JP6410132B2 - Suspension board with outer frame, suspension board with element and outer frame, method for manufacturing suspension board with element and outer frame - Google Patents

Description

  The present invention relates to a suspension board with an outer frame, a method for manufacturing a suspension board with an element and an outer frame, an element and a suspension board with an outer frame, and in particular, can prevent an actuator element from being damaged during an electrical inspection. The present invention relates to a suspension board with an outer frame, an element-attached and suspension board with an outer frame, an element-attached suspension board with an outer frame, and a method for manufacturing the suspension board with an outer frame.

  2. Description of the Related Art Generally, a hard disk drive (HDD) includes a suspension substrate having a gimbal area on which a magnetic head slider (hereinafter simply referred to as a head slider) for writing and reading data to and from a disk storing data is mounted. ing. This suspension substrate has a metal support layer and a wiring layer having a plurality of wirings laminated on the metal support layer via an insulating layer, and transmits an electric signal through each wiring, thereby allowing the disc to Data is written to or read from.

  While data is being written to or read from the disk, the head slider floats with a small distance (flying height) from the disk under the influence of an air flow generated by the rotation of the disk. Then, the gimbal region of the suspension substrate is supported by the convex dimple portion of the load beam attached to the suspension substrate from the side opposite to the disk side, and the head slider swings with this dimple portion as a fulcrum. And do a cymbal exercise.

  In such a hard disk drive, in order to move the head slider to a desired data track on the disk, a VCM actuator (voice coil motor) that rotates an actuator arm that supports the head slider is controlled by a servo control system. ing.

  In recent years, there has been an increasing demand for an increase in disk capacity. In order to meet this demand, the density of the disk is increased and the width of the track is reduced. For this reason, it may be difficult to accurately align the head slider with a desired track by the VCM actuator.

  In order to cope with this, a suspension of a dual actuator system (Dual Stage Actuator: DSA) in which a VCM actuator and a PZT microactuator cooperate to move a head slider to a desired track is known (for example, Patent Document 1). This PZT microactuator is composed of a piezo element (piezoelectric element) made of PZT (lead zirconate titanate), and expands and contracts when a voltage is applied to move the head slider minutely. In such a dual actuator type suspension, the VCM actuator roughly adjusts the position of the head slider, and the PZT microactuator finely adjusts the position of the head slider. In this way, the head slider is aligned with a desired track quickly and accurately.

  In Patent Document 1, a piezo element is mounted on a head region including a gimbal region of a suspension substrate, and one electrode of the mounted piezo element is electrically connected to an element terminal provided in the gimbal region. Yes. In this case, since the piezo element can be disposed close to the head slider, it is possible to improve the accuracy of alignment of the head slider.

JP 2010-146631 A

  In general, when a suspension substrate is manufactured, in order to improve manufacturing efficiency, the suspension substrate is manufactured in a multifaceted form in which a plurality of suspension substrates are arranged in an outer frame. For this reason, a piezoelectric element may be mounted on the head region of the suspension substrate and the piezoelectric element may be electrically inspected before each suspension substrate is separated.

  However, the gimbal region provided with the element terminals electrically connected to the piezo elements is formed flexibly so that the gimbal movement of the head slider is not hindered. As a result, the head region can be deformed when the tip of an electrical tester such as a probe is pressed against the element terminal. Since the piezo element generally has a hard property, it is difficult to follow the deformation of the head region. For this reason, there exists a problem that a piezoelectric element may be damaged at the time of an electrical test | inspection.

  The present invention has been made in consideration of such points, and the suspension substrate with an outer frame that can prevent the actuator element from being damaged during electrical inspection, the suspension substrate with the element and the suspension substrate with the outer frame, the element attachment, and It is an object of the present invention to provide a method for manufacturing a suspension substrate with an outer frame.

  The present invention relates to a suspension substrate with an outer frame on which an extendable actuator element for displacing a head slider is mounted, the suspension frame being disposed in the outer frame and supported by the outer frame. And the suspension board has a head region in which the head slider and the actuator element are mounted, and an element terminal electrically connected to the actuator element to be mounted is provided in the head region. The outer frame is provided with an outer frame terminal that is electrically connected to the element terminal.

  In the above suspension board with an outer frame, the element terminal includes a first element terminal for grounding the actuator element, a second element terminal for applying a predetermined voltage to the actuator element, And the outer frame terminal includes a first outer frame terminal electrically connected to the first element terminal and a second outer frame terminal electrically connected to the second element terminal. You may make it.

  In the suspension substrate with an outer frame described above, an insulating layer including a first surface and a second surface provided on a side opposite to the first surface, and the first of the insulating layer And a wiring layer provided on the second surface of the insulating layer, and the first element terminal is provided on the second surface of the insulating layer. The first outer frame terminal is provided on the first surface of the insulating layer, and the first element terminal and the first outer frame terminal are electrically connected to each other through the metal support layer. You may make it.

  Further, in the suspension substrate with an outer frame described above, the first element terminal constitutes the wiring layer, and the conductive layer electrically connects the first element terminal and the metal support layer to the insulating layer. A connection portion may be provided, and the first outer frame terminal may constitute the metal support layer.

  Further, in the suspension substrate with an outer frame described above, the insulating layer may have a terminal exposed portion that exposes the first outer frame terminal to the second surface side.

  In the suspension board with an outer frame described above, two first element terminals that are electrically connected to the corresponding actuator elements are provided in the head region in order to mount the pair of actuator elements. Each of the first element terminals may be electrically connected to the common first outer frame terminal.

  Also, in the suspension board with an outer frame described above, the suspension board with an outer frame has a plurality of suspension boards, and the first element terminals of the suspension boards are common to the first elements. It may be configured to be electrically connected to the outer frame terminal.

  The present invention also includes a suspension board with an outer frame and the suspension board with an outer frame, characterized in that the suspension board with an outer frame described above and the actuator element mounted on the head region of the suspension board are provided. I will provide a.

  In the suspension board with an element and the outer frame described above, the suspension board further includes a tail region provided with a tail terminal electrically connected to the second element terminal. A solder layer may be provided.

