JP2009148933A - Resin sealing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing device allowing facilitation or elimination of adjustment work of contact of molds by clamping the molds without deforming it even if a toggle link type press mechanism is used. <P>SOLUTION: The resin sealing apparatus keeps upper and a lower molds 112 and 122 supported by platens so that the molds are vertically opened or closed by the toggle link type press mechanism 106 through the platens. A lead frame 150 is clamped by the upper and lower molds 112 and 122 and sealed with a resin. A horizontal supporting region is formed when the lower mold 122 is supported by a movable platen 104. The supporting region is smaller than a width between both horizontal ends of the lead frame 150 when the maximum clampable lead frame 150 is placed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a technical field of a resin sealing device that seals a molded product with a resin in opposite molds.

  Conventionally, a resin sealing device 1 shown in FIG. 5 is known. The resin sealing device 1 includes a fixed platen 2 fixed to a tie bar 8, an upper mold 12 suspended from the fixed platen 2, a movable platen 4 movable up and down along the tie bar 8, and the movable And a lower die 22 placed on the platen 4. Further, a toggle link type press mechanism 6 is connected to the lower side of the movable platen 4, and the movable platen 4 and the lower mold 22 can be moved forward and backward with respect to the upper mold 12 by the operation of the press mechanism 6. It is configured. In the resin sealing device 1, molten resin is filled by the plunger 40 in a state where a lead frame (molded product) (not shown) is clamped by the upper mold 12 and the lower mold 22, and resin sealing is performed. .

JP 2006-269786 A

  In the resin sealing device 1 having the above-described configuration, the “per die” of the upper and lower molds 12 and 22 is often uneven. Here, “per die” refers to the pressure distribution state of the entire die when the opposing die is clamped (when the clamping pressure is applied). As shown in FIG. 5, when the toggle link type press 6 is adopted as the press mechanism, the lower die 22 is centered when the lower die 22 is viewed in plan because of the structure at the time of clamping. The press pressure is relatively greater at the peripheral portion than at the portion (see FIG. 6). That is, the pressure is lower than it should be in the central part when the mold is viewed in plan, while it is higher than the pressure that should be in the peripheral part of the mold. This is because a mechanism for filling the resin such as the plunger 40 is provided near the center of the lower mold 22 (center when viewed in plan), and it is difficult to ensure the rigidity of the entire lower mold 22. It is thought that there is also some. Naturally, when this “per die” state is bad (that is, a state where the pressure is not uniformly distributed), the sealing quality also deteriorates. That is, resin leakage is induced in a relatively low pressure portion, while on the other hand, a highly accurate resin sealing is performed such that a pressure mark is left on a lead frame to be clamped in a relatively high pressure portion. It is impossible.

  In order to improve the “per die” state, for example, it is possible to adjust by inserting a shim between the platen and the mold, or between the mold and the chase.

  However, the adjustment work using the shim is a repeated trial and error, and the adjustment work takes a very long time. Further, if all the adjustments are made by the shim, there is a possibility that the “per die” may be adjusted while the entire mold is distorted. For example, if a shim is interposed in the vicinity of the center of the upper mold, and the vicinity of the center in the plan view of the upper mold is adjusted to rise to the lower mold side, the "per die" as a whole mold will be Some adjustment is possible. However, such an adjustment method leads to resin sealing in a state where the cross section is distorted in a so-called “V-shape”, and adversely affects the molded product (for example, cracks, warpage, etc.). In addition, due to distortion of the entire mold, the reference position (off-center) when positioning the lead frame or the like on the mold surface becomes unclear, and from this point of view, accurate resin sealing cannot be desired.

  The present invention has been made to solve such a conventional problem, and even when a toggle link type press mechanism is adopted, the mold can be clamped without distorting the mold, and adjustment work per mold is possible. It is an object of the present invention to provide a resin sealing device that is easy or unnecessary.

  In the present invention, the first and second molds supported by the platen can be opened and closed in the Z direction by the toggle link type press mechanism via the platen, and the first and second molds are covered. A resin sealing device that seals the molded product with a resin filled in a state in which the molded product is clamped, and when the direction orthogonal to the Z direction is the X direction, the first and second Among the molds, at least the support region in the X direction in which the mold on the side interlocked with the toggle link type press mechanism is supported from the platen is the largest that can be clamped by the first and second molds. The said subject is solved by setting it as the width | variety (distance between both ends) of the said X direction of the said to-be-molded product at the time of mounting a to-be-molded product.

