JP2017142316A - Method for manufacturing liquid crystal panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress pressure from being applied at a time to a sealant applied to a substrate until the thickness of the sealant becomes dn.SOLUTION: A method for manufacturing a liquid crystal panel includes the steps of: applying a sealant SLa to a substrate SB1 (S4A); applying pressure to the sealant SLa so that the thickness of the sealant SLa on the substrate SB1 becomes d1 (S4B); and attaching a substrate SB2 to the substrate SB1 with the pressurized sealant SLb that is the sealant SLa having a thickness of d1 (S6). In the step (S6), while a space SPC1 is provided with liquid crystal, pressure is applied to the pressurized sealant SLb so that the thickness of the pressurized sealant SLb becomes dn.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a liquid crystal panel.

  In a method for manufacturing a liquid crystal panel, methods for injecting liquid crystal into the liquid crystal panel include a vacuum injection method and a drop injection (ODF) method. In the dropping injection method, liquid crystal is dropped onto a substrate coated with a sealing material. Next, in a vacuum state, a step in which the substrate on which the liquid crystal is dropped and the counter substrate are bonded to each other (hereinafter, also referred to as “bonding step”) is performed. Next, a step of curing the sealing material is performed. Thereby, a liquid crystal panel is formed.

  Hereinafter, the thickness of the sealing material in the formed liquid crystal panel is also referred to as “dn”. dn is a real number larger than 0.

  Patent Document 1 discloses a technique using a dropping injection method. Immediately after the sealing material is applied to the substrate by the dropping injection method, the shape of the sealing material is a scallop shape. Moreover, the width | variety of the said seal-like sealing material is 0.3 mm, for example, and the thickness of the said sealing material is about 30 micrometers, for example.

  In the bonding process, pressure treatment is performed. In the pressure treatment, pressure is applied to the sealing material at a time until the thickness of the sealing material becomes dn with the sealing material sandwiched between two substrates. Therefore, the sealing material is crushed. Thereby, the cross-sectional shape of the sealing material becomes a rectangular shape. At this time, the width of the sealing material is, for example, 1.0 mm, and the thickness of the sealing material is, for example, about 5 μm (dn).

  Note that when the pressure treatment is performed in the presence of an obstacle (liquid crystal, foreign matter, spacer material, etc.) around the sealing material, the sealing material cannot be crushed normally. Therefore, the sealing material has an unintended shape. In this case, the following problem N occurs. The defect N is, for example, a problem that a gap unevenness defect occurs. Further, the defect N is, for example, a problem that the sealing material is disconnected and liquid crystal leaks.

  Therefore, it is desirable that there are no obstacles in the vicinity of the sealing material. A method of dropping liquid crystal at a position away from the sealing material is also effective.

  Patent Document 2 discloses a technique (hereinafter also referred to as “Related Art A”) that suppresses the occurrence of the above-described defect N. Hereinafter, the region where the sealing material is formed on the substrate is also referred to as a “sealing material forming region”. Specifically, in Related Art A, a flow control wall for controlling the flow of liquid crystal is provided inside the sealing material formation region of the substrate. The flow control wall has a bank shape. Due to the presence of the flow control wall, it is possible to control the speed at which the liquid crystal flows to the sealing material formation region.

International Publication No. 2008/13936 JP 2003-315810 A

  In the conventional pressure treatment, pressure is applied to the sealing material at a time until the thickness of the sealing material reaches dn. Therefore, when the pressurizing process is performed, pressure is also applied to an obstacle such as a liquid crystal, and the sealing material cannot be crushed normally.

  In the related art A, the occurrence of the defect N can be suppressed to some extent, but there is a problem that the manufacturing cost increases because it is necessary to separately form a flow control wall.

  Therefore, in order to suppress the occurrence of the defect N without increasing the manufacturing cost, pressure is applied to the sealing material at a time until the thickness of the sealing material applied to the substrate reaches the above-mentioned dn. It is required to suppress this.

  The present invention was made to solve such problems, and suppressed the pressure from being applied to the sealing material at a time until the thickness of the sealing material applied to the substrate was dn. An object is to provide a method for manufacturing a liquid crystal panel.

  In order to achieve the above object, in a method for manufacturing a liquid crystal panel according to one embodiment of the present invention, a first substrate and a second substrate are bonded to each other with a seal pattern having a thickness of dn (a real number greater than 0). It is a manufacturing method of the liquid crystal panel which has a structure. The manufacturing method of the liquid crystal panel includes a step (a) of applying a fluid sealing material to the first substrate, and a thickness of the sealing material of the first substrate is d1 (a real number satisfying d1> dn). The step (b) of applying pressure to the sealing material, and the second substrate is attached to the first substrate through the pressurized sealing material that is the sealing material having the thickness d1. The first substrate and the pressurized sealant used in the step (c), which are steps performed between the step (c), the step (a), and the step (c). And (d) providing the liquid crystal on the first substrate or the second substrate so that the liquid crystal is provided in a space formed from the second substrate, and in the step (c), In the state where the liquid crystal is provided in the space, As the thickness of the wood is the dn, applying pressure to the pressure 圧済 sealant.

  The method of manufacturing a liquid crystal panel according to the present invention includes a step (a) of applying a sealing material to a first substrate, and a pressure applied to the sealing material so that the thickness of the sealing material of the first substrate is d1. And (c) affixing the second substrate to the first substrate through a pressurized sealing material that is the sealing material having the thickness d1. In the step (c), further, pressure is applied to the pressurized sealing material so that the thickness of the pressurized sealing material becomes the dn in a state where the liquid crystal is provided in the space.

  Thereby, it can suppress that a pressure is applied with respect to the said sealing material at once until the thickness of the sealing material apply | coated to the board | substrate becomes dn.

