JP2013006408A - Mold apparatus for injection molding and injection molding machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To greatly miniaturize a mold apparatus for injection molding, and greatly reduce power consumption spent for a series of injection molding.SOLUTION: First protrusion members 12 are provided at two side surfaces of a stationary mold 1 that has a first parting surface 11. Moreover, second protrusion members 22 are provided at two side surfaces that are the side surfaces of a mobile mold 2 that has a second parting surface 21 that is the same shape and same size with the first parting surface 11 and exist in the position not opposing to the first protrusion member 12 when mold clamping the stationary mold 1 and the mobile mold 2. As a result, the positioning of the stationary mold 1 and the mobile mold 2 is made by joining of the first protrusion member 12 with the side surface of the mobile mold 2 and by joining of the second protrusion members 22 with the side surface of the stationary mold 1, and the necessity for providing the guide pin for a positioning concerned is lost. Moreover, the heat capacity of the stationary mold 1 and the mobile mold 2 can be reduced by the miniaturization, and the power consumption required for temperature control can be reduced.

Description

  The present invention relates to an injection mold apparatus and an injection molding machine, and more particularly to an injection mold apparatus for manufacturing a resin product using a fixed mold and a movable mold, and an injection molding machine using the same.

  Conventionally, the injection molding method is known as the most widely used among the various molding methods for resin products. An injection molding machine is used to manufacture a resin product by the injection molding method. An injection mold is attached to a portion corresponding to the heart of the injection molding machine. By forming the cavity of this injection mold into a desired shape, a resin product (molded product) having a desired shape is formed (for example, see Patent Documents 1 and 2).

  Injection molds are classified into two-plate molds (single-stage sprue molds), sleep-rate molds (two-stage sprue molds), and hot runner molds (spruless molds) according to their basic structure. Is done.

  The two-plate mold includes two plates of a movable mold (male mold) and a fixed mold (female mold), and is a space portion having the same shape as a molded product by a male convex surface and a female concave surface. A cavity is formed. The sprue is only in the first stage (on the fixed mold side), and the molten resin follows the sprue, runner and gate from the nozzle of the molding machine and reaches the cavity. The two-plate mold has the simplest structure, but the molded product (the product formed by the resin in the cavity) and the runner part (the part formed by the resin remaining in the sprue runner gate) are integrated from the mold. Therefore, there is a demerit that the runner part must be cut out after taking out.

  The sleep rate mold includes three plates, a movable mold (male mold), a fixed mold (female mold), and a runner stripper plate. Also in the sleep rate mold, a cavity is formed by a male convex surface and a female concave surface. The sprue is in the first stage (fixed mold side) and the second stage (movable mold side), and the molten resin injected from the nozzle of the molding machine passes through the first stage sprue and then passes through the runner 2 It reaches the cavity through the sprue of the step. The sleep rate mold has a more complicated structure than the two-plate mold, but has an advantage that the molded product and the runner part can be taken out separately.

  In the hot runner mold, the sprue portion that is a flow path of the molten resin is constantly heated so that the resin remaining in the sprue portion is not cooled and solidified. Although this hot runner mold has a complicated structure, there is no runner portion, so there is an advantage that it is possible to eliminate the trouble of taking out the runner portion every time molding is performed.

  FIG. 1 is a diagram showing a configuration example of a two-plate mold having the simplest structure. In FIG. 1, 101 is a fixed type and 102 is a movable type, both of which are constituted by thick plates having a square cross section. A cavity 103 that is a space having the same shape as the molded product is formed by the concave surface formed in a part of the fixed mold 101 and the convex surface formed in a part of the movable mold 102. A guide pin 104 is used for positioning the fixed mold 101 and the movable mold 102. Usually, four guide pins 104 are provided near the four corners of the fixed mold 101 and the movable mold 102.

  Reference numeral 105 denotes a fixed-side attachment plate for attaching the solid mold 101 to a molding machine (not shown, the same applies hereinafter). 106 is a sprue, 107 is a runner, and 108 is a gate, and these form a flow path of molten resin. The sprue 106 indicates a resin flow path from the nozzle 100 to the runner 107 of the molding machine. The runner 107 indicates a resin flow path from the sprue 106 to the gate 108. The gate 108 refers to an inlet for injecting molten resin into the cavity 103.

  109 is a receiving plate, which is used for the purpose of reducing the thickness of the movable mold 102. Reference numeral 110 denotes a spacer block, which is a plate for securing a space necessary for a pushing operation for taking out a molded product from the cavity 103. Reference numeral 111 denotes an ejection pin, which is used for taking out a molded product from the cavity 103. Reference numeral 112 denotes a return pin, which is thicker than the protruding pin 111 in order to increase the strength. After the molded product is taken out from the cavity 103, the protruding pin 111 is pushed back to the original position by applying the return pin 112 to the fixed mold 101.

  Reference numeral 113 denotes an ejector plate to which a protruding pin 111 is attached. The ejector plate 113 to which the ejection pin 111 is attached is pushed out by an ejector mechanism (not shown) of the molding machine, whereby the molded product is taken out from the cavity 103 by the ejection pin 111. Reference numeral 114 denotes a movable side mounting plate for mounting the movable mold 102 to the molding machine. Reference numeral 115 denotes a cooling water hole, which is a flow path through which cooling water for cooling the mold flows.

  Injection molding using the two-plate mold configured as described above is performed in the order of mold clamping, injection, holding pressure, cooling, mold opening, and mold release. In the mold clamping process, by operating a mold clamping mechanism (not shown) of the molding machine, both the fixed mold 101 attached to the fixed side mounting plate 105 and the movable mold 102 attached to the movable side mounting plate 114 are moved. Press down with a predetermined tightening force.

