JP2017157765A - Calibration method for control data and component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a calibration method for control data and a component mounting apparatus that can accurately calibrate a control data.SOLUTION: A calibration substrate having plural calibration marks provided in a lattice pattern is positioned by a substrate transfer mechanism. Subsequently, the plural calibration marks on the calibration substrate are sequentially imaged by imaging means to achieve data of actual measurement values of the position of a mounting head corresponding to each calibration mark. Next, based on the data of the actual measurement values, the inclination of a first beam when the shape of the first beam is approximated by a straight line is calculated for each position of the first beam with respect to a second beam, and furthermore the shape of the first beam is derived. Next, based on the inclination and shape of the first beam is calculated a calibration value of the control data of the mounting head in a region containing an in-plane region as a region in which the calibration marks are provided in the plane of the calibration substrate and a region which is set outside the in-plane region.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a control data calibration method and a component mounting apparatus.

  In the mounting field, a component mounting apparatus for mounting a component on a substrate by moving a mounting head holding a component in a horizontal direction is widely known. As the mounting head moving means, there are many component mounting apparatuses that include a moving mechanism composed of an X-axis beam extending in the horizontal X-axis direction and a Y-axis beam extending in the Y-axis direction orthogonal to the X-axis direction in the horizontal plane. It is adopted in. The mounting head is provided to be movable in the X-axis direction with respect to the X-axis beam, and the X-axis beam is provided to be movable in the Y-axis direction with respect to the Y-axis beam.

  In the component mounting apparatus described above, there may be a deviation between the actual position of the mounting head and the position defined on the control data due to distortion of each beam, assembly error, and the like. In order to cancel such a shift and appropriately control the movement of the mounting head, so-called calibration for calibrating the control data is executed at the time of manufacturing, installing, or maintaining the equipment. More specifically, a calibration substrate provided with a plurality of calibration marks is transported / positioned using a substrate transport mechanism, and a plurality of calibration marks are moved by a camera (imaging means) that moves integrally with the mounting head. Are sequentially imaged. The control unit of the component mounting apparatus obtains a deviation amount between the actual position of the calibration mark and the camera position on the control data by recognizing the captured image, and calibrates the control data based on the deviation amount. .

  In the control data calibration method described above, only control data in a region within the surface of the calibration substrate where the calibration mark exists can be calibrated, and control data in a region outside the surface of the calibration substrate can be calibrated. could not. Therefore, in the past, when the component mounting apparatus is a so-called dual type in which a plurality of X-axis beams are provided and a mounting head and a camera are mounted for each X-axis beam, these mounting heads are used to move the calibration substrate out of plane. There has been proposed a method of calibrating control data in this area (see, for example, Patent Document 1). In Patent Document 1, one mounting head to which a plate type gauge having a calibration mark is attached is moved to a region outside the surface of the calibration substrate, and the camera provided for the other mounting head is used for calibration. A component mounting apparatus that calibrates control data by imaging a mark is disclosed. According to this method, the calibration mark can be aligned with an area outside the surface of the calibration substrate, so that the mounting head control data in the area can be calibrated.

Japanese Patent No. 5338767

  However, in the prior art including Patent Document 1, when the X-axis beam that moves one mounting head to which the plate type gauge is attached is distorted, the calibration mark on the plate type gauge is attached to the calibration substrate. It will deviate from the normal position which should be aligned in the out-of-plane region. Therefore, even if the calibration mark of the plate type gauge is imaged by the camera corresponding to the other mounting head and the control data is calibrated based on the acquired captured image, the control data is extremely inaccurate. As described above, calibration of control data using a plurality of beams for moving the mounting head and the camera lacks accuracy, and the mounting head movement control cannot be performed with high accuracy, and as a result, the mounting accuracy of the components decreases. was there.

  Accordingly, an object of the present invention is to provide a control data calibration method and a component mounting apparatus that can accurately calibrate control data.

  According to the control data calibration method of the present invention, a mounting head for mounting a component on a board positioned at a work position, and the mounting head extending in a first direction parallel to the board conveyance direction are moved in the first direction. A first beam to be moved, a second beam extending in a second direction orthogonal to the first direction in a horizontal plane and moving the first beam in the second direction, and positioned at the working position In the component mounting apparatus comprising: an image pickup unit that picks up an image of the printed board and moves together with the mounting head; and movement control of the mounting head along the first beam and the first along the second beam. A control data calibration method for calibrating control data combined with beam movement control of a plurality of schools provided along the first direction and the second direction of the calibration substrate. A first calculation step of calculating a displacement amount, which is an error between the center of the calibration mark and the actual measurement value, based on an actual measurement value obtained by sequentially imaging the measurement mark, and the first calculation step. Based on the amount of displacement, a second in-plane region that is an in-plane region of the calibration substrate and an inclination and intercept in an out-of-plane region that is set outside the in-plane region are calculated. Based on the calculation step, the shape formed from the calculated displacement amount calculated in the first calculation step, the slope calculated in the second calculation step, and the approximate straight line of the displacement amount formed by the intercept, A beam shape deriving step for deriving the shape of the first beam, and a region including the in-plane region and the out-of-plane region based on the shape of the first beam derived in the beam shape deriving step. Control data of the mounting head Including a calibration value calculation step of calculating a positive value, the.

