JP4987422B2 - Display device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a display device and a manufacturing method thereof.

  The liquid crystal display device includes an electrode substrate on which thin film transistors (hereinafter referred to as TFTs) are formed in a matrix, and a counter substrate disposed to face the electrode substrate. It has a configuration in which liquid crystal is sealed in a space between a sealing material for bonding these two substrates. The counter substrate is, for example, a color filter substrate on which a color material for performing color display is formed.

  In a method for manufacturing a liquid crystal display device, a vacuum injection method has been widely used so far as a method of sealing liquid crystal between an electrode substrate and a counter substrate. First, a rubbing process is performed on the alignment films formed on both substrates, spacers are dispersed, and then a sealing material is applied. Thereafter, in the vacuum injection method, the electrode substrate and the counter substrate are overlapped at a predetermined position (overlaying step). Then, the sealing material is cured while applying pressure so that the cell gap between the electrode substrate and the counter substrate becomes a predetermined value (crimping step). Thereafter, both the substrates are cut along the cutting line so as to obtain a target panel size (panel cutting step). Next, each panel is put into a vacuum chamber, and the liquid crystal inlet is immersed in a liquid crystal dish containing a liquid crystal material in a vacuum. When the vacuum chamber is opened to the atmospheric pressure by opening it to the atmosphere, liquid crystal is injected into the panel by the differential pressure inside and outside the panel (liquid crystal injection step). And a photocurable resin is apply | coated to a panel inlet, resin is hardened by irradiating light, and a panel inlet is closed (sealing process).

  As described above, the vacuum injection method is a method in which liquid crystal is infiltrated using a capillary phenomenon from a small gap left in a sealing material after two substrates are bonded together in advance. Since the cell gap is as narrow as about 5 μm, it takes a very long time to suck the liquid crystal material into the panel in this method. Therefore, the liquid crystal injection process requires a particularly long processing time and is inevitably a badge type. In addition, the number of manufacturing processes is large, and the production period is generally longer.

  On the other hand, recently, a drop injection method (One Drop Fill: ODF) has been adopted as an alternative to the vacuum injection method. The dropping injection method is a method in which a liquid crystal material is dropped onto one of the substrates before superposition and sealed at the same time as the substrates are bonded together. That is, the dropping injection method can consolidate the superposition process and the liquid crystal injection process of the vacuum injection method into one process. As described above, the dropping injection method can reduce the number of steps, and the processing time can be several minutes, which is significantly shorter than that of the vacuum injection method, and single wafer processing is possible.

  By the way, the spacer for uniformly holding the cell gap between the electrode substrate and the counter substrate is divided by a vacuum injection method in which a spherical resin is dispersed on the substrate and a patterning method using a photosensitive resin on the substrate in advance (columnar shape). A spacer is generally used. In the dropping injection method, it is necessary to fix the spacer to the substrate. Therefore, a columnar spacer or a fixed spacer that can be fixed to the substrate by performing heat treatment after spacer dispersion is used.

  As the sealing material, a thermosetting type that reacts by heat is generally used in the vacuum injection method. On the other hand, in the dropping injection method, since the sealing material must be cured in a state where the liquid crystal material is sealed, it is necessary to process at a low temperature in a short time. Therefore, a light (ultraviolet (UV)) curable sealing material is used. There are two types of light (ultraviolet) curable sealing materials that are cured only by light (ultraviolet) irradiation and those that are temporarily cured by light (ultraviolet) irradiation and then further cured by heat.

  In the case of using a photocurable sealing material as in the dropping injection method, it is necessary to irradiate the sealing material with light in order to cure the sealing material. Therefore, if a light-shielding film such as a wiring pattern is provided in the region where the sealing material is formed, light is blocked by the light-shielding film, and the sealing material is not completely cured. Not only does the adhesive force decrease due to insufficient curing of the sealing material, but also impurities are eluted from the uncured portion of the sealing material into the liquid crystal, resulting in poor display. Therefore, when an ultraviolet curable sealing material is used, a light-shielding film cannot be provided in the region where the sealing material is formed. That is, a sealing material cannot be provided in the region where the light-shielding film is formed.

