JP2009258398A - Driving substrate, display device, electronic apparatus, method for inspecting exposure deviation, and mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily detect the location of a shot joint in a display area in divided exposure and to shorten time required for inspecting a joint of patterns. <P>SOLUTION: A driving substrate 1 includes a diving element formation area 10 formed by dividing the area 10 into a plurality of exposure regions and marks each of which is arranged on a position to be a boundary between adjacent exposure regions in the driving element formation area 10 to discriminate an exposure deviation between both the exposure regions. The marks may be arranged in the vicinities of corner portions of an exposure region composed of a rectangle or may be arranged in the vicinities of respective corner portions of four exposure regions which are mutually adjacent to a certain exposure region composed of a rectangle. A mask includes an exposure pattern area corresponding to one exposure for forming the element formation area by divided exposure and a mark formed on a joint part of divided exposure in the exposure pattern area. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a drive substrate including a drive element that drives each pixel in a display region, a display device, an electronic apparatus, an exposure deviation inspection method, and a mask.

  In a display device such as a liquid crystal display device or an organic EL display device, a drive substrate for driving each pixel is used. The drive substrate is formed with a drive transistor such as a TFT (Thin Film Transistor) for driving each pixel arranged in a matrix in the image display area.

  In recent years, an increase in the size of a display device has progressed, and in response to this, there is a need to produce a drive substrate that is large and accurate. In order to cope with the manufacture of such a drive substrate, division exposure is performed in which a display area for forming a drive element is divided into a plurality of exposure areas. In other words, since the display area repeats the same pattern for each pixel, the display area is divided into several vertical and horizontal areas, and each area is exposed (shot) and connected to form a large display area. ing.

  At this time, if the positions of the shots vary, defects such as disconnection of the wiring connected between the shots will occur, so a technique is disclosed that enables inspection of positional deviation between shots (Patent Document). 1).

Japanese Patent Laid-Open No. 2000-231184

  However, the technique described in the cited document 1 has a problem that a shot shift in the device region cannot be accurately detected because the mark is provided outside the device region. In other words, what is important in the joint of shots when performing divided exposure is the state of the pattern formed in the display area, and this part affects the performance of the display device. Therefore, in the divided exposure, the alignment accuracy at the seam of the shot in the display area is very important. However, with the technique described in Patent Document 1, it is possible to inspect the pattern seam in the display area quickly and accurately. Can not.

  The present invention makes it easy to find the position of a shot seam in a display area in divided exposure, and can reduce the time required for pattern seam inspection. The purpose is to provide.

  The present invention includes an element that provides a drive signal to a drive target, and is formed by dividing into a plurality of exposure areas, and a boundary between adjacent exposure areas provided in the drive element formation area. And a mark for discriminating an exposure shift between the two exposure areas.

  In the present invention as described above, when the drive element formation region is formed by dividing into a plurality of exposure regions, the exposure deviation of both exposure regions is determined at the position of the seam that becomes the boundary between adjacent exposure regions in the drive element formation region. Since the mark to be provided is provided, the joint of the divided exposure in the drive element formation region can be easily found, and the deviation of the divided exposure in the drive element formation region can be accurately inspected.

  In the present invention, the mark is arranged in the vicinity of the corner of the rectangular exposure area, or in the vicinity of each corner of the four exposure areas adjacent to each other in the rectangular exposure area. As a result, it is possible to quickly perform exposure shifts of four adjacent exposure areas using marks arranged in one place.

  In the present invention, the mark is also provided at a position shifted by a certain amount in each layer when exposure is performed in multiple layers in the exposure region. Accordingly, it is possible to easily detect a deviation from the adjacent exposure area in the same layer in the exposure area, and also to easily detect a deviation between multiple layers.

  In addition, the present invention includes a display area that displays an image and a drive substrate that includes an element that drives each pixel in the display area, and the drive substrate is formed by being divided into a plurality of exposure areas. The display device includes a formation region and a mark provided in the drive element formation region, and a mark for determining an exposure shift between the two exposure regions at a position serving as a boundary between the adjacent exposure regions.