It is a top view which shows the structure of the liquid crystal panel contained in the liquid crystal display device which concerns on Embodiment 1 of this invention. It is sectional drawing of the liquid crystal panel contained in the liquid crystal display device which concerns on Embodiment 1 of this invention. It is a flowchart of the manufacturing method of a liquid crystal panel. It is a figure for demonstrating structure Ct1. It is a figure for demonstrating structure Ct2. It is a figure for demonstrating structure Ct3.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same components are denoted by the same reference numerals. The names and functions of the components having the same reference numerals are the same. Therefore, a detailed description of some of the components having the same reference numerals may be omitted.

  Note that the dimensions, materials, shapes, and relative arrangements of the components exemplified in the embodiments may be appropriately changed depending on the configuration of the apparatus to which the present invention is applied, various conditions, and the like. Moreover, the dimension of each component in each figure may differ from an actual dimension.

<Embodiment 1>
(Configuration of liquid crystal display device (liquid crystal panel))
FIG. 1 is a plan view showing a configuration of a liquid crystal panel 100 included in a liquid crystal display device 500 according to Embodiment 1 of the present invention. In FIG. 1, only the configuration of the liquid crystal panel 100 included in the liquid crystal display device 500 is shown. In FIG. 1, some components are omitted or simplified for easy understanding of the configuration. For example, in FIG. 1, only the outline of the substrate 120 is shown for a substrate 120 described later for easy understanding of the configuration.

  In FIG. 1, the X direction, the Y direction, and the Z direction are orthogonal to each other. Each of the X direction, the Y direction, and the Z direction shown in the following figures is also orthogonal to each other. Hereinafter, a direction including the X direction and the direction opposite to the X direction (−X direction) is also referred to as “X axis direction”. In the following, the direction including the Y direction and the direction opposite to the Y direction (−Y direction) is also referred to as “Y-axis direction”. Hereinafter, a direction including the Z direction and a direction opposite to the Z direction (−Z direction) is also referred to as a “Z-axis direction”.

  Hereinafter, a plane including the X-axis direction and the Y-axis direction is also referred to as an “XY plane”. Hereinafter, a plane including the X-axis direction and the Z-axis direction is also referred to as an “XZ plane”. Hereinafter, a plane including the Y-axis direction and the Z-axis direction is also referred to as a “YZ plane”.

  FIG. 2 is a cross-sectional view of liquid crystal panel 100 included in liquid crystal display device 500 according to Embodiment 1 of the present invention. FIG. 2 shows only the configuration of the liquid crystal panel 100 included in the liquid crystal display device 500. Specifically, FIG. 2 is a cross-sectional view of the liquid crystal panel 100 taken along line A1-A2 of FIG. In FIG. 2, some components are omitted or simplified for easy understanding of the configuration.

  1 and 2, liquid crystal display device 500 includes a liquid crystal panel 100, a backlight unit (not shown), which will be described later, and the like. Note that the liquid crystal display device 500 displays an image on a display region R10 (to be described later) of the liquid crystal panel 100 using light emitted from the backlight unit (not shown).

  The liquid crystal panel 100 is, for example, a TN (Twisted Nematic) mode liquid crystal panel. The liquid crystal panel 100 includes a control substrate 135, a connection cable 136, substrates 110 and 120, a liquid crystal 30, a seal pattern SL1, and a plurality of spacers SP1.

  The control board 135 is a board on which a circuit for controlling the liquid crystal panel 100 is mounted.

  Each of the substrates 110 and 120 has translucency. The substrate 110 is an array substrate having a configuration for controlling the liquid crystal 30. The substrate 120 is a color filter substrate that emits light transmitted through the substrate 120 as color light. The color light is, for example, red light, green light, blue light, or the like. The substrate 120 faces the substrate 110. The size of the substrate 110 in the XY plane is larger than the size of the substrate 120 in the XY plane.

  The substrate 110 and the substrate 120 are bonded to each other by the seal pattern SL1. That is, the liquid crystal panel 100 has a structure in which the substrate 110 and the substrate 120 are bonded to each other by the seal pattern SL1.

  The seal pattern SL1 is made of resin, for example. The shape of the seal pattern SL1 in a plan view (XY plane) is a closed loop shape (frame shape). In a plan view (XY plane), a seal pattern SL1 is provided so as to surround a display region R10 described later.

  In addition, the space | interval of the board | substrate 110 and the board | substrate 120 is set to the predetermined space | interval by several spacer SP1. That is, each spacer SP <b> 1 is a member for defining the distance between the substrate 110 and the substrate 120. That is, each spacer SP1 is a member for defining the thickness of the liquid crystal 30. Note that the width of the seal pattern SL1 is, for example, 1 mm. The tolerance of the width of the seal pattern SL1 is ± 0.1 mm. As described above, when the width of the seal pattern SL1 is set, the occurrence of rattling or the like can be reduced at the end portion of the seal pattern SL1, and the width of the seal pattern SL1 is made relatively uniform. Can do.

  Hereinafter, the thickness of the seal pattern SL1 is also referred to as “thickness dn” or “dn”. dn is a real number larger than 0.

  Hereinafter, the distance (gap) between the substrate 110 and the substrate 120 is also referred to as “Ga”. Ga is a real number larger than 0. Specifically, Ga is an interval (gap) between an alignment film 112 described later and an alignment film 122 described later. In the present embodiment, Ga is, for example, about 3 μm to 5 μm. Ga is the same as dn.

  Note that, in a plan view (XY plane), each spacer SP1 is provided in a display region R10 described later. Each spacer SP1 is made of resin, for example. The shape of the spacer SP1 is, for example, a columnar shape. The spacer SP1 may have a spherical shape.