  FIG. 5A is a schematic plan view of a conventional liquid crystal display device 51 using an ultraviolet curable sealing material. FIG.5 (b) is EE sectional drawing of Fig.5 (a). In FIG. 5, the electrode substrate 10 and the counter substrate 9 are joined by the sealing material 1. The liquid crystal 2 is sealed in a space surrounded by the sealing material 1 between the electrode substrate 10 and the counter substrate 9. On the surface of the counter substrate 9 facing the electrode substrate 10, a black matrix (BM) 3 made of a light-shielding film is formed in a frame shape so as to surround the display region 11. A light-shielding wiring 8 is formed on the surface of the electrode substrate 10 facing the counter substrate 9.

  In the conventional liquid crystal display device 51, as shown in FIG. 5, the sealing material 1 is formed outside the BM 3 (prior art 1). As a result, even in the region where the sealing material 1 is formed, the light shielding film is not formed on the counter substrate 9 side even if the wiring 8 having light shielding properties is partially formed on the electrode substrate 10 side. Therefore, the sealing material 1 can be cured by irradiating with ultraviolet rays 4 from the counter substrate 9 side. However, in the conventional liquid crystal display device 51, it is necessary to secure a transparent portion for irradiating the sealing material 1 with the ultraviolet rays 4 outside the BM 3. For this reason, the frame region 12 becomes wide, and the liquid crystal display device becomes large.

  For such a problem, a technique such as Patent Document 1 is disclosed (Prior Art 2). FIG. 6A is a schematic plan view of the liquid crystal display device 52 in Patent Document 1. FIG. 6B is an enlarged view of a portion F in FIG. 6A, and FIG. 6C is a cross-sectional view taken along line GG in FIG. 6B. FIG. 6D is a cross-sectional view taken along the end (inner shape end) of the sealing material 1 on the display region 11 side. In FIG. 6, a slit pattern 75 for transmitting ultraviolet rays is provided in the region of BM 3 of the counter substrate 9 facing the wiring 8 provided on the electrode substrate 10. Further, the light shielding film is not formed on the electrode substrate 10 facing the region where the slit pattern 75 of BM3 is not formed. The dimension of the slit pattern 75 can be made a predetermined amount smaller than the thickness of the wiring 8 in consideration of the wraparound of the ultraviolet rays 4 and the like.

In this manner, the BM 3 of the counter substrate 9 and the wiring 8 of the electrode substrate 10 are alternately arranged, and the ultraviolet ray 4 is irradiated from the counter substrate 9 side and the electrode substrate 10 side. Thereby, the whole sealing material 1 provided in the area | region in which BM3 was formed can be hardened, and generation | occurrence | production of the display defect by the contamination from the sealing material 1 is suppressed. Therefore, it is not necessary to secure a transparent portion for irradiating the sealing material 1 with the ultraviolet rays 4 outside the BM 3. That is, since it is not necessary to form the sealing material 1 outside the BM 3 as in the prior art 1, the frame region 12 can be made smaller (narrow frame), and the liquid crystal display device can be downsized.
JP 2000-56316 A

  However, even if the wiring 8 is provided on the electrode substrate 10 facing the slit pattern 75 formed on the BM 3 of the counter substrate 9, the wiring 8 is not completely shielded, and the light from the slit pattern 75 is caused by the wraparound of backlight light or oblique incident light. Leaks. In the liquid crystal display device 52 of Patent Document 1, since the area of the slit pattern 75 occupies substantially the entire area where the BM 3 and the wiring 8 overlap, the amount of light leakage from the BM 3 on the outer periphery of the display area 11 increases, which is favorable. There was a problem that display characteristics could not be obtained.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a display device having excellent display quality and a method for manufacturing the same.

A display device according to the present invention includes:
A first substrate having a light-shielding film formed in a frame shape so as to surround the display region;
A second substrate provided with a light-shielding wiring drawn to the outside of the display region, and disposed opposite to the first substrate;
A photo-curing sealing material which is provided in a frame shape in the region where the light-shielding film is formed, and which bonds the first substrate and the second substrate;
A display material provided in a space formed by the first substrate, the second substrate, and the sealing material;
Wherein disposed inside the outer edge of the sealing member, have a, a first opening portion in which the light-shielding film is removed so as to straddle the inner shape end of the sealing material,
The light-shielding film is formed on the entire periphery of the outer edge of the sealing material, and the first opening is formed only in a region overlapping with the wiring in a plan view .

  ADVANTAGE OF THE INVENTION According to this invention, the display apparatus excellent in display quality and its manufacturing method can be provided.