  In the present invention, when the drive element formation region is formed by dividing into a plurality of exposure regions as the drive substrate of the display device, both the positions of the seams that are the boundaries of adjacent exposure regions in the drive element formation region are provided. Since it has a mark to distinguish the exposure deviation in the exposure area, it is easy to find the joint of the divided exposure in the drive element formation area, and accurately checks the deviation of the divided exposure in the drive element formation area. become able to.

  In addition, the present invention includes a display device attached to the main body housing, and a drive element formation region in which a drive substrate that drives each pixel in the display device is divided into a plurality of exposure regions, and a drive element formation An electronic apparatus having a mark provided in an area and a mark for determining an exposure shift between both exposure areas at a position that is a boundary between the adjacent exposure areas.

  In the present invention as described above, when a drive element formation region is formed by dividing into a plurality of exposure regions as a drive substrate for driving each pixel in a display device of an electronic device, adjacent exposure regions in the drive element formation region are formed. Since a mark for discriminating the exposure deviation between the two exposure areas is provided at the boundary seam position, it is possible to easily find the seam of the divided exposure in the drive element formation area. It becomes possible to accurately inspect the deviation of the divided exposure.

  The present invention also includes a step of detecting a position of a mark provided at a joint portion of divided exposure in an element formation region formed by joining a plurality of exposure regions by divided exposure, and the divided exposure from the detected mark position. And a step of determining an exposure deviation.

  In the present invention as described above, in order to detect the position of the mark provided at the joint portion of the plurality of exposure areas by the divided exposure and discriminate the exposure shift in the divided exposure from the detected position of the mark, the divided exposure in the element forming area is performed. Thus, it becomes possible to accurately inspect the exposure shift at the joint portion.

  Further, the present invention is a mask having an exposure pattern region corresponding to one exposure for forming an element formation region by divided exposure, and a mark provided at a joint portion of the divided exposure in the exposure pattern region.

  In the present invention, when the element forming area is formed by the divided exposure, since the mark is provided at the joint portion of the divided exposure in the exposure pattern area, it becomes a boundary between adjacent exposure areas in the element forming area. A mark for discriminating the exposure deviation between the two exposure regions can be formed at the joint position.

  According to the present invention, in performing the divided exposure, the mark is arranged at the shot boundary of the divided exposure in the drive element formation region, whereby the visual inspection after the patterning can be efficiently performed, and the performance of the display device is improved. It becomes possible to quickly and accurately inspect the misalignment of exposure at an important part.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Overview of drive substrate>
FIG. 1 is a schematic plan view for explaining the outline of the drive substrate according to the present embodiment. That is, the drive substrate 1 includes, for example, a drive element formation region 10 provided substantially at the center of a support substrate such as a glass substrate, a power supply unit 20 disposed around the drive element formation region 10, a signal line input unit 21, and a scanning signal. An input unit 24 and a power control signal input unit 25 are provided. In the drive element formation region 10, a plurality of pixel portions 30 are arranged in a matrix form, and in a display device that displays a color image, for example, pixels corresponding to R (red), G (green), and B (blue). A display pixel is configured by the combination of the units 30.

  Each pixel unit 30 is provided with a driving unit 31 including a driving transistor. A driving transistor of the driving unit 31 is formed of a thin film transistor (TFT) formed on a substrate, and drives a driving target provided in the pixel unit 30 by applying a voltage. When the driving target of the pixel unit 30 is an organic EL (Electro Luminescence) light emitting layer, the electric field applied to the organic EL light emitting layer corresponding to each color is controlled by a driving transistor, and when the driving target of the pixel unit 30 is a liquid crystal layer Controls the electric field applied to the liquid crystal by the driving transistor.

