JP2017129514A - X-ray diffraction measurement device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an X-ray diffraction measurement device which enables speedy adjustment of position and attitude of a housing thereof for triaxial residual stress measurement, and allows for easily making measurement even when an object under measurement is in a narrow space.SOLUTION: An X-ray diffraction measurement device is provided with a tilt angle adjustment mechanism 5 for changing a tilt angle of a housing 50 thereof about a rotation axis that intersects with an optical axis of an output X-ray with an intersecting point located at a preset distance L set from an imaging plate 15. Distance from an X-ray irradiation point on an object OB under measurement to the imaging plate 15 is set to a preset value L, and a tilt angle of the housing 50 is altered by the tilt angle adjustment mechanism 5 to produce two states with different incident angles of the X-ray to the object OB under measurement. The object OB under measurement is irradiated with the X-ray at each of the two incident angles, and diffraction rings imaged on the imaging plate 15 are detected. Triaxial residual stress is calculated from the detected shapes of the two diffraction rings and the two incident angles.SELECTED DRAWING: Figure 1

Description

  The present invention uses an X-ray diffractometer that irradiates a measurement object with X-rays and detects the shape of an X-ray diffraction ring formed by the X-ray diffracted by the measurement object, and the X-ray diffraction measurement apparatus. The present invention relates to an X-ray diffraction measurement method.

  Conventionally, for example, as shown in Patent Document 1, an X-ray diffraction ring (hereinafter referred to as a diffraction ring) is formed by X-rays diffracted by a measurement object by irradiating the measurement object with X-rays at a predetermined incident angle. There is known an X-ray diffraction measurement apparatus that forms a diffraction ring, detects the shape of the formed diffraction ring, performs analysis by a cos α method, and measures a residual stress of a measurement object. The apparatus disclosed in Patent Document 1 includes an X-ray emitter, a diffraction ring imaging means such as an imaging plate, a diffraction ring reading means such as a laser detection device and a laser scanning mechanism, and a diffraction ring erasing means such as an LED irradiator. Are provided in one housing. In addition, the position and posture of the housing with respect to the measurement object can be changed by the arm type moving device. Then, after adjusting the position and orientation of the housing with respect to the measurement object, an imaging process for imaging the diffraction ring on the imaging plate by diffracted X-rays generated by irradiating the measurement object with X-rays, and laser detection on the imaging plate A reading process for detecting the shape of the diffractive ring by irradiating the laser beam from the apparatus while scanning and an erasing process for erasing the diffractive ring by irradiating the LED light can be performed continuously. If this X-ray diffraction measuring apparatus is used, the residual stress of the measuring object can be measured in a short time after the apparatus is transported to a place where the measuring object is located and the arm type moving device is fixed.

  When measuring the residual stress of a measurement object, the residual normal stresses σx and σy and the residual shear stress τxy (hereinafter referred to as plane residual stress) in two directions on the surface of the measurement object are often measured. Depending on the case, the residual normal stress σx, σy, σz and the residual shear stress τxy, τyz, τxz (hereinafter referred to as triaxial residual stress) may be measured. In order to measure the triaxial residual stress with an X-ray diffractometer as shown in Patent Document 1, it is only necessary to measure the same portion of the measurement object a plurality of times while changing the X-ray irradiation direction. For example, in Patent Document 2, an X-ray optical axis is included in a plane including a normal line of a measurement location (hereinafter referred to as Z-axis) and a line in the direction of residual normal stress σx from the measurement location (hereinafter referred to as X-axis). Two measurements are performed when X-rays are irradiated to the measurement object at a predetermined incident angle and when X-ray optical axes are aligned with the Z-axis (ie, perpendicular to the measurement location). And a method of calculating the triaxial residual stress from the shape of the diffraction ring obtained by each measurement is shown. If this method is used, the triaxial residual stress of the measurement object can be measured by two measurements.

International Publication No. 2014/128874 JP 2014-13203 A

  However, when X-ray irradiation is performed obliquely and perpendicularly to the measurement location and X-ray diffraction measurement is performed, the X-ray diffraction measurement is performed so that the X-ray irradiation location (measurement location) in each measurement is the same. There is a problem that it is necessary to adjust the position and orientation of the housing of the apparatus, and it takes time to adjust and it takes time to measure the triaxial residual stress. Further, when the measurement object is in a narrow place, there is a problem that it may be difficult to irradiate X-rays from the oblique direction and the perpendicular direction to the measurement place.

  The present invention has been made to solve this problem, and its purpose is to irradiate the measurement object with X-rays and detect the shape of the diffraction ring formed by the X-rays diffracted by the measurement object. In the X-ray diffraction measurement method using the measurement device and the X-ray diffraction measurement device, when measuring the triaxial residual stress, it takes no time to adjust the position and orientation of the housing of the X-ray diffraction measurement device. An object of the present invention is to provide an X-ray diffraction measurement apparatus and an X-ray diffraction measurement method that do not make measurement difficult even when an object is in a narrow place.

  In order to achieve the above object, the present invention is characterized in that an X-ray emitter that emits X-rays toward an object to be measured and an X-ray emitted from the X-ray emitter toward the object to be measured. In this case, diffracted X-rays generated at the measurement object are received by an imaging surface perpendicular to the optical axis of the X-rays emitted from the X-ray emitter, and an image of the diffracted X-rays is captured on the imaging surface. The diffraction ring formation detection means for forming the diffraction ring and detecting the shape of the diffraction ring, the housing in which the X-ray emitter and the diffraction ring formation detection means are disposed, and the inclination angle of the housing are represented by X An inclination angle changing mechanism that changes a rotation axis that intersects the optical axis of the X-ray emitted from the line emitter, the intersection point changing around a rotation axis that is a preset distance from the imaging surface, and X-ray emission X-ray diffractometer comprising an incident angle detection means for detecting an incident angle of an X-ray emitted from the detector to an object to be measured In the apparatus, the X-ray emitter, the diffraction ring formation detection means, the tilt angle change mechanism and the incident angle detection means are controlled, and the shape of the diffraction ring detected by the diffraction ring formation detection means and the incident angle detected by the incident angle detection means Control means for performing an operation using the sensor, and the control means causes the incident angle detection means to detect the incident angle in a state where the point where the rotation axis intersects the optical axis of the X-ray coincides with the measurement location of the measurement object. A first diffraction ring detection step of controlling the X-ray emitter and the diffraction ring formation detection means to detect the shape of the diffraction ring imaged on the imaging surface by irradiating the measurement object with X-rays; The angle changing mechanism is controlled to make the housing have different inclination angles, and after the incident angle detecting means detects the incident angle, the X-ray emitter and the diffractive ring formation detecting means are controlled so that the measurement object has X The second time to detect the shape of the diffraction ring imaged on the imaging surface by irradiating a line The ring detection step and the calculation step of calculating the triaxial residual stress using the two diffraction ring shapes and the two incident angles obtained in the first diffraction ring detection step and the second diffraction ring detection step are performed. There is.

  According to this, if the distance from the X-ray irradiation point of the measurement object to the imaging surface is set to a preset distance, the X-ray irradiation point is rotated when the tilt angle changing mechanism changes the tilt angle. Since it is included in the shaft, it is possible to change the X-ray incident angle while keeping the X-ray irradiation point the same by simply changing the tilt angle of the housing using the tilt angle changing mechanism. It is possible to prevent the adjustment of the position and posture of the casing from taking time. That is, the operator adjusts the position and orientation of the housing so that the distance from the X-ray irradiation point of the measurement object to the imaging surface becomes a preset distance, and then the control means moves the first diffraction ring. Since the detection process, the second diffraction ring detection process, and the calculation process are performed to measure the triaxial residual stress, it can be prevented from taking time to measure the triaxial residual stress.

  Another feature of the present invention is that a visible light emitter for emitting visible light, which is parallel light having the same optical axis as that of the X-ray emitted from the X-ray emitter, to the measurement object, and a rotational axis of X When the visible light is emitted from the visible light emitter and the point intersecting the optical axis of the line is coincident with the measurement location of the measurement object, the receiving position of the reflected light from the measurement object is set. And an incident angle setting means for setting the incident angle of visible light to the measurement object by setting it to a set position, and the incident angle detection means detects an inclination angle detected by the inclination angle changing mechanism. The difference between the tilt angle detected by the tilt angle detecting means when the incident angle is set to the set value by the incident angle setting means and the tilt angle detected by the tilt angle detecting means is added to the set value of the incident angle. And a calculation means for calculating the incident angle by That.

  According to this, while the visible light is emitted from the visible light emitter and the irradiation position is confirmed, the measurement location can be set to a desired location, and the incident angle of the X-ray with respect to the measurement object can be set to any angle. Even so, the incident angle can be detected with high accuracy.

  Another feature of the present invention is that the control means measures the X-rays emitted from the X-ray emitter based on the difference between the incident angle in the second diffractive ring detection step and the incident angle in the first diffractive ring detection step. The tilt angle is changed by controlling the tilt angle changing mechanism so that the direction projected onto the surface of the object is within 20 ° in the same direction.

  According to this, the X-ray diffraction measurement apparatus can irradiate X-rays with the same direction of projected X-rays on the surface of the object to be measured and with different incident angles within 20 ° with respect to the measurement location. Since the position and orientation of the housing does not change greatly and there is no condition of X-ray irradiation from the vertical direction, measurement is not difficult even when the measurement object is in a narrow place. The inventor has found that the triaxial residual stress can be measured even in this way. The theory will be described in the form for carrying out the invention.

  Further, the present invention is an invention of an X-ray diffraction measurement method using an X-ray diffraction measurement apparatus provided with the above-described X-ray emitter, diffraction ring formation detection means, housing, tilt angle changing mechanism, and incident angle detection means. Can also be implemented. In this case, with the point where the rotation axis intersects the optical axis of the X-ray coincides with the measurement location of the measurement object, the incident angle detection means detects the incident angle, and then the X-ray is emitted from the X-ray emitter. The first diffractive ring detection step for detecting the shape of the diffractive ring that is emitted and imaged on the imaging surface by the diffractive ring formation detection unit, and the tilt angle changing mechanism makes the housing have a different tilt angle, and the incident angle detection unit A second diffractive ring detecting step of detecting the incident angle, then emitting X-rays from the X-ray emitter, and detecting the shape of the diffractive ring imaged on the imaging surface by the diffractive ring formation detecting means; A calculation step for calculating the triaxial residual stress may be performed using the shapes of the two diffraction rings and the two incident angles obtained in the detection step and the second diffraction ring detection step. At that time, in the first diffraction ring detection step and the second diffraction ring detection step, the directions projected on the surface of the measurement object of the X-rays emitted from the X-ray emitter become the same direction, and two incident angles The tilt angle may be changed by the tilt angle changing mechanism so that the difference between the two is within 20 °. Also by this, the same effect as the invention of the X-ray diffraction measuring apparatus described above can be obtained.