  That is, by receiving the pressing pressure input from the platen to the mold at the portion corresponding to the portion where the molding product (lead frame or the like) clamped by the mold is located, the mold The whole is prevented from being greatly distorted. As a result, more uniform “per die” is realized. Specifically, when a product to be placed in the mold is projected in the press direction (Z direction), a support region in the X direction in which the mold is supported from the platen (that is, input from the platen). The press pressure input area) is set to be equal to or smaller than the width corresponding to both end portions in the X direction of the molded product. This makes it possible to transmit the force more directly to the portion where the press pressure should be concentrated.

  At this time, when a plurality of molded articles are arranged, the support area is set to be equal to or less than the width in the X direction (distance between both ends) of the entire molded article, or the support area is It is possible to set the width in the X direction (distance between both end portions) to be equal to or less than each molded product. This makes it possible to transmit the force more directly to the portion where the press pressure should be concentrated.

  More preferably, the first and second molds supported by the platen can be opened and closed in the Z direction by a toggle link type press mechanism via the platen, and the first and second molds are covered. A resin sealing device that seals a molded product with a resin that is filled in a state in which the molded product is clamped, and when the surface orthogonal to the Z direction is an XY plane, the first and first Among the two molds, at least the mold on the side interlocked with the toggle link type press mechanism is supported by the first and second molds in the support area on the XY plane where the mold is supported by the platen. It is good to comprise so that it may be settled inside the outermost periphery in the said XY plane at the time of mounting the largest possible molded article.

  In other words, the support area is inside the outermost periphery of the molded product in a plane perpendicular to the Z direction, so that the force can be transmitted more directly to the part where the press pressure should be concentrated from any direction. It is possible to do.

  Further, since the support region can be formed by interposing a support member between the mold and the platen, or by cutting a part of at least one of the mold or the platen, the present invention is applied. Therefore, no significant cost increase is necessary.

  In addition, when the Z-direction dimension of the support member and the Z-direction dimension of the cut portion are equal to or larger than the bending deformation amount of the platen when the toggle link press mechanism is operated, the platen is curved In this case, the support area can be appropriately maintained.

  By applying the present invention, the “per die” of the entire mold can be improved. As a result, adjustment work becomes easy or unnecessary.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a side sectional view of a resin sealing device 100 as an example of an embodiment of the present invention. FIG. 2 is a diagram schematically showing the relationship between the mold and the platen in FIG.

<Configuration of resin sealing device>
The resin sealing device 100 includes four tie bars 108 (only two appear in the drawing), a fixed platen 102 fixed to the uppermost portion of the tie bars 108 by a fixing member 110, and the tie bars 108. A movable platen 104 that can be moved up and down is provided. A through hole 104A is formed in the movable platen 104, and the tie bar 108 passes through the through hole 104A. A toggle link press mechanism 106 is connected to the lower side of the movable platen 104, and the movable platen 104 can be moved up and down by the operation of the toggle link press mechanism 106. Near the lower center of the movable platen 104, although not shown, a resin supply mechanism for supplying resin such as driving the plunger 140 is provided.

  An upper mold 112 is suspended from the fixed platen 102. On the other hand, a lower mold 122 is placed on the movable platen 104. As a result, when the movable platen 104 moves up and down, the upper mold 112 and the lower mold 122 are brought into contact with and separated from each other.

  A removable upper chase 114 is provided on the surface of the upper mold 112 (the lower mold 122 side surface). On the other hand, the lower chase 124 is provided on the surface of the lower mold 122 (the upper mold 112 side surface). These upper chase 114 and lower chase 124 can be appropriately replaced only in accordance with the type of a molded product such as a substrate to be sealed and a lead frame, for example. Reference numeral 116 and reference numeral 126 are backing plates.

  In addition, a plunger 140 is provided at a substantially central portion of the lower mold 122 in a plan view, and a resin (sealing material) melted by the plunger 140 is pushed out, and the pushed resin passes through a runner and a gate. And the cavity 142 is filled.

  Reference numeral 144 denotes an eject pin, which is a mechanism for releasing the molded product after resin sealing from the mold. Reference numeral 150 denotes a lead frame on which a semiconductor chip is mounted. In the present embodiment, two lead frames 150 are arranged for the pair of molds 112 and 122, and two lead frames at a time can be sealed with resin. Of course, the number of lead frames arranged may be one or three or more.