  A power supply control line 22 and a scanning line 23 are connected to the driving transistor, and an image is displayed by sequentially driving the driving transistor in the driving element formation region 10 by the scanning signal input unit 24. That is, the power supply voltage is supplied from the power supply control line 22 to the horizontal pixel column selected by the scanning line 23, and it corresponds according to the pixel signal input from the signal line input unit 21 through the signal line 26 in the vertical pixel column direction. Pixel display is performed. Then, by synchronizing the selection of the horizontal pixel column by the scanning line 23 and the input of the pixel signal from the signal line 26, the driving element forming region 10 is driven and an image is displayed.

  In order to manufacture the driving substrate 1, each layer such as a semiconductor layer and an insulating film layer is formed on a supporting substrate by a film forming process such as CVD (Chemical Vapor Deposition), and the driving element 1 is formed by an impurity implantation process, a photolithography process, or the like. Formation and wiring patterning are performed.

  In the present embodiment, in the circuit formation of the drive element formation region 10 on the drive substrate 1, the drive element formation region 10 is formed by divided exposure in which exposure is performed by dividing the drive element formation region 10 into a plurality of exposure regions. Here, one exposure in the divided exposure is called a shot. In the present embodiment, the same exposure pattern is connected by a plurality of shots, and the exposure of one drive element formation region 10 is configured. For example, in a patterning step when manufacturing a display device using organic EL (Electro Luminescence), in order to improve alignment accuracy in a plurality of layers, divided exposure is performed on a mask of each layer.

<Mask configuration: Shot arrangement for division exposure>
2A and 2B are schematic diagrams for explaining the mask configuration and the shot arrangement of the divided exposure. FIG. 2A is a schematic diagram showing an example of the pattern arrangement on the reticle corresponding to the shot, and FIG. It is a schematic diagram which shows the example of the shot arrangement | positioning at the time of exposing. As shown in FIG. 2A, a plurality of types of exposure patterns for divided exposure are formed on one mask. Shot_pix provided in the center is a pattern for exposing the drive element formation region. Further, Shot_L_1, Shot_R_1, Shot_T_1, and Shot_B_1 provided around the Shot_pix are patterns for exposing a driving circuit arranged around the driving element formation region.

  In the present embodiment, a mark M is provided at a joint portion in divided exposure in Shot_pix that is an exposure pattern corresponding to one exposure of divided exposure in the drive element formation region, that is, an end portion in the region of the exposure pattern Shot_pix. Yes. The mark M only needs to be provided on at least one side of the boundary line in the region of the exposure pattern Shot_pix formed of a rectangle. Further, as in the example shown in FIG. 2A, the mark M may be provided corresponding to all the upper, lower, left, and right boundary lines of the area of the exposure pattern Shot_pix. By providing the mark M corresponding to all the upper, lower, left, and right boundary lines, it becomes possible to verify the exposure shift in the exposure pattern area adjacent in any direction, up, down, left, or right during the divided exposure using the exposure pattern Shot_pix. .

  Further, since the mark M is provided in the vicinity of the corner of the area of the exposure pattern Shot_pix, the marks M corresponding to the exposure pattern Shot_pix are gathered at the corner at each corner of the four adjacent exposure patterns Shot_pix. Since exposure is performed, it is possible to quickly inspect the exposure deviation of each exposure pattern Shot_pix using the mark M arranged in one place.

  As shown in FIG. 2B, when performing divided exposure in photolithography on a predetermined film formed on a glass substrate, a mask having a layout as shown in FIG. 2A is used and Shot_pix at the center of the reticle is used. The exposure is moved several times vertically and horizontally. In the example shown in FIG. 2B, exposure is performed twice in the vertical direction in the drawing and three times in the horizontal direction in the drawing, for a total of six times, and is made to correspond to the entire exposure of the drive element forming region 10 shown in FIG. . Further, Shot_L_1, Shot_R_1, Shot_T_1, and Shot_B_1 are exposed to a region to be a peripheral driver circuit using the mask illustrated in FIG.

