JP2017133021A - Curable resin composition for filling holes - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent generation of voids even when a resin is filled and completely cured in a drilling space generated by conducting a back drilling method.SOLUTION: There is provided a curable resin composition for filling holes containing a curing agent having curing initiation temperature of less than 100°C of 1 to 200 pts.wt. based on 100 pts.wt. of a liquid epoxy resin and no solvent and exclusively used for the following manufacturing method of hole filling printed wiring board. There is provided a manufacturing method of hole filling printed wiring board, which includes removing 4 a surplus part of a plating through holes 1 where a substrate is arranged on the organic material made printed wiring board by a back drilling method, filling whole penetration holes with the curable resin composition for filling holes 6, heating the filled resin at 70 to 90°C to have curing rate of 60 to 73% and then heating at 130 to 200°C and curing the same completely.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a curable resin composition for hole filling.

  There may be an excess portion in the through hole that is not related to the conduction between layers. When a high-speed signal is transmitted to such a through hole, this surplus portion behaves as an open stub and causes signal resonance. As a result, the pass characteristic of the frequency due to the wavelength deteriorates.

  Therefore, stubs are removed by drilling (opening) through holes (Patent Document 1).

  However, there is a problem that voids (FIGS. 2 and 9) are generated when the resin formed in the space formed by excavation is completely cured.

JP 2014-187153 A

  In view of the above circumstances, the object of the present invention is to provide a technical means capable of preventing the generation of voids even when the excavation space generated by applying the back drill method is filled with resin and completely cured. And

  In order to achieve the above object, the inventor of the present application diligently studied, and as a result, the present invention was achieved.

That is, the first invention of the present application is a curable resin composition for filling a hole containing 1 to 200 parts by weight of a curing agent having a curing start temperature of less than 100 ° C. per 100 parts by weight of a liquid epoxy resin, and containing no solvent. Provided is a curable resin composition for hole filling, which is exclusively used in a method for producing a printed wiring board.
[The excess portion of the plated through hole provided on the printed wiring board made of an organic material is removed by a back drill method, and the entire through hole is filled with the curable resin composition for filling a hole, First, the curing rate is set to 60 to 73% by heating at 70 to 90 ° C., and then heated to 130 to 200 ° C. to be completely cured.

  The second invention of the present application provides the curable resin composition for hole filling of the first invention of the present application, characterized in that the base material is made of a resin containing glass cloth.

  The third invention of the present application is the curable resin composition for hole filling according to the first or second invention of the present invention, wherein the curable resin composition for hole filling further contains 10 to 1000 parts by weight of a filler. provide.

  The fourth invention of the present application is characterized in that the curable resin composition for filling a hole further contains a curing agent having a curing start temperature of 100 ° C. or higher, and the curable resin for filling a hole according to any one of the first to third inventions of the present invention. A resin composition is provided.

  The fifth invention of the present application is characterized in that the method for manufacturing a hole-filled printed wiring board further flattens at least a part of the surface of the printed wiring board after the filled resin is completely cured. 4 A curable resin composition for filling holes according to any one of the inventions.

  According to the present invention, even when the excavation space formed by applying the back drill method is filled with resin and completely cured, voids can be prevented from being generated.

It is sectional process drawing for demonstrating the manufacturing method of the hole-filling printed wiring board which concerns on this invention.

It is sectional drawing for showing that a void generate | occur | produces in the hole-filled printed wiring board manufactured by omitting the initial hardening process.

It is an expanded sectional view of the excavation part by a drill.

Hereinafter, the present invention will be described in detail based on the best embodiment with reference to the drawings.
The viscosity is according to JIS Z8803 and the particle diameter is according to JIS K5600-2-5.

  In the method for manufacturing a hole-filled printed wiring board according to the present invention, a printed wiring board having plated through holes (FIGS. 1A and 1) [that is, through-holes whose inner walls (wall surfaces) are plated (FIGS. 1A and 2)] is used.

  Such a printed wiring board is manufactured by the following method, for example. That is, a circuit is formed on the surface of the substrate (substrate) → a laminated plate is formed from this substrate → a through hole is formed in the laminated plate → an inner wall of the through hole is plated to form a plated through hole.

  When the base material (FIGS. 1A and 3) is made of an organic material, in particular, a glass cloth-containing resin (epoxy resin or the like), the effect of the present invention (prevention of voids and the like) is particularly prominent.

