JP2017142879A - Substrate for suspension, suspension, suspension having head, and hard disk drive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for suspension capable of simplifying a connection structure of a ground terminal for a head slider and a ground terminal for an actuator element with a metal support layer.SOLUTION: In a substrate 1 for suspension, a wiring layer 40 includes a first ground terminal 45 for an actuator element, and a second ground terminal 41G for a head slider. The first ground terminal 45 and the second ground terminal 41G are connected via ground wiring 43G. The first ground terminal 45 is connected to a metal support layer 20 via a conductive connection part 60 penetrating through an insulator layer 10.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a suspension board, a suspension, a suspension with a head, and a hard disk drive, and in particular, a connection structure between a ground terminal for a head slider, a ground terminal for an actuator element, and a metal support layer is simplified. The present invention relates to a suspension substrate, a suspension, a suspension with a head, and a hard disk drive.

  Generally, a hard disk drive (HDD) includes a suspension substrate (flexure) on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate is formed to extend from a head region on which the magnetic head slider is mounted to a tail region connected to an FPC substrate (flexible printed circuit board), and a metal support layer and an insulating layer on the metal support layer And a wiring layer having a plurality of wirings stacked via each other, and by writing an electric signal through each wiring, data is written to or read from the disk.

  In such a hard disk drive, in order to move the magnetic head slider to a desired data track on the disk, a VCM actuator (voice coil motor) that rotates an actuator arm that supports the magnetic head slider is provided by a servo control system. I have control.

  In recent years, there has been an increasing demand for an increase in disk capacity. In order to meet this demand, the density of the disk is increased and the width of the track is reduced. For this reason, it may be difficult to accurately align the magnetic head slider to a desired track by the VCM actuator.

  In order to cope with this, a dual actuator type (Dual Stage Actuator: DSA) suspension is known in which a VCM actuator and a PZT microactuator cooperate to move a magnetic head slider to a desired track (for example, , See Patent Document 1). This PZT microactuator is composed of a piezo element (piezoelectric element) made of PZT (lead zirconate titanate), and expands and contracts when a voltage is applied to move the magnetic head slider minutely. In such a dual actuator type suspension, the VCM actuator roughly adjusts the position of the magnetic head slider, and the PZT microactuator finely adjusts the position of the magnetic head slider. In this way, the magnetic head slider is aligned with a desired track quickly and accurately.

  In Patent Document 1, a piezo element is mounted on a head region of a suspension substrate. In this case, since the piezo element can be disposed close to the head slider, it is possible to improve the accuracy of alignment of the head slider.

JP 2012-99204 A

  By the way, the suspension substrate is provided with a ground terminal for the head slider and a ground terminal for the actuator element. The ground terminal for the head slider and the ground terminal for the actuator element are each separately penetrating the insulating layer. It is connected to the metal support layer through the ground pad.

  However, when the ground terminal for the head slider and the ground terminal for the actuator element are separately connected to the metal support layer via the ground pad, it is necessary to provide a plurality of ground pads penetrating the insulating layer. The connection structure with the support layer becomes complicated.

  The present invention has been made in consideration of such points, and a suspension substrate and a suspension capable of simplifying a connection structure between a ground terminal of a mounted head slider and actuator element and a metal support layer An object is to provide a suspension with a head and a hard disk drive.

  The present invention relates to a suspension substrate having a head region and a central region, on which a head slider and an extendable actuator element for displacing the head slider are mounted, a metal support layer, on the metal support layer A first ground terminal for an actuator element that constitutes the wiring layer, and a second for a head slider that constitutes the wiring layer, comprising: an insulating layer provided; and a wiring layer provided on the insulating layer. A ground terminal is provided, wherein the first ground terminal and the second ground terminal are electrically connected by a ground wiring, and are connected to the metal support layer through a ground pad penetrating the insulating layer. This is a suspension substrate.