<About shot seams>
FIG. 3 is a schematic diagram illustrating shot seams. FIG. 3A shows a post-exposure pattern formed when the divided exposure is performed. If there is a positional shift in at least one of the adjacent Shot_pix subjected to the divided exposure, a gap is generated in the pattern P straddling the boundary (seam). Note that the seam, which is the boundary of this shot, is a virtual boundary for explanation. FIG. 3B is an enlarged view of the pattern P straddling the seam. Thus, when a gap is generated in the pattern P, it causes a disconnection of the formed wiring pattern.

  FIG. 4 is a schematic diagram illustrating an example in which a pattern after exposure is extended in consideration of shot variation. As shown in FIG. 4A, among the patterns P after exposure by Shot_pix, the ends of the patterns P connected to the adjacent shots are extended in consideration of the shot variation.

  For example, since the shot position accuracy is about 0.5 to 2 μm, the edge of the pattern P corresponding to the joint portion of the shot shown in FIG. 4A is designed to be extended by a variation (for example, about 2 μm). Yes.

  FIG. 4B shows a state in which the shot_pix is divided and exposed. Since the pattern P after exposure by Shot_pix is extended, the pattern P is exposed to multiple times at the joint portion of the adjacent Shot_pix. Accordingly, as shown in FIG. 4C, in the pattern P straddling the seam of the shot, the constriction due to the multiple exposure of the seam portion occurs.

  After patterning by performing such divided exposure, it is necessary to visually inspect the shot seam with an optical microscope. However, there are a lot of such shot seams on a support substrate such as a glass substrate, and it is difficult to understand visually, so it takes time for visual inspection.

<Example of mark>
FIG. 5 is a schematic diagram for explaining marks applied in the present embodiment. As described above, when performing divided exposure, problems such as disconnection and constriction are likely to occur in the pattern P straddling the seam of shots. In particular, when such a disconnection or constriction of the pattern P occurs in the drive element formation region, the drive characteristics are greatly affected. Therefore, in the present embodiment, in the exposure shot of the driving element formation region, a mark M for determining a shift between adjacent shots is provided in the vicinity of the joint of the shot. At this time, the mark M is arranged at a position where it does not interfere with the pattern P.

  In the example shown in FIG. 5A, an exposure pattern to be a mark M is provided in the vicinity of the pattern P that crosses the joint in the exposure pattern Shot_pix. The mark M is formed simultaneously with the pattern P by exposure. Therefore, the mark M is formed on the reticle constituting Shot_pix and also on the support substrate after exposure. The mark M is provided linearly along the same direction as the pattern P that straddles the seam, and is provided so as to straddle the seam similarly to the pattern P.

  When the exposure pattern Shot_pix as shown in FIG. 5A is divided and exposed so as to be adjacent to each other, a post-exposure pattern as shown in FIG. 5B is formed. That is, the pattern P is exposed so as to straddle the adjacent exposure pattern Shot_pix, and the mark M overlaps and is exposed at the joint portion.

  In the driving substrate of the present embodiment, the mark M is exposed at the joint portion that becomes the boundary of the divided exposure in the drive element forming region in this way. It is possible to easily confirm the deviation. As a result, it is possible to accurately inspect in a short time the deviation of the divided exposure in the drive element formation region which is important in the characteristics of the drive substrate. In particular, since the mark M is provided at the joint portion in the drive element formation region, the joint portion of the divided exposure can be easily found in the drive element formation region, and the inspection time can be shortened.

  Here, in order to inspect the shift of the divided exposure by the mark M, it may be determined by the size of the mark M after the exposure. For example, when there is no deviation in divided exposure, the joint mark M of adjacent shots is completely subjected to multiple exposure, and the size (width, length) in this case is a preset size. On the other hand, when a deviation occurs in either direction in the adjacent shot, the joint mark M of the adjacent shot is not completely multiple-exposed and has a different exposure size as compared with the case where it is completely multiple-exposed. It can be determined that a deviation has occurred due to the difference in exposure size.