  Furthermore, the present invention provides a suspension substrate with an element and an outer frame on which an extendable actuator element for displacing a head slider is mounted, the suspension substrate being disposed within the outer frame and supported by the outer frame A suspension substrate with an element and a suspension substrate with an outer frame having a head region on which the head slider and the actuator element are mounted, the head region having an element terminal provided thereon, A step of preparing the suspension frame-equipped suspension board comprising: an outer frame provided with an outer frame terminal electrically connected to the element terminal; and a step of mounting the actuator element in the head region. A step of electrically connecting the actuator element to the element terminal; and A step of electrically testing the Chueta element, provides a method of manufacturing a substrate for attached and with an outer frame suspension device, characterized in that it comprises a.

  In the above-described suspension board with element and outer frame, the element terminal includes a first element terminal for grounding the actuator element and a second element for applying a predetermined voltage to the actuator element. A first outer frame terminal electrically connected to the first element terminal; a second outer frame terminal electrically connected to the second element terminal; In the step of electrically inspecting the actuator element, the actuator element may be electrically inspected from the first outer frame terminal and the second outer frame terminal.

  In the suspension board with an element and the suspension board with an outer frame described above, the suspension board further includes a tail region provided with a tail terminal electrically connected to the second element terminal, and the actuator element includes Before the mounting step, a solder layer may be provided on the tail terminal.

  In addition, in the above-described suspension board with an element and an outer frame, the second element terminal, the tail terminal, and the tail terminal from the second element terminal and the tail terminal before the step of providing the solder layer on the tail terminal. It is also possible to conduct an electrical inspection of the wiring connecting.

  According to the present invention, it is possible to prevent the actuator element from being damaged during the electrical inspection.

FIG. 1 is a plan view showing an example of a suspension with a head according to an embodiment of the present invention. FIG. 2 is an enlarged plan view showing a head region of the suspension with element of FIG. 3 is a cross-sectional view showing a head region and a tail region of the suspension with an element shown in FIG. FIG. 4 is a plan view of a suspension substrate with an element and an outer frame in the embodiment of the present invention. FIG. 5 is a sectional view showing a grounding element terminal in the suspension board with the element and with the outer frame of FIG. FIG. 6 is a cross-sectional view showing an application element terminal in the suspension board with elements and outer frame of FIG. FIG. 7 is a perspective view showing an example of a hard disk drive including the suspension with a head shown in FIG. FIGS. 8A to 8F are views for explaining a method of manufacturing the element-equipped and outer frame-equipped suspension substrate of FIG.

  The manufacturing method of the suspension board with an outer frame, the element and the suspension board with the outer frame, the element and the suspension board with the outer frame in the embodiment of the present invention will be described with reference to FIGS. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

  First, the suspension with head 111 will be described with reference to FIG.

  As shown in FIG. 1, the suspension with head 111 includes a suspension 101 and a head slider 112 mounted on the head region 2 (more specifically, the gimbal region 4) of the suspension substrate 1. Among them, the head slider 112 is for writing and reading data on a disk 123 (see FIG. 7) described later, and an adhesive (not shown) is attached to the gimbal region 4 of the suspension substrate 1 described later. It is joined using. A slider terminal (not shown) of the head slider 112 is electrically connected to a head terminal 32 described later by solder.

  Next, the suspension 111 will be described.

  The suspension 101 includes a base plate 102, a load beam 103 attached on the base plate 102, a suspension substrate 1 attached to the load beam 103, and a pair of piezo elements (mounted on the head region 2 of the suspension substrate 1). Actuator element) 104. Of these, the base plate 102 and the load beam 103 are both preferably made of stainless steel and are fixed to each other by welding.

  The load beam 103 is attached to the metal support layer 10 (described later) of the suspension substrate 1 by welding. The load beam 103 is provided with a jig hole 107, and the suspension substrate 1 is provided with a jig hole 5 for alignment with the jig hole 107 of the load beam 103. It has been. Thus, when the load beam 103 is attached to the suspension substrate 1, the suspension substrate 1 and the load beam 103 can be aligned. The jig hole 107 of the load beam 103 and the jig hole 5 of the suspension substrate 1 are arranged on the longitudinal axis X shown in FIG. Here, an example is shown in which two jig holes 5 are provided closer to the tail region 3 than the head slider 112. However, the present invention is not limited to this. It may be provided on the tip side (the side opposite to the tail region 3 side) from the region 4.

  Further, as shown in FIGS. 1 and 2, the load beam 103 has a dimple portion 108 that protrudes toward the gimbal region 4 (a tongue portion 12 described later) of the suspension substrate 1. The dimple portion 108 supports the tongue portion 12 in a swingable manner. Further, the dimple portion 108 is disposed on the longitudinal axis X of the suspension 101 and at a position corresponding to the center of gravity of the head slider 112.

  As shown in FIG. 2, the piezo element 104 is configured to be extendable and contractable in the longitudinal direction (P direction in FIG. 2). As a result, the pair of piezo elements 104 can displace the head slider 112 in the sway direction (the turning direction, the arrow Q direction in FIG. 2). Further, as shown in FIG. 3, each piezo element 104 includes a pair of electrodes (first electrode 104a, second electrode 104b) and a piezoelectric material portion 104c made of piezoelectric ceramics such as PZT (lead zirconate titanate). And have. The pair of electrodes 104a and 104b is formed at both ends (first element end 104d and second element end 104e) in the expansion / contraction direction of the piezoelectric material portion 104c on the surface of the piezoelectric material portion 104c on the insulating layer 20 side. Has been. That is, the piezo element 104 has a first element end 104d and a second element end 104e as ends in the expansion / contraction direction, the first electrode 104a is formed on the first element end 104d, A second electrode 104b is formed on the two-element end portion 104e.

  As shown in FIG. 3, the first electrode 104a of the piezo element 104 is electrically connected to a grounding element terminal 35 (described later) of the suspension substrate 1 via a conductive adhesive 105 (for example, silver paste). Has been. The grounding element terminal 35 is connected to the metal support layer 10 via a conductive connection portion 50 (described later) and is grounded. The second electrode 104 b is electrically connected to an application element terminal 36 (described later) of the suspension substrate 1 via the conductive adhesive 105. The application element terminal 36 is connected to an element wiring 34 to be described later, and a predetermined voltage is applied to the application element terminal 36 in order to expand and contract the piezo element 104.