  A component mounting apparatus according to the present invention includes a mounting head for mounting a component on a substrate positioned at a work position, and a first head extending in a first direction parallel to the substrate transport direction and moving the mounting head in the first direction. A first beam, a second beam extending in a second direction orthogonal to the first direction in a horizontal plane and moving the first beam in the second direction, and a substrate positioned at the working position And an imaging means that is movable with the mounting head with the imaging field of view directed to the side, and movement control of the mounting head along the first beam and movement of the first beam along the second beam A component mounting apparatus for mounting a component held by the mounting head on a substrate by moving the mounting head based on control data combined with control, wherein the first direction and the second direction of the calibration substrate In the direction A first calculation unit that calculates a displacement amount, which is an error occurring between the center of the calibration mark and the actual measurement value, based on the actual measurement value obtained by sequentially imaging the plurality of calibration marks provided in the above; Based on the amount of displacement calculated by the first calculation unit, an inclination in an in-plane area that is an in-plane area of the calibration substrate and an out-of-plane area that is an area set outside the in-plane area. A second calculation unit that calculates the intercept, a shape formed from the displacement calculated by the first calculation unit, an inclination calculated by the second calculation unit, and an approximation of the displacement formed by the intercept A beam shape deriving unit for deriving the shape of the first beam based on a straight line, the in-plane region, and the out-of-plane region based on the shape of the first beam derived in the beam shape deriving unit Control data of the mounting head in an area including Equipped with a calibration value calculator for calculating the value.

  According to the present invention, the control data can be accurately calibrated.

The top view of the component mounting apparatus in one embodiment of this invention The side view of the component mounting apparatus in one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus in one embodiment of this invention The image figure of the straight line L which carried out the primary approximation of the locus | trajectory (curve R) when moving the mounting head 12 to a X-axis direction for every predetermined y coordinate in one embodiment of this invention, and the locus | trajectory (straight line L). The top view of the board | substrate for calibration in one embodiment of this invention Flowchart of calibration method in one embodiment of the present invention (A) (b) Operation | movement explanatory drawing of the calibration method in one embodiment of this invention The top view of the board | substrate for calibration in one embodiment of this invention The figure which shows the imaging visual field of the board | substrate recognition camera with which the component mounting apparatus in one embodiment of this invention is provided. The top view of the component mounting apparatus in one embodiment of this invention The top view of the board | substrate for calibration in one embodiment of this invention (A) The figure which shows distribution of the inclination m calculated | required for every line in one embodiment of this invention (b) The figure which shows distribution of intercept b calculated | required for every line in one embodiment of this invention (A) The figure which shows the relationship between displacement amount (DELTA) x in a predetermined row, and the value of each column (b) The figure which shows the relationship between the calculated difference amount in a predetermined row, and the value of each column The top view of the component mounting apparatus in one embodiment of this invention The figure which shows distribution of displacement amount (DELTA) x (average value) in one embodiment of this invention The top view of the board | substrate for calibration in one embodiment of this invention (A) (b) The image figure showing the shape of the X-axis beam with which the component mounting apparatus in one embodiment of this invention is provided

  First, a component mounting apparatus according to an embodiment of the present invention will be described with reference to FIGS. The component mounting apparatus 1 has a function of mounting the component 3 (FIG. 2) on the board 2, and constitutes a component mounting system together with other devices and a host computer connected via a communication network (not shown). Hereinafter, the direction parallel to the transport direction of the substrate 2 is the X-axis direction (first direction), the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction (second direction), and is orthogonal to the XY plane. The direction is defined as the Z-axis direction.

  A substrate transport mechanism 5 is disposed in the approximate center of the base 4 in the Y-axis direction. The substrate transport mechanism 5 includes a pair of transport rails extending in parallel with the X-axis direction, and transports the substrate 2 in the X-axis direction and positions it at a predetermined work position. On both sides of the substrate transport mechanism 5 in the Y-axis direction, component supply units 6 are respectively arranged. In the component supply unit 6, a plurality of tape feeders 7 are arranged in parallel in the X-axis direction. The tape feeder 7 intermittently feeds the component 3 held on the carrier tape and supplies it to a component take-out position by a mounting head 12 to be described later.

  A long Y-axis beam (second beam) 8 extending in the Y-axis direction is provided at both ends in the X-axis direction of the base 4. Two Y-axis beams (first beams) 9 extending in the X-axis direction are installed on the Y-axis beam 8 so as to be movable in the Y-axis direction. An L-shaped head mounting member 11 that is movable in the X direction is mounted on each of the two X-axis beams 9, and a mounting head 12 is mounted on the head mounting member 11. The Y-axis beam 8 moves the X-axis beam 9 in the Y direction, and the X-axis beam 9 moves the mounting head 12 together with the head mounting member 11 in the X-axis direction. The Y-axis beam 8 and the X-axis beam 9 constitute a head moving mechanism 10 that moves the mounting head 12 in the horizontal direction.

