JP2014082067A - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
JP2014082067A
JP2014082067A JP2012228366A JP2012228366A JP2014082067A JP 2014082067 A JP2014082067 A JP 2014082067A JP 2012228366 A JP2012228366 A JP 2012228366A JP 2012228366 A JP2012228366 A JP 2012228366A JP 2014082067 A JP2014082067 A JP 2014082067A
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substrate
instrument body
protective cover
light emitting
lighting
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JP2012228366A
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Japanese (ja)
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Makoto Kono
誠 河野
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2012228366A priority Critical patent/JP2014082067A/en
Priority to CN201320513075.0U priority patent/CN203464093U/en
Publication of JP2014082067A publication Critical patent/JP2014082067A/en
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Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which widens a mounting area that is effective for mounting of semiconductor light emitting elements on a substrate and thereby allows many semiconductor light emitting elements to be mounted.SOLUTION: A lighting device 10 includes a device body 11 having a device attachment part 17 at its center part and uses a light emitting unit A having LED elements 35 and a substrate 12 on which the LED elements 35 are mounted. The substrate 12 is disposed around a device attachment part 17 at the front surface side of the device body 11. Multiple positions of the substrate 12 are pressed to the device body 11 by multiple resin pressing members.

Description

本発明の実施形態は、半導体発光素子を用いた照明器具に関する。   Embodiments described herein relate generally to a lighting fixture using a semiconductor light emitting element.

従来、例えばシーリングライトなどの照明器具では、中央に器具取付部を設けた器具本体に対して、その器具取付部の周囲に点灯回路が配置されているとともに、その点灯回路より外径側で器具本体の周辺部に複数のLED素子を実装した基板が配置されている。   Conventionally, in a lighting fixture such as a ceiling light, for example, a lighting circuit is arranged around the fixture mounting portion with respect to the fixture main body provided with a fixture mounting portion in the center, and the fixture is positioned on the outer diameter side of the lighting circuit. A substrate on which a plurality of LED elements are mounted is disposed on the periphery of the main body.

基板を器具本体に取り付ける場合には、LED素子が発生する熱を基板から器具本体に効率よく熱伝導して放熱性を高めるために、基板を器具本体に複数個の金属製のねじを用いて取り付けるのが一般的である。   When attaching the board to the instrument body, use multiple metal screws on the instrument body to efficiently conduct heat generated by the LED elements from the board to the instrument body to improve heat dissipation. It is common to install.

特開2011−134684号公報JP 2011-134684 A

このような照明器具において、例えば、高価な高出力形のLED素子に代えて、安価な比較的低出力形のLED素子を用いる場合、所望の明るさを確保するためにはLED素子の数を増加させる必要があり、この場合、基板におけるLED素子の実装に有効な実装面積を大きくすることが好ましい。   In such a lighting fixture, for example, when an inexpensive relatively low-power LED element is used instead of an expensive high-power LED element, the number of LED elements is set to ensure a desired brightness. In this case, it is preferable to increase the effective mounting area for mounting the LED elements on the substrate.

しかしながら、従来の照明器具では、基板の外径側には照明器具の大形化につながり、基板の内径側には点灯回路が配置されていることから、基板の面積を大きくしにくいとともに、基板を器具本体に取り付けるのに金属製のねじを用いていることから、ねじとの絶縁距離を確保するために、基板におけるLED素子の実装に有効な実装面積が制限されてしまう。   However, in the conventional lighting fixture, the lighting fixture is increased in size on the outer diameter side of the substrate, and the lighting circuit is disposed on the inner diameter side of the substrate. Since a metal screw is used to attach to the fixture body, the effective mounting area for mounting the LED element on the substrate is limited in order to secure an insulation distance from the screw.

本発明が解決しようとする課題は、基板における半導体発光素子の実装に有効な実装面積を広くし、半導体発光素子を多く実装できる照明器具を提供することである。   The problem to be solved by the present invention is to provide a luminaire capable of widening a mounting area effective for mounting semiconductor light emitting elements on a substrate and mounting many semiconductor light emitting elements.

実施形態の照明器具は、中央に器具取付部を有する器具本体を備える。半導体発光素子、および半導体発光素子を実装する基板を有する発光ユニットを用いる。基板を器具本体の前面側で器具取付部の周囲に配置する。樹脂製の複数個の押え部材により、基板の複数箇所を器具本体に押える。   The lighting fixture of the embodiment includes a fixture main body having a fixture mounting portion in the center. A light emitting unit having a semiconductor light emitting element and a substrate on which the semiconductor light emitting element is mounted is used. A board | substrate is arrange | positioned around the instrument attachment part on the front side of an instrument main body. A plurality of portions of the substrate are pressed against the instrument body by a plurality of resin pressing members.

本発明によれば、樹脂製の押え部材により基板を器具本体に押えることにより、基板の反りなどを規制して器具本体への放熱性を確保できるとともに、押え部材との絶縁距離の問題がなく、基板における半導体発光素子の実装に有効な実装面積を大きくでき、半導体発光素子を多く実装可能とすることが期待できる。   According to the present invention, by pressing the substrate to the instrument body by the resin pressing member, it is possible to ensure heat dissipation to the instrument body by regulating the warpage of the substrate, and there is no problem of the insulation distance from the pressing member. It can be expected that the mounting area effective for mounting the semiconductor light emitting element on the substrate can be increased, and a large number of semiconductor light emitting elements can be mounted.

一実施形態を示す照明器具の断面図である。It is sectional drawing of the lighting fixture which shows one Embodiment. 同上照明器具の保護カバーの取付構造を示す断面図である。It is sectional drawing which shows the attachment structure of the protective cover of a lighting fixture same as the above. 同上照明器具の基板および保護カバーを取り付けた器具本体の斜視図である。It is a perspective view of the fixture main body which attached the board | substrate and protective cover of the lighting fixture same as the above. 同上照明器具の基板を取り付けた器具本体および保護カバーの斜視図である。It is a perspective view of the fixture main body and protective cover which attached the board | substrate of the lighting fixture same as the above. 同上照明器具の分解状態の斜視図である。It is a perspective view of the decomposition | disassembly state of a lighting fixture same as the above.

