular limitation.

  Thus, in the present embodiment, the start point 9 and the end point 10 of the laser scanning are located on the short side 4c1 or the short side 4c2 side on the second main surface 4b of the side wall 4. Therefore, compared with the case where the start point 9 and the end point 10 of laser scanning are located on the long side 4d1 or the long side 4d2 side, cracks in the wavelength conversion member 1 are less likely to occur.

  The reason why it is difficult for the wavelength conversion member 1 to be cracked by positioning the start point 9 and the end point 10 of the laser scanning on the side of the short side 4c1 or the short side 4c2 on the second main surface 4b of the side wall 4. Is considered as follows.

  When the resin filled in the recess 2a of the container 2 is cured, the short sides 4c1 and 4c2 of the side wall 4 are short and thus are not easily deformed. That is, a large residual stress is applied to the side wall 4 on the short side 4c1 and 4c2 side. Does not occur. On the other hand, since the long sides 4d1 and 4d2 of the side wall 4 are long, deformation is likely to occur, that is, a large residual stress is likely to be generated on the side wall 4 on the long side 4d1 and 4d2 side. Further, stress is also generated at the start point 9 and the end point 10 of the laser scanning. Therefore, the residual stress is suppressed to an allowable range by positioning the laser scanning start point 9 and end point 10 on the short sides 4c1 and 4c2 side where only a small stress remains, rather than the long sides 4d1 and 4d2 side where a large stress remains. It is thought that it is possible.

  From the viewpoint of further suppressing the generation of stress in the sealing portion and making the wavelength conversion member 1 more difficult to crack, the length of the short sides 4c1 and 4c2 is preferably 4 mm or less, particularly preferably 3 mm or less. From the viewpoint of mechanical strength of the wavelength conversion member 1 and ease of handling during conveyance, the length of the short sides 4c1 and 4c2 is preferably 0.2 mm or more, particularly 0.3 mm or more. The ratio of the lengths of the long sides 4d1 and 4d2 to the short sides 4c1 and 4c2 (long side / short side) is preferably 1.5 or more, more preferably 2.0 or more, and preferably 6.0 or less. Preferably it is 5.0 or less.

  Moreover, in this embodiment, since the crack of the cover member 5 in the wavelength conversion member 1 does not easily occur, the thickness of the cover member 5 can be reduced. Therefore, the wavelength conversion member 1 can be downsized.

  From the viewpoint of further miniaturization of the wavelength conversion member 1, the thickness of the cover member 5 is preferably 0.2 mm or less, more preferably 0.1 mm or less.

  Hereinafter, the detail of each material which comprises the wavelength conversion member of this invention, such as the wavelength conversion member 1, is demonstrated.

(container)
The container has a bottom plate and side walls. The side wall is provided on the bottom plate.

The bottom plate can be made of a transparent material. As a material constituting the bottom plate, for example, glass can be used. Examples of the glass include SiO ₂ —B ₂ O ₃ —RO (R is Mg, Ca, Sr, or Ba) -based glass, SiO ₂ —B ₂ O ₃ —R ′ ₂ O (R ′ is Li, Na, or Ka). ) Series glass, SiO ₂ —B ₂ O ₃ —RO—R ′ ₂ O (R is Mg, Ca, Sr or Ba, R ′ is Li, Na or Ka) series glass, SnO—P ₂ O ₅ series glass, TeO ₂ -based glass or Bi ₂ O ₃ -based glass can be used.

  The side wall is preferably made of ceramics with high reflectivity. In this case, since excitation light and fluorescence can be reflected, the light utilization efficiency can be further enhanced. As a ceramic with high reflectance, for example, low temperature co-sintered ceramic (LTCC) can be mentioned. As the LTCC, for example, alumina-glass ceramics can be used.

  The container may have a bottom plate and a side wall integrally formed. By making the container in which the bottom plate and the side wall are integrally formed, it is possible to further suppress deformation of the container when the resin filled in the concave portion of the container is cured.

(Resin layer)
The resin layer includes a resin and a phosphor. The phosphor is preferably dispersed in the resin.

  As the resin, for example, an ultraviolet curable resin or a thermosetting resin is used. Specifically, for example, an epoxy curable resin, an acrylic ultraviolet curable resin, a silicone curable resin, or the like can be used.

