JP2017130480A - Electronic component - Google Patents
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- JP2017130480A JP2017130480A JP2016006900A JP2016006900A JP2017130480A JP 2017130480 A JP2017130480 A JP 2017130480A JP 2016006900 A JP2016006900 A JP 2016006900A JP 2016006900 A JP2016006900 A JP 2016006900A JP 2017130480 A JP2017130480 A JP 2017130480A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Abstract
Description
この発明は、電子部品に関するものであり、特に基板と、機能素子と回路部と端子電極とを備えた機能部と、樹脂層とを備えた電子部品に関する。 The present invention relates to an electronic component, and more particularly to an electronic component including a substrate, a functional unit including a functional element, a circuit unit, and a terminal electrode, and a resin layer.
通信機器などの電子機器の小型化の要請により、回路基板上への電子部品の高密度実装が要求されている。また、実装された電子部品の端子電極と、回路基板上の実装用電極との接続が、確実に行なわれることも重要である。 Due to the demand for miniaturization of electronic devices such as communication devices, high-density mounting of electronic components on a circuit board is required. It is also important that the terminal electrode of the mounted electronic component is securely connected to the mounting electrode on the circuit board.
例えば、国際公開第２０１０／１００７０６号（特許文献１）には、回路基板上の実装用電極と接続される電子部品の端子電極の一例が提案されている。 For example, International Publication No. 2010/100706 (Patent Document 1) proposes an example of a terminal electrode of an electronic component connected to a mounting electrode on a circuit board.
図４（Ａ）は、特許文献１に記載されている電子部品２００（図４（Ａ）では全体図は不図示）の要部の断面図である。特許文献１に記載されている電子部品２００は、基板２０１と、樹脂層２０３と、第１の電極２０５ａと、高さｔおよび幅ｗのはんだバンプＳＢが接続された第２の電極２０６ａと、保護層２０７とを備えている。第２の電極２０６ａは、不図示の回路基板上の実装用電極と接続される端子電極となっている。 4A is a cross-sectional view of a main part of an electronic component 200 described in Patent Document 1 (the whole view is not shown in FIG. 4A). An electronic component 200 described in Patent Document 1 includes a substrate 201, a resin layer 203, a first electrode 205a, a second electrode 206a to which solder bumps SB having a height t and a width w are connected, And a protective layer 207. The second electrode 206a is a terminal electrode connected to a mounting electrode on a circuit board (not shown).
保護層２０７は、基板２０１の一方主面上に配置されており、第１の貫通孔Ａ１を有している。樹脂層２０３は、保護層２０７の上面に配置されており、第２の貫通孔Ａ２を有している。第１の電極２０５ａは、基板２０１の一方主面上の、第２の貫通孔Ａ２内に配置されている。第２の電極２０６ａは、第１の貫通孔Ａ１を介して第１の電極２０５ａ上に配置されている。したがって、はんだバンプＳＢは、樹脂層２０３の第２の貫通孔内に形成されることになるため、位置ずれを起こしにくい。 The protective layer 207 is disposed on one main surface of the substrate 201 and has a first through hole A1. The resin layer 203 is disposed on the upper surface of the protective layer 207 and has a second through hole A2. The first electrode 205a is disposed in the second through hole A2 on the one main surface of the substrate 201. The second electrode 206a is disposed on the first electrode 205a via the first through hole A1. Therefore, since the solder bump SB is formed in the second through hole of the resin layer 203, it is difficult to cause a positional shift.
すなわち、特許文献１に記載されている電子部品２００では、その後のリフロー工程におけるはんだバンプＳＢと回路基板上の実装用電極との位置ずれによる接続不良が低減されるとされている。 In other words, in the electronic component 200 described in Patent Document 1, it is said that poor connection due to misalignment between the solder bump SB and the mounting electrode on the circuit board in the subsequent reflow process is reduced.
ところで、電子部品の端子電極として、既存品とあわせるために、形状を一方が長い長方形にすることが考えられる。この場合において、図４（Ｂ）ないし（Ｄ）に示した、特許文献１に開示されている正八角形、円形、正方形のような保護膜の開口形状を適用しようとすると、開口部の縁に応力が集中してしまう。 By the way, as a terminal electrode of an electronic component, in order to match with an existing product, it is conceivable to make the shape of a rectangle having one long side. In this case, if an opening shape of a protective film such as a regular octagon, a circle, or a square disclosed in Patent Document 1 shown in FIGS. 4B to 4D is applied, the edge of the opening is applied. Stress is concentrated.
したがって、第１の電極２０５ａと第２の電極２０６ａとは、十分な接続強度が得られていない虞がある。そのため、第２の電極２０６ａ上に形成したはんだバンプＳＢと回路基板上の実装用電極とを接続する際に、発生する熱歪みに第１の電極２０５ａと第２の電極２０６ａとの接合界面が耐えられず、そこに剥離やクラックが発生する虞がある。 Therefore, the first electrode 205a and the second electrode 206a may not have sufficient connection strength. Therefore, when the solder bump SB formed on the second electrode 206a and the mounting electrode on the circuit board are connected, the bonding interface between the first electrode 205a and the second electrode 206a is caused by the generated thermal strain. There is a risk of peeling and cracking.
そこで、この発明の目的は、端子電極における剥離やクラックのない電子部品を提供することである。 Accordingly, an object of the present invention is to provide an electronic component free from peeling and cracks in the terminal electrode.
この発明では、回路基板上の実装用電極との接続強度が十分高く、かつ端子電極における剥離やクラックのない電子部品を得るため、端子電極の形状についての改良が図られる。 According to the present invention, the shape of the terminal electrode can be improved in order to obtain an electronic component having a sufficiently high connection strength with the mounting electrode on the circuit board and free from peeling or cracking in the terminal electrode.
この発明に係る電子部品は、基板と、機能部と、樹脂層とを備えている。 The electronic component according to the present invention includes a substrate, a functional unit, and a resin layer.
機能部は、機能素子と、回路部と、端子電極とを含み、回路部および端子電極が基板の一方主面上に配置されている。回路部は、第１の電極と、機能素子と第１の電極とに接続された配線部とを含んでいる。端子電極は、第２の電極と、第１の電極と第２の電極とに接続された連結部とを含んでいる。 The functional unit includes a functional element, a circuit unit, and a terminal electrode, and the circuit unit and the terminal electrode are arranged on one main surface of the substrate. The circuit unit includes a first electrode, and a wiring unit connected to the functional element and the first electrode. The terminal electrode includes a second electrode and a connecting portion connected to the first electrode and the second electrode.
樹脂層は、第１の樹脂層を含んでいる。第１の樹脂層は、基板の一方主面上に配置され、かつ第１の貫通孔を有している。 The resin layer includes a first resin layer. The first resin layer is disposed on one main surface of the substrate and has a first through hole.