  A non-conductive adhesive (for example, UV curable resin) 106 is applied to each of the element end portions 104d and 104e. The non-conductive adhesive 106 is for mechanically joining the piezo element 104 to the suspension substrate 1.

  The piezoelectric material portions 104c of the pair of piezo elements 104 are formed to have polarization directions different from each other by 180 °. When a predetermined voltage is applied, one piezo element 104 contracts and the other piezo element 104 104 extends. That is, the piezo element 104 is configured as a piezoelectric element that can expand and contract in the direction of arrow P in FIG. 2 when a predetermined voltage is applied between the electrodes 104a and 104b.

  As shown in FIGS. 1 and 2, such a piezo element 104 is formed in an elongated rectangular shape along the longitudinal axis X, and the expansion / contraction direction thereof is parallel to the longitudinal axis X. Yes. The piezo elements 104 are arranged symmetrically with respect to the longitudinal axis X so that the expansion and contraction of each piezo element 104 is evenly transmitted to the head slider 112.

  Next, the suspension board with element 61 will be described.

  The element-equipped suspension substrate 61 includes a suspension substrate 1 and a pair of piezo elements 104 mounted on the suspension substrate 1, and the base plate 102 and the load beam 103 are removed from the suspension 101 described above. Say. Therefore, the suspension 101 described above includes a base plate 102, a load beam 103, and an element-equipped suspension board 91 attached to the load beam 103. In the suspension board with element 61 in the present embodiment, a solder layer 55 (see FIG. 3) is provided on the tail terminal 33 of the suspension board 1.

  Next, the suspension substrate 1 will be described.

  As shown in FIG. 1, the suspension substrate 1 includes a head region 2 on which the head slider 112 and the piezoelectric element 104 are mounted, a tail region 3 to which an FPC substrate (flexible printed circuit board, external connection substrate) 131 is connected, have. Among these, the head region 2 includes a gimbal region 4 that performs a gimbal motion together with the head slider 112, and the gimbal region 4 is provided with a plurality of head terminals 32 that are electrically connected to the head slider 112. On the other hand, a plurality of tail terminals 33 connected to the FPC board 131 are provided in the tail region 3. The tail terminal 33 includes a signal tail terminal 33a and an element tail terminal 33b. The head terminal 32 and the signal tail terminal 33a are connected to each other by a plurality of signal wirings 31 described later. The element tail terminal 33b is connected to the piezo element 104 by an element wiring 34 described later. 1 shows an example in which four head terminals 32 are provided and six tail terminals 33 are provided for the sake of clarity, the present invention is not limited to this. For example, The number of the signal wirings 31 and the number of the piezoelectric elements 104 are preferably provided.

  As shown in FIGS. 2 and 3, the suspension substrate 1 includes a metal support layer 10, an insulating layer 20 provided on the metal support layer 10, and a wiring layer 30 provided on the insulating layer 20. The wiring layer 30 is laminated on the metal support layer 10 with the insulating layer 20 interposed therebetween. That is, the insulating layer 20 includes a first surface 20a and a second surface 20b provided on the opposite side of the first surface 20a, and a metal support layer is formed on the first surface 20a of the insulating layer 20. 10, and the wiring layer 30 is provided on the second surface 20 b of the insulating layer 20. A seed layer (not shown) made of nickel (Ni), chromium (Cr), copper (Cu) and having a thickness of about 300 nm may be interposed between the insulating layer 20 and the wiring layer 30. In this case, the adhesion between the insulating layer 20 and the wiring layer 30 can be improved.

  The metal support layer 10 includes a metal support layer main body portion 11 extending from the tail region 3 and a tongue portion 12 provided in the gimbal region 4 on which the head slider 112 is mounted. The metal support layer main body portion 11 and the tongue portion 12 are connected by a central connecting portion 13 that extends along the longitudinal axis X. The width of the central coupling portion 13 is reduced, whereby the central coupling portion 13 has flexibility, prevents the gimbal movement of the tongue portion 12 on which the head slider 112 is mounted, and prevents the piezo element. This prevents the expansion / contraction operation 104 from being hindered. The gimbal region 4 corresponds to a region where the gimbal motion including the tongue 12 is performed, and the head region 2 corresponds to a region including the gimbal region 4 and a region where the surrounding gimbal motion is not performed. This is used as a concept including the gimbal region 4.

  In the head region 2, a rectangular accommodation opening 14 that accommodates the piezo element 104 is provided in the metal support layer 10. The accommodation openings 14 are arranged on both sides of the central connecting portion 13. That is, the central coupling portion 13 is disposed between the pair of accommodation openings 14. In the present embodiment, the member constituting the metal support layer 10 is not formed on the outer side of the accommodation opening 14 (the side opposite to the side of the central coupling portion 13). However, if there is no problem in hindering the gimbal movement of the head slider 112 and the expansion / contraction operation of the piezo element 104, a member constituting the metal support layer 10 may be formed outside the accommodation opening 14.

  The wiring layer 30 includes a plurality of wirings, that is, a signal wiring 31 including a pair of reading wirings and a pair of writing wirings, and a pair of element wirings 34 connected to the piezo element 104. Among these, as shown in FIG. 1, the signal wiring 31 connects the head terminal 32 and the signal tail terminal 33 a, and by transmitting an electric signal to the signal wiring 31, the head slider 112 moves the disk 123. Data is written to or read from (see FIG. 7). The element wiring 34 extending from the element tail terminal 33 b is electrically connected to the application element terminal 36, and applies a predetermined voltage to the second electrode 104 b of the piezo element 104.