1 is an overall schematic diagram showing an X-ray diffraction measurement system including an X-ray diffraction measurement apparatus used in an embodiment of the present invention. It is an enlarged view of the X-ray-diffraction measuring apparatus of FIG. It is a fragmentary sectional view which expands and shows the part through which the X-ray passes in the X-ray-diffraction measuring apparatus of FIG. It is an expansion perspective view of the plate part of FIG. It is process drawing when performing the triaxial residual stress measurement of a measuring object using an X-ray diffraction measuring system. It is the figure which showed visually the value obtained when changing the incident angle of X-rays and performing X-ray diffraction measurement twice.

  A configuration of an X-ray diffraction measurement system including an X-ray diffraction measurement apparatus according to an embodiment of the present invention will be described with reference to FIGS. Note that this X-ray diffraction measurement system is different from the X-ray diffraction measurement system disclosed in Patent Document 2 of the prior art document in that the inclination for changing the inclination angle of the housing 50 of the X-ray diffraction measurement apparatus is different. A program that performs the X-ray diffraction measurement twice by changing the tilt angle to the controller 91 by the tilt angle changing mechanism 5 in the controller 91, and a function of detecting the incident angle of the X-ray with respect to the measurement object. It is only a point where a program for calculating the triaxial residual stress using the detected diffraction ring shape data and incident angle data is installed. Therefore, the part already demonstrated by the X-ray-diffraction measurement system shown by patent document 1 is only demonstrated briefly.

  This X-ray diffraction measurement system transports the X-ray diffraction measurement system to the measurement object OB, performs X-ray diffraction measurement, and measures the triaxial residual stress of the measurement object OB. The X-ray diffraction measurement device is connected to a support arm 61 at the tip of the arm type moving device, and the position and posture can be adjusted by operating the arm type moving device. When performing measurement with this X-ray diffraction measurement system, after transporting the X-ray diffraction measurement system to the measurement object OB, the arm type moving device is fixed in the vicinity of the measurement object OB, and the X-ray diffraction measurement apparatus is used. By adjusting the position and orientation of the X-ray, the X-ray irradiation point, the X-ray irradiation direction and the distance from the X-ray irradiation point to the later-described imaging plate 15 are adjusted to the measurement object OB. X-ray diffraction measurement is performed by irradiating a line. In the present embodiment, the measurement object OB is an iron member.

  The X-ray diffraction measurement apparatus includes an X-ray emitter 10, a table 16 to which the imaging plate 15 is attached, a table driving mechanism 20 that rotates and moves the table 16, a laser detection device 30 that detects a diffraction ring, and the like. I have. The X-ray diffraction measurement system includes an arm type moving device (not shown), a computer device 90, and a high voltage power supply 95 together with the X-ray diffraction measurement device. Various types of circuits for controlling operation and inputting detection signals are connected to the above-described apparatus and mechanism, and are shown in FIG. Various circuits indicated by the dotted line are accommodated in a two-dot chain line in the housing 50.

  The casing 50 is formed in a substantially rectangular parallelepiped shape, and includes a bottom wall 50a, a front wall 50b, a rear wall 50e, a top wall 50f, a side wall (not shown), and corners of the bottom wall 50a and the front wall 50b. It is formed to have a notch wall 50c and a connecting wall 50d provided so as to be cut out from the front side to the back side of the sheet. The notch wall 50c is composed of a flat plate perpendicular to the bottom wall 50a and a parallel plate, and the connecting wall 50d is perpendicular to the side wall and has a predetermined angle with the bottom wall 50a. This predetermined angle is, for example, 30 to 45 degrees. The casing 50 has an upper surface wall 50f connected to a drive stage 51 of an inclination angle changing mechanism 5 that is an electric gonio stage via a fixed plate 54, and the inclination angle changing mechanism 5 rotates around the direction perpendicular to the plane of FIG. 1 and FIG. The tilt angle can be changed. In other words, the rotation axis when changing the tilt angle is in the direction perpendicular to the plane of FIG. 1 and FIG. 2, and the optical axis of the X-ray emitted from the X-ray emitter 10 described later and the rotation of the imaging plate 15 described later. The vertical direction of the plane including the line of the reference position. The rotation axis when changing the tilt angle intersects the optical axis of X-rays emitted from the X-ray emitter 10 described later, and the distance from the intersecting point to the imaging plate 15 described later is a set value L. It has become. Further, the fixed stage 52 of the tilt angle changing mechanism 5 is coupled to the side plate 53, and the side plate 53 is provided with a connection portion (not shown) connected to the support arm 61. The connection portion is also shown in FIG. 2 and can be rotated around the vertical plane of the paper surface of FIG. 2, that is, around the vertical plane of the plane including the optical axis of the outgoing X-ray and the rotation reference position line of the imaging plate 15 described later. The support arm 61 is a tip of an arm type moving device, and the case 50 (X-ray diffraction measuring device) can be set to an arbitrary position and posture by operating the arm type moving device.

  The tilt angle changing mechanism 5 is driven by the motor 55 to rotate, so that the drive stage 51 is driven with respect to the fixed stage 52. This is rotation around the rotation axis as described above. Change. The motor 55 is rotationally driven by a drive signal input from the motor control circuit 88. The motor control circuit 88 outputs a drive signal to the motor 55 and inputs a rotation angle from a rotation angle detection circuit 89 described later when a tilt angle change command and a rotation angle are input from the controller 91 constituting the computer device 90. When the input rotation angle becomes equal to the rotation angle input from the controller 91, the output of the drive signal is stopped. The motor control circuit 88 outputs a drive signal to the motor 55 when a drive start command and a rotation direction are input from the controller 91, and stops the output drive signal when a drive stop command is input from the controller. In either case, the motor control circuit 88 becomes the speed at which the rotational speed of the motor 55 (the tilt angle changing speed of the housing 50) is set by the signal output from the encoder 55a incorporated in the motor 55. In this way, the intensity of the drive signal is controlled. The encoder 55a outputs a pulse train signal that alternately switches between a high level and a low level to the motor control circuit 88 and a rotation angle detection circuit 89 described later each time the motor 55 rotates by a predetermined minute rotation angle. The motor control circuit 88 stores the rotational speed set in advance from the controller 91, and outputs the number of pulses per unit time of the pulse train signal input from the encoder 55a when outputting the drive signal to the motor 55. The rotational speed is calculated using the control signal, and the intensity of the output drive signal is controlled so that the calculated rotational speed becomes the set rotational speed.

  The rotation angle detection circuit 89 counts the number of pulses of the pulse train signal input from the encoder 55a, counts up or down according to the rotation direction of the motor 55 to obtain an integrated count value, and calculates the rotation angle from the integrated count value. Output to the motor control circuit 88 and the controller 91. The position where the rotation angle becomes 0 is when the drive stage 51 and the housing 50 rotate counterclockwise in FIG. 1 and FIG. 2 and reach the drive limit position. Is set by a command from the controller 91. That is, when the power is turned on, the controller 91 outputs a signal for instructing the motor control circuit 88 and the rotation angle detection circuit 89 to set the rotation angle 0. When this command is input, the motor control circuit 88 causes the drive stage 51 to 1 and 2, a drive signal that rotates counterclockwise is output, and the rotation angle detection circuit 89 counts the number of pulses of the pulse train signal input from the encoder 55a. Then, when the number of pulses of the pulse train signal is not counted, the rotation angle detection circuit 89 resets the accumulated count value to 0 and outputs a signal indicating the drive limit position to the motor control circuit 88. When a signal indicating the drive limit position is input, the motor control circuit 88 stops the drive signal output to the motor 55. After the controller 91 outputs a signal instructing the setting of the rotation angle 0, when the rotation angle input from the rotation angle detection circuit 89 becomes 0, the drive stage 51 and the housing 50 are in the state shown in FIGS. Output the rotation angle (becomes a tilt angle near the center of the tilt angle change range). Thus, the motor control circuit 88 outputs a drive signal until the rotation angle input from the rotation angle detection circuit 89 becomes the rotation angle input from the controller 91 as described above, and the drive stage 51 and the housing 50 are shown in FIGS. It becomes the state of 2.

  When the tilt angle of the housing 50 is input from the input device 92, the controller 91 outputs a tilt angle change command and a rotation angle to the motor control circuit 88 so that the housing 50 has the input tilt angle. The tilt angle input from the input device 92 is a rotation angle when the drive stage 51 and the casing 50 rotate counterclockwise in FIGS. 1 and 2 and reach the drive limit position, and the rotation angle is detected. This is the same as the rotation angle output by the circuit 89. Therefore, the controller 91 outputs the input tilt angle as it is to the rotation angle detection circuit 89. Since the attitude | position of the housing | casing 50 of an X-ray-diffraction measuring apparatus can be changed with an arm-type moving apparatus, an inclination angle does not become an angle of inclination with respect to a horizontal surface. The operator determines the tilt angle to be input from the current tilt angle displayed on the display device 93 to be described later and the attitude of the housing 50 of the X-ray diffraction measurement device. Further, when the direction of change in the tilt angle of the housing 50 is input from the input device 92, the controller 91 outputs a drive start command and a rotation direction to the motor control circuit 88, and a stop command is input from the input device 92. Then, a drive stop command is output to the motor control circuit 88.