  In order to form a laminated board from a base material, for example, a desired number of base materials can be stacked and integrated by hot pressing or the like.

  In order to form a through-hole in a laminated board, it can carry out with a drill etc. specifically ,.

  To plate the inner wall of the through hole, for example, chemical plating and / or electroplating can be performed.

  In the plated through hole, the plating thickness is, for example, 10 to 50 μm. Examples of the plated metal species include copper. The plated through hole has a hole diameter (inner diameter) of, for example, 100 to 800 μm, and a hole length of, for example, 200 to 10,000 μm.

In the method for manufacturing a hole-filled printed wiring board according to the present invention, surplus portions (including unnecessary portions) of the plated through holes are removed by a back drill method.
Examples of the surplus portion of the plated through hole include a through hole stub.

  The removal by the back drill method can be performed, for example, by digging along the central axis of the plated through hole to the depth at which the excess portion is removed from the surface of the printed wiring board with a drill. The diameter of the excavation hole is, for example, usually about 20 to 200% larger than the diameter of the plated through hole, and specifically 120 to 1600 μm.

  In the method for manufacturing a hole-filled printed wiring board according to the present invention, the entire through-hole [that is, the excavation space (FIGS. 1B and 4) (the space created by removing the surplus portion) and the remaining portion of the plated through hole (FIGS. 1B and 5) )] Is filled with a curable resin composition for filling holes (FIGS. 1C and 6).

  As the curable resin composition for filling a hole, a liquid epoxy resin and a filler which do not contain a solvent are used.

  The liquid epoxy resin refers to an epoxy resin in a liquid or semi-solid state at room temperature, and examples thereof include an epoxy resin having fluidity at room temperature. As such a liquid epoxy resin, for example, the viscosity (room temperature, mPa · s) is 20000 or less, particularly preferably 1000 to 10,000.

［式中、ｎは０若しくは１を表す。］
で表されるものが挙げられ、１種以上含有してよい。Specifically, as the liquid epoxy resin, bisphenol A type epoxy resin, for example, the following formula:

[Wherein n represents 0 or 1; ]
What is represented by these may be mentioned and you may contain 1 or more types.

［式中、ｎは０若しくは１を表す。］
で表されるものが挙げられ、１種以上含有してよい。Furthermore, specific examples of the liquid epoxy resin include bisphenol F type epoxy resin, for example,

[Wherein n represents 0 or 1; ]
What is represented by these may be mentioned and you may contain 1 or more types.

  Specific examples of the liquid epoxy resin include phenol novolac type, polyfunctional glycidylamine, naphthalene type, diphenylthioether (sulfide) type, trityl type, alicyclic type, and alcohols. Examples include those prepared, diallyl bis A type, methyl resorcinol type, bisphenol AD type, and N, N, O-tris (glycidyl) -p-aminophenol. Good.

  Preferably, the liquid epoxy resin includes bisphenol A type, F type or AD type epoxy resin, phenol novolac type epoxy resin, polyfunctional glycidylamine, N, N, O-tris (glycidyl) -p-aminophenol, and the like. One or more of them may be contained.

  Commercially available liquid epoxy resins include “Epon ™ 828” (bisphenol A type epoxy resin) and “Epon 807” (bisphenol F type epoxy resin) (above, manufactured by HEXION), “ELM-100” (multifunctional Glycidylamine (manufactured by Sumitomo Chemical Co., Ltd.), “RE-305S” (phenol novolac type epoxy resin, manufactured by Nippon Kayaku Co., Ltd.) and the like can be used.

  As a hardening | curing agent, what can start the below-mentioned initial stage hardening reaction is used. Such a curing agent is a curing agent having a curing start temperature of less than 100 ° C. (eg, 60 ° C. or more and less than 100 ° C.), preferably less than 80 ° C. (eg, 70 ° C. or more and less than 80 ° C.). If the curing start temperature is too low, the storage stability of the hole-filling curable resin composition is lowered, whereas if it is too high, the effect of preventing the generation of voids cannot be obtained.

  The “curing start temperature” is the first change point (rising point) when heated in a graph obtained by differential scanning calorimetry (DSC) (vertical calorific value, horizontal axis is heating temperature). ) Say temperature.