  The mounting head 12 is composed of a plurality of unit mounting heads. In FIG. 2, a suction nozzle 13 capable of sucking the component 3 is attached to the lower end of the unit mounting head. The suction nozzle 13 moves, that is, moves up and down in the Z-axis direction by driving a nozzle lifting mechanism 14 (FIG. 3) built in the mounting head 12. By driving the head moving mechanism 10 and the nozzle lifting / lowering mechanism 14, the mounting head 12 sucks and takes out the component 3 supplied by the tape feeder 7 by the suction nozzle 13, and puts the component on the substrate 2 positioned at a predetermined work position. 3 is implemented.

  1 and 2, a substrate recognition camera (imaging means) 15 is provided on the lower surface of the head mounting member 11 so that the imaging field of view is directed downward on the side of the substrate 2 positioned at the work position. The substrate recognition camera 15 is movable with the mounting head 12 by driving the X-axis beam 9. The substrate recognition camera 15 images a pair of substrate marks 2a (FIG. 1) formed on the substrate 2 positioned at the work position. A component recognition camera 16 is disposed between the substrate transport mechanism 5 and the tape feeder 7. When the mounting head 12 that has taken out the component 3 supplied by the tape feeder 7 moves above the component recognition camera 16, the component recognition camera 16 images the component 3 sucked by the suction nozzle 13 from below. The imaging data of the substrate 2 and the component 3 is used when correcting the position of the mounting head 12 during component mounting.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 20 included in the component mounting apparatus 1 includes a storage unit 21, a mechanism drive unit 22, a recognition processing unit 23, and a calibration execution unit 24. The control unit 20 is connected to the substrate transport mechanism 5, the tape feeder 7, the head moving mechanism 10, the mounting head 12, the nozzle lifting mechanism 14, the substrate recognition camera 15, the component recognition camera 16, and the like.

  The storage unit 21 stores production data and the like necessary for production of the board 2 on which the component 3 is mounted. This production data includes control data (control parameters) 21 a necessary for movement control of the mounting head 12. The control data 21 a is data that combines movement control of the mounting head 12 along the X-axis beam 9 and movement control of the X-axis beam 9 along the Y-axis beam 8.

  The mechanism driving unit 22 is controlled by the control unit 20 to drive the substrate transport mechanism 5, the tape feeder 7, the head moving mechanism 10, the mounting head 12, and the nozzle lifting / lowering mechanism 14. Thereby, the board | substrate 2 conveyance operation | movement and the mounting operation | movement of the components 3 are performed. The head moving mechanism 10 is driven based on the control data 21a and moves the mounting head 12 in the horizontal direction. Thus, the mounting head 12 takes out the component 3 from the tape feeder 7 and mounts it on the substrate 2 positioned at a predetermined work position. In this way, the component mounting apparatus 1 mounts the component 3 held by the mounting head 12 on the substrate 2 by moving the mounting head 12 based on the control data 21a.

  The recognition processing unit 23 recognizes the imaging data acquired by the substrate recognition camera 15 and the component recognition camera 16 to detect the substrate 2 positioned at the work position and the component 3 held by the mounting head 12. The detection results of the substrate 2 and the component 3 are used when the mounting head 12 is aligned with the substrate 2 when the component 3 is mounted.

  The calibration execution unit 24 executes calibration according to various members constituting the component mounting apparatus 1, and as an internal processing mechanism, an actual measurement value acquisition unit 24a, a first calculation unit 24b, a second calculation unit 24c, a beam The configuration includes a shape deriving unit 24d and a calibration value calculating unit 24e. Calibration refers to a calibration operation for correcting inherent variations and attachment errors of various members constituting the component mounting apparatus 1, and is performed at the time of manufacturing, installing, or maintaining the equipment.

  For example, since the Y-axis beam 8 and the X-axis beam 9 are long members, distortion may occur due to processing accuracy and assembly of various parts. Here, the position of the mounting head 12 grasped when the control unit 20 controls the mounting head 12 is a position defined on the control data 21a. Therefore, when the Y-axis beam 8 or the X-axis beam 9 is distorted, an error occurs between the position of the mounting head 12 on the control data 21a and the actual position of the mounting head 12 shown in the machine coordinate system. . Therefore, in order to accurately mount the component 3, it is necessary to calibrate the control data 21a so that the error is canceled. The calibration execution unit 24 performs a calculation necessary for obtaining a calibration value of the control data 21a based on the shape of the Y-axis beam 8 or the X-axis beam 9.