  The liquid crystal 30 includes a plurality of liquid crystal molecules 31. In FIG. 2, only two liquid crystal molecules 31 are shown to make the configuration easy to see, but actually, the liquid crystal 30 includes a large number of liquid crystal molecules 31. A liquid crystal 30 is sealed in a region (space) formed by the substrate 110, the substrate 120, and the seal pattern SL1.

  The liquid crystal panel 100 includes a display region R10 and a peripheral region (frame region) R20. The display area R10 is an area for the liquid crystal panel 100 to display an image in a plan view (XY plane). The display region R10 includes a plurality of pixel portions (not shown) arranged in a matrix in a plan view (XY plane). The liquid crystal panel 100 displays an image using the plurality of pixel portions. Each pixel portion is composed of a red pixel, a green pixel, and a blue pixel.

  Hereinafter, each of the red pixel, the green pixel, and the blue pixel is also referred to as a “pixel”. In the following, a region where pixels are formed is also referred to as a “pixel region”.

  The peripheral region R20 is provided around the display region R10 in plan view (XY plane). Specifically, the peripheral region R20 is a region surrounding the display region R10 in plan view (XY plane). The shape of the peripheral region R20 in a plan view (XY plane) is a closed loop shape (frame shape).

  Note that the display region R10 and the peripheral region R20 are applied to the space in which the liquid crystal panel 100 is configured and the XY plane, XZ plane, and YZ plane in the space in the same manner as the liquid crystal panel 100. That is, the display region R10 and the peripheral region R20 are applied to each component (substrates 110 and 120, liquid crystal 30 and the like) constituting the liquid crystal panel 100 in the same manner as the liquid crystal panel 100. Therefore, for example, the substrate 120 of the liquid crystal panel 100 includes a display region R10 and a peripheral region R20.

  Next, the substrate 110 as the array substrate will be described in detail. 1 and 2, a substrate 110 includes a polarizing plate 51, a glass substrate 111, a plurality of pixel electrodes 113, a plurality of switching elements SW1, an insulating film 115, an alignment film 112, and a plurality of A gate line WG1, a plurality of source lines WS1, a terminal 116, a transfer electrode 117, and a peripheral line (not shown) are included.

  In FIG. 1, three gate wirings WG1 and one source wiring WS1 are shown for easy understanding of the configuration. However, actually, the substrate 110 includes four or more gate wirings WG1 and two or more source wirings WS1.

  The polarizing plate 51 has a transmission axis and an absorption axis that are orthogonal to each other. The polarizing plate 51 absorbs light that vibrates along the absorption axis. That is, the polarizing plate 51 does not transmit light that vibrates along the absorption axis of the polarizing plate 51.

  The glass substrate 111 is a transparent substrate having translucency. A plurality of switching elements SW <b> 1 are provided on one surface of the glass substrate 111. The polarizing plate 51 described above is provided on the other surface of the glass substrate 111.

  Each switching element SW1 is set to an on state or an off state. Each switching element SW1 is, for example, a TFT (Thin Film Transistor). A pixel electrode 113 is connected to each switching element SW1.

  Note that a plurality of constituent elements (not shown) are further provided on one surface of the glass substrate 111.

  The insulating film 115 is provided on one surface of the glass substrate 111 so that the insulating film 115 covers each switching element SW1 and the like.

  Each pixel electrode 113 is provided corresponding to each pixel in the display region R10. Each pixel electrode 113 is an electrode for generating an electric field in the liquid crystal 30 when a voltage is applied to the pixel electrode 113. Specifically, each pixel electrode 113 is used in the liquid crystal 30 to generate an electric field for changing the direction of the liquid crystal molecules 31.

  The alignment film 112 is a film for aligning the liquid crystal molecules 31. The alignment film 112 is provided on one surface of the insulating film 115 so that the alignment film 112 covers each pixel electrode 113.

  Each gate line WG1 and each source line WS1 are lines for transmitting a signal for controlling each switching element SW1 to each switching element SW1, although details will be described later. Each switching element SW1 supplies a voltage to the pixel electrode 113 using the signal.

  As shown in FIG. 1, each gate line WG1 is provided so as to extend in the column direction (Y-axis direction) in the display region R10 of the substrate 110. Further, as shown in FIG. 1, each source line WS1 is provided so as to extend in the row direction (X-axis direction) in the display region R10. A switching element SW1 is provided in the vicinity of a portion where each gate line WG1 and each source line WS1 intersect. That is, each switching element SW1 is provided in a matrix.

  Further, as shown in FIG. 1, a pixel electrode 113 (pixel electrode) is provided in each rectangle (pixel region) formed by each gate wiring WG1 and each source wiring WS1. That is, the pixel electrodes 113 are provided in a matrix. The pixel electrode 113 is electrically connected to the switching element SW1.

  Peripheral wiring (not shown) transmits a signal received by a terminal 116 described later to the gate wiring WG1, the source wiring WS1, the transfer electrode 117, and the like.

  The terminal 116 is a terminal for receiving an external signal or the like. The terminal 116 is connected to the control board 135 by a connection cable 136. The connection cable 136 is, for example, an FFC (Flexible Flat Cable). For example, the terminal 116 supplies a signal received from the control board 135 to the switching element SW1 via the source wiring WS1, for example.

  Note that the terminal 116, the transfer electrode 117, and the peripheral wiring are provided on the substrate 110 in the peripheral region R20.

  Next, the substrate 120 as the color filter substrate will be described in detail. 1 and 2, the substrate 120 includes a polarizing plate 52, a glass substrate 121, a plurality of color filters CF1, a black matrix 20, a common electrode 123, and an alignment film 122.

  The polarizing plate 52 is a plate having the same function and configuration as the polarizing plate 51. The glass substrate 121 is a transparent substrate having translucency. On one surface of the glass substrate 121, a plurality of color filters CF1 and a black matrix 20 are provided. The polarizing plate 52 described above is provided on the other surface of the glass substrate 121.