  First, a display device according to the present invention will be described with reference to FIG. FIG. 1 is a front view showing a configuration of an electrode substrate 10 used in a liquid crystal display device. The display device according to the present invention will be described by taking a liquid crystal display device as an example. However, the display device is merely an example, and a flat display device (flat panel display) such as an organic EL display device can also be used. The overall configuration of the liquid crystal display device is common to the first to third embodiments described below.

  The display device according to the present invention has an electrode substrate 10. The electrode substrate 10 is provided with a display area 11 and a frame area 12 provided so as to surround the display area. A plurality of scanning signal lines 13 and a plurality of display signal lines 14 are formed in the display area 11. The plurality of scanning signal lines 13 are provided in parallel. Similarly, the plurality of display signal lines 14 are provided in parallel. The scanning signal line 13 and the display signal line 14 are formed so as to cross each other. The scanning signal line 13 and the display signal line 14 are orthogonal to each other. A region surrounded by the adjacent scanning signal lines 13 and display signal lines 14 is a pixel 17. Therefore, in the electrode substrate 10, the pixels 17 are arranged in a matrix. Thus, the electrode substrate 10 is a TFT array substrate.

  Further, a scanning signal driving circuit 15 and a display signal driving circuit 16 are provided in the frame region 12 of the electrode substrate 10. The scanning signal line 13 extends from the display area 11 to the frame area 12. The scanning signal line 13 is connected to the scanning signal driving circuit 15 at the end of the electrode substrate 10. Similarly, the display signal line 14 extends from the display area 11 to the frame area 12. The display signal line 14 is connected to the display signal drive circuit 16 at the end of the electrode substrate 10. An external wiring 18 is connected in the vicinity of the scanning signal driving circuit 15. Further, an external wiring 19 is connected in the vicinity of the display signal driving circuit 16. The external wirings 18 and 19 are wiring boards such as an FPC (Flexible Printed Circuit).

  Various external signals are supplied to the scanning signal driving circuit 15 and the display signal driving circuit 16 via the external wirings 18 and 19. The scanning signal driving circuit 15 supplies the scanning signal to the scanning signal line 13 based on an external control signal. The scanning signal lines 13 are sequentially selected by this scanning signal. The display signal driving circuit 16 supplies a display signal to the display signal line 14 based on an external control signal or display data. As a result, a display voltage corresponding to the display data can be supplied to each pixel 17. The scanning signal driving circuit 15 and the display signal driving circuit 16 are not limited to the configuration arranged on the electrode substrate 10. For example, the drive circuit may be connected by TCP (Tape Carrier Package).

  At least one TFT 20 is formed in the pixel 17. The TFT 20 is disposed in the vicinity of the intersection of the display signal line 14 and the scanning signal line 13. For example, the TFT 20 supplies a display voltage to the pixel electrode. That is, the TFT 20 which is a switching element is turned on by the scanning signal from the scanning signal line 13. Thereby, a display voltage is applied from the display signal line 14 to the pixel electrode connected to the drain electrode of the TFT 20. An electric field corresponding to the display voltage is generated between the pixel electrode and the counter electrode. An alignment film (not shown) is formed on the surface of the electrode substrate 10.

  Further, a counter substrate is disposed opposite to the electrode substrate 10. The counter substrate is, for example, a color filter substrate, and is disposed on the viewing side. On the counter substrate, a color filter, a black matrix (BM), a counter electrode, an alignment film, and the like are formed. The counter electrode may be disposed on the electrode substrate 10 side. A liquid crystal layer is sandwiched between the electrode substrate 10 and the counter substrate. That is, liquid crystal is injected between the electrode substrate 10 and the counter substrate. Furthermore, a polarizing plate, a phase difference plate, and the like are provided on the outer surfaces of the electrode substrate 10 and the counter substrate. A backlight unit or the like is disposed on the non-viewing side of the liquid crystal display panel.

  The liquid crystal is driven by the electric field between the pixel electrode and the counter electrode. That is, the alignment direction of the liquid crystal between the substrates changes. As a result, the polarization state of the light passing through the liquid crystal layer changes. That is, the polarization state of light that has been linearly polarized after passing through the polarizing plate is changed by the liquid crystal layer. Specifically, the light from the backlight unit becomes linearly polarized light by the polarizing plate on the electrode substrate 10 side. Then, the polarization state changes as this linearly polarized light passes through the liquid crystal layer.