  In the present embodiment, the upper mold 112 is not directly suspended from the fixed platen 102 but is suspended via the upper support plate 130. Further, the lower mold 122 is not placed directly on the movable platen 104 but is placed via the lower support plate 132. Further, these support plates 130 and 132 are configured to be smaller than the sizes of the molds 112 and 122 (the size and width in the horizontal direction in FIG. 1). That is, when the toggle link type press mechanism 106 operates and press pressure is applied from the platens 102 and 104 to the molds 112 and 122, the press pressure is input to the entire surfaces of the molds 112 and 122. Instead, it is configured to input only to the portions corresponding to the support plates 130 and 132.

  Next, the relationship between the platens 102 and 104 and the molds 112 and 122 will be described in detail with reference to FIG. Since FIG. 2 is shown as a simplified diagram for ease of explanation, there are portions in which the constituent ratios and the like of each portion are different from those in FIG. Further, when the contact / separation direction between the upper mold 112 and the lower mold 122, that is, the opening / closing direction is the Z direction, the direction orthogonal to the Z direction will be described as the X direction.

  As shown in FIG. 2, in the present embodiment, the lower mold 122 is supported from the movable platen 104 via the lower support plate (support member) 132. Further, the width (support region) W1 of the support plate 132 in the X direction is the entire lead frame 150 when the position of the lead frame 150 clamped by the upper mold 112 and the lower mold 122 is projected in the Z direction. Here, since the two lead frames 150 are arranged, the two lead frames are considered as one group, the width in the X direction (distance between both ends) is the same. The same applies to the width of the upper support plate 130 in the X direction. Here, the maximum lead frame (molded product) 150 clamped by the upper and lower molds 112 and 122 is considered as a reference. That is, by replacing each chase 114 and 124 as appropriate, different types of lead frames can be sealed with resin. In such a case, the maximum possible (in the X direction) that can be clamped. The largest leadframe is the reference. In this embodiment, the width of the lead frame in the X direction (distance between both ends) is set to “below”. However, for example, if the width of both ends is slightly exceeded, the predetermined effect of the present invention cannot be obtained at all. However, a corresponding effect can be expected up to about 1.2 times the width of both ends.

  Although not shown, when the direction perpendicular to both the X direction and the Z direction is the Y direction, the support plate 132 is located on the inner side of the outermost periphery of the lead frame 150 (including the same position) in the XY plane. ).

  With such a configuration, the press pressure transmitted from the toggle link type press mechanism 106 to the movable platen 104 is transmitted to the lower mold 122 side in a state of being concentrated on the lower support plate 132 portion. Is done. Further, the press pressure transmitted to the fixed platen 102 is transmitted to the upper mold 112 side in a state of being concentrated on the upper support plate 130. That is, it is possible to apply the pressing pressure more directly (vertically) to the “portion where the lead frame 150 is disposed”, which is the portion that needs to be pressed in the most uniform state. Further, since the press pressure is concentrated near the center of the mold (center in plan view), it is possible to prevent the entire mold from being greatly distorted even during clamping. As a result, the “per die” of the upper and lower molds 112 and 122 is less likely to be biased, and adjustment work per die becomes easy or unnecessary.

  In the present embodiment, the lower support plate 132 and the upper support plate 130 are configured as separate members from the platens 102 and 104 and the molds 112 and 122. However, the present invention is not necessarily limited to such a mode. For example, by projecting a part of the shape of each of the platens 102 and 104 (for example, by cutting a part of the platen), it is possible to perform the same function as the support plates 130 and 132. It is also possible to perform the same function by projecting a part of each mold 112, 122 (for example, by cutting a part of the mold).

  Further, the height (Z-direction dimension) H1 of the lower support plate 132 is larger than the bending deformation amount H2 of the movable platen 104 in a state in which the pressing pressure is applied to the movable platen 104 by the toggle link type press mechanism. It is comprised so that it may become. That is, with such a configuration, it is possible to appropriately maintain the indication area W1 even when the movable platen 104 is curved.

<Other Embodiments of the Present Invention>
Next, a second embodiment of the present invention will be described with reference to FIG. In the following description, the same or similar parts as those of the resin sealing device 100 described above are denoted by the same reference numerals in the last two digits, and the description of the overlapping configuration and operation is omitted.

