JP2017139444A - Light source device, method for manufacturing light source device, and projector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source device capable of obtaining desired light-emitting characteristics and being downsized, and further having high reliability.SOLUTION: A light source device comprises: a substrate including a first surface; a plurality of light-emitting elements provided on a first surface side of the substrate; a joining frame provided on the first surface side of the substrate so as to surround the plurality of light-emitting elements; and a lid provided on a side opposite to the substrate of the joining frame. The substrate uses metal as a forming material. The lid includes a translucent member. The translucent member faces the first surface of the substrate, and transmits light emitted from the plurality of light-emitting elements. The joining frame has lower thermal conductivity than that of the substrate.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light source device, a method for manufacturing the light source device, and a projector.

  A light emitting element such as a light emitting diode or a semiconductor laser used in a light source device may be damaged at the time of light emission when an organic substance or moisture adheres thereto. For this reason, the light source device is provided with a structure that blocks the light emitting element and the outside air. Conventionally, as such a structure, there is known an airtight sealing structure in which a light emitting element is sealed by bonding a ceramic substrate and a glass lid (for example, Patent Document 1). In recent years, with the miniaturization of light source devices, light source devices having a structure in which a plurality of light emitting elements are mounted at high density on a substrate have been studied.

  In general, these light emitting elements generate heat during light emission, and this heat may cause deterioration of the light emitting elements and deterioration of light emission characteristics. Therefore, the light source device is configured such that the heat generated from the light emitting element is released to the outside so that the light emitting element does not reach a high temperature.

JP 2007-123444 A

  However, the light source device of Patent Document 1 uses a ceramic substrate. The heat generated from the light emitting element is released to the outside through the substrate, but the ceramic substrate has low thermal conductivity (heat dissipation) and is likely to store heat. Therefore, in the light source device of Patent Document 1, it is necessary to reduce the amount of heat generated per unit area of the substrate in order to prevent the light emitting element from becoming high temperature. For this purpose, it is effective to reduce the number of light emitting elements per unit area. However, in this case, it is difficult to reduce the size of the entire light source device because the substrate must be enlarged in order to secure the necessary light quantity.

  When joining a board | substrate and a lid | cover using the joining material which consists of an inorganic substance, for example, low melting glass, you have to heat the whole light source device more than the melting | fusing point of a joining material. Therefore, the light emitting element deteriorates due to this heating, and desired light emission characteristics may not be obtained.

  In view of the above, an object of one embodiment of the present invention is to provide a light source device which can obtain desired light emission characteristics and can be miniaturized and has high reliability. Another object of one embodiment of the present invention is to provide a method for manufacturing a light source device in which a light-emitting element is unlikely to deteriorate. Another object of one embodiment of the present invention is to provide a projector that can display desired brightness and has high reliability by including the light source device.

  According to one embodiment of the present invention, a metal is used as a forming material, a substrate having a first surface, a plurality of light-emitting elements provided on the first surface side of the substrate, and a first of the substrate so as to surround the plurality of light-emitting elements. And a lid including a translucent member provided so as to face the first surface of the substrate, and light emitted from the plurality of light emitting elements is transmitted therethrough. The light-transmitting member is transmitted, and the bonding frame provides a light source device having a lower thermal conductivity than the substrate.

  According to this structure, the board | substrate which uses a metal material as a forming material has high heat dissipation of board | substrate itself compared with the board | substrate made from the conventional ceramics. Thereby, since the distance between two light emitting elements adjacent to each other can be made smaller than when a ceramic substrate is used, a plurality of light emitting elements can be mounted on the substrate at a high density. In addition, since the heat generated in the light emitting element is efficiently discharged, the reliability of the light source device is high.

  In addition, since the bonding frame has a lower thermal conductivity than the substrate, heat generated when the lid is bonded to the bonding frame is not easily transmitted to the substrate. Thereby, deterioration of the light emitting element due to heat can be reduced.

  With the above operation, according to one aspect of the light source device of the present invention, desired light emission characteristics can be obtained, miniaturization is possible, and high reliability can be obtained.

  In one aspect of the light source device according to the present invention, the lid includes a translucent member and a support frame to which the translucent member is bonded, and the support frame is bonded to the opposite side of the substrate of the bonding frame. It is good also as the structure currently made.