  Therefore, the amount of light passing through the polarizing plate on the counter substrate side changes depending on the polarization state. That is, the amount of light that passes through the polarizing plate on the viewing side among the transmitted light that passes through the liquid crystal display panel from the backlight unit changes. The alignment direction of the liquid crystal changes depending on the applied display voltage. Therefore, the amount of light passing through the viewing-side polarizing plate can be changed by controlling the display voltage. That is, a desired image can be displayed by changing the display voltage for each pixel.

Embodiment 1 FIG.
Next, the configuration of the liquid crystal display device 31 according to the first embodiment will be described with reference to FIG. FIG. 2A is a schematic plan view of the liquid crystal display device 31 according to the first embodiment. 2B is an enlarged view of a portion A in FIG. 2A, and FIG. 2C is a cross-sectional view taken along line BB in FIG. 2B. FIG. 2D is a cross-sectional view taken along the end (inner shape end) of the sealing material 1 on the display region 11 side. In FIG. 2A, a black matrix (BM) 3 made of a light-shielding film is formed in a frame shape so as to surround the display region 11 on the surface of the counter substrate 9 facing the electrode substrate 10. In the present embodiment, the light (ultraviolet) curable sealing material 1 is formed in the region of the BM 3 formed in the frame region 12 as in the case of the prior art 2. That is, the BM 3 formed in the frame region 12 and the sealing material 1 are formed so as to overlap each other.

  In FIG. 2B, the wiring 8 is formed on the surface of the electrode substrate 10 facing the counter substrate 9. The wiring 8 is a routing wiring for connecting the scanning signal line 13 to the scanning signal driving circuit 15 or a routing wiring for connecting the display signal line 14 to the display signal driving circuit 16. The wiring 8 is formed along the X direction. In BM3, as shown in FIG. 2B, a slit pattern 71 (first opening) is formed on the display region 11 side of the sealing material 1 at a position corresponding to the region where the wiring 8 is provided. . As shown in FIG. 2C, the slit pattern 71 is disposed so as to straddle the end (inner shape end) on the display region 11 side of the sealing material 1. That is, a part of the slit pattern 71 is disposed so as to protrude from the inner shape end of the BM 3. The dimension of the slit pattern 71 in the direction perpendicular to the sealing material 1 (X direction) is preferably 0.1 mm or more and 2.0 mm or less, and is 0.3 mm here. That is, the slit pattern 71 is formed not only on the entire area of the BM 3 corresponding to the area where the wiring 8 is provided, but only on the display area 11 side of the sealing material 1. The slit pattern 71 is not formed at the outer end of the sealing material 1. A BM 3 is formed on the entire outer periphery of the sealing material 1 to shield it from light. Therefore, the opening area of the slit pattern 71 of this embodiment is smaller than the slit pattern 75 of the prior art 2. Thereby, the light leakage from the frame area | region 12 can be reduced. The overlap amount of the sealing material 1 and the slit pattern 71 is preferably 0.1 mm or more. The dimension of the slit pattern 71 in the direction parallel to the sealing material 1 (Y direction) is reduced by, for example, 3 μm on one side with respect to the dimension width of the wiring 8. That is, the wiring 8 and the slit pattern 71 are arranged overlapping in the Y direction. The slit pattern 71 is formed inside the both ends of the wiring 8. The plurality of slit patterns 71 are formed separately for each wiring 8. That is, the number of slit patterns 71 corresponding to the number of wirings 8 is formed.

  Next, a method for manufacturing the liquid crystal display device 31 according to Embodiment 1 of the present invention will be described. First, the electrode substrate 10 and the counter substrate 9 are formed of a rectangular flat plate such as a light transmissive glass. A plurality of electrodes such as scanning signal lines 13, display signal lines 14, and pixel electrodes are formed on the electrode substrate 10 by photolithography. Further, a color material made of BM3, a pigment or a dye made of a metal such as a pigment or chromium is formed on the counter substrate 9 by photolithography. In the present embodiment, the BM 3 having the slit pattern 71 is formed. Further, on the counter substrate 9, a protruding spacer for maintaining the distance between the substrates is formed by photolithography using a photosensitive resin.

  An alignment film is formed on the electrode substrate 10 and the counter substrate 9 thus created. As the alignment film, for example, an organic thin film such as a polyimide thin film made of a polymer material is formed with a thickness of about 0.1 μm. The alignment film is subjected to an alignment process (rubbing process) for making micro scratches in one direction on the contact surface with the liquid crystal 2. Thereafter, in this embodiment mode, a dropping injection method is used. First, the sealing material 1 for bonding both substrates is applied by the dispenser method around the surface of the counter substrate 9 on which the alignment film is formed. At this time, the sealing material 1 is applied so that the inner shape end of the sealing material 1 is positioned on the slit pattern 71. For example, a light (ultraviolet) curing type sealing material 1 that is cured by light (ultraviolet) and heat is used. You may use the sealing material 1 with which the spacer was kneaded. The sealing material 1 can be formed around the surface of the electrode substrate 10 on which the alignment film is formed.