  The black matrix 20 is a light blocking member that blocks part or all of light. The black matrix 20 is configured to block light reaching a region between two adjacent color filters CF1. Specifically, the black matrix 20 has a plurality of openings. A color filter CF <b> 1 is provided in each opening of the black matrix 20.

  The black matrix 20 is provided in the peripheral region R20 so that light does not pass through the peripheral region R20 of the substrate 120.

  The common electrode 123 is provided so as to cover the black matrix 20 and each color filter CF1. The common electrode 123 is an electrode for generating an electric field in the liquid crystal 30 using each pixel electrode 113 described above.

  The alignment film 122 is a film for aligning the liquid crystal molecules 31. The alignment film 122 is provided so that the alignment film 122 covers a part of the common electrode 123 in the display region R10.

  The transfer electrode 117 is electrically connected to the common electrode 123 by the seal pattern SL1. The seal pattern SL1 has conductivity. Specifically, the seal pattern SL1 includes conductive particles. The conductive particles are, for example, those obtained by providing gold plating on the surface of a spherical resin. The signal transmitted from the terminal 116 to the transfer electrode 117 is transmitted to the common electrode 123 via the seal pattern SL1.

  As described above, the liquid crystal display device 500 further includes a backlight unit (not shown) as a light source. The backlight unit emits light used for the liquid crystal panel 100 to display an image. Hereinafter, the light emitted from the backlight unit is also referred to as “light La”.

  The backlight unit is provided below the substrate 110 in FIG. An optical sheet (not shown) is provided between the liquid crystal panel 100 and the backlight unit. The optical sheet is a sheet that controls the polarization state of light, the directivity of light, and the like.

  Hereinafter, a surface of the substrate 120 that displays an image in the display region R10 is also referred to as a “display surface”. The display surface is, for example, the upper surface of the substrate 120 in FIG.

  The liquid crystal display device 500 further includes a housing (not shown). The housing is provided with an opening for exposing the display surface to the outside. The casing of the liquid crystal display device 500 accommodates each component included in the liquid crystal display device 500. The constituent elements are, for example, a liquid crystal panel 100, a backlight unit, an optical sheet, and the like.

(Manufacture of liquid crystal display devices)
Next, a method for manufacturing the liquid crystal display device 500 will be described. Here, a manufacturing method of the liquid crystal panel 100 which is a main part of the liquid crystal display device 500 will be mainly described with reference to the flowchart of FIG. In the manufacturing method of liquid crystal panel 100 of the present embodiment, the above-described dropping injection method is performed as a method of injecting liquid crystal into the liquid crystal panel.

  A liquid crystal panel is usually manufactured using one or more substrates cut out from a mother substrate larger than the final size of the liquid crystal panel. The processes from steps S1 to S7 in FIG. 3 are processes performed on the mother substrate.

  First, in the substrate preparation process, the substrates 110 and 120 are prepared in a mother substrate state. Since the manufacturing process of the substrates 110 and 120 may be a general process, it will be briefly described.

  In manufacturing the substrate 110, first, each switching element SW1, the pixel electrode 113, the terminal 116, the transfer electrode 117, and the like are formed on one surface of the glass substrate 111. These are formed by repeatedly performing pattern formation processes such as film formation, patterning by photolithography, and etching.

  Further, the substrate 120 is formed by the same process as the substrate 110. Thereby, each color filter CF1, the black matrix 20, the common electrode 123, and the like are formed on one surface of the glass substrate 121. Note that the spacer SP1 is further formed on one surface of the glass substrate 121 by patterning the organic resin film.

  First, in the substrate cleaning process in step S1, the substrate 110 on which the switching element SW1, the pixel electrode 113, and the like are formed is cleaned.

  Next, in the alignment film material application process in step S2, the alignment film material is applied to one surface of the substrate 110 by, for example, a printing method. The alignment film material is a material of the alignment film 112. Subsequently, the applied alignment film material is baked using a hot plate or the like. Thereby, the alignment film material is dried.

  Next, in the alignment process step of step S3, the alignment process is performed on the alignment film material. The alignment treatment is, for example, a rubbing treatment that forms fine grooves, scratches, and the like along a specific direction on the surface of the alignment film material. Thereby, the alignment film 112 is formed.

  Also, steps S1, S2, and S3 are performed on the substrate 120 on which the common electrode 123 and the like are formed in the same manner as described above. Thereby, the alignment film 122 is formed.

  Next, step S4 is performed. Step S4 includes step S4A and step S4B. Step S4A and step S4B are performed in parallel.

  In step S4A, a sealing material application process is performed. Although details will be described later in the sealing material application step, the sealing material is applied to the substrate by a dispenser (not shown) having a nozzle NZ1 described later. The dispenser has a function of discharging the fluid sealing material SLa from the nozzle NZ1. The seal material SLa is a material for constituting the seal pattern SL1. Note that the sealing material SLa discharged from the nozzle NZ1 has conductivity in order to configure the sealing pattern SL1 having conductivity. Sealing material SLa includes conductive particles. The sealing material SLa is made of, for example, an ultraviolet curable resin, a thermosetting resin, or the like.

  Hereinafter, the substrate to which the sealing material is applied is also referred to as “substrate SB1”. The substrate SB1 is the substrate 110 or the substrate 120. The substrate SB1 is, for example, a substrate 120 (color filter substrate). The substrate SB1 may be the substrate 110 (array substrate). In the following, the surface of the substrate SB1 to which the sealing material is applied is referred to as “main surface SB1s”. The main surface SB1s of the substrate SB1 is a surface disposed so as to be in contact with the liquid crystal 30 of FIG.