  Examples of the curing agent include aliphatic (or modified aliphatic) polyamines, aromatic (or modified aromatic) polyamines, imidazoles (such as 2-ethyl-4-methylimidazole), and amines (primary / secondary / tertiary). Amines, aromatic amines, etc.), amine adducts modified with amines [amine-acid anhydride (polyamide) adducts], amide resins, polyamidoamines, mercaptans, Lewis acid amine complexes (BF3-amine complexes, etc.), organic Examples thereof include acid hydrazides, melamines, organic acid hydrazides, carboxylates of amines, onium salts and the like, and one or more of them can be used.

  As the curing agent, one composed of two or more curing agents can also be used. For example, an imidazole compound and an acid anhydride combined system, an imidazole compound and a phenol resin combined system, and the like can be used, and one or more kinds can be used.

  As the curing agent, those composed of the following curing agent and a curing catalyst can also be used. Specifically, examples of the curing agent include phenolic resins, acid anhydrides, polycarboxylic acids, and latent curing agents [dicyandiamide (DICY) and the like], and one or more can be used. Specific examples of the curing catalyst include imidazole (2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, etc.), tertiary amine, aromatic amine, boric acid. Examples thereof include esters, Lewis acids, organometallic compounds, and organic acid metal salts, and one or more thereof can be used.

  For the purpose of improving the chemical resistance of the cured product and suppressing thermal expansion, a curing agent having a curing start temperature of 100 ° C. or higher (eg, 100 to 200 ° C., typically 110 to 180 ° C.) may be further added. Specific examples of such a curing agent include 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole. And hexahydrophthalic anhydride can be used, and one or more of them can be used.

  Examples of commercially available curing agents or curing catalysts having a curing start temperature of less than 100 ° C. include “Fujicure (trademark) FXR-1020” (modified aliphatic polyamine, manufactured by T & K TOKA), “Cureazole (trademark) 2E4MZ” (imidazoles, Shikoku Kasei Co., Ltd.), “2MZ” (imidazoles, Shikoku Kasei Co., Ltd.), “EPICURE ™ W” (modified aromatic polyamine, manufactured by Mitsubishi Chemical), “PN-23” (amine adduct, Ajinomoto Fine Techno) 1) or more can be used.

  Examples of commercially available curing agents or curing catalysts having a curing start temperature of 100 ° C. or higher include “MEH-8000H” (phenol resins, manufactured by Meiwa Kasei Co., Ltd.), “2PHZ” (imidazoles, manufactured by Shikoku Kasei Co., Ltd.), “Curazole ( (Trademark) 2MZA-PW "(imidazoles, manufactured by Shikoku Kasei Co., Ltd.)," Rikacid (trademark) MH-700 "(acid anhydrides, manufactured by Shin Nippon Rika Co., Ltd.), and the like.

  The curable resin composition for filling a hole preferably further contains a filler. By blending the filler, dents due to curing shrinkage can be prevented, and cured product characteristics (chemical resistance, thermal expansion suppression, etc.) can be improved. Examples of the filler include inorganic fillers (specifically, silica, calcium carbonate, alumina, barium sulfate, aluminum hydroxide, talc, etc.), and one or more kinds can be used. The form of the filler is, for example, a powder having an average particle size of 0.1 to 100 μm.

  In addition to the curable resin composition for filling holes, as additives, antifoaming agents (polydimethylsiloxane, modified silicone type, fluorine type, polymer type, surfactant, emulsion type, etc.), colorant, viscosity modifier , Thixotropic agents, leveling agents, organic fillers, mold release agents, surface treatment agents, flame retardants, plasticizers, antibacterial agents, antifungal agents, stabilizers, antioxidants, phosphors and the like.

  The curable resin composition for hole filling does not contain a solvent. When a solvent is contained, the solvent is gasified at the time of heat curing, causing voids (bubbles) to be generated.

  The viscosity (25 ° C., Pa · s) of the curable resin composition for hole filling is, for example, 10 to 100.

  In the composition of the curable resin composition for filling holes, the curing agent is 1 to 200 (preferably 1 to 100) parts by weight and the filler is preferably 10 to 1000 (most preferably 50) with respect to 100 parts by weight of the liquid epoxy resin. ~ 150) parts by weight. In addition, 1 to 200 parts by weight (preferably 1 to 100) of a curing agent having a curing start temperature of 100 ° C. or more may be added to 100 parts by weight of the liquid epoxy resin.