  Next, a required amount of the liquid crystal 2 is dropped, placed in a vacuum chamber, and the electrode substrate 10 and the counter substrate 9 are superposed in a vacuum so as to coincide with a predetermined position. After that, when the vacuum chamber is opened to the atmosphere, the region surrounded by the frame-shaped sealing material 1 remains in a vacuum state, so that it is uniformly pressurized by the pressure difference, that is, atmospheric pressure (vacuum bonding step). Thereby, a uniform cell gap in which liquid crystal is sealed is formed.

  And after irradiating and hardening the ultraviolet-ray 4 to the sealing material 1, hardening is accelerated | stimulated by performing heat processing (sealing material hardening process (crimping process)). As shown in FIG. 2D, in the present embodiment, the ultraviolet ray 4 is irradiated from both sides of the counter substrate 9 and the electrode substrate 10 by about 10,000 mJ. At this time, the ultraviolet light 4 is irradiated to the sealing material 1 from the counter substrate 9 side through the slit pattern 71. From the electrode substrate 10 side, the sealing material 1 is irradiated with ultraviolet rays 4 through a region where the wiring 8 is not formed. Thereby, the sealing material 1 in the slit pattern 71 and the sealing material 1 in a region where the wiring 8 is not formed are temporarily cured. That is, the inner end of the sealing material 1 in contact with the liquid crystal 2 is temporarily cured. Then, the entire sealing material 1 is further cured by the subsequent heat treatment. Thus, for example, a cell gap of 5 μm is formed. Then, it cut | disconnects to the panel of the target magnitude | size along a cutting line (panel cutting process). A polarizing plate is attached to the outside of the electrode substrate 10 and the counter substrate 9. Thereafter, through a predetermined process, the liquid crystal display device 31 of the present embodiment is completed.

  As described above, in the present embodiment, the sealing material 1 is formed in the region of the frame region 12 where the BM 3 is formed. A slit pattern 71 from which the BM 3 is removed is formed at a position corresponding to the wiring 8 provided on the electrode substrate 10 at the inner shape end of the sealing material 1. With such a configuration, the area of the opening formed in the BM 3 of the frame region 12 is reduced, and light leakage from the frame region 12 can be reduced. Accordingly, a liquid crystal display device with excellent display characteristics and excellent display quality can be obtained. Further, like the prior art 2, the sealing material 1 on the display region 11 side in contact with the liquid crystal 2 is cured by the ultraviolet ray 4 irradiation, and the occurrence of display defects due to contamination from the sealing material 1 can be suppressed. Further, the sealing material 1 does not need to be formed outside the BM 3, the frame region 12 can be reduced, and the liquid crystal display device can be downsized.

Embodiment 2. FIG.
The configuration of the liquid crystal display device 32 according to the second embodiment will be described with reference to FIG. In the present embodiment, the BM 3 having a slit pattern different from that of the first embodiment is provided, and the other configuration is the same as that of the first embodiment, so that the description thereof is omitted. FIG. 3A is an enlarged view of the BM 3 in the frame region 12 of the liquid crystal display device 32 according to the second embodiment. 3B is a cross-sectional view taken along the line C-C in FIG. 3A, and FIG. 3C is a cross-sectional view taken along the inner shape end of the sealing material 1. In the liquid crystal display device 32 in the second embodiment, the sealing material 1 is formed in the region of the BM 3 formed in the frame region 12, similarly to the liquid crystal display device 31 in the first embodiment in FIG.

  3, the same components as those in FIG. 2 are denoted by the same reference numerals, and description thereof is omitted. In FIG. 3A, a slit pattern 72 having a shape different from that of the first embodiment is formed in the BM 3 on the display region 11 side of the sealing material 1. In the present embodiment, the BM 3 between the adjacent slit patterns 71 of the first embodiment is removed. That is, the slit pattern 72 is formed in a frame shape so as to surround the display region 11, and is formed over the entire circumference of the inner shape end of the sealing material 1. The inner shape end of the sealing material 1 is located immediately below the slit pattern 72. The dimension of the slit pattern 72 in the direction perpendicular to the sealing material 1 (X direction) is preferably 0.1 mm or more and 2.0 mm or less, and is 0.3 mm here. The overlap amount of the sealing material 1 and the slit pattern 72 is preferably 0.1 mm or more. In the present embodiment, a polarizing plate is provided on the outer surfaces of the counter substrate 9 and the electrode substrate 10 so as to cover the region of the slit pattern 72.