  For example, quantum dots can be used as the phosphor. Examples of the quantum dot include II-VI group compounds and III-V group compounds. Examples of the II-VI group compound include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe and the like. Examples of the III-V group compound include InP, GaN, GaAs, GaP, AlN, AlP, AlSb, InN, InAs, and InSb. At least one selected from these compounds, or a composite of two or more of these can be used as quantum dots. Examples of the composite include those having a core-shell structure, such as those having a core-shell structure in which the surface of CdSe particles is coated with ZnS.

  The phosphor is not limited to quantum dots. For example, oxide phosphor, nitride phosphor, oxynitride phosphor, chloride phosphor, acid chloride phosphor, sulfide phosphor, oxysulfide Inorganic phosphor particles such as a product phosphor, a halide phosphor, a chalcogenide phosphor, an aluminate phosphor, a halophosphate phosphor, or a garnet compound phosphor may be used.

(First and second glass frit)
The first glass frit is a glass frit that is melted by laser irradiation.

  As the first glass frit, for example, a glass frit containing an inorganic powder containing SnO-containing glass powder and a pigment can be used.

SnO-containing glass, a glass composition, in _mol%, SnO35~70%, preferably contains _P 2 O 5 _10~30%. SnO is a component that lowers the melting point of glass. P ₂ O ₅ is a component that enhances the thermal stability of the glass.

Furthermore, SnO-containing _{glass, ZnO, B 2 O 3,} Al 2 O 3, SiO 2, In 2 O 3, Ta 2 O 5, La 2 O 3, MoO 3, WO 3, Li 2 O, Na 2 O , K ₂ O, MgO, BaO or F ₂ may be contained.

  The pigment is preferably an inorganic pigment, and more preferably contains at least one metal selected from Fe, Mn, Cu and the like or a compound containing the above metal in order to easily generate heat by absorbing laser light.

  As the second glass frit, a glass frit containing an inorganic powder containing a SnO-containing glass powder can be used.

SnO-containing glass, a glass composition, in _mol%, SnO35~70%, preferably contains _P 2 O 5 _10~30%. SnO is a component that lowers the melting point of glass. P ₂ O ₅ is a component that enhances the thermal stability of the glass.

Furthermore, SnO-containing _{glass, ZnO, B 2 O 3,} Al 2 O 3, SiO 2, In 2 O 3, Ta 2 O 5, La 2 O 3, MoO 3, WO 3, Li 2 O, Na 2 O , K ₂ O, MgO, BaO or F ₂ may be contained.

  The second glass frit preferably does not contain an inorganic pigment such as at least one metal selected from Fe, Mn and Cu or a compound containing the above metal. In that case, since the excitation light and fluorescence are not absorbed by the inorganic pigment, the light utilization efficiency can be further enhanced.

(Cover member)
The cover member can be made of a transparent material. As a material constituting the cover member, for example, glass can be used. Examples of the glass include SiO ₂ —B ₂ O ₃ —RO (R is Mg, Ca, Sr, or Ba) -based glass, SiO ₂ —B ₂ O ₃ —R ′ ₂ O (R ′ is Li, Na, or Ka). ) Series glass, SiO ₂ —B ₂ O ₃ —RO—R ′ ₂ O (R is Mg, Ca, Sr or Ba, R ′ is Li, Na or Ka) series glass, SnO—P ₂ O ₅ series glass, TeO ₂ -based glass or Bi ₂ O ₃ -based glass can be used.

  When the bottom plate and the cover member are made of glass, it is possible to further suppress the permeation of moisture and oxygen. In this case, since the phosphor contained in the resin layer is unlikely to deteriorate, a highly reliable wavelength conversion member can be obtained.

[Second Embodiment]
FIG. 10 is a schematic cross-sectional view of a wavelength conversion member according to the second embodiment of the present invention.

  As shown in FIG. 10, in the wavelength conversion member 21, a reflection member 22 is provided on the side surfaces of the container 2 and the cover member 5. Although it does not specifically limit as a material which comprises the reflection member 22, For example, the ceramic and metal containing an alumina, a titania, etc. can be used. Other points are the same as in the first embodiment.

  Also in the wavelength conversion member 21, since the start point and end point of laser scanning are located on the short side on the second main surface 4b of the side wall 4, the residual stress in the sealing portion by the laser is suppressed to an allowable range. be able to. Therefore, the wavelength conversion member 21 is hardly cracked. In particular, since the cover member 5 is not easily cracked in the wavelength conversion member 21, the thickness of the cover member 5 can be reduced, and the wavelength conversion member 21 can be downsized.

