JP2017132245A - Fixing platen for resin molding device, resin molding device, and method for producing fixing platen for resin molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin molding device capable of improving the flatness of mold mated faces upon mold fastening.SOLUTION: Provided is a resin molding device comprising: a first fixing platen; a second fixing platen; a plurality of tie bars; a movement platen, between the first fixing platen and the second fixing platen, provided movably forward and backward relative to the first fixing platen along the plurality of tie bars; and a mold fastening mechanism provided between the movement platen and the second fixing platen. The first fixing platen includes: a planar base part having a front face and a back face; a mold fixing part formed so as to be raised to the front face of the base part and composed so as to be fittable with a mold; and a plurality of tie bar fixing parts raised at the positions matched with the respective tie bars in the front face of the base part, and the base part of the first fixing platen is formed so as to be thinner than the mold fitting part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molding apparatus used for molding a resin molded product.

  Conventionally, as a resin molding apparatus used for molding a resin molded product, a resin molding die composed of an upper mold and a lower mold capable of forming a resin molding cavity, an upper platen to which the upper mold is attached, and a lower mold are attached. There is widely known a resin sealing device including a movable platen, a mold clamping mechanism that moves the movable platen back and forth with respect to the upper platen, and a transfer mechanism that supplies molten resin to a cavity of a resin molding die (for example, Patent Document 1). Such a conventional resin sealing device is a resin molding between the lower mold and the upper mold by advancing the moving platen toward the upper platen by the mold clamping mechanism and clamping the lower mold and the upper mold. Configured to form a cavity.

JP-A-9-155910

  However, in the conventional resin sealing device, the upper platen is bent and deformed by a press load applied at the time of mold clamping, thereby generating a minute gap on the mold mating surface between the lower mold and the upper mold, so-called resin molding products. There is a problem that burrs may be formed.

  Then, an object of this invention is to provide the resin molding apparatus which can improve the flatness of the die matching surface at the time of mold clamping.

  In order to achieve the above object, a resin molding apparatus according to the present invention includes a first fixed platen and a second fixed platen that are spaced apart from each other, and one end portion of the first fixed platen. A plurality of tie bars attached at the other end to the second fixed platen, and between the first fixed platen and the second fixed platen, the first tie bar along the plurality of tie bars. A movable platen provided to be movable back and forth with respect to the fixed platen, and provided between the movable platen and the second fixed platen, and moves the movable platen forward and backward relative to the first fixed platen. A resin molding apparatus comprising a mold clamping mechanism, wherein the first fixed platen is formed to have a plate-like base portion having a front surface and a back surface, and to protrude from the front surface of the base portion. A mold mounting portion configured to be attachable, and a plurality of tie bar mounting portions formed to protrude at positions aligned with the tie bars on the front surface of the base portion. The base portion is formed thinner than the mold mounting portion.

  In the resin molding apparatus according to the present invention, the first fixed platen is formed in a rectangular shape, the mold attachment portion is formed in a center portion in the planar direction of the base portion, and the tie bar attachment portion is The base portion is preferably formed at four corners in the planar direction.

  Further, in the resin molding apparatus according to the present invention, the base portion of the first fixed platen is formed with a recess from the back surface to the front surface at a position aligned with the plurality of tie bar mounting portions. It is preferable.

  Furthermore, in the resin molding apparatus according to the present invention, the mold attachment portion is formed in a rectangular shape, and the base portion is formed along the corners of the mold attachment portion along the front surface of the base portion. It is preferable that a through-hole penetrating from the back surface to the back surface is formed for each corner portion.

  Still further, in the resin molding apparatus according to the present invention, the mold mounting portion is formed in a rectangular shape, and the mold mounting portion is disposed at a portion along the long side direction of the mold mounting portion of the base portion. It is preferable that a reinforcing rib extending along the short side direction of the portion is formed.

  Further, in the resin molding apparatus according to the present invention, the moving platen is provided with a through hole through which the tie bar can pass, and a moving guide member that is slidably moved along the tie bar provided at a position aligned with the through hole. The moving guide member is preferably provided on a surface of the moving platen that faces the first fixed platen.

  Furthermore, in the resin molding apparatus according to the present invention, the mold clamping mechanism includes a fixed platen side base portion fixed to the second fixed platen, a movable platen side base portion fixed to the movable platen, and the fixed A toggle link type comprising a movable link portion disposed between a platen side base portion and the movable platen side base portion, and a movable link portion for moving the movable platen side base portion forward and backward with respect to the fixed platen side base portion by bending and stretching operations. A mold clamping mechanism, wherein the movable link portion includes a plurality of first link members, one end portion of which is connected to the movable platen side base portion by a link shaft so as to be relatively rotatable, and one end portion of the first link by a link shaft. A plurality of members connected to the other end of the member so as to be relatively rotatable, and connected to the fixed platen side base by the link shaft so as to be relatively rotatable. 2 link members, and either one of the first link member and the second link member is provided to be twice the number of the other link member, and the two one link members It is preferable to arrange along the axial direction of the link shaft so as to sandwich one other link member.

  Furthermore, in the resin molding apparatus according to the present invention, it is preferable that the second fixed platen is formed such that a region corresponding to the fixed platen side base portion is thicker than other regions.

  Moreover, it is preferable that the resin molding apparatus according to the present invention further includes a transfer mechanism that is detachably disposed on a surface side of the movable platen facing the first fixed platen.

  ADVANTAGE OF THE INVENTION According to this invention, the resin molding apparatus which can improve the flatness of the die matching surface at the time of mold clamping can be provided.