  Next, a method for manufacturing the liquid crystal display device 32 according to Embodiment 2 of the present invention will be described. The description of the steps having the same manufacturing method as in Embodiment 1 is omitted. In the step of forming the BM 3 on the counter substrate 9, in the present embodiment, the slit pattern 72 is formed by removing the BM 3 at the inner shape end portion of the sealing material 1 in a frame shape along the sealing material 1. In the process of forming the sealing material 1, the sealing material 1 is applied so that the inner shape end of the sealing material 1 is located immediately below the slit pattern 72. Further, in the step of irradiating the sealing material 1 with the ultraviolet rays 4, as shown in FIG. 3C, the ultraviolet rays 4 are irradiated with about 5000 mJ from the counter substrate 9 side. At this time, the sealing material 1 in the slit pattern 72, that is, the inner shape end of the sealing material 1 is temporarily cured. Then, the entire sealing material 1 is further cured by the subsequent heat treatment. The polarizing plate is attached to the outer surfaces of the counter substrate 9 and the electrode substrate 10 so as to overlap the slit pattern 72.

  Thus, in the present embodiment, the sealing material 1 is formed in the region where the BM 3 of the frame region 12 is formed, and the BM 3 of the inner shape end portion of the sealing material 1 is frame-shaped along the sealing material 1. The slit pattern 72 removed is formed. The counter substrate 9 and the electrode substrate 10 are provided with polarizing plates so as to overlap the slit pattern 72. With such a configuration, light leakage occurs uniformly from the slit pattern 72 in the frame region 12, and the amount of light leakage can be reduced by the polarizing plate. Therefore, it is difficult to visually recognize light leakage, display characteristics are improved, and a liquid crystal display device with excellent display quality can be obtained. In addition, with such a configuration, the sealing material 1 on the display region 11 side in contact with the liquid crystal 2 is cured by irradiation with ultraviolet rays 4, and display defects due to contamination from the sealing material 1 can be prevented. In addition, the ultraviolet irradiation to the sealing material 1 can be carried out only in one direction from the counter substrate 9 side, and the ultraviolet irradiation amount can be reduced. Further, the sealing material 1 does not need to be formed outside the BM 3, the frame area 12 can be reduced, and the liquid crystal display device is downsized.

Embodiment 3 FIG.
The configuration of the liquid crystal display device 33 according to the third embodiment will be described with reference to FIG. In this embodiment, a BM 3 having a slit pattern different from those in the first and second embodiments is provided. FIG. 4A is an enlarged view of the BM 3 in the frame region 12 of the liquid crystal display device 33 according to the third embodiment. 4B is a cross-sectional view taken along the line DD of FIG. 4A, and FIG. 4C is a cross-sectional view taken along the inner shape end of the sealing material 1. FIG. In the liquid crystal display device 33 in the third embodiment, the sealing material 1 is formed in the region of the BM 3 formed in the frame region 12, similarly to the liquid crystal display device 31 in the first embodiment in FIG.

  4, the same components as those in FIG. 2 are denoted by the same reference numerals, and description thereof is omitted. In FIG. 4A, a slit pattern 71 and a slit pattern 74 are formed on the display area 11 side of the sealing material 1 in the BM 3. Since the slit pattern 71 (first opening) is the same as that of the first embodiment, description thereof is omitted.