  In the injection process, resin melted at high pressure and high temperature is poured into the mold, and the cavity 103 is filled with the molten resin. In the pressure-holding step, pressure is continuously applied to the mold while the molten resin is additionally filled so that the molten resin is firmly distributed in the mold. In addition, the pressure applied at the time of holding pressure may be smaller than that during resin filling.

  The cooling process proceeds almost simultaneously with the pressure holding process. In the cooling process, the mold is cooled to a certain temperature or less by flowing cooling water through the cooling water holes 115 opened at a certain depth from the mold surface. After the molded product is cooled and sufficiently hardened by this cooling, the movable mold 102 is opened in the mold opening process, and the molded product hugging the movable mold 102 is ejected by the ejecting pin 111 in the mold releasing process. Take out.

JP 2000-135724 A JP 2007-30441 A

  As described above, when a molded product is manufactured with a conventional injection mold, a resin melted at high pressure and high temperature is poured into the mold and cooled while keeping the pressure constant. The flow path (sprue 106, runner 107, gate 108) through which the molten resin flows is thin, and the molten resin is gradually cooled and solidified when flowing through the flow path. In order to suppress the resin solidification as much as possible, it is necessary to fill the molten resin heated to a high temperature into the cavity 103 in a short time by applying a large pressure.

At this time, the pressure of the molten resin injected into the mold is extremely large, ranging from ²⁰⁰ to 500 kgf / cm ² , although it depends on the viscosity of the resin. In order to prevent mold opening even when this large injection pressure is applied to the molten resin, a large pressure is also required for mold clamping. For example, the injection pressure of the molten resin is is 300 kgf / cm ^2, the mold clamping direction of the projected area of the molded product and was 1,200Cm ^2, molten resin injection pressure is applied in the mold in 360Ton as large as the force Will try to open. That is, a clamping force of 360 Ton or more is required for mold clamping. Therefore, in order to obtain the injection pressure of the molten resin and the mold clamping pressure of the mold, there is a problem that a large amount of power is consumed.

  Further, when the molten resin flowing through the flow path is solidified, a larger injection pressure is required. Therefore, in order to prevent the resin solidification from occurring, it is necessary to heat the mold to a high temperature. Therefore, there is a problem that a large amount of power is consumed even when the mold is heated. Moreover, since the mold is large and the heat capacity is large, the mold cannot be heated up to the melting point of the resin, and solidification of the resin cannot be prevented completely. Therefore, even when the mold is heated, a large injection pressure is still required, and a large amount of power is consumed. In addition, after the cavity 103 is filled with the molten resin, it is necessary to flow the cooling water through the cooling water holes 115 to cool the mold to a certain temperature. There is also a problem that a large amount of power is consumed during the cooling.

  Furthermore, in order to obtain rigidity that can withstand a large pressure of several hundred tons, the material of the fixed mold 101 and the movable mold 102 must be an alloy using a steel material, and the wall thickness must be increased. Accordingly, the fixed side mounting plate 105 and the movable side mounting plate 114 need to be large. Further, it is necessary to provide a guide pin 104 for positioning the fixed mold 101 and the movable mold 102, and it is necessary to provide a spacer block 110, a protruding pin 111, a return pin 112, and an ejector plate 113 for taking out a molded product. is there. In order to equip them, it is necessary to increase the width of the fixed mold 101 and the movable mold 102.

  Therefore, the mold as a whole is extremely large compared to the molded product, and there is a problem that a large space is required for installation. Generally, the volume ratio of the mold to the molded product is about 300 to 2,000 times, and the weight ratio is about 2,000 to 10,000 times. As described above, conventionally, it is necessary to use a mold which is several hundred to several thousand times larger in order to produce a molded product, and it must be said that the waste of installation space is extremely large. Moreover, since pressure control and temperature control must be performed on such a large and heavy mold, there is a waste of power consumption.

  There are many patent applications that have been devised to reduce wasteful power consumption and installation space of the mold. However, most of the devices found in these patent applications are improvements based on the basic structure of the mold shown in FIG. 1, and the degree of improvement of waste is insufficient. In order to greatly reduce the above waste, a fundamental review of the mold structure is required.

  The present invention has been made to solve such a problem, and can greatly reduce the size of an injection mold device and can greatly reduce the power consumption of a series of injection molding. The purpose is to.

In order to solve the above-described problems, an injection molding die apparatus according to the present invention is a protruding member for positioning a fixed mold and a movable mold, and is provided on a side surface of a fixed mold having a first parting surface. A second parting surface provided on a side surface of the movable type having a first projecting member projecting to the movable mold side from the first parting surface and a second parting surface having the same shape and size as the first parting surface At least one of the second projecting members projecting to the fixed mold side.

  In another aspect of the present invention, a sprue from the nozzle of the molding machine to the cavity is formed in the fixed mold as the flow path of the molten resin.

In still another aspect of the present invention, the fixed mold and the movable mold are made of a high thermal conductivity material, while the fixed mold is provided with a bush around the sprue, and the bush is made of a low thermal conductivity material.
In still another aspect of the present invention, the fixed mold and the movable mold are made of a low thermal conductivity material, while cooling water holes are provided around the cavity, and the cavity and the cooling water hole are made of a high thermal conductivity material. is doing.

In yet another aspect of the present invention, a take-out mechanism for taking out a molded product hugging a fixed mold cavity by suction is provided.
According to still another feature of the present invention, the fixed die is directly attached to the fixed side mounting plate, and the movable die is directly attached to the movable side mounting plate. Alternatively, the fixed mold is directly attached to the fixed attachment plate, and the movable mold is attached to the movable attachment plate via an adapter that functions as a mounting base.