It is a front perspective view which shows schematic structure of the resin molding apparatus which concerns on one Embodiment of this invention. It is a bottom perspective view showing a schematic configuration of an upper platen (first fixed platen) according to the present embodiment. FIG. 3A is a diagram illustrating a schematic configuration of the lower platen side of the upper platen (first fixed platen) according to the present embodiment, and FIG. 3B is a diagram illustrating the upper platen (first first platen) according to the present embodiment. It is a figure which shows schematic structure of the upper surface side of (fixed platen). It is a front perspective view which shows schematic structure of the mold clamping mechanism which concerns on this embodiment. It is a figure which shows the raising state of the mold clamping mechanism which concerns on this embodiment. It is a figure which shows the downward state of the mold clamping mechanism which concerns on this embodiment. It is a bottom perspective view showing a schematic configuration of a lower platen (second fixed platen) according to the present embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. The following embodiments do not limit the invention according to each claim, and all combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. .

  A resin molding apparatus 1 according to the present embodiment is a resin sealing apparatus for resin sealing of electronic components mounted on a lead frame or an electronic substrate by transfer molding, and is opposed to each other as shown in FIG. The upper platen (first fixed platen) 2 and the lower platen (second fixed platen) 3 that are arranged so as to be spaced apart from each other, and a plurality of (this embodiment) spanned between the upper platen 2 and the lower platen 3 In the form, four) tie bars 4, a movable platen 5 provided between the upper platen 2 and the lower platen 3 so as to move forward and backward along the tie bar 4, and a movable platen 5 and a lower platen A mold clamping mechanism 6 provided between the platen 3 and moving the moving platen 5 forward and backward (moving up and down) with respect to the upper platen 2; a transfer mechanism 7 provided on the upper surface of the moving platen 5; A resin molding die 8 provided between the emission 2 and a transfer mechanism 7, and includes a control unit for executing various controls of the resin molding apparatus 1 (not shown).

  As shown in FIG. 1, the upper platen 2, the lower platen 3, and the movable platen 5 are each formed of a rectangular plate-like metal member, and through holes (not shown) for inserting the tie bars 4 into the respective four corners. ) Is formed. The four tie bars 4 are attached to the upper platen 2 by the tie bar nuts 4a and the lower ends are lowered by the tie bar nuts 4b in a state of passing through the through holes of the upper platen 2, the lower platen 3 and the movable platen 5. It is attached to the platen 3. The movable platen 5 is provided at a position where the movable guide members 5a that are slidable along the tie bars 4 are aligned with the through-holes at the four corners, and these movable guide members 5a can be moved up and down along the tie bars 4. It is configured to be guided. The moving guide member 5a has a cylindrical sliding member such as a bush, for example, and is provided to be coaxial with the periphery of the tie bar 4 on the upper surface of the moving platen 5 (that is, on the side facing the upper platen 2). ing. In the resin molding apparatus 1 according to the present embodiment, the tie bar 4, the tie bar nuts 4a and 4b, and the movement guide member 5a can adopt various known configurations, and thus detailed description thereof is omitted. To do.

  As shown in FIG. 2, the upper platen 2 is formed to have a rectangular plate-like base portion 10 having a lower surface (front surface) and an upper surface (back surface), and to protrude from the lower surface of the base portion 10. A mold mounting portion 12 configured to be capable of mounting an upper mold 8a, which will be described later, and a position that is aligned with each tie bar 4 on the lower surface of the base portion 10 (in the present embodiment, raised at the four corners of the base portion 10). And a plurality (four in this embodiment) of tie bar attachment portions 14.

  As shown in FIG. 2, the base portion 10 is formed thinner than the die attachment portion 12 and the tie bar attachment portion 14, so that the amount of deformation caused by a press load applied at the time of mold clamping is reduced. 12 and the tie bar mounting portion 14 are configured to be larger. The mold attaching part 12 is formed by a central part in the planar direction of the base part 10 projecting downward in a rectangular parallelepiped shape, and its lower surface is configured as a mold attaching surface of the upper mold 8a. Yes. The tie bar attaching portion 14 is formed by raising the four corners of the base portion 10 in the planar direction downward in a prismatic shape, and through holes 14a into which the tie bars 4 can be inserted are formed from the lower surface to the upper surface. Has been.

  As shown in FIG. 2 and FIG. 3A, each of the portions along the long side 12 a of the mold mounting part 12 of the base part 10 has a substantially central part in the longitudinal direction of the long side 12 a of the mold mounting part 12. Reinforcing ribs 16 extending in parallel with the direction (short side direction) along the short side 12b of the mold mounting part 12 are formed from the side edge of the base part 10 to the side edge part. The reinforcing rib 16 is configured to increase the rigidity in the short side direction at the substantially central portion of the long side 12a of the mold mounting portion 12 by locally thickening the base portion 10. It is preferable that the shape and thickness of the reinforcing rib 16 be appropriately set so that the bending of the die mounting surface due to a press load during mold clamping becomes a spherical shape.

  As shown in FIG. 2 and FIG. 3 (b), a concave portion 18 is formed at the position matching the tie bar mounting portion 14 of the base portion 10 from the upper surface to the lower surface. That is, the recesses 18 are formed at the four corners on the upper surface side of the base portion 10 so that the region on the back side of each tie bar mounting portion 14 is lower than the upper surface of the base portion 10. Since the base portion 10 is formed with the recesses 18 in this way, the boundary portion 15 with each tie bar mounting portion 14 is thinner than other portions, and thereby, the deformation amount due to the press load applied at the time of mold clamping. Is configured to be larger than the mold mounting portion 12 and the tie bar mounting portion 14. A tie bar nut 4a for fixing the upper end of the tie bar 4 is disposed in each of the recesses 18 (see FIG. 1).