  In the second embodiment, the upper and lower support plates are configured to correspond to the lead frames to be clamped. That is, as shown in FIG. 3, when two lead frames 250 are clamped by a pair of molds 212 and 222, each support plate corresponds to each lead frame 250. It is provided one by one. Specifically, the two upper support plates 230A and 230B and the two lower support plates 232A and 232B correspond to the lead frame 250, respectively.

  Here, when each lead frame 250 is projected in the press direction (Z direction), the support region W2 in the X direction in which the lower die 222 is supported from the movable platen 204 (that is, the press input from the movable platen 204). The pressure input area (the width of each support plate) is set to be equal to or less than the width corresponding to both ends of each lead frame 250 (meaning individual lead frame) in the X direction. This makes it possible to transmit the force more directly to the portion where the press pressure should be concentrated. The same applies to the upper support plates 230A and 230B.

  Even when the support plates are arranged and configured corresponding to the individual lead frames as described above, these support plates are not necessarily configured by independent members. For example, as shown in FIG. 4, the molds 312 and 322 may be integrated with the mold as a part of the molds 312 and 322. Although not shown, the platen may be integrated with the platen.

  By adopting such a configuration, the “per die” state of the upper and lower molds can be maintained well from the beginning. As a result, the die-to-die adjustment mode by a shim or the like due to trial and error is simplified or unnecessary.

  The present invention is suitable as a resin sealing device that seals a substrate on which a semiconductor chip is mounted, a lead frame, and the like with a resin.

Side sectional drawing of the resin sealing apparatus which is an example of embodiment of this invention The figure which showed typically the relationship between the metal mold | die and platen in FIG. The figure which showed the 2nd Embodiment of this invention The figure which showed the 3rd Embodiment of this invention Resin sealing device described in Patent Document 1 Enlarged view around the mold

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing apparatus 102 ... Fixed platen 104 ... Movable platen 104A ... Through-hole 106 ... Toggle link type press mechanism 108 ... Tie bar 112 ... Upper die 114 ... Upper chase 116, 126 ... Backing plate 122 ... Lower die 124 ... Lower chase 130 ... Upper support plate 132 ... Lower support plate 140 ... Plunger 142 ... Cavity 144 ... Eject pin 150 ... Lead frame

Claims (8)

The first and second molds supported by the platen can be opened and closed in the Z direction by a toggle link type press mechanism via the platen, and the molded product is clamped by the first and second molds. It is a resin sealing device that seals the molded article with a resin filled in the state,
When the direction perpendicular to the Z direction is the X direction,
Of the first and second molds, at least the mold on the side interlocked with the toggle link type press mechanism is supported from the platen in the X-direction support region. A resin sealing device, wherein the width of the molded product is equal to or less than the width in the X direction when a maximum molded product that can be clamped by a mold is placed. In claim 1,
A plurality of the molded articles are arranged,
The support region is equal to or less than the width in the X direction in the entire molded product. In claim 1,
A plurality of the molded articles are arranged,
The resin sealing device, wherein the support region is equal to or less than the width in the X direction for each article to be molded. The first and second molds supported by the platen can be opened and closed in the Z direction by a toggle link type press mechanism via the platen, and the molded product is clamped by the first and second molds. It is a resin sealing device that seals the molded article with a resin filled in the state,
When the plane orthogonal to the Z direction is an XY plane,
Of the first and second molds, at least the molds on the side interlocked with the toggle link type press mechanism are supported by the platen in the XY plane support area. A resin-sealing device, wherein the largest molded product that can be clamped by the mold is placed inside the outermost periphery of the molded product on the XY plane. In any one of Claims 1 thru | or 4,
The resin sealing device, wherein the support region is formed by interposing a support member between the mold and the platen. In claim 5,
The resin sealing device, wherein the Z-direction dimension of the support member is equal to or greater than the bending deformation amount of the platen when the toggle link press mechanism is operated. In any one of Claims 1 thru | or 4,
The resin sealing device, wherein the support region is formed by cutting a part of at least one of the mold or the platen. In claim 7,
The resin-sealing device, wherein the dimension of the cut portion in the Z direction is equal to or greater than the amount of bending deformation of the platen when the toggle link press mechanism is operated.

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