JP2017143261A5 - - Google Patents
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- JP2017143261A5 JP2017143261A5 JP2017020050A JP2017020050A JP2017143261A5 JP 2017143261 A5 JP2017143261 A5 JP 2017143261A5 JP 2017020050 A JP2017020050 A JP 2017020050A JP 2017020050 A JP2017020050 A JP 2017020050A JP 2017143261 A5 JP2017143261 A5 JP 2017143261A5
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- etching
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/018,708 | 2016-02-08 | ||
| US15/018,708 US9792393B2 (en) | 2016-02-08 | 2016-02-08 | Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017143261A JP2017143261A (ja) | 2017-08-17 |
| JP2017143261A5 true JP2017143261A5 (enExample) | 2020-03-19 |
| JP6899659B2 JP6899659B2 (ja) | 2021-07-07 |
Family
ID=59496614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017020050A Active JP6899659B2 (ja) | 2016-02-08 | 2017-02-07 | 反射スペクトルマッチングおよび表面動力学モデル最適化によるエッチングプロファイル最適化のための方法および装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9792393B2 (enExample) |
| JP (1) | JP6899659B2 (enExample) |
| KR (1) | KR102765386B1 (enExample) |
| CN (2) | CN107330132B (enExample) |
| TW (1) | TWI706120B (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10386828B2 (en) * | 2015-12-17 | 2019-08-20 | Lam Research Corporation | Methods and apparatuses for etch profile matching by surface kinetic model optimization |
| US9792393B2 (en) | 2016-02-08 | 2017-10-17 | Lam Research Corporation | Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization |
| US10032681B2 (en) | 2016-03-02 | 2018-07-24 | Lam Research Corporation | Etch metric sensitivity for endpoint detection |
| US10197908B2 (en) | 2016-06-21 | 2019-02-05 | Lam Research Corporation | Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework |
| US10254641B2 (en) | 2016-12-01 | 2019-04-09 | Lam Research Corporation | Layout pattern proximity correction through fast edge placement error prediction |
| US10534257B2 (en) | 2017-05-01 | 2020-01-14 | Lam Research Corporation | Layout pattern proximity correction through edge placement error prediction |
| US20190049937A1 (en) * | 2017-08-09 | 2019-02-14 | Lam Research Corporation | Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization |
| US11380594B2 (en) * | 2017-11-15 | 2022-07-05 | Kla-Tencor Corporation | Automatic optimization of measurement accuracy through advanced machine learning techniques |
| CN107968042B (zh) * | 2017-11-28 | 2020-07-17 | 北京北方华创微电子装备有限公司 | 一种不同反应腔室之间工艺结果的匹配方法和装置 |
| CN112136135B (zh) * | 2018-04-06 | 2025-02-11 | 朗姆研究公司 | 使用关键尺寸扫描型电子显微镜的工艺仿真模型校正 |
| US10572697B2 (en) | 2018-04-06 | 2020-02-25 | Lam Research Corporation | Method of etch model calibration using optical scatterometry |
| CN111971551B (zh) | 2018-04-10 | 2025-02-28 | 朗姆研究公司 | 机器学习中的光学计量以表征特征 |
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| US11520953B2 (en) * | 2018-05-03 | 2022-12-06 | Lam Research Corporation | Predicting etch characteristics in thermal etching and atomic layer etching |
| KR102803747B1 (ko) | 2018-07-26 | 2025-05-09 | 에이에스엠엘 네델란즈 비.브이. | 시뮬레이션 시스템을 위한 웨이퍼 층의 에칭 프로파일을 결정하는 방법 |
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| US12197133B2 (en) * | 2019-10-08 | 2025-01-14 | International Business Machines Corporation | Tool control using multistage LSTM for predicting on-wafer measurements |
| TWI730486B (zh) | 2019-11-01 | 2021-06-11 | 財團法人工業技術研究院 | 流場可視化觀測裝置與流場可視化觀測方法 |
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| JP7325356B2 (ja) * | 2020-02-20 | 2023-08-14 | 東京エレクトロン株式会社 | 情報処理システム及びシミュレーション方法 |
| CN112380760B (zh) * | 2020-10-13 | 2023-01-31 | 重庆大学 | 基于多算法融合的多目标工艺参数智能优化方法 |
| US11587765B2 (en) * | 2020-11-22 | 2023-02-21 | Applied Materials, Inc. | Plasma ignition optimization in semiconductor processing chambers |
| US12360510B2 (en) | 2021-04-20 | 2025-07-15 | Lam Research Corporation | Large spot spectral sensing to control spatial setpoints |
| CN114063479B (zh) * | 2021-11-12 | 2024-01-23 | 华科电子股份有限公司 | 应用于蚀刻机的多路输出模块的射频电源控制方法及系统 |
| US12480212B2 (en) | 2022-03-30 | 2025-11-25 | Applied Materials, Inc. | Chemical-dose substrate deposition monitoring |
| US12333700B2 (en) | 2022-03-30 | 2025-06-17 | Applied Materials, Inc. | Chemical-dose substrate deposition monitoring |
| CN120883333A (zh) * | 2023-03-23 | 2025-10-31 | 东京毅力科创株式会社 | 学习模型的生成方法、信息处理方法、计算机程序以及信息处理装置 |
| WO2024211180A1 (en) * | 2023-04-03 | 2024-10-10 | Lam Research Corporation | Process diagnosis and design using multivariate model |
| US20250237496A1 (en) * | 2024-01-19 | 2025-07-24 | Kla Corporation | Methods And Systems For Reflectometry Based Measurements Of Deep, Large Pitch Semiconductor Structures |
| TWI874279B (zh) * | 2024-09-20 | 2025-02-21 | 亞智科技股份有限公司 | 穿孔基板蝕刻設備與方法 |
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| US9792393B2 (en) | 2016-02-08 | 2017-10-17 | Lam Research Corporation | Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization |
| US10032681B2 (en) | 2016-03-02 | 2018-07-24 | Lam Research Corporation | Etch metric sensitivity for endpoint detection |
| US10197908B2 (en) | 2016-06-21 | 2019-02-05 | Lam Research Corporation | Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework |
| US10254641B2 (en) | 2016-12-01 | 2019-04-09 | Lam Research Corporation | Layout pattern proximity correction through fast edge placement error prediction |
| US10262910B2 (en) | 2016-12-23 | 2019-04-16 | Lam Research Corporation | Method of feature exaction from time-series of spectra to control endpoint of process |
| US10534257B2 (en) | 2017-05-01 | 2020-01-14 | Lam Research Corporation | Layout pattern proximity correction through edge placement error prediction |
| US20190049937A1 (en) | 2017-08-09 | 2019-02-14 | Lam Research Corporation | Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization |
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2016
- 2016-02-08 US US15/018,708 patent/US9792393B2/en active Active
-
2017
- 2017-02-07 TW TW106103883A patent/TWI706120B/zh active
- 2017-02-07 JP JP2017020050A patent/JP6899659B2/ja active Active
- 2017-02-08 KR KR1020170017259A patent/KR102765386B1/ko active Active
- 2017-02-08 CN CN201710068974.7A patent/CN107330132B/zh active Active
- 2017-02-08 CN CN202011262730.0A patent/CN112526819B/zh active Active
- 2017-09-07 US US15/698,458 patent/US9996647B2/en active Active
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2018
- 2018-05-04 US US15/972,063 patent/US10303830B2/en active Active
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