  As shown in FIGS. 3 (a) and 3 (b), the base 10 is positioned along the corners of the mold mounting portion 12 at positions that align with the four corners of the mold mounting portion 12 respectively. A through hole 20 penetrating from the upper surface to the lower surface of the part 10 is formed for each corner of the mold mounting part 12. Each of the through holes 20 has a substantially L-shaped opening shape along the four corners of the mold attachment portion 12 as shown in FIG. 3A when the upper platen 2 is viewed from the lower surface side, and When the upper platen 2 is viewed from the upper surface side, it is formed so as to have a substantially fan-shaped opening shape as shown in FIG. Since the through hole 20 has such an opening shape, as shown in FIG. 3B, when the upper platen 2 is viewed from the upper surface side, the corners of the mold mounting portion 12 are in the through hole 20. Each is configured to be exposed. The through hole 20 is configured to function as an escape hole that absorbs deformation of the mold mounting portion 12.

  Such an upper platen 2 can be formed by carving by cutting a rectangular parallelepiped metal block. Specifically, a portion other than the die attachment portion 12 and the tie bar attachment portion 14 is deeply seated by cutting from the lower surface side of the rectangular metal block so that the reinforcing rib 16 is formed on the base portion 10 ( In addition, the back side of the tie bar attaching portion 14 is deeply seated (removed) from the upper surface side by cutting. Moreover, the through-hole 20 from the upper surface of the base part 10 to the metal mold mounting part 12 is formed by cutting (drilling process) at positions corresponding to the four corners of the metal mold mounting part 12. The substantially fan-shaped through hole 20 is formed such that the opening shape on the lower surface side is substantially L-shaped and the opening shape on the upper surface side is substantially fan-shaped.

  The resin molding die 8 is a so-called multi-pot molding die, and is attached to the upper die 8a attached to the die attaching portion 12 of the upper platen 2 and the transfer mechanism 7 as shown in FIG. And a lower mold 8b capable of forming a cavity (not shown) together with the upper mold 8a. The resin molding die 8 is formed with a runner and a gate for communicating the cavity and a storage pot, which will be described later, of the transfer mechanism 7. The molten resin extruded by the transfer mechanism 7 is directed to the cavity through the runner and the gate. It is possible to make it flow. Each of the upper mold 8a and the lower mold 8b incorporates an ejection mechanism (not shown) for releasing the resin molded product molded by the cavity. In the resin molding apparatus 1 according to the present embodiment, the resin molding die 8 can employ various known configurations, and thus detailed description thereof is omitted.

  The transfer mechanism 7 includes a plurality of storage pots (not shown) that can store resin tablets, plungers (not shown) arranged for the storage pots, and resin tablets in the storage pots by heating the storage pots. And a heating means that melts the molten resin, and is configured to cause the molten resin to flow toward the cavity of the resin molding die 8 by pressing the molten resin accommodated in each accommodating pot by each plunger. As shown in FIG. 1, the transfer mechanism 7 is detachably mounted on the upper surface of the moving platen 5 (that is, the surface facing the upper platen 2), and is configured to move up and down together with the moving platen 5. Yes. In addition, in the resin molding apparatus 1 which concerns on this embodiment, since the transfer mechanism 7 can employ | adopt various well-known structures, the detailed description is abbreviate | omitted.

  As shown in FIG. 4, the mold clamping mechanism 6 is connected to a pair of left and right toggle links 30 spanned between the lower platen 3 and the movable platen 5 and a pair of left and right toggle links 30, respectively. A slider (center arm) 40 for bending and extending the pair of left and right toggle links 30 by moving up and down along, and a slider drive mechanism 50 for moving the slider 40 up and down are provided.

  As shown in FIGS. 4 to 6, the pair of left and right toggle links 30 are respectively a lower platen side base member (fixed platen side base portion) 32 fixed to the lower platen 3 and a movement fixed to the moving platen 5. The platen side base member (moving platen side base portion) 34 is arranged between the lower platen side base member 32 and the moving platen side base member 34, and the moving platen side base member 34 is moved to the lower platen side base member 32 by bending and stretching movements. And a movable link portion 36 that moves forward and backward.

  As shown in FIGS. 4 to 6, the movable link portion 36 has a plurality of upper link members (first link members) 37 whose upper end portions are connected to the movable platen side base member 34 by the upper link shaft 39 a so as to be relatively rotatable. The upper end portion is connected to the lower end portion of the upper link member 37 by the intermediate link shaft 39b so as to be relatively rotatable, and the lower end portion is connected to the lower platen side base member 32 by the lower link shaft 39c so as to be relatively rotatable. And a lower link member (second link member) 38. A through hole (not shown) through which the upper link shaft 39a can be inserted is formed at the upper end portion of the upper link member 37, and the lower end portion of the upper link member 37 and the upper end portion of the lower link member 38 are A through hole (not shown) through which the intermediate link shaft 39b can be inserted is formed, and a through hole (not shown) through which the lower link shaft 39c can be inserted at the lower end portion of the lower link member 38. Is formed. Bearings (not shown) are provided in the through holes on the upper end side of the upper link member 37 and the upper and lower end portions of the lower link member 38. The upper link members 37 are provided so as to be twice as many as the lower link members 38. In the present embodiment, four upper link members 37 are provided for the two lower link members 38. ing.