  Furthermore, since the reflection member 22 is provided in the wavelength conversion member 21, excitation light and fluorescence can be reflected. Therefore, the light utilization efficiency can be further enhanced.

  In addition, in this embodiment, although the reflection member 22 is provided in the whole side surface of the container 2 and the cover member 5, the reflection member 22 may be provided only in the side surface of the side wall 4 in the container 2. FIG. Even in that case, excitation light and fluorescence can be reflected, and the utilization efficiency of light can be further enhanced.

[Third Embodiment]
FIG. 11 is a schematic plan view of a wavelength conversion member according to the third embodiment of the present invention. As shown in a schematic plan view in FIG. 11, in the wavelength conversion member 31, the outer peripheral portions on the short side 4 c 1 side and the short side 4 c 2 side are each arcuate. Further, the short side 4c1 and the short side 4c2 of the side wall 4 are also arc-shaped. Other points are the same as in the first embodiment.

  Also in the wavelength conversion member 31, since the laser scanning start point 9 and end point 10 are located on the short side 4c1 side on the second main surface of the side wall 4, the residual stress in the laser sealing portion is within an allowable range. Can be suppressed. Therefore, the wavelength conversion member 31 is not easily cracked. In particular, since the crack of the cover member 5 in the wavelength conversion member 31 is unlikely to occur, the thickness of the cover member 5 can be reduced, and the wavelength conversion member 31 can be downsized.

DESCRIPTION OF SYMBOLS 1, 21, 31 ... Wavelength conversion member 2 ... Container 2a ... Recess 3 ... Bottom plate 4 ... Side wall 4a ... 1st main surface 4b ... 2nd main surface 4c1, 4c2 ... Short side 4d1, 4d2 ... Long side 4f, 4g 4h, 4i ... corner 5 ... cover member 6 ... resin 7 ... phosphor 8 ... first glass frit 9 ... start point 10 ... end point 11 ... second glass frit 12 ... resin layer 13 ... laser light source 14 ... laser 22 ... Reflection member

Claims (11)

A container having a frame-shaped side wall, a resin and a phosphor filled in the container, and a cover member disposed on the side wall of the container, the pair of long sides facing each other A method for producing a wavelength conversion member having a side and a pair of short sides facing each other,
Preparing the container;
Filling the container with resin and phosphor;
Disposing the cover member on the side wall of the container via a first glass frit, irradiating a laser to melt the first glass frit, and joining the side wall of the container and the cover member When,
With
When irradiating the laser, on the side wall of the container, manufacturing the wavelength conversion member that seals the container by irradiating the laser so that the laser scanning start point and end point are positioned on the short side Method.   The method for manufacturing a wavelength conversion member according to claim 1, wherein in the step of preparing the container, the container including a bottom plate and the side wall disposed on the bottom plate is prepared.   In the step of preparing the container, the second glass frit is melted by placing the side wall on the bottom plate via a second glass frit and firing, and the bottom plate and the side wall are joined. The method for producing a wavelength conversion member according to claim 2, wherein the container is prepared.   The manufacturing method of the wavelength conversion member of Claim 2 or 3 further equipped with the process of forming a reflection member in the side surface of the said side wall in the said container.   5. The wavelength conversion member according to claim 1, wherein a ratio of a length of the long side to the short side (long side / short side) is 1.5 or more and 6.0 or less. Production method.   The method for manufacturing a wavelength conversion member according to claim 1, wherein the cover member has a thickness of 0.2 mm or less. A container having a frame-shaped side wall; a resin and a phosphor filled in the container; and a cover member disposed on the side wall of the container so as to seal the container; A wavelength conversion member having a pair of long sides facing each other and a pair of short sides facing each other,
The side wall of the container and the cover member are joined via a first glass frit that is melted by laser irradiation,
A wavelength conversion member in which a start point and an end point of laser scanning are located on the short side on the side wall of the container.   The wavelength conversion member according to claim 7, wherein the container includes a bottom plate and the side wall disposed on the bottom plate, and the bottom plate and the side wall are joined via a second glass frit.   The wavelength conversion member according to claim 7 or 8, wherein the first glass frit includes at least one metal selected from Fe, Mn, and Cu or a compound containing the metal.   The wavelength conversion member according to claim 8 or 9, wherein the second glass frit does not contain at least one metal selected from Fe, Mn, and Cu or a compound containing the metal.   The wavelength conversion member according to any one of claims 8 to 10, wherein the side wall is made of low-temperature co-sintered ceramics.

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