  As shown in FIGS. 2 and 3, the wiring layer 30 is connected to the grounding element terminal (first element terminal) 35 connected to the first electrode 104 a of the piezo element 104 and the second electrode 104 b of the piezo element 104. Application element terminal (second element terminal) 36 to be applied. Among these, the grounding element terminal 35 is for grounding the first electrode 104a of the piezo element 104 and grounding the piezo element 104, and is connected to the metal support layer 10 via the conductive connection portion 50 described later. Are electrically connected to the tongue section 12 of the first embodiment. As described above, the application element terminal 36 is for applying a predetermined voltage to the second electrode 104b of the piezo element 104. The application element terminal 36 is connected to the element tail via the element wiring 34. The terminal 33b is electrically connected. In the present embodiment, in order to mount the pair of piezo elements 104 in the head region 2, there are two ground element terminals 35 and application element terminals 36 electrically connected to the corresponding piezo elements 104. It is provided one by one.

  The grounding element terminal 35 and the application element terminal 36 are provided in the head region 2. More specifically, the grounding element terminal 35 is disposed in the gimbal region 4 which is a part of the head region 2 and is supported by the tongue portion 12. The application element terminal 36 is disposed in a region outside the gimbal region 4 in the head region 2 and supported by the metal support layer main body 21.

  As shown in FIG. 3, the insulating layer 20 is provided with a terminal opening 21 that exposes the element terminals 35 and 36 to the piezoelectric element 104 side. A plating layer (not shown) formed by performing nickel (Ni) plating and gold (Au) plating in this order on the portion of the element terminals 35 and 36 exposed to the terminal opening 21 is provided. . This prevents the element terminals 35 and 36 from corroding and reduces the contact resistance between the element terminals 35 and 36 and the electrodes 104 a and 104 b of the piezoelectric element 104. The head terminal 32 and the tail terminal 33 are similarly provided with a plating layer.

  A protective layer 40 that covers the wirings 31 and 34 is provided on the insulating layer 20. The head slider 112 described above is disposed on the protective layer 40 side (on the protective layer 40) of the suspension substrate 1, and the piezo element 104 is disposed on the metal support layer 10 side. In FIGS. 1 and 2, the protective layer 40 is omitted for the sake of clarity.

  The insulating layer 20 is provided with the above-described conductive connection portion (via) 50 that electrically connects the grounding element terminal 35 and the tongue portion 12 of the metal support layer 10 to each other. That is, the insulating layer through hole 22 is provided in the insulating layer 20, the wiring layer through hole 37 is provided in the wiring layer 30, and the insulating layer through hole 22 and the wiring layer through hole 37 are subjected to nickel plating or copper plating. Thus, the conductive connection part 50 is formed. In this way, the grounding element terminal 35 is grounded. In the form shown in FIG. 3, the conductive connection portion 50 is covered with the protective layer 40 to prevent corrosion of the conductive connection portion 50.

  Next, materials constituting each layer of the suspension substrate 1 will be described in detail.

  The material of the metal support layer 10 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, 42 alloy, aluminum, beryllium copper, or other copper Alloys can be used, and among these, stainless steel is preferred. The thickness of the metal support layer 10 is preferably 15 μm to 20 μm. Thereby, the conductivity, rigidity, and elasticity of the metal support layer 10 can be ensured.

  The material of the insulating layer 20 is not particularly limited as long as it has a desired insulating property, but for example, it is preferable to use polyimide (PI). The material of the insulating layer 20 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 20 is preferably 5 μm to 10 μm. As a result, it is possible to ensure the insulation performance between the metal support layer 10 and the wiring layer 30 and to prevent the rigidity of the suspension substrate 1 as a whole from being lost.

  The wirings 31 and 34 of the wiring layer 30 are configured as conductors for transmitting electrical signals, and the materials of the wirings 31 and 34 are particularly limited as long as they have a desired conductivity. However, it is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 31 and 34 is 5 micrometers-18 micrometers. As a result, the transmission characteristics of the wirings 31 and 34 can be ensured, and loss of flexibility as the suspension board 1 as a whole can be prevented. The head terminal 32, the tail terminal 33, and the element terminals 35 and 36 have the same material and the same thickness as the wirings 31 and 34, and constitute the wiring layer 30.

  As the material of the protective layer 40, it is preferable to use a resin material, for example, polyimide, like the insulating layer 20. The material of the protective layer 40 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 40 (thickness on the wiring layer 30) is preferably 3 μm to 10 μm.

  Next, the suspension substrate 71 with the outer frame according to the present embodiment will be described with reference to FIG.

  Here, the suspension frame-equipped suspension board 71 takes a plurality of suspension boards 1 from a long material plate (for example, a laminated material plate of the metal support layer 10, the insulating layer 20, and the wiring layer 30). Thus, etching of each layer, plating treatment, and the like are integrally performed to manufacture a plurality of suspension substrates 1 integrally. Although FIG. 4 shows an example in which six suspension substrates 1 are supported by the outer frame 72, the number of suspension substrates 1 supported by the outer frame 72 is not limited to six.

  As shown in FIG. 4, the suspension frame-equipped suspension substrate 71 includes an outer frame 72 and a plurality of suspension substrates 1 disposed in the outer frame 72 and supported by the outer frame 72. The plurality of suspension substrates 1 are aligned within the outer frame 72 in a direction (width direction) orthogonal to the longitudinal axis X of the suspension substrate 1.

  The outer frame 72 is formed integrally with each suspension substrate 1 and has a structure in which the metal support layer 10, the insulating layer 20, and the wiring layer 30 are laminated in the same manner as each suspension substrate 1. A part of the wiring layer 30 is covered with the protective layer 40.

  Further, as shown in FIGS. 4 to 6, the outer frame 72 is provided with inspection terminals (outer frame terminals) that are electrically connected to the element terminals 35 and 36. The inspection terminals include a grounding inspection terminal (first outer frame terminal) 15 electrically connected to the grounding element terminal 35 and an application inspection terminal (second outer terminal) electrically connected to the application element terminal 36. Frame terminal) 38.

  In the present embodiment, the grounding element terminal 35 and the application element terminal 36 are provided on the second surface 20b of the insulating layer 20 as shown in FIG. . That is, as described above, the grounding element terminal 35 and the application element terminal 36 have the same material and the same thickness as the wirings 31 and 34 and the like of the wiring layer 30. It is obtained by patterning together with 34 and the like.