  As shown in FIG. 4, the upper link member 37 and the lower link member 38 sandwich one lower link member 38 between two adjacent upper link members 37, that is, the upper link member 37. Is arranged along the axial direction of the intermediate link shaft 39b so that the lower link member 38 is supported by the intermediate link shaft 39b in a state where it is supported at both ends. Further, the two upper link members 37 located in the middle of the intermediate link shaft 39b in the axial direction are arranged so as to sandwich a slider arm 44 (to be described later) of the slider 40. It is supported by the intermediate link shaft 39b. That is, the intermediate link shaft 39b has a lower end portion of the first upper link member 37 → the upper end portion of the first lower link member 38 → the second upper link member from one end portion to the other end portion in the axial direction. The four upper links in the order of the lower end of 37 → the slider arm 44 → the lower end of the third upper link member 37 → the upper end of the second lower link member 38 → the lower end of the fourth upper link member 37. A member 37, two lower link members 38, and one slider arm 44 are rotatably arranged. The two upper link members 37 sandwiching the lower link member 38 are connected to each other by a connection block 37 a disposed between the two upper link members 37.

  As shown in FIG. 4, the lower platen side base member 32 has three projecting wall portions 32 a to 32 c projecting upward (in the direction toward the moving platen side base member 34). Between the wall parts 32a-32c, it is comprised so that the two attachment recessed parts 33 which can insert the lower end part of the lower side link member 38 are formed. Each of the protruding walls 32a to 32c is formed with a through hole (not shown) through which the lower link shaft 39c can be inserted. The lower platen side base member 32 has through holes formed in the projecting wall portions 32a to 32c and the lower link members 38 in a state where the lower end portions of the lower link member 38 are inserted into the two mounting recesses 33, respectively. The lower link shaft 39c is inserted into a through-hole formed in the lower end of each of the two lower link members 38 so as to be relatively rotatable.

  As shown in FIG. 4, the movable platen side base member 34 includes three projecting wall portions 34 a to 34 c that project downward (in the direction toward the lower platen side base member 32). Between the wall parts 34a-34c, it is comprised so that the two attachment recessed parts 35 which can insert the upper end part of the upper side link member 37 are formed. Each of the projecting walls 34a to 34c is formed with a through hole (not shown) through which the upper link shaft 39a can be inserted. The movable platen side base member 34 inserts the upper end portion of the upper link member 37 into each of the two mounting recesses 35, and is located outside the movable platen side base member 34 (on the outer peripheral surface side of the projecting wall portions 34a and 34c). In the state where the upper end portion of the upper link member 37 is arranged, that is, in the state where the protruding wall portions 34a to 34c are sandwiched by the upper link member 37, the through holes formed in the protruding wall portions 34a to 34c By inserting the upper link shaft 39a through a through hole formed in the upper end portion of the link member 37, the link member 37 is connected to the four upper link members 37 so as to be relatively rotatable.

  As shown in FIGS. 5 and 6, the slider 40 includes a slider main body 42 screwed into a ball screw shaft 52 (to be described later) of the slider driving mechanism 50, and a left and right connecting the slider main body 42 and the pair of left and right toggle links 30. A pair of slider arms 44, an arm shaft 46 that couples the slider body 42 and the pair of left and right slider arms 44 so as to be relatively rotatable, and a guide member 48 that guides the up-and-down movement of the slider body 42 are provided.

  The slider main body 42 has a built-in ball screw nut that is screwed onto the ball screw shaft 52, and is configured to move up and down along the axial direction of the ball screw shaft 52 as the ball screw shaft 52 rotates. Yes. Each of the pair of left and right slider arms 44 has one end portion connected to the slider body 42 by an arm shaft 46 so as to be relatively rotatable, and the other end portion connected to an intermediate link shaft 39b of the toggle link 30 so as to be relatively rotatable. Yes. When the ball screw shaft 52 rotates in the forward direction, the slider 40 moves upward along the axial direction of the ball screw shaft 52 as shown in FIG. 5, thereby extending the pair of left and right toggle links 30. When the ball screw shaft 52 rotates in the opposite direction, the ball screw shaft 52 moves downward along the axial direction of the ball screw shaft 52 as shown in FIG. It is configured to be bent. In the resin molding apparatus 1 according to this embodiment, the slider 40 can employ various known configurations, and thus detailed description thereof is omitted.

  As shown in FIGS. 4 to 7, the slider drive mechanism 50 includes a ball screw shaft 52 erected vertically from a substantially central portion of the lower platen 3 upward (in a direction toward the moving platen 5), and an electric motor. And a transmission mechanism 56 that transmits the rotational force from the drive source 54 to the ball screw shaft 52 and rotates the ball screw shaft 52.

  The ball screw shaft 52 is disposed through the lower platen 3 through a through hole (not shown) formed in a substantially central portion of the lower platen 3 so that the lower end portion is located on the lower surface side of the lower platen 3. ing. The ball screw shaft 52 has a top end rotatably supported by a holding member (not shown) via a bearing (not shown), and a bearing (not shown) whose bottom end is provided in a through hole of the lower platen 3 ( The lower platen 3 is rotatably supported via a not shown). As shown in FIG. 7, the transmission mechanism 56 is stretched between a pair of pulleys 57a and 57b attached to the lower end of the ball screw shaft 52 and the output shaft of the drive source 54, and the pair of pulleys 57a and 57b. An annular belt 58 is provided, and the rotational force of the drive source 54 is transmitted to the ball screw shaft 52 via the annular belt 58. In the resin molding apparatus 1 according to the present embodiment, the slider drive mechanism 50 can employ various known configurations, and thus detailed description thereof is omitted.