  The present invention is the suspension substrate, wherein the head slider and the actuator element are mounted on different sides with respect to the wiring layer.

  The present invention is the suspension substrate, wherein the head slider and the actuator element are mounted on the same side with respect to the wiring layer.

  The present invention is a suspension board characterized in that a third ground terminal for a heat assist element constituting a wiring layer is provided, and the third ground terminal is also electrically connected to the first ground terminal and the second ground terminal. .

  The present invention is the suspension substrate, wherein a pair of the first ground terminals are provided, and the pair of first ground terminals are connected to the second ground terminal.

  According to the present invention, the wiring layer includes a plurality of wirings positioned on one side and the other side of the head slider to be mounted, and the number of wirings on one side of the head slider is larger than the number of wirings on the other side. The suspension substrate is characterized in that the ground wiring is arranged on the other side of the head slider.

  The present invention provides the suspension substrate, wherein the head slider and the actuator element are mounted in the head region, and the ground pad is connected to a tongue portion of the metal support layer.

  The suspension board according to the present invention is characterized in that the ground pad is provided immediately below the first ground terminal for the actuator element.

  The present invention is a suspension comprising: a base plate; the above-described suspension substrate attached to the base plate via a load beam; and the actuator element mounted on the suspension substrate. .

  The present invention is a suspension with a head including the above-described suspension and a head slider mounted on the suspension substrate.

  The present invention is a hard disk drive including the above-described suspension with a head.

  According to the present invention, the connection structure of the ground terminal for the head slider and the ground terminal for the actuator element and the metal support layer can be simplified.

FIG. 1 is a plan view showing an example of a suspension with a head according to an embodiment of the present invention. FIG. 2 is an enlarged cross-sectional view showing the vicinity of a first ground terminal for a piezoelectric element in the suspension with a head shown in FIG. FIG. 3 is an enlarged plan view showing the suspension substrate in the embodiment of the present invention to which the actuator element and the head slider are attached. FIG. 4 is a cross-sectional view showing the conductive connection portion in the vicinity of the second ground terminal in the suspension substrate of FIG. FIG. 5 is an enlarged plan view showing a suspension substrate showing another modification of the present invention to which an actuator element and a head slider are attached. FIG. 6 is an enlarged cross-sectional view showing the vicinity of the first ground terminal for the piezoelectric element in the suspension substrate of FIG. FIG. 7 is an enlarged plan view showing a suspension substrate showing another modification of the present invention to which an actuator element and a head slider are attached. 8A to 8I are views for explaining a method for manufacturing a suspension substrate in a modification of the present invention. 9A to 9H are views for explaining a method for manufacturing a suspension substrate in a modification of the present invention. FIG. 10 is a perspective view showing an example of a hard disk drive including the suspension with a head shown in FIG. FIG. 11 is a plan view showing a suspension substrate in the embodiment of the present invention. FIG. 12 is an enlarged plan view showing a suspension substrate in a modification of the present invention to which an actuator element and a head slider are attached. FIG. 13 is an enlarged plan view showing a suspension substrate in a modification of the present invention to which an actuator element and a head slider are attached.

A suspension substrate, a suspension, a suspension with a head, and a hard disk drive according to an embodiment of the present invention will be described with reference to FIGS.
In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

Embodiment First, a first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the suspension with head 111 includes a suspension 101 and a head slider 112 mounted on the head region 2 of the suspension substrate 1. Of these, the head slider 112 is for writing and reading data on a disk 123 (see FIG. 10) described later, and is bonded to the head region 2 of the suspension substrate 1 described later using an adhesive. ing. A slider terminal (not shown) of the head slider 112 is electrically connected to the head terminal 41 by a solder material.

  The suspension 101 includes a base plate 102, a load beam 103 attached on the base plate 102, a suspension substrate 1 attached to the load beam 103, and a pair of piezo elements (mounted on the head region 2 of the suspension substrate 1). Actuator element) 104. Of these, the base plate 102 and the load beam 103 are both preferably made of stainless steel and are fixed to each other by welding.

