JP2017136864A5 - - Google Patents

Claims (14)

A resin sheet with a support comprising a support and a resin sheet provided on the support,
The resin sheet includes a first resin composition layer provided on the support side,
2nd resin formed by the 2nd curable resin composition of the composition different from the 1st curable resin composition which is provided in the opposite side to a support body and forms the 1st resin composition layer A composition layer,
The minimum melt viscosity of the resin sheet is less 6000Poise, average linear thermal expansion coefficient of between 25 ° C. of the cured layer formed by curing the resin sheet to 0.99 ° C. is 17 ppm / ° C. Ri der less,
Or the thickness of the first resin composition layer is 5μm or less, or the thickness of the second resin composition layer is Ru der less 25 [mu] m, the support coated resin sheet.   A resin sheet with a support comprising a support and a resin sheet provided on the support,
  The resin sheet includes a first resin composition layer provided on the support side,
  2nd resin formed by the 2nd curable resin composition of the composition different from the 1st curable resin composition which is provided in the opposite side to a support body and forms the 1st resin composition layer A composition layer,
  The minimum melt viscosity of the resin sheet is 6000 poise or less, and the average linear thermal expansion coefficient between 25 ° C. and 150 ° C. of the cured product layer obtained by curing the resin sheet is 17 ppm / ° C. or less,
  The first curable resin composition and the second curable resin composition each include an inorganic filler,
  When the content of the inorganic filler in the first curable resin composition is A1 (mass%) and the content of the inorganic filler in the second curable resin composition is A2 (mass%), A1 + 20 A resin sheet with a support that satisfies the relationship ≦ A2. The resin sheet with a support according to claim 1 or 2 , wherein the thickness of the resin sheet is 30 µm or less. The resin sheet with a support according to claim 2 , wherein the thickness of the second resin composition layer is 25 μm or less. The second curable resin composition includes an inorganic filler,
The resin with support according to any one of claims 1 to 4 , wherein the content of the inorganic filler is 70% by mass or more when the nonvolatile component in the second curable resin composition is 100% by mass. Sheet. The resin sheet with a support according to any one of claims 1 to 5 , wherein the minimum melt viscosity of the second resin composition layer is lower than the minimum melt viscosity of the first resin composition layer. The resin sheet with a support according to any one of claims 1 to 6 , which is used for embedding a cavity. The first curable resin composition and the second curable resin composition each include an inorganic filler,
When the average particle diameter of the inorganic filler in the first curable resin composition is D1 (μm) and the average particle diameter of the inorganic filler in the second curable resin composition is D2 (μm), D1 and D2, the support with a resin sheet according to any one of claims 1 to 7 satisfy the relationship of D1 ≦ D2. The average particle diameter D1 (μm) of the inorganic filler in the first curable resin composition and the average particle diameter D2 (μm) of the inorganic filler in the second curable resin composition are D1 ≦ 0.5. The resin sheet with a support according to claim 8 , satisfying a relationship of ≦ D2. The resin sheet with a support according to any one of claims 1 to 9 , wherein the second curable resin composition contains an inorganic filler and a liquid epoxy resin. The resin sheet with a support according to claim 10 , comprising 5 parts by mass or more of a liquid epoxy resin when the inorganic filler is 100 parts by mass. (A) A circuit board having first and second main surfaces and having a cavity penetrating between the first and second main surfaces, and a second main surface of the circuit board joined to each other 12. The circuit board on which a part is temporarily attached, including a temporary attachment material and a part temporarily attached by the temporary attachment material inside the cavity of the circuit board. 12. A first laminating step of vacuum laminating the resin sheet with a support so that the second resin composition layer is bonded to the first main surface of the circuit board;
(B) a heat treatment step of heat treating the circuit board on which the resin sheet with the support is laminated;
(C) A resin sheet with a second support including a second support and a second resin sheet that is bonded to the second support after the tacking material is peeled from the second main surface of the circuit board. A second lamination step of vacuum lamination so that the second resin sheet is bonded to the second main surface of the circuit board;
(D) The manufacturing method of the circuit board with a built-in component which includes the process of thermosetting the resin sheet of the resin sheet with a support and the second resin sheet in this order. The manufacturing method of the component built-in circuit board according to claim 12 , wherein the thickness of the circuit board is 100 µm or more. The method for producing a component built-in circuit board according to claim 12 or 13 , wherein the second resin sheet with a support is the resin sheet with a support according to any one of claims 1 to 11 .