  The curable resin composition for hole filling of the present invention is limited to those used only in the method for producing a hole-filled printed wiring board of the present invention.

  The filling method of the curable resin composition for filling a hole can be performed by, for example, a screen printing method under an atmospheric pressure or a vacuum under reduced pressure, a direct filling method in which ink is directly filled into a through hole, or the like.

  In the method for manufacturing a hole-filled printed wiring board according to the present invention, the filled resin is first initially cured. The initial curing temperature is 70 to 90 ° C, preferably less than 80 ° C. If the initial curing temperature is too low, curing will start during the work, and if it is too high, the effect of preventing the generation of voids cannot be obtained.

  The initial curing is performed until the initial curing rate is 60 to 73%, preferably 65% or more, and most preferably 70% or more. If the curing rate of the initial curing is too low, it is impossible to suppress moisture evaporation and gas generation during complete curing. Such initial curing time is, for example, 30 to 180 (typically 60 to 120) minutes.

  In the method for manufacturing a hole-filled printed wiring board of the present invention, the filling resin is then heated (“post-heating”) at 130 to 200 ° C., preferably 130 to 180 ° C., and most preferably 150 to 180 ° C. If the post-heating temperature is too low, the heat resistance and chemical resistance of the cured product will decrease, and if it is too high, thermal damage will occur. The post-heating time is, for example, 30 to 180 (typically 30 to 60) minutes.

  After obtaining a completely cured product of the filling resin in this way, it is preferable to further flatten at least a part (including the entire surface) of the printed wiring board surface. Specifically, it is preferable to flatten at least the exposed portion of the filled resin cured product. For example, the exposed protrusions (FIGS. 1C and 7) of the filling resin are polished and removed with a buff, a belt sander or the like until they become flat after complete curing (FIGS. 1D and 8).

  As described above, the entire through hole is filled with the completely cured product of the curable resin composition for hole filling of the present invention, and a hole-filled printed wiring board free from voids is manufactured.

  In particular, the entire through-hole is filled with a completely cured product of the curable resin composition for hole filling of the present invention, and a hole-filled printed wiring board in which no void exists and the surface of the printed wiring board is flattened is manufactured. The

  Hereinafter, the present invention will be specifically described based on examples.

<Used printed wiring board>
The printed wiring board provided with the following plated through hole was used.
Printed wiring board [Epoxy resin base material with glass cloth, 2 layers, total thickness 1600 μm]

  Plating through hole [hole diameter 250 μm, hole length 1600 μm, plating thickness 30 μm, copper plating]

<Preparation of curable resin composition for hole filling>
Preparation Examples 1-15
According to the blending compositions shown in Tables 1 and 2, the blending components were uniformly mixed to prepare curable resin compositions for hole filling (Preparation Examples 1 to 15).

＊）ジエチレングリコールエチルエーテルアセテート

*) Diethylene glycol ethyl ether acetate

<Method for manufacturing hole-filled printed wiring board>
Production Examples 1 to 11 and Production Comparative Examples 1 to 11
The through-hole stub was removed by drilling with a 600 μm diameter drill from the plated through-hole opening end of the printed wiring board to a depth of 800 μm.

  Next, the excavation space and the remaining plated through holes were filled with a curable resin composition for filling holes shown in Tables 3 and 4 by a screen printing method under atmospheric pressure.

  Next, the filled resin was initially cured under predetermined initial curing conditions shown in Tables 3 and 4 until the initial curing rate was reached.

The initial curing rate is determined by comparing the absorbance of the epoxy group absorption peak (910 cm ⁻¹ ) of the filling resin before and after the curing reaction by Fourier transform infrared spectroscopy (FT-IR). The initial curing rate was determined. A calcium carbonate absorption peak (873 cm ⁻¹ ) was used as a control.

That is, initial curing rate (%) =
100 × [1-{(absorbance of epoxy group peak / absorbance of calcium carbonate peak in hole filling resin after reaction) / (absorbance of epoxy group peak / absorbance of calcium carbonate peak in hole filling resin before reaction)}]

In addition, about the ink which does not contain a filler, the initial stage hardening rate was calculated | required from the peak decreasing rate after hardening reaction on the basis of the light absorbency of the epoxy group absorption peak (910 cm < ^-1 >) before hardening reaction.