  The dispenser has a structure capable of moving the nozzle NZ1. The dispenser has a function of discharging the sealing material SLa from the nozzle NZ1 while moving the nozzle NZ1.

  In the sealing material application step, the dispenser applies the sealing material SLa to the substrate SB1 such that the closed loop-shaped sealing material SLa is provided on the substrate SB1. The shape of the closed loop seal material SLa is equivalent to the shape of the seal pattern SL1 in FIG. That is, in a plan view (XY plane), the closed loop sealing material SLa is provided so as to surround the display region R10.

  Specifically, the dispenser moves the nozzle NZ1 while discharging the sealing material SLa from the nozzle NZ1 to the main surface SB1s of the substrate SB1 so that the main surface SB1s of the substrate SB1 is provided with the closed loop-shaped sealing material SLa. Let That is, for example, the nozzle NZ1 moves along a rectangular outline indicated by the seal pattern SL1 in FIG. 1 in a plan view (XY plane). Thus, in the sealing material application process, the nozzle NZ1 that moves while discharging the sealing material SLa is used.

  Hereinafter, the thickness of the sealing material SLa immediately after the sealing material SLa is applied to the substrate SB1 is also referred to as “dn1”. dn1 is a real number larger than dn. dn1 is a predetermined value. For example, dn1 is about 20 μm to 30 μm.

  In the sealing material application process, the dispenser discharges the sealing material SLa from the nozzle NZ1 and the moving speed of the nozzle NZ1 so that the thickness of the sealing material SLa applied to the main surface SB1s of the substrate SB1 becomes dn1. Control the speed. Hereinafter, the sealing material SLa applied to the main surface SB1s of the substrate SB1 is also referred to as “applied sealing material”.

  In step S4B, a pressurizing process is performed. In the pressurizing step, pressure is applied to the sealing material SLa that is the application sealing material. Hereinafter, the thickness of the sealing material SLa after the pressurizing step is performed is also referred to as “d1”. d1 is a real number satisfying the expression dn <d1 <dn1. In the present embodiment, d1 is a real number that satisfies the formula Ga <d1 ≦ 3 × Ga. As described above, Ga is the distance (gap) between the substrate 110 and the substrate 120.

  That is, in the liquid crystal panel 100, when the distance between the substrate 110 and the substrate 120 is defined as Ga, the formula Ga <d1 ≦ 3 × Ga is satisfied for d1 and Ga. Moreover, d1 is about 1/2 times or less of dn1. Moreover, d1 may be about 1/3 times or less of dn1, for example.

  The pressurizing step is a step of applying pressure to the sealing material SLa using the nozzle NZ1 so that the thickness of the sealing material SLa (application sealing material) of the substrate SB1 becomes d1. The sealing material application process and the pressurizing process are performed in parallel. Specifically, pressure is applied to the sealing material SLa applied to the substrate SB1 by the pressurizing step while the sealing material SLa is applied to the substrate SB1 by the sealing material application step.

  The sealing material application process and the pressurization process are performed until the closed loop sealing material SLa is applied to the substrate SB1 and the entire thickness of the sealing material SLa reaches d1. As a result, a seal material SLa having a thickness of d1 and a closed loop is formed on the main surface SB1s of the substrate SB1. In the following, the thickness d1 and the closed loop sealing material SLa is also referred to as “pressurized sealing material SLb”.

  In addition, a pressurization process is performed by the following structures Ct1, for example. FIG. 4 is a diagram for explaining the configuration Ct1. Hereinafter, the direction in which the nozzle NZ1 moves in the sealing material application step is also referred to as “direction DRa”.

  With reference to FIG. 4, in the configuration Ct1, a roller RL1 is attached via a member 61 on the side of the nozzle NZ1 opposite to the direction DRa in which the nozzle NZ1 moves. The roller RL1 is configured to be rotatable so as to apply pressure to the sealing material SLa (application sealing material) by the weight of the roller RL1 itself. The nozzle NZ1 is provided with a hole H1 for discharging the sealing material SLa. The shape of the hole H1 is a cylindrical shape. In the sealing material application process, the sealing material SLa is discharged from the hole H1 of the nozzle NZ1.

  In the pressurizing process to which the configuration Ct1 is applied, the roller RL1 applies pressure to the sealing material SLa so that the thickness dn1 of the sealing material SLa applied to the main surface SB1s of the substrate SB1 becomes d1 by the sealing material application process. Add. With this configuration Ct1, pressure is applied to the sealing material SLa applied to the substrate SB1 by the roller RL1 while the sealing material SLa is applied to the substrate SB1.

  Further, the pressurizing step may be performed, for example, with the following configuration Ct2. FIG. 5 is a diagram for explaining the configuration Ct2. Referring to FIG. 5, in the configuration Ct2, a cover CV1 is attached to the outside of the nozzle NZ1.

  The cover CV1 is configured such that the cover CV1 applies pressure to the sealing material SLa (application sealing material) existing on the opposite side of the nozzle NZ1 in the direction DRa in which the nozzle NZ1 moves.

  In the pressurizing process to which the configuration Ct2 is applied, the cover CV1 applies pressure to the sealing material SLa so that the thickness dn1 of the sealing material SLa applied to the main surface SB1s of the substrate SB1 becomes d1 by the sealing material application process. Add. With this configuration Ct2, pressure is applied to the sealing material SLa applied to the substrate SB1 by the cover CV1 while the sealing material SLa is applied to the substrate SB1.

  Further, the pressurizing step may be performed by the following configuration Ct3, for example. FIG. 6 is a diagram for explaining the configuration Ct3. Hereinafter, the tip of the nozzle NZ1 is also referred to as “tip NZx”.

