JP2017129801A - Bonded substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonded substrate which allows for checking if an end material section of a first substrate has been removed or not.SOLUTION: A bonded substrate 100 is prepared comprising a fist substrate 1 having a plurality of spaces 14 formed on one surface thereof and a second substrate 2 disposed at a fixed distance from the first substrate 1 with the spacers 14 in between, followed by a check on whether an end material section 1a to be removed has actually been removed from the first substrate 1 or not. The presence/absence of the spacers 14 in the section of the first substrate 1 to be removed is determined based on an imaging result.SELECTED DRAWING: Figure 2

Description

  The present invention includes a bonded substrate, in particular, a first substrate in which a plurality of spacers are formed on one surface, and a second substrate disposed at a certain distance from the first substrate via the spacers. The present invention relates to a bonded substrate.

  Generally, a liquid crystal display panel is constituted by a so-called bonded substrate in which two substrates are bonded together. Specifically, the bonded substrate includes a first substrate and a second substrate bonded to each other. A color filter is formed on the first substrate. A thin film transistor (TFT) for driving the liquid crystal and a terminal portion for external connection are formed on the second substrate. A spacer is formed on one surface of the first substrate, thereby maintaining a cell gap between the first substrate and the second substrate (for example, Patent Document 1).

  Since the terminal portion is a portion connected to an external device, it needs to be exposed. For this reason, it is necessary to remove an end material part from the part which opposes a terminal part in the 1st substrate, ie, the edge part of the 1st substrate. By removing the end material portion of the first substrate, the terminal portion formed on the second substrate is exposed.

JP 2001-201750 A

  If the end material portion of the first substrate is not removed, a problem due to the end material portion may occur in a subsequent process. For this reason, it is necessary to inspect that the end material portion of the first substrate is reliably removed.

  The subject of this invention is providing the bonded substrate which can test | inspect whether the end material part of a 1st board | substrate is removed.

  The bonded substrate board concerning the 1st side of the present invention is provided with the 1st substrate which has an end material part, and the 2nd substrate bonded together to the 1st substrate, and the end material part of the 1st substrate is the 2nd substrate. A spacer projecting toward the second substrate is provided on the surface facing the substrate.

  Here, in a bonded substrate such as a liquid crystal display panel, the first substrate and the second substrate are bonded to each other with a predetermined interval. A spacer is provided between the first substrate and the second substrate in order to maintain a cell gap (interval between the two substrates). The spacer is formed on one surface of the first substrate, that is, the surface of the first substrate facing the second substrate.

  A part of the first substrate has an end material portion to be removed. Therefore, it is not necessary to form a spacer in the end material portion, but in the present invention, it is determined whether the end material portion has been removed by forming a spacer also in the end material portion. I have to. Specifically, the spacer is generally formed in a black columnar shape. If the end material portion of the first substrate remains without being removed, the spacer also remains. Therefore, if the first substrate is photographed and the spacer is photographed, it can be determined that the end material portion remains, and if the spacer is not photographed, it can be determined that the end material portion has been removed.

  Preferably, the first substrate is light transmissive.

  Preferably, the spacer is made of a colored insulating resin.

  Preferably, the first substrate is a color filter substrate and the second substrate is a thin film transistor substrate.

  According to the present invention, it is possible to inspect whether or not the end material portion of the first substrate is removed with a simple configuration.

The perspective view of a bonded substrate board. Sectional drawing of a bonded substrate. The top view of a bonded substrate board. The cross-sectional enlarged view of a bonded substrate. Schematic of an inspection device.

  1 is a perspective view of a bonded substrate, FIG. 2 is a sectional view of the bonded substrate, and FIG. 3 is a plan view thereof. These drawings are schematically shown, and a cell gap between two substrates is omitted.

  As shown in FIG. 1, the bonded substrate 100 includes a first substrate 1 and a second substrate 2. The first substrate 1 and the second substrate 2 are bonded together. The bonded substrate 100 has a rectangular shape in plan view.

  In this embodiment, the bonded substrate is a liquid crystal display panel, the first substrate 1 is a color filter (CF) substrate, and the second substrate 2 is a thin film transistor (TFT) substrate. The first substrate 1 and the second substrate 2 are bonded together by a sealing material (not shown), and a liquid crystal layer is formed between the first substrate 1 and the second substrate 2. The liquid crystal layer is surrounded by a seal member. For example, the bonded substrate 100 is one of a plurality of unit substrates obtained by dividing a mother substrate.