以下、一実施形態を、図1ないし図5を参照して説明する。   Hereinafter, an embodiment will be described with reference to FIGS. 1 to 5.

図4および図5に示すように、照明器具10は、天井面に設置されている引掛シーリングにアダプタを介して取り付けられる円形のシーリングライトである。なお、照明器具10から光を照射する方向を前面側、前面側に対して反対側を背面側と呼び、これら前面側および背面側は設置状態の照明器具10の下面側および上面側に対応する。   As shown in FIGS. 4 and 5, the lighting fixture 10 is a circular ceiling light that is attached to a hook ceiling installed on the ceiling surface via an adapter. The direction in which light is emitted from the lighting fixture 10 is referred to as the front side, and the opposite side to the front side is referred to as the back side. The front side and the back side correspond to the lower side and the upper side of the installed lighting fixture 10. .

照明器具10は、器具本体11を備え、この器具本体11の前面側に発光ユニットAのモジュール基板あるいは主基板である基板12、保護カバー13およびセード14が取り付けられ、器具本体11の背面側にケース16が取り付けられる。ケース16にはアダプタガイドである器具取付部17および点灯回路18などが取り付けられている。   The lighting fixture 10 includes a fixture main body 11. A module substrate or a main substrate 12 of the light emitting unit A, a protective cover 13, and a shade 14 are attached to the front side of the fixture main body 11. Case 16 is attached. The case 16 is provided with an appliance mounting portion 17 and a lighting circuit 18 as adapter guides.

そして、器具本体11は、金属製で円盤状に形成されている。器具本体11中央には器具取付部17が嵌り込む開口部21が形成され、この開口部21の周囲で器具本体11の前面には基板12が取り付けられる平面状の基板取付部22が環状に形成され、基板取付部22の周辺部には背面側に突出する凹部23が環状に形成され、この凹部23の周辺部にフランジ部24が環状に形成されている。   The instrument body 11 is made of metal and has a disk shape. An opening 21 into which the instrument mounting portion 17 is fitted is formed at the center of the instrument body 11, and a planar substrate mounting portion 22 to which the substrate 12 is attached is formed in an annular shape around the opening 21 on the front surface of the instrument body 11. In addition, a recess 23 that protrudes toward the back surface is formed in an annular shape in the peripheral portion of the substrate mounting portion 22, and a flange portion 24 is formed in an annular shape in the peripheral portion of the recess 23.

図1に示すように、基板取付部22には、径方向の中間位置に、例えば絞り加工により器具本体11の背面側に突出して基板取付部22側に開口するとともに周方向に沿って環状に突出部25が形成されている。突出部25の頂部には、ケース16をねじ(図示せず)で取り付けるためのねじ孔26が形成されている。さらに、図4および図5に示すように、突出部25と開口部21との間には窓孔27が形成され、開口部21を中心とする窓孔27との対称位置には器具本体11の背面側に突出して前面側が窪んだ窪み部28が形成されている。窓孔27および窪み部28の外径側の一部は、基板取付部22の領域に位置されている。また、図2および図5に示すように、基板取付部22の外周側および内周側には、基板12を取り付けるための複数の取付孔29が周方向に沿って配列されている。   As shown in FIG. 1, the board mounting portion 22 is formed at an intermediate position in the radial direction, for example, by drawing to the back side of the instrument body 11 so as to open to the board mounting portion 22 side and annularly along the circumferential direction. A protruding portion 25 is formed. A screw hole 26 for attaching the case 16 with a screw (not shown) is formed at the top of the protruding portion 25. Further, as shown in FIGS. 4 and 5, a window hole 27 is formed between the projecting portion 25 and the opening 21, and the instrument body 11 is located at a symmetrical position with respect to the window hole 27 with the opening 21 as the center. A recess 28 is formed that protrudes toward the back side and is recessed on the front side. A portion of the window hole 27 and the recessed portion 28 on the outer diameter side is located in the region of the board mounting portion 22. As shown in FIGS. 2 and 5, a plurality of mounting holes 29 for mounting the substrate 12 are arranged along the circumferential direction on the outer peripheral side and the inner peripheral side of the substrate mounting portion 22.

図1および図4に示すように、基板取付部22の外周側には、保護カバー13を係止して取り付けるための複数の爪挿通孔30が形成されている。基板取付部22の内周側には、保護カバー13をねじ(図示せず)で取り付けるための複数のねじ孔31が形成されている。   As shown in FIGS. 1 and 4, a plurality of claw insertion holes 30 for locking and attaching the protective cover 13 are formed on the outer peripheral side of the board attaching portion 22. A plurality of screw holes 31 for attaching the protective cover 13 with screws (not shown) are formed on the inner peripheral side of the board attaching portion 22.

図4および図5に示すように、凹部23には、セード14を器具本体11に対して回動させることによってセード14を着脱可能に取り付ける複数のセード取付金具32が取り付けられている。セード取付金具32は、基板取付部22から突出せず、凹部23内に収容されている。   As shown in FIGS. 4 and 5, a plurality of shade attachment fittings 32 are attached to the recess 23 to removably attach the shade 14 by rotating the shade 14 relative to the instrument body 11. The seed mounting bracket 32 does not protrude from the board mounting portion 22 but is accommodated in the recess 23.