  The load beam 103 is attached to the metal support layer 20 (described later) of the suspension substrate 1 by welding. The load beam 103 is provided with a jig hole (not shown), and the suspension substrate 1 is aligned with the jig hole of the load beam 103 as shown in FIG. A jig hole 5 for performing the above is provided. Thus, when the load beam 103 is attached to the suspension substrate 1, the suspension substrate 1 and the load beam 103 can be aligned. The jig hole of the load beam 103 and the jig hole 5 of the suspension substrate 1 are arranged on the longitudinal axis (X) shown in FIG.

  As shown in FIGS. 1 and 2, the piezo element 104 is configured to be extendable in the longitudinal direction (P direction in FIG. 1). Accordingly, the pair of piezo elements 104 can displace the head slider 112 in the sway direction (the turning direction, the direction of arrow Q in FIG. 1). Further, as shown in FIG. 2, each piezo element 104 has a pair of electrodes 104a and 104b and a piezoelectric material portion 104c made of piezoelectric ceramics such as PZT (lead zirconate titanate). The pair of electrodes 104a and 104b are formed at both ends of the piezoelectric material portion 104c in the expansion / contraction direction on the surface of the piezoelectric material portion 104c on the insulating layer 10 side.

  As shown in FIG. 2, the first electrode 104 a of the piezoelectric element 104 is connected to a ground terminal (first ground terminal) 45 (described later) of the suspension substrate 1. The first ground terminal 45 is connected to the metal support layer 20 and electrically grounded via a conductive connection portion (ground pad) 60 that penetrates the insulating layer 10 as will be described later. The second electrode 104b is electrically connected to the connection terminal 46 of the suspension substrate 1. The connection terminal 46 is connected to an element wiring 44 which will be described later, and a predetermined voltage is applied to the connection terminal 46 in order to expand and contract the piezo element 104.

  The piezoelectric material portions 104c of the pair of piezo elements 104 are formed to have polarization directions different from each other by 180 °. When a predetermined voltage is applied, one piezo element 104 contracts and the other piezo element 104 104 extends. That is, the piezo element 104 is configured as a piezoelectric element that can expand and contract in the direction of arrow P in FIG. 1 when a predetermined voltage is applied between the electrodes 104a and 104b.

  As shown in FIG. 1, the pair of piezo elements 104 is formed in an elongated rectangular shape along the longitudinal axis (X), and the expansion / contraction direction thereof is parallel to the longitudinal axis (X). It has become. The pair of piezo elements 104 are arranged symmetrically with respect to the longitudinal axis (X) so that the expansion and contraction of each piezo element 104 is evenly transmitted to the head slider 112.

  Next, the suspension substrate 1 will be described with reference to FIGS.

  As shown in FIGS. 1 and 11, the suspension substrate 1 includes a head region (gimbal region) 2 on which the head slider 112 and the piezoelectric element 104 are mounted, and a tail to which an FPC substrate (external connection substrate) 131 is connected. It has a region 3 and a central region 4 between the head region 2 and the tail region 3. The head region 2 is provided with a plurality of head terminals 41 connected to the head slider 112, and the tail region 3 is provided with a plurality of tail terminals (external connection substrate terminals) 42 connected to the FPC board 131. Yes. The head terminal 41 and the tail terminal 42 are respectively connected by a plurality of signal wirings 43 described later.

  As shown in FIGS. 1 and 2, the suspension substrate 1 includes a metal support layer 20, an insulating layer 10 provided on the metal support layer 20, and a plurality of wirings 43 and 44 provided on the insulating layer 10. And a wiring layer 40 having. That is, the wiring layer 40 is laminated on the metal support layer 20 via the insulating layer 10. A protective layer 50 that covers the wirings 43 and 44 is provided on the insulating layer 10. The head slider 112 described above is arranged on the side where the protective layer 50 is provided with respect to the wiring layer 40 of the suspension substrate 1, and the piezo element 104 is also protected against the wiring layer 40 of the suspension substrate 1. It is arranged on the side where is provided. In FIG. 1, the protective layer 50 is omitted for the sake of clarity.