  Next, the shape and inclination of the X-axis beam 9 will be described in detail with reference to FIG. FIG. 4 is an image diagram of a locus (curve R) when the mounting head 12 is moved in the X-axis direction for each predetermined y coordinate and a straight line L obtained by linear approximation of the locus (curve R). The curve R is a shape affected by the distortion of the X-axis beam 9 and the Y-axis beam 8, and the straight line L is a linear approximation of the curve R, so that only the distortion of the Y-axis beam 8 is affected. Received shape. Here, when the curves R in FIG. 4 are overlapped with the straight line L, the shapes of the curves R substantially match. That is, if the shape of the X-axis beam 9 is not affected by the distortion of the Y-axis beam 8, the shape tends not to change, and the shape of the X-axis beam 9 is affected only by the distortion of the Y-axis beam 8. The shape (straight line L) and the shape affected by only the distortion of the X-axis beam 9 (curves R obtained by superimposing the curves R in accordance with the straight lines L) can be separated. A straight line L indicated by a broken line indicates that the corresponding X-axis beam 9 is at a position deviated from above the substrate 2 positioned at the working position. Here, when the control data 21a is calibrated using only the substrate recognition camera 15 that moves the X-axis beam 9 in order to solve the above-described problems, the following problems arise. In the region where the mounting head 12 that moves the X-axis beam 9 mounts the component 3 on the substrate 2, there is a region that cannot be imaged by the substrate recognition camera 15 that moves the X-axis beam 9. Cannot acquire the shape of the X-axis beam 9. Therefore, the inventor calibrates the control data 21a including the region that cannot be imaged by the substrate recognition camera 15 that moves the X-axis beam 9 based on the relationship between the curve R and the straight line L described above. I came up with it.

  When the calibration is executed to obtain the calibration value of the control data 21a, the calibration substrate 17 shown in FIG. 5 is used. The calibration substrate 17 can be transported by the substrate transport mechanism 5 and is a plate-like member having the same outer diameter shape as the substrate 2. On the upper surface of the calibration substrate 17, a plurality of calibration marks M are provided in a lattice arrangement with pitches px and py in the X-axis direction and Y-axis direction, respectively. For convenience, a direction parallel to the transport direction (X-axis direction) of the substrate 2 is defined as a column direction, and a direction (Y-axis direction) orthogonal to the column direction in the horizontal plane is defined as a row direction. Further, in FIG. 5, the first column, the second column,..., The twelfth column are defined in order from the left side of the page, and in FIG. 5, the first row, the second row,. . When calibration is performed, the calibration substrate 17 is transported to a predetermined position and positioned by the substrate transport mechanism 5, and then individual calibration marks M are sequentially imaged by the substrate recognition camera 15. The calibration substrate 17 may be installed at a predetermined position by the operator. Further, the size of the calibration substrate 17 is preferably the maximum size that can be positioned by the substrate transport mechanism 5, but even if it is not the maximum size, the outer region of the calibration substrate 17 can be calibrated by performing the calibration of the present invention. Can do.

  The actual measurement value acquisition unit 24 a acquires an image of the calibration mark M captured by the board recognition camera 15. The first calculation unit 24b obtains a displacement amount (Δx, Δy) that is an error between the center value of the calibration mark M and the actual measurement value based on the actual measurement value acquired by the actual measurement value acquisition unit 24a. The second calculation unit 24c calculates the inclination of the approximate straight line of the X-axis beam 9 for each row and its intercept (hereinafter referred to as the inclination m, intercept b, and the like) from the displacement amount Δx calculated by the first calculation unit 24b and the value of each column. Calculate). The beam shape deriving unit 24d derives the average shape of the X-axis beam 9 for each row from the displacement amount Δx calculated by the first calculating unit 24b and the value of each column. The calibration value calculation unit 24e calculates the calibration value of the control data 21a of the mounting head 12 based on the approximate straight line of the displacement amount Δx and the average shape of the X-axis beam 9. Details of these parts will be described later.

  The component mounting apparatus 1 in the present embodiment is configured as described above. Next, a calibration method of the component mounting apparatus 1 for obtaining the calibration value of the control data 21a will be described according to the flowchart of FIG. When the execution of calibration is instructed by the operator, the calibration execution unit 24 detects the operation and controls the substrate transport mechanism 5. Accordingly, as shown in FIG. 7A, the substrate transport mechanism 5 transports the calibration substrate 17 (arrow a) and positions it at a predetermined work position (ST1: calibration substrate positioning step). That is, in (ST1), a plurality of calibration marks M are provided in a lattice shape along the first direction (X-axis direction) and the second direction (Y-axis direction). Position by.

  Next, processing for acquiring the actual measurement value of the mounting head 12 at the position of the calibration mark M is executed (ST2: actual measurement value acquisition step). That is, as shown in FIG. 7B, the mounting head 12 moves above the calibration substrate 17 positioned at a predetermined work position (row and column) based on the control data 21a. At this time, the mounting head 12 is controlled to move so that the center of the imaging field of the substrate recognition camera 15 that moves together is the center α of each calibration mark M. As a result, the substrate recognition camera 15 sequentially captures a plurality of calibration marks M individually. The actual measurement value acquisition unit 24a acquires the center α of each calibration mark M. The imaging order of the calibration mark M is arbitrary. In the present embodiment, as shown in FIG. 8, the substrate recognition camera 15 sequentially images the calibration mark M while moving along the X-axis direction for each row (arrow b).

