JP2017123277A - Lighting device and luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which suppresses warp of a substrate due to heat, and to provide a luminaire.SOLUTION: A lighting device 1 includes: a printed wiring board 11 in which a first conductor 14 is formed on one surface of a substrate 111, and a second conductor 15 is formed on the other surface of the substrate 111; and a lightning circuit 12. The lightning circuit 12 is constituted by a circuit component 121 mounted on the substrate 111, and supplies lighting power to a solid light-emitting element 41. On the one surface and the other surface of the substrate 111, a ratio of an area of all conductor patterns formed on a plate surface with respect to an area of the plate surface is defined as an area ratio, and out of the one surface and the other surface of the substrate 111, a surface with a smaller area ratio is defined as a first surface 111A, and a surface with a larger area ratio is defined as a second surface 111B. On the first surface 111A, a third conductor 17A is provided so as to reduce a difference between the area ratio of the first surface 111A and the area ratio of the second surface 111B.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a lighting device and a lighting device using the lighting device.

  As a conventional example, an LED illumination device described in Patent Document 1 is illustrated. The LED lamp main body of the LED lighting device described in Patent Literature 1 includes an LED element, a substrate on which the LED element is mounted, and a lighting circuit that is mounted on the same substrate as the substrate on which the LED element is mounted and lights the LED element Circuit components. A slit is formed in the substrate, and the front surface and the back surface of the substrate are divided into two areas inside (center side) and outside (outer peripheral side), respectively. The front surface of the substrate is composed of an LED element mounting area for mounting the LED element on the substrate on the outer peripheral side with the slit as a boundary, and a mixed mounting area for mounting the LED element and circuit components of the lighting circuit on the center side. ing. A circuit component mounting area for mounting circuit components of the lighting circuit is formed on the back surface corresponding to the mixed mounting area.

JP, 2015-159020, A

  By the way, in the LED lighting device described in Patent Document 1, a conductor on which the LED element is mounted is formed on the front surface of the substrate, and a conductor on which circuit components of the lighting circuit are mounted is formed on the back surface of the substrate. When the area ratio of the conductor pattern formed on the front surface of the substrate is different from the area ratio of the conductor pattern formed on the back surface of the substrate, for example, when heat is applied to the substrate during soldering, the substrate is affected by the heat. May be warped.

  This invention is made | formed in view of the said reason, and it aims at providing the lighting device and lighting device which suppress the curvature of the board | substrate by a heat | fever.

  A lighting device of the present invention includes a printed wiring board in which a first conductor is formed on one surface of a substrate and a second conductor is formed on the other surface of the substrate, and a lighting circuit. A light emitting element is mounted, the solid state light emitting element is electrically connected to the first conductor, and the lighting circuit is composed of circuit components mounted on the substrate, and supplies lighting power to the solid state light emitting element. The circuit component is electrically connected to the second conductor, and each of one surface and the other surface of the substrate has an area of all conductor patterns formed on the plate surface with respect to an area of the plate surface. Of the one surface and the other surface of the substrate, the surface having the small area ratio is the first surface, the surface having the large area ratio is the second surface, and the first surface is the first surface. To reduce the difference between the area ratio of the surface and the area ratio of the second surface 3 conductors is provided, wherein the third conductor is characterized in that not electrically connected to said first conductor and said second conductor.

  The illuminating device of this invention is equipped with said lighting device, the said solid light emitting element mounted in the said printed wiring board, and the fixture main body which accommodates the said lighting device, It is characterized by the above-mentioned.

  The lighting device and the lighting device of the present invention have an effect that the warpage of the substrate due to heat can be suppressed.

It is a disassembled perspective view which shows the illuminating device which concerns on embodiment. It is a bottom view which shows the board | substrate which concerns on embodiment. It is a bottom view which shows the conductor of the board | substrate which concerns on embodiment. It is a bottom view which shows the board | substrate which mounted the circuit component and the light source based on Embodiment. It is a top view which shows the conductor of the board | substrate which concerns on embodiment. It is a bottom view which shows the lighting device which concerns on embodiment. It is a bottom view which shows the lighting device of the modification 1 which concerns on embodiment. It is a bottom view which shows the lighting device of the modification 2 which concerns on embodiment.

  The following embodiments relate to a lighting device and a lighting device, and more particularly to a lighting device that supplies power to a light source and a lighting device including the lighting device. Hereinafter, embodiments of a lighting device and a lighting device will be described in detail with reference to the drawings.