  As shown in FIG. 1, the metal support layer 20 includes a metal support layer main body 21 and a tongue portion 22 that is disposed in the head region 2 and to which the head slider 112 is attached. The metal support layer main body 21 and the tongue portion 22 are connected by a pair of connecting portions 24. The width of each connecting portion 24 is reduced, so that each connecting portion 24 has flexibility. Therefore, the tongue 22 is displaced by the expansion / contraction operation of the piezo element 104, and at the same time, the head slider 112 pivots. As described above, according to the present embodiment, the pivot movement of the head slider 112 is prevented from being inhibited, and the expansion / contraction operation of the piezo element 104 is prevented from being inhibited.

  In the head region 2, a pair of rectangular accommodation openings 25 that accommodate the piezo elements 104 are provided in the metal support layer 20. The housing opening 25 is disposed inside the pair of connecting portions 24. That is, the connecting portions 24 are disposed on both sides of the pair of housing openings 25.

  The wiring layer 40 includes a plurality of wirings, that is, a signal wiring 43 including a pair of reading wirings and a pair of writing wirings, and a pair of element wirings 44 connected to the piezoelectric element 104. Among these, the signal wiring 43 connects the head terminal 41 and the tail terminal 42, and an electric signal is passed through the signal wiring 43, so that the head slider 112 receives data from the disk 123 (see FIG. 10). Write or read. The element wiring 44 extending from the tail terminal 42 is connected to a connection terminal 46 for the piezoelectric element, and applies a predetermined voltage to the second electrode 104b of the piezoelectric element 104.

  The wiring layer 40 has a ground connection terminal 45 connected to the first electrode 104 a of the piezo element 104 and a connection terminal 46 for the piezo element connected to the second electrode 104 b of the piezo element 104. Among these, the ground terminal 45 is for grounding the first electrode 104a of the piezo element 104 and grounding the piezo element 104. The ground terminal 45 is provided with a tongue of the metal support layer 20 through a conductive connection portion 60 described later. The unit 22 is electrically connected. As described above, the piezo element connection terminal 46 is used to apply a predetermined voltage to the second electrode 104b of the piezo element 104, and the element wiring 44 is connected to the second element connection terminal 46. ing.

  As described above, the ground terminal 45 is electrically connected to the tongue portion 22 of the metal support layer 20 by the conductive connection portion 60. That is, the insulating layer through-hole 12 is provided in the insulating layer 10, and the conductive connection portion 60 is formed by applying nickel plating or copper plating to the insulating layer through-hole 12. In this way, the first element connection terminal 45 is grounded.

  As shown in FIGS. 1 and 2, in the head region 2 of the suspension substrate 1, the ground terminal (connected to the head slider 112) is arranged on the insulating layer 10 along with the head terminal 41 connected to the head slider 112. (Second ground terminal) 41G is provided.

  The first ground terminal 45 for the piezo element and the second ground terminal 41G for the head slider are electrically connected to each other through the ground wiring 43G installed on the insulating layer 10 and are connected to the metal through the conductive connection portion 60. The tongue layer 22 of the support layer 20 is electrically connected. In this way, the first ground terminal 45 for the piezoelectric element and the second ground terminal 41G for the head slider are grounded. In this case, since the piezo element 104 is provided in the head region 2 and the conductive portion 60 is connected to the tongue portion 22, the first ground terminal 45 for the piezo element and the second ground terminal 41G for the head slider are connected. The installation area of the ground wiring 43G to be performed can be kept small.