That is, initial curing rate (%) =
100 × [1- (Absorbance of epoxy group peak in filling resin after reaction / Absorbance of epoxy group peak in filling resin before reaction)]

Next, the initial cured resin was completely cured under predetermined complete curing conditions shown in Tables 3 and 4.
Next, the entire surface of the printed wiring board was polished with a puff and flattened.

  About the hole-filled printed wiring board manufactured in this way, the generation | occurrence | production state of a void was test | inspected. The test results are shown in Tables 3 and 4.

Production Example 12
A hole-filled printed wiring board was produced in the same manner as in Production Example 1 except that a printed wiring board containing no glass cloth was used.

  The manufactured hole-filled printed wiring board was inspected for the occurrence of voids, and no voids were generated.

Production Comparative Example 12
A hole-filled printed wiring board was produced in the same manner as in Production Example 1 except that the initial curing step was omitted.

  When the produced hole-filled printed wiring board was inspected for the occurrence of voids, voids were found in the drilled portion.

Production Comparative Example 13
A hole-filled printed wiring board was produced in the same manner as in Production Example 1 except that a printed wiring board containing no glass cloth was used and the initial curing step was omitted.

  About the manufactured hole-filled printed wiring board, when the generation | occurrence | production state of the void was test | inspected, although the void was confirmed in the drill cutting part, it was smaller than the void of the manufacture comparative example 12.

<Inspection of void occurrence in printed wiring board with hole filling>
The manufactured printed wiring board was cut, and the cut surface was observed with an optical microscope (100 times). And the generation | occurrence | production situation of the void was evaluated according to the following evaluation criteria.

  Evaluation was based on the ratio of the void cross-sectional area to the cross-sectional area of the excavation space. In the table, “◯” represents 0 to 1%, “Δ” represents 1 to 5%, and “x” represents 5% or more in the “void generation state” column.

Mechanism of action

  During excavation by a back drill, the glass cloth (FIGS. 3 and 10) and the base material cause delamination, or a part of the base material is chipped and a gap (FIGS. 3 and 11) is generated.

  On the other hand, the part cut by the back drill is exposed to moisture in the atmosphere because the plating foil on the inner wall is peeled off. As a result, the base material (particularly made of an organic material) absorbs very much moisture. Therefore, when the filled resin is suddenly heated above 100 ° C., (moisture absorption) moisture is discharged from the voids (by vaporization) and becomes voids.

  When the filled resin is rapidly completely cured, the filled resin is cured before the void is exhausted from the filled resin to the outside (outside), and eventually the void remains in the cured resin. Become.

  On the other hand, in the present invention, first, the initial curing is performed at a temperature lower than 100 ° C. (that is, lower than the boiling point of water). This prevents vaporization of moisture (ie, generation of voids).

1 Plating through hole 2 Plating 3 Base material

4 Excavation space 5 Remaining portion of plated through hole 6 Curable resin composition for filling hole

7 Exposed protrusion of filled resin 8 Completely cured resin 9 Void

10 Glass cloth 11 Air gap

Claims (5)

It is a curable resin composition for hole filling containing 1 to 200 parts by weight of a curing agent having a curing start temperature of less than 100 ° C. per 100 parts by weight of a liquid epoxy resin, and exclusively for the following method for producing a hole-filled printed wiring board. A curable resin composition for hole filling used.
[The excess portion of the plated through hole provided on the printed wiring board made of an organic material is removed by a back drill method, and the entire through hole is filled with the curable resin composition for filling a hole, First, the curing rate is set to 60 to 73% by heating at 70 to 90 ° C., and then heated to 130 to 200 ° C. to be completely cured.   The curable resin composition for filling holes according to claim 1, wherein the substrate is made of a resin containing glass cloth.   The curable resin composition for filling holes according to claim 1, wherein the curable resin composition for filling holes further contains 10 to 1000 parts by weight of a filler.   The curable resin composition for filling holes according to claim 1, wherein the curable resin composition for filling holes further contains a curing agent having a curing start temperature of 100 ° C. or higher.   5. The hole filling according to claim 1, wherein the method for manufacturing a hole-filled printed wiring board further flattens at least a part of the surface of the printed wiring board after the filling resin is completely cured. Curable resin composition.

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