  According to this configuration, since the bonding frame has a lower thermal conductivity than the substrate, heat generated when the lid is bonded to the bonding frame is difficult to be transmitted to the substrate. Thereby, deterioration of the light emitting element due to heat can be reduced.

  In one aspect of the light source device according to the present invention, the support frame may be welded to the joining frame. Thereby, only the junction part of a support frame and a joining frame can be heated locally. Therefore, one embodiment of the light source device according to the present invention can reduce deterioration of the light-emitting element due to heat during manufacture.

  In one aspect of the light source device according to the present invention, the translucent member may be provided on the substrate side of the support frame. In general, light emitted from a light emitting element is divergent light. Further, an optical element such as a condensing lens may be provided on the light emission side of the translucent member. According to the said structure, the space | interval of a light emitting element and a translucent member can be made small. That is, the interval between the optical element and the light emitting element provided on the light emitting side of the translucent member can be reduced. Therefore, the light emitted from the light emitting element can be used efficiently.

  In one mode of the light source device according to the present invention, a storage space surrounded by the substrate, the joining frame, and the lid may be included, and the storage space may be a vacuum. Thereby, compared with the light source device whose storage space is not vacuum, adhesion of organic matter and moisture to the surface of the light emitting element can be reduced. Therefore, one embodiment of the light source device according to the present invention can reduce damage to the light-emitting element during use and has high reliability.

  In one aspect of the light source device according to the present invention, the storage space may be filled with an inert gas. Thereby, compared with the light source device with which storage space is not filled with the inert gas, adhesion of the organic substance and water | moisture content with respect to the surface of a light emitting element can be reduced. Therefore, one embodiment of the light source device according to the present invention is highly reliable because breakage of the light emitting element during use is reduced.

  In one mode of the light source device according to the present invention, a storage space surrounded by the substrate, the joining frame, and the lid may be included, and the storage space may be filled with an inert gas. Thereby, compared with the light source device with which storage space is not filled with the inert gas, adhesion of the organic substance and water | moisture content with respect to the surface of a light emitting element can be reduced. Therefore, one embodiment of the light source device according to the present invention is highly reliable because breakage of the light emitting element during use is reduced.

  In one aspect of the light source device according to the present invention, a configuration may further include a wavelength conversion element that converts at least part of light emitted from the plurality of light emitting elements into fluorescence. Thereby, the one aspect | mode of the light source device which concerns on this invention can inject | emit the light of a desired wavelength.

  According to one embodiment of the present invention, a metal is used as a forming material, a substrate having a first surface, a plurality of light-emitting elements provided on the first surface side of the substrate, and a first of the substrate so as to surround the plurality of light-emitting elements. 1. A method for manufacturing a light source device, comprising: a joining frame provided on one surface side; and a lid including a translucent member provided so as to face the first surface of the substrate. A joining step of joining the lid to the joining frame, and the joining frame provides a method for manufacturing a light source device having a lower thermal conductivity than the substrate.

  According to this method, in addition to local heating, the bonding frame has a lower thermal conductivity than the substrate, so that heat generated when the lid is bonded to the bonding frame is not easily transmitted to the substrate. Thereby, deterioration of the light emitting element by the heat at the time of manufacture of a light source device can be reduced.

  In one aspect of the method for manufacturing a light source device according to the present invention, the lid includes a translucent member and a support frame to which the translucent member is joined, and by welding the support frame to the joint frame. The manufacturing method may be such that the lid is joined to the joining frame.

  According to this method, the joining portion between the joining frame and the support frame may be heated to a weldable temperature. Further, since the bonding frame has a lower thermal conductivity than the substrate, heat generated when the support frame is welded to the bonding frame is difficult to be transmitted to the substrate. Thereby, deterioration of the light emitting element due to heat at the time of manufacturing the light source device can be reduced.

  In one aspect of the method for manufacturing a light source device according to the present invention, the bonding step includes a step of disposing the low melting point glass between the bonding frame and the translucent member, and a step of melting the low melting point glass by local heating. It is good also as a manufacturing method containing these.

  According to this method, the bonding step can be performed at a relatively low temperature at which the low melting point glass can be melted. In addition to the local heating, the bonding frame has a lower thermal conductivity than the substrate, so that heat generated when the support frame is welded to the bonding frame is not easily transmitted to the substrate. Thereby, deterioration of the light emitting element by the heat at the time of manufacture of a light source device can be reduced.