  In this case, the head slider wiring is constituted by the head slider head terminal 41, the head slider second ground terminal 41G, and the signal wiring 43, and the piezoelectric element connection terminal 46 and the piezoelectric element wiring. The first ground terminal 45 and the element wiring 44 for the piezoelectric element constitute a wiring for the piezoelectric element.

  Further, the wiring layer 40 described above includes wirings 41, 41G, 43 for head sliders and wirings 46, 45, 44 for piezoelectric elements.

  Furthermore, as shown in FIG. 2, the conductive connection portion 60 is provided immediately below the first ground terminal 45 for the piezo element, so that the second ground terminal 45 and the conductive connection portion 60 are electrically connected. Separate and independent wiring is not provided.

  Next, materials constituting each layer of the suspension substrate 1 will be described in detail.

  The material of the insulating layer 10 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of the insulating layer 10 can be a photosensitive material or a non-photosensitive material. Moreover, it is preferable that the thickness of the insulating layer 10 is 5 micrometers-10 micrometers. As a result, the insulation performance between the metal support layer 20 and the wirings 43 and 44 can be ensured, and loss of the rigidity of the suspension substrate 1 as a whole can be prevented.

  The wirings 43 and 44 of the wiring layer 40 are configured as conductors for transmitting electrical signals, and the materials of the wirings 43 and 44 are particularly limited as long as they have a desired conductivity. However, it is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 43 and 44 is 5 micrometers-18 micrometers. As a result, it is possible to ensure the transmission characteristics of the wirings 43 and 44 and to prevent the flexibility of the suspension substrate 1 as a whole from being lost. The head terminal 41, the tail terminal 42, and the element connection terminals 45 and 46 have the same material and the same thickness as the wirings 43 and 44, and constitute the wiring layer 40.

The material of the metal support layer 20 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, 42 alloy, aluminum, beryllium copper, or other copper Alloys can be used, and among these, stainless steel is preferred. The thickness of the metal support layer 20 is preferably 15 μm to 20 μm.
As a result, the conductivity, rigidity, and elasticity of the metal support layer 20 can be ensured.

  As a material of the protective layer 50, it is preferable to use a resin material, for example, polyimide. The material of the protective layer 50 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 50 is preferably 3 μm to 10 μm on the wirings 43 and 44.

Next, the hard disk drive 121 in this embodiment will be described with reference to FIG. 10 includes a case 122, a disk 123 that is rotatably attached to the case 122, stores data, a spindle motor 124 that rotates the disk 123, and a desired flying height on the disk 123. And a suspension 111 with a head including a head slider 112 that writes and reads data to and from the disk 123. Of these, the suspension with head 111 is movably attached to the case 122, and a voice coil motor 125 that moves the head slider 112 of the suspension with head 111 along the disk 123 is attached to the case 122. Yes.
The suspension with head 111 is attached to the voice coil motor 125 via an arm 126, and is connected to an FPC board 131 (see FIG. 1) connected to a control unit (not shown) that controls the hard disk drive 121. ing. In this way, an electrical signal is transmitted between the control unit and the head slider 112 via the suspension board 1 and the FPC board 131.

  As described above, according to the present embodiment, the second ground terminal 41G for the head slider is electrically connected to the first ground terminal 45 for the piezo element via the ground wiring 43G. The first ground terminal 45 and the second ground terminal 41G can be grounded by connecting the ground terminal 41G to the tongue portion 22 of the metal support layer 20 through the conductive connection portion 60. Therefore, the first ground terminal 45 and the second ground terminal 41G are connected to the metal support layer 20 as compared with the case where the first ground terminal 45 and the second ground terminal 41G are grounded to the metal support layer 20 using individual ground pads. The grounding structure connected to can be simplified.

Modified Example Next, a modified example of the present invention will be described with reference to FIGS.

  In the embodiment shown in FIG. 1 and FIG. 2, the example in which the conductive connection portion 60 is provided directly below the first ground terminal 45 for the piezo element is shown. The conductive connection 61 may be provided on the head terminal 41 for the head slider without providing the connection 60 (see FIGS. 3 and 4).