また、発光ユニットAの基板12は、半環状に分割形成されており、一対の基板12が器具本体11の基板取付部22に取り付けられることによって一対の基板12が環状に組み合わされる。基板12は、例えば紙フェノールを材料として用いられ、基板12の外周側が点灯回路18(回路基板)より外径側に配置されるとともに基板12の内周側が点灯回路18(回路基板)の前方領域に重なって配置されるように基板12の径方向の寸法が大きく、その結果、基板12の面積が広く形成されている。なお、基板12の材料は、紙フェノールに限らず、金属、セラミックスあるいは樹脂などの他の基板材料を用いてもよい。   The substrate 12 of the light emitting unit A is divided and formed in a semi-annular shape, and the pair of substrates 12 are combined in an annular shape by attaching the pair of substrates 12 to the substrate attaching portion 22 of the instrument body 11. The substrate 12 is made of, for example, paper phenol, and the outer peripheral side of the substrate 12 is arranged on the outer diameter side of the lighting circuit 18 (circuit board), and the inner peripheral side of the substrate 12 is the front area of the lighting circuit 18 (circuit board). The dimension of the substrate 12 in the radial direction is large so as to be disposed so as to overlap with each other, and as a result, the area of the substrate 12 is formed wide. The material of the substrate 12 is not limited to paper phenol, and other substrate materials such as metal, ceramics, or resin may be used.

基板12の前面側は、実装面であり、配線パターンが形成され、この配線パターンに接続されて例えばLED素子や有機ELなどを含む複数の半導体発光素子が同心円上に複数列実装されている。本実施形態では、半導体発光素子として、面実装タイプのSMDパッケージ式のLED素子35が用いられ、複数のLED素子35が基板12に円周方向に沿って等間隔に配列されているとともに同心円上に複数列配置されている。なお、図4および図5にはLED素子35の列として外周側と内周側の2列のみを示しているが、他の列は図示を省略しており、図1および図3に示すように、これら外周側と内周側との間にも2列のLED素子35の列が配置され、計4列が配置されている。ただし、LED素子35の列は、4列に限らず、2列、3列、あるいは5列以上としてもよい。このような基板12にLED素子35を実装する場合のいずれの配列形態であっても、基板12に実装されるLED素子35は、器具本体11の突出部25に対向する領域に配置されず、その領域から外れた位置に配置されている。また、LED素子35の発光部は基板12に対して反対方向であって照明器具10の設置状態で直下方向に向けられる。さらに、基板12の前面側には、配線パターンを覆って高反射率特性を有する反射面が形成されている。   The front side of the substrate 12 is a mounting surface. A wiring pattern is formed, and a plurality of semiconductor light emitting elements including LED elements, organic ELs, and the like are mounted on the concentric circles connected to the wiring pattern. In the present embodiment, a surface mount type SMD package type LED element 35 is used as the semiconductor light emitting element, and a plurality of LED elements 35 are arranged on the substrate 12 at equal intervals along the circumferential direction and are concentrically arranged. Are arranged in multiple rows. 4 and 5 show only two rows of the outer peripheral side and the inner peripheral side as the rows of the LED elements 35, but the other rows are not shown, as shown in FIG. 1 and FIG. In addition, two rows of LED elements 35 are arranged between the outer peripheral side and the inner peripheral side, and a total of four rows are arranged. However, the number of columns of the LED elements 35 is not limited to four, and may be two, three, or five or more. In any arrangement form when the LED elements 35 are mounted on such a substrate 12, the LED elements 35 mounted on the substrate 12 are not arranged in a region facing the protruding portion 25 of the instrument body 11, It is arranged at a position outside the region. In addition, the light emitting portion of the LED element 35 is directed in the opposite direction with respect to the substrate 12 and in the downward direction when the lighting fixture 10 is installed. Further, a reflective surface having a high reflectance characteristic is formed on the front side of the substrate 12 so as to cover the wiring pattern.

一対の基板12の互いに対向する縁部で内周側には、器具本体11の窓孔27および窪み部28の位置に対応して切欠部36が形成されている。また、一対の基板12の互いに対向する縁部近傍には配線パターンに接続されたコネクタ37が実装されている。   A notch 36 is formed on the inner peripheral side of the pair of substrates 12 facing each other, corresponding to the positions of the window hole 27 and the recess 28 of the instrument body 11. In addition, a connector 37 connected to the wiring pattern is mounted in the vicinity of the opposing edges of the pair of substrates 12.

分割されている基板12は、共通の構成であり、同一のものが用いられている。   The divided substrates 12 have a common configuration, and the same substrate is used.

図4に示すように、一対の基板12の互いに対向する一方のコネクタ37は、電線38の両端にコネクタ39が接続された接続部材40で互いに電気的に接続されている。また、一対の基板12の互いに対向する他方のコネクタ37には、それぞれ電線41の先端にコネクタ42が接続された一対の給電部材43が電気的に接続されている。各給電部材43の電線41は基板12間から器具本体11側に配線され、器具本体11に形成された配線孔(図示せず)を通じて点灯回路18に電気的に接続されている。なお、給電部材43の電線41は、器具本体11の突出部25の内側の空間を配線空間として用いて配線してもよい。   As shown in FIG. 4, one connector 37 of the pair of substrates 12 facing each other is electrically connected to each other by a connecting member 40 having connectors 39 connected to both ends of the electric wire 38. In addition, a pair of power feeding members 43 each having a connector 42 connected to the tip of the electric wire 41 are electrically connected to the other connector 37 of the pair of substrates 12 facing each other. The electric wires 41 of each power supply member 43 are wired from the space between the substrates 12 to the instrument body 11 side, and are electrically connected to the lighting circuit 18 through wiring holes (not shown) formed in the instrument body 11. The electric wire 41 of the power supply member 43 may be wired using the space inside the protruding portion 25 of the instrument body 11 as a wiring space.

基板12の外周側および内周側には、径方向に沿って長い長孔で、それぞれ外周側および内周側に開口された複数の挿通孔44が形成されている。各挿通孔44は器具本体11の各取付孔の位置に対応して形成されており、図2に示すように、挿通孔44および取付孔29を利用して複数個の押え部材45により基板12が器具本体11に押え付けられて取り付けられている。   On the outer peripheral side and the inner peripheral side of the substrate 12, there are formed a plurality of insertion holes 44 that are long holes along the radial direction and open to the outer peripheral side and the inner peripheral side, respectively. Each insertion hole 44 is formed corresponding to the position of each attachment hole of the instrument main body 11, and as shown in FIG. 2, the substrate 12 is formed by a plurality of pressing members 45 using the insertion holes 44 and the attachment holes 29. Is pressed and attached to the instrument body 11.