  In addition, the controller 91 displays the rotation angle input from the rotation angle detection circuit 89 on the display device 93 as an inclination angle. Further, when a command for completing the adjustment of the incident angle set value is input from the input device 92, the rotation angle Θs input from the rotation angle detection circuit 89 is stored. Then, using the rotation angle Θ input from the rotation angle detection circuit 89 and the incident angle setting value Ψs stored in the memory in advance, the current X-ray is calculated from the calculation of Ψ = Ψs + (Θ−Θs). Is calculated and displayed on the display device 93. The operator confirms the current X-ray incident angle displayed on the display device 93 or the tilt angle of the housing 50 of the X-ray diffraction measurement device, and inputs the X-ray incident angle or The inclination angle of the housing 50 can be set to an intended value.

  The X-ray emitter 10 extends in the left-right direction in the figure at the upper part in the case 50 and is fixed to the case 50. The X-ray emitter 10 is supplied with a high voltage from a high-voltage power supply 95 and receives X-rays at the bottom. Emits in the direction. When a command is input from the controller 91, the X-ray control circuit 71 outputs a driving current supplied to the X-ray emitter 10 from the high voltage power supply 95 so that X-rays with a constant intensity are emitted from the X-ray emitter 10. Control drive voltage. In addition, the X-ray emitter 10 includes a cooling device (not shown), and the X-ray control circuit 71 also controls a drive signal supplied to the cooling device.

  The table driving mechanism 20 is fixed to the housing 50 and includes a moving stage 21 below the X-ray emitter 10. The moving stage 21 is sandwiched between a pair of opposed plate-like guides 25, 25 in the table driving mechanism 20, and is output by a feed motor 22, a screw rod 23, and a bearing portion 24 fixed to the table driving mechanism 20. It moves in a plane parallel to the side wall of the housing 50 including the X-ray optical axis and in a direction perpendicular to the optical axis of the outgoing X-ray. An encoder 22a is incorporated in the feed motor 22, and the encoder 22a outputs a pulse train signal that alternately switches between a high level and a low level each time the feed motor 22 rotates by a predetermined minute rotation angle. And output to the feed motor control circuit 73.

  The position detection circuit 72 and the feed motor control circuit 73 operate according to commands from the controller 91. Immediately after the start of measurement, the feed motor control circuit 73 outputs a drive signal to the feed motor 22 so as to move the moving stage 21 toward the feed motor 22, and the position detection circuit 72 indicates that the moving stage 21 has reached the movement limit position. When the pulse train signal is no longer input from the encoder 22a, a signal indicating that the drive signal is stopped is output to the feed motor control circuit 73, and the count value is set to “0”. Thus, the feed motor control circuit 73 stops outputting the drive signal. This movement limit position becomes the origin position of the moving stage 21, and the position detection circuit 72 thereafter counts the pulse train signal from the encoder 22a every time the moving stage 21 moves, and adds or subtracts the count value depending on the moving direction. The movement distance x from the movement limit position is output as a position signal. When the feed motor control circuit 73 inputs the destination position of the moving stage 21 from the controller 91, the feed motor 22 is driven forward or backward until the position signal input from the position detection circuit 72 becomes equal to the input destination position. To do. Further, when the moving speed of the moving stage 21 is input from the controller 91, the feed motor control circuit 73 calculates the moving speed of the moving stage 21 using the number of pulses per unit time of the pulse train signal input from the encoder 22a. The feed motor 22 is driven so that the calculated movement speed becomes the input movement speed.

  The upper ends of the pair of guides 25, 25 are connected by a plate-like upper wall 26, and a through hole 26 a is provided in the upper wall 26, and the center position of the through hole 26 a is the emission of the X-ray emitter 10. Opposite the center position of the mouth 11, the outgoing X-rays enter the table drive mechanism 20 through the outgoing opening 11 and the through hole 26a. In a state where an imaging plate 15 to be described later is in the diffraction ring imaging position (the state shown in FIGS. 1 to 3), a through hole is formed at a position facing the through hole 26a of the moving stage 21 as shown in an enlarged view in FIG. 21a is formed. The moving stage 21 is assembled with a spindle motor 27 whose center of rotation is the position of the central axis of the emission port 11 and the through holes 26a, 21a. The output shaft 27a of the spindle motor 27 is cylindrical and has a circular cross section. Have A through hole 27b is provided on the opposite side of the output shaft 27a of the spindle motor 27, and a cylindrical passage member 28 for reducing the inner diameter of a part of the through hole 27b is provided on the inner peripheral surface of the through hole 27b. Is fixed.

  An encoder 27c is incorporated in the spindle motor 27. The encoder 27c controls a pulse train signal that alternately switches between a high level and a low level every time the spindle motor 27 rotates by a predetermined minute rotation angle. It outputs to the circuit 74 and the rotation angle detection circuit 75. Furthermore, the encoder 27c outputs an index signal that switches from the low level to the high level for a predetermined short period of time for each rotation of the spindle motor 27 to the controller 91 and the rotation angle detection circuit 75.

  When the rotation speed is input from the controller 91, the spindle motor control circuit 74 outputs a drive signal so that the rotation speed calculated from the number of pulses per unit time of the pulse train signal input from the encoder 27c becomes the input rotation speed. Output to the spindle motor 27. The rotation angle detection circuit 75 counts the number of pulses of the pulse train signal input from the encoder 27c, calculates the rotation angle θp from the count value, and outputs it to the controller 91. In addition, when the index signal is input from the encoder 27c, the rotation angle detection circuit 75 resets the count value to “0”. This is the position at a rotation angle of 0 °. Note that the position of the imaging plate 15 at a rotation angle of 0 ° means that the laser beam is irradiated when an index signal is input when a diffraction ring formed on the imaging plate 15 is read by laser irradiation from a laser detection device 30 described later. It is a position that has been. This position is a line because it is at each radial position of the imaging plate 15, and this line is hereinafter referred to as a rotation reference position line.

  The table 16 has a circular shape and is fixed to the tip of the output shaft 27 a of the spindle motor 27. The table 16 has a protruding portion 17 that protrudes downward from the central portion of the lower surface, and a thread is formed on the outer peripheral surface of the protruding portion 17. An imaging plate 15 is attached to the lower surface of the table 16. A through hole 15 a is provided in the center of the imaging plate 15, and the projection 17 is passed through the through hole 15 a, and a nut-shaped fixture 18 is screwed onto the outer peripheral surface of the projection 17, thereby imaging plate 15. Is fixed between the fixture 18 and the table 16. The fixture 18 is a cylindrical member, and a thread corresponding to the thread of the protrusion 17 is formed on the inner peripheral surface.

  The table 16, the protruding portion 17, and the fixture 18 are also provided with through holes 16 a, 17 a, and 18 a, and the inner diameter of the through hole 18 a is the same as the inner diameter of the passage member 28. That is, the emitted X-rays are emitted through the through holes 26a and 21a, the passage member 28, the through holes 27b, 27a1, 16a, 17a and 18a, and the inner diameter of the passage member 28 and the inner diameter of the through hole 18a are small. The X-ray emitted from the hole 18a becomes parallel light parallel to the axis of the through hole 27a1, and is emitted from the circular hole 50c1 of the housing 50.

  The imaging plate 15 moves to the diffraction ring imaging position together with the moving stage 21, the spindle motor 27, and the table 16, and also includes a diffraction ring reading region for reading the imaged diffraction ring, which will be described later, and a diffraction ring erasing region for erasing the diffraction ring. Move to. In this movement, the central axis of the imaging plate 15 is perpendicular to the optical axis of the outgoing X-ray while being maintained in a plane including the optical axis of the outgoing X-ray and the line of the rotation reference position in the imaging plate 15. Move in the direction.

  The laser detection device 30 irradiates the imaging plate 15 that images the diffraction ring with laser light, and detects the intensity of the light emitted from the imaging plate 15. The laser detection device 30 is sufficiently separated from the imaging plate 15 at the diffraction ring imaging position toward the feed motor 22 so that the X-ray diffracted by the measurement object OB is not blocked by the laser detection device 30. . The laser detection device 30 is an optical head including a laser light source 31, a collimating lens 32, a reflecting mirror 33, a dichroic mirror 34, an objective lens 36, and the like, and has the same configuration as that used for recording and reproduction of an optical disc. When a command is input from the controller 91, the laser drive circuit 77 outputs a drive signal to the laser light source 31 so that the intensity of the signal input from the photodetector 42 becomes a predetermined intensity. Laser light with a constant intensity is emitted from the laser light source 31. The photodetector 42 reflects a small amount by a dichroic mirror 34 to be described later, and outputs a signal having an intensity corresponding to the intensity of the laser beam received through the condenser lens 41, but the ratio of reflection at the dichroic mirror 34 is constant. Therefore, it can be considered that a signal having an intensity corresponding to the intensity of the emitted laser light is output. The collimating lens 32 collimates the laser light, the reflecting mirror 33 reflects the laser light toward the dichroic mirror 34, and the dichroic mirror 34 transmits most of the incident laser light (for example, 95%) as it is. The objective lens 36 focuses the laser light on the surface of the imaging plate 15. A focus actuator 37 is assembled to the objective lens 36. The focus of the laser light always matches the surface of the imaging plate 15 by a focus servo described later.

  When the focused laser beam is applied to the portion of the imaging plate 15 where the diffractive ring is imaged, a photo-stimulated luminescence phenomenon occurs, corresponding to the intensity of the diffracted X-ray at the time of diffractive ring imaging. Light is generated. The light generated by the stimulated light emission has a wavelength shorter than that of the laser light and passes through the objective lens 36 together with the reflected light of the laser light, but most of the light is reflected by the dichroic mirror 34, and the reflected light of the laser light is Most are transparent. The light reflected by the dichroic mirror 34 enters the photodetector 40 via the condenser lens 38 and the cylindrical lens 39. The photodetector 40 includes a four-part light receiving element including four light receiving elements having the same square shape, and outputs four light receiving signals (a, b, c, d) to the amplifier circuit 78. The cylindrical lens 39 is used to cause astigmatism.

  The amplifier circuit 78 amplifies the four received light signals (a, b, c, d) and outputs them to the focus error signal generation circuit 79 and the SUM signal generation circuit 80. The focus error signal generation circuit 79 generates a focus error signal in the astigmatism method and outputs the focus error signal to the focus servo circuit 81. The focus servo circuit 81 starts to operate when a command is input from the controller 91, generates a focus servo signal based on the input focus error signal, and outputs the focus servo signal to the drive circuit 82. The drive circuit 82 drives the focus actuator 37 in accordance with the input focus servo signal to displace the objective lens 36 in the direction of the optical axis of the laser beam, so that the focal point of the laser beam is always on the surface of the imaging plate 15. Match.