  One embodiment of the present invention includes the above light source device, a light modulation device that modulates light emitted from the light source device according to image information, and a projection optical system that projects light modulated by the light modulation device. A projector is provided. Since one aspect of the projector according to the present invention includes the above-described light source device, it can display a desired image and has high reliability.

It is a perspective view which shows the light source device 1 which concerns on this embodiment. It is sectional drawing which follows the AA line of FIG. It is sectional drawing which shows the manufacturing method of the light source device which concerns on this embodiment. It is sectional drawing which shows the light source device 2 as another structure of the light source device which concerns on this embodiment. It is the schematic which shows the optical system of the projector 1000 which concerns on this embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In addition, in the drawings used in the following description, in order to make the features easy to understand, there are cases where the portions that become the features are enlarged for the sake of convenience, and the dimensional ratios of the respective components are not always the same as the actual ones. Absent. In addition, for the same purpose, portions that are not characteristic may be omitted from illustration.

[Light source device]
Although an example of the light source device according to the present embodiment will be described below, the present embodiment is not limited to these.

  FIG. 1 is a perspective view showing a light source device 1 according to this embodiment. 2 is a cross-sectional view taken along line AA in FIG. As shown in FIGS. 1 and 2, the light source device 1 according to the present embodiment includes a substrate 11, a plurality of light emitting elements 21, a joining frame 31, a plurality of electrodes 33, a support frame 41, and a translucent member. 43.

  The board | substrate 11 has the 1st surface 11a and the 2nd surface 11b to which a heat radiator is attached to the other side, for example. The light emitting element 21 is provided on the first surface 11 a side of the substrate 11 by a bonding material 61. The light emitting element 21 emits light toward the side opposite to the substrate 11. As the bonding material 61, for example, a solder material such as gold-tin is used.

  The joining frame 31 is provided on the first surface 11 a side of the substrate 11 so as to surround the plurality of light emitting elements 21. The joining frame 31 is joined to the substrate 11 by a joining material 63. The bonding material 63 is not particularly limited as long as the substrate 11 and the bonding frame 31 can be bonded to each other, but metal brazing is preferable and silver brazing is more preferably used.

  The joining frame 31 is provided with a plurality of through holes 35. Each through-hole 35 is provided with an electrode 33 for supplying power to the light emitting element 21. The electrode 33 is provided with a bonding wire for electrical connection with the light emitting element 21 (not shown). A space between the bonding frame 31 and the electrode 33 is sealed with a sealing material 71. As the sealing material 71, for example, low-melting glass is preferably used.

  The support frame 41 is bonded to the opposite side of the bonding frame 31 from the substrate 11.

  The translucent member 43 is provided on the substrate 11 side of the support frame 41 so as to face the first surface 11a. At this time, the translucent member 43 is joined to the support frame 41 by the adhesive 51. As the adhesive 51, for example, low-melting glass is preferably used. In the present embodiment, the translucent member 43 constitutes the lid body 40 together with the support frame 41 and the adhesive material 51.

  The light source device 1 has a storage space S surrounded by the substrate 11, the joining frame 31, the support frame 41, and the translucent member 43. That is, the plurality of light emitting elements 21 are provided in the storage space S.

(substrate)
Hereinafter, the configuration of each part will be described in detail with reference to FIG.
The substrate 11 has a quadrangular shape such as a substantially square or a substantially rectangular shape in plan view. The first surface 11a on which the light emitting element 21 is mounted is, for example, a flat surface.

  As the material for forming the substrate 11, a material having high heat dissipation, for example, a metal material is used. As such a metal material, copper or aluminum is preferable, and copper is more preferably used.

(Light emitting element)
For example, a light emitting diode or a semiconductor laser is used as the light emitting element 21. The light emitting element 21 can be selected to have any wavelength depending on the application. For example, a blue light emitting element having a wavelength of 430 nm to 490 nm includes a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1). be able to. In addition to this, a group III element in which a boron atom is partially substituted or a group V element in which a nitrogen atom is partially substituted with a phosphorus atom or an arsenic atom can be included.

(Joining frame, electrode)
As a material for forming the bonding frame 31, a material having a lower thermal conductivity than that of the substrate 11 is used. As such a material, for example, Kovar is used. A plating layer is formed on the surface of the joining frame 31, for example, a plating layer made of nickel-gold is formed.