  The illuminating device 10 of this embodiment is an illuminating device attached to a ceiling using a plurality of solid state light emitting elements, for example, light emitting diodes as light sources. In the following description, unless otherwise specified, the vertical direction is defined with the ceiling 100 in FIG. In addition, this direction is not the meaning which limits the use condition of the lighting device 1 and the illuminating device 10 of this embodiment. In addition, the configuration described below is merely an example of the present invention, and the present invention is not limited to the following embodiment, and the technical idea according to the present invention is not deviated from this embodiment. Various changes can be made in accordance with the design or the like as long as they are not.

  As shown in FIG. 1, the lighting device 10 includes a lighting device 1, a fixture body 2, a protective cover 3, a light source 4, a lighting circuit cover 51, a light source cover 52, and a globe 6.

  The ceiling 100 is provided with an attachment member 71 that is a power socket that supports the instrument body 2 and supplies AC power to the instrument body 2 from an AC power source such as a commercial power source. The attachment member 71 is, for example, a hook ceiling or a hook rosette. A cylindrical adapter 72 is mechanically and electrically connected to the mounting member 71.

  The instrument body 2 is formed in a disk shape from metal. A circular through hole 21 that is opened to allow the adapter 72 to pass therethrough is provided at the center of the instrument body 2. Around the through hole 21, an annular recess 22 that is recessed upward is provided. The lighting device 1 is accommodated in the recess 22.

  A fixing member 23 formed in a flat cylindrical shape is fixed to the instrument body 2 using a screw or the like at the center of the lower surface of the instrument body 2. The inner diameter of the fixing member 23 is substantially the same as the diameter of the through hole 21. Further, the fixing member 23 is fixed to the instrument body 2 so as to be substantially concentric with the through hole 21. An adapter 72 is attached to the fixing member 23. More specifically, the adapter 72 has a hooking claw 721 on the side surface. When the hooking claw 721 is hooked on the fixing member 23, the fixing member 23 is fixed to the adapter 72.

  A protective cover 3 is attached to the lower surface of the instrument body 2 so as to cover the peripheral surface of the fixing member 23. The protective cover 3 is formed in a flat cylindrical shape similar to the fixing member 23. The inner diameter of the protective cover 3 is larger than the outer diameter of the fixing member 23. The protective cover 3 is attached to the instrument body 2 so as to be substantially concentric with the through hole 21 and the fixing member 23. By attaching the protective cover 3 to the instrument body 2, the adapter 72 is covered by the protective cover 3 so that only the lower part of the adapter 72 is exposed. For this reason, the adapter 72 is protected by the protective cover 3.

  Three further glove attachment members 24 are provided on the lower surface of the instrument body 2. These glove attachment members 24 are provided along the outer peripheral edge of the instrument body 2, and the glove 6 is detachably attached thereto.

  The lighting device 1 is attached to the lower surface of the appliance body 2. The lighting device 1 includes a printed wiring board 11 on which a conductor is formed on a substrate 111 and a lighting circuit 12. The lighting circuit 12 converts AC power supplied from an external AC power source into DC power and supplies it to the light source 4 mounted on the printed wiring board 11. The light source 4 is lit by DC power supplied from the lighting circuit 12. The lighting device 1 is fixed to the instrument body 2 using, for example, screws. The substrate 111 is formed in a substantially rectangular plate shape with four corners curved in an arc shape. In the center of the substrate 111, a circular hole 13 that penetrates in the thickness direction of the substrate 111 is provided.

  As shown in FIG. 2, the lower surface 111 </ b> A (first surface) of the substrate 111 includes an outer region 112, an inner region 113, and an intermediate region 114.

  The outer region 112 is an annular region along the outer edge of the substrate 111 as shown in FIG. As shown in FIG. 3, a first conductor 14 that is a conductor pattern for mounting the light source 4 is formed in the outer region 112 of the lower surface 111A. The first conductor 14 is a metallic conductor such as a copper foil. As shown in FIG. 4, for example, a plurality of surface mounted light emitting diodes (LEDs) 41 that are the light sources 4 are mounted on the outer region 112. That is, the plurality of light emitting diodes 41 are mounted on and electrically connected to the first conductor 14 formed in the outer region 112 of the lower surface 111A.

  In the present embodiment, the plurality of light emitting diodes 41 are annularly arranged in two rows in the radial direction. Further, the solid-state light emitting element is not limited to the light emitting diode 41 but may be an electroluminescent element or the like.