押え部材45は、樹脂製で、例えばブッシュリベットなどの止め具が用いられている。ブッシュリベットの場合には、それぞれ樹脂製のスリーブ46とピン47とから構成され、スリーブ46の先端側46aが挿通孔44および取付孔29に挿通されるとともに基端側のフランジ部46bが基板12の前面側に接触した状態で、スリーブ46内にピン47が圧入されることにより、スリーブ46の先端側46aが外径方向に開いて取付孔29の背面側の縁に圧接され、このスリーブ46の先端側46aとフランジ部46bとの間で基板12と器具本体11とを挟み込んで止めるように構成されている。押え部材45と基板12の挿通孔44との間には少なくとも基板12の径方向に隙間があり、熱膨張などによる基板12の移動が許容されている。なお、押え部材45は、プッシュリベットに限らず、基板12を器具本体11に押えることができる他の構成の止め具を用いてもよい。   The pressing member 45 is made of resin, and for example, a stopper such as a bush rivet is used. In the case of bush rivets, each comprises a resin sleeve 46 and a pin 47. The distal end side 46a of the sleeve 46 is inserted into the insertion hole 44 and the mounting hole 29, and the flange portion 46b on the proximal end side is formed on the substrate 12. When the pin 47 is press-fitted into the sleeve 46 in contact with the front side of the sleeve 46, the distal end side 46a of the sleeve 46 opens in the outer diameter direction and presses against the edge on the back side of the mounting hole 29. The substrate 12 and the instrument body 11 are sandwiched and stopped between the front end side 46a and the flange portion 46b. There is a gap at least in the radial direction of the substrate 12 between the pressing member 45 and the insertion hole 44 of the substrate 12, and movement of the substrate 12 due to thermal expansion or the like is allowed. Note that the pressing member 45 is not limited to a push rivet, and a stopper having another configuration capable of pressing the substrate 12 against the instrument body 11 may be used.

また、保護カバー13は、光透過性および拡散性を有する透明な樹脂製で、中央に開口部50が開口する環状に形成されている。保護カバー13は、基板12を器具本体11との間に覆うことが可能な大きさで中央領域が前面側に突出するように断面湾曲形状に形成された環状でカバー部51を有している。   Further, the protective cover 13 is made of a transparent resin having light transmittance and diffusibility, and is formed in an annular shape having an opening 50 at the center. The protective cover 13 has a ring-shaped cover portion 51 that is large enough to cover the substrate 12 between the instrument main body 11 and is formed in a cross-sectional curved shape so that the central region protrudes to the front side. .

図1に示すように、保護カバー13の背面の外周側および内周側には、基板12の前面の内周側および外周側のそれぞれに当接してこの基板12を器具本体11に押え付ける環状の押え部52,53が形成されている。外周側の押え部52は環状のリブによって形成され、内周側の押え部53は環状の段部によって形成されている。基板12の外周面側および内周面側には、押え部52,53が位置せず、基板12が例えば熱変形などで径方向に移動するのを許容する空間部Sが形成されている。   As shown in FIG. 1, the outer peripheral side and the inner peripheral side of the back surface of the protective cover 13 are in contact with the inner peripheral side and the outer peripheral side of the front surface of the substrate 12 to press the substrate 12 against the instrument body 11. The presser portions 52 and 53 are formed. The outer periphery side pressing part 52 is formed by an annular rib, and the inner periphery side pressing part 53 is formed by an annular stepped part. On the outer peripheral surface side and the inner peripheral surface side of the substrate 12, the holding portions 52 and 53 are not positioned, and a space portion S that allows the substrate 12 to move in the radial direction due to, for example, thermal deformation is formed.

図2に示すように、保護カバー13の背面側には、各押え部材45の位置に対応して、押え部材45が挿通孔44および取付孔29から脱落するのを規制し、押え部材45により基板12と器具本体11とを挟み込んでいる状態を保持させるための保持部54が形成されている。   As shown in FIG. 2, on the back side of the protective cover 13, the presser members 45 are restricted from dropping from the insertion holes 44 and the mounting holes 29 in accordance with the positions of the presser members 45. A holding portion 54 is formed to hold a state in which the substrate 12 and the instrument body 11 are sandwiched.

図1および図4に示すように、保護カバー13の背面側で外周側には、器具本体11の各爪挿通孔30に挿通可能とする複数の爪部55が一体に突出形成されている。これら複数の爪部55は、保護カバー13の周方向の一方である装着回動方向へ向けて略L字形に形成されている。そして、各爪部55を器具本体11の各爪挿通孔30に挿通して保護カバー13を装着回動方向に回動させることにより、各爪部55の先端が器具本体11の背面側に乗り上げて保護カバー13を器具本体11に向けて引き寄せるとともに、各爪部55が器具本体11の背面側に引っ掛かって保護カバー13の押え部52,53と器具本体11との間に基板12を挟持した状態で保護カバー13が器具本体11に固定される。   As shown in FIG. 1 and FIG. 4, a plurality of claw portions 55 that can be inserted into the claw insertion holes 30 of the instrument main body 11 are integrally formed on the outer peripheral side on the back side of the protective cover 13. The plurality of claw portions 55 are formed in a substantially L shape toward the mounting rotation direction which is one of the circumferential directions of the protective cover 13. Then, by inserting each claw portion 55 into each claw insertion hole 30 of the instrument body 11 and rotating the protective cover 13 in the mounting rotation direction, the tip of each claw portion 55 rides on the back side of the instrument body 11 The protective cover 13 is pulled toward the instrument body 11 and each claw 55 is caught on the back side of the instrument body 11 so that the substrate 12 is sandwiched between the holding parts 52 and 53 of the protection cover 13 and the instrument body 11. In this state, the protective cover 13 is fixed to the instrument body 11.