  As a material for forming the electrode 33, for example, Kovar is used. Moreover, the plating layer is formed in the surface of the electrode 33, for example, the plating layer which consists of nickel-gold is formed.

  In the storage space S, a bonding wire is provided at the end of the electrode 33, and the electrode 33 is electrically connected to the light emitting element 21 (not shown). Gold is preferably used as a material for forming this bonding wire. The other end of the electrode 33 is connected to an external electric circuit (not shown).

(Support frame)
Examples of the material for forming the support frame 41 include metals, and copper is preferably used. A plating layer is formed on the surface of the support frame 41. For example, a plating layer made of nickel is formed.

  The support frame 41 is welded to the joining frame 31 using, for example, nickel-gold.

(Translucent member)
The translucent member 43 is not particularly limited as long as it can transmit light emitted from the light emitting element 21. Examples of the material for forming the translucent member 43 include glass such as borosilicate glass, quartz glass, and synthetic quartz glass, crystal, and sapphire.

  The translucent member 43 may be integrally formed with an optical element having a lens function, for example, on the side opposite to the substrate 11 (not shown). An example of such an optical element is a condenser lens.

(Storage space)
In the present embodiment, the storage space S is a sealed space in order to reduce adhesion of organic substances and moisture to the surface of the light emitting element 21. At this time, the storage space S is preferably a vacuum. Moreover, when the storage space S is not a vacuum, it is preferable to be filled with inert gas, such as nitrogen gas. As this inert gas, an industrial high-purity gas may be used. In this specification, the vacuum means a state of a space filled with a gas having a pressure lower than the normal atmospheric pressure, as defined in JIS Z 8126. In this definition, the gas may be an inert gas.

  Since the light emitting element 21 generates heat during light emission, the heat may cause the light emitting element 21 to deteriorate or the light emission characteristics to deteriorate. The light source device 1 according to the present embodiment includes a substrate 11 made of a metal material. The heat generated from the light emitting element is released to the outside through the substrate, but the substrate 11 according to the present embodiment has higher heat dissipation of the substrate itself than the conventional ceramic substrate. Therefore, in the light source device 1, an increase in the temperature of the light emitting element 21 can be reduced without reducing the amount of heat generated per unit area of the substrate 11. That is, it is not necessary to reduce the number of light emitting elements 21 per unit area of the substrate 11. By this action, the light source device 1 according to the present embodiment can mount the plurality of light emitting elements 21 on the substrate 11 with high density, and the entire light source device 1 can be downsized.

  In the present embodiment, the bonding frame 31 has a lower thermal conductivity than the substrate 11. Thereby, the heat generated when the support frame 41 is bonded to the bonding frame 31 is not easily transmitted to the substrate 11, and the heat transferred from the substrate 11 to the light emitting element 21 can be reduced. With this action, the light source device 1 according to the present embodiment can reduce deterioration of the light emitting element 21 due to heat.

  In the present embodiment, the support frame 41 is welded to the joining frame 31. That is, the support frame 41 can be joined to the joining frame 31 by locally heating the joining portion between the support frame 41 and the joining frame 31. With this action, the light source device 1 according to the present embodiment can reduce deterioration of the light emitting element 21 due to heat during manufacture.

  In the present embodiment, the translucent member 43 is provided on the substrate 11 side of the support frame 41. Thereby, the space between the light emitting element 21 and the translucent member 43 can be reduced. In general, light emitted from the light emitting element 21 is divergent light. Therefore, the light emitted from the light emitting element 21 can be efficiently extracted through the light transmissive member 43 as the distance between the light emitting element 21 and the light transmissive member 43 becomes smaller. Further, an optical element such as a condensing lens may be provided on the light emission side of the translucent member 43. According to the above configuration, the distance between the optical element provided on the light emitting side of the translucent member 43 and the light emitting element 21 can be reduced. Therefore, the light emitted from the light emitting element 21 can be used efficiently.

  The translucent member 43 may be integrally formed with a member having a lens function such as a condensing lens on the side opposite to the substrate 11. Thereby, the light which permeate | transmitted the translucent member 43 can be utilized efficiently.

  In the present embodiment, the storage space S is preferably filled with a vacuum or an inert gas. Thereby, compared with the light source device in which the storage space S is in a state other than the above, adhesion of organic matter and moisture to the surface of the light emitting element 21 can be reduced. Due to this action, the light source device 1 according to the present embodiment has high reliability because damage to the light emitting element 21 during use is reduced.