  According to the present invention configured as described above, the positioning of the fixed mold and the movable mold is performed by joining the first projecting member projecting toward the movable mold with respect to the first parting surface and the side surface of the movable mold, and the second. Since it is performed by at least one of joining the second projecting member projecting to the fixed mold side with respect to the parting surface and the side surface of the fixed mold, it is not necessary to provide a guide pin for the positioning. Thereby, the width | variety of a fixed mold | type and a movable mold | type can be made small by the part which does not need to provide a guide pin. As a result, the injection mold apparatus can be downsized as a whole.

  Also, if the fixed mold and the movable mold are downsized, the heat capacity is reduced, so that the fixed mold and the movable mold are heated during the injection process and the fixed mold and the movable mold are performed during the cooling process so that the resin solidification hardly occurs during the injection process. Cooling of the mold can be realized with less energy than conventional. Thereby, power consumption required for temperature control in the injection process and the cooling process can be reduced.

  According to another aspect of the present invention, there is no runner on the flow path from the nozzle of the molding machine to the cavity, and the flow path can be shortened compared to the prior art. For this reason, solidification of the molten resin on the flow path can be made difficult to occur, and accordingly, the injection pressure to be pressurized against the molten resin can be reduced.

  Thereby, the pressurization with respect to the molten resin performed at the time of an injection process can be implement | achieved with less energy compared with the past, and the power consumption required for the pressure control in an injection process can be reduced. Further, if the injection pressure can be reduced, the pressure required for mold clamping can also be reduced, so that the power consumption required to obtain the mold clamping pressure can also be reduced.

  Furthermore, if the injection pressure can be reduced, it becomes possible to reduce the thickness of the fixed type and the movable type for the purpose of pressure resistance. That is, by omitting the guide pins as described above, the width of the fixed mold and the movable mold can be reduced, and the wall thickness can be reduced. As a result, the heat capacities of the fixed mold and the movable mold are further reduced, so that the heating during the injection process and the cooling during the cooling process can be realized with less energy. Thereby, by reducing the thickness of the fixed mold and the movable mold, the injection mold apparatus can be reduced as a whole, and the power consumption required for temperature control can be further reduced.

  According to still another aspect of the present invention, when the molten resin is flowing through the sprue, it is difficult for heat to be taken away by the low thermal conductivity material formed around the molten resin, and the progress of resin solidification can be delayed. Thereby, since the injection pressure can be further reduced, the power consumption required for pressure control in the injection process can be further reduced. Accordingly, the pressure required for mold clamping can be further reduced, so that the power consumption required to obtain the mold clamping pressure can be further reduced.

  Furthermore, since the injection pressure can be further reduced, it is possible to further reduce the thickness of the fixed type and the movable type for the purpose of pressure resistance. As a result, the heat capacities of the fixed mold and the movable mold are further reduced, so that the heating during the injection process and the cooling during the cooling process can be realized with less energy. Thereby, by further reducing the thickness of the fixed mold and the movable mold, the injection mold apparatus can be further reduced in size as a whole, and the power consumption required for temperature control can be further reduced.

  According to still another aspect of the present invention, since it has a configuration for taking out the molded product by means other than the ejection, the ejection pin for taking out the molded product hugging the movable mold as in the prior art, and its There is no need to provide return pins, ejector plates, spacer blocks, etc., which are related members. The widths of the fixed mold and the movable mold can be further reduced by eliminating the need for these members, and the injection molding mold apparatus can be further downsized as a whole.

  Further, when the fixed mold and the movable mold are further downsized, the heat capacity is further reduced, so that the heating during the injection process and the cooling during the cooling process can be realized with less energy. Thereby, the power consumption required for temperature control in the injection process and the cooling process can be further reduced.

It is a figure which shows the structural example of the conventional two plate metal mold | die. It is a figure which shows the structural example of the mold apparatus for injection molding by this embodiment. It is a figure which shows the structural example of the injection molding machine using the mold apparatus for injection molding by this embodiment. It is a figure which shows the modification of the 1st protrusion member by this embodiment, and a 2nd protrusion member. It is a figure which shows the modification of the injection molding machine using the mold apparatus for injection molding by this embodiment. It is a figure which shows the modification of the taking-out mechanism used for the mold apparatus for injection molding by this embodiment. It is a figure which shows the modification of the resin flow path used for the injection mold apparatus by this embodiment.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a diagram illustrating a configuration example of the injection molding die apparatus 10 according to the present embodiment. 2A shows a state where the mold is opened, and FIG. 2B shows a state where the mold is clamped. FIG. 2C is a perspective view schematically showing the main part of the injection molding die apparatus 10. FIG. 2D is a partially enlarged view of the protruding member.

  In FIG. 2, the fixed mold 1 is a plate having a square cross section, for example, and has a flat first parting surface 11 on one surface thereof. The movable mold 2 is also a plate having a square cross section, for example, and has a flat second parting surface 21 facing the first parting surface 11 on one surface thereof. The first parting surface 11 and the second parting surface 21 have the same shape and the same size, and are formed so as to be bonded over the entire surface (excluding the portion of the cavity 3) when the fixed mold 1 and the movable mold 2 are clamped. ing.

  A part of the side surface of the fixed mold 1 is provided with a first projecting member 12 that projects from the first parting surface 11 to the movable mold 2 side. In the present embodiment, the first projecting member 12 is provided on two side surfaces located on the opposite side of a pair of quadrangles forming the first parting surface 11 among the four side surfaces of the fixed mold 1. . The first projecting member 12 is a rectangular flat plate that covers the entire side surface and has a portion projecting to the movable mold 2 side. Inside the protruding portion, a tapered slope is formed as shown in FIG. The first protruding member 12 is fixed to the two side surfaces of the fixed mold 1 by, for example, screwing.