  The SUM signal generation circuit 80 adds the four received light reception signals to generate a SUM signal and outputs it to the A / D conversion circuit 83. The intensity of the SUM signal is equivalent to the intensity of a small amount of laser light reflected by the imaging plate 15 and reflected by the dichroic mirror 34 and the intensity of light generated by the stimulated emission. Since the intensity of the reflected laser beam is substantially constant, the intensity of the SUM signal corresponds to the intensity of the light generated by the stimulated emission. That is, the intensity of the SUM signal corresponds to the intensity of diffracted X-rays in the imaged diffraction ring. When a command is input from the controller 91, the A / D conversion circuit 83 converts the instantaneous value of the input SUM signal into digital data and outputs it to the controller 91.

  Further, an LED light source 43 is provided adjacent to the objective lens 36. The LED light source 43 is controlled by the LED drive circuit 84 to emit visible light and erase the diffraction ring imaged on the imaging plate 15. When the LED drive circuit 84 receives a command from the controller 91, the LED drive circuit 84 supplies the LED light source 43 with a drive signal for generating visible light having a predetermined intensity.

  The X-ray diffraction measurement apparatus has an LED light source 44. As shown in FIGS. 2 to 4, the LED light source 44 is fixed to the lower surface of one end portion of the plate 45 disposed between the moving stage 21 and the lower surface of the upper wall 26 of the table driving mechanism 20. The plate 45 is fixed to an output shaft 46 a of a motor 46 fixed in the moving stage 21, and rotates in a plane parallel to the lower surface of the upper wall 26 by the rotation of the motor 46. The moving stage 21 is provided with stopper members 47a and 47b. When the plate 45 is rotated in the direction D1 in FIG. 4, the LED light source 44 causes the through hole 26a of the upper wall 26 and the moving stage 21 to move. The rotation of the plate 45 is regulated so that it stops at a position (position A) facing the through hole 21a. On the other hand, the stopper member 47b is a position (B position) where the plate 45 does not block between the through hole 26a of the upper wall 26 and the through hole 21a of the moving stage 21 when the plate 45 is rotated in the direction D2 in FIG. The rotation of the plate 45 is restricted so as to be stationary. In other words, the A position is a position where the plate 45 is in the state shown in FIGS. 2 and 3, and the LED light emitted from the LED light source 44 enters the passage of the passage member 28 provided in the through hole 27 a 1 of the spindle motor 27. This is the incident position. The B position is a position where X-rays emitted from the X-ray emitter 10 are not blocked by the plate 45. The LED light source 44 emits LED light according to a drive signal from an LED drive circuit 85 that is controlled by the controller 91. Although the LED light is a diffusing visible light, when the plate 45 is at the A position, a part of the light is emitted from the through hole 18a through the same path as the outgoing X-ray, so that the through hole 27a1 is the same as the outgoing X-ray. Becomes parallel light parallel to the axis.

  The motor 46 includes an encoder 46b. The encoder 46b outputs a pulse train signal that alternately switches between a high level and a low level to the rotation control circuit 86 every time the motor 46 rotates by a predetermined minute rotation angle. When a rotation direction and a rotation start command are input from the controller 91, the rotation control circuit 86 outputs a drive signal to the motor 46 to rotate the motor 46 in the indicated direction. When the input of the pulse train signal from the encoder 46b is stopped, the output of the drive signal is stopped. Thereby, the plate 45 can be rotated to the A position and the B position, respectively.

  An imaging lens 48 is provided on the notch wall 50 c of the housing 50, and an imager 49 is provided inside the housing 50. The image pickup device 49 is constituted by a CCD light receiver or a CMOS light receiver, and outputs a signal having an intensity corresponding to the light reception intensity of each image pickup device to the sensor signal extraction circuit 87. The imaging lens 48 and the imager 49 function as a digital camera that captures an image of a region around the irradiation point of the LED light on the measurement object OB located at a position set with respect to the imaging plate 15. The position set with respect to the imaging plate 15 is a position where the vertical distance from the irradiation point of the X-ray and LED light on the measurement object OB to the imaging plate 15 becomes a predetermined set value L. In this case, the depth of field by the imaging lens 48 and the imager 49 is set in a range before and after the irradiation point. The sensor signal extraction circuit 87 outputs the signal intensity data for each image pickup device of the image pickup device 49 to the controller 91 together with data for knowing the position (that is, pixel position) of each image pickup device.

  The optical axis of the imaging lens 48 is included in a plane including the optical axis of the X-rays emitted from the X-ray emitter 10 and the rotation reference position line of the imaging plate 15. The point at which the optical axes of the X-rays and LED light irradiated on the OB intersect is adjusted to be the irradiation point of the X-rays and LED light on the measurement object OB at the position set with respect to the imaging plate 15. Yes. Furthermore, when the incident angle of the X-ray and LED light with respect to the measurement object OB is a set value, the optical axis of the imaging lens 48 and the normal direction at the irradiation point of the X-ray and LED light of the measurement object OB are formed. The angle is made equal to the incident angle. Therefore, when the irradiation point of the X-ray and LED light on the measurement object OB is at a position set with respect to the imaging plate 15, and the LED light is irradiated at the incident angle set on the measurement object OB, The irradiation point of the LED light in the photographed image and the reception point of the LED light reflected by the measurement object OB are generated at the same position. Since the LED light applied to the measurement object OB is parallel light, the LED light generates scattered light and reflected light that is reflected substantially as parallel light at the irradiation point. The incident light is imaged at the position of the image pickup device 49 to form an image of the irradiation point, and the reflected light incident on the image forming lens 48 is collected by the image forming lens 48 and received by the image pickup device 49. It becomes an image. And when the irradiation point of LED light exists in the position set with respect to the imaging plate 15, and LED light is irradiated with the incident angle set to the measuring object OB, the scattered light which injects into the imaging lens 48 is shown. Since both the optical axis and the optical axis of the reflected light coincide with the optical axis of the imaging lens 48, the image of the irradiation point and the image of the light receiving point are at the same position, and the optical axis of the imaging lens 48 is the imaging organ. It occurs at a predetermined position that intersects 49. Therefore, by adjusting the position and orientation of the housing 50 of the X-ray diffraction measurement device so that the irradiation point and the light receiving point of the LED light in the captured image occur at predetermined positions on the captured image, the X-ray and LED light The distance from the irradiation point to the imaging plate 15 can be set to the set value L, and the incident angle of X-rays can be set to the set value.

  The computer device 90 includes a controller 91, an input device 92, and a display device 93. The controller 91 is an electronic control unit mainly including a microcomputer including a CPU, ROM, RAM, a large capacity storage device, and the like, and executes various programs stored in the large capacity storage device to perform an X-ray diffraction measurement device. Control the operation of The input device 92 is connected to the controller 91 and is used by an operator for inputting various parameters, operation commands, and the like. In addition to the image including the irradiation point and the light receiving point imaged by the imager 49, the display device 93 displays a mark indicating the position where the LED light irradiation point and the light receiving point should be matched. Further, the display device 93 visually notifies the operator of various setting situations, operating situations, measurement results, and the like. The high voltage power supply 95 supplies the X-ray emitter 10 with a high voltage and current for X-ray emission.

  Next, using the X-ray diffraction measurement system including the X-ray diffraction measurement apparatus configured as described above, the position and orientation of the X-ray diffraction measurement apparatus are adjusted, and then the triaxial residual stress of the measurement object OB is measured. A specific method for performing X-ray diffraction measurement for measurement will be described. The operator transports the X-ray diffraction measurement system to a place where the measurement object OB is present, and fixes the arm type moving device to an appropriate location near the measurement object OB. Then, by operating the arm type moving device, approximately the X-rays emitted from the X-ray diffraction measurement device are irradiated to the measurement location of the measurement object OB from the target direction, and from the X-ray irradiation point to the imaging plate 15. Until the distance is about the set value L. Thereafter, as shown in FIG. 5, the X-ray diffraction measurement includes the position / orientation adjustment step S1, the diffraction ring imaging step S2, the diffraction ring reading step S3, and the diffraction ring elimination step S4, and is the first measurement. After performing the incident angle changing step S6, the diffraction ring imaging step S2, the diffraction ring reading step S3, and the diffraction ring erasing step S4 are performed again, and the triaxial residual stress calculating step S7 is performed. In each step, the portions already described in detail in Patent Document 1 of the prior art document will be simply described.

  The position and orientation adjustment step S1 is a step of adjusting the position and orientation of the X-ray diffraction measurement apparatus (housing 50) with respect to the measurement object OB. When the operator inputs an adjustment of the position and orientation from the input device 92, the controller 91 outputs a command to each circuit, and moves the imaging plate 15 to the diffraction ring imaging position (state shown in FIGS. 1 to 3). Then, the motor 46 is driven to rotate the plate 45 to the A position, and the LED light source 44 is turned on. As a result, LED light, which is parallel light, is emitted from the circular hole 50c1 of the housing 50 to the outside, and is irradiated near the measurement location of the measurement object OB. Furthermore, the controller 91 causes the image pickup signal from the image pickup device 49 to be output from the sensor signal extraction circuit 87 to the controller 91 and causes the display device 93 to display an image near the irradiation position of the LED light created from this image pickup signal. At this time, the displayed image has a cross mark at a position on the captured image corresponding to the position where the optical axis of the imaging lens 48 intersects the image pickup device 49 independently of the image displayed by the imaging signal. Is displayed.

  In this case, the cross point of the cross mark is located at the center of the screen of the display device 93, the X-axis direction of the cross mark corresponds to the horizontal direction of the screen, and the Y-axis direction of the cross mark corresponds to the vertical direction of the screen. The cross point of the cross mark is a position where the irradiation point is imaged when the distance from the LED light irradiation point to the imaging plate 15 is the set value L, and at the same time the distance is the set value L. When the LED light is incident on the measurement object OB at the incident angle set, the light receiving point is a position to be imaged. The Y axis of the cross mark corresponds to a line in which the plane including the optical axis of the emitted X-ray and the rotation reference position line of the imaging plate 15 intersects the imaging organ 49, and the Y axis direction of the cross mark is the LED light and This is the X-ray irradiation direction, and the direction in which this direction is projected onto the measurement object OB is the measurement direction of the residual normal stress σx.