  As shown in FIG. 7, the lower platen 3 is formed in a rectangular plate shape having an upper surface on which the mold clamping mechanism 6 can be placed and a lower surface in which legs 60 are arranged at the four corners. 6, the region corresponding to the lower platen side base member 32, that is, the back side of the lower platen side base member 32 and the region in the vicinity thereof are thicker portions 62 than the other regions (base portions 64). Is formed. At the four corners of the lower surface of the base portion 64, tie bar nuts 4b for fixing the lower end of the tie bar 4 are disposed. Further, pulleys 57 a and 57 b and an annular belt 58 of the slider drive mechanism 50 are disposed on the lower surface of the base portion 64. The leg portion 60 has a downward projecting amount larger than each component arranged on the lower surface side of the lower platen 3, that is, the thick portion 62, the tie bar nut 4 b, the pulleys 57 a and 57 b, and the annular belt 58. Thus, the thick portion 62, the tie bar nut 4b, the pulleys 57a and 57b, and the annular belt 58 are configured not to contact the floor surface.

  In order to manufacture a resin molded product by the resin molding apparatus 1 having the above configuration, first, in a state where the movable platen 5 is lowered by the mold clamping mechanism 6, the electronic component to be sealed is placed in the cavity. The lead frame or the electronic substrate is placed on the lower mold 8b so that the resin tablet is accommodated in each accommodation pot of the transfer mechanism 7. Next, the movable platen 5 is raised by the mold clamping mechanism 6 and the lower mold 8b and the upper mold 8a are clamped to form a cavity between the lower mold 8b and the upper mold 8a. At this time, an electronic component to be sealed is disposed in the cavity. Next, the resin melted in the accommodation pot of the transfer mechanism 7 is caused to flow into the cavity by the plunger and thermally cured. Thereby, the electronic component arrange | positioned in a cavity is molded, and a resin molded product is shape | molded. Next, the movable platen 5 is lowered by the mold clamping mechanism 6 to open the lower mold 8b and the upper mold 8a. At this time, the resin molded product is released from the mold surface of the upper mold 8a by an ejector mechanism built in the upper mold 8a. Finally, the resin molded product is released from the mold surface of the lower mold 8b by the ejector mechanism built in the lower mold 8b, and no cull or runner is required from the resin molded product at the time of mold release or at an arbitrary timing thereafter. A resin molded product is manufactured by removing the resin. The supply of the lead frame or the electronic substrate and the resin tablet to the resin molding apparatus 1 and the removal of the resin molded product from the resin molding apparatus 1 are preferably automatically performed by the peripheral mechanism of the resin molding apparatus 1.

  As described above, the resin molding apparatus 1 according to the present embodiment includes an upper platen (first fixed platen) 2 and a lower platen (second fixed platen) 3 that are spaced apart from each other and one end. The upper platen 2 is attached to the upper platen 2 along the plurality of tie bars 4 between the upper platen 2 and the lower platen 3. And a mold platen 5 provided between the movable platen 5 and the lower platen 3 to move the movable platen 5 forward and backward relative to the upper platen 2. 1, the upper platen 2 is a plate-like base portion 10 having a front surface and a back surface, and is formed so as to protrude from the front surface of the base portion 10, and is configured so that an upper die (die) 8 a can be attached thereto. Mold making Part 12 and a plurality of tie bar attachment parts 14 formed so as to be aligned with the tie bars 4 on the front surface of the base part 10, and the base part 10 of the upper platen 2 is a mold attachment part. It is formed thinner than 12.

  As described above, the resin molding apparatus 1 according to the present embodiment forms the base portion 10 of the upper platen 2 thinner than the mold attachment portion 12, and the rigidity of the base portion 10 is more intentional than the mold attachment portion 12. When the press load is applied at the time of mold clamping, the base portion 10 can be deformed in preference to the die attachment portion 12, so that the deformation amount of the die attachment portion 12 can be reduced. It can be reduced. Further, since the deformation amount of the mold mounting portion 12 is reduced, it is possible to suppress the deformation of the upper mold 8a attached to the mold mounting surface of the mold mounting portion 12, so that the mold matching surface at the time of mold clamping The flatness of can be improved. Furthermore, in the resin molding apparatus 1 according to this embodiment, the rigidity of the upper platen 2 is not increased by increasing the thickness of the upper platen 2 or adding reinforcing parts, but the periphery of the mold mounting portion 12 is seated by cutting. The flatness of the die mating surface at the time of mold clamping is improved by intentionally increasing the deformation amount of the portion other than the die mounting portion 12 and relatively reducing the deformation amount of the mold mounting portion 12. Thus, the upper platen 2 can be reduced in weight.

  Further, in the resin molding apparatus 1 according to the present embodiment, the base portion 10 of the upper platen (first fixed platen) 2 has a position aligned with the plurality of tie bar mounting portions 14 from the upper surface (back surface) to the lower surface, respectively. A recess 18 is formed toward (front). According to the resin molding apparatus 1 according to the present embodiment, the recess portion 18 is formed at a position aligned with the tie bar mounting portion 14 in this way, so that the boundary portion 15 with each tie bar mounting portion 14 in the base portion 10 is formed. It becomes possible to form thinner than other parts, and thereby, the deformation of the base portion 10 due to the press load at the time of mold clamping can be further increased, and the deformation of the mold mounting portion 12 can be further absorbed. Therefore, the flatness of the die-matching surface at the time of mold clamping can be further improved.