第２の電極は、基板の一方主面側から見たときの平面図形が、矩形状または角部が円弧となっている矩形状であり、かつ第１の樹脂層の基板の一方主面と対向していない表面側に配置されている。また、連結部は、基板の一方主面側から見たときの平面図形が、角部が円弧となっている矩形状であり、かつ第１の貫通孔内に配置されている。 As for the 2nd electrode, the planar figure when it sees from the one main surface side of a board | substrate is a rectangular shape or the rectangular shape by which the corner | angular part is a circular arc, and the 1st main surface of the board | substrate of a 1st resin layer and It is arrange | positioned at the surface side which is not facing. Further, the connecting portion is arranged in the first through hole, and the plan view when viewed from the one main surface side of the substrate has a rectangular shape with corners being arcs.
そして、第２の電極の平面図形の短軸の長さを分母とし、連結部の平面図形の短軸の長さを分子としたときの比率が１／２ないし１の間にある。また、第２の電極の平面図形の長軸の長さを分母とし、連結部の平面図形の長軸の長さを分子としたときの比率が１／２ないし１の間にある。 The ratio of the short axis of the plane figure of the second electrode as the denominator and the length of the short axis of the plane figure of the connecting portion as the numerator is between 1/2 and 1. Further, the ratio when the length of the major axis of the plan view of the second electrode is the denominator and the length of the major axis of the plan view of the connecting portion is the numerator is between 1/2 and 1.
上記の電子部品では、連結部の形状が基板の一方主面側から見たときの平面図形が、角部が円弧となっている矩形状であるため、第１の電極と第２の電極との接合面積が広い。したがって、両者の間の接続強度が十分高くなる。また、第２の電極の形状と連結部の形状とが上記の関係を満たすため、第２の電極上に形成されたはんだバンプと回路基板上の実装用電極とを接続する際に発生する熱歪みの集中が抑制される。上記の作用により、端子電極における剥離やクラックの発生が抑制される。 In the above electronic component, since the shape of the connecting portion when viewed from the one main surface side of the substrate is a rectangular shape with corners being arcs, the first electrode and the second electrode Wide bonding area. Therefore, the connection strength between the two is sufficiently high. In addition, since the shape of the second electrode and the shape of the connecting portion satisfy the above relationship, heat generated when connecting the solder bump formed on the second electrode and the mounting electrode on the circuit board. The concentration of distortion is suppressed. Due to the above action, the occurrence of peeling and cracks in the terminal electrode is suppressed.
この発明に係る電子部品は、以下の特徴を備えることが好ましい。すなわち、第２の電極の平面図形の短軸の長さを分母とし、連結部の平面図形の短軸の長さを分子としたときの比率が１／２ないし３／４の間にある。また、第２の電極の平面図形の長軸の長さを分母とし、連結部の平面図形の長軸の長さを分子としたときの比率が１／２ないし３／４の間にある。 The electronic component according to the present invention preferably has the following features. That is, the ratio when the length of the short axis of the plane figure of the second electrode is the denominator and the length of the short axis of the plane figure of the connecting portion is the numerator is between 1/2 and 3/4. Further, the ratio when the length of the major axis of the plan view of the second electrode is the denominator and the length of the major axis of the plan view of the connecting portion is the numerator is between 1/2 and 3/4.
上記の電子部品では、第１の電極と第２の電極との接合面積がさらに広くなっている。したがって、第１の電極と第２の電極との間の接続強度がさらに高くなる。また、第２の電極上に形成されたはんだバンプと回路基板上の実装用電極とを接続する際に発生する熱歪みの集中がさらに抑制される。上記の作用により、端子電極における剥離やクラックの発生が確実に抑制される。 In the above electronic component, the bonding area between the first electrode and the second electrode is further increased. Therefore, the connection strength between the first electrode and the second electrode is further increased. Further, the concentration of thermal strain that occurs when the solder bump formed on the second electrode is connected to the mounting electrode on the circuit board is further suppressed. By the above action, the occurrence of peeling and cracks in the terminal electrode is reliably suppressed.
この発明に係る電子部品は、およびその好ましい実施形態は、以下の特徴を備えることが好ましい。すなわち、樹脂層は、第２の樹脂層をさらに含んでいる。第２の樹脂層は、第１の樹脂層の基板の一方主面と対向していない表面側に配置され、かつ第２の貫通孔を有している。そして、第２の電極は、第２の樹脂層から第２の貫通孔を介して一部が露出している。 The electronic component according to the present invention and preferred embodiments thereof preferably have the following features. That is, the resin layer further includes a second resin layer. The 2nd resin layer is arrange | positioned at the surface side which is not facing one main surface of the board | substrate of a 1st resin layer, and has a 2nd through-hole. A part of the second electrode is exposed from the second resin layer through the second through hole.
上記の電子部品では、第２の樹脂層が第２の電極の一部を被覆しているため、第２の電極上に形成されたはんだバンプと回路基板上の実装用電極とを接続する際に発生する熱歪みが、第２の電極の周囲でも緩和される。上記の作用により、端子電極における剥離やクラックの発生が確実に抑制される。 In the above electronic component, since the second resin layer covers a part of the second electrode, the solder bump formed on the second electrode is connected to the mounting electrode on the circuit board. The thermal distortion generated in the second electrode is relieved even around the second electrode. By the above action, the occurrence of peeling and cracks in the terminal electrode is reliably suppressed.
この発明に係る電子部品は、およびその好ましい実施形態は、以下の特徴を備えることが好ましい。すなわち、第２の電極は、長方形である。 The electronic component according to the present invention and preferred embodiments thereof preferably have the following features. That is, the second electrode is rectangular.
上記の電子部品では、第２の電極の面積が広いため、回路基板上の実装用電極との接続強度が高くなる。 In the above electronic component, since the area of the second electrode is large, the connection strength with the mounting electrode on the circuit board is increased.
この発明に係る電子部品では、連結部の形状が基板の一方主面側から見たときの平面図形が、角部が円弧となっている矩形状であるため、第１の電極と第２の電極との接合面積が広い。したがって、両者の間の接続強度が十分高くなる。また、第２の電極の形状と連結部の形状とが前述の関係を満たすため、第２の電極上に形成されたはんだバンプと回路基板上の実装用電極とを接続する際に発生する熱歪みの集中が抑制される。上記の作用により、端子電極における剥離やクラックの発生が抑制される。 In the electronic component according to the present invention, since the planar shape when the shape of the connecting portion is viewed from the one main surface side of the substrate is a rectangular shape with corners being arcs, the first electrode and the second electrode Wide bonding area with electrode. Therefore, the connection strength between the two is sufficiently high. In addition, since the shape of the second electrode and the shape of the connecting portion satisfy the above-described relationship, heat generated when connecting the solder bump formed on the second electrode and the mounting electrode on the circuit board. The concentration of distortion is suppressed. Due to the above action, the occurrence of peeling and cracks in the terminal electrode is suppressed.