  According to the present embodiment, a light source device that provides desired light emission characteristics, can be miniaturized, and has high reliability is provided.

[Method for Manufacturing Light Source Device]
Although an example of the manufacturing method of the light source device according to the present embodiment will be described below, the present embodiment is not limited to these.

  FIG. 3 is a cross-sectional view illustrating the method for manufacturing the light source device according to this embodiment. As shown in FIG. 3, first, the support frame 41 is fixed to the translucent member 43 using the adhesive 51, and the lid body 40 is formed.

  Separately from the lid 40, the joining frame 31 and the light emitting element 21 in which the through holes 35 are formed are joined to the first surface 11 a of the substrate 11. At this time, either the light emitting element 21 or the joining frame 31 may be joined to the first surface 11a first. If the light emitting element 21 is bonded after the bonding frame 31 is bonded, the light emitting element 21 does not receive heat generated when the bonding frame 31 is bonded. Therefore, it is preferable to bond the bonding frame 31 first. preferable.

  Next, the electrode 33 is fixed to the joining frame 31 using the sealing material 71. This step may be performed before joining the joining frame 31 to the first surface 11a.

  Next, the light emitting element 21 and the electrode 33 are electrically connected using a bonding wire. Specifically, one end of the bonding wire is bonded to the electrode 33 and the other end of the bonding wire is bonded to the light emitting element 21 using ultrasonic bonding, thermocompression bonding, or both.

  Next, the joining frame 31 provided on the substrate 11 and the support frame 41 provided on the translucent member 43 are welded. In the present embodiment, this step corresponds to the joining step in the claims. In this joining step, the translucent member 43 is disposed so as to face the first surface 11a.

  Specifically, welding can be performed by locally heating the joint between the joining frame 31 and the support frame 41 and melting the nickel-gold plating layer formed on the surface of the joining frame 31. As the welding method, for example, welding by local heating such as resistance welding or laser welding is used.

  The joining process may be performed in a vacuum. The bonding process may be performed in a space filled with an inert gas such as nitrogen gas. Thereby, the adhesion of organic matter and moisture to the surface of the light emitting element 21 can be reduced when the light source device 1 is manufactured. Moreover, since the storage space S can be filled with vacuum or nitrogen gas, adhesion of organic substances and moisture to the surface of the light emitting element 21 can be reduced even when the light source device 1 is used. Therefore, it is possible to easily manufacture a highly reliable light source device in which damage to the light emitting element 21 during use is reduced.

  In the method of manufacturing the light source device according to the present embodiment, the bonding frame 31 has a lower thermal conductivity than the substrate 11, so that heat generated when the support frame 41 is bonded to the bonding frame 31 is not easily transmitted to the substrate 11. . Therefore, the ambient temperature of the light emitting element 21 can be suppressed to a use temperature or less in the light source device 1. In addition, the use temperature of the light source device 1 which concerns on this embodiment is 50-70 degreeC.

  Moreover, the junction part of the joining frame 31 and the support frame 41 can be heated locally, and can be welded. Furthermore, since welding using nickel-gold has a low welding temperature, welding can be performed with little heating. With these actions, the method for manufacturing the light source device according to the present embodiment can reduce deterioration of the light-emitting element 21 due to heat during manufacturing.

  According to this embodiment, it is possible to reduce the deterioration of the light emitting element due to heat, and a method for manufacturing a light source device that can manufacture a highly reliable light source device is provided.

[Modification]
For example, in the light source device 1 according to the present embodiment, the lid 40 includes the support frame 41. However, the support frame 41 may not be included. FIG. 4 is a cross-sectional view showing a light source device 2 as another configuration of the light source device according to the present embodiment. As shown in FIG. 4, in the light source device 2, a lid body 40 made of a translucent member 43 is bonded to the bonding frame 31 by an adhesive material 53. As the adhesive 53, low-melting glass is used.

  The method for manufacturing the light source device 2 is partly in common with the method for manufacturing the light source device 1. What is different is the joining process. The joining process in the manufacturing method of the light source device 2 includes a process of placing the adhesive 53 (low melting glass) between the joining frame 31 and the translucent member 43 and a process of melting the adhesive 53 by local heating. Including. In the light source device 2, a plating layer made of nickel that can be bonded to the low-melting glass is provided on the surface of the bonding frame 31.