  Furthermore, the resin molding apparatus 1 according to the present embodiment penetrates through the base portion 10 from the lower surface (front surface) to the upper surface (rear surface) of the base portion 10 along each corner of the mold mounting portion 12. A hole 20 is formed for each corner. According to the resin molding apparatus 1 according to the present embodiment, the through holes 20 are formed at the respective corners of the mold mounting portion 12 as described above, so that the deformation of the mold mounting portion 12 is absorbed by the through holes 20. Therefore, the flatness of the die mating surface at the time of mold clamping can be further improved.

  Furthermore, in the resin molding apparatus 1 according to the present embodiment, the reinforcing rib 16 that extends along the short side direction of the mold attaching part 12 is formed at a site along the long side direction of the mold attaching part 12 of the base part 10. Has been. According to the resin molding apparatus 1 according to the present embodiment, the reinforcing ribs 16 extending along the short side direction of the mold attaching part 12 are formed in this way, so that the short side direction of the mold attaching part 12 is formed. Rigidity is increased, which makes it possible to make the deflection of the mold mounting portion 12 spherical. That is, when the mold mounting part 12 is formed in a rectangular shape, the mold mounting part 12 tends to bend into an elliptical shape by a press load at the time of clamping, but in the upper platen 2 according to the present embodiment, By increasing the rigidity in the short side direction by means of the reinforcing ribs 16, it is possible to make the deflection of the mold mounting portion 12 due to the press load at the time of mold clamping spherical. Then, the flatness of the die-matching surface at the time of mold clamping can be greatly improved by minimizing the bending of the mold mounting portion 12 and making the bending spherical.

  Further, in the resin molding apparatus 1 according to the present embodiment, the moving platen 5 is provided at a position where the moving platen 5 is aligned with the through hole through which the tie bar 4 can pass, and is slidably movable along the tie bar 4. The movement guide member 5 a is provided on the surface side facing the upper platen (first fixed platen) 2 of the movement platen 5. According to the resin molding apparatus 1 according to the present embodiment, the movement guide member 5a is thus provided on the surface (the upper surface in the present embodiment) facing the upper platen 2 of the movement platen 5, thereby moving the movement guide member. Compared to the case where 5a is provided on the surface (the lower surface in the present embodiment) facing the lower platen 3 of the movable platen 5, it is possible to increase the displacement rigidity on the mold matching surfaces of the upper mold 8a and the lower mold 8b.

  Furthermore, in the resin molding apparatus 1 according to the present embodiment, the mold clamping mechanism 6 includes a lower platen side base member (fixed platen side base portion) 32 fixed to the lower platen 3 (second fixed platen), and a movable platen. 5, the movable platen side base member (movable platen side base part) 34, the lower platen side base member 32, and the movable platen side base member 34 are arranged, and the movable platen side base member 34 is bent and extended. A toggle link type mold clamping mechanism including a movable link portion 36 that moves forward and backward with respect to the lower platen side base member 32. One end portion of the movable link portion 36 is relative to the movable platen side base member 34 by a link shaft 39a. A plurality of upper link members (first link members) 37 that are rotatably connected and one end portion of the upper link member 37 by a link shaft 39b. A plurality of lower link members (second link members) 38 that are connected to the end portion so as to be relatively rotatable and that have the other end portion connected to the lower platen side base member 32 by a link shaft 39c. The link members 37 are provided so as to be double the number of the lower link members 38, and are arranged along the axial direction of the link shaft 39 b so that one lower link member 38 is sandwiched between the two upper link members 37. Are arranged.

  According to the resin molding apparatus 1 according to the present embodiment, in this way, the upper link member 37 is supported in the axial direction of the link shaft 39b so that the upper link member 37 is supported by the link shaft 39b while being supported on the lower link member 38. Since the support load (stress) applied to the link shaft 39b at the time of mold clamping is distributed in the axial direction and the uneven load on the link shaft 39b can be suppressed, the occurrence of abnormal friction, etc. Can be reduced. That is, in the case where the same number of upper link members 37 and lower link members 38 are supported by the link shaft 39b in a cantilevered state, the stress distribution in the axial direction of the link shaft 39b during mold clamping is not good. Since the load becomes uniform and an offset load is generated on the link shaft 39b, abnormal friction or the like may occur. However, in the mold clamping mechanism 6 according to the present embodiment, the upper link member 37 is supported at both ends with respect to the lower link member 38. By being arranged so as to be supported by the link shaft 39b in a state, it is possible to suppress the eccentric load on the link shaft 39b. In particular, in the mold clamping mechanism 6 according to the present embodiment, three projecting wall portions 32a to 32c, two lower link members 38, four upper link members 37, from the lower platen 3 to the moving platen 5, The three protruding wall portions 34a to 34c are arranged in this order, and not only between the upper link member 37 and the lower link member 38, but also the three protruding wall portions 32a to 32c and the two lower link members 38. And the four upper link members 37 and the three projecting wall portions 34a to 34c are supported by the link shafts 39a and 39c in a both-sided state, and therefore the load on the entire toggle link 30 is offset. Can be suppressed.

  Furthermore, in the resin molding apparatus 1 according to the present embodiment, the lower platen 3 (second fixed platen) has a region corresponding to the lower platen side base member (fixed platen side base portion) 32 as compared with other regions. It is formed to be thick. According to the resin molding apparatus 1 according to the present embodiment, the region corresponding to the lower platen side base member 32 in the lower platen 3 is thus formed thick so that it corresponds to the lower platen side base member 32. Since the rigidity of the region can be increased, the risk of breakage of the lower platen 3 can be reduced.