  As shown in FIG. 5, the grounding inspection terminal 15 is provided on the first surface 20 a of the insulating layer 20 and constitutes the metal support layer 10. That is, as described above, the grounding inspection terminal 15 has the same material and the same thickness as the metal support layer main body 21 etc. of the metal support layer 10, and together with the metal support layer main body 21 etc. by the etching process. Obtained by patterning. The outer frame 72 is provided with only one grounding inspection terminal 15, and the two grounding element terminals 35 of one suspension board 1 are provided with this single (common) grounding inspection terminal 15. The two grounding element terminals 35 of the other suspension boards 1 are also electrically connected to the grounding inspection terminal 15. That is, the grounding element terminals 35 of all the suspension substrates 1 supported in the outer frame 72 are electrically connected to the single grounding inspection terminal 15.

  The insulating layer 20 is provided with an insulating layer terminal exposed portion 23 that exposes the grounding inspection terminal 15 to the second surface 20b side. The grounding inspection terminal 15 is exposed by the insulating layer terminal exposed portion 23, and the tip of an electrical inspection device 150 (see FIG. 8) such as a probe can be brought into contact with the grounding inspection terminal 15. . In the present embodiment, an example in which the insulating layer terminal exposing portion 23 is formed in a rectangular opening shape is shown, but the present invention is not limited to this, and if the grounding inspection terminal 15 can be exposed, The shape of the insulating layer terminal exposed portion 23 is arbitrary, and may be, for example, a shape in which the insulating layer 20 is cut out from the outer peripheral edge or inner peripheral edge of the outer frame 72. As shown in FIG. 5, when the protective layer 40 is provided on the grounding inspection terminal 15, the grounding inspection terminal 15 is exposed to the protective layer 40 in the same manner as the insulating terminal exposing portion 23. It is preferable that the protective layer terminal exposed portion 41 is provided.

  As shown in FIG. 6, the inspection terminal for application 38 is provided on the second surface 20b of the insulating layer 20, and the wiring layer 30 is connected to the grounding element terminal 35 and the application element terminal 36 described above. It is composed. A plurality of application inspection terminals 38 are provided on the outer frame 72, arranged in the vicinity of the tail region 3 of the corresponding suspension substrate 1, and connected to the corresponding application element terminal 36 of the suspension substrate 1. Each is electrically connected via a terminal 33b.

  As shown in FIG. 4, each suspension substrate 1 is supported by an outer frame 72 via a plurality of joint portions 16. The joint portion 16 is formed by a member constituting the metal support layer 10. Thus, the suspension substrate 1 portion and the outer frame 72 portion of the metal support layer 10 are mechanically and electrically connected to each other. As described above, the grounding element terminal 35 is electrically connected to the tongue portion 12 of the metal support layer 10 via the conductive connection portion 50. As a result, the grounding element terminal 35 and the grounding inspection terminal 15 are electrically connected to each other via the tongue portion 12 of the metal support layer 10, the metal support layer main body portion 11, the joint portion 16, and the like. The joint portion 16 is a cut portion when the suspension substrate 1 is separated.

  Further, the application element terminal 36 of each suspension substrate 1 and the application inspection terminal 38 of the outer frame 72 are connected by a joint wiring 39. More specifically, the application element terminal 36 is electrically connected to the element tail terminal 33b via the element wiring 34, and the application inspection terminal 38 is connected to the joint wiring 39 extending from the element tail terminal 33b. Are electrically connected. The joint wiring 39 is supported by the insulating layer 20 and covered with the protective layer 40. As shown in FIG. 5, the application inspection terminal 38 is exposed by the protective layer terminal exposing portion 42 of the protective layer 40, and the tip of the electrical inspection device 150 can be brought into contact therewith.

  The pair of piezo elements 104 described above is mounted in the form of the suspension frame-equipped suspension board 71 to obtain the suspension board 81 with the element and the suspension frame with the outer frame. In other words, the suspension board 81 with the element and the suspension frame 81 has a pair of piezo elements mounted on the head region 2 of each suspension board 1 of the suspension board 71 with the outer frame and the suspension board 71 with the outer frame. 104. In addition, the suspension board 81 with the elements and the suspension frame 81 with the outer frame can be said to be a form in which a plurality of suspension boards with elements 61 in which a pair of piezo elements 104 are mounted in the head region 2 are supported in the outer frame 72. . In this element-equipped and outer frame-equipped suspension board 81, a solder layer 55 (see FIG. 3) is provided on the tail terminal 33 of the suspension board 1. In the element-equipped and outer frame-equipped suspension board 81, the base plate 102 and the load beam 103 are attached to each element-equipped suspension board 61 to obtain the suspension 101. Subsequently, the head slider 112 is mounted in the gimbal region 4. As a result, the suspension with head 111 shown in FIG. 1 is obtained.

  Next, the hard disk drive 121 in this embodiment will be described with reference to FIG. 7 includes a case 122, a disk 123 that is rotatably attached to the case 122, stores data, a spindle motor 124 that rotates the disk 123, and a desired flying height on the disk 123. And a suspension 111 with a head including a head slider 112 that writes and reads data to and from the disk 123. Of these, the suspension with head 111 is movably attached to the case 122, and a voice coil motor 125 that moves the head slider 112 of the suspension with head 111 along the disk 123 is attached to the case 122. Yes. The suspension with head 111 is attached to the voice coil motor 125 via an arm 126, and is connected to an FPC board 131 (see FIG. 1) connected to a control unit (not shown) that controls the hard disk drive 121. ing. In this way, an electrical signal is transmitted between the control unit and the head slider 112 via the suspension board 1 and the FPC board 131.

  Next, the operation of the present embodiment having such a configuration, that is, a method of manufacturing the suspension board 81 with elements and the outer frame will be described with reference to FIG. FIG. 8 schematically shows a cross section of the head region 2, the tail region 3, and the outer frame 72.

  First, the manufacturing method of the outer frame suspension board 71 will be described in the case of manufacturing by the subtractive method. Note that the suspension frame-equipped suspension substrate 1 can be manufactured by an additive method.