以下にこの発明の実施形態を示して、この発明の特徴とするところをさらに詳しく説明する。この発明が適用される電子部品としては、例えばＥＳＤ（Ｅｌｅｃｔｒｏ‐Ｓｔａｔｉｃ‐Ｄｉｓｃｈａｒｇｅ）保護デバイスなどの半導体装置や、薄膜コンデンサなどが挙げられるが、これらに限られるものではない。 Embodiments of the present invention will be described below to describe the features of the present invention in more detail. Examples of electronic components to which the present invention is applied include, but are not limited to, semiconductor devices such as ESD (Electro-Static-Discharge) protection devices and thin film capacitors.
−電子部品の実施形態−
この発明に係る電子部品の実施形態である電子部品１００について、図１および図２を用いて説明する。ここでは、電子部品１００の例として、ＥＳＤ保護デバイスを取り上げる。
-Embodiment of electronic component-
An electronic component 100 that is an embodiment of an electronic component according to the present invention will be described with reference to FIGS. 1 and 2. Here, an ESD protection device is taken as an example of the electronic component 100.
図１（Ａ）は、図１（Ｂ）に示したＡ１−Ａ１線を含む切断面における電子部品１００の矢視断面図である。図１（Ｂ）は、電子部品１００の各構成要素の位置関係を示した上面図である。図２は、電子部品１００の要部の詳細を示した上面図である。なお、図２は、後述する第２の樹脂層３ｂを仮想的に剥離して、後述する第１の樹脂層３ａならびに第２の電極６ａ1、６ｂ1を露出させた状態での上面図となっている。 FIG. 1A is a cross-sectional view of the electronic component 100 taken along the cutting plane including the line A1-A1 shown in FIG. FIG. 1B is a top view showing the positional relationship of each component of the electronic component 100. FIG. 2 is a top view showing details of a main part of the electronic component 100. FIG. 2 is a top view of a state in which a second resin layer 3b described later is virtually peeled to expose a first resin layer 3a described later and the second electrodes 6a 1 and 6b 1 . It has become.
電子部品１００は、基板１と、機能部２と、樹脂層３とを備えた２端子の電子部品である。基板１には、例えば半導体Ｓｉや半導体ＧａＡｓなどが用いられる。電子部品１００において、基板１は、長方形であり、短軸と直交する対称軸と長軸と直交する対称軸を有している。 The electronic component 100 is a two-terminal electronic component that includes a substrate 1, a functional unit 2, and a resin layer 3. For the substrate 1, for example, semiconductor Si or semiconductor GaAs is used. In the electronic component 100, the substrate 1 is rectangular and has a symmetry axis perpendicular to the short axis and a symmetry axis perpendicular to the long axis.
機能部２は、機能素子４と、回路部５ａ、５ｂと、端子電極６ａ、６ｂとを含んでいる。機能素子４は、例えば２端子のツェナーダイオードなどが用いられる。回路部５ａは、第１の電極５ａ1と、機能素子４と第１の電極５ａ1とに接続された配線部５ａ2とを含んでいる。回路部５ｂは、第１の電極５ｂ1と、機能素子４と第１の電極５ｂ1とに接続された配線部５ｂ2とを含んでいる。 The functional unit 2 includes a functional element 4, circuit units 5a and 5b, and terminal electrodes 6a and 6b. The functional element 4 is, for example, a two-terminal Zener diode. The circuit portion 5a includes a first electrode 5a 1 and a wiring portion 5a 2 connected to the functional element 4 and the first electrode 5a 1 . Circuit 5b includes a first electrode 5b 1, and the functional element 4 and a wiring portion 5b 2 connected to 1 and the first electrode 5b.
電子部品１００では、基板１の一方主面上に保護層７が配置されている。保護層７は、基板１の一方主面上に配置された第１の保護層７ａと、第１の保護層７ａの表面上に配置された第２の保護層７ｂとを含んでいる。保護層７は、電子部品１００の耐湿性向上のために設置される。第１の保護層７ａには、例えばＳｉ酸化物などが用いられ、第２の保護層７ｂには、例えばＳｉ窒化物などが用いられる。第１の保護層７ａおよび第２の保護層７ｂの材質は、これらに限られない。なお、第１の保護層７ａおよび第２の保護層７ｂは、電子部品１００において必須の構成要素ではない。 In the electronic component 100, the protective layer 7 is disposed on one main surface of the substrate 1. The protective layer 7 includes a first protective layer 7a disposed on one main surface of the substrate 1 and a second protective layer 7b disposed on the surface of the first protective layer 7a. The protective layer 7 is installed to improve the moisture resistance of the electronic component 100. For example, Si oxide or the like is used for the first protective layer 7a, and Si nitride or the like is used for the second protective layer 7b, for example. The material of the 1st protective layer 7a and the 2nd protective layer 7b is not restricted to these. The first protective layer 7 a and the second protective layer 7 b are not essential components in the electronic component 100.
第１の電極５ａ1、５ｂ1は、第１の保護層７ａの表面上に形成されている。また、配線部５ａ2、５ｂ2も、第１の保護層７ａの表面上に形成されており、第１の保護層７ａに形成されている２つの開口部を介してそれぞれ機能素子４と接続されている。第２の保護層７ｂにも２つの開口部が形成されており、それぞれの開口部内で第１の電極５ａ1と後述する連結部６ａ2とが接続され、第１の電極５ｂ1と後述する連結部６ｂ2とが接続されている。 The first electrodes 5a 1 and 5b 1 are formed on the surface of the first protective layer 7a. The wiring portions 5a 2 and 5b 2 are also formed on the surface of the first protective layer 7a, and are connected to the functional element 4 through two openings formed in the first protective layer 7a. Has been. Are formed two openings for the second protective layer 7b, is the first electrode 5a 1 in the respective openings and the connecting portion 6a 2 to be described later connected, it will be described below first with the electrode 5b 1 The connecting portion 6b 2 is connected.