  As shown in FIGS. 3 and 4, a conductive connection part (ground pad) 61 is provided on the head terminal 41 for the head slider so as to penetrate the insulating layer 10. In addition to the head terminal 41 for the head slider, a second ground terminal 41G for the head slider is provided, and the second ground terminal 41G is connected to the conductive connecting portion 61 via the ground wiring 43G provided on the insulating layer 10. It is connected to the. Further, the first ground terminal 45 for the piezo element is connected to the conductive connection portion 61 via the ground wiring 43G.

  Thus, the first ground terminal 45 for the piezo element and the second ground terminal 41G for the head slider are connected to the tongue portion 22 of the metal support layer 20 via the conductive connection portion 61, and the first ground terminal 45 The second ground terminal 41G can be grounded.

  Next, a method for manufacturing the suspension substrate 1 according to the modification shown in FIGS. 3 and 4 will be described with reference to FIGS.

  First, the laminated body 1a is prepared (refer Fig.8 (a)). Here, the laminated body 1a is a substrate for producing the suspension substrate 1 in the present embodiment. Here, the case where the suspension substrate 1 is manufactured by the subtractive method will be described as an example.

  First, a laminated body 1a in which the metal support layer 20, the insulating layer 10, and the wiring layer 40 are laminated is prepared (FIG. 8A). Subsequently, the wiring layer 40 is etched into a desired shape to form the head terminal 41, the tail terminal 42, the wirings 43 and 44, the ground terminals 41G and 45, and the connection terminal 46 (FIG. 8B). Thereafter, the metal support layer 20 is etched to form positioning holes. Next, the protective layer 50 covering the wirings 43 and 44 is formed on the insulating layer 10 in a desired shape (FIG. 8C). Subsequently, the insulating layer 10 is etched into a desired shape (FIG. 8D).

  Next, the laminated body 1a is plated to form the conductive connection portion 61 (FIG. 8E).

  Next, as shown in FIG. 8F, a plating layer 41A is formed on the head terminal 41 and the second ground terminal 41G of the wiring layer 40.

  Next, as shown in FIG. 8G, the metal support layer 20 is etched again, and the metal support layer 20 is finally subjected to outer shape processing.

  Next, as shown in FIG. 8H, a solder layer 45 </ b> A is formed on the first ground terminal 45 of the wiring layer 40.

  In this way, the suspension substrate 1 according to the present embodiment is obtained.

  Next, the piezo element 104 is mounted on the first ground terminal 45 and the piezo element connection terminal 46 of the suspension substrate 1.

  Next, the case where the suspension substrate 1 is manufactured by the additive method will be described with reference to FIG.

  First, as shown in FIG. 9A, a metal support layer 20 is prepared, and the insulating layer 10 is formed on the metal support layer 20 in a pattern.

  Next, as shown in FIG. 9B, the metal support layer 20 is etched to form positioning holes. Next, plating is performed on the insulating layer 10 to form the wiring layer 40 including the head terminal 41, the tail terminal 42, the wirings 43 and 44, the ground terminals 41G and 45, and the connection terminals 46 (FIG. 9C). ).

  In this case, when the wiring layer 40 is formed, the conductive connection portion 61 is also formed at the same time.

  Next, as shown in FIG. 9D, a protective layer 50 is formed in a pattern on the wiring layer 40, and then a plating layer 41A is formed on the head terminal 41 and the second ground terminal 41G of the wiring layer 40. (FIG. 9E).

  Next, as shown in FIG. 9F, the metal support layer 20 is etched again, and the metal support layer 20 is finally subjected to outer shape processing. Next, as shown in FIG. 9G, a solder layer 45 </ b> A is formed on the first ground terminal 45 of the wiring layer 40.

  In this way, the suspension substrate 1 according to the present embodiment is obtained. Next, the piezo element 104 is mounted on the first ground terminal 45 and the piezo element connection terminal 46 of the suspension substrate 1.