  The mark M may be provided near the corner of the exposure pattern Shot_pix provided in the rectangular area. By providing the mark M at the corner portion of the exposure pattern Shot_pix, it is possible to inspect the exposure deviations of the four exposure patterns Shot_pix adjacent to each other in the exposure pattern Shot_pix provided in the rectangular area.

  FIG. 6 is a diagram showing an example in which four exposure patterns provided in a rectangular area are adjacent vertically and horizontally. As described above, when the four exposure patterns Shot_pix are adjacent to each other, by providing the mark M at the adjacent corner, the exposure deviation of the four exposure patterns Shot_pix is changed depending on the positional relationship of each mark concentrated at the corner. It becomes possible to inspect in a short time. Specific examples of the marks M provided at the corners shown in FIG. 6 are shown in the enlarged corners of FIGS.

  The example of the mark shown in FIG. 7 is an example in which an oblique straight mark M is provided at each corner of four adjacent exposure patterns Shot_pix, and the four marks M form an X shape. By providing oblique straight marks M at the respective corners of the four exposure patterns Shot_pix, when the four exposure patterns Shot_pix are exposed without misalignment, the marks M of the exposure patterns Shot_pix constitute accurate x marks. It will be. If the crosses are not accurately configured, the relative positional deviation of each exposure pattern Shot_pix can be determined by detecting the positional relationship between the marks M.

  The example of the mark shown in FIG. 8 is an example in which a diagonal straight mark M is provided at each corner of four adjacent exposure patterns Shot_pix, and the four marks M form a rhombus. By providing oblique straight marks M at the corners of the four exposure patterns Shot_pix, when the four exposure patterns Shot_pix are exposed without misalignment, accurate marks are formed by the marks M of the exposure patterns Shot_pix. become. If the rhombus is not accurately configured, the relative positional deviation of each exposure pattern Shot_pix can be determined by detecting the positional relationship between the marks M.

  The example of the mark shown in FIG. 9 is an example in which an arc-shaped mark M is provided at each corner of four adjacent exposure patterns Shot_pix, and the four marks M form a circle. By providing the arc-shaped mark M at each corner of the four exposure patterns Shot_pix, when the four exposure patterns Shot_pix are exposed without positional displacement, the mark ○ of each exposure pattern Shot_pix forms an accurate ○ shape. It will be. If the mold is not accurately configured, the relative positional deviation of each exposure pattern Shot_pix can be determined by detecting the positional relationship between the marks M.

<Examples of other marks>
FIG. 10 is a schematic diagram showing an example of another mark. Among these, the example of the mark shown in FIG. 10A is an example constituted by notches in the exposure pattern. That is, when there is a pattern P that straddles the seam in the adjacent exposure pattern Shot_pix, a part of the end of the seam portion of the pattern P is cut out as a mark M. Thus, when the exposure pattern Shot_pix is exposed adjacently, the notch h faces the seam portion of the pattern P that straddles the seam.

  When the adjacent exposure pattern Shot_pix is exposed without misalignment, the notch h facing each other is accurately rectangular. On the other hand, when the notch h facing each other is not an accurate rectangle, the relative positional deviation of each exposure pattern Shot_pix can be determined by detecting the positional relationship between the notches h.

  The example of the mark shown in FIG. 10B is an example provided at different positions between the layers of the multilayer film. In pattern exposure in the drive element formation region, formation of each layer and exposure are repeatedly performed in order to cope with multilayer wiring. For example, in order to form a first layer wiring pattern, a conductive film to be a first layer wiring pattern is formed on a support substrate, and a resist is applied and exposure and patterning corresponding to the first layer wiring pattern are performed. I do. Next, a conductive film to be a second layer wiring pattern is formed thereon via an insulating film, and exposure and patterning corresponding to the second layer wiring pattern are performed with a resist applied. In such a multilayer wiring, the alignment of the pattern between the layers is important.