保護カバー13の内周部には、器具本体11の各取付孔29の位置に対応して複数の挿通孔56が形成されている。ねじ(図示せず)が挿通孔56から器具本体11の取付孔29にねじ込まれることにより、保護カバー13が器具本体11に締め付けられ、保護カバー13の押え部52,53と器具本体11との間に基板12を挟持した状態で保護カバー13が器具本体11に固定される。   A plurality of insertion holes 56 are formed in the inner peripheral portion of the protective cover 13 corresponding to the positions of the mounting holes 29 of the instrument body 11. When the screw (not shown) is screwed into the mounting hole 29 of the instrument body 11 from the insertion hole 56, the protective cover 13 is tightened to the instrument body 11, and the presser portions 52 and 53 of the protection cover 13 and the instrument body 11 are The protective cover 13 is fixed to the instrument body 11 with the substrate 12 sandwiched therebetween.

また、図5に示すように、セード14は、透光性を有する乳白色の樹脂製で、上面側が開口され、上面側の内周縁部に各セード取付金具32に取り付けられる取付段部(図示せず)が形成されている。器具本体11に取り付けられるセード14により、器具本体11の下面、基板12および保護カバー13などが一体的に覆われる。   Further, as shown in FIG. 5, the shade 14 is made of a translucent milky white resin, the upper surface side is opened, and an attachment step portion (not shown) attached to each of the shade attachment brackets 32 on the inner peripheral edge portion on the upper surface side. ) Is formed. The shade 14 attached to the instrument main body 11 integrally covers the lower surface of the instrument main body 11, the substrate 12, the protective cover 13, and the like.

また、図1および図5に示すように、ケース16は、金属製で、中央に器具取付部17が配置される開口部59が形成され、周辺部から前面側に突出する側壁部の周囲にフランジ部60が形成され、フランジ部60が器具本体11の突出部25にねじ止めされて取り付けられる。フランジ部60には、突出部25の各ねじ孔26の位置に対応してねじが挿通する挿通孔61が形成されている。ケース16内には器具本体11の上面との間に器具取付部17や点灯回路18を収容して取り付ける収容空間62が形成されている。ケース16の背面には、照明器具10を天井面に設置した際に天井面との間で圧縮されて照明器具10のがたつきを防止したり照明器具10が回転するのを防止する複数のクッション材63が取り付けられている。   As shown in FIGS. 1 and 5, the case 16 is made of metal and has an opening 59 in which the instrument mounting portion 17 is disposed at the center, around the side wall portion protruding from the peripheral portion to the front side. A flange portion 60 is formed, and the flange portion 60 is screwed and attached to the protruding portion 25 of the instrument body 11. The flange portion 60 is formed with an insertion hole 61 through which a screw is inserted corresponding to the position of each screw hole 26 of the protruding portion 25. In the case 16, a housing space 62 is formed between the upper surface of the device body 11 and the device mounting portion 17 and the lighting circuit 18 are received and attached. The back surface of the case 16 is compressed with the ceiling surface when the lighting device 10 is installed on the ceiling surface to prevent rattling of the lighting device 10 and to prevent the lighting device 10 from rotating. A cushion material 63 is attached.

また、図5に示すように、器具取付部17は、樹脂製で筒状に形成され、天井面に設置されている引掛シーリングに装着されたアダプタに嵌め込むことにより、アダプタに着脱可能に取り付けられる。器具取付部17には、器具本体11の窓孔27に対向配置される常夜灯取付部66が形成され、この常夜灯取付部66に常夜灯基板67が取り付けられている。   In addition, as shown in FIG. 5, the fixture mounting portion 17 is made of resin and is formed into a cylindrical shape, and is detachably attached to the adapter by being fitted into an adapter mounted on a hook ceiling installed on the ceiling surface. It is done. In the fixture mounting portion 17, a nightlight mounting portion 66 is formed so as to be opposed to the window hole 27 of the fixture body 11, and a nightlight substrate 67 is attached to the nightlight mounting portion 66.

図3に示すように、常夜灯基板67には、例えばLED素子で構成される常夜灯素子68、リモコン受光部(図示せず)、およびリモコン切換スイッチ69が一緒に実装されている。そして、常夜灯素子68が乳白色の拡散カバー70で覆われ、常夜灯71が構成されている。拡散カバー70ではリモコン受光部も一緒に覆われているがリモコン切換スイッチ69は覆われない。リモコン受光部は、照明器具10の点灯状態を遠隔操作するリモコンから赤外線媒体によって送信される信号を受光し、この信号を点灯回路18に出力する。リモコン切換スイッチ69は、リモコンとこのリモコンで遠隔操作する照明器具10とを対応させるためのリモコン信号の切り換えに用いられる。   As shown in FIG. 3, the nightlight board 67 is mounted with a nightlight element 68 made of, for example, an LED element, a remote control light receiving unit (not shown), and a remote control changeover switch 69. The nightlight element 68 is covered with a milky white diffusion cover 70 to form a nightlight 71. In the diffusion cover 70, the remote control light receiving part is also covered, but the remote control changeover switch 69 is not covered. The remote control light receiving unit receives a signal transmitted by an infrared medium from a remote control that remotely controls the lighting state of the lighting fixture 10, and outputs this signal to the lighting circuit 18. The remote control changeover switch 69 is used for switching a remote control signal for associating the remote control with the lighting fixture 10 remotely operated by the remote control.