  In the configuration Ct3, for example, the inner diameter of the hole H1 of the nozzle NZ1 is made larger than the inner diameter of the hole H1 of the nozzle NZ1 of the configuration Ct1. In the configuration Ct3, the thickness of the portion surrounding the hole H1 in the nozzle NZ1 is increased. Specifically, the area of the sealing material SLa in contact with the tip NZx of the nozzle NZ1 is made larger than the area of the sealing material SLa in contact with the tip NZx of the nozzle NZ1 of the configuration Ct1. Thereby, the tip NZx has a shape for applying pressure to the sealing material SLa by the tip NZx.

  In the pressurizing process to which the configuration Ct3 is applied, the tip NZx of the nozzle NZ1 is set to the sealing material SLa so that the thickness dn1 of the sealing material SLa applied to the main surface SB1s of the substrate SB1 is d1 by the sealing material application process. Pressure. With this configuration Ct3, pressure is applied to the sealing material SLa applied to the substrate SB1 by the tip NZx while the sealing material SLa is applied to the substrate SB1.

  By performing the pressurizing process to which any one of the above-described configurations Ct1, Ct2, and Ct3 is applied and the sealing material applying process, the pressurized sealing material SLb having a thickness of d1 is formed on the main surface SB1s of the substrate SB1. Is formed.

  In the first embodiment, the shape of the spacer SP1 that defines the distance between the substrate 110 and the substrate 120 is a columnar shape, but is not limited thereto. The spacer SP1 may have a spherical shape. In this configuration, spherical spacers are scattered on the surface of the substrate SB1. In this case, a spacer spraying process is performed after step S4.

  In the following, in the liquid crystal panel 100 shown in FIGS. 1 and 2, the space formed from the substrate 110, the seal pattern SL1, and the substrate 120 is also referred to as “space SPC1”. The space SPC1 is also a space formed from the substrate 110, the pressurized sealing material SLb, and the substrate 120, which is used in a bonding process described later. That is, the space SPC <b> 1 is a space formed from the substrate 110, the closed loop-shaped pressurized seal material SLb, and the substrate 120. The space SPC1 is also a space formed by the main surface SB1s of the substrate SB1 and the closed-loop pressurized pressurized sealing material SLb.

  Step S5 is performed after step S4. In step S5, a liquid crystal dropping step is performed. In the liquid crystal dropping step, liquid liquid crystal is dropped onto the main surface SB1s of the substrate SB1. Specifically, in the liquid crystal dropping step, the liquid crystal is formed on the substrate SB1 so that the liquid crystal is provided in the space SPC1 formed by the main surface SB1s of the substrate SB1 and the closed-loop pressurized pressurized sealing material SLb. It is dropped on the main surface SB1s. That is, the liquid crystal dropping step is a step of providing the liquid crystal on the substrate SB1 so that the liquid crystal is provided in the space SPC1.

  Hereinafter, the state in which the liquid crystal is provided in the space SPC1 is also referred to as “liquid crystal presence state St1”.

  Next, in the bonding process in step S6, a bonding apparatus is used. A space SPC2 is provided inside the bonding apparatus. The space SPC2 is a space in which the substrates 110, 120, etc. can be placed. The bonding apparatus has a function of bonding the substrates 110 and 120 arranged in the space SPC2 to each other in a vacuum state.

  In the bonding step, the bonding apparatus bonds the substrates 110 and 120 in the state of the mother substrate, which are arranged in the space SPC2, via the pressurized seal material SLb in a vacuum state.

  Hereinafter, the substrate on which the sealing material SLa is not applied in the above-described sealing material application step is also referred to as “substrate SB2”. The substrate SB2 is the substrate 110 or the substrate 120. For example, when the substrate SB1 is the substrate 120, the substrate SB2 is the substrate 110. The substrate SB2 has a main surface. The main surface of the substrate SB2 is a surface disposed so as to be in contact with the liquid crystal 30 of FIG.

  That is, the bonding process is a process in which the bonding apparatus bonds the substrate SB2 to the substrate SB1 via the pressurized sealing material SLb.

  Hereinafter, the pressurized sealing material SLb having a thickness of dn is also referred to as “seal pattern SL1n”. The seal pattern SL1n has fluidity. The seal pattern SL1n obtained by curing the seal pattern SL1n having fluidity is the seal pattern SL1.

  In the bonding step, the bonding apparatus further applies pressure to the pressurized seal material SLb so that the thickness of the pressurized seal material SLb is dn in the liquid crystal presence state St1. dn is the same as Ga described above. Thereby, the seal pattern SL1n having a thickness of dn is formed. Further, the liquid crystal is sealed in the space SPC1. The liquid crystal sealed in the space SPC1 is the liquid crystal 30 in FIG. A mother cell substrate is formed by the above process in the bonding step.

  Next, in the curing process step of step S7, a curing process for completely curing the seal pattern SL1n is performed. For example, when the seal pattern SL1n is made of an ultraviolet curable resin, the ultraviolet rays are irradiated to the seal pattern SL1n in the curing process. Thereby, the seal pattern SL1 is formed.

  In the curing process, for example, the seal pattern SL1n may be cured by applying heat to the seal pattern SL1n.

  Next, in the cell dividing step of step S8, the mother cell substrate is cut along the scribe line. Thereby, the mother cell substrate is divided into a plurality of liquid crystal panels. In the cell dividing step, the end of the substrate 120 is cut so that the terminals 116 are exposed to the outside.

  For each liquid crystal panel divided as described above, a polarizing plate attaching process in step S9, a control board mounting process in step S10, and the like are performed. In the polarizing plate attaching step, polarizing plates 51 and 52 are attached to the substrates 110 and 120 of the liquid crystal panel, respectively. In the control board mounting step, the control board 135 is mounted on the liquid crystal panel. Thereby, the manufacture of the liquid crystal panel 100 of FIGS. 1 and 2 is completed.