端子電極６ａは、第２の電極６ａ1と連結部６ａ2とを含んでいる。第２の電極６ａ1は、基材６ａ11と、基材６ａ11の表面上に配置された第１の被覆層６ａ12と、第１の被覆層６ａ12の表面上に配置された第２の被覆層６ａ13とを含んでいる。また、第２の電極６ａ1は、基板１の一方主面側から見たときの平面図形が、長さＸａ1の短軸と長さＹａ1の長軸とを有する長方形（図２参照）であり、後述する第１の樹脂層３ａの基板１の一方主面と対向していない表面側に配置されている。なお、第２の電極６ａ1は、長方形に限らず、矩形状、または後述するように角部が円弧となっている矩形状（図３参照）であってもよい。 The terminal electrode 6a includes a second electrode 6a 1 and a connecting portion 6a 2 . The second electrode 6a 1 comprises a substrate 6a 11, the first cover layer 6a 12 disposed on the surface of the substrate 6a 11, disposed on a surface of the first coating layer 6a 12 2 and a coating layer 6a 13. The second electrode 6a 1 is a rectangle whose plan view when viewed from the one main surface side of the substrate 1 has a short axis of length Xa 1 and a long axis of length Ya 1 (see FIG. 2). It is arrange | positioned at the surface side which is not facing the one main surface of the board | substrate 1 of the 1st resin layer 3a mentioned later. The second electrode 6a 1 is not limited to a rectangle, but may be a rectangle or a rectangle (see FIG. 3) whose corners are arcs as described later.
連結部６ａ2は、第１の電極５ａ1と第２の電極６ａ1とに接続されている。また、連結部６ａ2は、基板１の一方主面側から見たときの平面図形が、長さＸａ2の短軸と長さＹａ2の長軸とを有する、角部が半径Ｒａ2の円弧となっている矩形状（図２参照）であり、後述する第１の貫通孔Ａ１ａ内に配置されている。基材６ａ11には、Ｃｕなどが用いられ、第１の被覆層６ａ12には、Ｎｉなどが用いられ、第２の被覆層６ａ13には、Ａｕなどが用いられる。なお、第１の被覆層６ａ12および第２の被覆層６ａ13は、端子電極６ａにおいて必須の構成要素ではない。 The connecting portion 6a 2 is connected to the first electrode 5a 1 and the second electrode 6a 1 . Further, the connecting portion 6a 2 has a plan view when viewed from the one main surface side of the substrate 1 and has a short axis having a length Xa 2 and a long axis having a length Ya 2 , and a corner portion having a radius Ra 2 . It has a rectangular shape that is an arc (see FIG. 2), and is disposed in a first through hole A1a, which will be described later. Cu or the like is used for the substrate 6a 11 , Ni or the like is used for the first coating layer 6a 12 , and Au or the like is used for the second coating layer 6a 13 . The first coating layer 6a 12 and the second coating layer 6a 13 are not essential components in the terminal electrode 6a.
基材６ａ11と第１の被覆層６ａ12と第２の被覆層６ａ13は、例えばめっきにより形成される。その際、第１の電極５ａ1の表面上にシード層となるＴｉ層およびＣｕ層がスパッタリングにより配置され、その上に上記の構成要素が順次めっきにより形成される。 Substrate 6a 11 and the first covering layer 6a 12 second coating layer 6a 13 is formed, for example, by plating. At that time, a Ti layer and a Cu layer to be seed layers are disposed on the surface of the first electrode 5a 1 by sputtering, and the above-described components are sequentially formed thereon by plating.
端子電極６ｂは、第２の電極６ｂ1と連結部６ｂ2とを含んでいる。第２の電極６ｂ1は、基材６ｂ11と、基材６ｂ11の表面上に配置された第１の被覆層６ｂ12と、第１の被覆層６ｂ12の表面上に配置された第２の被覆層６ｂ13とを含んでいる。また、第２の電極６ｂ1は、基板１の一方主面側から見たときの平面図形が、長さＸｂ1の短軸と長さＹｂ1の長軸とを有する長方形（図２参照）であり、後述する第１の樹脂層３ａの基板１の一方主面と対向していない表面側に配置されている。なお、第２の電極６ｂ1の形状は、第２の電極６ａ1と同様に長方形に限られない。 The terminal electrode 6b includes a second electrode 6b 1 and a connecting portion 6b 2 . The second electrode 6b 1 includes a base material 6b 11 , a first coating layer 6b 12 disposed on the surface of the base material 6b 11 , and a second coating disposed on the surface of the first coating layer 6b 12 . and a coating layer 6b 13. The second electrode 6b 1 is a rectangle whose plan view when viewed from the one main surface side of the substrate 1 has a minor axis of length Xb 1 and a major axis of length Yb 1 (see FIG. 2). It is arrange | positioned at the surface side which is not facing the one main surface of the board | substrate 1 of the 1st resin layer 3a mentioned later. The shape of the second electrode 6b 1 is not limited to a rectangle in the same manner as the second electrode 6a 1.
連結部６ｂ2は、第１の電極５ｂ1と第２の電極６ｂ1とに接続されている。また、連結部６ｂ2は、基板１の一方主面側から見たときの平面図形が、長さＸｂ2の短軸と長さＹｂ2の長軸とを有する、角部が半径Ｒｂ2の円弧となっている矩形状（図２参照）であり、後述する第１の貫通孔Ａ１ｂ内に配置されている。各構成要素の材質および形成方法は、端子電極６ａと同様である。また、端子電極６ａと同様に、第１の被覆層６ｂ12および第２の被覆層６ｂ13は、端子電極６ｂにおいて必須の構成要素ではない。 The connecting portion 6b 2 is connected to the first electrode 5b 1 and the second electrode 6b 1 . Further, the connecting portion 6b 2 has a plan view when viewed from one main surface side of the substrate 1 having a short axis of length Xb 2 and a long axis of length Yb 2 , and a corner portion having a radius Rb 2 . It has a rectangular shape (see FIG. 2) that is an arc, and is disposed in a first through hole A1b described later. The material and forming method of each component are the same as those of the terminal electrode 6a. Similarly to the terminal electrode 6a, the first coating layer 6b 12 and the second coating layer 6b 13 are not essential components in the terminal electrode 6b.
なお、連結部６ａ2の平面図形の形状と連結部６ｂ2の平面図形の形状とは、電子部品１００内部における熱歪みの対称性の観点から、同一であることが好ましい。 Note that the shape of the plane figure of the connecting portion 6b 2 and the shape of the plane figure of the connecting portion 6a 2, from the viewpoint of symmetry of the thermal distortion in the internal electronic components 100 are preferably identical.
回路部５ａ、５ｂおよび端子電極６ａ、６ｂは、基板１の一方主面上に配置されている。なお、端子電極６ａ、６ｂは、図１（Ｂ）に示されるように、基板１の一方主面上において、上記の長軸に直交する対称面について対称に配置されている。 The circuit portions 5 a and 5 b and the terminal electrodes 6 a and 6 b are arranged on one main surface of the substrate 1. As shown in FIG. 1B, the terminal electrodes 6a and 6b are symmetrically arranged on the one main surface of the substrate 1 with respect to a symmetry plane orthogonal to the long axis.