  Next, another modification of the present invention will be described with reference to FIGS.

  In the embodiment shown in FIG. 1 and FIG. 2, the example in which the head slider 112 and the piezo element 104 are provided on the same side with respect to the wiring layer 40 is shown. The head slider 112 may be provided on the front side of the wiring layer 40, and the piezo element 104 may be provided on the back side of the wiring layer 40.

  As shown in FIGS. 5 and 6, the wiring layer 40 has a first ground terminal 45 for the piezoelectric element and a connection terminal 46, and the piezoelectric element 104 is mounted on the back side of the first ground terminal 45 and the connection terminal 46. Has been.

  That is, the first ground terminal 45 and the connection terminal 46 of the wiring layer 40 are covered with the protective layer 50 on the front side, and the back side is exposed to the outside and connected to the piezo element 104.

  A conductive connection 60 is formed directly below the first ground terminal 45 through the insulating layer 10.

  Further, as shown in FIGS. 5 and 6, in the head region 2 of the suspension substrate 1, the ground terminal (connected to the head slider 112) is aligned with the head terminal 41 connected to the head slider 112 on the insulating layer 10. (Second ground terminal) 41G is provided. The second ground terminal 41G for the head slider is electrically connected to the first ground terminal 45 for the piezo element through the ground wiring 43G installed on the insulating layer 10.

  The first ground terminal 45 for the piezo element and the second ground terminal 41G for the head slider are electrically connected to each other via the ground wiring 43G and are connected to the tongue portion 22 of the metal support layer 20 via the conductive connection portion 60. Electrically connected. In this way, the first ground terminal 45 for the piezoelectric element and the second ground terminal 41G for the head slider are grounded.

  Next, another modification of the present invention will be described with reference to FIG.

  In the modification shown in FIG. 7, the head slider 112 is provided on the front side of the wiring layer 40 and the piezo element 104 is provided on the back side of the wiring layer 40, as in the modification shown in FIGS. 5 and 6.

  On the other hand, in the modification shown in FIGS. 5 and 6, the example in which the conductive connection portion 60 is provided directly below the first ground terminal 45 for the piezo element is shown. Without providing the conductive connection portion 60, the conductive connection portion 61 may be provided on the tip side of the head terminal 41 for the head slider (see FIG. 7).

  As shown in FIG. 7, a conductive connection portion (ground pad) 61 is provided through the insulating layer 10 on the tip side of the head terminal 41 for the head slider. In addition to the head terminal 41 for the head slider, a second ground terminal 41G for the head slider is provided, and the second ground terminal 41G is connected to the conductive connecting portion 61 via the ground wiring 43G provided on the insulating layer 10. It is connected to the. Further, the first ground terminal 45 for the piezo element is connected to the conductive connection portion 61 via the ground wiring 43G.

  Thus, the first ground terminal 45 for the piezo element and the second ground terminal 41G for the head slider are connected to the tongue portion 22 of the metal support layer 20 via the conductive connection portion 61, and the first ground terminal 45 The second ground terminal 41G can be grounded.

  By the way, in each of the above embodiments, the example in which the piezo element 104 is provided in the head region 2 of the suspension substrate 1 has been described. However, the present invention is not limited thereto, and the piezo element 104 may be provided in the central region 4 of the suspension substrate 1. Good. Here, when the first ground terminal and the conductive connection portion 60 are also provided in the central region 4, the conductive connection portion 60 can be provided in the central region 4 having a relatively sufficient margin in wiring design. For this reason, the freedom degree of wiring design of the head region 2 increases.

  Furthermore, a thermal assist element terminal is provided in the vicinity of the head terminal 41, and a third ground terminal for the thermal assist element is provided in the vicinity of the second ground terminal 41G. The third ground terminal is connected to the first ground terminal 45 and The second ground terminal 41G may be electrically connected.