  As shown in an enlarged view in FIG. 4, the first substrate 1 includes a glass substrate 11, a black matrix 12 formed on the lower surface side of the glass substrate 11, a color filter 13, a plurality of spacers 14, and the like. In the first substrate 1, the spacers 14 are mainly formed below the black matrix 12, but the portions corresponding to the end material portions 1 a at the end portions are formed at positions that can be observed from above. The spacer 14 holds the cell gap between the two substrates 1 and 2. The second substrate 2 is made of a glass substrate or the like. The second substrate 2 is a substrate on which a plurality of TFTs and terminal portions 21 are formed. The TFT and the external device are electrically connected via the terminal portion 21. For this reason, it is necessary to expose the terminal portion 21 to the outside.

  An end material portion 1a is formed on the first substrate 1 so that the terminal portion 21 can be exposed to the outside. The end material portion 1 a faces the terminal portion 21 formed on the second substrate 2. By removing the end material portion 1a, the terminal portion 21 is exposed. That is, the end material portion 1 a is a portion that is removed from the first substrate 1 in order to expose the terminal portion 21. The end material portion 1 a is disposed at the end portion of the first substrate 1. By forming a scribe line S on the first substrate 1 and breaking the first substrate 1 along the scribe line S, the first substrate 1 is divided into a main body portion 1b and an end material portion 1a.

  The spacer 14 is made of an insulating resin and is black and columnar. The color filter 13 and the glass substrate 11 formed on the upper side of the spacer 14 are light transmissive. Therefore, as described above, the spacer 14 can be observed from above the first substrate 1 in the portion where the black matrix 12 is not formed.

  FIG. 5 is a schematic view showing the inspection apparatus 30. As shown in FIG. 5, the inspection device 30 includes an imaging unit 31 and a control unit 32. The inspection apparatus 30 is an apparatus that inspects whether or not the end material portion 1 a has been removed from the first substrate 1.

  The imaging unit 31 images the bonded substrate 100. Specifically, the imaging unit 31 images the bonded substrate 100 from above, that is, from the first substrate 1 side. In addition, the photographing unit 31 photographs the end portion of the first substrate 1. The photographing unit 31 may photograph the entire end material part 1a or only a part thereof. The photographing unit 31 may photograph a predetermined position in a fixed state, or may be photographed along a predetermined line while being moved in the longitudinal direction of the end member 1a. Also good.

  The imaging unit 31 captures the bonded substrate 100 and generates image data. This image data is output to the control unit 32. The imaging unit 31 and the control unit 32 may be wirelessly connected or wired. The imaging unit 31 is, for example, a CCD (Charge Coupled Device) camera, a CMOS (Complementary Metal Oxide Semiconductor) camera, or the like.

  The control unit 32 determines the presence / absence of the spacer 14 based on the imaging result obtained by the imaging unit 31. That is, the control unit 32 determines whether the image of the spacer 14 is present in the image data acquired from the imaging unit 31.

  As described above, the spacer 14 is formed on the lower surface of the first substrate 1 (the surface facing the second substrate 2). The spacer 14 is formed not only on the main body 1b of the first substrate 1 but also on the end material 1a. Therefore, when the end material portion 1a is removed from the first substrate 1 in the removal process of the end material portion 1a, the image of the spacer 14 is not captured when the first substrate 1 is imaged.

  On the other hand, when the end material part 1a remains without being removed in the step of removing the end material part 1a, an image of the spacer 14 is present in the photographed image data. Therefore, when the image of the spacer 14 is detected in the control part 32, it turns out that the end material part 1a remains.

  In addition, when it determines with the remainder of the end material part 1a existing by the above inspection, the test | inspection apparatus 30 may be made to perform alerting | reporting operation | movement. The notification operation includes various operations. For example, the device is stopped or a notification sound is generated to notify the worker that the end material portion 1a has not been removed.

[Modification]
As mentioned above, although embodiment of this invention was described, this invention is not limited to these, A various change is possible unless it deviates from the meaning of this invention.

  The shape, arrangement, color, and the like of the spacer are not limited to the above embodiment. Various modifications are possible as long as they can be observed from above the first substrate.

DESCRIPTION OF SYMBOLS 1 1st board | substrate 1a End material part 2 2nd board | substrate 14 Spacer 21 Terminal part 30 Inspection apparatus 31 Imaging | photography part 32 Control part 100 Bonded board | substrate

Claims (4)

A first substrate having end material parts;
A second substrate bonded to the first substrate;
With
The bonded substrate, wherein the end material portion of the first substrate has a spacer projecting toward the second substrate on a surface facing the second substrate.   The bonded substrate according to claim 1, wherein the first substrate has light transparency.   The bonded substrate according to claim 1, wherein the spacer is formed of a colored insulating resin. The bonded substrate according to claim 1, wherein the first substrate is a color filter substrate and the second substrate is a thin film transistor substrate.