  On the other hand, the slit pattern 74 (second opening) is formed when the interval between the slit patterns 71 is wider than 0.1 mm. That is, the slit pattern 74 is arranged so that the width of the BM 3 formed between the adjacent slit patterns 71 or 74 is 0.1 mm or less. For example, the slit pattern 71 is spaced apart at a location where the distance between the adjacent wirings 8 is separated. And the slit pattern 74 is arrange | positioned in the location where the distance of the slit pattern 71 which overlaps with wiring becomes wider than 0.1 mm. Thereby, the space | interval of the some slit pattern arranged along the sealing material 1 becomes 0.1 mm or less. On the edge where the wiring 8 is not provided, the slit pattern 74 may be formed at a constant interval of 0.1 mm or less. The slit pattern 74 is formed so as to straddle the inner shape end of the sealing material 1. Since a light-shielding film such as the wiring 8 is not originally formed in a region on the electrode substrate 10 corresponding to the slit pattern 74, a dummy light-shielding pattern 81 for shielding backlight light is newly provided. The light shielding pattern 81 can be formed of, for example, a conductive layer of the same layer as the wiring 8 of the electrode substrate 10. Specifically, it can be formed in the same layer as the scanning signal line 13 or the display signal line 14. The dimensions of the slit pattern 74 may be the same as or different from the slit pattern 71. The dimension of the slit pattern 74 in the direction perpendicular to the sealing material 1 (X direction) is preferably 0.1 mm or more and 2.0 mm or less. The light shielding pattern 81 is preferably larger in size than the slit pattern 74 in consideration of misalignment of the counter substrate 9 and the electrode substrate 10. That is, the light shielding pattern 81 is disposed so as to overlap with the slit pattern 74. Therefore, the slit pattern 74 is covered with the light shielding pattern 81. For example, the direction (Y direction) parallel to the sealing material 1 of the slit pattern 74 is formed smaller by 5 μm on one side than the light shielding pattern 81.

  Next, a method for manufacturing the liquid crystal display device 33 according to Embodiment 3 of the present invention will be described. The description of the steps having the same manufacturing method as in Embodiment 1 is omitted. In the step of forming the BM 3 on the counter substrate 9, in this embodiment, the slit pattern is formed in the BM 3 at a position corresponding to the counter substrate 9 in the region where the wiring 8 of the electrode substrate 10 is provided. 71 and slit patterns 74 are formed so that the distance between adjacent openings is 0.1 mm or less. In the step of forming an electrode on the electrode substrate 10, a light shielding pattern 81 is formed. In the step of forming the sealing material 1, the sealing material 1 is applied so that the inner shape end of the sealing material 1 is positioned immediately below the slit patterns 71 and 74. Further, in the step of irradiating the sealing material 1 with the ultraviolet ray 4, as shown in FIG. 4C, the ultraviolet ray 4 is irradiated with about 10,000 mJ from the counter substrate 9 side. At this time, the sealing material 1 in the slit patterns 71 and 74 is temporarily cured. Further, the sealing material 1 within 0.05 mm around the slit patterns 71 and 74 is also temporarily cured by the wrapping of the ultraviolet rays 4 and the like. That is, the inner shape end of the sealing material 1 is temporarily cured. Then, the entire sealing material 1 is further cured by the subsequent heat treatment.

  Thus, in the present embodiment, the slit pattern 71 is formed in the BM 3 at a position corresponding to the wiring 8 provided on the electrode substrate 10. A slit pattern 74 is formed between the wirings 8 so that the interval between adjacent openings is 0.1 mm or less. A light shielding pattern 81 is formed on the electrode substrate 10 corresponding to the slit pattern 74. With such a configuration, the area of the opening formed in the BM 3 of the frame region 12 is reduced as compared with the related art 2, and light leakage from the frame region 12 can be reduced. Accordingly, a liquid crystal display device with excellent display characteristics and excellent display quality can be obtained. In addition, the sealing material 1 on the display region 11 side in contact with the liquid crystal 2 is cured by the ultraviolet rays 4, and display defects due to contamination from the sealing material 1 can be suppressed. In addition, the ultraviolet irradiation to the sealing material 1 can be performed only in one direction from the counter substrate 9 side. Further, the sealing material 1 does not need to be formed outside the BM 3, the frame area 12 can be reduced, and the liquid crystal display device is downsized.

  In the first to third embodiments, the active matrix liquid crystal display device having a TFT array substrate has been described. However, the present invention is not limited to this. For example, a passive matrix liquid crystal display device may be used. For example, a display device using a display material other than liquid crystal, such as electronic paper, may be used. Note that in this embodiment mode, the dropping injection method is used to enclose the liquid crystal, but the present invention is not limited to this, and other methods can also be used. Moreover, in this Embodiment, although demonstrated using the sealing material 1 of the type hardened | cured with light and a heat | fever, the sealing material 1 is hardened only by light irradiation or light irradiation and other methods. Also good. Although the light irradiated to the sealing material 1 is exemplarily described as the ultraviolet ray 4, the present invention is not limited to this, and the sealing material 1 that is cured by light having a wavelength other than the ultraviolet ray 4 can also be used.