  While viewing the image displayed on the display device 93, the operator operates the arm type moving device to adjust the position and posture of the X-ray diffraction measurement device (housing 50), and irradiates the LED light on the screen. Becomes the target measurement location of the measurement object OB, matches the cross point of the cross mark, and makes the light receiving point match the cross point of the cross mark. As a result, the emitted X-ray is irradiated to the target measurement location of the measurement object OB, the distance from the X-ray irradiation point to the imaging plate 15 becomes the set value L, and the incident angle of the X-ray with respect to the measurement object OB is It becomes a set value.

  When the irradiation point and the light receiving point of the LED light coincide with the cross point of the cross mark, the operator inputs a command for completing the adjustment of the incident angle setting value from the input device 92. Thereby, the controller 91 stores the rotation angle Θs input from the rotation angle detection circuit 89, and thereafter, the rotation angle Θ input from the rotation angle detection circuit 89 and the incident angle stored in the memory in advance. Using the set value Ψs, the current incident angle Ψ of the X-ray is calculated from the calculation Ψ = Ψs + (Θ−Θs) and displayed on the display device 93. When the operator wants to make the incident angle of X-rays other than the set value, he / she inputs the tilt angle from the input device 92 or inputs the tilt angle changing direction to drive the motor 55 of the tilt angle changing mechanism 5, The inclination angle of the housing 50 of the X-ray diffraction measurement apparatus is changed. Since the distance from the X-ray irradiation point to the imaging plate 15 is set to the set value L by the adjustment described above, the rotation axis when changing the tilt angle of the drive stage 51 of the tilt angle changing mechanism 5 is the X-ray irradiation point. It corresponds to (irradiation point of LED light). Therefore, even if the inclination angle of the housing 50 of the X-ray diffraction measurement apparatus is changed, the X-ray irradiation point does not change, and only the X-ray incident angle changes.

  When the adjustment of the position and orientation of the housing 50 of the X-ray diffraction measurement apparatus is completed, the operator inputs the end of adjustment of the position and orientation from the input device 92. Thus, the controller 91 outputs a command to each circuit, turns off the LED light source 44, stops outputting the imaging signal, drives the motor 46, and rotates the plate 45 to the B position. As a result, the X-ray from the X-ray emitter 10 can enter the through hole 21 a of the moving stage 21. Further, the controller 91 stores the rotation angle input from the rotation angle detection circuit 89 and the current X-ray incident angle Ψ 1 displayed on the display device 93.

  In the next diffraction ring imaging step S2, the operator inputs the material of the measurement object OB (in this embodiment, iron) from the input device 92, and inputs the start of measurement. Accordingly, the controller 91 controls the spindle motor control circuit 74 to rotate the imaging plate 15 at a low speed, and stops the rotation of the imaging plate 15 when the index signal is input from the encoder 27c. Thereby, the diffraction ring is imaged on the imaging plate 15 in a state where the rotation angle is 0 ° at the time of reading the diffraction ring. Next, the controller 91 controls the X-ray control circuit 71 to cause the X-ray emitter 10 to start emitting X-rays. Thereby, the diffraction ring is imaged on the imaging plate 15 by the diffracted X-rays generated at the X-ray irradiation point in the measurement object OB. Then, after a predetermined time has elapsed, the X-ray control circuit 71 is controlled to cause the X-ray emitter 10 to stop emitting X-rays.

Next, the controller 91 executes the diffraction ring reading step S3 automatically or by operator input. The controller 91 controls the feed motor control circuit 73 to move the imaging plate 15 to the reading start position in the diffraction ring reading region. The reading start position is a position where the irradiation position of the laser beam is slightly inside the circle with the diffraction ring reference radius Ro. The diffraction ring reference radius Ro is the radius of the diffraction ring formed on the imaging plate 15 when the residual stress of the measurement object OB is “0”, and the X-ray diffraction angle 2Θ on the measurement object OB. ₀ (Θ ₀ is a Bragg angle) and the set value L of the distance IP-OB are calculated by the following formula: Ro = L · tan (2Θ ₀ ). The X-ray diffraction angle 2Θ ₀ is determined by the material of the measurement object OB, and the distance L is adjusted to a set value. Therefore, if the diffraction angle 2Θ ₀ is stored in advance for each material of the measurement object OB, The diffraction ring reference radius Ro can be calculated by inputting the material of the measurement object OB.

  Next, the controller 91 controls the spindle motor control circuit 74 to rotate the spindle motor 27 at a predetermined rotation speed, and controls the laser drive circuit 77 to irradiate the imaging plate 15 with laser light from the laser detection device 30. The focus servo circuit 81 is controlled to start focus servo. Further, the rotation angle detection circuit 75 is controlled to start the output of the rotation angle θp of the spindle motor 27 (imaging plate 15), and the A / D conversion circuit 83 is controlled to output the data of the instantaneous value I of the SUM signal. , And the feed motor control circuit 73 is controlled to rotate the feed motor 22 to move the imaging plate 15 from the reading start position in the lower right direction in FIGS. 1 and 2 at a constant speed. Thereby, the irradiation position of the laser beam starts to rotate relatively spirally on the imaging plate 15. Thereafter, every time the imaging plate 15 rotates by a predetermined small angle, the controller 91 outputs the data of the instantaneous value I of the SUM signal output from the A / D conversion circuit 83 and the rotation angle θp output from the rotation angle detection circuit 75. And the data of the movement distance x output from the position detection circuit 72 are input and stored in correspondence with each other. The moving distance x is stored after being converted into a radial distance r (radius value r) of the laser beam irradiation position. As a result, the data representing the instantaneous value I, the rotation angle θp, and the radius value r of the SUM signal are sequentially stored for each predetermined rotation angle with respect to the irradiation position of the laser beam rotating in a spiral.

In parallel with the storing operation for each predetermined rotation angle of the data representing the instantaneous value I, the rotation angle θp, and the radius value r of the SUM signal, the controller 91 sets the instantaneous value I of the SUM signal with respect to the radius value r for each rotation angle θp. A curve is created, and a radius value r _α and a SUM signal intensity value I _α corresponding to the peak of the curve are stored. This is to obtain the intensity distribution of the diffracted X-rays in the radial direction for each rotation angle α of the diffraction ring, and to calculate the radius value r _{α at the} location where the intensity of the diffracted X-rays reaches the peak and the intensity I _α corresponding to the intensity of the diffracted X-ray. This is the processing to be sought. Then, the radius value r _α and the intensity I _α are acquired at all the rotation angles θp (rotation angle α), and when the instantaneous value I of the SUM signal to be detected becomes sufficiently small with respect to the intensity I _α , the data is stored. Exit. Thereby, the intensity distribution corresponding to the intensity of the diffracted X-rays in the diffraction ring is a data group of the instantaneous value I, the rotation angle θp, and the radius value r, and the shape of the diffraction ring is the radius value r _α for each rotation angle _α . It is detected. Thereafter, the controller 91 outputs a command to each circuit, stops the focus servo, stops the irradiation of the laser beam, stops the operation of the A / D conversion circuit 83 and the rotation angle detection circuit 75, and Stop operation. The rotation of the imaging plate 15 is continued.

  Next, the controller 91 executes the diffraction ring elimination step S4 automatically or by operator input. The controller 91 controls the feed motor control circuit 73 to move the imaging plate 15 to the erase start position in the diffraction ring erase region. The erasure start position of the imaging plate 15 is a position where the center of the LED light output from the LED light source 43 is further inside than the reading start position with respect to the circle having the diffraction ring reference radius Ro. Next, the controller 91 controls the LED drive circuit 84 to irradiate the imaging plate 15 with the LED light from the LED light source 43 and controls the feed motor control circuit 73 so that the imaging plate 15 is moved from the erasing start position. The feed motor 22 is rotated so as to move at a constant speed in the lower right direction in FIGS. 1 and 2 to the erase end position. The erase end position is a position where the center of the LED light is outside the diffraction ring reference radius Ro by the same distance as the erase start position. Thereby, LED light is irradiated spirally on the imaging plate 15, and the imaged diffraction ring is erased.

  When the imaging plate 15 reaches the erasing end position, the controller 91 controls the feed motor control circuit 73 to stop the movement of the imaging plate 15 and controls the LED drive circuit 84 to stop the irradiation of the LED light to detect the position. The operation of the circuit 72 is stopped, and the spindle motor control circuit 74 is controlled to stop the rotation of the spindle motor 27 (imaging plate 15).

  Next, the controller 91 or the operator determines whether or not the measurement is the first time, and if it is the first time, the incident angle changing step S6 is executed automatically or by the operator's input. When the controller 91 performs automatically, the rotation angle obtained by adding the rotation angle change amount A stored in advance to the rotation angle stored at the end of the position / orientation adjustment step S <b> 1 is output to the motor control circuit 88. Thus, the X-ray incident angle Ψ2 becomes a value obtained by adding the rotation angle change amount A to the first X-ray incident angle Ψ1. The rotation angle change amount A can be set by an operator by inputting from the input device 92, but cannot be set to exceed a preset upper limit value. This upper limit is, for example, 20 °. In addition, when the operator inputs, the incident angle and the tilt angle displayed on the display device 93 are viewed, and an appropriate tilt angle is input from the input device 92 or the incident angle displayed on the display device 93. , The tilt angle change direction is input from the input device 92, and the stop command is input at the timing when the appropriate incident angle is reached. When the end of the incident angle change is input from the input device 92, the controller 91 stores the incident angle Ψ2 displayed on the display device 93. As described above, since the rotation axis when changing the tilt angle of the drive stage 51 of the tilt angle changing mechanism 5 coincides with the X-ray irradiation point, even after the incident angle changing step S6 is executed. The X-ray irradiation point is the same position, and the measurement location is the same in the second X-ray diffraction measurement described later.