  In the mark shown in FIG. 10B, the mark M1 is formed so as to straddle the joint in the divided exposure for forming the first layer wiring pattern. Thereby, the shift | offset | difference of the division | segmentation exposure at the time of forming the wiring pattern of a 1st layer can be test | inspected. Further, the mark M2 is formed so as to straddle the joint in the divided exposure for forming the second layer wiring pattern. The mark M2 is provided at a position different from the mark M1. Thereby, the shift | offset | difference of the division | segmentation exposure at the time of forming the wiring pattern of a 2nd layer can be test | inspected. Furthermore, since the mark M1 and the mark M2 are at different positions, the positional deviation between the layers can be inspected based on the relative positional relationship between the mark M1 and the mark M2.

<Exposure deviation inspection method>
The following procedure is used to inspect the exposure pattern in which the drive element formation region is divided and exposed using the mask according to the present embodiment. First, a plurality of exposure areas are connected by divided exposure, the drive element forming area is exposed, and the position of the joint mark in the divided exposure of the drive element forming area is detected. The mark position may be detected by using, for example, an optical microscope or by processing an image captured by the optical microscope. When divided exposure is performed, the position of each mark in both exposure areas is detected at the joint between adjacent exposure areas in the divided exposure.

  Next, a deviation between adjacent exposure areas is determined based on the detected mark position. One mark and the other mark of the adjacent exposure region are detected as the marks at the joint portion detected earlier. By measuring the interval between the two marks and comparing it with a predetermined reference value, it is possible to determine the exposure deviation between adjacent exposure regions.

  Further, if the position (coordinates) of each mark from one reference (for example, the origin of the substrate) is detected, it is possible to inspect the exposure deviation amount of each exposure area of the divided exposure. Further, when each layer of the multilayer film is formed by divided exposure, if the mark positions between the multilayers as shown in FIG. 10B are detected in the same manner as described above, the exposure shift between the multilayers at the same divided exposure position. Can be detected.

  Next, an application example of the display device according to the present embodiment will be described.

<Display device>
The display device according to the present embodiment includes a flat module-shaped display as shown in FIG. For example, a pixel array portion 2002a in which pixels made up of a light emitting region, a thin film transistor, a light receiving element, and the like are integrated and formed in a matrix is provided on an insulating substrate 2002. An adhesive is provided so as to surround the pixel array portion (pixel matrix portion) 2002a. 2021 is provided, and a counter substrate 2006 such as glass is attached to form a display module. The transparent counter substrate 2006 may be provided with a color filter, a protective film, a light shielding film, and the like as necessary. For example, an FPC (flexible printed circuit) 2023 may be provided in the display module as a connector for inputting / outputting a signal or the like to / from the pixel array unit 2002a from the outside.

<Application example of display device>
The display device according to the present embodiment described above is input to various electronic devices shown in FIGS. 12 to 15, for example, electronic devices such as digital cameras, notebook personal computers, mobile terminal devices such as mobile phones, and video cameras. The video signal generated or the video signal generated in the electronic device can be applied to a display device of an electronic device in any field for displaying as an image or a video. Below, an example of the electronic device to which this embodiment is applied is demonstrated.

  FIG. 12 is a perspective view showing a television to which the present embodiment is applied. The television according to this application example includes a video display screen unit 101 including a front panel 102, a filter glass 103, and the like, and is created by using the display device according to this embodiment as the video display screen unit 101.

  13A and 13B are perspective views showing a digital camera to which the present embodiment is applied, in which FIG. 13A is a perspective view seen from the front side, and FIG. 13B is a perspective view seen from the back side. The digital camera according to this application example includes a light emitting unit 111 for flash, a display unit 112, a menu switch 113, a shutter button 114, and the like, and is manufactured by using the display device according to the present embodiment as the display unit 112. .

  FIG. 14 is a perspective view showing a notebook personal computer to which the present embodiment is applied. A notebook personal computer according to this application example includes a main body 121 including a keyboard 122 that is operated when characters or the like are input, a display unit 123 that displays an image, and the like, and the display unit 123 includes a display device according to the present embodiment. It is produced by using.