  The above description describes the embodiment of the present invention, and the present invention is not limited to the above embodiment. Moreover, those skilled in the art can easily change, add, and convert each element of the above embodiment within the scope of the present invention.

It is a figure which shows the structure of the electrode substrate of the liquid crystal display device which concerns on this invention. It is a figure which shows the structure of the liquid crystal display device in Embodiment 1 of this invention. It is a figure which shows the structure of the liquid crystal display device in Embodiment 2 of this invention. It is a figure which shows the structure of the liquid crystal display device in Embodiment 3 of this invention. It is a figure which shows the structure of the liquid crystal display device which concerns on the prior art 1. FIG. It is a figure which shows the structure of the liquid crystal display device which concerns on the prior art 2. FIG.

Explanation of symbols

1 sealing material, 2 liquid crystal, 3 BM, 4 UV,
8 wiring, 9 counter substrate, 10 electrode substrate,
11 display area, 12 frame area, 13 scanning signal lines,
14 display signal lines, 15 scanning signal drive circuits, 16 display signal drive circuits,
17 pixels, 18, 19 external wiring, 20 TFT,
71, 72, 74, 75 slit pattern,
81 Shading pattern

Claims (9)

A first substrate having a light-shielding film formed in a frame shape so as to surround the display region;
A second substrate provided with a light-shielding wiring drawn to the outside of the display region, and disposed opposite to the first substrate;
A photo-curing sealing material which is provided in a frame shape in the region where the light-shielding film is formed, and which bonds the first substrate and the second substrate;
A display material provided in a space formed by the first substrate, the second substrate, and the sealing material;
Wherein disposed inside the outer edge of the sealing member, have a, a first opening portion in which the light-shielding film is removed so as to straddle the inner shape end of the sealing material,
A display device in which the light-shielding film is formed on the entire periphery of the outer edge of the sealing material, and the first opening is formed only in a region overlapping the wiring in a plan view . The first opening has a length of the first opening in a direction perpendicular to the inner shape end of the sealing material of 0.1 mm to 2.0 mm,
The display device according to claim 1, wherein the first opening and the sealing material overlap each other by 0.1 mm or more.   The display device according to claim 1, wherein a plurality of the wirings are provided, and a plurality of the first openings are provided corresponding to the plurality of wirings. A light shielding pattern having a light shielding property formed on the second substrate;
In a plan view, the light shielding pattern overlaps with a region that does not overlap with the wiring , inside the outer edge of the sealing material and across the inner shape end of the sealing material, and the light shielding property. display device according to any one of claims 1 to 3 further comprising a second opening film is removed. The display device according to claim 4 , wherein a width of the light-shielding film sandwiched between the second opening and the first opening adjacent to the second opening is 0.1 mm or less. Forming a frame-shaped light-shielding film having a first opening on the first substrate and surrounding the display area;
Forming a light-shielding wiring drawn out of the display area on the second substrate;
Forming a photocurable sealing material in a frame shape on the first substrate or the second substrate;
With the display material sandwiched between the first substrate and the second substrate, the first substrate and the second substrate so that the first opening protrudes from the inner shape end of the sealing material. A step of disposing a substrate opposite to each other with the sealing material interposed therebetween;
Irradiating the sealing material with light through the first opening to cure at least the inner shape end of the sealing material ,
In the step of forming the light-shielding film, the light-shielding film is formed on the entire periphery of the outer edge of the sealing material, and the first opening is formed only in a region overlapping the wiring in a plan view. ,
A method of manufacturing a display device in which light is irradiated from both sides of the first substrate and the second substrate in the step of curing the inner end of the sealing material . The first opening has a length of the first opening in a direction perpendicular to the inner shape end of the sealing material of 0.1 mm to 2.0 mm,
The method for manufacturing a display device according to claim 6 , wherein the first opening and the sealing material are arranged to overlap each other by 0.1 mm or more. It said second substrate having a light-shielding pattern,
In the step of forming the light-shielding film, the planar shape overlaps with the light-shielding pattern and is within the region that does not overlap with the wiring, inside the outer edge of the sealing material, and the inner shape end of the sealing material. The method for manufacturing a display device according to claim 6, wherein the second opening is formed so as to straddle the substrate and from which the light-shielding film is removed . The method for manufacturing a display device according to claim 6 , further comprising a step of curing the sealing material by heating.

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