Next, the controller 91 executes the diffraction ring imaging step S2, the diffraction ring reading step S3, and the diffraction ring elimination step S4 again automatically or by operator input. These steps are the same as the first steps. As a result, the shape data of the second diffraction ring (radius value r _α for each rotation angle _α ) is stored in the controller 91. At this time, the values stored in the controller 91 are visually shown in FIG. Among the values shown in FIG. 6, the radius values r _α 1 and r _α 2 of the two diffraction rings and the two incident angles ψ 1 and ψ 2 are stored by performing two X-ray diffraction measurements, and the X-ray irradiation point is stored. The distance L from the imaging plate 15 is stored in advance. When annotating FIG. 6, the X, Y, and Z axes are different from those shown in FIG. 2, and the X axis is the direction in which the emitted X-ray is projected from the X-ray irradiation point onto the plane of the measurement object. Then, the plane including the optical axis of the emitted X-ray and the rotation reference position line of the imaging plate 15 is a line intersecting the plane of the measurement object. The Y axis is a line perpendicular to the X axis passing through the X-ray irradiation point on the plane of the measurement object, and the Z axis is a line perpendicular to the X axis and the Y axis. Residual normal stresses σx, σy, and σz, which will be described later, are residual normal stresses in the X, Y, and Z axis directions, and the residual shear stress τxy is a residual shear stress in the XY plane that is the plane of the measurement object. Stress τxz and τyz are residual shear stresses in the XZ plane and the YZ plane.

Next, the controller 91 executes the triaxial residual stress calculation step S7 automatically or by operator input. The calculation procedure will be described below together with the calculation formula. Note that the calculation for calculating the triaxial residual stress by the calculation using the cos α method is a known technique, and is described in, for example, Japanese Patent Laid-Open No. 2014-13203. . First, from the radius values r _α 1 and r _α 2 which are the shape data of the two diffraction rings, the diffraction angle 2Θ _α for each rotation angle _α is calculated using the following equation (1). L is the distance L from the X-ray irradiation point to the imaging plate 15.
(Equation 1)
2Θ _α = tan ⁻¹ (−r _α / L)
Then it is known a diffraction angle 2 [Theta] _alpha from the diffraction angle 2 [Theta] ₀ in the case of undistorted, calculates the strain epsilon _alpha of each rotation angle alpha with the following Expression 2.
(Equation 2)
[epsilon] [ _alpha] = (1/2) (2 [theta] _{0-2 [} theta] [ _alpha] ) cot [theta] ₀
Then the strain epsilon _alpha of each rotation angle alpha, calculates the a _1, a _2, a ₃ value using the following equation 3 or the number 5 of the formula.
(Equation 3)
a ₁ = (1/2) {(ε _α −ε _{π + α} ) + (ε _−α −ε _π−α )}
(Equation 4)
a ₂ = (1/2) {(ε _α −ε _{π + α} ) − (ε _−α −ε _π−α )}
(Equation 5)
a ₃ = (1/2) {(ε _α + ε _{π + α} ) + (ε _−α + ε _π−α )}
Since there are radius values r _α 1 and r _α 2 which are the shape data of the two diffraction rings, two a ₁ , a ₂ and a ₃ values are obtained.

As shown in the prior art, cos α, which is the cosine of the a ₁ value and the rotation angle α, has the following relational expression 6 using the residual stresses σx, σz, τxz.
E is the Young's modulus, ν is the Poisson's ratio, η is (π−diffraction angle), and the stressless diffraction angle 2Θ ₀ can be used in this case. Therefore, since the number 6 variables are only α and a ₁ value, there is a proportional relationship to cosα and a ₁ value, by modifying the equation becomes: having 7.
Since (∂a ₁ / ∂cos α) on the left side is a value calculated from the slope of the regression line passing through the origin of cos α and the a ₁ value,-(1 + ν) / E, sin 2η and sin 2ψ on the right side are constants. -{(∂a ₁ / ∂cosα) · E} / {(1 + ν) · sin2η · sin2ψ}, which is the left side when both sides are multiplied by −E / {(1 + ν) · sin2η · sin2Ψ}, cosα and a It can be a value calculated from the slope of the regression line passing through the origin of _one value. If this left side is (cos α diagram calculated value), Equation 7 can be transformed into Equation 8 below.

As described above, since the a ₁ value has _each value in the two X-ray diffraction measurements, the slopes of the regression lines passing through the origin of cos α and the a ₁ value are calculated, and the obtained values are By multiplying by a constant −E / {(1 + ν) · sin2η · sin2Ψ}, each (cos α diagram calculated value) in the two X-ray diffraction measurements can be obtained. In Equation 8, since there are two unknowns, σx−σz and τxz, σx−σz and τxz can be obtained by solving simultaneous equations in which the respective (cos α diagram calculation values) and incident angles Ψ1, Ψ2 are substituted into Expression 8. Can be requested.

Further, as shown in the known art, sin α, which is the sine of the a ₂ value and the rotation angle α, has the following relational expression 9 using the residual stresses τxy and τyz.
Similar to Equation 6, since only α and a ₂ values are variables in Equation 9, sin α and a ₂ values are proportional to each other.
Since (∂a ₁ / ∂sin α) on the left side is a value calculated from the slope of the regression line passing through the origin of sin α and a ₂ values, 2 (1 + ν) / E, sin 2η and sin Ψ on the right side are constants. -{(∂a ₂ / ∂sin α) · E} / {2 (1 + ν) · sin2η · sinΨ}, which is the left side when E / {2 (1 + ν) · sin2η · sinΨ} is multiplied on both sides, It may be a value calculated from the slope of the regression line passing through the origin of a ₂ value. When this left side is (sin α diagram calculation value), Equation 10 can be transformed into Equation 11 below.

As described above, since the a ₂ value has _each value in the two X-ray diffraction measurements, the slopes of the regression lines passing through the origin of sin α and the a ₂ value are calculated, and the obtained values are By multiplying by a constant E / {2 (1 + ν) · sin2η · sinΨ}, each (sin α diagram calculation value) in two X-ray diffraction measurements can be obtained. In Equation 11, there are two unknowns, τxy and τyz. Therefore, τxy and τyz can be obtained by solving simultaneous equations in which the respective (sin α diagram calculation values) and incident angles ψ1 and ψ2 are substituted into Equation 11. it can. Σx−σz, τxy, τxz, τyz can be obtained by the calculation so far.

Subsequent calculations are the same as those shown in the known art. The a ₃ value and the rotation angle cos ² is the square of the cosine of alpha alpha, there is a number 12, the relational expression of Equation 13 follows using residual stress σx-σz, σy-σz, the Tauxz.
D is a constant that is determined from the residual normal stress σx, Young's modulus E, Poisson's ratio ν, (π−diffraction angle) η, and incident angle ψ. Therefore, since only variables α and a1 are variables in Equation 12, cos ² α and a ₃ have a linear relationship, and the slope of the regression line between cos ² α and a ₃ is calculated by the least square method. Thus, Φ can be obtained. In Equation 13, σx−σz and τxz have already been calculated, and Young's modulus E, Poisson's ratio ν, (π−diffraction angle) η and incident angle Ψ are known values, so Φ is obtained. If it can be obtained, σy−σz can be obtained from Equation 13. The a ₃ value, since each of the values in the X-ray diffraction measurement of the two, it is possible to determine the Φ and σy-σz respectively. Therefore, each σy−σz may be averaged to obtain a normal σy−σz.

Expression relating the strain epsilon _alpha and triaxial residual stress are the following number 14 and number 15, as shown in the prior art.
In Equation 15, φ ₀ is an angle formed by the X axis and the direction in which the optical axis of the emitted X-ray is projected on the surface of the measurement object, and is 0 in this embodiment. Therefore, since η, Ψ, and φ ₀ appearing on the right side of the equation in Equation 15 are known values and the variable is only the rotation angle α of the diffraction ring, n _{1 to} n ₃ are values determined by the rotation angle α. It is.

When Expression 14 is transformed, the following Expressions 16 and 17 are obtained.
On the right side of Equation 17, σx−σz, σy−σz, τxy, τxz, and τyz are already calculated values, and Young's modulus E and Poisson's ratio ν are known values. As described above, n _{1 to} n ₃ is a value determined by the rotation angle α. Therefore, X is a value determined by the rotation angle α. The Young's modulus in the number 16 on the right side E, the Poisson's ratio ν is a known value, the strain epsilon _alpha is a value that is obtained for each rotation angle alpha. Therefore, by calculating X for each rotation angle α using Equations 15 and 17, and substituting X for each rotation angle α and strain ε _α for each rotation angle _α into Equation 16, the residual normal stress σz is calculated as the rotation angle. It can be obtained for each α.

Since the strain epsilon _alpha is the respective value in the X-ray diffraction measurement of the two, the residual normal stress σz of each rotation angle alpha was calculated, respectively, in X-ray diffraction measurement twice, the average of all σz by normal The residual normal stress σz. Then, σz is added to already calculated σx−σz, σy−σz to obtain residual normal stress σx, σy. Thereby, triaxial residual stress (sigma) x, (sigma) y, (sigma) z, (tau) xy, (tau) xz, (tau) yz can be calculated | required.

When the triaxial residual stress calculation step S7 is completed, the controller 91 displays the residual stress calculation result on the display device 93. In addition to the residual stress, the distance L from the X-ray irradiation point to the imaging plate 15, the measurement conditions such as the X-ray incident angles Ψ1, Ψ2, etc., the shape curve of the diffraction ring (radius value r _α 1, for each rotation angle α) curve obtained from r _α 2), intensity distribution image of diffraction ring (instantaneous value I _α is converted into lightness, and an image created from a data group of lightness, rotation angle θp and radius value r corresponding to instantaneous value I _α ) Etc. may be displayed. By looking at the result, the operator can evaluate the fatigue level of the measurement object OB, evaluate the processing result by shot peening, and the like.