常夜灯基板67に搭載されている常夜灯71およびリモコン切換スイッチ69は、器具本体11の窓孔27に配置されている。窓孔27の外径側に常夜灯71が実装され、窓孔27の内径側にリモコン切換スイッチ69が配置されている。窓孔27の外径側は基板取付部22の領域に配置されているため、常夜灯71も基板取付部22の領域すなわち基板12の内周側より基板12の内側領域に侵入した位置に配置され、リモコン切換スイッチ69はそれら領域の外に配置されている。そのため、基板12を覆う保護カバー13によって、基板12とともに常夜灯71が一緒に覆われている。リモコン切換スイッチ69は、保護カバー13の外側に位置して覆われていない。   The nightlight 71 and the remote control switch 69 mounted on the nightlight board 67 are disposed in the window hole 27 of the instrument body 11. A night light 71 is mounted on the outer diameter side of the window hole 27, and a remote control changeover switch 69 is disposed on the inner diameter side of the window hole 27. Since the outer diameter side of the window hole 27 is arranged in the area of the board mounting portion 22, the nightlight 71 is also arranged at the position of the board mounting section 22, that is, the position invading the inner area of the board 12 from the inner peripheral side of the board 12. The remote control switch 69 is arranged outside these areas. Therefore, the nightlight 71 is covered together with the substrate 12 by the protective cover 13 covering the substrate 12. The remote control changeover switch 69 is located outside the protective cover 13 and is not covered.

また、図5に示すように、点灯回路18は、器具取付部17の周囲に配置されてケース16側に固定された回路基板74を有し、この回路基板74上に点灯回路18を構成する各種の電子部品が実装されている。点灯回路18の電源入力側にはアダプタおよび引掛シーリングを介して商用交流電源が入力され、点灯回路18の電源出力側は給電部材43、基板12の配線パターンおよび接続部材40を通じて複数のLED素子35に接続されている。そして、点灯回路18は、交流電源を整流平滑し、所定の直流電源に変換してLED素子35に供給する。   Further, as shown in FIG. 5, the lighting circuit 18 includes a circuit board 74 disposed around the fixture mounting portion 17 and fixed to the case 16 side, and the lighting circuit 18 is configured on the circuit board 74. Various electronic components are mounted. Commercial AC power is input to the power input side of the lighting circuit 18 through an adapter and hook ceiling, and the power output side of the lighting circuit 18 is connected to the plurality of LED elements 35 through the power supply member 43, the wiring pattern of the substrate 12, and the connection member 40. It is connected to the. Then, the lighting circuit 18 rectifies and smoothes the AC power, converts it to a predetermined DC power, and supplies it to the LED element 35.

次に、照明器具10を組み立てるには、器具取付部17および点灯回路18などを取り付けたケース16を器具本体11の上面にねじ止めする。   Next, in order to assemble the lighting fixture 10, the case 16 to which the fixture mounting portion 17 and the lighting circuit 18 are attached is screwed to the upper surface of the fixture body 11.

器具本体11の基板取付部22に基板12を載置するとともに、基板12に接続部材40および給電部材43を電気的に接続した後、基板12の挿通孔44および器具本体11の取付孔29に押え部材45を挿入し、この押え部材45によって基板12と器具本体11とを挟み込んで止める。   After placing the substrate 12 on the substrate mounting portion 22 of the instrument body 11 and electrically connecting the connection member 40 and the power feeding member 43 to the substrate 12, the insertion hole 44 of the substrate 12 and the attachment hole 29 of the instrument body 11 are connected. The pressing member 45 is inserted, and the substrate 12 and the instrument body 11 are sandwiched and stopped by the pressing member 45.

基板12を覆うように保護カバー13を被せながら、保護カバー13の各爪部55を器具本体11の各爪挿通孔30に挿通させ、保護カバー13を装着回動方向に回動させることにより、各爪部55の先端が器具本体11の背面側に乗り上げて保護カバー13を器具本体11に向けて引き寄せる。さらに、ねじを保護カバー13の挿通孔56を通じて器具本体11のねじ孔31にねじ込んで締め付け固定する。これにより、保護カバー13の押え部52,53が基板12の前面の外周側および内周側に当接し、基板12を器具本体11に押圧する。   By covering the protective cover 13 so as to cover the substrate 12, each claw portion 55 of the protective cover 13 is inserted into each claw insertion hole 30 of the instrument body 11, and the protective cover 13 is rotated in the mounting rotation direction. The tip of each claw portion 55 rides on the back side of the instrument body 11 and draws the protective cover 13 toward the instrument body 11. Further, the screw is screwed into the screw hole 31 of the instrument body 11 through the insertion hole 56 of the protective cover 13 and fastened and fixed. As a result, the holding portions 52 and 53 of the protective cover 13 come into contact with the outer peripheral side and the inner peripheral side of the front surface of the substrate 12 and press the substrate 12 against the instrument body 11.

基板12および保護カバー13などを覆うようにセード14を器具本体11に被せ、所定の装着回動方向に回動させることにより、セード14をセード取付金具32に取り付ける。   The shade 14 is placed on the instrument body 11 so as to cover the substrate 12, the protective cover 13, and the like, and is rotated in a predetermined mounting rotation direction, so that the shade 14 is attached to the shade mounting bracket 32.

なお、照明器具10の組立順序は、このような順序に限られるものではない。   Note that the assembly order of the lighting fixtures 10 is not limited to such an order.

そして、照明器具10を設置するには、セード14を外した照明器具10の器具取付部17を天井面の引掛シーリングに予め装着したアダプタに取り付ける。アダプタから導出されている配線を点灯回路18側と接続し、引掛シーリングと点灯回路18とを電気的に接続する。セード14を器具本体11に装着する。   And in order to install the lighting fixture 10, the fixture attachment part 17 of the lighting fixture 10 which removed the shade 14 is attached to the adapter previously mounted | worn with the ceiling ceiling ceiling. The wiring led out from the adapter is connected to the lighting circuit 18 side, and the hooking ceiling and the lighting circuit 18 are electrically connected. Attach the shade 14 to the instrument body 11.

照明器具10を設置する際に、リモコンとこのリモコンで遠隔操作する照明器具10とを対応させるためのリモコン信号を切り換える場合には、保護カバー13で覆われていないリモコン切換スイッチ69を切り換えればよい。   When installing the luminaire 10, when switching the remote control signal to correspond the remote controller and the luminaire 10 remotely operated by this remote controller, switch the remote control switch 69 that is not covered by the protective cover 13 Good.