樹脂層３は、第１の樹脂層３ａと、第２の樹脂層３ｂとを備えている。第１の樹脂層３ａは、基板１の一方主面上に配置され、かつ第１の貫通孔Ａ１ａ、Ａ１ｂを有している。前述したように、第１の樹脂層３ａの基板１の一方主面と対向していない表面側には、第２の電極６ａ1、６ｂ1が配置されている。また、第１の貫通孔Ａ１ａ内には、連結部６ａ2が配置され、第１の貫通孔Ａ１ｂ内には、連結部６ｂ2が配置されている。 The resin layer 3 includes a first resin layer 3a and a second resin layer 3b. The first resin layer 3a is disposed on one main surface of the substrate 1 and has first through holes A1a and A1b. As described above, the second electrodes 6a 1 and 6b 1 are arranged on the surface side of the first resin layer 3a that does not face one main surface of the substrate 1. Addition, in the first through-hole A1a, is arranged connecting portions 6a 2, in the first through hole A1b, connecting portions 6b 2 is arranged.
第２の樹脂層３ｂは、第１の樹脂層３ａの基板１の一方主面と対向していない表面側に配置され、かつ第２の貫通孔Ａ２ａ、Ａ２ｂを有している。第２の電極６ａ1は、第２の樹脂層３ｂから第２の貫通孔Ａ２ａを介して一部が露出している。また、第２の電極６ｂ1は、第２の樹脂層３ｂから第２の貫通孔Ａ２ｂを介して一部が露出している。 The second resin layer 3b is disposed on the surface side of the first resin layer 3a that is not opposed to one main surface of the substrate 1, and has second through holes A2a and A2b. A portion of the second electrode 6a 1 is exposed from the second resin layer 3b through the second through hole A2a. The second electrode 6b 1 is partially exposed from the second resin layer 3b through the second through hole A2b.
第１の樹脂層３ａおよび第２の樹脂層３ｂには、ポリイミド樹脂、エポキシ系樹脂、液晶ポリマー樹脂、ＰＢＯ（ポリベンゾオキサゾール）、ＢＣＢ（ベンゾシクロブテン）などが用いられる。なお、第１の樹脂層３ａおよび第２の樹脂層３ｂの材質は、同じであっても、または異なっていてもよい。 For the first resin layer 3a and the second resin layer 3b, polyimide resin, epoxy resin, liquid crystal polymer resin, PBO (polybenzoxazole), BCB (benzocyclobutene), or the like is used. In addition, the material of the 1st resin layer 3a and the 2nd resin layer 3b may be the same, or may differ.
そして、電子部品１００の特徴は、第２の電極６ａ1の平面図形の短軸の長さＸａ1を分母とし、連結部６ａ2の平面図形の短軸の長さＸａ2を分子としたときの比率ＭａXが１／２ないし１の間にあり、第２の電極６ａ1の平面図形の長軸の長さＹａ1を分母とし、連結部６ａ2の平面図形の長軸の長さＹａ2を分子としたときの比率ＭａYが１／２ないし１の間にあることにある。 The characteristic of the electronic component 100, the minor axis of the second plane figures of the electrode 6a 1 the length Xa 1 as the denominator when the length Xa 2 of the minor axis of the plane figure of the connecting portion 6a 2 and the molecular The ratio Ma X is between 1/2 and 1, the major axis length Ya 1 of the planar figure of the second electrode 6a 1 is taken as the denominator, and the major axis length Ya of the coupling part 6a 2 The ratio Ma Y when 2 is a molecule is between 1/2 and 1.
さらに、電子部品１００のもう１つの特徴は、第２の電極６ｂ1の平面図形の短軸の長さＸｂ1を分母とし、連結部６ｂ2の平面図形の短軸の長さＸｂ2を分子としたときの比率ＭｂXが１／２ないし１の間にあり、第２の電極６ｂ1の平面図形の長軸の長さＹｂ1を分母とし、連結部６ｂ2の平面図形の長軸の長さＹｂ2を分子としたときの比率ＭｂYが１／２ないし１の間にあることにある。 Moreover, the electronic component 100 Another feature of the length Xb 1 of the minor axis of the second plane figures electrode 6b 1 and the denominator, the length Xb 2 molecules of the minor axis of the plane figure of the connecting portion 6b 2 The ratio Mb X is between 1/2 and 1, the major axis length Yb 1 of the planar figure of the second electrode 6b 1 is used as the denominator, and the major axis of the planar figure of the connecting part 6b 2 The ratio Mb Y with the length Yb 2 as a molecule is between 1/2 and 1.
そのため、第１の電極５ａ1と第２の電極６ａ1との接合面積、および第１の電極５ｂ1と第２の電極６ｂ1との接合面積が広くなっている。したがって、第１の電極５ａ1と第２の電極６ａ1との間、および第１の電極５ｂ1と第２の電極６ｂ1との間の接続強度が十分高くなる。 For this reason, the junction area between the first electrode 5a 1 and the second electrode 6a 1 and the junction area between the first electrode 5b 1 and the second electrode 6b 1 are widened. Therefore, the connection strength between the first electrode 5a 1 and the second electrode 6a 1 and between the first electrode 5b 1 and the second electrode 6b 1 is sufficiently high.
前述したように、連結部６ａ2の平面図形は、角部が半径Ｒａ2の円弧となっている矩形状である。また、連結部６ｂ2の平面図形は、角部が半径Ｒｂ2の円弧となっている矩形状である。 As described above, the plan view of the connecting portion 6a 2 has a rectangular shape in which the corner portion is an arc having a radius Ra 2 . Further, the plan view of the connecting portion 6b 2 has a rectangular shape in which the corner portion is an arc having a radius Rb 2 .
したがって、第２の電極６ａ1、６ｂ1の形状と連結部６ａ2、６ｂ2の形状とが上記の関係を満たすため、第２の電極６ａ1、６ｂ1上に形成されたはんだバンプと通信機器などの回路基板上の実装用電極とを接続する際に発生する熱歪みの集中が抑制される。上記の作用により、端子電極６ａ、６ｂにおける剥離やクラックの発生が抑制される。 Therefore, since the shape of the second electrodes 6a 1 and 6b 1 and the shape of the connecting portions 6a 2 and 6b 2 satisfy the above relationship, it communicates with the solder bumps formed on the second electrodes 6a 1 and 6b 1. Concentration of thermal strain that occurs when connecting mounting electrodes on a circuit board such as equipment is suppressed. Due to the above action, the occurrence of peeling and cracks in the terminal electrodes 6a and 6b is suppressed.