  A part of the side surface of the movable mold 2 is provided with a second projecting member 22 that projects to the fixed mold 1 side from the second parting surface 21. In the present embodiment, the second projecting member 22 has two side surfaces at positions that do not face the first projecting member 21 when the fixed mold 1 and the movable mold 2 are clamped among the four side surfaces of the movable mold 2. Is provided. That is, the second projecting member 22 is a pair of opposite sides of a quadrangle that forms the second parting surface 21, and is formed on two side surfaces that are located on the opposite sides different from the opposite side on which the first projecting member 12 is provided. Is provided.

  The second projecting member 22 is a rectangular flat plate that covers substantially the entire one side surface (entirely excluding the portion of the cooling water hole 5 described later) and has a portion projecting to the fixed mold 1 side. A tapered inclination similar to that in FIG. 2D is also formed inside the protruding portion of the second protruding member 22. The second projecting member 22 is also fixed to the two side surfaces of the movable mold 2 by, for example, screwing. By forming a tapered slope inside the protruding portion of the first protruding member 12 and inside the protruding portion of the second protruding member 22, the fixed mold 1 and the movable mold 2 can be separated when the mold is clamped. It is guided by a taper so that the position is correctly aligned.

  A cavity 3 is formed by providing a recess with respect to the first parting surface 11. In the case of the example in FIG. 2, the space shape of the recess itself is the shape of the cavity 3, which is the shape of the molded product. Therefore, the space shape of the recessed part which comprises the cavity 3 can be made into a desired shape according to the shape of a molded article.

  Reference numeral 4 denotes a sprue provided in the fixed mold 1, thereby forming a flow path of the molten resin from the nozzle 200 to the cavity 3 of a molding machine (not shown, the same applies hereinafter). A gate is provided at the tip of the sprue 4 on the cavity 3 side. In the present embodiment, no runner is provided between the sprue 4 and the cavity 3. That is, the molten resin injected from the nozzle 200 of the molding machine reaches the cavity 3 directly through the sprue 4.

  A cooling water hole 5 is provided in both the fixed mold 1 and the movable mold 2. The cooling water hole 5 is a flow path through which cooling water for cooling the fixed mold 1 and the movable mold 2 flows. The reason why the fixed mold 1 and the movable mold 2 are cooled is to cool and harden the molten resin filled in the cavity 3. Therefore, in order to enhance this cooling effect, it is preferable to provide the cooling water holes 5 around the cavity 3 in the fixed mold 1. Moreover, in the movable mold | type 2, it is preferable to provide the cooling water hole 5 in the convex part which comes closest to the cavity 3 when mold clamping is carried out like FIG.2 (b). In order to improve heat conduction from the cooling water hole 5 to the cavity 3, the fixed mold 1 and the movable mold 2 are preferably made of a steel material having a high heat conductivity.

  As shown in FIGS. 2A and 2B, the second projecting member 22 does not cover and close the cooling water hole 5 on the fixed mold 1 side and the cooling water hole 5 on the movable mold 2 side. In addition, a notch 23 is provided. In FIG. 2C, only the arrangement relationship between the first projecting member 12 and the second projecting member 22 is shown in a simplified manner, and therefore the notch 23 is not shown.

  Reference numeral 6 denotes a bush formed around the sprue 4 and is made of a material (for example, ceramic) having a lower thermal conductivity than the steel material. In the present embodiment, the bush 6 is formed so as to cover the periphery of the sprue 4. Any material other than ceramic may be used as long as it has a lower thermal conductivity than the steel material used for the fixed mold 1 and the movable mold 2.

  When the bush 6 is configured in this way, since the thermal conductivity of the bush 6 is low, it becomes difficult for heat to be taken away from the molten resin flowing through the sprue 4 during the injection process, and the resin in the sprue 4 The progress of solidification can be delayed. Further, the cooling temperature due to the cooling water is not easily transmitted to the bush 6 during the cooling step, and the molten resin remaining in the sprue 4 can be kept at a relatively high temperature.

  Reference numeral 7 denotes a fixed-side attachment plate for attaching the solid mold 1 to the molding machine. Reference numeral 8 denotes a movable side mounting plate for mounting the movable mold 2 on the molding machine. In the present embodiment, the movable die 2 is not directly attached to the movable attachment plate 8 via a receiving plate or a spacer block, but the movable die 2 is directly attached to the movable attachment plate 8.

  When the fixed mold 1 is mounted on the fixed side mounting plate 7 and the movable mold 2 is mounted on the movable side mounting plate 8, the fixed mold 1 is first fixed to the center of the sprue hole and the center of the nozzle hole of the fixed side mounting plate 7, The mold is clamped in a state where the movable mold 2 is temporarily fixed to the movable side mounting plate 8. At this time, the first projecting member 12 projecting to the movable mold 2 side from the first parting surface 11 and the side surface of the movable mold 2 are joined, and the second parting surface 21 projects to the fixed mold 1 side. The fixed mold 1 and the movable mold 2 are positioned by joining the second projecting member 22 and the side surface of the fixed mold 1.

  That is, the two first projecting members 12 provided on the opposing side surfaces of the fixed mold 1 and the two opposing side surfaces of the movable mold 2 (the side surfaces on which the second projecting member 22 is not provided) are joined together, The fixed mold 1 and the movable mold 2 are positioned in the first direction in which the two first projecting members 12 face each other.

  At the same time, the two second projecting members 22 provided on the opposing side surfaces of the movable mold 2 and the two opposing side surfaces (the side surfaces on which the first projecting member 12 is not provided) of the fixed mold 1 are joined, respectively. The fixed mold 1 and the movable mold 2 are positioned with respect to a second direction (a direction perpendicular to the first direction) in which the two second projecting members 22 face each other.

  When the fixed mold 1 and the movable mold 2 are positioned in this way, the movable mold 2 is permanently fixed to the movable side mounting plate 8.