  Furthermore, as shown in FIG. 12, a pair of first ground terminals 45 for piezoelectric elements may be provided. The pair of first ground terminals 45 and the second ground terminal 41G for the head slider are electrically connected to each other through the ground wiring 43G and electrically connected to the tongue portion 22 of the metal support layer 20 through the conductive connection portion 61. It is connected to the.

  Further, as shown in FIG. 13, for example, three wires 43 of the wiring layer 40 are arranged on the left side (one side) of the head slider 112, and two fewer than three wires are arranged on the right side (the other side) of the head slider 112. May be. In this case, by arranging the ground wiring 43G on the side with the small number of wirings (right side), the weight of the suspension substrate 1 can be made uniform between the left side and the right side, and the expansion / contraction operation by the piezoelectric element 104 can be performed smoothly.

  Although not shown, when the wiring for the thermal assist element is arranged on one side of the head slider 112, the number of wirings on the one side may be smaller than that on the other side of the head slider 112. In such a case, by disposing the ground wiring 43G on the other side, the weight of the suspension substrate 1 can be made uniform between the left side and the right side, and the expansion / contraction operation by the piezo element 104 can be performed smoothly.

  As described above, the embodiments of the present invention have been described in detail. However, the suspension substrate, the suspension, the suspension with a head, and the hard disk drive according to the present invention are not limited to the above-described embodiments. Various changes can be made without departing from the spirit of the invention.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Head area | region 3 Tail area | region 4 Central area | region 10 Insulating layer 20 Metal support layer 40 Wiring layer 41 Head terminal 41G 2nd ground terminal 43 Signal wiring 43G Ground wiring 44 Element wiring 45 1st ground terminal 46 Connection terminal 60 Conductivity Connection 61 Conductive connection 101 Suspension 102 Base plate 103 Load beam 104 Piezo element 111 Suspension with head 112 Head slider 121 Hard disk drive

Claims (11)

In a suspension substrate having a head region and a central region, on which a head slider and an extendable actuator element that displaces the head slider are mounted,
A metal support layer;
An insulating layer provided on the metal support layer;
A wiring layer provided on the insulating layer,
A first ground terminal for an actuator element constituting the wiring layer and a second ground terminal for a head slider constituting the wiring layer;
The suspension substrate, wherein the first ground terminal and the second ground terminal are electrically connected by a ground wiring, and are connected to the metal support layer through a ground pad penetrating the insulating layer.   The suspension substrate according to claim 1, wherein the head slider and the actuator element are mounted on different sides with respect to the wiring layer.   The suspension substrate according to claim 1, wherein the head slider and the actuator element are mounted on the same side with respect to the wiring layer.   The suspension ground according to claim 1 or 2, wherein a third ground terminal for a heat assist element constituting the wiring layer is provided, and the third ground terminal is also electrically connected to the first ground terminal and the second ground terminal. substrate.   5. The suspension substrate according to claim 1, wherein a pair of the first ground terminals are provided, and the pair of first ground terminals are connected to the second ground terminal. 6. The wiring layer includes a plurality of wirings positioned on one side and the other side of the head slider to be mounted,
The number of wirings on one side of the head slider is larger than the number of wirings on the other side, and the ground wiring is disposed on the other side of the head slider. 6. The suspension substrate according to any one of 5 above.   The suspension substrate according to any one of claims 1 to 6, wherein the head slider and the actuator element are mounted in the head region, and the ground pad is connected to a tongue portion of the metal support layer.   8. The suspension substrate according to claim 1, wherein the ground pad is provided immediately below the first ground terminal for the actuator element. A base plate;
The suspension substrate according to any one of claims 1 to 8, which is attached to the base plate via a load beam;
A suspension comprising the actuator element mounted on the suspension substrate. The suspension according to claim 9,
A suspension with a head, comprising: a head slider mounted on the suspension substrate.   A hard disk drive comprising the suspension with a head according to claim 10.

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