また、比率ＭａXが１／２ないし３／４の間にあり、比率ＭａYが１／２ないし３／４の間にあり、比率ＭｂXが１／２ないし３／４の間にあり、比率ＭｂYが１／２ないし３／４の間にあることが好ましい。 Further, the ratio Ma X is between 1/2 and 3/4, the ratio Ma Y is between 1/2 and 3/4, the ratio Mb X is between 1/2 and 3/4, The ratio Mb Y is preferably between 1/2 and 3/4.
この場合、第１の電極５ａ1と第２の電極６ａ1との接合面積、および第１の電極５ｂ1と第２の電極６ｂ1との接合面積がさらに広くなっている。したがって、第１の電極５ａ1と第２の電極６ａ1との間、および第１の電極５ｂ1と第２の電極６ｂ1との間の接続強度がさらに高くなる。 In this case, the junction area between the first electrode 5a 1 and the second electrode 6a 1 and the junction area between the first electrode 5b 1 and the second electrode 6b 1 are further increased. Accordingly, the connection strength between the first electrode 5a 1 and the second electrode 6a 1 and between the first electrode 5b 1 and the second electrode 6b 1 is further increased.
また、第２の電極６ａ1、６ｂ1上に形成されたはんだバンプと通信機器などの回路基板上の実装用電極とを接続する際に発生する熱歪みの集中がさらに抑制される。上記の作用により、端子電極６ａ、６ｂにおける剥離やクラックの発生が確実に抑制される。 In addition, the concentration of thermal strain generated when connecting the solder bumps formed on the second electrodes 6a 1 and 6b 1 and the mounting electrodes on the circuit board such as a communication device is further suppressed. By the above action, the occurrence of peeling and cracks in the terminal electrodes 6a and 6b is surely suppressed.
この実施形態のように、樹脂層３は、第２の樹脂層３ｂを含むことが好ましい。それは、第２の樹脂層３ｂが第２の電極６ａ1、６ｂ1の一部を被覆することで、第２の電極６ａ1、６ｂ1上に形成されたはんだバンプと、通信機器などの回路基板上の実装用電極とを接続する際に発生する熱歪みが、第２の電極６ａ1、６ｂ1の周囲でも緩和されるためである。上記の作用により、端子電極６ａ、６ｂにおける剥離やクラックの発生が確実に抑制される。しかしながら、電子部品が上記の特徴を有していれば、第１の樹脂層３ａだけでもこの発明の効果は十分得られる。 As in this embodiment, the resin layer 3 preferably includes the second resin layer 3b. It second resin layer 3b is to coat the second portion of the electrode 6a 1, 6b 1, and the solder bumps formed on the second electrode 6a 1, 6b 1 on the circuit, such as communications equipment This is because the thermal distortion generated when connecting the mounting electrodes on the substrate is alleviated even around the second electrodes 6a 1 and 6b 1 . By the above action, the occurrence of peeling and cracks in the terminal electrodes 6a and 6b is surely suppressed. However, if the electronic component has the above-described characteristics, the effect of the present invention can be sufficiently obtained by using only the first resin layer 3a.
なお、連結部６ａ2の角部における円弧の半径Ｒａ2は、０より大きく、かつＸａ2／２以下であり、半径Ｒａ2がＸａ2／２、すなわち連結部６ａ2の形状がいわゆる長円形である場合が好ましい。連結部６ｂ2の角部における円弧の半径Ｒｂ2についても同様であり、半径Ｒｂ2がＸｂ2／２、すなわち連結部６ｂ2の形状がいわゆる長円形である場合が好ましい。また、前述したように、電子部品１００内部における熱歪みの対称性の観点から、連結部６ａ2の角部における円弧の半径Ｒａ2と、連結部６ｂ2の角部における円弧の半径Ｒｂ2とは、同一であることが好ましい。 Incidentally, the radius Ra 2 arc at the corner portion of the connecting portion 6a 2 is greater than 0, and is at Xa 2/2 or less, the radius Ra 2 is Xa 2/2, i.e. the shape of the connecting portion 6a 2 is a so-called oval Is preferred. The same applies to the radius Rb 2 of the circular arc at the corner portion of the connecting portion 6b 2, the radius Rb 2 is Xb 2/2, that is, when the shape of the connecting portion 6b 2 is the so-called oval are preferred. Further, as described above, in view of symmetry of the thermal distortion in the internal electronic components 100, and the radius Ra 2 of the circular arc at the corner portion of the connecting portion 6a 2, and the radius Rb 2 of the circular arc at the corner portion of the connecting portion 6b 2 Are preferably the same.
−電子部品の実施形態の変形例−
この発明に係る電子部品の実施形態の変形例である電子部品１００Ａについて、図３を用いて説明する。電子部品１００Ａの例として、電子部品１００と同様にＥＳＤ保護デバイスを取り上げる。
-Modification of Embodiment of Electronic Component-
An electronic component 100A, which is a modification of the embodiment of the electronic component according to the present invention, will be described with reference to FIG. As an example of the electronic component 100 </ b> A, an ESD protection device is taken up similarly to the electronic component 100.
図３は、図２に相当する電子部品１００Ａの要部の詳細を示した上面図である。電子部品１００Ａは、第２の電極６ｂ1の形状が、前述の電子部品１００と異なっており、角部が円弧となっている長方形である。それ以外は電子部品１００と共通であるため、共通する箇所の説明については省略または簡略化することがある。 FIG. 3 is a top view showing details of a main part of the electronic component 100A corresponding to FIG. The electronic component 100A has a rectangular shape in which the shape of the second electrode 6b 1 is different from that of the electronic component 100 described above and the corners are arcs. Since the rest is common to the electronic component 100, description of common parts may be omitted or simplified.
図３に示すように、第２の電極６ａ1の形状と第２の電極６ｂ1の形状とが異なっていても、この発明の効果を得ることができる。端子電極６ａ、６ｂにおける剥離やクラックの発生は、前述した熱歪みにより、第２の電極６ａ1と連結部６ａ2との接合界面、および第２の電極６ｂ1と連結部６ｂ2との接合界面で発生する。それで、第２の電極６ａ1の形状と第２の電極６ｂ1の形状が幾らか異なっていたとしても、接合界面の面積自体は異ならないので、剥離やクラックの発生には影響を及ぼさないためと考えられる。なお、第２の電極６ｂ1に替えて、第２の電極６ａ1を角部が円弧となっている長方形としてもよい。 As shown in FIG. 3, even if the shape of the second electrode 6a 1 and the shape of the second electrode 6b 1 are different, the effect of the present invention can be obtained. The occurrence of peeling or cracking in the terminal electrodes 6a and 6b is caused by the thermal strain described above, the bonding interface between the second electrode 6a 1 and the connecting portion 6a 2, and the bonding between the second electrode 6b 1 and the connecting portion 6b 2. Occurs at the interface. Therefore, even if the shape of the second electrode 6a 1 and the shape of the second electrode 6b 1 are somewhat different, the area of the bonding interface itself is not different, so that it does not affect the occurrence of peeling or cracking. it is conceivable that. Instead of the second electrode 6b 1, it may be the second electrode 6a 1 as a rectangular corner portion is a circular arc.