  In the present embodiment, the bonding frame 31 has a lower thermal conductivity than the substrate 11. Thereby, the heat generated when the translucent member 43 is bonded to the bonding frame 31 is not easily transmitted to the substrate 11, and the heat transferred from the substrate 11 to the light emitting element 21 can be reduced. With this action, in the light source device 2 as well, the deterioration of the light emitting element 21 due to heat can be reduced as in the light source device 1.

  Moreover, since the light source device 2 has fewer components and fewer joints, the risk of breakage at the joints can be reduced.

[projector]
Although an example of the projector according to the present embodiment will be described below, the present embodiment is not limited to these.

  FIG. 5 is a schematic diagram showing an optical system of the projector 1000 according to the present embodiment. As shown in FIG. 5, the projector 1000 according to the present embodiment includes an illumination device 100, a color separation light guide optical system 200, three liquid crystal light modulation devices 400R as light modulation devices, a liquid crystal light modulation device 400G, and a liquid crystal light modulation device. A device 400B, a cross dichroic prism 500, and a projection optical system 600 are provided.

  The illumination device 100 includes a light source unit 10, a condensing optical system 80, a wavelength conversion element 90, a collimating optical system 110, a first lens array 120, a second lens array 130, a polarization conversion element 140, and a superimposing lens 150. In the present embodiment, the light source unit 10 and the wavelength conversion element constitute the light source device in the claims.

  The light source unit 10 can use the light source device 1 or the light source device 2 described above. For example, the light source unit 10 emits blue light B toward the condensing optical system 80.

  The condensing optical system 80 includes a first lens 82 and a second lens 84. The condensing optical system 80 is disposed in the optical path from the light source unit 10 to the wavelength conversion element 90, and makes the blue light B substantially converged as a whole to enter a wavelength conversion layer 92 described later. The first lens 82 and the second lens 84 are convex lenses.

  The wavelength conversion element 90 is a so-called transmission-type wavelength conversion element, and a single wavelength conversion layer 92 is continuously formed along a circumferential direction of the disk 96 on a part of a disk 96 that can be rotated by a motor 98. Being done. The wavelength conversion element 90 is configured to convert the blue light B into fluorescent light including red light R and green light G, and to emit this light toward the side opposite to the side on which the blue light B is incident. Yes.

  The disc 96 is made of a material that transmits the blue light B. As a material of the circular plate 96, for example, quartz glass, crystal, sapphire, optical glass, transparent resin, or the like can be used.

Blue light B from the light source unit 10 enters the wavelength conversion element 90 from the disk 96 side.
The wavelength conversion layer 92 is formed on the disc 96 through a dichroic film 94 that transmits blue light B and reflects red light R and green light G. The dichroic film 94 is made of, for example, a dielectric multilayer film.

The wavelength conversion layer 92 converts part of the blue light B having a wavelength of about 445 nm from the light source unit 10 into fluorescent light and emits it, and passes the remaining part of the blue light B without conversion. Thus, desired color light can be obtained using the light source unit 10 that emits excitation light and the wavelength conversion layer 92. The wavelength conversion layer 92 is made of a layer containing (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ : Ce, which is a YAG phosphor, and an organic binder, for example.

  The collimating optical system 110 includes a first lens 112 and a second lens 114, each of which is a convex lens, and makes the light from the wavelength conversion element 90 substantially parallel.

  The first lens array 120 has a plurality of first small lenses 122 for dividing the light from the collimating optical system 110 into a plurality of partial light beams. The first lens array 120 includes a plurality of first small lenses 122 arranged in a matrix in a plane orthogonal to the illumination optical axis 100ax.

  The second lens array 130 has a plurality of second small lenses 132 arranged in a matrix in a plane orthogonal to the illumination optical axis 100ax. The plurality of second small lenses 132 are provided corresponding to the plurality of first small lenses 122 of the first lens array 120. The second lens array 130, together with the superimposing lens 150, causes the images of the first small lenses 122 of the first lens array 120 to be in the vicinity of the image forming regions of the liquid crystal light modulation device 400R, the liquid crystal light modulation device 400G, and the liquid crystal light modulation device 400B. It has a function to form an image.