  Further, a backlight unit (not shown) is provided on the back side (non-viewing side) of the substrate 110 of the liquid crystal panel 100 via an optical film (not shown). Then, the liquid crystal panel 100 and peripheral members such as a backlight unit (not shown) are accommodated in the above-described casing provided with an opening. In addition, the liquid crystal panel 100 is accommodated in the casing so that the display region R10 of the liquid crystal panel 100 is exposed to the outside through the opening of the casing. Thus, the manufacture of the liquid crystal display device 500 is completed.

  As described above, in the method of manufacturing the liquid crystal panel according to the present embodiment, the step (S4A) of applying the sealing material SLa to the substrate SB1 and the thickness of the sealing material SLa of the substrate SB1 are d1. A step of applying pressure to the sealing material SLa (S4B), and a step of attaching the substrate SB2 to the substrate SB1 via the pressurized sealing material SLb that is the sealing material SLa having a thickness of d1 (S6). In addition, in the step (S6), pressure is further applied to the pressurized seal material SLb so that the thickness of the pressurized seal material SLb becomes dn in a state where the liquid crystal is provided in the space SPC1.

  Thereby, it can suppress that a pressure is applied with respect to the said sealing material at once until the thickness of the sealing material apply | coated to the board | substrate becomes dn.

  In the present embodiment, d1 is a real number that satisfies the formula Ga <d1. Further, in the bonding step, pressure is further applied to the pressurized sealing material so that the thickness of the pressurized sealing material SLb having a thickness of d1 becomes dn (Ga). Thereby, the joining action between the board | substrate 110 and the board | substrate 120 by the pressurized sealing material SLb can be obtained stably.

  In the present embodiment, d1 is a real number that satisfies the formula d1 ≦ 3 × Ga. The thickness of the sealing material immediately after being applied to the substrate from the nozzle NZ1 is generally about 20 μm to 30 μm (dn1). Ga is, for example, about 3 μm to 5 μm. Therefore, the thickness of the sealing material can be set to d1 by applying pressure to the sealing material so that the thickness of the sealing material applied to the substrate is 1/2 times or less.

  As described above, d1 is a real number that satisfies the formula Ga <d1 ≦ 3 × Ga. In the method of manufacturing the liquid crystal panel according to the present embodiment, the closed loop pressurized seal material SLb is formed. And a liquid crystal is dripped at a board | substrate. In the bonding step (S6), pressure is applied to the pressurized sealing material SLb sandwiched between the substrates 110 and 120 so that the thickness of the pressurized sealing material SLb having the thickness d1 is dn (Ga). Is added. Thereby, a liquid crystal panel is manufactured.

  Conventionally, when a liquid crystal panel is manufactured by a dropping injection method, the sealing material having a thickness of about 20 μm to 30 μm (dn1) is used until the thickness of the sealing material becomes about 3 μm to about 5 μm (Ga). In contrast, pressure is applied at once. That is, conventionally, pressure is applied to the sealing material at a time until the thickness dn1 of the sealing material becomes 1/5 to 1/6 times the dn1.

  On the other hand, in the bonding step (S6) of the manufacturing method of the liquid crystal panel of the present embodiment, the pressurized sealing material is set so that the thickness of the pressurized sealing material SLb having the thickness d1 is dn (Ga). Pressure is applied to SLb. For example, d1 is about 1/3 or less of dn1. That is, d1 is closer to Ga than dn1 described above. That is, in the bonding step (S6), the pressure applied to the pressurized sealing material SLb having the thickness d1 is sufficiently smaller than the above-described conventional method.

  Thereby, in a bonding process (S6), when a pressure is applied with respect to the pressurized sealing material SLb, before the thickness of the said pressurized sealing material SLb becomes Ga, a liquid crystal is applied to the pressurized sealing material SLb. Contact can be suppressed. As a result, the occurrence of the above-described problem N can be suppressed.

  The defect N is, for example, a problem that the liquid crystal becomes an obstacle and the sealing material cannot be normally crushed. In addition, the defect N is, for example, a problem that the liquid crystal comes into contact with the sealing material and the liquid crystal leaks outside from the region surrounded by the pressurized sealing material SLb.

  As described above, according to the manufacturing method of the liquid crystal panel of the present embodiment, it is possible to prevent the occurrence of gap unevenness defect, liquid crystal leakage defect, and the like. Thereby, the yield of a liquid crystal panel can be improved.

  In addition, when pressure is applied to the sealing material at a time as in the past, the amount of expansion of the sealing material is not uniform depending on the location. Thereby, the width | variety of a sealing material generate | occur | produces.

  On the other hand, in the bonding step (S6) of the present embodiment, as described above, the pressure applied to the pressurized sealing material SLb having a thickness d1 is sufficiently smaller than the above-described conventional method. Thereby, the following additional effects can be obtained. The effect is an effect that it is possible to suppress the occurrence of variations in the width of the sealing material. Thereby, the seal pattern SL1n can be stably formed normally.

  For this reason, it is possible to suppress the occurrence of adhesion peeling of the seal pattern. Therefore, the occurrence of display defects such as gap unevenness defects can be suppressed. As a result, the production yield of the liquid crystal panel can be improved. Thereby, a liquid crystal panel (liquid crystal display device) can be manufactured at low cost. In addition, a highly reliable liquid crystal panel can be obtained.

  Further, in the present embodiment, by applying the pressurizing process to which any of the above-described configurations Ct1, Ct2, and Ct3 is applied and the sealing material applying process, the coating is applied to the substrate SB1 having a thickness of dn1. A pressurized seal material SLb having a thickness d1 is formed from the seal material SLa immediately after. For example, d1 is about 1/2 times or less of dn1 or about 1/3 times or less of dn1. Therefore, the pressurized seal material SLb having a small thickness can be suitably formed.