−実験例−
次に、この発明を実験例に基づいて具体的に説明する。この実験例では、２端子の電子部品における一方の端子電極に着目して評価が行なわれた。すなわち、連結部の形状、ならびに前述した比率ＭａXおよび比率ＭａYの違いによる熱衝撃試験の結果の違いが調べられた。なお、他方の端子電極についても同様の結果が得られるものと考えられるため、他方の端子電極についての評価は割愛した。
-Experimental example-
Next, the present invention will be specifically described based on experimental examples. In this experimental example, the evaluation was performed by paying attention to one terminal electrode in a two-terminal electronic component. That is, the difference in the result of the thermal shock test due to the difference in the shape of the connecting portion and the ratio Ma X and the ratio Ma Y described above was examined. In addition, since it is thought that the same result is obtained also about the other terminal electrode, the evaluation about the other terminal electrode was omitted.
熱衝撃試験の試料である電子部品について説明する。連結部の形状および寸法を変更した３種類の試料を作製した。電子部品として、半導体Ｓｉ基板にツェナーダイオードが形成された、ＥＳＤ保護デバイスを用意した。半導体Ｓｉ基板の一方主面上には、２つの開口部を有するＳｉ酸化物からなる第１の保護層が形成されている。以下、電子部品の構成要素は、半導体Ｓｉ基板の一方主面側に形成されたものとする。 An electronic component that is a sample of the thermal shock test will be described. Three types of samples in which the shape and dimensions of the connecting portion were changed were produced. As an electronic component, an ESD protection device in which a Zener diode was formed on a semiconductor Si substrate was prepared. A first protective layer made of Si oxide having two openings is formed on one main surface of the semiconductor Si substrate. Hereinafter, it is assumed that the components of the electronic component are formed on one main surface side of the semiconductor Si substrate.
第１の保護層上に、ツェナーダイオードの引き出し電極として、２つの第１の電極が配置された。第１の電極の材質はＡｌである。第１の電極とツェナーダイオードとは、第１の保護層の開口部を介して接続されている。第１の保護層上および第１の電極上に、２つの開口部を有する第２の保護層が配置された。第２の保護層の材質はＳｉ窒化物である。 On the first protective layer, two first electrodes were arranged as lead electrodes for the Zener diode. The material of the first electrode is Al. The first electrode and the Zener diode are connected via the opening of the first protective layer. A second protective layer having two openings was disposed on the first protective layer and the first electrode. The material of the second protective layer is Si nitride.
第２の保護層上に、２つの第１の貫通孔を有する第１の樹脂層が配置された。第１の樹脂層の材質はポリイミド樹脂である。第１の貫通孔は、第１の電極の中央領域が露出するように形成されている。第１の貫通孔内に、第１の電極と接続された連結部が形成された。連結部の材質はＣｕである。連結部の形状および寸法は、後述する表１に示されている。 A first resin layer having two first through holes was disposed on the second protective layer. The material of the first resin layer is polyimide resin. The first through hole is formed so that the central region of the first electrode is exposed. A connecting portion connected to the first electrode was formed in the first through hole. The material of the connecting portion is Cu. The shape and dimensions of the connecting portion are shown in Table 1 described later.
連結部に接続されるように、第２の電極が形成された。第２の電極は、基材ならびに第１および第２の被覆層を含んでいる。基材の材質はＣｕであり、第１の被覆層の材質はＮｉであり、第２の被覆層の材質はＡｕである。第２の電極の形状および寸法は、後述する表１に示されている。 A second electrode was formed so as to be connected to the connecting portion. The second electrode includes a substrate and first and second coating layers. The material of the base material is Cu, the material of the first coating layer is Ni, and the material of the second coating layer is Au. The shape and dimensions of the second electrode are shown in Table 1 described later.
第１の樹脂層上に、２つの第２の貫通孔を有する第２の樹脂層が配置された。第２の樹脂層の材質はポリイミド樹脂である。第２の貫通孔は、第２の電極の中央領域が露出するように形成されている。 A second resin layer having two second through holes was disposed on the first resin layer. The material of the second resin layer is polyimide resin. The second through hole is formed so that the central region of the second electrode is exposed.
以上のようにして得られた電子部品の試料について、低温側温度を−５５℃とし、高温側温度を１２５℃として、両者の間を１０００サイクル往復させる熱衝撃試験（ＪＩＳ Ｃ ６００６８−２−１４に準拠）が実施された。連結部の形状および寸法、ならびに第２の電極の形状および寸法と、熱衝撃試験の結果は、表１に示されている。 With respect to the sample of the electronic component obtained as described above, a thermal shock test (JIS C 60068-2-14) in which the low temperature side temperature is set to −55 ° C. and the high temperature side temperature is set to 125 ° C. to reciprocate 1000 cycles between the two. Compliant). Table 1 shows the shape and size of the connecting portion, the shape and size of the second electrode, and the results of the thermal shock test.
表１から分かるように、連結部の形状が基板の一方主面側から見たときの平面図形が、角部が円弧となっている矩形状であり、かつ前述した比率Ｍａおよび比率ＭａYがこの発明で規定した範囲内にあるとき、熱衝撃試験において故障の発生が認められなかった。ここでいう故障とは、熱衝撃試験後に行なわれた導通試験により異常が認められたものについて断面研磨などが行なわれた結果、第１の電極と第２の電極との間に剥離またはクラックの発生が認められたものである。 As can be seen from Table 1, the plan view when the shape of the connecting portion is viewed from the one main surface side of the substrate is a rectangular shape with corners being arcs, and the ratio Ma and ratio Ma Y described above are When it was within the range defined by the present invention, no failure was observed in the thermal shock test. As used herein, the term “failure” refers to the occurrence of peeling or cracking between the first electrode and the second electrode as a result of cross-section polishing or the like performed on an abnormality found in a continuity test conducted after the thermal shock test. Occurrence has been observed.
すなわち、上記の実験例により、この発明に係る電子部品では、端子電極における剥離やクラックの発生が抑制されていることが確認された。 That is, from the above experimental example, it was confirmed that in the electronic component according to the present invention, the occurrence of peeling and cracks in the terminal electrode was suppressed.