The polarization conversion element 140 is a polarization conversion element that emits the polarization direction of each partial light beam divided by the first lens array 120 as approximately one type of linearly polarized light having a uniform polarization direction.
The polarization conversion element 140 transmits one linear polarization component of the polarization component included in the light from the wavelength conversion element 90 as it is, and reflects the other linear polarization component in a direction perpendicular to the illumination optical axis 100ax. And the other linearly polarized light component reflected by the polarization separation layer in a direction parallel to the illumination optical axis 100ax, and the other linearly polarized light component reflected by the reflective layer is converted into one linearly polarized light component. And a retardation plate.

  The superimposing lens 150 condenses the partial light beams from the polarization conversion element 140 and superimposes them in the vicinity of the image forming regions of the liquid crystal light modulation device 400R, the liquid crystal light modulation device 400G, and the liquid crystal light modulation device 400B.

  The first lens array 120, the second lens array 130, and the superimposing lens 150 constitute an integrator optical system that makes the in-plane light intensity distribution of the light from the wavelength conversion element 90 uniform.

  The color separation light guide optical system 200 includes a dichroic mirror 210, a dichroic mirror 220, a reflection mirror 230, a reflection mirror 240, a reflection mirror 250, a relay lens 260, and a relay lens 270. The color separation light guide optical system 200 separates light from the illumination device 100 into red light R, green light G, and blue light B, and each color light of the red light R, green light G, and blue light B is an illumination target. The liquid crystal light modulation device 400R, the liquid crystal light modulation device 400G, and the liquid crystal light modulation device 400B have a function of guiding light.

  A field lens 300R, a field lens 300G, and a field lens 300B are disposed between the color separation light guide optical system 200 and the liquid crystal light modulation device 400R, the liquid crystal light modulation device 400G, and the liquid crystal light modulation device 400B.

The dichroic mirror 210 transmits the red light R component and reflects the green light G component and the blue light B component toward the dichroic mirror 220.
The dichroic mirror 220 reflects the green light G component toward the field lens 300G and transmits the blue light B component.

  The red light R that has passed through the dichroic mirror 210 is reflected by the reflection mirror 230, passes through the field lens 300R, and enters the image forming region of the liquid crystal light modulation device 400R for red light R.

  The green light G reflected by the dichroic mirror 210 is further reflected by the dichroic mirror 220, passes through the field lens 300G, and enters the image forming area of the liquid crystal light modulation device 400G for green light G.

  The blue light B that has passed through the dichroic mirror 220 passes through the relay lens 260, the incident-side reflection mirror 240, the relay lens 270, the emission-side reflection mirror 250, and the field lens 300B, and the image of the liquid crystal light modulation device 400B for blue light B Incident into the formation area.

  The liquid crystal light modulation device 400R, the liquid crystal light modulation device 400G, and the liquid crystal light modulation device 400B modulate light emitted from the light source unit 10 according to image information. These modulate incident color light according to image information to form a color image, which is an illumination target of the illumination device 100.

  Although not shown, an incident-side polarizing plate and an emitting-side polarizing plate are provided on the light incident side and the light emitting side of the liquid crystal light modulation device 400R, respectively. The same applies to the liquid crystal light modulation device 400G and the liquid crystal light modulation device 400B.

  The cross dichroic prism 500 combines the image light emitted from the liquid crystal light modulation device 400R, the liquid crystal light modulation device 400G, and the liquid crystal light modulation device 400B to form a color image. The cross dichroic prism 500 has a substantially square shape in plan view in which four right-angle prisms are bonded together, and a dielectric multilayer film is formed on a substantially X-shaped interface in which the right-angle prisms are bonded together.

  The projection optical system 600 projects a color image formed by the liquid crystal light modulation device 400R, the liquid crystal light modulation device 400G, and the liquid crystal light modulation device 400B onto the screen SCR.

  Since the projector 1000 according to this embodiment includes the light source device according to one embodiment of the present invention as the light source unit 10, the projector 1000 can display an image with high reliability and desired brightness. In addition, since the projector 1000 according to the present embodiment further includes the wavelength conversion element 90, an image of a desired color can be displayed. In addition, you may use the fluorescent substance which emits fluorescent lights other than yellow as fluorescent substance. For example, a phosphor that emits red fluorescent light may be used. A phosphor that emits green fluorescent light may be used. A wavelength conversion element that emits fluorescent light of any color can be selected according to the application of the projector.

  As mentioned above, although embodiment of this invention was described, each structure and those combination in this embodiment are examples, and addition, abbreviation | omission, substitution, and other of a structure are within the range which does not deviate from the meaning of this invention. It can be changed. Further, the present invention is not limited by the embodiment.