  As shown in FIG. 2, the inner region 113 is an annular region around the hole 13. As shown in FIG. 4, a plurality of circuit components 121 constituting the lighting circuit 12 are mounted on the inner region 113. The plurality of circuit components 121 are lead components such as resistors, capacitors, inductors, and switching elements, for example. In the region of the upper surface 111B (second surface) facing the inner region 113 of the substrate 111, as shown in FIG. 5, a second conductor 15 to which a plurality of circuit components 121 are electrically connected is formed. The second conductor 15 is a metallic conductor such as a copper foil. The plurality of circuit components 121 are mounted from the lower surface 111 </ b> A of the substrate 111 and soldered to the second conductor 15 formed on the upper surface 111 </ b> B of the substrate 111. That is, the plurality of circuit components 121 are electrically connected to the second conductor 15 formed on the upper surface 111B by inserting leads into through holes formed in the inner region 113. Further, as shown in FIG. 3, a connecting portion 18 is formed on the lower surface 111A. The connection portion 18 is formed of a metallic conductor such as a copper foil. The connecting portion 18 electrically connects the first conductor 14 and the second conductor 15. The connecting portion 18 on the lower surface 111A is electrically connected to the second conductor 15 on the upper surface 111B through the through hole of the substrate 111. That is, the second conductor 15 is electrically connected to the first conductor 14 via the connection portion 18.

  The inner region 113 is provided with a light receiving unit 25 that receives an infrared signal from a remote controller that is an operating device of the illumination device 10 (see FIG. 4). A case 251 is provided in the inner region 113 of the substrate 111, and the light receiving unit 25 is disposed inside the opening 252 of the case 251 in plan view (see FIG. 1).

  In the region of the upper surface 111B facing the outer region 112 of the substrate 111, a radiator 16 is provided as shown in FIG. The radiator 16 is a metallic conductor such as a copper foil, for example. On the upper surface 111 </ b> B of the substrate 111, the radiator 16 is provided in an annular shape so as to face the outer region 112. The radiator 16 is thermally coupled to the plurality of light emitting diodes 41 via the substrate 111, and dissipates heat generated by the lighting of the light emitting diodes 41 to the outside.

  Incidentally, the first conductor 14 and the connecting portion 18 are formed on the lower surface 111A of the substrate 111 (see FIG. 3), and the second conductor 15 and the heat radiator 16 are formed on the upper surface 111B (see FIG. 5). reference). The ratio of the area of all conductor patterns formed on the lower surface 111A to the area of the lower surface 111A is the area ratio (remaining copper ratio) of the lower surface 111A, and the conductor formed on the upper surface 111B with respect to the area of the upper surface 111B The pattern area ratio is defined as the area ratio (remaining copper ratio) of the upper surface 111B. As shown in FIGS. 3 and 5, all the conductor patterns formed on the lower surface 111 </ b> A are conductor patterns of the first conductor 14 and the connecting portion 18. All the conductor patterns formed on the upper surface 111 </ b> B are conductor patterns of the second conductor 15 and the radiator 16. Here, the remaining copper ratio of the lower surface 111A is smaller than the remaining copper ratio of the upper surface 111B. In this case, when the remaining copper ratio of the lower surface 111A and the remaining copper ratio of the upper surface 111B are different, the substrate 111 is warped when heat is applied to the light emitting diode 41 and the circuit component 121, for example. It tends to occur.

  Therefore, in order to reduce the difference between the remaining copper ratio on the lower surface 111A and the remaining copper ratio on the upper surface 111B, the third conductor 17A is formed on the lower surface 111A.

  As shown in FIG. 2, the intermediate region 114 is a region between the outer region 112 and the inner region 113 in the radial direction of the substrate 111. In the intermediate region 114, as shown in FIG. 6, four third conductors 17A are formed. Each of the four third conductors 17A is formed in a semicircular shape near the four corners of the inner peripheral edge of the outer region 112, for example, by a metal conductor such as a copper foil. Each of the four third conductors 17 </ b> A is not electrically connected to either the first conductor 14 or the second conductor 15. Each of the four third conductors 17A is an electrically independent conductor.

  As a first modification, a third conductor 17B may be formed in the intermediate region 114 as shown in FIG. The third conductor 17 </ b> B is formed in an annular shape that is partially broken along the inner periphery of the outer region 112 and the outer periphery of the inner region 113. The third conductor 17B is formed so as not to be electrically connected to the connection portion 18 while avoiding the periphery of the connection portion 18.