  First, a laminate in which the metal support layer 10, the insulating layer 20, and the wiring layer 30 are laminated is prepared. Subsequently, the wiring layer 30 is etched into a desired shape to form wirings 31 and 34, a head terminal 32, a tail terminal 33, and element terminals 35 and 36. At this time, an application inspection terminal 38 and joint wiring 39 are also formed. Next, the protective layer 40 that covers the wirings 31 and 34 is formed in a desired shape on the insulating layer 20. At this time, the protective layer terminal exposed portions 41 and 42 are formed in the protective layer 40. Subsequently, the insulating layer 20 is etched into a desired shape. At this time, terminal openings 21, insulating layer terminal exposed portions 23, and the like are formed in the insulating layer 20. Thereafter, the metal support layer 10 is etched into a desired shape and contoured, and the metal support layer main body portion 11, the tongue portion 12, the central connection portion 13, the accommodation opening portion 14, the grounding inspection terminal 15, the joint portion 16, and the like are formed. It is formed. Thus, a suspension substrate 71 with an outer frame in which a plurality of suspension substrates 1 are supported in the outer frame 72 (see FIGS. 4 and 8A) is obtained.

  In the suspension substrate 71 with the outer frame obtained as described above, as shown in FIG. 8A, electrical inspection such as disconnection inspection of the signal wiring 31 and the element wiring 34 of the suspension substrate 1 is performed. In this case, the tip of the electrical tester 150 such as a probe can be pressed against the head terminal 32 and the tail terminal 33 for inspection.

  Subsequently, as shown in FIG. 8B, a solder layer 55 is formed on the tail terminal 33 (the signal tail terminal 33a and the element tail terminal 33b). The method for forming the solder layer 55 is not particularly limited. For example, the solder layer 55 may be formed by applying a solder paste (also referred to as cream solder) on the tail terminal 33 by a printing method, and heating and melting it. it can. Here, the solder paste is a paste in which fine powdery solder particles are formed by a flux. For this reason, when heated after printing, the solder grains are melted, and the solder layer 55 welded onto the tail terminal 33 is formed. When melting the solder paste, the solder paste is generally heated to 300 ° C. or higher. Thus, the solder layer 55 is preferably formed before the piezo element 104 is mounted in order to avoid thermal damage to the piezo element 104.

  Next, the piezo element 104 is mounted on the head region 2 of each suspension substrate 1.

  In this case, first, a conductive adhesive 105 is applied to the terminal opening 21 as shown in FIG.

  Subsequently, as shown in FIG. 8D, the piezo element 104 is accommodated in the accommodation opening 14. As a result, the electrodes 104 a and 104 b of the piezo element 104 are electrically connected to the grounding element terminal 35 and the application element terminal 36 through the conductive adhesive 105, respectively. Thereafter, the conductive adhesive 105 is baked and cured.

  After the conductive adhesive 105 is cured, a non-conductive adhesive 106 is applied to the first element end 104d and the second element end 104e of the piezo element 104 as shown in FIG. Potting). The applied nonconductive adhesive 106 spreads wet around the element end portions 104 d and 104 e of the piezo element 104. After the non-conductive adhesive 106 is applied, the non-conductive adhesive 106 applied is cured by being left in an air environment. Thus, the piezo element 104 is mechanically joined to the suspension substrate 1 and mounted.

  After the piezo element 104 is mounted, the piezo element 104 is electrically inspected from the ground inspection terminal 15 and the application inspection terminal 38 as shown in FIG. More specifically, the electrical tester 150 is connected to the grounding test terminal 15 exposed from the insulating layer terminal exposed part 23 and the protective layer terminal exposed part 41 and the application test terminal 38 exposed from the protective layer terminal exposed part 42. The piezoelectric element 104 can be electrically inspected by pressing the tip of the piezoelectric element 104.

  In this case, the electrical inspection can be performed without using the grounding element terminal 35 and the application element terminal 36 provided in the head region 2. That is, by pressing the tip of the electrical tester 150 against the element terminals 35 and 36, it is possible to avoid the head region 2 including the gimbal region 4 from being deformed and damaging the piezoelectric element 104.

  Further, the electrical inspection can be performed without using the element tail terminal 33b on which the solder layer 55 is formed. That is, when the tip of the electrical tester 150 is pressed against the solder layer 55 on the element tail terminal 33b, the tip of the electrical tester 150 becomes slippery with respect to the solder layer 55, so that workability may be reduced. However, as described above, by using the application inspection terminal 38 in which the solder layer 55 is not provided, it is possible to prevent the workability from being deteriorated.

  After the electrical inspection of the piezo element 104 is performed in this manner, the element-equipped and outer frame-equipped suspension substrate 81 according to the present embodiment is obtained.

  Next, a manufacturing method of the suspension 101 and a manufacturing method of the suspension with head 111 using the element-mounted and outer frame-mounted suspension substrate 81 obtained as described above will be described.

  First, the load beam 103 is fixed to the base plate 102 (see FIG. 1) by welding. Subsequently, the load beam 103 and the suspension substrate 1 are aligned by the jig hole 107 provided in the load beam 103 and the jig hole 5 provided in the suspension substrate 1. Thereafter, the metal support layer 10 of the suspension substrate 1 is welded, and the load beam 103 and the suspension substrate 1 are joined and fixed to each other. In this way, a plurality of suspensions 101 supported in the outer frame 72 are obtained.

  Next, the head slider 112 is mounted on the gimbal region 4 of each suspension substrate 1. In this case, the head slider 112 is joined to the tongue 12 using an adhesive, and the slider terminal of the head slider 112 is electrically connected to the head terminal 32 of the suspension substrate 1 by soldering.

  Then, each joint part 16 (refer FIG. 4) and the joint wiring 39 are cut | disconnected. As a result, the suspensions with heads 111 are separated from the outer frame 72 to obtain a plurality of individual suspensions with heads 111.

  The suspension 111 with the head obtained as described above is attached to the arm 126 of the hard disk drive 121, and the FPC board 131 (see FIG. 1) is connected to the tail terminal 33 of the suspension board 1, as shown in FIG. A hard disk drive 121 is obtained.