  FIG. 9 illustrates the imaging field 15a when the substrate recognition camera 15 moves above a predetermined calibration mark M. FIG. When the Y-axis beam 8 or the X-axis beam 9 is distorted, an error occurs between the center β of the imaging field 15a and the center α of the calibration mark M. The first calculation unit 24b calculates this error as a displacement amount (Δx, Δy) (ST3: first calculation step).

  Next, the second calculation unit 24c calculates the slope m from the approximate straight line obtained by temporarily approximating the curve formed by the displacement amount Δx for each row calculated by the first calculation unit 24b and the value of each column. The intercept b is calculated (ST4: second calculation step). As shown in FIG. 10, the inclination m and the intercept b are calculated with respect to an in-plane region E1, which is a region where the calibration mark M is provided in the plane of the calibration substrate 17. Further, the inclination m and the intercept b in the region including the out-of-plane region E2, which is a region set outside (in the Y-axis direction orthogonal to the longitudinal direction of the X-axis beam 9) from the in-plane region E1, are estimated values. Calculated. In the case of a configuration in which a plurality of substrates are transported in parallel, the inclination m and the intercept b are calculated using the calibration substrate 17 for each pair of transport lanes. That is, the out-of-plane region E2 in this case also exists between the plurality of calibration substrates 17.

  Here, an example of an approximate straight line calculation method calculated by the second calculation unit 24c will be described. First, as shown in FIG. 11, the second calculation unit 24 c is configured such that the center β (β1, β2, β2) of each imaging field of view 15 a in a predetermined row (first row in the figure) calculated by the first calculation unit 24 b. ... Β12) and the displacements Δx1, Δx2... Δx12, which are errors between the center α of each calibration mark M (α1, α2. calculate. As a calculation method, an approximate straight line may be calculated using all the displacement amounts, or as a simple calculation method, an approximate straight line may be calculated only at both right and left ends of Δx1 and Δx12. Then, the second calculation unit 24c calculates the slope m and the intercept b from the approximate straight line. The second calculation unit 24c calculates the slope m and the intercept b of the approximate line corresponding to the second row, the third row,.

  The second calculation unit 24c further calculates an estimated value of the slope m and the intercept b in the out-of-plane region E2 based on the slope m and the intercept b calculated for each row. First, an n-order approximate expression of the slope m and an n-order approximate expression of the intercept b in the in-plane region E1 are calculated. FIG. 12A is a diagram showing the distribution of the slope m obtained for each row, with the horizontal axis representing the value of each row and the vertical axis representing the slope m. The second calculation unit 24c obtains an nth-order approximation expression representing the correlation between the row and the inclination m in the in-plane region E1 from the distribution of the inclination m by a so-called interpolation method (interpolation method) (solid line shown in FIG. 12A). See the curve). FIG. 12B is a diagram showing the distribution of the intercept b obtained for each row, with the horizontal axis representing the value of each row and the vertical axis representing the intercept b. The second calculation unit 24c obtains an nth-order approximate expression representing the correlation between the row and the intercept b in the in-plane region E1 from the distribution of the intercept b by the same interpolation method (see the solid curve shown in FIG. 12B). ).

  Next, estimated values of the slope m and the intercept b in the out-of-plane region E2 are calculated. That is, the second calculation unit 24c performs an out-of-plane region by a so-called extrapolation method (interpolation method) based on an nth-order approximation expression that represents the correlation between the row and the slope m in the in-plane region E1 illustrated in FIG. The slope m in the row E2 is obtained (see the dashed curve shown in FIG. 12A). Further, the second calculation unit 24c uses the extrapolation method to calculate the row of the out-of-plane region E2 based on the nth-order approximation expression that represents the correlation between the value of each row in the in-plane region E1 and the intercept b in FIG. Is obtained (see the dashed curve shown in FIG. 12B). The second calculation unit 24c estimates the slope m in the row in the out-of-plane region E2 from the n-th order approximation expression representing the correlation between the row in the in-plane region E1 and the slope m, and correlates the row and the intercept b in the in-plane region E1. The intercept b in the row of the out-of-plane region E2 is estimated from the n-th order approximation formula representing Thereby, the second calculation unit 24c was affected only by the straight line formed from the slope m and the intercept b in the row of the out-of-plane region E2, that is, the distortion of the Y-axis beam 8 including the out-of-plane region E2. The shape of the X-axis beam 9 is obtained. As described above, in (ST4), the second calculation unit 24c calculates the inclination m and the intercept b of the approximate straight line obtained by linearly approximating the shape of the X-axis beam 9 based on the displacement amount Δx and the value of the row. The calculation is performed for each row (the position of the X-axis beam 9 with respect to the Y-axis beam 8) including E2. Note that the above-described method for calculating the estimated values of the slope m and the intercept b in the out-of-plane region E2 is merely an example. A value may be calculated.