  FIG. 3 is a diagram showing a configuration example of an injection molding machine using the injection molding die apparatus 10 configured as described above. In FIG. 3, components having the same functions as those shown in FIG. 2 are denoted by the same reference numerals. Further, since the configuration of the injection molding die apparatus 10 has already been described in detail, a part of the illustration is omitted and is simply shown.

  In FIG. 3, reference numeral 9 denotes a take-out mechanism for taking out a molded product hugging the cavity 3 of the fixed mold 1 by suction. In the present embodiment, the take-out mechanism 9 includes an arm 9a having a plurality of joints and a suction pad 9b provided at the tip of the arm 9a, and takes out a molded product from the cavity 3 by, for example, vacuum suction.

  Reference numeral 30 denotes a tie bar, one end of which is fixed to the fixed mounting plate 7 and the other end is inserted into a hole provided in the movable mounting plate 8. The tie bar 30 serves as a guide for guiding the movement path when the movable mold 2 moves together with the movable attachment plate 8. Reference numeral 300 denotes a hydraulic cylinder which controls the movement of the movable side mounting plate 8 (and the movable mold 2 attached thereto).

  201 is a cylinder of the molding machine, 202 is a screw, 203 is a hopper, 204 is a hydraulic motor, and 205 is a heater. The raw material resin charged from the hopper 203 is heated by the heater 205 in the cylinder 201 and kneaded by the screw 202, and is injected from the nozzle 200 at the tip of the cylinder 201 toward the injection molding die apparatus 10.

  Next, the operation of the injection molding die apparatus 10 configured as described above according to the present embodiment will be described. The injection molding by the injection molding die apparatus 10 of the present embodiment is performed in the order of mold clamping, injection, holding pressure, cooling, mold opening, and mold release, as in the prior art.

  In the first mold clamping step, the fixed cylinder 1 and the movable mold are moved by moving the movable side mounting plate 8 and the movable mold 2 attached thereto in the direction of the fixed mold 1 by operating the hydraulic cylinder 300 of the molding machine. Clamp both of the two at a predetermined pressure. At this time, the take-out mechanism 9 is retracted. When the fixed mold 1 and the movable mold 2 are clamped, the first parting surface 11 and the second parting surface 21 are joined as shown in FIG.

  At this time, the first projecting member 12 projecting to the movable mold 2 side from the first parting surface 11 and the side surface of the movable mold 2 are joined, and the second parting surface 21 projects to the fixed mold 1 side. The fixed mold 1 and the movable mold 2 are positioned by joining the second projecting member 22 and the side surface of the fixed mold 1.

  In the injection process, the resin melted in the cylinder 201 of the molding machine is poured into the injection mold apparatus 10 and the cavity 3 is filled with the molten resin. In the pressure-holding step, pressure is continuously applied to the injection mold apparatus 10 while additionally filling the molten resin so that the molten resin is firmly filled in the cavity 3. In addition, the pressure applied at the time of holding pressure may be smaller than that during resin filling. The cooling process proceeds almost simultaneously with the pressure holding process. In the cooling step, the fixed mold 1 and the movable mold 2 are cooled to a certain temperature or lower by flowing cooling water through the cooling water holes 5.

  After the molten resin is cooled in the cavity 3 and sufficiently hardened as a molded product, in the mold opening process, the hydraulic cylinder 300 is operated in the reverse direction to move the movable mold 2 away from the fixed mold 1. In the mold release step, the arm 9a of the take-out mechanism 9 is moved to the space formed between the fixed mold 1 and the movable mold 2 so that the molded product hugging the fixed mold 1 is adsorbed to the suction pad 9b. And take it out. Here, the resin (molded product) in the cavity 3 is sufficiently hardened by cooling, but the molten resin remaining in the sprue 4 is kept at a relatively high temperature. The tip of the sprue 4 has a gate structure. Therefore, only the molded product in the cavity 3 can be separated from the resin in the sprue 4 and taken out.

  As described above in detail, in the injection mold apparatus 10 of the present embodiment, the two side surfaces of the fixed mold 1 having the first parting surface 11 protrude toward the movable mold 2 side from the first parting surface 11. A first projecting member 12 is provided. Further, the movable mold 2 has a second parting surface 21 having the same shape and size as the first parting surface 11, and when the fixed mold 1 and the movable mold 2 are clamped, A second projecting member 22 projecting toward the fixed mold 1 side from the second parting surface 21 is provided on two side surfaces that are not opposed to each other.

  According to the injection mold apparatus 10 of the present embodiment configured as described above, the first projecting member in which the positioning of the fixed mold 1 and the movable mold 2 projects from the first parting surface 11 to the movable mold 2 side. 12 and the side surface of the movable mold 2, and the second projecting member 22 projecting to the fixed mold 1 side from the second parting surface 21 and the side surface of the fixed mold 1. There is no need to provide guide pins on the board. Since the guide pins need not be provided, the widths of the fixed mold 1 and the movable mold 2 can be reduced.

  Further, in the injection molding die apparatus 10 of the present embodiment, the molded product hugging the cavity 3 of the fixed mold 1 is taken out by suction using the take-out mechanism 9. Conventionally, in order to take out a molded product from a mold using a protruding pin provided on the movable mold side, the molded product can be moved by adopting a structure in which the holding force for the movable mold is larger than that of the fixed mold, for example. I was trying to hug the mold. On the other hand, in the present embodiment, the structure for holding the molded product on the movable mold is not adopted, but the molded product is held on the fixed mold 1. The molded product hugging the fixed mold 1 is taken out by suction.

  Therefore, as in the conventional example shown in FIG. 1, a protruding pin 111 for taking out a molded product hung on the movable mold 102, a return pin 112, an ejector plate 113, a spacer block 110, and the like, which are related members, are provided. There is no need. Therefore, the widths of the fixed mold 1 and the movable mold 2 can be reduced by the amount that these members need not be provided. As described above, the injection mold apparatus 10 can also be reduced in size and weight as a whole.