  As a second modification, for example, a third conductor 17C may be formed on the lower surface 111A of the lighting device 1 as shown in FIG. The third conductor 17C is at least partially formed in the inner region 113 of the lower surface 111A. That is, the third conductor 17C is formed on the lower surface 111A so as to overlap the second conductor 15 in the thickness direction (vertical direction) of the substrate 111. Since the third conductor 17C is formed in this manner, even when heat is applied to the lighting device 1, the conductor expands and contracts at positions where the lower surface 111A and the upper surface 111B overlap in the thickness direction of the substrate 111. 1 can suppress warping of the substrate 111. However, the third conductor 17C is formed so as not to be mechanically and electrically connected to any of the plurality of circuit components 121.

  In the lighting device 1 of the present embodiment, the substrate 111 and the conductor have different coefficients of thermal expansion. Therefore, if the remaining copper ratio of the lower surface 111A and the remaining copper ratio of the upper surface 111B are different, bending stress is generated on the substrate 111, and the substrate 111 is likely to be warped. Therefore, the lighting device 1 of the present embodiment reduces the difference between the remaining copper ratio of the lower surface 111A and the remaining copper ratio of the upper surface 111B by forming the third conductors 17A, 17B, or 17C on the lower surface 111A. The lighting device 1 can cancel the bending stress caused by the conductor on the lower surface 111A and the bending stress caused by the conductor on the upper surface 111B. Therefore, the lighting device 1 can suppress warping of the substrate 111 due to heat.

  In the lighting device 1 of the present embodiment, the third conductors 17A and 17B are formed on the lower surface 111A of the substrate 111. However, for example, when the remaining copper ratio of the upper surface 111B of the substrate 111 is smaller than the remaining copper ratio of the lower surface 111A of the substrate 111, the third conductor is formed on the upper surface 111B. In this case, the upper surface 111B of the substrate 111 is the first surface, and the lower surface 111A is the second surface. The number and shape of the third conductors are not limited to the number and shape of the present embodiment.

  As shown in FIG. 1, the lighting device 10 is provided with a metallic lighting circuit cover 51 that covers the inner region 113 and a light source cover 52 that has a light transmitting property and covers the outer region 112.

  The lighting circuit cover 51 is formed in a bowl shape that opens to the upper surface and has a lower surface having a smaller diameter than the upper surface. The lighting circuit cover 51 is provided with a through hole 512 in the bottom wall so that the lower surface of the adapter 72 is exposed. Further, the lighting circuit cover 51 has a flange 511 at the upper end edge. The lighting circuit cover 51 covers the inner region 113 from below so as not to contact the plurality of circuit components 121 constituting the lighting circuit 12. Further, the lighting circuit cover 51 is provided with a notch portion 513 so as to avoid the case 251 of the light receiving portion 25 provided in the inner region 113. This prevents the light receiving unit 25 from being covered by the metal lighting circuit cover 51.

  The lighting circuit cover 51 is positioned on the substrate 111 by, for example, inserting a protrusion provided on the flange 511 into a hole provided on the substrate 111. The lighting circuit cover 51 is fixed to the substrate 111 using, for example, screws.

  The light source cover 52 is formed in a disk shape with an upper surface opened, and covers the outer region 112 from below so as not to contact the plurality of light emitting diodes 41 constituting the light source 4. A circular window hole 521 that penetrates in the thickness direction is provided on the lower surface of the light source cover 52. The lighting circuit cover 51 is exposed to the outside through the window hole 521. The light source cover 52 is positioned on the substrate 111 by inserting a protrusion provided on the light source cover 52 into a hole provided on the substrate 111, for example. The light source cover 52 is fixed to the substrate 111 so as to be pressed from below the lighting circuit cover 51 using, for example, screws. In the illumination device 10 of the present embodiment, the screw used for mounting the lighting circuit cover 51 and the screw used for mounting the light source cover 52 are shared.

  A light receiving cover 522 that covers the case 251 of the light receiving unit 25 from below is provided on the inner periphery of the window hole 521 of the light source cover 52. The light receiving cover 522 is formed of a translucent material so that the light receiving unit 25 can receive an infrared signal. The light source cover 52 is positioned on the substrate 111 by inserting a protrusion provided on the light source cover 52 into a hole provided on the substrate 111, for example.

  The glove 6 is attached to the instrument body 2 using four glove attachment members 24. The globe 6 is made of, for example, a milky white light-transmitting material. The globe 6 covers the substrate 111, the lighting circuit cover 51, and the light source cover 52 from below by being attached to the instrument body 2.

  Since the lighting device 10 according to the present embodiment uses the lighting device 1 described above, the substrate 111 can be prevented from warping due to heat.