  As can be understood from the above description, in the above embodiment, the X-ray emitter 10 that emits X-rays toward the target measurement object OB, and the X-ray emitter 10 toward the measurement object OB. X-rays are emitted, and the diffracted X-rays generated at the X-ray irradiation spot of the measurement object OB are reflected on the imaging plate 15 that intersects the optical axis of the X-rays emitted from the X-ray emitter 10 perpendicularly. A diffractive ring formation detection device comprising a laser detector 30, a table driving mechanism 20, and various circuits that receive light and form a diffraction ring as an image of a diffracted X-ray on the imaging plate 15 and detect the shape of the diffractive ring; A housing 50 in which the emitter 10 and the diffraction ring formation detection device are disposed, and a rotation axis that intersects the optical axis of the X-ray emitted from the X-ray emitter 10 with an inclination angle of the housing 50; The intersecting point is the imaging plan. Inclination angle changing mechanism 5 that changes around a rotation axis that is a distance L set in advance from base 15, and incident angle detection that detects an incident angle of X-rays emitted from X-ray emitter 10 to measurement object OB In an X-ray diffraction measurement system including an X-ray diffraction measurement device having a function, the X-ray emitter 10, the diffraction ring formation detection device, the tilt angle changing mechanism 5 and the incident angle detection function are controlled, and the diffraction ring formation detection is performed. A program of the controller 91 that performs calculation using the shape of the diffraction ring detected by the device and the incident angle detected by the incident angle detection function is provided. The program of the controller 91 is an X-ray light whose rotation axis of the tilt angle changing mechanism 5 is X-ray. After the incident angle is detected by the incident angle detection function in a state where the point intersecting the axis coincides with the measurement location of the measurement object OB, the X-ray emitter 10 and the diffraction ring formation detection function are controlled, and the measurement target OB The first diffraction ring detection step of detecting the shape of the diffraction ring imaged on the imaging plate 15 by irradiating X-rays and the tilt angle changing mechanism 5 to control the casing 50 to have a different tilt angle and incident After the incident angle is detected by the angle detection function, the X-ray emitter 10 and the diffraction ring formation detection function are controlled, and the shape of the diffraction ring imaged on the imaging plate 15 by irradiating the measurement object OB with X-rays. Using the second diffractive ring detection step for detecting the diffractive ring, the two diffractive ring shapes and the two incident angles obtained in the first diffractive ring detection step and the second diffractive ring detection step. A triaxial residual stress calculation step for calculating stress is performed.

  According to this, if the distance from the X-ray irradiation spot of the measurement object OB to the imaging plate 15 is set to a preset distance, the tilt angle changing mechanism 5 changes the tilt angle of the X-ray irradiation spot. The incident angle of the X-ray can be changed while the X-ray irradiation spot remains the same by simply changing the inclination angle of the housing 50 using the inclination angle changing mechanism 5. Adjustment of the position and orientation of the housing 50 of the X-ray diffraction measurement apparatus can be prevented from taking time. In other words, if the operator adjusts the position and orientation of the housing so that the distance from the X-ray irradiation point of the measurement object OB to the imaging plate 15 becomes a preset distance, the program of the controller 91 is performed thereafter. Performs the first diffraction ring detection step, the second diffraction ring detection step, and the triaxial residual stress calculation step to measure the triaxial residual stress, so that it does not take time to measure the triaxial residual stress. can do.

  Moreover, in the said embodiment, the visible light which consists of LED light source 44, the plate 45, etc. which radiate | emit the visible light which is the parallel light which made the X-ray radiate | emitted from the X-ray emitter 10 the same optical axis to the measuring object OB. With the light emitter and the point where the rotation axis of the tilt angle changing mechanism 5 intersects the optical axis of the X-ray coincides with the measurement location of the measurement object OB, the visible light is transferred from the visible light emitter to the measurement object OB. An incident angle setting function for setting the incident angle of visible light to the measurement object OB to a set value by setting the light receiving position of the reflected light from the measurement object OB to a set position when irradiated; The functions include a rotation angle detection circuit 89 that detects the inclination angle changed by the inclination angle change mechanism 5 as a rotation angle, and the incident angle is set to a set value by the incident angle setting function of the rotation angle detected by the rotation angle detection circuit 89. Rotation angle detection when The difference from the rotational angle detected by the road 89, and a calculation function of the controller 91 for calculating the angle of incidence by adding the set value of the incident angle.

  According to this, while the visible light is emitted from the visible light emitter and the irradiation position is confirmed, the measurement location can be set to a desired location, and the incident angle of the X-ray with respect to the measurement object OB can be set in any way. Even if it is an angle, the incident angle can be detected with high accuracy.

  Further, in the above embodiment, the program of the controller 91 is such that the difference between the incident angle in the second diffraction ring detection step and the incident angle in the first diffraction ring detection step is emitted from the X-ray emitter 10. The tilt angle is changed by controlling the tilt angle changing mechanism 5 so that the direction projected on the surface of the measurement object OB of the line is within 20 ° in the same direction.

  According to this, the X-ray diffraction can be performed because the direction in which the emitted X-ray is projected onto the surface of the measurement object OB is the same direction and the incident angle is different within 20 ° with respect to the measurement location. Since the position and orientation of the housing 50 of the measuring apparatus do not change greatly and there is no condition of X-ray irradiation from the vertical direction, measurement is not difficult even when the measurement object OB is in a narrow place. Even in this way, the triaxial residual stress can be measured as described with reference to equations (1) to (17).

  In the above embodiment, the operator inputs a command from the input device 92 instead of executing the program of the controller 91 for the first diffraction ring detection step, the second diffraction ring detection step, and the triaxial residual stress calculation step. It can also be done. That is, X-ray diffraction measurement using an X-ray diffraction measurement system including an X-ray diffraction measurement apparatus including an X-ray emitter 10, a diffraction ring formation detection device, a casing 50, an inclination angle changing mechanism 5, and an incident angle detection function. It can also be implemented as a method invention. In this case, the change in the inclination angle of the housing 50 is caused by the difference between the incident angle in the second diffraction ring detection step and the incident angle in the first diffraction ring detection step while observing the incident angle displayed on the display device. The direction projected on the surface of the measurement object OB of the X-rays emitted from the X-ray emitter 10 may be within 20 ° in the same direction. Also by this, the same effect as the case of executing the program of the controller 91 can be obtained.

  In carrying out the present invention, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the object of the present invention.

  In the above embodiment, the drive stage 51 of the tilt angle changing mechanism 5 that is an electric gonio stage is connected to the upper surface wall 50f of the casing 50 of the X-ray diffraction measurement device so that the tilt angle of the casing 50 can be changed. did. However, if the rotation axis when changing the inclination angle intersects the optical axis of the outgoing X-ray and the distance from the intersection to the imaging plate 15 is the set value L, which mechanism changes the inclination angle? Such a mechanism may be used. For example, a gonio stage capable of manually reading the rotation angle may be used, or a mechanism in which the drive stage 51 is connected to the side surface of the housing 50 may be used.

  In the above embodiment, the irradiation point of the LED light and the position of the light receiving point in the photographed image obtained from the imaging lens 48, the image pickup device 49, and the sensor signal extraction circuit 87 are displayed independently of the photographed image. The incident angle of X-rays was set to a set value ψs by matching with the cross point of the cross mark, and the rotation angle Θs input from the rotation angle detection circuit 89 at this time was stored. Thereafter, using the rotation angle Θ input from the rotation angle detection circuit 89 and the incident angle setting value Ψs stored in advance in the memory, the calculation of Ψ = Ψs + (Θ−Θs) is performed. The incident angle Ψ is detected. However, any detection method may be used as long as the incident angle of X-rays can be detected. For example, the measurement object OB is irradiated with pattern light such as a quadrangle other than visible parallel light, and the incident angle is calculated by calculation processing from the shape of the pattern formed on the surface of the measurement object OB. May be. Further, the table 16 is moved to the laser detection device 30 side while irradiating the measurement object OB with visible parallel light, and the incident angle is calculated from the amount of movement and the change amount of the irradiation point position of the LED light in the photographed image. You may do it.

  In the above-described embodiment, the position of the LED light irradiation point in the captured image obtained from the imaging lens 48, the image pickup device 49, and the sensor signal extraction circuit 87 is a cross of a cross mark displayed independently of the captured image. The distance from the X-ray irradiation point to the imaging plate 15 was set to the set value L by matching the points. However, any method may be used as long as the distance from the X-ray irradiation point to the imaging plate 15 can be the set value L. For example, an imaging function is not provided, and visible parallel light having a different optical axis from that of the LED light having the same optical axis as that of the emitted X-ray intersects the optical axis of the LED light at a distance L from the imaging plate 15. Thus, the distance from the X-ray irradiation point to the imaging plate 15 may be set to the set value L by adjusting the position of the measurement object OB so that the two light irradiation points become one. . Further, the incident angle of the X-ray in that case stores the rotation angle Θs inputted from the rotation angle detection circuit 89 when the light receiving position of the reflected light of the LED light is set at the visual observation, and stores the rotation angle Θs described above. What is necessary is just to make it detect by the calculation of Ψ = Ψs + (Θ−Θs).

  In the above embodiment, the program installed in the controller 91 adds the rotation angle change amount A stored in advance to the rotation angle stored at the end of the position / orientation adjustment step S1 to perform motor control. By outputting to the circuit 88, the X-ray incident angle Ψ2 in the second X-ray diffraction measurement is changed by the rotation angle change amount A from the X-ray incident angle Ψ1 in the first X-ray diffraction measurement. However, if the X-ray incident angle in the second X-ray diffraction measurement is different from that in the first X-ray diffraction measurement and the X-ray incident angle can be detected, what is the method for controlling the tilt angle changing mechanism 5? It may be used. For example, a drive signal is output to the motor control circuit 88 for a set time, and the incident angle Ψ obtained by the calculation of Ψ = Ψs + (Θ−Θs) described above when the rotation ends is stored as the X-ray incident angle Ψ2. May be.

  In the above embodiment, the X-ray diffraction measurement is performed at two incident angles to detect the shape of the diffraction ring, and the triaxial residual stress is calculated. The triaxial residual stress may be calculated by performing X-ray diffraction measurement at the above inclination angle. In that case, triaxial residual stress is calculated and averaged for all combinations of two diffraction rings for σx−σz, τxy, τxz, and τyz, and σy−σz, σz is calculated and averaged for all diffraction rings. That's fine.