そして、商用交流電源が点灯回路18に供給されることにより、点灯回路18から複数のLED素子35に点灯電力が供給され、複数のLED素子35が点灯する。   Then, when the commercial AC power is supplied to the lighting circuit 18, the lighting power is supplied from the lighting circuit 18 to the plurality of LED elements 35, and the plurality of LED elements 35 are lit.

複数のLED素子35が発生する光は、保護カバー13を透過してセード14に入射し、セード14で拡散されて照明空間に照射される。   The light generated by the plurality of LED elements 35 passes through the protective cover 13 and enters the shade 14, is diffused by the shade 14, and is irradiated onto the illumination space.

また、LED素子35が発生する熱は、基板12の背面側から器具本体11に熱伝導され、器具本体11から効率よく放熱される。一方、点灯回路18が発生する熱は、ケース16に伝わり、ケース16から効率よく放熱される。そのため、LED素子35が発生する熱と点灯回路18が発生する熱とが干渉し合うことが少なく、それぞれが発生する熱を効率よく放熱することができる。   Further, the heat generated by the LED element 35 is conducted from the back side of the substrate 12 to the instrument body 11 and is efficiently radiated from the instrument body 11. On the other hand, the heat generated by the lighting circuit 18 is transmitted to the case 16 and efficiently radiated from the case 16. Therefore, the heat generated by the LED element 35 and the heat generated by the lighting circuit 18 are unlikely to interfere with each other, and the heat generated by each can be efficiently radiated.

また、リモコン操作により、点灯状態を切り換えることができる。常夜灯71のみを点灯させた場合、常夜灯素子68が発生する光が拡散カバー70で拡散され、保護カバー13およびセード14を透過して照明空間に照射される。このとき、常夜灯71をLED素子35と一緒に保護カバー13の面方向に凹凸や角部などがない均一な面で覆っているため、輝線が発生することがなく、輝線がセード14に映るのを防止できる。   The lighting state can be switched by remote control operation. When only the night light 71 is turned on, the light generated by the night light element 68 is diffused by the diffusion cover 70, passes through the protective cover 13 and the shade 14, and is irradiated to the illumination space. At this time, since the night light 71 is covered with the LED element 35 with a uniform surface having no irregularities or corners in the surface direction of the protective cover 13, no bright line is generated and the bright line is reflected on the shade 14. Can be prevented.

このように構成された照明器具10では、基板12の外周側が点灯回路18より外径側に配置されるとともに基板12の内周側が点灯回路18の前方領域に重なって配置されるようにして基板12の面積を大きくしたうえで、樹脂製の押え部材45により基板12を器具本体11に押えることにより、基板12の面積が大きく例えば紙フェノールで形成されていて反りなどが発生しやすくても、基板12の反りなどを規制して器具本体11への密着性を高めることで放熱性を確保できるとともに、押え部材45との絶縁距離の問題がなく、基板12におけるLED素子35の実装に有効な実装面積を大きくでき、LED素子35を多く実装することができる。   In the lighting fixture 10 configured in this way, the substrate 12 is arranged such that the outer peripheral side of the substrate 12 is disposed on the outer diameter side from the lighting circuit 18 and the inner peripheral side of the substrate 12 is disposed so as to overlap the front region of the lighting circuit 18. After the area of 12 is increased, by pressing the substrate 12 to the instrument body 11 by the resin pressing member 45, even if the area of the substrate 12 is large and formed with, for example, paper phenol, warping is likely to occur. Heat dissipation can be ensured by regulating the warpage of the substrate 12 and improving the adhesion to the instrument body 11, and there is no problem of the insulation distance with the holding member 45, which is effective for mounting the LED element 35 on the substrate 12. The mounting area can be increased, and a large number of LED elements 35 can be mounted.

そのため、例えば、直径の小さい照明器具10を形成する場合、あるいは安価な比較的低出力形のLED素子35を多数用いる照明器具10を形成する場合でも、基板12の実装面積を大きくできて、明るさの確保に必要な数のLED素子35を実装することができる。   Therefore, for example, when forming a lighting fixture 10 with a small diameter, or when forming a lighting fixture 10 that uses a large number of inexpensive, relatively low-power LED elements 35, the mounting area of the substrate 12 can be increased and the brightness can be increased. It is possible to mount as many LED elements 35 as necessary to ensure the thickness.

基板12を覆って器具本体11に取り付けられる保護カバー13の押え部52,53により基板12の外周側および内周側を器具本体11に押えることにより、面積の大きい基板12の反りなどを規制して器具本体11への密着性を高め、放熱性を確保できる。   By pressing the outer peripheral side and inner peripheral side of the substrate 12 against the instrument body 11 by the holding portions 52 and 53 of the protective cover 13 that covers the substrate 12 and is attached to the instrument body 11, warping of the substrate 12 having a large area is regulated. Thus, the adhesion to the instrument body 11 can be improved and heat dissipation can be ensured.

押え部52,53を有する保護カバー13は、基板12の径方向への移動を許容する空間部Sを確保することにより、基板12の熱膨張による移動を許容することができ、基板12に負荷が加わるのを防止でき、配線パターン自体や配線パターンとLED素子35とのはんだ接続部分の損傷を防止できる。   The protective cover 13 having the holding parts 52 and 53 can allow movement due to thermal expansion of the substrate 12 by securing a space S that allows the substrate 12 to move in the radial direction, and the substrate 12 is loaded. Can be prevented and damage to the wiring pattern itself and the solder connection portion between the wiring pattern and the LED element 35 can be prevented.

基板12を覆う保護カバー13の保持部54により、押え部材45が挿通孔44および取付孔29から脱落するのを規制し、押え部材45により基板12と器具本体11とを挟み込んでいる状態を保持できる。   The holding member 54 of the protective cover 13 covering the substrate 12 restricts the pressing member 45 from falling off the insertion hole 44 and the mounting hole 29, and holds the state in which the substrate 12 and the instrument body 11 are sandwiched by the pressing member 45. it can.