  FIG. 15 is a perspective view showing a video camera to which the present embodiment is applied. The video camera according to this application example includes a main body 131, a subject shooting lens 132 on a side facing forward, a start / stop switch 133 at the time of shooting, a display unit 134, and the like. It is manufactured by using the display device according to the above.

  FIG. 16 is a diagram showing a mobile terminal device to which the present embodiment is applied, for example, a mobile phone, in which (A) is a front view in an opened state, (B) is a side view thereof, and (C) is closed. (D) is a left side view, (E) is a right side view, (F) is a top view, and (G) is a bottom view. The mobile phone according to this application example includes an upper housing 141, a lower housing 142, a connecting portion (here, a hinge portion) 143, a display 144, a sub display 145, a picture light 146, a camera 147, and the like. In addition, the display device according to this embodiment is used as the sub display 145.

<Display imaging device>
The display device according to the present embodiment is applicable to the following display imaging device. In addition, the display imaging device can be applied to the various electronic devices described above. FIG. 17 illustrates the overall configuration of the display imaging apparatus. The display imaging apparatus includes an I / O display panel 2000, a display drive circuit 1200, a light receiving drive circuit 1300, an image processing unit 1400, and an application program execution unit 1100.

  The I / O display panel 2000 includes organic electroluminescent elements in which a plurality of pixels are arranged in a matrix over the entire surface, and displays an image such as a predetermined figure or character based on display data while performing line sequential operation. In addition to having a function (display function), as described later, it has a function (imaging function) for imaging an object that is in contact with or close to the I / O display 2000.

  The display drive circuit 1200 drives the I / O display panel 2000 (drives line-sequential operation) so that an image based on display data is displayed on the I / O display panel 2000 (so as to perform a display operation). Circuit).

  The light receiving drive circuit 1300 is a circuit that drives the I / O display panel 2000 (drives line-sequential operation) so that light reception data can be obtained in the I / O display panel 2000 (so as to image an object). It is. The light reception data at each pixel is accumulated in the frame memory 1300A, for example, in units of frames, and is output to the image processing unit 14 as a captured image.

  The image processing unit 1400 performs predetermined image processing (arithmetic processing) based on the captured image output from the light receiving drive circuit 1300, and information (position coordinate data, object of the object) that is in contact with or close to the I / O display 2000. Data on the shape and size, etc.) are detected and acquired. The details of the detection process will be described later.

  The application program execution unit 1100 executes processing according to predetermined application software based on the detection result of the image processing unit 1400. For example, the display data includes the position coordinates of the detected object, and the I / O What is displayed on the display panel 2000 is mentioned. The display data generated by the application program execution unit 1100 is supplied to the display drive circuit 1200.

  Next, a detailed configuration example of the I / O display panel 2000 will be described with reference to FIG. The I / O display panel 2000 includes a display area (sensor area) 2100, a display H driver 2200, a display V driver 2300, a sensor readout H driver 2500, and a sensor V driver 2400. Yes.

  The display area (sensor area) 2100 is an area that modulates light from the organic electroluminescent element to emit display light and images an object that is in contact with or close to the area, and is an organic light emitting element (display element). Electroluminescent elements and light receiving elements (imaging elements), which will be described later, are arranged in a matrix.

  The display H driver 2200 drives the organic electroluminescence element of each pixel in the display area 2100 together with the display V driver 2300 based on the display drive display signal and the control clock supplied from the display drive circuit 1200. It is.

  The sensor readout H driver 2500 drives the light receiving element of each pixel in the sensor area 2100 together with the sensor V driver 2400 to obtain a light reception signal.

  Next, a connection relationship between each pixel in the display area 2100 and the sensor readout H driver 2500 will be described with reference to FIG. In this display area 2100, a red (R) pixel 3100, a green (G) pixel 3200, and a blue (B) pixel 3300 are arranged side by side.