  In the above-described embodiment, the X-ray diffraction measurement apparatus is an apparatus that images the diffraction ring on the imaging plate 15 and detects the shape of the diffraction ring by laser irradiation from the laser detection apparatus 30 and light intensity detection. However, any type of apparatus may be used as long as the shape can be detected by imaging the diffraction ring. For example, instead of the imaging plate 15, an X-ray CCD having a plane as wide as the imaging plate 15 is provided, and when X-ray irradiation from the X-ray emitter 10 is performed, an electric signal output from each pixel of the X-ray CCD A device that detects the intensity distribution of diffracted X-rays in the diffraction ring may be used. Further, instead of the X-ray CCD having the same plane as the imaging plate 15, the X-ray CCD having a small size is scanned while detecting the position, and the electric signal output from each pixel of the X-ray CCD and the X-ray CCD. A device that detects the intensity distribution of the diffracted X-rays in the diffraction ring from the scanning position in FIG. In addition, an apparatus using a scintillation counter that detects fluorescence emitted from the scintillator by a photomultiplier tube (PMT) instead of the X-ray CCD may be used.

  In the above embodiment, the controller 91 is provided with a calculation program for calculating the triaxial residual stress. However, if the X-ray diffraction measurement may take a long time, the X-ray diffraction measurement system can obtain the shape of the diffraction ring and two incident angles, and the shape data of the diffraction ring and two incidents can be sent to another computer device. The angle may be input to calculate the triaxial residual stress. In this case, as a method for inputting data to another computer device, various methods such as a method through a recording medium and a method of transferring using a network or the like can be considered. Also, some or all of the calculations may be performed artificially.

  Moreover, in the said embodiment, the position and attitude | position of the housing | casing 50 of the X-ray-diffraction measuring apparatus with respect to the measurement object OB are connected by connecting the housing | casing 50 of an X-ray-diffraction measuring apparatus with the support arm 61 of an arm type moving apparatus. However, any structure may be used as long as the position and orientation of the housing 50 of the X-ray diffraction measurement apparatus with respect to the measurement object OB can be adjusted. For example, if the measurement object OB is a transportable sample piece, the fixed stage 52 and the side plate 53 of the tilt angle changing mechanism 5 are fixed, and the housing 50 of the X-ray diffraction measurement apparatus is only used by the tilt angle changing mechanism 5. A stage apparatus that can move in three orthogonal directions and change the tilt angle may be prepared so that the position and orientation change, and the object to be measured OB can be placed. In this case, the stage device is placed on the housing 50 of the X-ray diffraction measurement device, the measurement object OB is placed on the stage device, and the stage device is operated to measure the measurement object with respect to the housing 50 of the X-ray diffraction measurement device. The OB position and posture may be adjusted. Even in that case, the housing 50 of the X-ray diffraction measurement device is connected to the support arm 61 of the arm type moving device so that the position and posture can be adjusted by both the arm type moving device and the stage device. Also good.

  In the above embodiment, the LED light source 44 is moved on the optical axis of the X-ray by the plate 45, the motor 46, and the stopper member 47a to irradiate the measurement object OB with the LED light. However, instead of this, any structure may be used as long as it can emit visible parallel light having the same optical axis as that of the emitted X-ray. For example, the beam splitter may be disposed on the optical axis of the outgoing X-ray, and the LED light may be reflected by the beam splitter so that the outgoing X-ray and the optical axis are the same.

  In the above-described embodiment, the passage member 28 having a small inner diameter is provided in the through hole 27b of the spindle motor 27, and the inner diameters of the through holes 18a and 18b of the fixture 18 are reduced to reduce the LED emitted from the LED light source 44. Although parallel light having a small cross-sectional diameter can be obtained from light, another structure may be used as long as visible parallel light having a small cross-sectional diameter can be obtained. For example, a collimator lens and an expander lens are disposed near a laser light source that emits visible laser light, and the optical axis of the laser light having a small cross-sectional diameter is set to the central axis of the through hole 27a1 of the output shaft 27a of the spindle motor 27. They may be made to coincide and enter the through holes 18 a and 18 b of the fixture 18.

5 ... Inclination angle changing mechanism, 10 ... X-ray emitter, 15 ... Imaging plate, 15a, 16a, 17a, 18a, 21a, 26a, 27a1, 27b ... Through hole, 16 ... Table, 17 ... Projection, 18 ... Fixed , 19 ... cylindrical lens, 20 ... table drive mechanism, 21 ... moving stage, 22 ... feed motor, 23 ... screw rod, 27 ... spindle motor, 28 ... passage member, 30 ... laser detector, 31 ... laser light source, 36 ... objective lens, 44 ... LED light source, 45 ... plate, 46 ... motor, 47a, 47b ... stopper member, 48 ... imaging lens, 49 ... imaging device, 50 ... housing, 50a ... bottom wall, 50c ... notch Wall, 50d ... Connecting wall, 50f ... Top wall, 51 ... Drive stage, 52 ... Fixed stage, 53 ... Side plate, 54 ... Fixed plate, 55 ... Mode Motor, 61 ... support arm, 90 ... computer device, 91 ... controller, 92 ... input apparatus, 93 ... display, 95 ... high voltage power supply, OB ... measurement object

Claims (5)

An X-ray emitter that emits X-rays toward a target measurement object;
When X-rays are radiated from the X-ray emitter toward the measurement object, the diffracted X-rays generated at the measurement object are reflected with respect to the optical axis of the X-ray emitted from the X-ray emitter. Diffracting ring formation detecting means for detecting light on an imaging surface that intersects perpendicularly and forming a diffraction ring that is an image of the diffracted X-ray on the imaging surface,
A housing in which the X-ray emitter and the diffraction ring formation detection means are disposed;
The rotation angle of the casing is a rotation axis that intersects the optical axis of the X-ray emitted from the X-ray emitter, and the intersection point is around a rotation axis that is a preset distance from the imaging surface. An inclination angle changing mechanism to be changed;
In an X-ray diffraction measurement apparatus comprising an incident angle detection means for detecting an incident angle of the X-ray emitted from the X-ray emitter to the measurement object,
The X-ray emitter, the diffraction ring formation detection means, the tilt angle changing mechanism, and the incident angle detection means are controlled, and the shape of the diffraction ring detected by the diffraction ring formation detection means and the incident angle detection means are detected. A control means for performing calculations using the corners
The control unit causes the incident angle detection unit to detect an incident angle in a state where a point where the rotation axis intersects the optical axis of the X-ray coincides with a measurement location of the measurement object, and then the X-ray A first diffraction ring detection step of controlling the emitter and the diffraction ring formation detection means to detect the shape of the diffraction ring imaged on the imaging surface by irradiating the measurement object with X-rays; The change mechanism is controlled to make the casing have a different inclination angle, and after the incident angle detection means detects the incident angle, the X-ray emitter and the diffraction ring formation detection means are controlled to perform the measurement. Obtained by a second diffractive ring detection step of irradiating an object with X-rays to detect the shape of the diffractive ring imaged on the imaging surface, the first diffractive ring detection step, and the second diffractive ring detection step The calculation of the triaxial residual stress using the shape of the two diffraction rings and the two incident angles. X-ray diffraction measurement apparatus, characterized by performing the steps. The X-ray diffraction measurement apparatus according to claim 1,
A visible light emitter that emits visible light, which is parallel light having the same optical axis as the X-ray emitted from the X-ray emitter, to the measurement object;
When the measurement object is irradiated with visible light from the visible light emitter in a state where the point where the rotation axis intersects the optical axis of the X-ray coincides with the measurement location of the measurement object, the measurement object An incident angle setting means for setting the incident angle of the visible light to the measurement object by setting the light receiving position of the reflected light from the set position,
The incident angle detection means includes
An inclination angle detecting means for detecting an inclination angle changed by the inclination angle changing mechanism;
The difference between the tilt angle detected by the tilt angle detecting means and the tilt angle detected by the tilt angle detecting means when the incident angle is set to the set value by the incident angle setting means is set as the set value of the incident angle. An X-ray diffraction measuring apparatus comprising: a calculating means for calculating an incident angle by adding. The X-ray diffraction measurement apparatus according to claim 1 or 2,
The control means is configured such that the difference of the incident angle in the second diffractive ring detection step from the incident angle in the first diffractive ring detection step is caused on the surface of the measurement object of X-rays emitted from the X-ray emitter. An X-ray diffraction measurement apparatus, wherein the tilt angle is changed by controlling the tilt angle changing mechanism so that the projected directions are within 20 ° in the same direction. An X-ray emitter that emits X-rays toward a target measurement object;
When X-rays are radiated from the X-ray emitter toward the measurement object, the diffracted X-rays generated at the measurement object are reflected with respect to the optical axis of the X-ray emitted from the X-ray emitter. Diffracting ring formation detecting means for detecting light on an imaging surface that intersects perpendicularly and forming a diffraction ring that is an image of the diffracted X-ray on the imaging surface,
A housing in which the X-ray emitter and the diffraction ring formation detection means are disposed;
The rotation angle of the casing is a rotation axis that intersects the optical axis of the X-ray emitted from the X-ray emitter, and the intersection point is around a rotation axis that is a preset distance from the imaging surface. An inclination angle changing mechanism to be changed;
In an X-ray diffraction measurement method using an X-ray diffraction measurement device comprising an incident angle detection means for detecting an incident angle of the X-ray emitted from the X-ray emitter with respect to the measurement object,
After the incident angle is detected by the incident angle detection means in a state where the point where the rotation axis intersects the optical axis of the X-ray coincides with the measurement location of the measurement object, X-rays are emitted from the X-ray emitter. A first diffraction ring detection step of detecting the shape of the diffraction ring imaged on the imaging surface by the diffraction ring formation detection means;
The tilt angle changing mechanism causes the housing to have different tilt angles, and after the incident angle detection means detects the incident angle, X-rays are emitted from the X-ray emitter, and the diffraction ring formation detection means A second diffraction ring detection step of detecting the shape of the diffraction ring imaged on the imaging surface;
And a calculation step of calculating a triaxial residual stress using the shapes of the two diffraction rings and the two incident angles obtained in the first diffraction ring detection step and the second diffraction ring detection step. X-ray diffraction measurement method. The X-ray diffraction measurement method according to claim 4,
In the first diffraction ring detection step and the second diffraction ring detection step, the X-rays emitted from the X-ray emitter are projected onto the surface of the measurement object in the same direction, and the two incident angles are An X-ray diffraction measurement apparatus, wherein the tilt angle is changed by the tilt angle changing mechanism so that the difference is within 20 °.