JP2017145376A5 - - Google Patents

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Publication number
JP2017145376A5
JP2017145376A5 JP2016030462A JP2016030462A JP2017145376A5 JP 2017145376 A5 JP2017145376 A5 JP 2017145376A5 JP 2016030462 A JP2016030462 A JP 2016030462A JP 2016030462 A JP2016030462 A JP 2016030462A JP 2017145376 A5 JP2017145376 A5 JP 2017145376A5
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JP
Japan
Prior art keywords
resin composition
silica
resin
silane coupling
interlayer insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016030462A
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Japanese (ja)
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JP2017145376A (en
JP6724408B2 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2016030462A external-priority patent/JP6724408B2/en
Priority to JP2016030462A priority Critical patent/JP6724408B2/en
Priority to PCT/JP2017/006044 priority patent/WO2017142094A1/en
Priority to KR1020187023539A priority patent/KR20180109936A/en
Priority to KR1020247002868A priority patent/KR20240017101A/en
Priority to TW106105565A priority patent/TWI769148B/en
Priority to CN201780011793.9A priority patent/CN108699408B/en
Publication of JP2017145376A publication Critical patent/JP2017145376A/en
Publication of JP2017145376A5 publication Critical patent/JP2017145376A5/ja
Publication of JP6724408B2 publication Critical patent/JP6724408B2/en
Application granted granted Critical
Active legal-status Critical Current
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Claims (10)

（ａ）エポキシ樹脂、（ｂ）シアネート樹脂、（ｃ）活性エステル硬化剤、（ｄ）フェノキシ樹脂及び（ｅ）シリカを含有し、（ｅ）シリカが、エポキシシランカップリング剤及びビニルシランカップリング剤から選ばれる１種以上のシランカップリング剤で表面処理されたものである、樹脂組成物。(A) an epoxy resin, (b) a cyanate resin, (c) an active ester curing agent, (d) a phenoxy resin and (e) silica, wherein (e) the silica is an epoxy silane coupling agent and a vinyl silane coupling agent A resin composition that is surface-treated with one or more silane coupling agents selected from: （ｅ）シリカの体積平均粒径が、０．０５〜１０μｍである、請求項１に記載の樹脂組成物。(E) The resin composition of Claim 1 whose volume average particle diameter of a silica is 0.05-10 micrometers. （ｅ）シリカの含有量が、樹脂組成物の固形分換算１００質量部に対して、５０〜５００質量部である、請求項１又は２に記載の樹脂組成物。(E) The resin composition of Claim 1 or 2 whose content of a silica is 50-500 mass parts with respect to 100 mass parts of solid content conversion of a resin composition. （ｅ）シリカが、エポキシシランカップリング剤で表面処理されたシリカと、ビニルシランカップリング剤で表面処理されたシリカとを含有するものである、請求項１〜３のいずれか１項に記載の樹脂組成物。(E) Silica contains the silica surface-treated with the epoxy silane coupling agent, and the silica surface-treated with the vinyl silane coupling agent. Resin composition. さらに、（ｆ）硬化促進剤を含有する、請求項１〜４のいずれか１項に記載の樹脂組成物。Furthermore, the resin composition of any one of Claims 1-4 containing (f) hardening accelerator. （ｆ）硬化促進剤が、イミダゾール化合物及び有機金属塩から選ばれる１種以上である、請求項５に記載の樹脂組成物。(F) The resin composition of Claim 5 whose hardening accelerator is 1 or more types chosen from an imidazole compound and organometallic salt. 請求項１〜６のいずれか１項に記載の樹脂組成物を含有する、層間絶縁層用樹脂フィルム。The resin film for interlayer insulation layers containing the resin composition of any one of Claims 1-6. さらに、支持体を有する、請求項７に記載の層間絶縁層用樹脂フィルム。Furthermore, the resin film for interlayer insulation layers of Claim 7 which has a support body. 接着補助層を介して前記支持体を有する、請求項８に記載の層間絶縁層用樹脂フィルム。The resin film for interlayer insulation layers according to claim 8 which has the above-mentioned support through an adhesion auxiliary layer. 請求項１〜６のいずれか１項に記載の樹脂組成物の硬化物又は請求項７〜９のいずれか１項に記載の層間絶縁層用樹脂フィルムが含有する樹脂組成物の硬化物を含む、多層プリント配線板。The hardened | cured material of the resin composition of any one of Claims 1-6 or the hardened | cured material of the resin composition which the resin film for interlayer insulation layers of any one of Claims 7-9 contains is contained. , Multilayer printed wiring board.
JP2016030462A 2016-02-19 2016-02-19 Adhesive film for multilayer printed wiring boards Active JP6724408B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016030462A JP6724408B2 (en) 2016-02-19 2016-02-19 Adhesive film for multilayer printed wiring boards
TW106105565A TWI769148B (en) 2016-02-19 2017-02-20 Resin composition, resin film for interlayer insulating layer, multilayer printed wiring board, and semiconductor package
KR1020187023539A KR20180109936A (en) 2016-02-19 2017-02-20 Adhesive film for multilayer printed circuit boards
KR1020247002868A KR20240017101A (en) 2016-02-19 2017-02-20 Adhesive film for multilayer printed wiring boards
PCT/JP2017/006044 WO2017142094A1 (en) 2016-02-19 2017-02-20 Adhesive film for multilayer printed wiring boards
CN201780011793.9A CN108699408B (en) 2016-02-19 2017-02-20 Adhesive film for multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016030462A JP6724408B2 (en) 2016-02-19 2016-02-19 Adhesive film for multilayer printed wiring boards

Publications (3)

Publication Number Publication Date
JP2017145376A JP2017145376A (en) 2017-08-24
JP2017145376A5 true JP2017145376A5 (en) 2019-04-04
JP6724408B2 JP6724408B2 (en) 2020-07-15

Family

ID=59682107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016030462A Active JP6724408B2 (en) 2016-02-19 2016-02-19 Adhesive film for multilayer printed wiring boards

Country Status (1)

Country Link
JP (1) JP6724408B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021106848A1 (en) * 2019-11-29 2021-06-03 東洋紡株式会社 Adhesive composition, adhesive sheet, laminate, and printed wiring board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5130698B2 (en) * 2006-11-21 2013-01-30 住友ベークライト株式会社 Insulating resin composition for multilayer printed wiring board, insulating sheet with substrate, multilayer printed wiring board, and semiconductor device
TWI565750B (en) * 2009-02-20 2017-01-11 Ajinomoto Kk Resin composition
JP2012041510A (en) * 2010-08-23 2012-03-01 Sekisui Chem Co Ltd Resin composition, b-stage film, laminated film, and multilayer substrate
JP5728997B2 (en) * 2011-02-16 2015-06-03 日立化成株式会社 Insulating resin material for wiring board, multilayer wiring board, and method for manufacturing multilayer wiring board
JP5864299B2 (en) * 2012-02-24 2016-02-17 味の素株式会社 Resin composition
TWI602873B (en) * 2012-06-11 2017-10-21 味之素股份有限公司 Resin composition

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