  The lighting device 1 according to the present embodiment includes a printed wiring board 11 in which a first conductor 14 is formed on one surface of a substrate 111 and a second conductor 15 is formed on the other surface of the substrate 111, and a lighting circuit 12. . A light emitting diode (solid light emitting element) 41 is mounted on one surface of the substrate 111. The light emitting diode 41 is electrically connected to the first conductor 14. The lighting circuit 12 includes a circuit component 121 mounted on the substrate 111 and supplies lighting power to the light emitting diode 41. The circuit component 121 is electrically connected to the second conductor 15. In each of the one surface and the other surface of the substrate 111, the area ratio of the area of all the conductor patterns formed on the plate surface to the area of the plate surface is defined as the area ratio. A surface having a small ratio is defined as a first surface (lower surface 111A), and a surface having a large area ratio is defined as a second surface (upper surface 111B). A third conductor 17A, 17B, or 17C is provided on the first surface so as to reduce the difference between the area ratio of the first surface and the area ratio of the second surface. The third conductors 17A, 17B, and 17C are not electrically connected to the first conductor 14 and the second conductor 15.

  Since the lighting device 1 of the present embodiment is formed as described above, the warp of the substrate 111 due to heat can be suppressed.

  In the lighting device 1 of the present embodiment, at least a part of the conductor on the first surface (lower surface 111A) including the third conductor 17C and the conductor on the second surface (upper surface 111B) is seen from the thickness direction of the substrate 111. It is preferable that they are formed at positions overlapping each other.

  When the lighting device 1 of the present embodiment is formed as described above, the conductor pattern of the third conductor 17C and the pattern of the second conductor expand and contract by heat at a position where they overlap each other. Therefore, the lighting device 1 can easily cancel the bending stress due to the conductor on the lower surface 111A and the bending stress due to the conductor on the upper surface 111B, and can further suppress warping of the substrate 111 due to heat.

  In the lighting device 1 of the present embodiment, the first conductor 14 is preferably formed in an annular shape along the outer edge of the first surface (lower surface 111A). The third conductor 17 </ b> A or 17 </ b> B is preferably formed inside the inner periphery of the first conductor 14.

  When the lighting device 1 of the present embodiment is configured as described above, the third conductor 17A or 17B is formed in the empty area (intermediate area 114) of the lower surface 111A, so that the substrate 111 can be prevented from being enlarged. it can.

  The illumination device 10 of the present embodiment includes a lighting device 1, a light emitting diode (solid light emitting element) 41 mounted on a printed wiring board 11, and a fixture body 2 that houses the lighting device 1.

  Since the illuminating device 10 of this embodiment is comprised as mentioned above, the curvature of the board | substrate 111 by a heat | fever can be suppressed.

DESCRIPTION OF SYMBOLS 1 Lighting device 10 Illuminating device 11 Printed wiring board 111A Lower surface (1st surface)
111B Upper surface (second surface)
DESCRIPTION OF SYMBOLS 12 Lighting circuit 121 Circuit component 111 Board | substrate 14 1st conductor 15 2nd conductor 17A, 17B, 17C 3rd conductor 2 Instrument body 41 Light emitting diode (solid light emitting element)

Claims (4)

A printed wiring board having a first conductor formed on one surface of the substrate and a second conductor formed on the other surface of the substrate; and a lighting circuit,
A solid light emitting element is mounted on one surface of the substrate,
The solid state light emitting device is electrically connected to the first conductor;
The lighting circuit is composed of circuit components mounted on the substrate, and supplies lighting power to the solid state light emitting device,
The circuit component is electrically connected to the second conductor;
In each of the one surface and the other surface of the substrate, the ratio of the area of all conductor patterns formed on the plate surface to the area of the plate surface is defined as an area ratio, and the one surface and the other surface of the substrate A surface with a small area ratio is a first surface, a surface with a large area ratio is a second surface,
The first surface is provided with a third conductor so as to reduce the difference between the area ratio of the first surface and the area ratio of the second surface,
The lighting device, wherein the third conductor is not electrically connected to the first conductor and the second conductor. The conductor of the first surface including the third conductor and the conductor of the second surface are formed at positions where at least a part thereof overlaps each other when viewed from the thickness direction of the substrate. The lighting device according to 1. The first conductor is formed in an annular shape along an outer edge of the first surface,
The lighting device according to claim 1, wherein the third conductor is formed on an inner side than an inner peripheral edge of the first conductor. An illuminating device comprising: the lighting device according to any one of claims 1 to 3, the solid-state light emitting element mounted on the printed wiring board, and an appliance main body that houses the lighting device.

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