  When writing and reading data in the hard disk drive 121 shown in FIG. 7, the head slider 112 of the suspension with head 111 is moved along the disk 123 by the voice coil motor 125 and is rotated by the spindle motor 124. Ascending while maintaining the desired flying height. During this time, the head slider 112 attached to the tongue portion 12 swings while being supported by the dimple portion 108 of the load beam 103 under the influence of the airflow generated by the rotation of the disk 123. As a result, the head slider 112 can maintain a desired flying height with respect to the disk 123. In this way, data is exchanged between the head slider 112 and the disk 123 while the head slider 112 performs a gimbal movement on the disk 123. During this time, an electrical signal is transmitted to the signal wiring 31 that connects the head terminal 32 and the tail terminal 33 of the suspension substrate 1.

  When moving the head slider 112, the voice coil motor 125 roughly adjusts the position of the head slider 112, and the piezo element 104 finely adjusts the position of the head slider 112. That is, by applying a predetermined voltage to the second electrode 104b of the piezo element 104, one piezo element 104 contracts in the direction along the longitudinal axis X (the direction of arrow P in FIG. 2) and the other piezo element 104 Element 104 expands. In this case, a predetermined voltage is input to the piezoelectric element 104 via the element wiring 34, the application element terminal 36, and the conductive adhesive 105. When the piezo element 104 expands and contracts, the head slider 112 mounted on the head region 2 moves in the sway direction (the arrow Q direction in FIG. 2).

  Thus, according to the present embodiment, the outer frame 72 is provided with the ground inspection terminal 15 electrically connected to the ground element terminal 35 and electrically connected to the application element terminal 36. An application inspection terminal 38 is provided. Thus, the electrical inspection of the piezo element 104 can be performed from the ground inspection terminal 15 and the application inspection terminal 38 without using the ground element terminal 35 and the application element terminal 36. That is, it is possible to avoid the head region 2 from being deformed and damaging the piezo element 104 by pressing the tip of the electrical tester 150 against the element terminals 35 and 36. As a result, it is possible to prevent the actuator element from being damaged during the electrical inspection.

  In addition, according to the present embodiment, the electrical inspection of the piezo element 104 can be performed from the application inspection terminal 38 without using the element tail terminal 33b. Thus, even when the solder layer 55 is provided on the element tail terminal 33b, it is possible to prevent the workability from being deteriorated. That is, when the tip of the electrical tester 150 is pressed against the solder layer 55 on the element tail terminal 33b, the tip of the electrical tester 150 is slidable with respect to the solder layer 55, and workability may be reduced. However, according to the present embodiment, the electrical inspection of the piezo element 104 can be performed from the application inspection terminal 38 provided on the outer frame 72 instead of the element tail terminal 33b. For this reason, it can prevent that the workability | operativity of the electrical inspection of the piezo element 104 falls.

  Further, according to the present embodiment, the grounding inspection terminal 15 is provided on the first surface 20 a of the insulating layer 20, and the grounding element terminal 35 and the grounding inspection terminal 15 are interposed via the metal support layer 10. They are electrically connected to each other. For this reason, it is not necessary to provide a member such as the conductive connection portion 50 in order to electrically connect the grounding inspection terminal 15 and the metal support layer 10, and the structure of the outer frame 72 can be simplified. . In particular, according to the present embodiment, since the grounding inspection terminal 15 constitutes the metal support layer 10, the configuration of the grounding inspection terminal 15 can be further simplified. It can be easily formed by patterning together with other members.

  Further, according to the present embodiment, the insulating layer 20 has the insulating layer terminal exposed portion 23 that exposes the grounding inspection terminal 15 to the second surface 20b side. As a result, the grounding inspection terminal 15 can be exposed on the same side as the application inspection terminal 38 (the second surface 20b side), and the grounding inspection terminal 15 and the application inspection terminal 38 can be exposed to each other. The tip of the electrical tester 150 can be pressed from the same side. For this reason, the workability of the electrical inspection of the piezo element 104 can be improved.

  Further, according to the present embodiment, the plurality of suspension boards 61 with elements are supported on the outer frame 72, and each grounding inspection terminal 15 of each suspension board 1 is a single grounding inspection terminal 15. Is electrically connected. Therefore, the number of grounding inspection terminals 15 formed on the outer frame 72 can be reduced, and the structure of the outer frame 72 can be simplified. In particular, when the insulating layer terminal exposed portion 23 is provided on the ground inspection terminal 15, the number of the insulating layer terminal exposed portions 23 can be reduced, and the rigidity of the outer frame 72 can be ensured.

  As described above, the embodiments of the present invention have been described in detail. The manufacturing method of the suspension substrate with an outer frame, the suspension substrate with an element and the suspension frame with an outer frame, the suspension substrate with an element and the suspension frame with an outer frame according to the present invention is as follows. The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the example in which the grounding inspection terminal 15 forms the metal support layer 10 has been described. However, the present invention is not limited to this, and the grounding inspection terminal 15 may be formed on the first surface 20 a of the insulating layer 20 using a material different from that of the metal support layer 10. Furthermore, the grounding inspection terminal 15 may be provided on the second surface 20 b instead of the first surface 20 a of the insulating layer 20. In this case, it is preferable that the grounding inspection terminal 15 is electrically connected to the metal support layer 10 via a conductive connection portion (not shown) penetrating the insulating layer 20. In this case, the grounding inspection terminal 15 may constitute the wiring layer 30.

  Further, in the present embodiment described above, the example in which the outer frame 72 is provided with the single grounding inspection terminal 15 has been described. However, the present invention is not limited to this. For example, two grounding element terminals 35 provided in the head region 2 of one suspension substrate 1 are electrically connected to a single (common) grounding inspection terminal 15. A plurality of such grounding test terminals 15 may be provided for each suspension board 1. Alternatively, each grounding element terminal 35 existing on the suspension board 71 with the outer frame is electrically connected to a separate grounding inspection terminal 15, and a plurality of grounding inspection terminals 15 are provided for each grounding element terminal 35. It may be done.