  Next, the beam shape deriving unit 24d derives the shape of the X-axis beam 9 including the out-of-plane region E2 (ST5: beam shape deriving step). The shape of the X-axis beam 9 including the out-of-plane region E2 was calculated by the second calculation unit 24c from the curve formed by the displacement amount Δx for each row calculated by the first calculation unit 24b and the value of each column. It can be derived by subtracting the approximate line. FIG. 13A is a diagram illustrating the relationship between the displacement amount Δx in a predetermined row and the value of each column. FIG. 13B is a diagram illustrating a relationship between the calculated difference amount in a predetermined row and the value of each column. First, the shape of a curve formed by the displacement amount Δx and the value of each column in a predetermined row (here, the first row) is derived. In FIG. 13A, the beam shape deriving unit 24d includes the displacement amount Δx of each column in the approximate straight line calculated by the second calculating unit 24c and the column of the first row calculated by the first calculating unit 24b. A difference amount from the displacement amount Δx is calculated. FIG. 13B shows the relationship between the calculated difference amount and the column value. As shown in FIG. 13B, the relationship between the calculated difference amount and the column value is in a state in which the influence of the inclination m of the approximate straight line calculated by the second calculation unit 24c and the intercept b is removed. The shape formed by this difference amount is the shape of the X-axis beam 9 that is not affected by only the distortion of the Y-axis beam 8 in the first row of the in-plane region E1. In other words, the shape of the X-axis beam 9 is only affected by the distortion of the X-axis beam 9. Next, the same calculation is derived for other rows, and the shape of the X-axis beam 9 is derived for all rows, and then the average value of the difference amounts calculated for each column is calculated. This is a reference for the shape of the X-axis beam 9 affected by the distortion of the X-axis beam 9 in the in-plane region E1. Further, since the shape of the reference X-axis beam 9 is not affected by the distortion of the Y-axis beam 8, the same shape can be applied to the out-of-plane region E2.

  Next, the beam shape deriving unit 24d is derived in the slope m of the out-of-plane region E2 calculated in the second calculation step (ST4), the displacement amount Δx of the primary straight line of the intercept b, and the beam shape deriving step (ST5). By combining the displacement amount Δx of the reference shape of the X-axis beam 9 for each column, the displacement amount Δx for each row of the out-of-plane region E2 is calculated. The calibration value calculation unit 24e calculates a value that cancels out this displacement amount at each coordinate point, and the calculated value becomes a calibration value (ST6: calibration value calculation step). The above steps (ST1) to (ST5) are also executed for the displacement amount Δy, and further executed for each individual X-axis beam 9.

  If the calibration value of the control data 21a is calculated, then a mounting operation for mounting the component 3 on the board 2 is executed. That is, the mounting head 12 takes out the component 3 supplied by the tape feeder 7 and mounts it on the substrate 2 positioned at a predetermined work position. In this mounting operation, movement control of the mounting head 12 is performed based on the calibration value of the control data 21a. As a result, even when the Y-axis beam 8 and the X-axis beam 9 are distorted, the component 3 can be accurately mounted at the position where it should be mounted on the substrate 2.

  As described above, according to the present embodiment, not only the in-plane region E1 provided with the calibration mark M of the calibration substrate 17, but also the out-of-plane region E2 set outside the in-plane region E1. It is possible to accurately calibrate the control data 21a of the mounting head 12 corresponding to the above. In addition, since it is not necessary to use the substrate recognition camera 15 provided for each of the plurality of X-axis beams 9, a highly reliable calibration value can be acquired.

  As shown in FIG. 10, the calibration value of the control data 21a of the mounting head 12 that can be obtained by the above-described calibration method is the width W of the in-plane region E1 and the out-of-plane region E2 from which the shape of the X-axis beam 9 is derived. Limited to. In the other calibration methods described below, as shown in FIG. 14, an area that is further extended in the longitudinal direction (X-axis direction) of the X-axis beam 9 from the width W of the in-plane area E1 and the out-of-plane area E2 is set. The calibration value of the control data 21a of the mounting head 12 in the out-of-plane region E3 can be acquired.

  Hereinafter, other calibration methods will be described, but the steps that are already described will be simplified. First, the substrate transport mechanism 5 transports the calibration substrate 17 and positions it at a predetermined work position (ST11: substrate transport process). Next, the actual measurement value acquisition unit 24a acquires an image of the calibration mark M captured by the board recognition camera 15 (ST12: actual measurement value acquisition step). And the 1st calculation part 24b calculates displacement amount ((DELTA) x, (DELTA) y) based on the actual value acquired by the actual value acquisition part 24a (ST13: 1st calculation process). The second calculation unit 24c calculates the slope m and the intercept b of the approximate straight line calculated using each displacement amount Δx of the predetermined row calculated by the first calculation unit 24b for each predetermined row (ST14: second). Calculation step).

