JP2017135363A - システムメンテナンス中に最小接触面積フィーチャおよびウエハ移動ピンを保管して整理するための設計 - Google Patents
システムメンテナンス中に最小接触面積フィーチャおよびウエハ移動ピンを保管して整理するための設計 Download PDFInfo
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- 238000012423 maintenance Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 55
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- 210000003811 finger Anatomy 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 210000003813 thumb Anatomy 0.000 description 4
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920004943 Delrin® Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003251 chemically resistant material Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 polyoxymethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】基板処理システムの最小接触面積(MCA)構成要素を保管するためのトレイ100が、第1リフトピントレイ116および第1の複数の穴の少なくとも一方を備えた第1区画104−1を備える。第1リフトピントレイは、基板処理システムのリフトピンを保持するよう構成された複数のスロットを備える。第1の複数の穴は、基板処理システムのMCAピンを受け入れるよう構成されている。第1カップが、第1区画に隣接して配置されている。第1カップは、第1カップを少なくとも部分的に囲む壁を備え、壁は、第1カップを第1区画から分離し、壁の上縁は、第1区画の底面より上に伸びている。
【選択図】図1
Description
本願は、2015年12月4日出願の米国仮特許出願第62/263,255号の利益を主張する。上記の出願の開示全体が、参照によって本明細書に組み込まれる。
Claims (16)
- 基板処理システムの最小接触面積(MCA)構成要素を保管するためのトレイであって、
第1リフトピントレイおよび第1の複数の穴の少なくとも一方を備えた第1区画であって、
前記第1リフトピントレイは、前記基板処理システムのリフトピンを保持するよう構成された複数のスロットを備え、
前記第1の複数の穴は、前記基板処理システムのMCAピンを受け入れるよう構成されている、第1区画と、
前記第1区画に隣接して配置された第1カップであって、前記第1カップを少なくとも部分的に囲む壁を備え、前記壁は、前記第1カップを前記第1区画から分離し、前記壁の上縁は、前記第1区画の底面より上に伸びる、第1カップと、
を備える、トレイ。 - 請求項1に記載のトレイであって、
前記リフトピントレイは、第2区画と、前記第2区画に隣接して配置された第2カップと、を備える、トレイ。 - 請求項2に記載のトレイであって、
前記第2区画は、第2リフトピントレイおよび第2複数の穴の少なくとも一方を備える、トレイ。 - 請求項1に記載のトレイであって、
前記第1リフトピントレイは、前記リフトピンのそれぞれの識別子を備える、トレイ。 - 請求項1に記載のトレイであって、
前記複数のスロットの数は、前記基板処理システム内の前記リフトピンの数に対応する、トレイ。 - 請求項1に記載のトレイであって、
前記第1リフトピントレイは、前記基板処理システム内の前記リフトピンのそれぞれの位置の識別子を備える、トレイ。 - 請求項1に記載のトレイであって、
前記第1リフトピントレイは、前記複数のスロットの深さより大きい深さを有するサブトレイを備える、トレイ。 - 請求項1に記載のトレイであって、
前記第1の複数の穴の数は、前記基板処理システム内の前記MCAピンの数に対応する、トレイ。 - 請求項1に記載のトレイであって、
前記第1の複数の穴は、前記基板処理システム内の前記MCAピンのパターンに対応するパターンに配置される、トレイ。 - 請求項1に記載のトレイであって、
前記第1の複数の穴の深さは、前記MCAピンの長さからオフセットを引いた長さに対応する、トレイ。 - 請求項1に記載のトレイであって、
前記第1の複数の穴の深さは、前記MCAピンの長さにMCAベアリングの直径を足してオフセットを引いた長さに対応する、トレイ。 - 請求項1に記載のトレイであって、
前記第1カップは、前記第1カップの底面に形成されたガイドチャネルを備える、トレイ。 - 請求項12に記載のトレイであって、
前記ガイドチャネルは、前記第1カップの前記底面から、前記第1カップを少なくとも部分的に囲む前記壁まで伸びる、トレイ。 - 請求項13に記載のトレイであって、
前記第1カップを少なくとも部分的に囲む前記壁は、前記ガイドチャネルと整列されたノッチを備える、トレイ。 - 請求項1に記載のトレイであって、
前記第1カップの底面は、平面または凹面の少なくとも一方である、トレイ。 - 請求項1に記載のトレイであって、
前記カップの側壁および底面の間の境界は、0.375インチ(0.9525cm)〜0.625インチ(1.5875cm)の間の曲率半径を有する、トレイ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562263255P | 2015-12-04 | 2015-12-04 | |
US62/263,255 | 2015-12-04 | ||
US15/214,943 US10418269B2 (en) | 2015-12-04 | 2016-07-20 | Storing and organizing minimum contact area features and wafer transfer pins during system maintenance |