  In the above-described embodiment, the example in which the electrical inspection of the piezo element 104 is performed from the application inspection terminal 38 with the solder layer 55 provided on the tail terminal 33 has been described. However, the present invention is not limited to this, and when the solder layer 55 is not provided on the tail terminal 33, the piezo element 104 is not formed from the application test terminal 38 but the tail terminal 33 and the ground test terminal 15. An electrical inspection may be performed. Even in this case, since the tail region 3 provided with the tail terminal 33 against which the tip of the electrical tester 150 is pressed is separated from the head region 2 on which the piezo element 104 is mounted, the head region 2 is deformed. Thus, the piezo element 104 can be prevented from being damaged.

  Further, in the above-described embodiment, an example in which a pair of (two) piezo elements 104 formed separately is mounted on the head region 2 has been described. However, the present invention is not limited to this, and a single piezoelectric element in which piezoelectric material portions having polarization directions different from each other by 180 ° are integrally formed may be mounted on the head region 2. Even in this case, the present invention can be preferably applied.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Head area | region 3 Tail area | region 10 Metal support layer 15 Grounding test terminal 20 Insulating layer 20a 1st surface 20b 2nd surface 23 Insulating layer terminal exposure part 30 Wiring layer 31 Signal wiring 32 Head terminal 33 Tail Terminal 34 Element wiring 35 Grounding element terminal 36 Application element terminal 38 Application inspection terminal 50 Conductive connection 55 Solder layer 71 Suspension substrate 72 with outer frame 81 External frame suspension substrate with element 104 Piezo element 112 Head slider

Claims (10)

A suspension substrate with an outer frame on which an extendable actuator element that displaces the head slider is mounted,
An outer frame,
A suspension substrate disposed in the outer frame and supported by the outer frame,
The suspension substrate has a head region on which the head slider and the actuator element are mounted,
In the head region, an element terminal electrically connected to the actuator element to be mounted is provided,
The outer frame is provided with an outer frame terminal electrically connected to the element terminal ,
The element terminal includes a first element terminal for grounding the actuator element, and a second element terminal for applying a predetermined voltage to the actuator element,
The outer frame terminal includes a first outer frame terminal electrically connected to the first element terminal, and a second outer frame terminal electrically connected to the second element terminal,
The outer frame and the suspension substrate are:
An insulating layer including a first surface and a second surface provided on the opposite side of the first surface;
A metal support layer provided on the first surface of the insulating layer;
A wiring layer provided on the second surface of the insulating layer,
The first element terminal is provided on the second surface of the insulating layer;
The first outer frame terminal is provided on the first surface of the insulating layer,
The first element terminal and the first outer frame terminal are electrically connected to each other through the metal support layer,
The suspension substrate with an outer frame , wherein the insulating layer has a terminal exposed portion that exposes the first outer frame terminal to the second surface side . The first element terminal constitutes the wiring layer,
The insulating layer is provided with a conductive connection portion that electrically connects the first element terminal and the metal support layer to each other,
The suspension substrate with an outer frame according to claim 1 , wherein the first outer frame terminal constitutes the metal support layer. In order to mount a pair of the actuator elements in the head region, two first element terminals electrically connected to the corresponding actuator elements are provided,
Wherein each of the first element terminal, the suspension board with the outer frame according to claim 1 or 2, characterized in that it is electrically connected to the common of said first outer frame terminal. The suspension substrate with an outer frame has a plurality of the suspension substrates,
Each said first element terminal of the substrate for the suspension, an outer frame according to any one of claims 1 to 3, characterized in that it is electrically connected to the common of said first outer frame terminals Substrate for suspension. The suspension substrate with an outer frame according to any one of claims 1 to 4 ,
A suspension substrate with an element and an outer frame, comprising: the actuator element mounted on the head region of the suspension substrate. The suspension substrate further includes a tail region provided with a tail terminal electrically connected to the second element terminal;
6. The suspension board with an element and the outer frame according to claim 5 , wherein a solder layer is provided on the tail terminal. A suspension substrate with an element and an outer frame on which an extendable actuator element for displacing the head slider is mounted, the element having an outer frame and a suspension substrate disposed in the outer frame and supported by the outer frame A method of manufacturing a suspension board with a frame,
A head region on which the head slider and the actuator element are mounted, the suspension substrate having a head region provided with an element terminal, and an outer frame terminal electrically connected to the element terminal. Preparing the outer frame-equipped suspension substrate including the outer frame;
Mounting the actuator element in the head region, electrically connecting the actuator element to the element terminal;
Electric inspection of the actuator element from the outer frame terminal ,
The element terminal includes a first element terminal for grounding the actuator element, and a second element terminal for applying a predetermined voltage to the actuator element,
The outer frame terminal includes a first outer frame terminal electrically connected to the first element terminal, and a second outer frame terminal electrically connected to the second element terminal,
The outer frame and the suspension substrate are:
An insulating layer including a first surface and a second surface provided on the opposite side of the first surface;
A metal support layer provided on the first surface of the insulating layer;
A wiring layer provided on the second surface of the insulating layer,
The first element terminal is provided on the second surface of the insulating layer;
The first outer frame terminal is provided on the first surface of the insulating layer,
The first element terminal and the first outer frame terminal are electrically connected to each other through the metal support layer,
The method for manufacturing a suspension substrate with an element and an outer frame , wherein the insulating layer has a terminal exposed portion that exposes the first outer frame terminal to the second surface side . In the step of electrically testing the previous SL actuator element, said first outer frame terminal and the second element with, and an outer frame with suspension according to claim 7, the outer frame terminal, characterized in that electrical testing of the actuator element Manufacturing method for industrial use. The suspension substrate further includes a tail region provided with a tail terminal electrically connected to the second element terminal;
Before the step of mounting the actuator element, the elements with and method of manufacturing a substrate for an outer frame with suspension according to claim 7 or 8 a solder layer to the tail terminal is characterized in that it is provided. The electrical inspection of a wiring connecting the second element terminal and the tail terminal is performed from the second element terminal and the tail terminal before the step of providing the solder layer on the tail terminal. Item 10. A method for manufacturing a suspension board with an element and an outer frame according to Item 9 .

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