  If the fixed mold 1 and the movable mold 2 can be reduced in size, the heat capacity becomes small. Therefore, the fixed mold 1 and the movable mold 2 are heated to prevent the resin from solidifying during the injection process, and fixed during the cooling process. Cooling of the mold 1 and the movable mold 2 can be realized with less energy than in the past. Thereby, power consumption required for temperature control in the injection process and the cooling process can be reduced.

  Further, in the injection molding die apparatus 10 of the present embodiment, the sprue 4 is formed in the fixed die 1 as a flow path until the molten resin injected from the nozzle 200 of the molding machine reaches the cavity 3. According to this configuration, there is no runner on the flow path from the nozzle 200 to the cavity 3 of the molding machine, and the flow path can be shortened compared to the conventional case. For this reason, solidification of the molten resin on the flow path can be made difficult to occur, and accordingly, the injection pressure to be pressurized against the molten resin can be reduced.

  Furthermore, in the mold apparatus 10 for injection molding of this embodiment, the bush 6 is provided around the sprue 4 and the bush 6 is made of a low thermal conductivity material such as ceramic. Therefore, when the molten resin flows through the sprue 4, it becomes difficult for heat to be taken away by the bushes 6 formed around the molten resin, and the progress of solidification of the resin can be delayed. Thereby, the injection pressure which should be pressurized with respect to molten resin can further be reduced.

  Thereby, the pressurization with respect to the molten resin performed at the time of an injection process can be implement | achieved with less energy compared with the past, and the power consumption required for the pressure control in an injection process can be reduced. Further, if the injection pressure can be reduced, the pressure required for mold clamping can also be reduced, so that the power consumption required to obtain the mold clamping pressure can also be reduced.

  Further, if the injection pressure can be reduced, the thickness of the fixed mold 1 and the movable mold 2 for the purpose of pressure resistance can be reduced. That is, by omitting the guide pins and the projecting pins as described above, the width of the fixed mold 1 and the movable mold 2 can be reduced, and the thickness can be reduced. As a result, the heat capacities of the fixed mold 1 and the movable mold 2 are further reduced, so that the heating during the injection process and the cooling during the cooling process can be realized with less energy. As a result, the thickness of the fixed mold 1 and the movable mold 2 can be reduced, whereby the injection molding mold apparatus 10 can be reduced in size and weight as a whole, and the power consumption required for temperature control can be further reduced. be able to.

  According to the injection mold apparatus 10 of the present embodiment configured as described above, it can be downsized to 1 or less, which is several tenths of the volume and weight, as compared with a conventional mold. Along with the downsizing of the injection molding die device 10, it is possible to reduce the size of the entire injection molding machine that uses it as a heart. Thereby, the waste of the installation space in a factory can be reduced significantly and a factory area can be reduced.

In addition, according to the injection molding die apparatus 10 of the present embodiment, the power consumption required for pressure control and temperature control can be reduced to several tenths or less as compared with a conventional mold. Thereby, waste of power consumption can be significantly reduced and CO ₂ emission amount can be remarkably reduced.

  In the above embodiment, the first parting surface 11 of the fixed mold 1 and the second parting surface 21 of the movable mold 2 are flat, but the present invention is not limited to this. If the first parting surface 11 and the second parting surface 21 are properly joined when the mold is clamped, the shape is arbitrary. However, considering the ease of processing and the like, it is preferable to have a flat shape.

  Moreover, although the said embodiment demonstrated the example which forms the cavity 3 by providing a recessed part with respect to the 1st parting surface 11 of the fixed mold | type 1, this invention is not limited to this. For example, the cavity 3 may be formed by providing a recess with respect to the second parting surface 21 of the movable mold 2, or the recesses may be formed on both the first parting surface 11 and the second parting surface 21. The cavity 3 may be formed by providing. Alternatively, the cavity 3 is formed by the space formed between the recessed portion and the projecting portion by mold clamping by providing the recessed portion on the first parting surface 11 and the projecting portion on the second parting surface 21. You may make it do.

  Moreover, although the said embodiment demonstrated the example which provides the 1st protrusion member 12 over the whole surface of one side of the fixed mold | type 1, this invention is not limited to this. For example, as shown in FIG. 4A or FIG. 4B, the first protruding member 12 may be provided on a part of one side surface of the fixed mold 1. Similarly, the second projecting member 22 may be provided on a part of one side surface of the movable mold 2.

  As shown in FIG. 4A, when the first projecting member 12 and the second projecting member 22 are provided together at two corners, the fixed mold 1 is formed at two corners where these projecting members 12 and 22 are not provided. And the movable mold 2 are prevented from being displaced from each other, the widths of the first projecting member 12 and the second projecting member 22 are equal to or larger than a certain width (for example, 1/2 the width of the side surfaces of the fixed mold 1 and the movable mold 2). The above is preferable. In FIG. 4A, one first projecting member 12 or second projecting member 22 is provided on one side surface, but a plurality of first projecting members 12 or second projecting members 22 are provided on one side surface. May be.

  Thus, when it comprises so that the 2nd protrusion member 22 may be provided in a part of one side surface of the movable mold | type 2, even if it does not process the notch part 23 like FIG. And the 2nd protrusion member 22 can be arrange | positioned avoiding the cooling water hole 5 of the movable mold | type 2 side. Since the notch part 23 is unnecessary, the process of the 2nd protrusion member 22 is easy.

  Moreover, although the said embodiment demonstrated the example provided with the 1st protrusion member 12 and the 2nd protrusion member 22 in both the side surface of the fixed mold | type 1 and the movable mold | type 2, the side surface of the fixed mold | type 1 or the movable mold | type 2 was demonstrated. The first projecting member 12 or the second projecting member 22 may be provided only on either one of the side surfaces. For example, FIG. 4C shows a plan view of a state in which a plurality of second projecting members 22 are provided only on the side surfaces of the second projecting member 22. As described above, when the protruding member is provided only on one of the side surface of the fixed mold 1 or the side surface of the movable mold 2, it is preferable to provide the protruding member on all the side surfaces.