  Next, the beam shape deriving unit 24d derives the shape of the X-axis beam 9 (ST15). Here, not only the in-plane region E1 but also the shape of the X-axis beam 9 in the out-of-plane region E3 is derived. Since the specific method for deriving the shape of the X-axis beam 9 in the in-plane region E1 is as described above, the description thereof is omitted.

  A method for deriving the shape of the X-axis beam 9 corresponding to the out-of-plane region E3 will be described. Here, a case will be described in which the shape of the X-axis beam 9 corresponding to the out-of-plane region E3 on the left side in FIG. 14 is derived. The shape of the X-axis beam 9 corresponding to the out-of-plane region E3 is estimated from the shape of the X-axis beam 9 that is not affected by only the distortion of the Y-axis beam 8 derived in the in-plane region E1. FIG. 15A is a diagram showing the distribution of the displacement amount Δx (average value) for each x coordinate. The horizontal axis represents the x coordinate, and the vertical axis represents the displacement amount Δx. From the figure, the beam shape deriving unit 24d shows the data point P1 indicating the displacement amount Δx (average value) in the first row and the data point P2 indicating the displacement amount Δx (average value) in the second row adjacent to the first row. The amount of change between (P1-P2) is obtained. The beam shape deriving unit 24d adds the change amount to the displacement amount Δx indicated by the data point P1, thereby obtaining the data point P0 adjacent to the data point P1 and located in the out-of-plane region E3 (PO = P1 + (P1 -P2)).

  Data points in the out-of-plane region E3 on the right side of the page shown in FIG. 14 are derived by the same method. Then, the beam shape deriving unit 24d includes the X-axis beam 9 including the approximate straight line displacement Δx calculated in the second calculation step (ST14) and the out-of-plane region E3 derived in the beam shape deriving step (ST15). The displacement amount Δx for each row including the out-of-plane region E3 is calculated by combining the average shape displacement amount Δx for each column. As described above, the beam shape deriving unit 24d derives the shape of the X-axis beam 9 including the out-of-plane region E3 set by extending in the longitudinal direction of the X-axis beam 9 from the width W of the in-plane region E1. Can do.

  The calibration value calculator 24e calculates a value that cancels out the displacement Δx at each coordinate point, and the calculated value becomes the calibration value.

  The component mounting apparatus calibration method and the component mounting apparatus according to the present invention are not limited to the present embodiment, and can be changed without changing the gist of the invention. For example, the shape of the X-axis beam 9 may be derived based only on actually measured values belonging to one row. This is because the shape of the X-axis beam 9 is considered to be almost unchanged even when moved in the Y-axis direction. The inclination m and the intercept b of the X-axis beam 9 for each row are obtained based on the machine coordinate system position βn of the mounting head 12 with respect to the calibration marks M located at both ends on the calibration substrate 17.

  Referring to FIG. 16, the board recognition camera 15 sequentially images all the calibration marks M1, M2,... M12 belonging to the first row, while the second row, the third row,. For six rows, the substrate recognition camera 15 images only the calibration marks M13, M24, M25, M36, M37, M48, M49, M60, M61, and M72 located at both ends. The shape of the X-axis beam 9 is derived from the actually measured values of the calibration marks M1, M2,... M12, that is, the positions β1, β2,. Further, the inclination m and intercept b of the X-axis beam 9 are measured values corresponding to the calibration marks M located at both ends of each row (machine coordinate system positions β13, β24, β25, β36, β37, β48, β49, β60). , Β61, β72).

  That is, in the actual measurement value acquisition step (ST2 (12)), the substrate recognition camera 15 sequentially images a plurality of calibration marks M having at least one y coordinate in the Y-axis direction (second direction). An actual measurement value of the position of the mounting head 12 is acquired, and in the beam shape deriving step (ST5 (15)), based on the actual measurement value acquired by imaging a plurality of calibration marks M having a common y coordinate. The shape of one beam may be derived. According to this, it is possible to reduce the number of times the calibration mark M is captured and to shorten the time required for calibration.

  Moreover, after acquiring the data of actual measurement values, the following steps may be newly added. That is, as shown in FIG. 17A, the control unit 20 obtains an n-order approximate expression based on the position βn of the machine coordinate system of the mounting head 12 corresponding to each calibration mark M, thereby obtaining an X-axis beam. 9 shapes are derived for each row. In FIG. 17A, the shape of the X-axis beam 9 is represented by curves R1, R2,... R6 for each row. Then, the control unit 20 performs coordinate conversion on the position βn of the mechanical coordinate system of the mounting head 12 obtained from the nth-order approximation so that the inclination m of the X-axis beam 9 is canceled, and then in FIG. As shown, the shapes of the plurality of X-axis beams 9 (curves R1 to R6) are overlapped. Then, the control unit 20 determines whether or not there is a position Sn * in the machine coordinate system of the mounting head 12 that is separated by a certain value or more in a state where the shapes of the X-axis beams 9 are superimposed. The cause of the position Sn * of the mounting coordinate system 12 of the mounting head 12 includes a case where the control unit 20 mistakenly recognizes dust adhering to the calibration substrate 17 as the calibration mark M. . In this case, the control unit 20 takes measures such as re-imaging the calibration mark M corresponding to the position Sn *. Alternatively, the control unit 20 corrects the data of the actual measurement value of the position of the mounting head 12 based on the average value of the displacement amounts Δx and Δy of the column belonging to the calibration mark M corresponding to the position Sn *. Thereby, the calibration value of the control data 21a can be calculated more accurately, and the mounting accuracy can be improved.