US15/214,943 | 2016-07-20 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017135363A true JP2017135363A (ja) | 2017-08-03 |
JP2017135363A5 JP2017135363A5 (ja) | 2020-01-16 |
JP6814614B2 JP6814614B2 (ja) | 2021-01-20 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016234638A Active JP6814614B2 (ja) | 2015-12-04 | 2016-12-02 | システムメンテナンス中に最小接触面積フィーチャおよびウエハ移動ピンを保管して整理するための設計 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10418269B2 (ja) |
EP (1) | EP3176815B1 (ja) |
JP (1) | JP6814614B2 (ja) |
KR (1) | KR102665027B1 (ja) |
SG (1) | SG10201610102UA (ja) |
TW (1) | TWI723089B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11011355B2 (en) * | 2017-05-12 | 2021-05-18 | Lam Research Corporation | Temperature-tuned substrate support for substrate processing systems |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57156886U (ja) * | 1981-03-27 | 1982-10-02 | ||
US5346070A (en) | 1993-07-06 | 1994-09-13 | Mcspadden Development Company | Portable food tray with cup holder |
JP3035727B2 (ja) | 1996-06-10 | 2000-04-24 | ゴールド工業株式会社 | 部品搬送用トレー |
USD396955S (en) * | 1997-06-26 | 1998-08-18 | Golf Cart Organizer, LLC | Golf cart organizer |
US20010030139A1 (en) * | 1999-12-02 | 2001-10-18 | Gagliardi Eugene D. | Plate for evaluating foods or other goods |
JP5015633B2 (ja) | 2007-02-27 | 2012-08-29 | ヤマハ発動機株式会社 | ライン制御装置、バックアップユニット形成装置、及び基板処理装置 |
KR101685150B1 (ko) * | 2011-01-14 | 2016-12-09 | 주식회사 원익아이피에스 | 박막 증착 장치 및 이를 포함한 기판 처리 시스템 |
US9539757B2 (en) * | 2013-06-26 | 2017-01-10 | Tekni-Plex, Inc. | Packing tray having cell pockets with expandable sidewalls and floating base, and method of manufacture |
JP6296755B2 (ja) * | 2013-10-25 | 2018-03-20 | 富士機械製造株式会社 | ピン配置機構および基板処理装置 |
-
2016
- 2016-07-20 US US15/214,943 patent/US10418269B2/en active Active
- 2016-12-01 TW TW105139606A patent/TWI723089B/zh active
- 2016-12-01 KR KR1020160162504A patent/KR102665027B1/ko active IP Right Grant
- 2016-12-01 SG SG10201610102UA patent/SG10201610102UA/en unknown
- 2016-12-01 EP EP16201598.6A patent/EP3176815B1/en active Active
- 2016-12-02 JP JP2016234638A patent/JP6814614B2/ja active Active
Also Published As
Publication number | Publication date |
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KR20170070817A (ko) | 2017-06-22 |
EP3176815A1 (en) | 2017-06-07 |
TW201730055A (zh) | 2017-09-01 |
KR102665027B1 (ko) | 2024-05-20 |
JP6814614B2 (ja) | 2021-01-20 |
US20170162423A1 (en) | 2017-06-08 |
SG10201610102UA (en) | 2017-07-28 |
EP3176815B1 (en) | 2022-07-27 |
TWI723089B (zh) | 2021-04-01 |
US10418269B2 (en) | 2019-09-17 |
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