なお、この発明は上記の実施形態に限定されるものではなく、この発明の範囲内において、種々の応用、変形を加えることができる。また、この明細書に記載の各実施形態は、例示的なものであり、異なる実施形態間において、構成の部分的な置換または組み合わせが可能であることを指摘しておく。 In addition, this invention is not limited to said embodiment, A various application and deformation | transformation can be added within the scope of this invention. In addition, it is pointed out that each embodiment described in this specification is an exemplification, and a partial replacement or combination of configurations is possible between different embodiments.
１００、１００Ａ 電子部品
１ 基板
２ 機能部
３ 樹脂層
３ａ 第１の樹脂層
３ｂ 第２の樹脂層
４ 機能素子
５ａ、５ｂ 回路部
５ａ1、５ｂ1 第１の電極
５ａ2、５ｂ2 配線部
６ａ、６ｂ 端子電極
６ａ1、６ｂ1 第２の電極
６ａ2、６ｂ2 連結部
７ 保護層
７ａ 第１の保護層
７ｂ 第２の保護層
Ａ１ａ、Ａ１ｂ 第１の貫通孔
Ａ２ａ、Ａ２ｂ 第２の貫通孔
ＭａX、ＭａX 第２の電極の平面図形の短軸の長さを分母とし、連結部の平面図形の短軸の長さを分子としたときの比率
ＭａY、ＭａY 第２の電極の平面図形の長軸の長さを分母とし、連結部の平面図形の長軸の長さを分子としたときの比率
Ｘａ1、Ｘｂ1 第２の電極の平面図形の短軸の長さ
Ｘａ2、Ｘｂ2 連結部の平面図形の短軸の長さ
Ｙａ1、Ｙｂ1 第２の電極の平面図形の長軸の長さ
Ｙａ2、Ｙｂ2 連結部の平面図形の長軸の長さ
100,100A electronic component 1 substrate 2 function unit 3 resin layer 3a first resin layer 3b second resin layer 4 functional element 5a, 5b circuit portion 5a 1, 5b 1 first electrode 5a 2, 5b 2 wiring portion 6a , 6b terminal electrodes 6a 1 , 6b 1 second electrodes 6a 2 , 6b 2 connecting part 7 protective layer 7a first protective layer 7b second protective layer A1a, A1b first through hole A2a, A2b second through The ratio Ma Y , Ma Y second electrode when the length of the minor axis of the plane figure of the hole Ma X , Ma X second electrode is the denominator and the length of the minor axis of the plane figure of the connecting portion is the numerator The ratio Xa 1 , Xb 1 is the length Xa of the short axis of the plane figure of the second electrode Xa 1 when the length of the long axis of the plane figure is the denominator and the length of the long axis of the plane figure of the connecting part is the numerator 2, Xb 2 the length of the minor axis of the plane figure of the connecting portion Ya 1, Yb 1 second, the length Ya 2 of the major axis of the plane figure of the electrodes Y Plane major axis length of the figure of the second coupling portion
Claims (4)
前記機能部は、機能素子と、回路部と、端子電極とを含み、前記回路部および前記端子電極が前記基板の一方主面上に配置されており、
前記回路部は、第１の電極と、前記機能素子と前記第１の電極とに接続された配線部とを含み、
前記端子電極は、第２の電極と、前記第１の電極と前記第２の電極とに接続された連結部とを含み、
前記樹脂層は、第１の樹脂層を含み、
前記第１の樹脂層は、前記基板の一方主面上に配置され、かつ第１の貫通孔を有しており、
前記第２の電極は、前記基板の一方主面側から見たときの平面図形が、矩形状または角部が円弧となっている矩形状であり、かつ前記第１の樹脂層の前記基板の一方主面と対向していない表面側に配置されており、
前記連結部は、前記基板の一方主面側から見たときの平面図形が、角部が円弧となっている矩形状であり、かつ前記第１の貫通孔内に配置されており、
前記第２の電極の前記平面図形の短軸の長さを分母とし、前記連結部の前記平面図形の短軸の長さを分子としたときの比率が１／２ないし１の間にあり、
前記第２の電極の前記平面図形の長軸の長さを分母とし、前記連結部の前記平面図形の長軸の長さを分子としたときの比率が１／２ないし１の間にあることを特徴とする、電子部品。 An electronic component comprising a substrate, a functional part, and a resin layer,
The functional unit includes a functional element, a circuit unit, and a terminal electrode, and the circuit unit and the terminal electrode are disposed on one main surface of the substrate,
The circuit unit includes a first electrode, and a wiring unit connected to the functional element and the first electrode,
The terminal electrode includes a second electrode, and a connecting portion connected to the first electrode and the second electrode,
The resin layer includes a first resin layer,
The first resin layer is disposed on one main surface of the substrate and has a first through hole,
As for the said 2nd electrode, the planar figure when it sees from the one main surface side of the said board | substrate is a rectangular shape or the rectangular shape by which the corner | angular part is a circular arc, and the said 1st resin layer of the said board | substrate On the other hand, it is arranged on the surface side not facing the main surface,
The connecting portion has a rectangular shape when viewed from one main surface side of the substrate, and has a rectangular shape in which corner portions are arcs, and is disposed in the first through hole,
The ratio of the short axis of the planar figure of the second electrode as a denominator and the short axis length of the planar figure of the connecting part as a numerator is between 1/2 and 1.
The ratio of the length of the long axis of the plane figure of the second electrode as a denominator and the length of the long axis of the plane figure of the connecting portion as a numerator is between 1/2 and 1. Features electronic parts.
前記第２の電極の前記平面図形の長軸の長さを分母とし、前記連結部の前記平面図形の長軸の長さを分子としたときの比率が１／２ないし３／４の間にあることを特徴とする、請求項１に記載の電子部品。 A ratio between the length of the short axis of the plane figure of the second electrode as a denominator and the length of the short axis of the plane figure of the connecting portion as a numerator is between 1/2 and 3/4. Yes,
The ratio of the long axis of the plane figure of the second electrode as a denominator and the length of the long axis of the plane figure of the connecting part as a numerator is between 1/2 and 3/4. The electronic component according to claim 1, wherein there is an electronic component.
前記第２の樹脂層は、前記第１の樹脂層の前記基板の一方主面と対向していない表面側に配置され、かつ第２の貫通孔を有しており、
前記第２の電極は、前記第２の樹脂層から前記第２の貫通孔を介して一部が露出していることを特徴とする、請求項１または２に記載の電子部品。 The resin layer further includes a second resin layer,
The second resin layer is disposed on a surface side of the first resin layer that is not opposed to one main surface of the substrate, and has a second through hole,
3. The electronic component according to claim 1, wherein a part of the second electrode is exposed from the second resin layer through the second through hole.
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