  Further, in the resin molding apparatus 1 according to the present embodiment, the transfer mechanism 7 is detachably disposed on the surface (the upper surface in the present embodiment) facing the upper platen (first fixed platen) 2 of the moving platen 5. ing. According to the resin molding apparatus 1 according to the present embodiment, the drive system of the transfer mechanism 7 is arranged on the upper surface side of the moving platen 5 in this way, and the transfer mechanism 7 itself is a detachable (replaceable) unit. Accordingly, it is possible to easily change from transfer molding that requires the transfer mechanism 7 to compression molding that does not require the transfer mechanism 7, or to change to another type of transfer mechanism 7 having a different number of storage pots and plungers. . As a result, the degree of freedom in design is improved, and it is possible to flexibly cope with specification changes at the delivery destination.

  The preferred embodiment of the present invention has been described above, but the technical scope of the present invention is not limited to the scope described in the above-described embodiment. Various modifications or improvements can be added to the above embodiments.

  For example, in the above-described embodiment, the resin molding apparatus has been described as a vertical resin sealing apparatus that performs transfer molding. However, the present invention is not limited to this. For example, the resin molding apparatus is a vertical or horizontal injection molding apparatus or the like. Also good.

  In the embodiment described above, the resin mold 8 is described as a two-sheet mold including the upper mold 8a and the lower mold 8b. However, the present invention is not limited to this, and the upper mold 8a and the lower mold 8b are connected to the intermediate mold. It is possible to use various resin molds such as a three-sheet mold to which is added.

  In the above-described embodiment, the upper platen 2, the lower platen 3, and the movable platen 5 are each described as being formed from a rectangular plate-like metal member. However, the present invention is not limited to this, and various known shapes are employed. Is possible.

  In the above-described embodiment, the concave portion 18 is described as being formed at a position aligned with the tie bar mounting portion 14 of the base portion 10. However, the present invention is not limited to this, and a configuration in which the concave portion 18 is not formed may be employed.

  In the above-described embodiment, the base portion 10 has been described as having the through holes 20 along the respective corners of the mold mounting portion 12. However, the present invention is not limited thereto, and the through holes 20 may not be formed. good.

  The reinforcing ribs 16 of the base portion 10 described in the above-described embodiment are not limited to the illustrated example, and the shape, thickness, length, position, and number can be arbitrarily changed. Moreover, it is good also as a structure in which the reinforcement rib 16 is not formed.

  In the embodiment described above, the movement guide member 5a is provided on the upper surface of the movement platen 5. However, the present invention is not limited to this, and the position of the movement guide member 5a can be arbitrarily changed.

  In the above-described embodiment, the mold clamping mechanism 6 has been described as an electric toggle link mold clamping mechanism. However, the present invention is not limited to this, and it is assumed that the mold clamping mechanism 6 is a hydraulic toggle link mold clamping mechanism using a hydraulic cylinder as a drive source. It is also possible to use a mold clamping mechanism other than the toggle link type.

  In the above-described embodiment, the region corresponding to the lower platen side base member 32 of the lower platen 3 is described as being formed to be thick. However, the present invention is not limited to this, and the thickness may be uniform. .

  In the above-described embodiment, the transfer mechanism 7 has been described as being detachably disposed on the upper surface of the movable platen 5. However, the present invention is not limited to this, and the position of the transfer mechanism 7 can be arbitrarily changed. It is good also as a structure attached so that attachment or detachment is impossible.

  DESCRIPTION OF SYMBOLS 1 Resin molding apparatus, 2 Upper platen (1st fixed platen), 3 Lower platen (2nd fixed platen), 4 Tie bar, 5 Moving platen, 5a Moving guide member, 6 Clamping mechanism, 7 Transfer mechanism, 8 Resin Molding die, 10 base portion, 12 die attaching portion, 14 tie bar attaching portion, 16 reinforcing rib, 18 recessed portion, 20 through hole, 30 toggle link, 32 lower platen side base member (fixed platen side base portion), 32a to 32c Protruding wall part, 33 mounting concave part, 34 moving platen side base member (moving platen side base part), 34a to 34c projecting wall part, 35 mounting concave part, 36 movable link part, 37 upper link member (first link member), 38 Lower link member (second link member), 40 slider, 50 slider drive mechanism

Accordingly, an object of the present invention is to provide a fixed platen for a resin molding apparatus , a resin molding apparatus, and a method for manufacturing the fixed platen for a resin molding apparatus that can improve the flatness of a mold-matching surface during mold clamping. To do.

To achieve the above object, a stationary platen resin molding apparatus according to the present invention, a plate-shaped base portion having a positive surface and a rear surface, are formed by ridges on the front of the base portion, it can be attached to the mold a mold mounting portion configured to, the base portion is formed with raised Takashi in front of, respectively and a plurality of tie bars mounting portion to which is attachable configured tie bars, before Symbol base portion, the die It is characterized by being formed thinner than the mounting portion and surrounding the mold mounting portion .

The fixed platen for a resin molding apparatus according to the present invention is formed in a rectangular shape, the mold attachment portion is formed in a center portion in the planar direction of the base portion, and the tie bar attachment portion is formed on the base portion. It is preferably formed at four corners in the planar direction.

Further, in the fixed platen resin molding apparatus according to the present invention, the base portion, said tie bar than the mounting portion is formed in a thin and is formed between the mold mounting section tie bar attachment portion Rukoto Is preferred.