  Moreover, although the said embodiment demonstrated the example which comprises the 1st protrusion member 12 and the 2nd protrusion member 22 with a rectangular flat plate, this invention is not limited to this. If the first projecting member 12 and the side surface of the movable mold 2 are joined, and the second projecting member 22 and the side surface of the fixed mold 1 are joined, the shapes of the first projecting member 12 and the second projecting member 22 are arbitrary. is there.

  Moreover, although the fixed mold | type 1 and the movable mold | type 2 were demonstrated in the said embodiment about the example which comprises a square cross section, this invention is not limited to this. That is, the shape of the first parting surface 11 and the second parting surface 21 is not limited to a quadrangle.

  For example, the fixed mold 1 and the movable mold 2 may be configured by a plate having a hexagonal cross section, and the shapes of the first parting surface 11 and the second parting surface 21 may be hexagonal. In this case, among the hexagonal sides constituting the first parting surface 11, for example, the first projecting members 12 are provided on three side surfaces on which three sides that are not adjacent to each other are located. Further, among the hexagonal sides constituting the second parting surface 21, the second projecting member 22 is formed on three side surfaces that are not adjacent to each other and that are not opposed to the first projecting member 12. Is provided. The same applies to the case where the first parting surface 11 and the second parting surface 21 are constituted by other polygons having an even number of sides.

  Alternatively, the fixed mold 1 and the movable mold 2 may be configured by a plate having a pentagonal cross section, and the shapes of the first parting surface 11 and the second parting surface 21 may be pentagons. In this case, among the sides of the pentagon forming the first parting surface 11, for example, the first protruding members 12 are provided on two side surfaces where two sides that are not adjacent to each other are located. Moreover, the 2nd protrusion member 22 is provided in three side surfaces in which the edge | side which does not oppose the 1st protrusion member 12 among the sides of the pentagon which comprises the 2nd parting surface 21 is located. The same applies when the first parting surface 11 and the second parting surface 21 are configured by other polygons having an odd number of sides.

  Alternatively, the fixed mold 1 and the movable mold 2 may be configured by plates having a circular cross section, and the shapes of the first parting surface 11 and the second parting surface 21 may be circular. In this case, of the circumferences constituting the first parting surface 11, for example, two side surfaces corresponding to two arcs (for example, arcs having a center angle of 90 degrees) at positions facing each other across the center of the circle The 1st protrusion member 12 is provided in this. In addition, the second projecting member is formed on two side surfaces corresponding to an arc (for example, an arc having a central angle of 90 degrees) at a position that does not face the first projecting member 12 in the circumference constituting the second parting surface 21. 22 is provided.

  To cut a plate with a polygonal cross section from a large plate, multi-face processing is required, but to cut a plate with a circular cross section from a cylindrical round member, three-side processing is sufficient, which means that processing is easy and the cost is low. There are benefits. When the fixed mold 1 and the movable mold 2 are cylindrical, the shape of the first projecting member 12 and the second projecting member 22 attached to the side surfaces may be formed of a curved material having a curve along an arc. However, it may be made of a refractive material that is easy to process (for example, a flat material bent into a bowl shape).

  Moreover, although the said embodiment demonstrated the example which screws the 1st protrusion member 12 to the side surface of the fixed mold | type 1 and screws the 2nd protrusion member 22 to the side surface of the movable mold | type 2, this invention is limited to this. Not. For example, you may make it fix by means other than screwing. Alternatively, the first projecting member 12 and the fixed mold 1 may be integrally formed with the second projecting member 22 and the movable mold 2. However, it is preferable in terms of easy processing that the first projecting member 12 and the fixed mold 1 are separated and the second projecting member 22 and the movable mold 2 are separated and fixed by some means.

  Moreover, although the said embodiment demonstrated the example (FIG. 3) used for the molding machine reduced in size which used the injection molding die apparatus 10 reduced in size, this invention is not limited to this. At present, every factory uses a large injection mold for a large molding machine. At the same time as replacing a large mold with a small injection molding apparatus 10, a large molding machine is replaced with a small one. It may be difficult to change to a molding machine due to cost burden.

  Therefore, an adapter for attaching the injection mold apparatus 10 to the molding machine so that the conventional large mold can be used as it is by simply replacing the large mold with the small injection mold apparatus 10. May be provided. FIG. 5 is a view showing an example of a structure in which the injection molding die apparatus 10 of the present embodiment is attached to a conventional large molding machine by an adapter.

  In FIG. 5, components having the same functions as those shown in FIG. 3 but larger than those shown in FIG. Reference numeral 31 denotes a fixed plate (plate for attaching a fixed-side mounting plate) of the molding machine, and 32 denotes a movable plate (plate for mounting the movable-side mounting plate) of the molding machine. Although not shown in FIG. 5, the mounting position of the arm 9 a is the fixed platen 31.

  A tie bar 30 ′ shown in FIG. 5 has one end fixed to the fixed platen 31 and the other end inserted into a hole provided in the movable platen 32. The tie bar 30 ′ serves as a guide for guiding the movement route when the movable mold 2 moves together with the movable side mounting plate 8 and the movable platen 32. The hydraulic cylinder 300 ′ controls the movement of the movable platen 32 (and the movable side mounting plate 8 and the movable mold 2 attached thereto).