  For example, in the light source device 1 according to the present embodiment, the example in which the translucent member 43 is provided on the substrate 11 side of the support frame 41 is illustrated, but the light transmission device 43 may be provided on the opposite side of the support frame 41 from the substrate 11. Good. According to this, for example, when the storage space S is vacuum, the translucent member 43 is unlikely to fall off the support frame 41. Therefore, the reliability of the light source device is increased. In the case of this configuration, the lid 40 may be formed either before or after the welding process.

  Further, although the example in which the member having the lens function is provided on the side opposite to the substrate 11 of the translucent member 43 is shown, it may be provided on the substrate 11 side of the translucent member 43.

  Furthermore, for example, the projector 1000 according to the present embodiment has been described with an example in which the wavelength conversion element 90 is provided, but the wavelength conversion element 90 may not be provided. In such a case, as the light source unit 10 of the projector, at least one of a light source unit that emits red light R, a light source unit that emits green light G, and a light source unit that emits blue light B is used as a light source device. 1 is used.

  In the projector 1000 according to the present embodiment, the liquid crystal light modulation device is used as the light modulation device, but is not limited thereto. For example, a digital mirror device may be used as the light modulation device.

  Further, for example, in the present embodiment, an example in which the light source device according to the present invention is mounted on a projector is shown, but the present invention is not limited to this. The light source device according to the present invention can also be applied to lighting fixtures, automobile headlights, and the like.

  DESCRIPTION OF SYMBOLS 1 ... Light source device, 10 ... Light source part, 11 ... Board | substrate, 11a ... 1st surface, 21 ... Light emitting element, 31 ... Joining frame, 33 ... Electrode, 35 ... Through-hole, 40 ... Cover body, 41 ... Support frame, DESCRIPTION OF SYMBOLS 43 ... Translucent member, 51 ... Adhesive material, 61, 63 ... Bonding material, 71 ... Sealing material, 90 ... Wavelength conversion element, 400B, 400G, 400R ... Liquid crystal light modulator, 600 ... Projection optical system, 1000 ... Projector, S ... Storage space

Claims (12)

A substrate made of metal and having a first surface;
A plurality of light emitting elements provided on the first surface side of the substrate;
A bonding frame provided on the first surface side of the substrate so as to surround the plurality of light emitting elements;
A lid including a translucent member provided to face the first surface of the substrate,
Light emitted from the plurality of light emitting elements is transmitted through the translucent member;
The joining frame is a light source device having a lower thermal conductivity than the substrate. The lid includes the translucent member and a support frame to which the translucent member is joined,
The light source device according to claim 1, wherein the support frame is bonded to an opposite side of the bonding frame to the substrate.   The light source device according to claim 2, wherein the support frame is welded to the joining frame.   The light source device according to claim 2, wherein the translucent member is provided on the substrate side of the support frame. A storage space surrounded by the substrate, the joining frame, and the lid;
The light source device according to claim 1, wherein the storage space is a vacuum.   The light source device according to claim 5, wherein the storage space is filled with an inert gas. A storage space surrounded by the substrate, the joining frame, and the lid;
The light source device according to claim 1, wherein the storage space is filled with an inert gas.   The light source device according to claim 1, further comprising a wavelength conversion element that converts at least a part of light emitted from the plurality of light emitting elements into fluorescence. A substrate made of metal and having a first surface;
A plurality of light emitting elements provided on the first surface side of the substrate;
A bonding frame provided on the first surface side of the substrate so as to surround the plurality of light emitting elements;
A lid including a translucent member provided to face the first surface of the substrate, and a method of manufacturing a light source device,
Comprising a joining step of joining the lid to the joining frame by local heating;
The bonding frame is a method of manufacturing a light source device having a lower thermal conductivity than the substrate. The lid includes the translucent member and a support frame to which the translucent member is joined,
The method of manufacturing the light source device according to claim 9, wherein the lid is joined to the joining frame by welding the support frame to the joining frame.   The light source device according to claim 9, wherein the joining step includes a step of disposing a low-melting glass between the joining frame and the translucent member, and a step of melting the low-melting glass by the local heating. Manufacturing method. The light source device according to any one of claims 1 to 8,
A light modulation device that modulates light emitted from the light source device according to image information;
A projection optical system that projects the light modulated by the light modulation device.

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