Resin molding apparatus according to the present invention, together with a first stationary platen and a second stationary platen disposed in a spaced relationship from each other so as to face, one end attached to the first stationary platen and the other end the A plurality of tie bars attached to a second fixed platen, and advancing and retreating with respect to the first fixed platen along the plurality of tie bars between the first fixed platen and the second fixed platen Resin molding comprising a movable platen provided in a possible manner and a mold clamping mechanism that is provided between the movable platen and the second fixed platen and moves the movable platen forward and backward with respect to the first fixed platen. It is an apparatus, Comprising: The said 1st stationary platen is a stationary platen for resin molding apparatuses of any one of Claims 1-3, It is characterized by the above-mentioned .

In the resin molding apparatus according to the present invention, the moving platen includes a through-hole through which the tie bar can pass, and a moving guide member that is provided at a position aligned with the through-hole and is slidably movable along the tie bar. Preferably, the moving guide member is provided on a surface of the moving platen facing the first fixed platen .

The resin molding apparatus according to the present invention preferably further comprises a transfer mechanism arranged detachably on the side facing the first stationary platen of the moving platen.

A method of manufacturing a fixed platen for a resin molding apparatus according to the present invention includes a plate-like base portion having a front surface and a back surface, and a mold formed so as to be raised from the front surface of the base portion and to which a mold can be attached. A mounting portion and a plurality of tie bar mounting portions formed so as to protrude from the front surface of the base portion, each of which is configured to be capable of mounting a tie bar, the base portion being formed thinner than the mold mounting portion. And it is a method for manufacturing the fixed platen for a resin molding apparatus formed so as to surround the mold mounting part from a metal block, and corresponds to the mold mounting part from the front side of the metal block The mold mounting portion and the base portion are formed by sitting around the portion to be performed .

In the method for manufacturing a fixed platen for a resin molding apparatus according to the present invention, the plurality of tie bar mounting portions are formed by sitting on a corresponding portion between the adjacent tie bar mounting portions from the front side of the metal block. It is preferable.

Further, the method for manufacturing a fixed platen for a resin molding device according to the present invention corresponds to the back side of the tie bar mounting portion by sitting on a portion corresponding to the back side of the tie bar mounting portion from the back side of the metal block. It is preferable to form a recess in the portion from the back to the front .

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the fixed platen for resin molding apparatuses which can improve the flatness of the mold fitting surface at the time of mold clamping , the resin molding apparatus, and the fixed platen for resin molding apparatuses can be provided.

Claims (9)

A first fixed platen and a second fixed platen that are spaced apart from each other;
A plurality of tie bars having one end attached to the first fixed platen and the other end attached to the second fixed platen;
A movable platen provided between the first fixed platen and the second fixed platen so as to be movable forward and backward with respect to the first fixed platen along the plurality of tie bars;
A resin molding apparatus comprising: a mold clamping mechanism provided between the movable platen and the second fixed platen and moving the movable platen forward and backward with respect to the first fixed platen;
The first fixed platen includes a plate-like base portion having a front surface and a back surface, a mold mounting portion formed so as to protrude from the front surface of the base portion, and configured to be capable of mounting a mold, and the base portion. A plurality of tie bar attachment portions formed so as to be raised in a position aligned with each tie bar on the front side of
The resin molding apparatus, wherein the base portion of the first fixed platen is formed thinner than the mold attachment portion. The first fixed platen is formed in a rectangular shape,
The mold mounting portion is formed at a central portion in the planar direction of the base portion,
The resin molding apparatus according to claim 1, wherein the tie bar attaching portion is formed at four corners of the base portion in a planar direction. The base portion of the first fixed platen is formed with a recess from the back surface toward the front surface at a position aligned with the plurality of tie bar mounting portions. The resin molding apparatus described in 1. The mold mounting part is formed in a rectangular shape,
The base part has a through-hole penetrating from the front surface to the back surface of the base part along each corner of the mold mounting part, and is formed for each corner. Item 4. The resin molding apparatus according to any one of Items 1 to 3. The mold mounting part is formed in a rectangular shape,
The reinforcement rib extended along the short side direction of this metal mold | die attachment part is formed in the site | part along the long side direction of the said metal mold | die attachment part of the said base part. The resin molding apparatus of Claim 1. The moving platen includes a through-hole through which the tie bar can pass, and a moving guide member that is provided at a position aligned with the through-hole and is slidably movable along the tie bar.
The resin molding apparatus according to claim 1, wherein the movement guide member is provided on a surface side of the movement platen that faces the first fixed platen. The mold clamping mechanism includes a fixed platen side base portion fixed to the second fixed platen, a movable platen side base portion fixed to the movable platen, the fixed platen side base portion, and the movable platen side base portion. A toggle link type mold clamping mechanism comprising a movable link portion that is arranged between and a movable link portion that moves the moving platen side base portion forward and backward with respect to the fixed platen side base portion by bending and stretching operations,
The movable link portion includes a plurality of first link members whose one end portions are connected to the movable platen side base portion by a link shaft so as to be relatively rotatable, and one end portions to the other end portion of the first link member by a link shaft. A plurality of second link members that are connected so as to be rotatable relative to each other and whose other ends are connected to the fixed platen side base portion via a link shaft so as to be rotatable relative to each other
Either one of the first link member and the second link member is provided so as to be double the number of the other link member, and one other link member is provided by two one link members. The resin molding apparatus according to claim 1, wherein the resin molding apparatus is arranged along an axial direction of the link shaft so as to be sandwiched. The resin molding apparatus according to claim 7, wherein the second fixed platen is formed such that a region corresponding to the fixed platen side base portion is thicker than other regions. The resin molding apparatus according to claim 1, further comprising a transfer mechanism that is detachably disposed on a surface of the movable platen that faces the first fixed platen.

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