  Reference numeral 50 denotes an adapter, which is attached to the movable platen 32 of the molding machine. The movable side mounting plate 8 is fixed on the adapter 50. The adapter 50 is a mounting base used for reducing the spatial distance between the fixed mold 1 and the movable mold 2. If the surface on which the movable mounting plate 8 is mounted is parallel to the movable plate 32, the shape of the adapter 50 is used. Is optional.

  When a large molding machine is used as shown in FIG. 5, the movable range of the movable platen 32 is limited. That is, when a large mold is attached to a large molding machine, the movable range of the movable platen 32 may be small. Therefore, if the movable side mounting plate 8 is directly attached to the movable platen 32, the movable die 2 does not reach the fixed die 1 even if the movable platen 32 is moved to the maximum in the direction of the fixed die 1, and the mold is clamped. It will be in a state that can not be. On the other hand, if the movable side mounting plate 8 is attached using the adapter 50, the fixed mold 1 and the movable mold 2 can be securely clamped even if a large molding machine is used.

  Moreover, although the said embodiment demonstrated the example which comprised the taking-out mechanism 9 with the arm 9a and the suction pad 9b, and taking out a molded article by vacuum suction, this invention is not limited to this. For example, as shown in FIG. 6, a vent hole 60 penetrating from the molding machine side to the cavity 3 side is provided in the fixed mold 1 and the fixed side mounting plate 7, and the cavity is formed from the fixed side mounting plate 7 side through the vent hole 60. The molded product may be taken out by the air pressure by blowing air toward 3. It is preferable to provide a backflow prevention valve 61 at the tip of the vent hole 60 so that the molten resin does not flow back into the vent hole 60.

  In the above embodiment, the fixed mold 1 and the movable mold 2 are made of a high thermal conductivity material such as a steel material, while the bush 6 is provided around the sprue 4 and the bush 6 is made of a low thermal conductivity material such as ceramic. Although the example which comprises is demonstrated, this invention is not limited to this. For example, while the fixed mold 1 and the movable mold 2 are made of a low thermal conductivity material such as ceramic, instead of providing the bush 6 around the sprue 4, the cavity 3 and the cooling water hole 5 are surrounded by a high thermal conductivity such as a steel material. You may make it comprise with a degree material. In this way, the injection molding mold apparatus 10 can be further reduced in weight.

  Moreover, although the said embodiment demonstrated the example which forms the sprue 4 in the fixed mold | type 1 as a flow path until molten resin reaches the cavity 3, this invention is not limited to this. For example, as shown in FIG. 7, a concave portion that matches the shape of the nozzle 200 of the molding machine is formed in the fixed mold 1, and the tip of the nozzle 200 is brought into contact with the cavity 3, thereby allowing the nozzle 200 itself to flow through the resin flow. It may be a road. The tip hole of the nozzle 200 is made thin like a gate. In this case, since the nozzle 200 is heated by the heater 205, it is not necessary to provide a ceramic bush around the nozzle 200. It is preferable to provide a heater 205 in the vicinity of the nozzle 200.

  Moreover, although the said embodiment demonstrated the example in which the injection mold apparatus 10 is provided with the stationary side mounting plate 7 and the movable side mounting plate 8, this invention is not limited to this. That is, the fixed side mounting plate 7 and the movable side mounting plate 8 are not essential components. For example, as a modification of FIG. 3, a fixed plate and a movable plate of a molding machine are provided instead of the fixed side mounting plate 7 and the movable side mounting plate 8, and the fixed die 1 is directly on the fixed plate and the movable die 2 is directly on the movable plate. It may be attached. As a modification of FIG. 5, the fixed mold 1 may be directly attached to the fixed platen 31 of the molding machine, and the movable mold 2 may be directly attached to the adapter 50.

  In addition, each of the above-described embodiments is merely an example of implementation in carrying out the present invention, and the technical scope of the present invention should not be construed in a limited manner. That is, the present invention can be implemented in various forms without departing from the gist or the main features thereof.

Claims (7)

A stationary mold having a first parting surface;
A movable mold having a second parting surface of the same shape and size as the first parting surface;
A cavity formed by providing at least a recess with respect to at least one of the first parting surface and the second parting surface;
A projecting member for positioning the fixed mold and the movable mold, the first projecting member provided on a side surface of the fixed mold and projecting to the movable mold side from the first parting surface, and the movable An injection mold apparatus comprising: a second projecting member provided on a side surface of the mold and projecting toward the fixed mold side from the second parting surface. The injection mold apparatus according to claim 1 , wherein a sprue from a nozzle of a molding machine to the cavity is formed in the fixed mold as a flow path of the molten resin. The injection molding mold apparatus according to claim 1 , wherein the fixed mold is formed with a recess for causing a tip of a nozzle of a molding machine to contact the cavity. The fixed mold is provided with a bush around the sprue, while the fixed mold and the movable mold constituting a high thermal conductivity material than the bush, lower thermal conductivity than the fixed mold and the movable mold of the bush The mold apparatus for injection molding according to claim 2 , wherein the mold apparatus is made of a material. The fixed mold is provided with cooling water holes around the cavity, and the fixed mold and the movable mold are made of a thermal conductivity material lower than the periphery of the cavity and the cooling water hole, while the cavity and the cooling water hole are formed. The mold apparatus for injection molding according to claim 2 , wherein the periphery of the mold is made of a material having higher thermal conductivity than the fixed mold and the movable mold . The injection mold apparatus according to any one of claims 1 to 5 , further comprising a take-out mechanism for taking out a molded product hugging the cavity of the fixed mold by suction. An injection molding machine comprising the molding apparatus for injection molding according to any one of claims 1 to 6 attached to a molding machine,
An adapter that functions as a mounting base with the fixed mold or the fixed-side mounting plate attached with the fixed mold directly attached to the stationary platen of the molding machine and the movable mold or the movable-side mounting plate with the movable mold attached thereto. An injection molding machine characterized by being attached to the movable platen of the molding machine.

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