基板12の面積を大きくすることで、基板12の内周側にはこの基板12と点灯回路18とを接続するための配線スペースを確保し難くなるが、基板12と点灯回路18とを接続する給電部材43の電線41を分割されている基板12間に通すことによって容易に配線することができる。   By increasing the area of the substrate 12, it becomes difficult to secure a wiring space for connecting the substrate 12 and the lighting circuit 18 on the inner peripheral side of the substrate 12, but the substrate 12 and the lighting circuit 18 are connected. Wiring can be easily performed by passing the electric wires 41 of the power supply member 43 between the divided substrates 12.

また、基板12に実装するLED素子35を器具本体11の突出部25の領域から外れた位置に配置するため、LED素子35が発生する熱を基板12の背面側から器具本体11に効率よく伝えてLED素子35の温度上昇を抑制することができる。   In addition, since the LED element 35 mounted on the substrate 12 is disposed at a position away from the region of the protrusion 25 of the instrument body 11, the heat generated by the LED element 35 is efficiently transmitted from the back side of the substrate 12 to the instrument body 11. Thus, the temperature rise of the LED element 35 can be suppressed.

突出部25を形成することにより、器具本体11の補強になるとともに、器具本体11の背面側に配置する点灯回路18を収容するケース16をねじ止めして取り付けることができる。   By forming the projecting portion 25, it is possible to reinforce the instrument body 11, and to attach the case 16 that houses the lighting circuit 18 disposed on the back side of the instrument body 11 by screwing.

突出部25の内側の空間は、分割されている基板12間に通す給電部材43の電線41を配線する配線空間として利用することもできる。   The space inside the protruding portion 25 can also be used as a wiring space for wiring the electric wires 41 of the power feeding member 43 that passes between the divided substrates 12.

また、基板12、および基板12とは別体に設けた常夜灯71を保護カバー13で一体に覆うため、常夜灯71の点灯時に保護カバー13から輝線が発生するのを低減することができる。   Further, since the nightlight 71 provided separately from the substrate 12 and the substrate 12 is integrally covered with the protective cover 13, it is possible to reduce the generation of bright lines from the protective cover 13 when the nightlight 71 is turned on.

基板12の一部に形成された切欠部36に常夜灯71を配置するため、例えば保護カバー13から常夜灯71を覆う部分を突出させて形成するような必要がなく、基板12の外形状に沿った外形状に保護カバー13を形成することができる。   Since the nightlight 71 is arranged in the notch 36 formed in a part of the substrate 12, there is no need to form a part covering the nightlight 71 from the protective cover 13, for example, and the outer shape of the substrate 12 is aligned. The protective cover 13 can be formed in an outer shape.

常夜灯71の常夜灯基板67にリモコン切換スイッチ69が搭載されている場合、リモコン切換スイッチ69が保護カバー13で覆われない領域に配置されるため、保護カバー13を外すことなく、リモコン切換スイッチ69を操作できる。   If the remote control changeover switch 69 is mounted on the nightlight board 67 of the nightlight 71, the remote control changeover switch 69 is arranged in an area that is not covered by the protective cover 13, so the remote control changeover switch 69 can be operated without removing the protective cover 13. Can be operated.

なお、照明器具は、円形のシーリングライトに限らず、四角形や多角形の照明器具にも適用できる。   In addition, a lighting fixture is applicable not only to a circular ceiling light but to a square or polygonal lighting fixture.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 照明器具
11 器具本体
12 基板
13 保護カバー
17 器具取付部
18 点灯回路
35 半導体発光素子としてのLED素子
41 電線
45 押え部材
52,53 押え部
A 発光ユニット
S 空間部
10 Lighting equipment
11 Instrument body
12 Board
13 Protective cover
17 Instrument mounting part
18 Lighting circuit
35 LED elements as semiconductor light-emitting elements
41 electric wire
45 Presser member
52, 53 Presser A Light-emitting unit S Space

Claims (3)

中央に器具取付部を有する器具本体と;
半導体発光素子、および半導体発光素子を実装する基板を有し、基板が器具本体の前面側で器具取付部の周囲に配置される発光ユニットと;
基板の複数箇所を器具本体に押える樹脂製の複数個の押え部材と;
を具備していることを特徴とする照明器具。
An instrument body having an instrument mounting portion in the center;
A light emitting unit having a semiconductor light emitting element and a substrate on which the semiconductor light emitting element is mounted, the substrate being disposed around the instrument mounting portion on the front side of the instrument body;
A plurality of resin-made pressing members that hold a plurality of locations on the substrate to the instrument body;
The lighting fixture characterized by comprising.
発光ユニットを覆って器具本体に取り付けられ、基板を器具本体に押える押え部、および基板の径方向への移動を許容する空間部が形成された透光性を有する保護カバーを具備している
ことを特徴とする請求項1記載の照明器具。
It has a translucent protective cover that covers the light emitting unit and is attached to the instrument body, and has a presser part that presses the substrate against the instrument body and a space that allows the substrate to move in the radial direction. The lighting fixture according to claim 1.
器具取付部の周囲に配置される点灯回路を具備し、
基板は周方向に複数に分割されており、基板と点灯回路とを接続する電線が分割された基板間を通じて配線されている
ことを特徴とする請求項1または2記載の照明器具。
Having a lighting circuit arranged around the fixture mounting part,
The lighting device according to claim 1, wherein the substrate is divided into a plurality of portions in the circumferential direction, and an electric wire connecting the substrate and the lighting circuit is wired between the divided substrates.
JP2012228366A 2012-10-15 2012-10-15 Lighting device Pending JP2014082067A (en)

Priority Applications (2)

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JP2012228366A JP2014082067A (en) 2012-10-15 2012-10-15 Lighting device
CN201320513075.0U CN203464093U (en) 2012-10-15 2013-08-21 Lighting appliance

Applications Claiming Priority (1)

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