  The charges accumulated in the capacitors connected to the light receiving sensors 3100c, 3200c, and 3300c of each pixel are amplified by the respective buffer amplifiers 3100f, 3200f, and 3300f, and the signals are output at the timing when the readout switches 3100g, 3200g, and 3300g are turned on. It is supplied to the sensor reading H driver 2500 via the output electrode. Each signal output electrode is connected to a constant current source 4100a, 4100b, 4100c, and a signal corresponding to the amount of received light is detected with high sensitivity by the sensor reading H driver 2500.

It is a schematic plan view explaining the outline | summary of the drive substrate which concerns on this embodiment. It is a schematic diagram explaining shot arrangement of division exposure. It is a schematic diagram explaining the joint of a shot. It is a schematic diagram which shows the example which has extended the pattern after exposure in consideration of the dispersion | variation in a shot. It is a schematic diagram explaining the mark applied in this embodiment. It is a figure which shows the example which four of the exposure patterns provided in a rectangular area adjoin vertically and horizontally. It is a corner enlarged view explaining the example which comprises X type by four marks M. It is a corner enlarged view explaining the example which comprises a rhombus with four marks M. FIG. It is a corner enlarged view explaining an example which constitutes a circle shape with four marks M. It is a corner part enlarged view explaining the example comprised by the notch in an exposure pattern. It is a schematic diagram which shows the example of a flat type module shape. It is a perspective view which shows the television with which this embodiment is applied. It is a perspective view which shows the digital camera to which this embodiment is applied. It is a perspective view which shows the notebook type personal computer to which this embodiment is applied. It is a perspective view which shows the video camera to which this embodiment is applied. It is a figure which shows the portable terminal device to which this embodiment is applied, for example, a mobile telephone. It is a block diagram showing the structure of a display imaging device. It is a block diagram showing the structural example of an I / O display panel. It is a circuit diagram for demonstrating the connection relation of each pixel and the sensor reading H driver.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Drive substrate, 10 ... Drive element formation area, 20 ... Power supply part, 21 ... Signal line input part 21, 24 ... Scanning signal input part, 25 ... Power supply control signal input part, 30 ... Pixel part, M ... Mark, P ... Pattern

Claims (9)

A drive element forming region that includes an element that gives a drive signal to a drive target, and is divided into a plurality of exposure regions;
A drive substrate having a mark provided in the drive element formation region and a mark for discriminating an exposure shift between the exposure regions at a position that is a boundary between the adjacent exposure regions. The drive substrate according to claim 1, wherein the mark is provided in the vicinity of a corner of the exposure area having a rectangular shape. The drive substrate according to claim 1, wherein the mark is provided in the vicinity of each corner of four exposure areas adjacent to each other in the exposure area formed of a rectangle. The drive substrate according to claim 1, wherein the mark is provided at a position shifted by a certain amount in each layer when the exposure is performed in multiple layers in the exposure region. A display area for displaying images;
A drive substrate including an element for driving each pixel of the display area;
The drive substrate is
A drive element formation region formed by dividing into a plurality of exposure regions;
A display device provided in the drive element formation region and having a mark for determining an exposure shift between both exposure regions at a position that is a boundary between the adjacent exposure regions. Having a display device attached to the main body housing;
A driving substrate for driving each pixel in the display device,
A drive element formation region formed by dividing into a plurality of exposure regions;
An electronic apparatus having a mark provided in the drive element formation region and a mark for determining an exposure shift between both exposure regions at a position that is a boundary between adjacent exposure regions. Detecting a position of a mark provided at a joint portion of the divided exposure in the element formation region formed by joining a plurality of exposure regions by divided exposure;
And a step of discriminating an exposure shift in divided exposure from the detected position of the mark. An exposure pattern area corresponding to one exposure for forming an element formation area by divided exposure;
And a mark provided at a joint portion of the divided exposure in the exposure pattern region. The mask according to claim 8, wherein the mark is provided in the vicinity of a corner of the exposure pattern region formed of a rectangle.

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