  The drop injection method is mainly used in the manufacture of large panels, but in recent years, the drop injection method is also used in the manufacture of small panels. In order to prevent the above-described problem N, it is necessary to keep the liquid crystal dropping position away from the sealing material. However, in a small panel, it has become difficult to provide a sufficient distance between the dropping position of the liquid crystal and the sealing material.

  This is because of the following factor X. The factor X will be described below. In a small panel, the volume of liquid crystal required is small, whereas the volume of liquid crystal droplets to be dropped is determined to be a predetermined value. Note that the number of droplets dropped on one small panel is, for example, less than 10 droplets. Therefore, in the small panel, it is not possible to optimize the position where the droplets are arranged.

  Therefore, in the small panel, when the sealing material is crushed, the liquid crystal becomes an obstacle, and the sealing material cannot be crushed normally.

  Further, in the related art A described above, by using the flow control wall to control the flow rate of the liquid crystal, the same effect as moving the liquid crystal dripping position away from the sealing material can be obtained. However, in a small panel, there is almost no place to arrange the flow control wall. If a flow control wall is arranged on a small panel, it is impossible to realize a narrow frame of the small panel. Moreover, problems such as an increase in cost occur due to an increase in the process of separately forming the flow control wall.

  In addition, it is difficult to set the liquid crystal dropping position to a position away from the sealing material not only in the small panel but also in a medium-sized panel or more. For this reason, even in a medium-sized panel or more, the liquid crystal becomes an obstacle, and the sealing material cannot be crushed normally.

  Therefore, since the liquid crystal panel 100 (liquid crystal display device 500) of the present embodiment is configured as described above, the above problem can be solved.

  In the present invention, the embodiments can be appropriately modified and omitted within the scope of the invention.

  For example, in the liquid crystal dropping process in step S5, the liquid crystal is dropped on the substrate SB1 to which the sealing material is applied, but the present invention is not limited to this. In the liquid crystal dropping step of step S5, the liquid crystal may be dropped on the main surface of the substrate SB2. In this case, the liquid crystal dropping step is a step of providing the liquid crystal on the substrate SB2 so that the liquid crystal is provided in the space SPC1.

  That is, in the manufacturing method of the liquid crystal panel of the present embodiment, either the process in which the pressurized sealant SLb and the liquid crystal are provided on the same substrate, or the process in which each of the pressurized sealant SLb and the liquid crystal is provided on different substrates. May be performed.

  In any process, the liquid crystal dropping step and the bonding step are performed in a state where the substrate on which the liquid crystal is dropped is arranged on the lower side, so that the liquid crystal is sealed in the space SPC1 without any particular problem. can do.

  Hereinafter, the sealing material SLa from which a part of the closed-loop sealing material SLa is separated is also referred to as a “separated sealing material SLap”. The separation sealing material SLap has a start point and an end point formed by separating a part of the closed loop sealing material SLa.

  In the sealing material application step, the dispenser applies the sealing material SLa to the substrate SB1 so that the closed loop-shaped sealing material SLa is provided on the substrate SB1, but the invention is not limited thereto. In the sealing material application step, the dispenser may apply the separation sealing material SLap to the substrate SB1 so that the separation sealing material SLap is provided on the substrate SB1.

  In the said structure, a bonding apparatus applies a pressure to the said isolation | separation sealing material Slap so that the starting point part and the end point part of the isolation | separation sealing material SLap may be joined in a bonding process. Thereby, the separation sealing material SLap becomes a closed loop sealing material SLa.

  30 liquid crystal, 100 liquid crystal panel, 110, 120, SB1, SB2 substrate, 500 liquid crystal display device, CV1 cover, NZ1 nozzle, NZx tip, RL1 roller, SL1, SL1n seal pattern, SLa seal material.

Claims (5)

A method of manufacturing a liquid crystal panel having a structure in which a first substrate and a second substrate are bonded to each other by a seal pattern having a thickness of dn (real number greater than 0),
The manufacturing method of the liquid crystal panel is as follows:
A step (a) of applying a fluid sealing material to the first substrate;
A step (b) of applying pressure to the sealing material such that the thickness of the sealing material of the first substrate is d1 (a real number satisfying d1>dn);
A step (c) of attaching the second substrate to the first substrate via a pressurized sealing material which is the sealing material having the thickness d1;
A step performed between the step (a) and the step (c), and used from the first substrate, the pressurized sealant and the second substrate used in the step (c). And (d) providing the liquid crystal on the first substrate or the second substrate so that the liquid crystal is provided in the space to be formed,
In the step (c), in the state where the liquid crystal is provided in the space, pressure is applied to the pressurized sealing material so that the thickness of the pressurized sealing material becomes the dn. Production method. In the liquid crystal panel having a structure in which the first substrate and the second substrate are bonded to each other by the seal pattern, when the gap between the first substrate and the second substrate is defined as Ga, the d1 and About the Ga
Ga <d1 ≦ 3 × Ga
The method for manufacturing a liquid crystal panel according to claim 1, wherein: In the step (a), a nozzle that moves while discharging the sealing material is used,
A roller is attached to the direction side opposite to the direction in which the nozzle moves among the nozzles,
The method for manufacturing a liquid crystal panel according to claim 1, wherein in the step (b), the roller applies pressure to the sealing material. In the step (a), a nozzle that moves while discharging the sealing material is used,
A cover is attached to the outside of the nozzle,
The method for manufacturing a liquid crystal panel according to claim 1, wherein in the step (b), the cover applies pressure to the sealing material. In the step (a), a nozzle that moves while discharging the sealing material is used,
The tip of the nozzle has a shape for applying pressure to the sealant by the tip,
The method for manufacturing a liquid crystal panel according to claim 1, wherein in the step (b), the tip of the nozzle applies pressure to the sealing material.

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