  According to the present invention, control data can be accurately calibrated, which is particularly useful in the field of component mounting.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 Components 5 Board | substrate conveyance mechanism 8 Y-axis beam (2nd beam)
9 X-axis beam (first beam)
DESCRIPTION OF SYMBOLS 12 Mounting head 15 Board | substrate recognition camera 24a Actual value acquisition part 24b 1st calculation part 24c 2nd calculation part 24d Beam shape derivation | leading-out part 24e Calibration value calculation part

Claims (6)

A mounting head for mounting a component on a substrate positioned at a work position; a first beam extending in a first direction parallel to a substrate transport direction; and moving the mounting head in the first direction; The second beam extending in a second direction orthogonal to the direction of the first direction and moving the first beam in the second direction and the substrate positioned at the working position are imaged and moved together with the mounting head In a component mounting apparatus comprising an imaging means for
A control data calibration method for calibrating control data combining movement control of the mounting head along the first beam and movement control of the first beam along the second beam,
An error occurring between the center of the calibration mark and the actual measurement value based on the actual measurement value obtained by sequentially imaging the plurality of calibration marks provided along the first direction and the second direction of the calibration substrate. A first calculation step of calculating a displacement amount,
Based on the amount of displacement calculated in the first calculation step, in an in-plane area that is an in-plane area of the calibration substrate and an out-of-plane area that is an area set outside the in-plane area. A second calculation step for calculating the slope and intercept;
Based on the shape formed from the calculated displacement calculated in the first calculation step, the slope calculated in the second calculation step, and the approximate straight line of the displacement formed by the intercept, the first A beam shape deriving step for deriving a beam shape;
Calibration value calculation step for calculating a calibration value of control data of the mounting head in the region including the in-plane region and the out-of-plane region based on the shape of the first beam derived in the beam shape deriving step. And a control data calibration method including:   In the beam shape deriving step, in addition to the shape of the first beam in the range corresponding to the in-plane region, the shape of the first beam in the range corresponding to the out-of-plane region is derived based on the actually measured value. The control data calibration method according to claim 1. In the first calculation step, by sequentially imaging the plurality of calibration marks having at least one coordinate in the second direction by the imaging unit, an actual measurement value of the position of the mounting head is obtained,
3. The shape of the first beam is derived in the beam shape deriving step based on the actual measurement values obtained by imaging the plurality of calibration marks having the same one coordinate. The calibration method of the control data as described. A mounting head for mounting a component on a substrate positioned at a work position; a first beam extending in a first direction parallel to a substrate transport direction; and moving the mounting head in the first direction; A second beam extending in a second direction orthogonal to the direction of the first plane and moving the first beam in the second direction, and an imaging field of view toward the substrate side positioned at the working position. Imaging means that is movable together with the head, and based on control data that combines movement control of the mounting head along the first beam and movement control of the first beam along the second beam. A component mounting apparatus for mounting the component held by the mounting head on a substrate by moving the mounting head.
An error occurring between the center of the calibration mark and the actual measurement value based on the actual measurement value obtained by sequentially imaging the plurality of calibration marks provided along the first direction and the second direction of the calibration substrate. A first calculation unit for calculating a displacement amount,
Based on the amount of displacement calculated by the first calculation unit, an in-plane area that is an in-plane area of the calibration substrate and an out-of-plane area that is an area set outside the in-plane area. A second calculator for calculating the slope and intercept;
The shape of the first beam based on the shape formed from the displacement calculated by the first calculation unit and the approximate straight line of the displacement calculated by the slope and intercept calculated by the second calculation unit. A beam shape deriving unit for deriving
A calibration value calculation unit for calculating a calibration value of control data of the mounting head in the in-plane region and the region including the out-of-plane region based on the shape of the first beam derived in the beam shape deriving unit; , A component mounting apparatus.   In the beam shape deriving unit, in addition to the shape of the first beam in the range corresponding to the in-plane region, the shape of the first beam in the range corresponding to the out-of-plane region is derived based on the actually measured value. The component mounting apparatus according to claim 4. In the first calculation unit, by sequentially capturing a plurality of calibration marks having at least one coordinate in the second direction by the imaging unit, an actual measurement value of the position of the mounting head is obtained,
6. The shape of the first beam is derived in the beam shape deriving unit based on the actually measured values acquired by imaging the plurality of calibration marks having the same one coordinate. 6. The component mounting apparatus described.

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